WO2017067078A1 - Structure en couches de placage de verre, appareil de détection d'empreintes digitales et terminal mobile - Google Patents

Structure en couches de placage de verre, appareil de détection d'empreintes digitales et terminal mobile Download PDF

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Publication number
WO2017067078A1
WO2017067078A1 PCT/CN2015/099676 CN2015099676W WO2017067078A1 WO 2017067078 A1 WO2017067078 A1 WO 2017067078A1 CN 2015099676 W CN2015099676 W CN 2015099676W WO 2017067078 A1 WO2017067078 A1 WO 2017067078A1
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Prior art keywords
layer
plating
coating
coating layer
glass
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PCT/CN2015/099676
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English (en)
Chinese (zh)
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苏斌
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乐视移动智能信息技术（北京）有限公司
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Publication of WO2017067078A1 publication Critical patent/WO2017067078A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
    • C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
    • C03C17/3435—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising a nitride, oxynitride, boronitride or carbonitride
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing

Definitions

  • the invention relates to a glass coating structure, a fingerprint detecting device and a mobile terminal, in particular to a glass coating structure applied to fingerprint detection, a fingerprint detecting device comprising the glass plating structure and a mobile terminal including the fingerprint detecting device.
  • fingerprint recognition technology has been applied to products such as mobile terminals (such as computers).
  • the capacitive push fingerprint detection method is widely used, and is specifically divided into active press detection and passive press detection.
  • the basic principle of passive press detection is shown in Figure 1.
  • the entire detection system includes: a capacitive fingerprint sensor 10 at the bottom and an isolation layer (or a protective layer) overlying the capacitive fingerprint sensor 10, which is also the area where the finger is in direct contact.
  • the capacitive fingerprint sensor 10 includes a plurality of capacitor plates arranged in a two-dimensional array (exemplarily labeled 5 capacitor plates P1-P5 in the figure), when the skin of the finger 12 is attached to the isolation layer 11 After the combination, a capacitance is formed between the skin of the finger 12 and the capacitor plate. Due to the presence of the fingerprint, a situation as shown in FIG.
  • the skin of the finger 12 and the surface of the isolation layer 11 form a plurality of ridges and ridges.
  • the distance between the different positions of the skin of the finger 12 and the respective capacitive plates is unequal, whereby different capacitance values are produced between the respective capacitive plates and the skin of the fingers 12.
  • the capacitance value formed at the crucible is Cv
  • the capacitance value formed at the crucible is Cr.
  • FIG. 2 The principle of active press detection is shown in FIG. 2.
  • a metal ring 13 surrounding the isolation layer 11 is added.
  • the metal ring 13 is connected to the bottom circuit, and the metal ring 13 is used to wake up the bottom layer.
  • the capacitive fingerprint sensor 10 and a certain current signal are applied to the finger 12 through the metal ring 13, thereby increasing the power on the skin of the finger 12.
  • the amount of charge which in turn enhances the signal detected by the capacitor plates.
  • FIG. 3 it shows a fingerprint image signal presented by detection of a capacitive fingerprint sensor.
  • the upper and lower surfaces of the spacer layer 11 must be formed of an insulating material, otherwise the capacitance between the skin of the finger 12 and the capacitor plate will be destroyed, so that the fingerprint information cannot be detected.
  • the portion of the isolation layer 11 that is in contact with the metal ring 13 must also be insulated. If the isolation layer 11 is electrically conductive, current on the metal ring 13 will flow through the isolation layer 11, thereby The signal is confusing and the fingerprint information cannot be detected.
  • the capacitive fingerprint sensor 10 since the detection range of the capacitive plate array of the capacitive fingerprint sensor 10 is small, the finger 12 is required to be close to the array of the capacitor plates, that is, the thickness of the isolation layer 11 is not required to be large, or the fingerprint detection effect is affected. Especially for the passive press detection system, the capacitive fingerprint sensor 10 is more sensitive to the thickness of the upper covered isolation layer 11, and the isolation layer 11 having a larger thickness cannot be used.
  • the area covered by the isolation layer 11 is also the area for fingerprint recognition, which is generally located on mobile terminals.
  • the more prominent position, for example, is placed in the middle of the back cover of the mobile phone, or placed in the lower part of the front of the mobile phone. Therefore, the aesthetic appearance of the fingerprint recognition area will directly affect the overall appearance of the mobile phone.
  • the isolation layer 11 of the fingerprint recognition area is mostly made of ceramic or plastic, and the protection capacitor is simply realized in function.
  • the fingerprint sensor 10 functions as an isolation package, but the glass mirror cannot be realized on the fingerprint detecting device.
  • the coating technology of the glass mirror surface is relatively mature.
  • the general mirror coating does not require high insulation and thickness, it is generally adopted by direct metal plating or by multi-layer coating.
  • the effect of the coating layer thus formed is generally thick or non-insulating, and therefore, the thickness requirement for fingerprint detection cannot be satisfied.
  • the fingerprint detection system itself adopts the principle of capacitance detection.
  • the skin of the finger 12 and the array of the capacitor plates respectively serve as the two poles of the capacitor. According to the calculation formula of the capacitance, the size of the capacitor is related to the distance between the capacitor plates.
  • the introduction of the coating layer will increase the amount of medium between the capacitor plates, thereby affecting the size of the capacitance, the thickness of the coating layer The larger the effect, the greater the influence on the capacitance value. Therefore, in order not to have a serious influence on the fingerprint detection, it is objectively impossible to allow the existence of a thick coating layer.
  • An object of the present invention is to provide a glass plating structure, a fingerprint detecting device, and a mobile terminal, which can make the fingerprint detecting area have a mirror effect under the premise that the fingerprint detecting effect is small.
