WO2017088466A1 - Dispositif de traitement chimique par voie humide pour carte de circuit imprimé et procédé de traitement chimique par voie humide pour carte de circuit imprimé - Google Patents

Dispositif de traitement chimique par voie humide pour carte de circuit imprimé et procédé de traitement chimique par voie humide pour carte de circuit imprimé Download PDF

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Publication number
WO2017088466A1
WO2017088466A1 PCT/CN2016/086862 CN2016086862W WO2017088466A1 WO 2017088466 A1 WO2017088466 A1 WO 2017088466A1 CN 2016086862 W CN2016086862 W CN 2016086862W WO 2017088466 A1 WO2017088466 A1 WO 2017088466A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
wet chemical
processing
chemical processing
Prior art date
Application number
PCT/CN2016/086862
Other languages
English (en)
Chinese (zh)
Inventor
陈德和
Original Assignee
宇宙电路板设备(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宇宙电路板设备(深圳)有限公司 filed Critical 宇宙电路板设备(深圳)有限公司
Priority to KR1020177037854A priority Critical patent/KR102051729B1/ko
Priority to DE112016001153.9T priority patent/DE112016001153T5/de
Priority to DE212016000082.9U priority patent/DE212016000082U1/de
Publication of WO2017088466A1 publication Critical patent/WO2017088466A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB

Definitions

  • the present disclosure pertains to the field of printed circuit board manufacturing, for example, to a printed circuit board wet chemical processing apparatus and a printed circuit board wet chemical processing method.
  • PCBs printed circuit boards
  • the chemical processing steps typically involve several different processing steps using different chemicals (for achieving chemical reactions) and water (for washing/removing residual chemicals), which can be carried out in a horizontal or vertical mode
  • the apparatus for performing such processing is referred to herein as a "wet chemical processing apparatus” and may be provided in a horizontal or vertical form.
  • the processing liquid medicine liquid
  • the processing liquid is pumped mainly by a pump.
  • bubbles are easily generated during pumping, the treatment liquid is easily deteriorated, the pump body is easy to fail, the bearing needs to be replaced frequently, the cost is relatively high, and the shaft and the outer casing also have sealing problems, and a high degree is generated.
  • the use of waterjet also has the following disadvantages. Firstly, the waterjet is easy to block, which easily affects the performance of the treatment fluid, and the liquid inlet is only on one side, but the outlet runs through the entire length of the waterjet, the flow uniformity is limited, and the waterjet construction accuracy is better. High and frequent maintenance, resulting in high application costs, especially for horizontal processing equipment, requiring multiple waterjets with higher cost. Operators need to constantly monitor to adjust the performance of the waterjet. Due to the different viscosity of each treatment fluid, different The task requires different waterjet designs, and the water knife dead angle also creates a risk of degradation of the treatment fluid with poor reliability.
  • the object of the embodiments of the present invention is to overcome the deficiencies of the related art, and provide a wet chemical processing device for printed circuit boards and a wet chemical processing method for printed circuit boards, wherein the printed circuit board wet chemical processing equipment has good reliability and low cost.
  • the present disclosure is surprising in that it can overcome the above limitations with a relatively simple principle: the use of a propeller for transporting liquids and for generating turbulence.
  • the thruster is defined here as: a fan-like structure that passes through the fan-like structure The rotary motion is converted to thrust to transmit power. A pressure differential is created between the forward and rearward surfaces of the fan-like structure propeller-shaped blades such that fluid (e.g., air or water) is accelerated behind the blades.
  • a printed circuit board wet chemical processing apparatus comprising:
  • the processing component is disposed on a wet chemical processing line of the printed circuit board;
  • the propeller includes at least one first propeller or at least one second propeller;
  • the at least one first pusher is housed in the processing component for transporting the treatment fluid from the reservoir to the chemical processing location;
  • the at least one second pusher is configured to generate turbulence at the chemical processing location.
  • the processing component is a horizontal processing tank or a vertical processing tank for wet chemical processing of a printed circuit board.
  • the chemical processing location is a location on the surface of the printed circuit board that is subjected to a wet chemical treatment.
  • a wet chemical processing device for printed circuit boards comprising: a liquid storage tank and a processing tank;
  • the liquid storage tank is for containing a treatment liquid
  • the processing tank is for accommodating a circuit board
  • the printed circuit board wet chemical processing apparatus further includes: a pushing device;
  • the pushing device is configured to push the processing liquid from the liquid storage tank to the processing tank;
  • the pushing device comprises: a first thruster and a driver
  • the driver is configured to drive the first propeller to rotate
  • the first propeller is disposed in the liquid storage tank and has at least two blades.
  • the first propeller is a low pressure propeller.
  • the driver is coupled to the first pusher.
  • the liquid storage tank communicates with the processing tank through a communication groove.
  • a top of the liquid storage tank is provided with a transition groove communicating with the liquid storage tank, and the transition groove has a guiding opening to the processing tank.
  • the driver includes a rotating shaft that is longitudinally disposed and extends into the liquid storage tank and connects the first thruster.
  • the driver further includes a first motor for driving the rotation of the rotating shaft, the first motor being located above the liquid storage tank.
  • a return line is disposed between the treatment tank and the liquid storage tank.
  • the reservoir is lower than the processing tank when the printed circuit board wet chemical processing apparatus is placed in an operational state.
  • a second propeller is disposed in the processing tank, and the second propeller is connected to a driven disc located in the processing tank; a driving disc is disposed outside the processing tank, and the active disc is used The driving disk is driven; the driving disk is connected to a driving device, and the driving device is configured to drive the driving disk to rotate.
  • the second propeller is coupled to a drive shaft, and the drive shaft is coupled to the second motor.
  • a printed circuit board wet chemical processing apparatus comprising at least one push device disposed on a wet chemical processing line of a printed circuit board, the push device including at least one first pusher for transporting a processing liquid to a wet chemical processing position Or comprising at least one second thruster that creates a vortex at the wet chemical processing location.
  • a wet chemical processing method for a printed circuit board comprising: the wet chemical processing device of the printed circuit board, comprising: a driver driving a first propeller in a liquid storage tank to rotate, and a pressure difference between the blades of the first propeller is driven to drive the treatment The liquid is pushed from the reservoir to the processing tank for wet chemical treatment of the printed circuit board.
  • the disadvantages of the pump can be overcome, that is, the treatment liquid is less likely to generate bubbles, the performance of the treatment liquid is not easily deteriorated, and the pump body that is in contact with the chemical treatment liquid is not required, and the pump body in the related art is easily prevented from being ineffective.
  • the problem is that there is no need to change the bearing frequently, there is no sealing problem, the equipment has low noise, low energy consumption, low heat generation, low application cost, and no need for water knife.
  • the application cost is low, there is no dead angle, and the treatment liquid is degraded.
  • the problem is that the reliability is good, which is beneficial to ensure the production quality and efficiency of the circuit board, and the processing liquid loss is low, and can be applied to the transmission modes such as horizontal and vertical transmission.
  • the thruster can include two, three or even more blades.
  • the arrangement of three of the blades is an alternative that is described in the embodiments, but the solution using other numbers of blades is also a solution that can produce beneficial effects, and is included in the protection scope of the present disclosure.
