Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/842—Containers
  • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/46—Polymerisation initiated by wave energy or particle radiation
  • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
  • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/52—Encapsulations
  • H01L33/56—Materials, e.g. epoxy or silicone resin
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/02—Details
  • H05B33/04—Sealing arrangements, e.g. against humidity
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
  • H10K30/80—Constructional details
  • H10K30/88—Passivation; Containers; Encapsulations
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/549—Organic PV cells

Definitions

• the present invention relates to a sealant for electronic devices that can be easily applied by an ink jet method, has excellent adhesiveness, suppresses the generation of outgas, and can reduce residual stress. Moreover, this invention relates to the manufacturing method of an electronic device using this sealing agent for electronic devices.
• organic thin film elements such as organic electroluminescence (hereinafter also referred to as organic EL) display elements and organic thin film solar cell elements
• organic EL organic electroluminescence
• the organic thin film element can be easily produced by vacuum deposition, solution coating, or the like, and thus has excellent productivity.
• An organic EL display element has a laminated structure in which an organic light emitting material layer is sandwiched between a pair of electrodes facing each other, and electrons are injected from one electrode into the organic light emitting material layer and positive from the other electrode. When holes are injected, electrons and holes are combined in the organic light emitting material layer to emit light.
• the organic EL display element since the organic EL display element performs self-emission, it has better visibility than a liquid crystal display element that requires a backlight, can be reduced in thickness, and can be driven by a DC low voltage. Has the advantage.
• Non-Patent Document 1 discloses an organic solar cell element using a laminated film of phthalocyanine copper and a perylene dye.
• Patent Document 1 discloses a method of sealing an organic light emitting material layer and an electrode of an organic EL display element with a laminated film of a silicon nitride film and a resin film formed by a CVD method.
• the resin film has a role of preventing pressure on the organic layer and the electrode due to internal stress of the silicon nitride film.
• Patent Document 1 discloses a method of alternately depositing an inorganic material film and a resin film
• Patent Document 3 and Patent Document 4 disclose. A method of forming a resin film on an inorganic material film is disclosed.
• a method for forming the resin film there is a method in which a low-viscosity sealant is applied onto a substrate using an inkjet method, and then the sealant is cured. If such a coating method by the ink jet method is used, a resin film can be uniformly formed at high speed.
• the sealant is made to have a low viscosity in order to be suitable for application by the ink jet method, outgas is generated, the degree of crosslinking is too high, and the adhesiveness is reduced due to residual stress due to curing shrinkage. There were problems such as failure of electronic devices.
• An object of the present invention is to provide an electronic device sealant that can be easily applied by an ink jet method, has excellent adhesiveness, suppresses the generation of outgas, and can reduce residual stress. Moreover, this invention aims at providing the manufacturing method of an electronic device using this sealing agent for electronic devices.
• the present invention is a sealing agent for electronic devices used for coating by an inkjet method, which contains a polymerizable compound and a radical photopolymerization initiator, and the polymerizable compound contains two or more ( A polyfunctional (meth) acrylic compound having a (meth) acryloyloxy group and having a polyoxyalkylene skeleton in the main chain, one (meth) acryloyloxy group and one or more cationic polymerizable compounds in one molecule It is the sealing agent for electronic devices containing the monofunctional (meth) acrylic compound which has group.
• the present invention is described in detail below.
• the present inventors have a polyfunctional compound having two or more (meth) acryloyloxy groups in one molecule and a polyoxyalkylene skeleton in the main chain as a polymerizable compound used for an electronic device sealant.
• Sealing obtained by using a combination of a (meth) acrylic compound and a monofunctional (meth) acrylic compound having one (meth) acryloyloxy group and one or more cationically polymerizable groups in one molecule It has been found that the agent can be easily applied by an ink jet method, has excellent adhesiveness, can suppress the generation of outgas, and can reduce the residual stress, thereby completing the present invention.
• the encapsulant for electronic devices of the present invention contains a polymerizable compound.
