DE212016000082U1 - Vorrichtung für eine nasschemische Behandlung für eine Leiterplatte und nasschemische Behandlung für eine Leiterplatte - Google Patents

Vorrichtung für eine nasschemische Behandlung für eine Leiterplatte und nasschemische Behandlung für eine Leiterplatte Download PDF

Info

Publication number
DE212016000082U1
DE212016000082U1 DE212016000082.9U DE212016000082U DE212016000082U1 DE 212016000082 U1 DE212016000082 U1 DE 212016000082U1 DE 212016000082 U DE212016000082 U DE 212016000082U DE 212016000082 U1 DE212016000082 U1 DE 212016000082U1
Authority
DE
Germany
Prior art keywords
propeller
circuit board
printed circuit
tank
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE212016000082.9U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universal P C B Equipment (shenzhen) Co Ltd
Universal PCB Equipment Co Ltd
Original Assignee
Universal P C B Equipment (shenzhen) Co Ltd
Universal PCB Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal P C B Equipment (shenzhen) Co Ltd, Universal PCB Equipment Co Ltd filed Critical Universal P C B Equipment (shenzhen) Co Ltd
Publication of DE212016000082U1 publication Critical patent/DE212016000082U1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Mixers Of The Rotary Stirring Type (AREA)
DE212016000082.9U 2015-11-23 2016-06-23 Vorrichtung für eine nasschemische Behandlung für eine Leiterplatte und nasschemische Behandlung für eine Leiterplatte Active DE212016000082U1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201510819146.3A CN106793499B (zh) 2015-11-23 2015-11-23 印刷电路板湿化学处理设备和印刷电路板湿化学处理方法
CN201510819146.3 2015-11-23
PCT/CN2016/086862 WO2017088466A1 (fr) 2015-11-23 2016-06-23 Dispositif de traitement chimique par voie humide pour carte de circuit imprimé et procédé de traitement chimique par voie humide pour carte de circuit imprimé

Publications (1)

Publication Number Publication Date
DE212016000082U1 true DE212016000082U1 (de) 2017-12-05

Family

ID=58763799

Family Applications (2)

Application Number Title Priority Date Filing Date
DE212016000082.9U Active DE212016000082U1 (de) 2015-11-23 2016-06-23 Vorrichtung für eine nasschemische Behandlung für eine Leiterplatte und nasschemische Behandlung für eine Leiterplatte
DE112016001153.9T Pending DE112016001153T5 (de) 2015-11-23 2016-06-23 Vorrichtung für eine nasschemische behandlung für eine leiterplatte und nasschemische behandlung für eine leiterplatte

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112016001153.9T Pending DE112016001153T5 (de) 2015-11-23 2016-06-23 Vorrichtung für eine nasschemische behandlung für eine leiterplatte und nasschemische behandlung für eine leiterplatte

Country Status (5)

Country Link
KR (1) KR102051729B1 (fr)
CN (1) CN106793499B (fr)
DE (2) DE212016000082U1 (fr)
TW (2) TWM542317U (fr)
WO (1) WO2017088466A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113873774B (zh) * 2021-09-15 2023-08-29 江苏贺鸿电子有限公司 一种印刷电路板制作的水平沉铜装置
CN114222433B (zh) * 2022-01-25 2022-08-09 东莞塘厦裕华电路板有限公司 一种印刷电路板湿化学处理设备
CN114760765B (zh) * 2022-06-16 2022-09-02 深圳市惠利电子科技有限公司 一种干式电路板化学蚀刻设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565472U (ja) * 1992-01-20 1993-08-31 東京生産技研株式会社 自動半田付装置
US6214117B1 (en) * 1998-03-02 2001-04-10 Speedline Technologies, Inc. Dispensing system and method
CN1258607A (zh) * 2000-01-21 2000-07-05 陈缨 由永磁联轴节传动的不泄漏汽车水泵
CN2445847Y (zh) * 2000-06-05 2001-09-05 王赐斌 锡炉装置
JP2003230979A (ja) * 2002-02-13 2003-08-19 Aisin Seiki Co Ltd 噴流型半田付け装置
JP4501486B2 (ja) * 2004-03-25 2010-07-14 株式会社大真空 エッチング処理槽及び、エッチング処理槽を備えたエッチング処理装置
TWI415968B (zh) * 2005-11-23 2013-11-21 Applied Materials Inc 用於在微特徵工件之濕式化學製程中攪動液體的裝置與方法
DE102009060676B4 (de) * 2009-12-28 2015-07-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut
CN103377972B (zh) * 2012-04-30 2016-12-28 细美事有限公司 基板处理装置和供给处理溶液的方法
EP2854490A1 (fr) * 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Procédé et appareil pour un traitement électrochimique ou chimique par voie humide
CN203890479U (zh) * 2014-05-15 2014-10-22 衢州顺络电路板有限公司 一种高密度互连印刷电路板的电镀槽
CN205305227U (zh) * 2015-11-23 2016-06-08 宇宙电路板设备(深圳)有限公司 印刷电路板湿化学处理设备