  • Suitable propellers employed in the present disclosure are preferred designs based on fluid engineering.
  • the propeller should be a cavitation resistant propeller.
  • the number of propellers in each of the containers for accommodating the above-mentioned propellers (such as the above-mentioned liquid storage tank), and the number of blades of each propeller, the arrangement manner, the rotational direction, and the like may be used according to specific conditions.
  • the environment eg, the size parameters of the reservoir and/or treatment tank, and other related components, such as length, width, depth, volume, and structural strength, etc. is determined.
  • FIG. 1 is a plan partial schematic view of a wet chemical processing apparatus for a printed circuit board according to Embodiment 1 of the present invention
  • FIG. 2 is a plan partial schematic view of a wet chemical processing apparatus for a printed circuit board according to Embodiment 2 of the present invention
  • FIG. 3 is a schematic partial plan view showing a stirrer in a wet chemical processing apparatus for a printed circuit board according to Embodiment 2 of the present invention.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • FIG. 1 is a plan partial schematic view of a wet chemical processing apparatus for a printed circuit board according to a first embodiment of the present invention.
  • the present disclosure provides a wet chemical processing apparatus for producing a printed circuit board comprising: a processing component and a pusher.
  • the processing component (such as the processing tank 2 described above) is disposed on a printed circuit board wet chemical processing line.
  • the pusher includes at least one first pusher 3 or at least one second pusher 92.
  • the at least one first pusher 3 is housed in the processing component for transporting treatment fluid from a reservoir to a chemical processing location; the at least one second thruster 92 is for use in the chemical Processing position generation Turbulent flow.
  • the pressure difference between the blades 31 of the first thruster 3 is generated, so that the processing liquid can be driven to flow from the liquid storage tank 1 to the processing tank 2.
  • the processing liquid is not likely to generate bubbles, and the performance of the processing liquid is not easily deteriorated.
  • the pump body avoids the problem that the pump body in the related art is easy to be broken, and the bearing does not need to be replaced frequently, there is no sealing problem, the equipment has low noise, low energy consumption, small heat generation, low application cost, and no water knife is needed.
  • the application cost is low, there is no dead angle, the problem of the degradation of the treatment liquid is avoided, the reliability is good, the production quality and efficiency of the circuit board are ensured, and the cost is low.
  • the processing component is a horizontal processing tank 2 or a vertical processing tank 2 for wet chemical processing of a printed circuit board. That is to say, if the processing tank 2 is used as the processing component in the embodiment, the processing tank 2 may be in a horizontal mode, a vertical mode, or even a tilting, depending on the actual situation. Make an selection.
  • the chemical treatment location is a wet chemically treated location on the surface of the printed circuit board, and the chemical processing location may refer to the processing tank 2.
  • the second pusher 92 is disposed in the processing tank 2 to effectively slow down the overall flow rate of the liquid medicine, and does not bring the air bubbles into the liquid medicine, thereby effectively prolonging the service life of the liquid medicine, and the production cost is low.
  • the second pusher 92 can be directly connected to the drive shaft 923.
  • the drive shaft 923 can be directly connected to the second motor 924, that is, the second pusher 92 is directly driven by the second motor 924 and the drive shaft 923.
  • the driving mode of the second propeller 92 can be driven by the driving shaft 923 as shown in FIG. 1, or can be driven by a belt, a chain, or the like, or can be driven by a magnetic transmission method, as long as the second propeller 92 can be driven. Turn it.
  • the driver 4 is connected to the first pusher 3 and above the first pusher 3.
  • the liquid storage tank 1 communicates with the processing tank 2 through the communication tank 5 .
  • the first pusher 3 is disposed longitudinally or laterally to push the treatment liquid upwardly out of the reservoir 1 and into the treatment tank 2 through the communication tank 5.
  • a top of the liquid storage tank 1 is provided with a transition groove 6 communicating with the liquid storage tank 1, the transition groove 6 having a guiding port 61 leading to the processing tank 2, so as to facilitate the processing tank 2.
  • the arrow in Fig. 1 indicates the flow direction of the treatment liquid.
  • the driver 4 includes a rotating shaft 41.
  • the rotating shaft 41 is longitudinally disposed and extends into the liquid storage tank 1 and is connected to the first thruster 3.
  • the first thruster 3 is longitudinally arranged and can be driven and processed. The liquid flows upward into the reservoir 1.
  • the driver 4 further includes a first motor 42 for driving the rotation of the rotating shaft 41, and the first motor 42 is located above the liquid storage tank 1.
  • the first motor 42 can be directly connected to the rotating shaft 41, and the driving belt or the speed reducer can be connected to the rotating shaft 41.
  • a return line is disposed between the treatment tank 2 and the liquid storage tank 1 so that the treatment liquid can be refluxed in time.
  • the liquid storage tank 1 is lower than the processing tank 2, and the first impeller 3 can push the treatment liquid in the liquid storage tank 1 into the treatment tank 2.
  • the first thruster 3 may have at least two blades 31, two to six blades 31, preferably three or four blades 31, and the size of the first thruster 3 may be set according to actual conditions.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • a printed circuit board wet chemical processing apparatus includes a liquid storage tank 1 for containing a processing liquid (medicine liquid) and a processing tank 2 for accommodating a circuit board.
  • the printed circuit board wet chemical processing apparatus further includes a pushing device for pushing the processing liquid from the liquid storage tank 1 to the processing tank 2, the pushing device comprising a first thruster 3 and for driving the first A drive 4 in which the pusher 3 rotates, the first pusher 3 has at least two blades 31, and the first pusher 3 is disposed in the liquid storage tank 1.
  • the pressure difference between the blades 31 of the first propeller 3 is generated before and after, so that the processing liquid can be driven to flow from the liquid storage tank 1 to the processing tank 2, and the processing liquid is less likely to generate bubbles.
  • the performance of the liquid is not easily deteriorated, the pump body is not needed, the problem of easy failure of the pump body in the related art is avoided, the bearing is not required to be replaced frequently, there is no sealing problem, the equipment has low noise, low energy consumption, small heat generation, and low application cost.
  • the wet chemical treatment of the printed circuit board can be set either longitudinally or laterally.
  • a plurality of first impellers 3 may be provided in the treatment tank 2 to provide sufficient fluid.
  • the push device can be set horizontally or vertically.
  • the first propeller 3 is a low pressure propeller and has a long service life.
  • the driver 4 is connected to the first pusher 3 and above the first pusher 3.