• the polymerizable compound is a polyfunctional (meth) acrylic compound having two or more (meth) acryloyloxy groups in one molecule and a polyoxyalkylene skeleton in the main chain (hereinafter referred to as “the present invention”).
• a polyfunctional (meth) acrylic compound By containing the polyfunctional (meth) acrylic compound according to the present invention, the encapsulant for electronic devices of the present invention is excellent in coating properties and film forming properties by the ink jet method. Moreover, the polyfunctional (meth) acrylic compound concerning this invention also has the effect of improving the heat resistance of the sealing agent for electronic devices obtained.
• the “(meth) acryloyl” means acryloyl or methacryloyl
• the “(meth) acryl” means acryl or methacryl.
• the polyfunctional (meth) acrylic compound according to the present invention has a polyoxyalkylene skeleton in the main chain.
• the polyoxyalkylene skeleton possessed by the polyfunctional (meth) acrylic compound according to the present invention has a role of improving the applicability of the encapsulant for electronic devices of the present invention by the inkjet method.
• the polyoxyalkylene skeleton reduces damage to the device such as swelling of the adhesive and rubber material used in the head portion of the ink jet device, etc., wettability to the inorganic material film, after application and curing It also has an effect of improving the later flatness.
• the polyoxyalkylene skeleton possessed by the polyfunctional (meth) acrylic compound according to the present invention is excellent in the applicability by the ink jet method, the adhesiveness, and the flexibility of the cured product. It is preferable that
• Examples of the oxyalkylene units constituting the polyoxyalkylene skeleton of the polyfunctional (meth) acrylic compound according to the present invention include oxyethylene units and oxypropylene units.
• the polyfunctional (meth) acrylic compound according to the present invention has a structure with less carbon chain branching from the viewpoint that it is easy to make the obtained sealing agent for electronic devices into a viscosity suitable for the inkjet method. Is preferable, and it is more preferable that it is linear.
• polyfunctional (meth) acrylic compound according to the present invention examples include diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, dipropylene glycol di ( Examples include meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, and polytetramethylene glycol di (meth) acrylate.
• the “(meth) acrylate” means acrylate or methacrylate.
• the content of the polyfunctional (meth) acrylic compound according to the present invention is preferably 10 parts by weight with respect to 100 parts by weight of the entire polymerizable compound, and 90 parts by weight with respect to the preferable upper limit.
• the content of the polyfunctional (meth) acrylic compound according to the present invention is within this range, the obtained sealing agent for electronic devices has an effect of reducing the coating property by the ink jet method, damage to the ink jet apparatus, and inorganic. It is excellent in the effect of improving the wettability with respect to the material film and the flatness after coating and curing.
• the minimum with more preferable content of the polyfunctional (meth) acrylic compound concerning this invention is 40 weight part, and a more preferable upper limit is 70 weight part.
• the polymerizable compound is a monofunctional (meth) acrylic compound having one (meth) acryloyloxy group and one or more cationic polymerizable groups in one molecule (hereinafter, simply referred to as “monofunctional (meth) ) Acrylic compound ").
• the sealing agent for electronic devices of the present invention is excellent in adhesiveness due to improved flexibility and reduced residual stress.
• the monofunctional (meth) acrylic compound according to the present invention has a cationic polymerizable group in the molecule, an electronic device obtained by trapping an acid component contained in the raw material or an acid generated by the decomposition of the resin It also has the effect of reducing the outgassing of the sealing agent.
• a vinyl ether group As a cationically polymerizable group which the monofunctional (meth) acrylic compound concerning this invention has, a vinyl ether group, an epoxy group, an oxetanyl group, an allyl ether group, a vinyl group, a hydroxyl group etc. are mentioned, for example.
• the monofunctional (meth) acrylic compound according to the present invention include 3,4-epoxycyclohexylmethyl (meth) acrylate, glycidyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, ( 2- (2-vinyloxyethoxy) ethyl methacrylate), 3-ethyl-3- (meth) acryloxymethyloxetane, allyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate Ethoxydiethylene glycol (meth) acrylate, ethoxytriethylene glycol (meth) acrylate, 2- (2-vinyloxyethoxy) ethyl (meth) acrylate, and the like.
