WO2017094469A1 - Appareil d'évacuation de vapeur et procédé de formation de film - Google Patents

Appareil d'évacuation de vapeur et procédé de formation de film Download PDF

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Publication number
WO2017094469A1
WO2017094469A1 PCT/JP2016/083350 JP2016083350W WO2017094469A1 WO 2017094469 A1 WO2017094469 A1 WO 2017094469A1 JP 2016083350 W JP2016083350 W JP 2016083350W WO 2017094469 A1 WO2017094469 A1 WO 2017094469A1
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Prior art keywords
organic compound
vapor
compound monomer
evaporator
monomer
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PCT/JP2016/083350
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English (en)
Japanese (ja)
Inventor
齋藤　和彦
信博 林
貴啓 廣野
照明 岩橋
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株式会社アルバック
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Application filed by 株式会社アルバック filed Critical 株式会社アルバック
Priority to JP2017553740A priority Critical patent/JP6637520B2/ja
Priority to KR1020187014469A priority patent/KR102139125B1/ko
Priority to CN201680069977.6A priority patent/CN108291292B/zh
Publication of WO2017094469A1 publication Critical patent/WO2017094469A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process

Definitions

  • the present invention relates to a technique of a film forming apparatus for forming an organic compound film on a base film in a vacuum.
  • the organic compound monomer is evaporated and the vapor is sprayed on the base film to form an organic compound layer.
  • a layer is cured by applying heat or irradiating energy rays to form a polymer organic compound film.
  • the present invention has been made in view of the problems of the conventional technology, and the object of the present invention is to vaporize an organic compound monomer when forming an organic compound film on a base film in a vacuum.
  • An object of the present invention is to provide a technique capable of stabilizing the film formation rate by generating a certain amount.
  • the present invention which has been made to achieve the above object, is a vapor discharge device that discharges vapor of an organic compound monomer in a vacuum, and is communicated with a vaporization unit that vaporizes a liquid organic compound monomer, and the vaporization unit.
  • a vapor discharge part that discharges the vapor of the organic compound monomer vaporized in the vaporization part, and a hollow evaporator is provided in the vaporization part, and the evaporator atomizes the liquid organic compound monomer.
  • the mist-like organic compound monomer is heated and evaporated to derive the vapor of the organic compound monomer into the vaporization section.
  • the present invention is effective also when it has a heating means to heat each of the said vaporization part and the said vapor
  • the present invention is also effective in the case of having a monomer supply pipe for supplying a liquid organic compound monomer to the evaporator and a cooling means for cooling the monomer supply pipe.
  • a nozzle part for introducing the liquid organic compound monomer into the evaporator in the form of a mist is provided at the tip part of the monomer supply pipe, and the tip part of the nozzle part is provided in the evaporator. It is also effective when it is arranged and configured so as not to protrude inward of the evaporator with respect to the inner wall surface.
  • the present invention has a vacuum chamber and any one of the above-described vapor discharge devices provided in the vacuum chamber, and the vapor of the vapor discharge device is applied to the base film transported in the vacuum chamber. It is a film forming apparatus configured to spray vapor of an organic compound monomer from a discharge part. In this invention, it is effective also when the vaporization part of the said vapor
  • a hollow evaporator is provided in the vaporization section, the liquid organic compound monomer is introduced into the evaporator in the form of a mist, and the mist-like organic compound monomer is heated and evaporated. The vapor of the organic compound monomer is led out into the vaporization section and released from the vapor discharge section.
  • an evaporator that heats and evaporates the mist-like organic compound monomer, and a vaporization unit that guides the vapor of the organic compound monomer generated by the evaporator to the vapor discharge unit By using a separate structure, it becomes possible to have a structure in which the portion that evaporates the organic compound monomer and the portion that emits the vapor of the organic compound monomer do not communicate directly with each other. It is possible to prevent the organic compound monomer in the state from being directly introduced into the vapor discharge part and used for film formation. That is, the entrainment of the organic compound monomer can be suppressed by configuring the path between the part for evaporating the organic compound monomer and the part for releasing the vapor of the organic compound monomer to be long.