Also Published As

Publication number Publication date
DE112016001153T5 (de) 2017-11-23
TW201720253A (zh) 2017-06-01
KR102051729B1 (ko) 2019-12-03
TWM542317U (zh) 2017-05-21
CN106793499B (zh) 2019-07-16
WO2017088466A1 (fr) 2017-06-01
TWI640231B (zh) 2018-11-01
KR20180015685A (ko) 2018-02-13
CN106793499A (zh) 2017-05-31

Similar Documents

Publication Publication Date Title
DE212016000082U1 (de) Vorrichtung für eine nasschemische Behandlung für eine Leiterplatte und nasschemische Behandlung für eine Leiterplatte
DE69215866T2 (de) Schraubenartige Vorrichtung zur Erzeugung eines Wasserflusses
DE2151412A1 (de) Belueftungsvorrichtung
DE2137982A1 (de) Verfahren und Vorrichtung zur Ent fernung von Gasen aus einer Flüssigkeit
DE2909878A1 (de) Vorrichtung zur abfuehrung des leckflusses eines mediums bei spaltdichtungen
DE2337328C2 (de) Elektrischer Regelantrieb
DE202014010710U1 (de) Querstromströmungspumpe
DE3715331A1 (de) Homogenisator fuer die herstellung fliessfaehiger produkte
DE102007048642A1 (de) Elektrischer Antrieb, insbesondere für eine Kraftstoffzumesseinheit für ein Flugzeugtriebwerk
DE112018000048T5 (de) Elektrische Winde
WO2013026545A1 (fr) Appareil de traitement de l'eau pour la destruction d'organismes et procédé pour le traitement de l'eau de mer
EP0635595A1 (fr) Procédé et dispositif pour le traitement des textiles en surface
DE102014200576B3 (de) Vorrichtung zum Umkehren der Laufschaufeln für ein Laufrad in einem Gezeiten-Kraftwerk
DE112010001133B4 (de) Schmiervorrichtung
DE102013015908A1 (de) Multikopterausleger
DE69726122T2 (de) Wasserstrahlantriebsvorrichtung für wasserfahrzeuge
DE102005031804A1 (de) Schmiermittelsystem
DE112014004517T5 (de) Schallemitter
EP4276010A1 (fr) Système d'entraînement sous-marin
WO2001079060A1 (fr) Dispositif de propulsion par reaction pour bateaux
DE102008045887B4 (de) Direkt gekoppelter Tauchmischer ohne Untersetzung
DE19905435A1 (de) Tauchpumpe
CH716035A2 (de) Vorrichtung zur Rückgewinnung von Energie.
AT511095B1 (de) Pumpe zur erzeugung von druckluft
WO2003011774A1 (fr) Aerateur pour cours d'eau

Legal Events

Date Code Title Description
R207 Utility model specification
R150 Utility model maintained after payment of first maintenance fee after three years
R151 Utility model maintained after payment of second maintenance fee after six years