  • the present invention provides a glass plating structure comprising a glass substrate, and an alternating layer of a titanium oxynitride coating layer and a silicon oxynitride coating layer are disposed downwardly on a lower surface of the glass substrate, wherein
  • the ratio of nitrogen to oxygen is the same, ranging from 0.4:1 to 1.5:1.
  • the present invention also provides a fingerprint detecting device comprising: a capacitive fingerprint sensor, wherein the glass plating structure is attached to an upper portion of the capacitive fingerprint sensor.
  • the present invention further provides a mobile terminal including the above-mentioned fingerprint detecting device, the back cover of the mobile terminal is provided with an opening for performing fingerprint detection, and the fingerprint detecting device is located at a lower portion of the opening, and the fingerprint detecting device The upper surface of the glass plating structure is exposed from the opening.
  • the glass plating structure, the fingerprint detecting device and the mobile terminal provided by the invention alternately apply a titanium oxynitride coating layer and a silicon oxynitride coating layer on the lower surface of the glass substrate, and the ratio of nitrogen to oxygen in the plating compound is the same. And in the range of 0.4:1 to 1.5:1, the glass coating structure with mirror effect is realized under the premise of ensuring insulation, and the influence of the thickness of the plating itself on the fingerprint detection is very controlled. Small range.
  • FIG. 1 is a schematic diagram of a prior art fingerprint detection principle
  • FIG. 2 is a second schematic diagram of the principle of fingerprint detection in the prior art
  • FIG. 3 is a schematic diagram of a fingerprint detection image signal of the prior art
  • FIG. 4 is a schematic view showing a structure of a glass plating layer according to an embodiment of the present invention.
  • FIG. 5 is a second schematic view showing the structure of a glass plating layer according to an embodiment of the present invention.
  • FIG. 6 is a schematic view showing a principle of coating a film according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in Embodiment 2 of the present invention.
  • FIG. 8 is a second schematic diagram of a reflectance curve corresponding to a second group of film structures in Embodiment 2 of the present invention.
  • FIG. 9 is a third schematic diagram of a reflectance curve corresponding to a third group of film structures in Embodiment 2 of the present invention.
  • FIG. 10 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in Embodiment 3 of the present invention.
  • FIG. 11 is a second schematic diagram of a reflectance curve corresponding to a second group of film structures in Embodiment 3 of the present invention.
  • FIG. 12 is a third schematic diagram of a reflectance curve corresponding to a third group of film structures in Embodiment 3 of the present invention.
  • FIG. 13 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in Embodiment 4 of the present invention.
  • FIG. 14 is a second schematic diagram of a reflectance curve corresponding to a second group of film structures in Embodiment 4 of the present invention.
  • FIG. 15 is a third schematic diagram of a reflectance curve corresponding to a third group of film structures in Embodiment 4 of the present invention.
  • FIG. 16 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in Embodiment 12 of the present invention.
  • FIG. 17 is a second schematic diagram of a reflectance curve corresponding to a second group of film structures in Embodiment 12 of the present invention.
  • FIG. 18 is a third schematic diagram of a reflectance curve corresponding to a third group of film structures in the twelfth embodiment of the present invention.
  • FIG. 19 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in an eighteenth embodiment of the present invention.
  • 20 is a second schematic diagram of a reflectance curve corresponding to the second group of film structures in the eighteenth embodiment of the present invention.
  • Figure 21 is a third schematic diagram of a reflectance curve corresponding to the third group of film structures in the eighteenth embodiment of the present invention.
  • the principle of the embodiment of the invention is that the mirror effect is achieved by alternately plating the titanium oxynitride coating layer and the silicon oxynitride coating layer on the lower surface of the glass substrate, and at the same time ensuring the insulation and controlling the thickness of the overall coating layer. In a very thin range, thereby reducing the impact on fingerprint detection.
  • the embodiment relates to a glass plating structure, which is mainly used in a capacitive press type fingerprint detecting system, and functions as an isolation layer covering a capacitive fingerprint sensor.
  • the structure of the glass plating layer includes glass.
  • the substrate 1 and the alternately stacked titanium oxynitride coating layer 2 and the silicon oxynitride plating layer 3 disposed on the lower surface of the glass substrate, and the overall coating layer structure formed by the multilayer coating layer are also referred to as a film. system.
  • the glass coating structure of the embodiment of the invention comprises a glass substrate, and an alternating layer of titanium oxynitride coating layer and a silicon oxynitride coating layer are disposed downwardly on the lower surface of the glass substrate, wherein in each coating layer
  • the ratio of nitrogen to oxygen is the same, ranging from 0.4:1 to 1.5:1.
  • the refractive index of the titanium oxynitride is controlled to about 1.8 to 2.1
  • the refractive index of silicon oxynitride is controlled at about 1.3-1.4.
  • the overall coating thickness can be controlled to be thin (can be controlled under the premise that the desired effect is satisfied) Within 1um), therefore, the impact on the capacitance value detection of the fingerprint sensor is small.
  • the magnitude of the capacitance value is also affected by the filled medium between the capacitor plates.
  • the capacitance value is also affected.
  • the plating structure of the embodiment of the present invention only Two kinds of nitrogen oxides are used as the plating layer. Therefore, there are few kinds of substances between the finger skin and the capacitor plate array, and there is no metal plating layer, and the overall thickness of the plating layer is very thin, from between the capacitor plates. From the perspective of the filling material, the effect is also reduced to a small extent.