• the content of the monofunctional (meth) acrylic compound according to the present invention is preferably 10 parts by weight with a preferred lower limit and 90 parts by weight with respect to 100 parts by weight of the entire polymerizable compound.
• the content of the monofunctional (meth) acrylic compound according to the present invention is within this range, the obtained sealing agent for electronic devices is excellent in flexibility, adhesiveness, and low outgassing property.
• the minimum with more preferable content of the monofunctional (meth) acrylic compound concerning this invention is 20 weight part, and a more preferable upper limit is 50 weight part.
• the content ratio of the polyfunctional (meth) acrylic compound according to the present invention and the monofunctional (meth) acrylic compound according to the present invention is within this range, the obtained sealing agent for electronic devices can be coated by the inkjet method. Further, the film formability, heat resistance, adhesiveness, and flexibility can be further improved.
• the polymerizable compound is used for other polymerizations for the purpose of adjusting viscosity and improving adhesiveness. May contain an ionic compound.
• an ionic compound As said other polymeric compound, other (meth) acrylic compounds other than the polyfunctional (meth) acrylic compound concerning this invention and the monofunctional (meth) acrylic compound concerning this invention, an epoxy compound, an oxetane compound, And other cationic polymerizable compounds such as vinyl ether compounds, etc., but from the viewpoint of low outgassing properties, it is preferable not to contain the other cationic polymerizable compounds.
• the upper limit of the content of the other cationic polymerizable compound is preferably 1 part by weight with respect to 100 parts by weight of the whole polymerizable compound.
• Examples of the other (meth) acrylic compounds include dicyclopentenyl (meth) acrylate, dicyclopentanyl (meth) acrylate, benzyl (meth) acrylate, lauryl (meth) acrylate, 1,6-hexanediol di ( And (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, trimethylolpropane tri (meth) arylate, and the like. These other (meth) acrylic compounds may be used alone or in combination of two or more.
• the epoxy compound examples include bisphenol A type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol O type epoxy resin, 2,2′-diallyl bisphenol A type epoxy resin, Alicyclic epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene Epoxy resin, phenol novolac epoxy resin, orthocresol novolac epoxy resin, dicyclopentadiene novolac epoxy resin, biphenyl Examples thereof include a volac type epoxy resin, a naphthalene phenol novolac type epoxy resin, a glycidyl amine type epoxy resin, an alkyl polyol type epoxy resin, a rubber-modified epoxy resin, and a glycidyl ester compound.
• alicyclic epoxy resins are preferred.
• examples of commercially available alicyclic epoxy resins include Celoxide 2000, Celoxide 2021P, Celoxide 2081, Celoxide 3000, Celoxide 8000, Cyclomer M100 (all manufactured by Daicel Corporation), and SUNSOSIZER EPS (New Nippon Rika Kogyo Co., Ltd.). These epoxy compounds may be used independently and 2 or more types may be used in combination.
• oxetane compound examples include phenoxymethyl oxetane, 3-ethyl-3-hydroxymethyl oxetane, 3-ethyl-3- (phenoxymethyl) oxetane, 3-ethyl-3-((2-ethylhexyloxy) methyl) oxetane.
• vinyl ether compound examples include benzyl vinyl ether, cyclohexane dimethanol monovinyl ether, dicyclopentadiene vinyl ether, 1,4-butanediol divinyl ether, cyclohexane dimethanol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, dipropylene glycol. Examples thereof include divinyl ether and tripropylene glycol divinyl ether. These vinyl ether compounds may be used alone or in combination of two or more.
• the content of the other polymerizable compound is preferably 1 part by weight with respect to 100 parts by weight of the entire polymerizable compound, and 20 parts by weight with a preferable upper limit.