  • the liquid storage tank 1 communicates with the processing tank 2 through the communication tank 5 .
  • the first pusher 3 is disposed longitudinally or laterally to push the treatment liquid upwardly out of the reservoir 1 and into the treatment tank 2 through the communication tank 5.
  • a top of the liquid storage tank 1 is provided with a transition groove 6 communicating with the liquid storage tank 1, the transition groove 6 having a guiding port 61 leading to the processing tank 2, so as to facilitate the processing tank 2.
  • the arrow in Fig. 1 indicates the flow direction of the treatment liquid.
  • the driver 4 includes a rotating shaft 41.
  • the rotating shaft 41 is longitudinally disposed and extends into the liquid storage tank 1 and is connected to the first thruster 3.
  • the first thruster 3 is longitudinally arranged and can be driven and processed. The liquid flows upward into the reservoir 1.
  • the driver 4 further includes a first motor 42 for driving the rotation of the rotating shaft 41, and the first motor 42 is located above the liquid storage tank 1.
  • the first motor 42 can be directly connected to the rotating shaft 41, and the driving belt or the speed reducer can be connected to the rotating shaft 41.
  • a return line is disposed between the treatment tank 2 and the liquid storage tank 1 so that the treatment liquid can be refluxed in time.
  • the liquid storage tank 1 is lower than the processing tank 2, and the first impeller 3 can push the treatment liquid in the liquid storage tank 1 into the treatment tank 2.
  • the first thruster 3 may have at least two blades 31, preferably two to six blades 31, in particular three or four blades 31, the size of which may be set according to actual conditions.
  • a second propeller 92 (agitator) is disposed in the processing tank 2, and the second propeller 92 is connected with a driven disc 93 located in the processing tank 2, and the processing tank 2 is disposed outside
  • the driving disk 94 of the driven disk 93 is driven by a magnetic force, and the driving disk 94 is connected with a driving device for driving the rotation of the driving disk 94, and the rotation of the second pushing device 92 can be effectively slowed down without using a pump.
  • the overall flow rate of the liquid medicine does not bring the air bubbles into the liquid medicine, effectively prolongs the service life of the liquid medicine, and the production cost is low, and the quality of the printed circuit board after the treatment is good.
  • the second pusher 92 can have at least two blades, preferably two to six blades, particularly three or four blades, and the size of the second pusher 92 can be set according to actual conditions.
  • the driving disk 94 and the driven disk 93 are disposed on the inner and outer sides of the bottom wall or the side wall of the processing tank 2 and are disposed opposite to each other, and the transmission effect is good.
  • the active disk 94 and the driven disk 93 are disposed.
  • At least one of the magnetic material is made of a magnetic material, such as a magnet, etc., and an electromagnet structure or the like can also be used.
  • the active disk 94 and the driven disk 93 are both made of a magnet, and the active disk 94 and the driven disk 93 face each other.
  • the magnetic properties at one end are different; or, as an alternative to magnetic drive.
  • the driven disk 93 is a magnet in the shape of a disk.
  • the bottom wall of the processing tank 2 is provided with a disk seat 911 having a circular groove for accommodating the driven disk 93, and the driven disk 93 can be reliably treated in the processing tank 2 Rotate inside.
  • the bottom wall of the processing tank 2 is provided with a slot 910 for mounting the active disk 94.
  • the active disk 94 is located below the driven disk 93 and separated by the processing slot 2.
  • the processing slot 2 can be Made of non-magnetic material.
  • the second propeller 92 includes an agitating shaft 921 and at least two agitating blades 922 fixedly coupled to one end of the agitating shaft 921, and the other end of the agitating shaft 921 is fixedly coupled to the driven plate 93.
  • the agitating blade 922 can push the drug solution in the axial direction to stir the drug solution.
  • the driving device includes a second motor 924, and a rotating shaft of the second motor 924 is coupled to the driving plate 94 or connected to the driving plate 94 via a belt 944.
  • the driving plate 94 is connected to the driving shaft 941.
  • One end of the driving shaft 941 is fixedly connected to the driving plate 94, and the other end of the driving shaft 941 is rotatably disposed through the bearing 942 and the middle of the driving shaft 941.
  • a rotating wheel 943 is fixed, and the driving belt 944 is sleeved between the rotating wheel 943 and the rotating shaft of the second motor 924.
  • the first motor 42 is connected to the frequency modulation module to adjust the rotation speed of the first motor 42.
  • the second motor 924 is connected to the frequency modulation module to adjust the rotation speed of the second motor 924.
  • the embodiment of the invention further provides a printed circuit board wet chemical processing apparatus, comprising at least one pushing device disposed on a wet chemical processing line of a printed circuit board, the pushing device comprising at least one for conveying the processing liquid to the wet chemical
  • the first thruster 3 of the treatment position or at least one first thruster 3 (which may also include a second pusher 92) that produces a vortex at the wet chemical processing location; the pusher is used to replace the function of the pump.
  • the wet chemical treatment location can be located in the reservoir or in the treatment tank described above.
  • the pushing device is the above pushing device, and the pushing device can be set horizontally or vertically.
  • the embodiment of the invention further provides a wet chemical processing method for a printed circuit board, wherein the printed circuit board is subjected to wet chemical treatment using the above-mentioned printed circuit board wet chemical processing equipment, comprising the following steps, the driver 4 drives the first in the liquid storage tank 1 When the pusher 3 rotates, a pressure difference is generated between the blades 31 of the first pusher 3, and the processing liquid is driven from the liquid storage tank 1 to the processing tank 2 to perform wet chemical treatment on the printed circuit board.
  • the driver 4 drives the first in the liquid storage tank 1
  • a pressure difference is generated between the blades 31 of the first pusher 3
  • the processing liquid is driven from the liquid storage tank 1 to the processing tank 2 to perform wet chemical treatment on the printed circuit board.
  • the processing liquid is not easy to generate bubbles, the performance of the processing liquid is not easily deteriorated, and the pump body that is in contact with the chemical treatment liquid is not needed, and the related technology is avoided.
  • the pump body is easy to fail, and there is no need to change the bearing frequently. There is no sealing problem.
  • the equipment has low noise, low energy consumption, low heat generation, low application cost, and no water knife. The application cost is low and there is no dead angle. The problem of degradation of the treatment liquid is avoided, the reliability is good, the production quality and efficiency of the circuit board are ensured, and the loss of the treatment liquid is low, and the transmission mode can be applied to horizontal and vertical transmission.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Mixers Of The Rotary Stirring Type (AREA)