  • the titanium oxynitride coating layer is located in the first layer, that is, the titanium oxynitride coating layer is first plated, and since the reflectance of the titanium oxynitride is relatively high, it is disposed on the first layer. It can make the entire film system appear more colorful.
  • a mirror effect can be achieved by using the number of layers, the thickness, and the coating ratio of titanium oxynitride to silicon oxynitride: the titanium oxynitride coating layer and the coating layer of the silicon oxynitride coating layer.
  • the total number is 4-7 layers
  • the total thickness of the plating layer is between 100 nm and 950 nm
  • the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 0.4 and 1.65.
  • the glass plating structure of the present embodiment can be realized by an NCVM (non-conductive vacuum plating) process. Specifically, a vacuum space as shown in FIG. 6 is disposed, and a fixed ratio of nitrogen and oxygen is introduced thereto, wherein the ratio of nitrogen to oxygen ranges from 0.4:1 to 1.5:1, and then titanium nitrogen is alternately executed. In the oxide plating layer forming step and the silicon oxynitride plating layer forming step, a silicon oxynitride plating layer and a titanium oxynitride plating layer which are alternately laminated are formed downward on the lower surface of the glass substrate.
  • NCVM non-conductive vacuum plating
  • the step of forming the titanium oxynitride coating layer is specifically: exciting the titanium raw material provided in the sealed space by an electron gun, evaporating the titanium raw material, reacting with nitrogen and oxygen in the sealed space, and then in the glass.
  • a titanium oxynitride coating layer is formed downward on the lower surface of the substrate.
  • the silicon oxynitride coating layer forming process includes: exciting a silicon raw material disposed in the sealed space by an electron gun, evaporating the silicon raw material, reacting with nitrogen and oxygen in the sealed space, and then under the glass substrate A silicon oxynitride coating layer is formed on the surface downward.
  • the number of times of alternately performing the titanium oxynitride coating layer formation step and the silicon oxynitride coating layer formation step depends on the number of layers to be finally obtained, and the thickness of each layer is controlled by controlling the titanium oxynitride coating layer formation process and silicon nitrogen each time.
  • the oxide plating layer formation step is realized.
  • the ratio of the nitrogen atom to the oxygen atom in the compound of the coating layer is controlled to achieve the reflectance of the titanium oxynitride and the silicon oxynitride. Adjustment, thereby controlling the refractive index of titanium oxynitride to about 1.8-2.1, controlling the refractive index of silicon oxynitride to about 1.3-1.4, and controlling the layer thickness and layer thickness, in the case of thin overall thickness Underneath, a mirror effect with a brighter effect is achieved.
  • This embodiment employs a process, since only two common metal and semiconductor materials are used, The process is simple to implement and is convenient for batch generation.
  • a titanium oxynitride plating layer forming step is performed so that the titanium oxynitride coating layer is located in the first layer, and since the reflectance of the titanium oxynitride is relatively high, In the first layer, the entire film system can be rendered more vivid colors.
  • the number of layers, the thickness, and the coating ratio of titanium oxynitride to silicon oxynitride can be achieved by control of the process (such as coating time, number of processes, etc.)
  • the total thickness of the coating layer of the silicon oxynitride coating layer is 4-7 layers, and the total thickness of the plating layer is between 100 nm and 950 nm, and the total thickness of the coating layer of the titanium oxynitride and the total coating layer of the silicon oxynitride layer
  • the thickness ratio is between 0.4 and 1.65.
  • Embodiments 1 to 10 correspond to a specific embodiment of the mirror effect of the rose gold
  • Embodiments 11 to 16 correspond to a specific embodiment of the silver mirror effect
  • Embodiments 17 to 22 correspond to the specific mirror effect of the black color.
  • Embodiments, Embodiments Twenty-three and Twenty-four are specific application product embodiments of the glass coating structure of the present invention.
  • the embodiment relates to a glass coating structure, which is mainly used in a capacitive press type fingerprint detecting system, and functions as an isolation layer covering a capacitive fingerprint sensor.
  • the structure of the glass plating layer includes a glass basic 1 and The entire layer of the titanium oxide layer 2 and the silicon oxynitride layer 3, which are disposed alternately on the lower surface of the glass substrate, and the layer of the coating layer formed by the multilayer coating layer are also referred to as a film system.
  • the ratio of nitrogen to oxygen is approximately between 1.3:1 and 1.5:1. In practical applications, the ratio of nitrogen to oxygen is positioned as a preferred solution.
  • a plating structure in which a titanium oxynitride plating layer and the silicon oxynitride coating layer are alternately laminated is used to realize a mirror effect of the glass substrate, and the thickness can be thinner as a whole while ensuring insulation.
  • the coating is used to achieve a brightly colored mirror effect.
  • the reflectance of titanium oxynitride and silicon oxynitride is adjusted by controlling the ratio of nitrogen atoms to oxygen atoms in titanium oxynitride and silicon oxynitride between 1.3:1 and 1.5:1.
  • the refractive index of titanium oxynitride is controlled to about 1.84, and the refractive index of silicon oxynitride is controlled to about 1.31.
  • the combination of layer number and layer thickness is controlled, and the effect is relatively thin when the overall thickness is thin.
  • the titanium oxynitride coating layer is located in the first layer, that is, the titanium oxynitride coating layer is first plated, and since the reflectance of the titanium oxynitride is relatively high, setting it on the first layer enables The entire film system is more colorful.
  • the total number of coating layers of the titanium oxynitride coating layer 2 and the silicon oxynitride coating layer 3 may be 5-7 layers, and the total thickness of the plating layer may be controlled between 280 nm and 1000 nm. Further, in the embodiment of the invention, the thickness of the glass substrate may be in the range of 170-180 um, preferably 175 um.