  • the amount of vapor of the organic compound monomer sent to the vapor discharge unit can be reduced by storing the vapor of the organic compound monomer in the space outside the evaporator, which is a space not related to evaporation once. It can be kept stable.
  • the vapor discharge device of the present invention it is possible to always generate a certain amount of vapor of the organic compound monomer and send it from the vaporization section to the vapor discharge section. As a result, a constant amount of vapor of the organic compound monomer can always be released, so that the film formation rate can be stabilized.
  • the present invention when it has heating means for heating each of the vaporization part and the vapor discharge part of the vapor discharge device, it is possible to reliably prevent the condensation of the vapor of the organic compound monomer in the vaporization part and the vapor discharge part. Therefore, the film formation rate can be further stabilized.
  • the polymerization reaction due to the heat of the organic compound monomer in the monomer supply pipe can be more reliably prevented. it can.
  • a nozzle portion for introducing a liquid organic compound into the evaporator in the form of a mist is provided at the tip portion of the monomer supply pipe, and the tip portion of the nozzle portion is against the inner wall surface of the evaporator. Therefore, the following effects can be obtained when the arrangement is made so as not to protrude inward of the evaporator.
  • the nozzle part is provided at the tip of the monomer supply pipe having a cooling means, and has a lower temperature than the inner wall surface of the evaporator. For this reason, when the nozzle portion protrudes inward of the evaporator from the inner wall surface of the evaporator, the vapor of the organic compound monomer heated and evaporated in the evaporator has a lower temperature than the inner wall surface of the evaporator. There is a possibility that the nozzle portion is exposed and the vapor of the organic compound monomer is condensed.
  • the tip portion of the nozzle portion is arranged and configured not to protrude inward of the evaporator, there is no possibility that the vapor of the organic compound monomer adheres to the nozzle portion and condenses, Furthermore, since the vapor of the organic compound monomer heated and evaporated in the evaporator contacts only the inner wall surface of the evaporator heated by, for example, a heater, the condensation on the inner wall surface of the evaporator is prevented and reliably performed. A certain amount of steam can be generated.
  • the organic compound monomer has a vacuum tank and any one of the above-described vapor discharge devices provided in the vacuum tank, and the organic film monomer from the vapor discharge unit of the vapor discharge device with respect to the substrate film conveyed in the vacuum tank
  • a film forming apparatus configured to spray the vapor
  • a film forming apparatus capable of constantly generating and releasing the vapor of the organic compound monomer at a constant rate to stabilize the film forming rate is provided. Can do.
  • the vaporization unit of the vapor discharge device when the vaporization unit of the vapor discharge device is provided outside the vacuum chamber, maintenance of the evaporator and the like in the vaporization unit can be easily performed, and the evaporator and vapor discharge in the vaporization unit can be performed. It is possible to secure a sufficient distance from the part to make the vapor concentration of the organic compound monomer uniform.
  • FIG. 1 is an overall configuration diagram of an embodiment of a film forming apparatus using a vapor discharge apparatus according to the present invention.
  • the internal block diagram of embodiment of the vapor discharge apparatus concerning this invention Sectional drawing which shows the principal part structure of the monomer introduction part of the evaporator of the vapor
  • FIG. 1 is an overall configuration diagram of an embodiment of a film forming apparatus using a vapor discharge apparatus according to the present invention
  • FIG. 2 is an internal configuration diagram of an embodiment of the vapor discharge apparatus according to the present invention.
  • a film forming apparatus 1 forms an organic compound film on a base film 10 in a vacuum chamber 2 connected to an evacuating apparatus 17, and a vapor release described later. It has the apparatus 20 (refer FIG. 2).
  • a cylindrical central roller 3 is provided for contacting and transporting the base film 10, and a steam described later is provided around the central roller 3.
  • the vapor discharge part 22 of the discharge device 20 and the energy beam injection device 9 are arranged so as to face the central roller 3, respectively.