Abstract

L'invention concerne un dispositif de traitement chimique par voie humide pour une carte de circuit imprimé, comprenant un élément de traitement et une hélice; l'élément de traitement étant disposé sur une ligne de traitement chimique par voie humide de carte de circuit imprimé; l'hélice comportant au moins une première hélice (3) ou au moins une seconde hélice (92), ladite première hélice (3) étant logée dans l'élément de traitement, et étant utilisée pour transférer le liquide de traitement depuis un réservoir de stockage (1) de liquide vers une position de traitement chimique; ladite seconde hélice (92) étant utilisée pour générer des turbulences au niveau de la position de traitement chimique.
PCT/CN2016/086862 2015-11-23 2016-06-23 Dispositif de traitement chimique par voie humide pour carte de circuit imprimé et procédé de traitement chimique par voie humide pour carte de circuit imprimé WO2017088466A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020177037854A KR102051729B1 (ko) 2015-11-23 2016-06-23 인쇄회로기판 습식 화학 처리 장치 및 인쇄회로기판 습식 화학 처리 방법
DE112016001153.9T DE112016001153T5 (de) 2015-11-23 2016-06-23 Vorrichtung für eine nasschemische behandlung für eine leiterplatte und nasschemische behandlung für eine leiterplatte
DE212016000082.9U DE212016000082U1 (de) 2015-11-23 2016-06-23 Vorrichtung für eine nasschemische Behandlung für eine Leiterplatte und nasschemische Behandlung für eine Leiterplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510819146.3A CN106793499B (zh) 2015-11-23 2015-11-23 印刷电路板湿化学处理设备和印刷电路板湿化学处理方法
CN201510819146.3 2015-11-23

Publications (1)

Publication Number Publication Date
WO2017088466A1 true WO2017088466A1 (fr) 2017-06-01

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PCT/CN2016/086862 WO2017088466A1 (fr) 2015-11-23 2016-06-23 Dispositif de traitement chimique par voie humide pour carte de circuit imprimé et procédé de traitement chimique par voie humide pour carte de circuit imprimé

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KR (1) KR102051729B1 (fr)
CN (1) CN106793499B (fr)
DE (2) DE212016000082U1 (fr)
TW (2) TWM542317U (fr)
WO (1) WO2017088466A1 (fr)

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