  • This embodiment provides a specific plating structure on the basis of the first embodiment: the total number of the coating layers is 5, the total thickness of the coating layer of the titanium oxynitride and the silicon oxynitride The ratio of the total thickness of the coating layer is between 1.55 and 1.65. This ratio is guaranteed to achieve the mirror effect of rose gold in the case of plating only 5 layers, and the total thickness can be controlled below 500 nm, thereby reducing the The effect of capacitance detection.
  • each layer can be distributed as follows:
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 45 to 70 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 55 to 90 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 45 to 70 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 55 to 90 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 95 to 150 nm;
  • first layer and the third layer have the same thickness
  • second layer and the fourth layer have the same thickness
  • second layer and the fourth layer have a thickness greater than the thicknesses of the first layer and the third layer.
  • Second Group The third group First layer (TIN x O y ) 46nm 69nm 50nm Second layer (SIN x O y ) 59nm 89nm 66nm Third layer (TIN x O y ) 46nm 69nm 50nm The fourth layer (SIN x O y ) 59nm 89nm 66nm Fifth layer (TIN x O y ) 99nm 149nm 110nm Total thickness 309nm 465nm 342nm Thickness ratio of TIN x O y to SIN x O y 1.61 1.61 1.59
  • the reflectance curves of the three groups of film structures in the above table are shown in Figs. 7 to 9, in which the horizontal axis coordinate is the wavelength (nm) and the vertical axis is the refractive index (%), and the graphs of the following examples have the same horizontal and vertical coordinates. .
  • the total number of the coating layers is 6 layers
  • the total thickness of the coating layer of the titanium oxynitride and the silicon oxynitride is between 0.8 and 0.9. This ratio is ensured to achieve the mirror effect of rose gold with only 6 layers of plating, and the total thickness can be controlled below 600 nm, thereby reducing The effect on capacitance detection.
  • each layer can be distributed as follows:
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 75 to 95 nm;
  • the sixth layer coating layer is a silicon oxynitride coating layer having a thickness ranging from 110 to 135 nm;
  • first layer, the third layer and the fifth layer have the same thickness
  • the second layer and the fourth layer have the same thickness
  • the thicknesses of the second layer and the fourth layer are greater than the thicknesses of the third layer and the fifth layer.
  • Second Group The third group First layer (TIN x O y ) 76nm 50nm 90nm
  • Second layer (SIN x O y ) 77nm 51nm 91nm Third layer (TIN x O y ) 76nm 50nm 90nm The fourth layer (SIN x O y ) 77nm 51nm 91nm Fifth layer (TIN x O y ) 76nm 50nm 90nm The sixth layer (SIN x O y ) 111nm 67nm 134nm Total thickness 493nm 319nm 586nm Thickness ratio of TIN x O y to SIN x O y 0.86 0.88 0.85
  • the total number of the coating layers is 7 layers
  • the total thickness of the coating layer of the titanium oxynitride and the silicon oxynitride is between 1.4 and 1.5. This ratio is ensured to achieve the mirror effect of rose gold with only 7 layers of plating, and the total thickness can be controlled below 950 nm, thereby reducing The effect on capacitance detection.
  • each layer can be distributed as follows:
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 65 to 130 nm;
  • the sixth layer coating layer is a silicon oxynitride plating layer, and the thickness ranges from 65 to 130 nm;
  • the seventh layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 80 to 170 nm;
  • the thicknesses of the first layer to the sixth layer are the same, and the thickness of the seventh layer is greater than the thickness of the first layer to the sixth layer.
  • Second Group The third group First layer (TIN x O y ) 99nm 66nm 129nm Second layer (SIN x O y ) 99nm 66nm 129nm Third layer (TIN x O y ) 99nm 66nm 129nm
  • the fourth layer (SIN x O y ) 99nm 66nm 129nm Fifth layer (TIN x O y ) 99nm 66nm 129nm The sixth layer (SIN x O y ) 99nm 66nm 129nm The seventh layer (TIN x O y ) 128nm 84nm 165nm Total thickness 722nm 480nm 939nm Thickness ratio of TIN x O y to SIN x O y 1.43 1.42 1.42
  • an ink layer is disposed under the entire plating layer, and by providing an ink layer, light shielding can be better to prevent interference of stray light, and the invention is required for the invention.
  • the color achieved is preferably a gray ink layer printed, and the gray ink layer is capable of adjusting the background color to give a better rose gold effect.
  • a certain hollow pattern when printing the gray ink layer, for example, a hollow pattern of the printed fingerprint pattern, a hollow portion and a non-hollow portion, and there is a difference in light transmittance and reflectivity, thereby The upper glass observation will present a corresponding pattern on the mirror background, so that the fingerprint area can be identified or decorated.
  • a pigment different from gray may be further disposed in the hollow pattern, and more preferably, a pigment that contrasts with the gray is filled, thereby making the pattern more conspicuous.
  • This embodiment mainly describes a method for manufacturing the glass plating structure of the first embodiment.
  • the glass plating structure of the present embodiment can be realized by an NCVM (non-conductive vacuum plating) process.
  • a vacuum space as shown in FIG. 6 is disposed, and nitrogen and oxygen (preferably, nitrogen and oxygen in a ratio of 1.4:1) are introduced into the ratio between 1.3:1 and 1.5:1, and then
  • nitrogen and oxygen preferably, nitrogen and oxygen in a ratio of 1.4:1
  • the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step are alternately performed to form an alternately stacked silicon oxynitride plating layer and a titanium oxynitride plating layer on the lower surface of the glass substrate.