  • an original roll 4 a of the base film 10 is arranged, and the direction of the base film 10 fed from the original roll 4 a is changed so as to be in close contact with the surface of the central roller 3.
  • a winding roller 4b provided in, for example, the upper portion of the vacuum chamber 2.
  • the vapor discharge device 20 includes a vaporization unit 21 that vaporizes a liquid organic compound monomer such as an acrylic resin, and a vapor of the organic compound monomer vaporized in the vaporization unit 21. And a vapor discharge part 22 for discharging the gas.
  • a vaporization unit 21 that vaporizes a liquid organic compound monomer such as an acrylic resin, and a vapor of the organic compound monomer vaporized in the vaporization unit 21.
  • a vapor discharge part 22 for discharging the gas.
  • the vaporization unit 21 of the vapor discharge device 20 is formed in a cylindrical shape, for example, and is connected to the vaporization unit 21 in a state where, for example, a vapor discharge unit 22 formed in a cylindrical shape having a smaller diameter than the vaporization unit 21 is concentrically connected. ing.
  • release part 22 is not restricted concentric, but is suitably adjusted with the positional relationship of the vapor
  • the vaporization section 21 is disposed outside the vacuum chamber 2 and the vapor discharge section 22 is disposed inside the vacuum chamber 2 (see FIG. 2).
  • the vaporization unit 21 has a hollow main body 21a made of a metal material such as stainless steel, for example. Further, an openable / closable door 21b for maintenance is provided at an end of the vaporization unit 21 opposite to the vacuum chamber 2. Is provided.
  • Heating means 23 are provided on the surfaces of the main body 21a and the door 21b of the vaporizing unit 21, respectively, so that the surface of the vaporizing unit 21 is entirely covered.
  • the heating means 23 is, for example, in a jacket shape, and can be suitably used that is configured such that the heat medium circulates therein.
  • the heating means 23 has a function of heating the vaporizing unit 21 to a temperature higher than the temperature at which the vapor of the organic compound monomer is condensed, and the organic compound monomer led into the vaporizing unit 21 from the evaporator 40 as will be described later. This serves to prevent the steam from condensing on the inner wall surface of the vaporizing section 21. Note that the temperature at which the vaporizing section 21 is heated by the heating means 23 is selected according to the material of the organic compound monomer used to form the organic compound film.
  • a monomer supply source 30 is provided outside the vaporization unit 21, and a liquid organic compound monomer is supplied from the monomer supply source 30 through the pump 31 and the monomer supply pipe 32 to the inside of the vaporization unit 21 described below.
  • the evaporator 40 is configured to supply a predetermined amount.
  • the evaporator 40 is made of a metal material having a high thermal conductivity such as copper, and is formed in a hollow, for example, cylindrical shape having a size smaller than that of the vaporizing portion 21, and is a door of the vaporizing portion 21. It arrange
  • an upper portion of the evaporator 40 is provided with a monomer introduction portion 41 to be described later for introducing a liquid organic compound monomer into the evaporator 40 in the form of a mist, and the monomer introduction portion 41 is the above-described monomer introduction portion 41. Connected to the monomer supply pipe 32.
  • the monomer supply pipe 32 is provided with a cooling means 33 on the surface thereof.
  • the cooling means 33 is, for example, in a jacket shape, and can be suitably used that is configured such that a cooling medium circulates therein.
  • This cooling means 33 is for reliably preventing the polymerization reaction due to the heat of the organic compound monomer in the monomer supply pipe 32, and has a function of cooling the organic compound monomer to a room temperature of about 25 ° C., for example.
  • an evaporator heater 42 for heating the evaporator 40 and evaporating the atomized organic compound monomer 34 introduced into the evaporator 40 is provided on the outer surface of the evaporator 40.
  • the heater 42 for an evaporator can be, for example, a resistance heating type, and is provided on the entire outer surface of the evaporator 40.