• the minimum with more preferable content of the said other polymeric compound is 3 weight part, and a more preferable upper limit is 10 weight part.
• a preferable upper limit is 1 weight part with respect to 100 weight part of whole polymeric compounds. .
• the sealing agent for electronic devices of this invention contains radical photopolymerization initiator.
• the photo radical polymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, benzyl, thioxanthone compounds, and the like.
• photo radical polymerization initiators examples include IRGACURE 184, IRGACURE 369, IRGACURE 379, IRGACURE 651, IRGACURE 819, IRGACURE 907, IRGACURE 2959, IRGACURE OXE01, all manufactured by Rusilin TPO ), Benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether (all manufactured by Tokyo Chemical Industry Co., Ltd.) and the like.
• the content of the photo radical polymerization initiator is preferably 0.5 parts by weight and preferably 20 parts by weight with respect to 100 parts by weight of the polymerizable compound.
• the sealing agent for electronic devices of the present invention having a low viscosity wets and spreads after application by the ink jet method and comes into contact with oxygen causing inhibition of curing. Even if it becomes large, it can be made to harden enough and a uniform hardened
• the minimum with more preferable content of the said radical photopolymerization initiator is 10 weight part, and a more preferable upper limit is 15 weight part.
• the encapsulant for electronic devices of the present invention may contain a silane coupling agent.
• the said silane coupling agent has a role which improves the adhesiveness of the sealing agent for electronic devices of this invention, a board
• silane coupling agent examples include 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane, and the like. These silane compounds may be used independently and 2 or more types may be used together.
• the content of the silane coupling agent is preferably 0.1 parts by weight and preferably 10 parts by weight with respect to 100 parts by weight of the polymerizable compound. When the content of the silane coupling agent is within this range, it is possible to exert the effect of improving the adhesiveness while suppressing the excess silane coupling agent from bleeding out.
• the minimum with more preferable content of the said silane coupling agent is 0.5 weight part, and a more preferable upper limit is 5 weight part.
• the encapsulant for electronic devices of the present invention may further contain a surface modifier as long as the object of the present invention is not impaired.
• a surface modifier By containing the surface modifier, the flatness of the coating film can be imparted to the electronic device sealant of the present invention.
• the surface modifier include surfactants and leveling agents.
• Examples of the surface modifier include silicone-based and fluorine-based ones.
• Examples of commercially available surface modifiers include BYK-340, BYK-345 (both manufactured by Big Chemie Japan) and Surflon S-611 (manufactured by AGC Seimi Chemical).
• the sealant for electronic devices of the present invention may contain an organic solvent for the purpose of adjusting the viscosity, etc., but the organic light emitting material layer is deteriorated by the remaining organic solvent when used in an organic EL display element, It is preferable not to contain an organic solvent because of problems such as generation of outgas.
• the sealing agent for electronic devices of this invention may contain well-known various additives, such as a reinforcing agent, a softening agent, a plasticizer, a viscosity modifier, a ultraviolet absorber, antioxidant, as needed. Good.
• a method for producing the sealing agent for electronic devices of the present invention for example, using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, three rolls, Examples thereof include a method of mixing a radical polymerization initiator and an additive such as a silane coupling agent added as necessary.
• the electronic device sealant of the present invention has a preferred lower limit of 5 mPa ⁇ s and a preferred upper limit of 200 mPa ⁇ s, measured using an E-type viscometer at 25 ° C. and 100 rpm.
• the more preferable lower limit of the viscosity of the electronic device sealant is 10 mPa ⁇ s
• the more preferable upper limit is 80 mPa ⁇ s
• the still more preferable upper limit is 30 mPa ⁇ s.
• the preferable lower limit of the total light transmittance of light at a wavelength of 380 to 800 nm of the cured product of the encapsulant for electronic devices of the present invention is 80%.
• the total light transmittance is 80% or more, the obtained electronic device such as an organic EL display element is excellent in optical characteristics.
• a more preferable lower limit of the total light transmittance is 85%.