  • the step of forming the titanium oxynitride coating layer is specifically: being set by the electron gun excitation
  • the titanium raw material in the sealed space evaporates the titanium raw material, and reacts with nitrogen and oxygen in the sealed space to form a titanium oxynitride plating layer on the lower surface of the glass substrate.
  • the silicon oxynitride coating layer forming process includes: exciting a silicon raw material disposed in the sealed space by an electron gun, evaporating the silicon raw material, reacting with nitrogen and oxygen in the sealed space, and then under the glass substrate A silicon oxynitride coating layer is formed on the surface downward.
  • the number of times of alternately performing the titanium oxynitride coating layer formation step and the silicon oxynitride coating layer formation step depends on the number of layers to be finally obtained, and the thickness of each layer is controlled by controlling the titanium oxynitride coating layer formation process and silicon nitrogen each time.
  • the oxide plating layer formation step is realized.
  • the ratio of the nitrogen atom to the oxygen atom in the compound of the coating layer is controlled to achieve the reflectance of the titanium oxynitride and the silicon oxynitride. Adjusting, so that the refractive index of titanium oxynitride is controlled at about 1.84, and the refractive index of silicon oxynitride is controlled at about 1.31, and the combination of layer number and layer thickness is controlled, and the overall thickness is thin. The mirror effect of the brighter rose gold.
  • This embodiment adopts a process. Since only two common metal and semiconductor materials are used, the process is simple to implement and convenient for batch generation.
  • a titanium oxynitride plating layer forming step is performed so that the titanium oxynitride coating layer is located in the first layer, and since the reflectance of the titanium oxynitride is relatively high, In the first layer, the entire film system can be rendered more vivid colors.
  • the total number of coating layers can be controlled in 5-7 layers, and the total thickness of the plating layer can be controlled between 280 nm and 1000 nm.
  • the thickness of the glass substrate can be 170-180 um. Within the range, it is preferably 175 um.
  • the embodiment relates to a method for manufacturing the plating structure of the second embodiment, which comprises: alternately performing a titanium oxynitride coating layer forming step and a silicon oxynitride coating layer forming step (which can be performed five times alternately).
  • the total number of coating layers is 5 layers, and the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 1.55 and 1.65.
  • the film layer process produces a plating structure having the following thickness:
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 45 to 70 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 55 to 90 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 45 to 70 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 55 to 90 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 95 to 150 nm;
  • first layer and the third layer have the same thickness
  • second layer and the fourth layer have the same thickness
  • second layer and the fourth layer have a thickness greater than the thicknesses of the first layer and the third layer.
  • the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in the second embodiment, and details are not described herein.
  • the present embodiment relates to a method for producing a plating structure of the above-described third embodiment, which alternately executes a titanium oxynitride plating layer forming step and a silicon oxynitride coating layer forming step (which can be performed alternately six times) to make the coating
  • the total number of layers is 6 layers, and the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 0.8 and 0.9.
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 75 to 95 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 75 to 95 nm;
  • the sixth layer coating layer is a silicon oxynitride coating layer having a thickness ranging from 110 to 135 nm;
  • first layer, the third layer and the fifth layer have the same thickness
  • the second layer and the fourth layer have the same thickness
  • the thicknesses of the second layer and the fourth layer are greater than the thicknesses of the third layer and the fifth layer.
  • the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in the third embodiment, and details are not described herein.
  • the present embodiment relates to a method for manufacturing the plating structure of the fourth embodiment, which alternately performs a titanium oxynitride coating layer forming step and a silicon oxynitride coating layer forming step (which can be performed alternately seven times), the coating layer
  • the total number is 7 layers, and the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 1.4 and 1.5.
  • a plating structure having the following thickness plating layer is produced:
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 65 to 130 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 65 to 130 nm;
  • the sixth layer coating layer is a silicon oxynitride plating layer, and the thickness ranges from 65 to 130 nm;
  • the seventh layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 80 to 170 nm;
  • the thicknesses of the first layer to the sixth layer are the same, and the thickness of the seventh layer is greater than the thickness of the first layer to the sixth layer.
  • the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in the fourth embodiment, and details are not described herein.
  • This embodiment mainly describes the structure of the above-described fifth embodiment.
  • an ink layer is printed on the lower side of the plating layer, whereby light shielding can be performed better.
  • printing a layer of gray ink under the plating layer may include: printing a gray ink layer having a fingerprint pattern hollow pattern, filling a pigment different from gray in a portion having a hollow; or printing only a hollow pattern without filling the pigment.
  • the filling is preferably a pigment which contrasts with the gray color, thereby making the pattern more conspicuous.
  • the embodiment relates to a glass plating structure, which is mainly used in a capacitive press type fingerprint detecting system, and functions as an isolation layer covering a capacitive fingerprint sensor.
  • the structure of the glass plating layer includes a glass basic 1 and The entire layer of the titanium oxide layer 2 and the silicon oxynitride layer 3, which are disposed alternately on the lower surface of the glass substrate, and the layer of the coating layer formed by the multilayer coating layer are also referred to as a film system.
  • a plating structure in which a titanium oxynitride plating layer and the silicon oxynitride coating layer are alternately laminated is used to realize a mirror effect of the glass substrate, and the thickness can be thinner as a whole while ensuring insulation.
  • the coating is used to achieve a brightly colored mirror effect.
  • the reflectance of the titanium oxynitride and the silicon oxynitride is adjusted by controlling the ratio of the nitrogen atom to the oxygen atom in the titanium oxynitride and the silicon oxynitride to be between 0.8:1 and 1:1.
  • the refractive index of titanium oxynitride is controlled to about 1.92
  • the refractive index of silicon oxynitride is controlled to about 1.35.