  • the evaporator heater 42 has a function of heating the evaporator 40 to a temperature equal to or higher than the temperature at which the organic compound monomer evaporates efficiently, and heats and evaporates the atomized organic compound monomer 34 on the inner wall surface of the evaporator 40. It plays a role of preventing the vapor of the generated organic compound monomer from condensing on the inner wall surface of the evaporator 40.
  • the temperature at which the evaporator 40 is heated by the evaporator heater 42 is selected according to the material of the organic compound monomer used to form the organic compound film.
  • an upper portion of the evaporator 40 is provided with a lead-out port 43 for leading the vapor of the organic compound monomer heated and evaporated in the evaporator 40 into the vaporization unit 21.
  • FIG. 3 is a cross-sectional view showing the main configuration of the monomer introduction part of the evaporator of the vapor discharge apparatus according to the present embodiment.
  • the monomer introduction port 44 for introducing the organic compound monomer into the evaporator 40 passes through the upper wall part of the evaporator 40. Is provided.
  • a nozzle portion 35 provided at the tip of the monomer supply pipe 32 is disposed at a position inside the monomer introduction port 44.
  • This nozzle portion 35 is made of, for example, a material such as a ceramic that is less thermally deformed or worn, and is arranged so that the tip portion thereof does not protrude inward of the evaporator 40 with respect to the inner wall surface 40a of the evaporator 40. It is configured.
  • the nozzle portion 35 of the present embodiment is provided at the tip of the monomer supply pipe 32 provided with the cooling means 33, and has a lower temperature than the inner wall surface 40 a of the evaporator 40. For this reason, when the nozzle portion 35 is protruded inward of the evaporator 40 from the inner wall surface 40a of the evaporator 40, the evaporator 40 is converted into vapor of the organic compound monomer heated and evaporated in the evaporator 40. There is a risk that the nozzle portion 35 having a temperature lower than that of the inner wall surface 40a is exposed and the vapor of the organic compound monomer is condensed.
  • the nozzle part 35 of the present embodiment is arranged and configured so that the tip part does not protrude inward of the evaporator 40, so that the vapor of the organic compound monomer adheres to the nozzle part 35.
  • the vapor of the organic compound monomer heated and evaporated in the evaporator 40 is in contact with only the inner wall surface 40a of the evaporator 40 heated by the evaporator heater 42. It is possible to prevent condensation on the inner wall surface 40a of 40 and to generate a certain amount of steam with certainty.
  • the mist-like organic compound monomer 34 sprayed from the nozzle part 35 introduce
  • the liquid organic compound monomer is used as the nozzle portion 35. It is preferable to use the one that is configured such that the distance between the droplets is increased by spraying the droplets radially, that is, the density of the droplets becomes smaller.
  • the spray port of the nozzle portion 35 is formed in a mortar shape so that the opening widens.
  • the spray port of the nozzle portion 35 is formed in a mortar shape so that the opening widens.
  • an evaporator 40 that heats and evaporates the atomized organic compound monomer 34, and vapor of the organic compound monomer generated by the evaporator 40 is vaporized.
  • the vaporization part 21 led to the discharge part 22 have a separate structure, it is possible to make the structure in which the part for evaporating the organic compound monomer and the part for releasing the vapor of the organic compound monomer do not directly communicate with each other. It is possible to prevent the organic compound monomer in a state where a mixture of liquid droplets and vapor is mixed and directly introduced into the vapor discharge portion 22 and used for film formation. That is, the entrainment of the organic compound monomer can be suppressed by configuring the path between the part for evaporating the organic compound monomer and the part for releasing the vapor of the organic compound monomer to be long.
  • the vapor of the organic compound monomer is stored in the space inside the vaporizing unit 21 and outside the evaporator 40, which is a space that is not related to evaporation, and then the vapor of the organic compound monomer that is sent to the vapor discharge unit 22.
  • the amount of can be kept stable.
  • the vapor discharge device 20 of the present embodiment it is possible to always generate a certain amount of organic compound monomer vapor and send it from the vaporization section 21 to the vapor discharge section 22. As a result, a constant amount of vapor of the organic compound monomer can always be released, so that the film formation rate can be stabilized.