  • the combination of layer number and layer thickness is controlled, and the effect is relatively thin when the overall thickness is thin. Bright silver mirror effect.
  • the titanium oxynitride coating layer is located in the first layer, that is, the titanium oxynitride coating layer is first plated, and since the reflectance of the titanium oxynitride is relatively high, setting it on the first layer enables The entire film system is more colorful.
  • the total number of coating layers of the titanium oxynitride coating layer 2 and the silicon oxynitride coating layer 3 is 6 layers, and the total thickness of the plating layer can be controlled between 300 nm and 550 nm. Further, in the embodiment of the invention, the thickness of the glass substrate may be in the range of 170-180 um, preferably 175 um.
  • This embodiment provides a specific plating structure on the basis of the embodiment stone eleven: the total number of the coating layers is six, the total thickness of the coating layer of the titanium oxynitride and the silicon nitrogen The ratio of the total thickness of the oxide coating layer is between 0.4 and 0.5. This ratio is ensured to achieve a silver mirror effect with only 6 layers of plating, and the total thickness can be controlled below 550 nm. Small impact on capacitance detection.
  • each layer can be distributed as follows:
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 50 to 80 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 70 to 120 nm;
  • the third layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 20 to 40 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 60 to 105 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 30 to 45 nm;
  • the sixth layer coating layer is a silicon oxynitride coating layer having a thickness ranging from 85 to 145 nm;
  • the thickness of the sixth layer is greater than the thickness of any one of the first five layers.
  • Second Group The third group First layer (TIN x O y ) 59nm 77nm 50nm Second layer (SIN x O y ) 91nm 118nm 75nm Third layer (TIN x O y ) 29nm 38nm 25nm The fourth layer (SIN x O y ) 80nm 104nm 65nm Fifth layer (TIN x O y ) 34nm 44nm 37nm The sixth layer (SIN x O y ) 110nm 143nm 88nm Total thickness 403nm 524nm 340nm Thickness ratio of TIN x O y to SIN x O y 0.43 0.43 0.49
  • the reflectance curves of the three groups of film structures in the above table are shown in Figs. 16 to 18, in which the horizontal axis coordinate is the wavelength (nm) and the vertical axis is the refractive index (%), and the graphs of the following examples have the same horizontal and vertical coordinates. .
  • a black ink layer is disposed under the entire plating layer, and by providing the ink layer, the light shielding can be better. Prevent stray light interference.
  • the hollow pattern of the printed fingerprint pattern, the hollowed out portion and the non-hollowed portion have differences in light transmission and reflectivity, so that when viewed from the upper glass, a corresponding pattern will be presented on the mirror background, thereby enabling fingerprinting.
  • the area is marked or decorated.
  • a pigment different from black may be further disposed in the hollow pattern, and more preferably, a pigment that contrasts with gray is filled, for example, a white pigment is filled, thereby making the pattern more conspicuous.
  • This embodiment mainly describes the manufacturing method of the glass plating structure of the above eleventh embodiment.
  • the glass plating structure of the present embodiment can be realized by an NCVM (non-conductive vacuum plating) process.
  • a vacuum space as shown in FIG. 6 is disposed, and nitrogen and oxygen are introduced thereto in a ratio of 0.8:1 to 1:1, and then a titanium oxynitride coating layer forming process and a silicon oxynitride coating are alternately performed.
  • a titanium oxynitride coating layer forming process and a silicon oxynitride coating are alternately performed.
  • an alternately stacked silicon oxynitride plating layer and a titanium oxynitride plating layer are formed downward on the lower surface of the glass substrate.
  • the step of forming the titanium oxynitride coating layer is specifically: exciting the titanium raw material provided in the sealed space by an electron gun, evaporating the titanium raw material, reacting with nitrogen and oxygen in the sealed space, and then in the glass.
  • a titanium oxynitride coating layer is formed downward on the lower surface of the substrate.
  • the silicon oxynitride coating layer forming process includes: exciting a silicon raw material disposed in the sealed space by an electron gun, evaporating the silicon raw material, reacting with nitrogen and oxygen in the sealed space, and then under the glass substrate A silicon oxynitride coating layer is formed on the surface downward.
  • the number of times of alternately performing the titanium oxynitride coating layer formation step and the silicon oxynitride coating layer formation step depends on the number of layers to be finally obtained, and the thickness of each layer is controlled by controlling the titanium oxynitride coating layer formation process and silicon nitrogen each time.
  • the oxide plating layer formation step is realized.
  • the ratio of the nitrogen atom to the oxygen atom in the compound of the coating layer is controlled to achieve the reflectance of the titanium oxynitride and the silicon oxynitride. Adjustment, so that the refractive index of titanium oxynitride is controlled at about 1.92, and the refractive index of silicon oxynitride is controlled at about 1.35. At the same time, the combination of layer number and layer thickness is controlled, and the overall thickness is thin. A silvery mirror effect with a brighter effect.
  • This embodiment uses a process in which only two common metal and semiconductor materials are used. Therefore, the process is relatively simple to implement and is convenient for batch generation.
  • a titanium oxynitride plating layer forming step is performed so that the titanium oxynitride coating layer is located in the first layer, and since the reflectance of the titanium oxynitride is relatively high, In the first layer, the entire film system can be rendered more vivid colors.
  • the total number of coating layers can be controlled in 6 layers, and the total thickness of the plating layer can be controlled between 300 nm and 550 nm.
  • the thickness of the glass substrate can be in the range of 170-180 um. Preferably, it is 175 um.