  • FIG. 4A is a front view showing a vapor discharge portion of the vapor discharge device of the present embodiment
  • FIG. 4B is a side view showing the vapor discharge portion of the vapor discharge device.
  • the vapor discharge portion 22 formed in a cylindrical shape discharges the organic compound monomer sent from the vaporization portion 21, and as shown in FIGS. 4 (a) and 4 (b), in the longitudinal direction of the cylinder.
  • the discharge portion 24 is formed in a straight line along the discharge portion 24, and the discharge portion 24 is provided with a straight slit-shaped vapor discharge port 25.
  • the vapor discharge portion 22 is arranged so that the central axis thereof is parallel to the rotation axis of the central roller 3, and the base film on the central roller 3 has the vapor discharge port 25 parallel to these axial lines. 10 is disposed in close proximity to and opposite to 10.
  • the vapor discharge port 25 of the vapor discharge portion 22 is formed to be slightly narrower than the width of the central roller 3 (base film 10), and is linear with respect to the surface of the base film 10 in the width direction.
  • the steam 36 is blown.
  • a steam discharge section heater 26 (heating means) is provided.
  • a resistance heating type heater can be used as the vapor discharge portion heater 26, and is provided on the entire outer surface of the vapor discharge portion 22.
  • the heater 26 for the vapor discharge part has a function of heating the vapor release part 22 to a temperature higher than the temperature at which the vapor of the organic compound monomer is condensed.
  • the temperature at which the vapor discharge part 22 is heated by the vapor discharge part heater 26 is selected according to the material of the organic compound monomer used to form the organic compound film.
  • a heat insulating portion 2 a for blocking heat from the heating means 23 and the vapor discharge portion heater 26 provided in the vapor discharge device 20 is provided on the wall portion of the vacuum tank 2 connected to the vapor discharge portion 22. It has been.
  • the vacuum exhaust device 17 when a polymer organic compound film is formed on the base film 10 in the vacuum chamber 2, the vacuum exhaust device 17 is operated to adjust the pressure in the vacuum chamber 2. Evacuate to a predetermined value.
  • the heating unit 23 is operated to heat the vaporization unit 21 to a temperature higher than the temperature at which the vapor of the organic compound monomer is condensed, and the vapor discharge unit heater 26 is operated to operate the vapor discharge unit. 22 is heated to a temperature higher than the temperature at which the vapor of the organic compound monomer condenses.
  • the evaporator heater 42 is operated to heat the evaporator 40 to a temperature equal to or higher than the temperature at which the vapor of the organic compound monomer is efficiently evaporated.
  • the cooling means 33 is operated to cool the monomer supply pipe 32 to a room temperature of about 25 ° C., for example. In this state, a predetermined amount of liquid organic compound monomer is supplied from the monomer supply source 30 through the monomer supply pipe 32 to the monomer introduction part 41 of the evaporator 40 in the vaporization part 21.
  • the mist-like organic compound monomer 34 is introduced into the evaporator 40 from the nozzle portion 35 of the monomer introduction portion 41, thereby contacting and heating the inner wall of the evaporator 40. Evaporate.
  • the vapor of the organic compound monomer generated in the evaporator 40 is discharged into the vaporization unit 21 through the outlet 43 and is filled in the vaporization unit 21, and further sent to the vapor discharge unit 22 to be sent to the vapor discharge unit 22.
  • the energy ray 91 is injected from the energy ray injection device 9 shown in FIG. It forms (refer FIG. 5 (a) (b)). Then, the base film 10 is wound up by the winding roller 4b shown in FIG.
  • the hollow evaporator 40 is provided in the vaporization section 21 of the vapor release apparatus 20 so that the liquid organic compound is atomized.
  • the vaporized organic compound monomer 34 is heated and evaporated to lead out the vapor of the organic compound monomer into the vaporization section 21 and be discharged from the vapor discharge section 22. Since a constant amount of vapor of the organic compound monomer can always be generated and released, the film formation rate can be stabilized.