  • the present embodiment relates to a method for manufacturing the plating structure of the above-described embodiment 12, comprising: alternately performing a titanium oxynitride coating layer forming step and a silicon oxynitride coating layer forming step (which can be performed six times alternately).
  • the total number of the plating layers is 6 layers, and the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 0.4 and 0.5.
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 50 to 80 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 70 to 120 nm;
  • the third layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 20 to 40 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 60 to 105 nm;
  • the fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 30 to 45 nm;
  • the sixth layer coating layer is a silicon oxynitride coating layer having a thickness ranging from 85 to 145 nm;
  • the thickness of the sixth layer is greater than the thickness of any one of the first five layers.
  • the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in Embodiment 12, and details are not described herein.
  • This embodiment mainly describes the structure of the above-described thirteenth embodiment.
  • a black ink layer is printed under the plating layer, thereby enabling Shade well to prevent stray light interference.
  • printing a layer of black ink under the plating layer may include: printing a black ink layer having a fingerprint pattern hollow pattern, filling a pigment different from gray in a portion having a hollow; or printing only a hollow pattern without filling the pigment.
  • the filling is preferably a pigment which contrasts with black, for example, a white pigment is filled, thereby making the pattern more conspicuous.
  • the embodiment relates to a glass plating structure, which is mainly used in a capacitive press type fingerprint detecting system, and functions as an isolation layer covering a capacitive fingerprint sensor.
  • the structure of the glass plating layer includes a glass basic 1 and The entire layer of the titanium oxide layer 2 and the silicon oxynitride layer 3, which are disposed alternately on the lower surface of the glass substrate, and the layer of the coating layer formed by the multilayer coating layer are also referred to as a film system.
  • a plating structure in which a titanium oxynitride plating layer and the silicon oxynitride coating layer are alternately laminated is used to realize a mirror effect of the glass substrate, and the thickness can be thinner as a whole while ensuring insulation.
  • the coating is used to achieve a brightly colored mirror effect.
  • the reflectance of titanium oxynitride and silicon oxynitride is adjusted by controlling the ratio of nitrogen atoms to oxygen atoms in titanium oxynitride and silicon oxynitride to be between 0.4:1 and 0.6:1.
  • the refractive index of titanium oxynitride is controlled to about 2.08, and the refractive index of silicon oxynitride is controlled to about 1.39.
  • the combination of layer number and layer thickness is controlled, and the effect is relatively thin when the overall thickness is thin. Bright, ochre mirror effect.
  • the color of L is 54
  • the value of A is -3.5 to 2.9
  • the value of B is -7.6 to 6.1.
  • the titanium oxynitride coating layer is located in the first layer, that is, the titanium oxynitride coating layer is first plated, and since the reflectance of the titanium oxynitride is relatively high, setting it on the first layer enables The entire film system is more colorful.
  • the total number of coating layers of the titanium oxynitride coating layer 2 and the silicon oxynitride coating layer 3 is 4, and the total thickness of the plating layer can be controlled between 100 nm and 150 nm. Further, in the embodiment of the invention, the thickness of the glass substrate may be in the range of 170-180 um, preferably 175 um.
  • This embodiment provides a specific plating structure on the basis of the seventeenth embodiment: the total number of the coating layers is four, the total thickness of the coating layer of the titanium oxynitride and the silicon oxynitride The ratio of the total thickness of the coating layer is between 0.4 and 0.5. This ratio is ensured to achieve a mirror effect of enamel in the case of plating only 4 layers, and the total thickness can be controlled below 150 nm, thereby reducing The effect on capacitance detection.
  • each layer can be distributed as follows:
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 5 to 10 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 50 to 85 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 25 to 40 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 15 to 25 nm.
  • Second Group The third group First layer (TIN x O y ) 6nm 9nm 7nm Second layer (SIN x O y ) 54nm 81nm 67nm Third layer (TIN x O y ) 25nm 37.5nm 30nm
  • the reflectance curves of the three groups of film structures in the above table are shown in Figs. 7 to 9, in which the horizontal axis coordinate is the wavelength (nm) and the vertical axis is the refractive index (%), and the graphs of the following examples have the same horizontal and vertical coordinates. .
  • a black ink layer is disposed under the entire plating layer, and by providing the ink layer, it is possible to better shading and prevent stray light. interference.
  • a certain hollow pattern when printing a black ink layer, for example, a hollow pattern of a printed fingerprint pattern, a hollow portion and a non-hollow portion, which differ in light transmittance and reflectivity, thereby The upper glass observation will present a corresponding pattern on the mirror background, so that the fingerprint area can be identified or decorated.
  • a pigment different from black may be further disposed in the hollow pattern, and more preferably, a pigment that contrasts with gray is filled, for example, a white pigment is filled, thereby making the pattern more conspicuous.
  • This embodiment mainly describes the manufacturing method of the glass plating layer structure of the above-mentioned seventeenth embodiment.
  • the glass plating layer structure of the present embodiment can be realized by an NCVM (non-conductive vacuum plating) process.
  • a vacuum space as shown in FIG. 6 is disposed, and nitrogen gas and oxygen gas (preferably, a ratio of nitrogen gas to oxygen gas of 0.5:1) are introduced thereto in a ratio of 0.4:1 to 0.6:1, and then alternated.
  • nitrogen gas and oxygen gas preferably, a ratio of nitrogen gas to oxygen gas of 0.5:1
  • the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step are performed to form an alternately stacked silicon oxynitride plating layer and a titanium oxynitride plating layer on the lower surface of the glass substrate.
  • the step of forming the titanium oxynitride coating layer is specifically: exciting the titanium raw material provided in the sealed space by an electron gun, evaporating the titanium raw material, reacting with nitrogen and oxygen in the sealed space, and then in the glass.