  • the cooling means 33 for cooling the monomer supply pipe 32 for supplying the liquid organic compound monomer to the evaporator 40 since there is a cooling means 33 for cooling the monomer supply pipe 32 for supplying the liquid organic compound monomer to the evaporator 40, the polymerization reaction due to the heat of the organic compound monomer in the monomer supply pipe 32 is provided. Can be reliably prevented.
  • a nozzle part 35 for introducing a liquid organic compound into the evaporator 40 in the form of a mist is provided at the tip part of the monomer supply pipe 32, and the tip part of the nozzle part 35
  • it is arranged and configured not to protrude inward of the evaporator 40 with respect to the inner wall surface 40a of the evaporator 40, there is no possibility that the vapor of the organic compound monomer adheres to the nozzle portion 35 and condenses.
  • the vapor of the organic compound monomer heated and evaporated in the evaporator 40 comes into contact only with the inner wall surface 40a of the evaporator 40 heated by the evaporator heater 42, so that the inner wall surface 40a of the evaporator 40 is contacted. It is possible to prevent the condensation in the water and to reliably generate a certain amount of steam.
  • the vaporization unit 21 of the vapor release device 20 is provided outside the vacuum chamber 2, maintenance of the evaporator 40 and the like in the vaporization unit 21 is easy. In addition, it is possible to ensure a sufficient distance between the evaporator 40 in the vaporization section 21 and the vapor discharge section 22 to make the vapor concentration of the organic compound monomer uniform.
  • the present invention is not limited to the above-described embodiment, and various changes can be made.
  • the shapes of the vaporization unit, the vapor discharge unit, the evaporator, and the nozzle unit of the vapor discharge device are not limited to those in the above embodiment, and various shapes can be used.
  • the kind of organic compound used as the raw material of the film in the present invention is not particularly limited, and can be applied to various organic compounds.
  • the type and thickness of the base film are not particularly limited and can be applied to various films.
  • this invention can perform film-forming not only on a base film but on various film-forming objects. However, it is most effective when applied to a film-like film formation target.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

La présente invention a pour objet de fournir une technique telle que, lors de la formation d'un film de composé organique sur un film de substrat sous vide, une vapeur d'un monomère de composé organique peut être générée à un taux constant, ce qui permet de stabiliser le taux de formation du film. Ce dispositif d'évacuation de vapeur évacue une vapeur d'un monomère de composé organique sous vide et comprend : une unité 21 de vaporisation destinée à vaporiser un monomère de composé organique liquide ; et une unité 22 d'évacuation de vapeur qui est en communication avec l'unité 21 de vaporisation et évacue la vapeur du monomère de composé organique vaporisé par l'unité 21 de vaporisation. L'unité 21 de vaporisation est pourvue d'un vaporisateur 40 creux. Le vaporisateur 40 est conçu de telle sorte qu'un brouillard du monomère de composé organique liquide est introduit dans celui-ci, le brouillard 34 de monomère de composé organique est chauffé et vaporisé, et la vapeur de monomère de composé organique est évacuée vers l'unité 21 de vaporisation.
PCT/JP2016/083350 2015-11-30 2016-11-10 Appareil d'évacuation de vapeur et procédé de formation de film WO2017094469A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017553740A JP6637520B2 (ja) 2015-11-30 2016-11-10 蒸気放出装置及び成膜装置
KR1020187014469A KR102139125B1 (ko) 2015-11-30 2016-11-10 증기 방출 장치 및 성막 장치
CN201680069977.6A CN108291292B (zh) 2015-11-30 2016-11-10 蒸汽释放装置及成膜装置

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JP2015232893 2015-11-30
JP2015-232893 2015-11-30

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US20220145457A1 (en) * 2020-11-11 2022-05-12 M. I. Co., Ltd. Vaporizing apparatus for thin film deposition

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CN110629161B (zh) * 2019-09-23 2020-09-29 北京师范大学 一种定量真空蒸发制备共价有机框架材料薄膜的方法

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