  • a titanium oxynitride coating layer is formed downward on the lower surface of the substrate.
  • the silicon oxynitride coating layer forming process includes: exciting a silicon raw material disposed in the sealed space by an electron gun, evaporating the silicon raw material, reacting with nitrogen and oxygen in the sealed space, and then under the glass substrate A silicon oxynitride coating layer is formed on the surface downward.
  • the number of times of alternately performing the titanium oxynitride coating layer formation step and the silicon oxynitride coating layer formation step depends on the number of layers to be finally obtained, and the thickness of each layer is controlled by controlling the titanium oxynitride coating layer formation process and silicon nitrogen each time.
  • the oxide plating layer formation step is realized.
  • the ratio of the nitrogen atom to the oxygen atom in the compound of the coating layer is controlled to achieve the reflectance of the titanium oxynitride and the silicon oxynitride. Adjustment, so that the refractive index of titanium oxynitride is controlled at about 2.08, the refractive index of silicon oxynitride is controlled at about 1.39, and the number of layers and layer thickness are combined.
  • the control in the case of a thin overall thickness, achieves a brighter chrome mirror effect.
  • This embodiment adopts a process. Since only two common metal and semiconductor materials are used, the process is simple to implement and convenient for batch generation.
  • a titanium oxynitride plating layer forming step is performed so that the titanium oxynitride coating layer is located in the first layer, and since the reflectance of the titanium oxynitride is relatively high, In the first layer, the entire film system can be rendered more vivid colors.
  • the total number of coating layers can be controlled in 4 layers, and the total thickness of the plating layer can be controlled between 100 nm and 150 nm.
  • the thickness of the glass substrate can be in the range of 170-180 um. Preferably, it is 175 um.
  • the embodiment relates to a method for manufacturing the plating structure of the second embodiment, comprising: alternately performing a titanium oxynitride coating layer forming step and a silicon oxynitride coating layer forming step (which can be performed four times alternately).
  • the total number of coating layers is 4 layers, and the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 0.4 and 0.5.
  • the first coating layer is a titanium oxynitride coating having a thickness ranging from 5 to 10 nm;
  • the second coating layer is a silicon oxynitride coating having a thickness ranging from 50 to 85 nm;
  • the third coating layer is a titanium oxynitride coating having a thickness ranging from 25 to 40 nm;
  • the fourth coating layer is a silicon oxynitride coating having a thickness ranging from 15 to 25 nm.
  • the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in the eighteenth embodiment, and details are not described herein.
  • This embodiment mainly describes the structure of the above-described nineteenth embodiment.
  • a black ink layer is printed under the plating layer, thereby enabling better shading. To prevent stray light interference.
  • printing a layer of black ink under the plating layer may include: printing a black ink layer having a fingerprint pattern hollow pattern, filling a pigment different from gray in a portion having a hollow; or printing only a hollow pattern without filling the pigment.
  • the filling is preferably a pigment which contrasts with black, for example, a white pigment is filled, thereby making the pattern more conspicuous.
  • the embodiment relates to a fingerprint detecting device, including: a capacitive fingerprint sensor, which can be any capacitive fingerprint sensor used in the prior art, and can be an active capacitive fingerprint sensor (for example, The fingerprint sensor produced by FPC can also be a passive capacitive fingerprint sensor.
  • the glass plating structure of each of the above embodiments is attached to the upper portion of the capacitive fingerprint sensor as an isolation layer or a protective layer. The coated side faces the capacitive plate array of the capacitive fingerprint sensor, and the upper surface of the glass is externally used for contact. Fingerprint skin.
  • the embodiment relates to a mobile terminal including the fingerprint detecting device of the eleventh embodiment, such as a mobile phone, a tablet computer, etc., and an opening for performing fingerprint detection is disposed on a back cover of the mobile terminal, and the fingerprint detecting device is located at the The upper portion of the opening is exposed from the opening of the glass plating structure of the fingerprint detecting device.
  • the area where the fingerprint is recognized is placed behind the mobile terminal, and the opening of the back cover is opened to expose the glass of the rose gold color having the mirror effect as the area for fingerprint recognition. Since the glass plating layer of the embodiment of the present invention can present a bright rose gold mirror effect, the fingerprint recognition area of the mobile terminal can be made abnormal and beautiful, and the overall aesthetic effect of the mobile terminal can be improved.

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Abstract

L'invention concerne une structure en couches de placage de verre, un appareil de détection d'empreintes digitales et un terminal mobile. La structure en couches de placage de verre comprend un substrat de verre ; une pellicule de placage d'oxynitrure de titane et une pellicule de placage d'oxynitrure de silicium disposées par alternance vers le bas, sur la surface inférieure du substrat de verre ; dans les formules moléculaires des pellicules de placage d'oxynitrure de titane et d'oxynitrure de silicium, le rapport azote sur oxygène est le même, à savoir compris entre 0,4:1 et 1,5:1. L'application d'une pellicule de placage d'oxynitrure de titane et d'une pellicule de placage d'oxynitrure de silicium sur la surface inférieure du substrat de verre, et le rapport azote sur oxygène identique dans les compositions des pellicules de placage, à savoir compris entre 0,4:1 et 1,5:1, et dans la mesure où l'isolation est assurée, on obtient une structure en couches de placage de verre ayant un effet brillant, et on réduit à un niveau très minime, l'incidence de l'épaisseur des couches de placage sur la détection des empreintes digitales.
PCT/CN2015/099676 2015-10-20 2015-12-30 Structure en couches de placage de verre, appareil de détection d'empreintes digitales et terminal mobile WO2017067078A1 (fr)

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