• the encapsulant for electronic devices of the present invention preferably has a transmittance at 400 nm of 85% or more at an optical path length of 20 ⁇ m after the cured product is irradiated with ultraviolet rays for 100 hours.
• the transmittance after irradiating the ultraviolet rays for 100 hours is 85% or more, the transparency is high, the loss of light emission is small, and the color reproducibility is excellent.
• a more preferable lower limit of the transmittance after irradiation with the ultraviolet rays for 100 hours is 90%, and a more preferable lower limit is 95%.
• the light source for irradiating the ultraviolet rays a conventionally known light source such as a xenon lamp or a carbon arc lamp can be used.
• the electronic device sealant of the present invention has a moisture permeability of 100 g / m 2 at a thickness of 100 ⁇ m as measured by exposing a cured product to an environment of 85 ° C. and 85% RH for 24 hours in accordance with JIS Z 0208.
• the following is preferable.
• the moisture permeability is 100 g / m 2 or less, for example, when used in the manufacture of an organic EL display element as an electronic device, the effect of preventing moisture from reaching the organic light emitting material layer and generating dark spots. It will be better.
• the sealing agent for electronic devices of the present invention preferably has a moisture content of less than 0.5% when the cured product is exposed to an environment of 85 ° C. and 85% RH for 24 hours.
• the moisture content of the cured product is less than 0.5%, for example, when used in the manufacture of an organic EL display element as an electronic device, the effect of preventing deterioration of the organic light emitting material layer due to moisture in the cured product It will be excellent.
• a more preferable upper limit of the moisture content of the cured product is 0.3%.
• the method for measuring the moisture content include a method of obtaining by a Karl Fischer method in accordance with JIS K 7251, and a method of obtaining a weight increment after water absorption in accordance with JIS K 7209-2.
• the sealing agent for electronic devices of this invention is used for application
• An electronic device manufacturing method comprising a step of applying the electronic device sealant of the present invention to a substrate by an inkjet method and a step of curing the applied electronic device sealant by light irradiation is also provided by the present invention. It is one of.
• when hardening the sealing agent for electronic devices of this invention you may harden by heating in addition to light irradiation.
• the electronic device sealant of the present invention may be applied to the entire surface of the base material, or may be applied to a part of the base material.
• the shape of the sealing part of the sealing agent for electronic devices of the present invention formed by coating is to protect the laminate having an organic light emitting material layer from the outside air.
• the shape is not particularly limited as long as it can be formed, and may be a shape that completely covers the laminate, or may form a closed pattern on the periphery of the laminate, or the periphery of the laminate A pattern having a shape in which a part of the openings is provided may be formed.
• the electronic device sealant of the present invention is preferably applied by irradiating light with a wavelength of 300 nm to 400 nm and an integrated light amount of 300 to 3000 mJ / cm 2. It can be cured.
• Examples of the light source for irradiating the electronic device sealant of the present invention with light include a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, an excimer laser, a chemical lamp, a black light lamp, and a microwave excitation mercury lamp. , Metal halide lamps, sodium lamps, halogen lamps, xenon lamps, LED lamps, fluorescent lamps, sunlight, electron beam irradiation devices, and the like. These light sources may be used independently and 2 or more types may be used together. These light sources are appropriately selected according to the absorption wavelength of the photo radical polymerization initiator.
• Examples of the light irradiation means for the electronic device sealant of the present invention include simultaneous irradiation of various light sources, sequential irradiation with a time difference, combined irradiation of simultaneous irradiation and sequential irradiation, etc. Irradiation means may be used.
• the cured product obtained by the step of curing the encapsulant for electronic devices by light irradiation may be further coated with an inorganic material film.
• the inorganic material forming the inorganic material layer can be a conventionally known, for example, silicon nitride (SiN x), silicon oxide (SiO x), and the like.
• the inorganic material film may be a single layer or may be a laminate of a plurality of types of layers. Moreover, you may coat
• the method for producing an electronic device of the present invention includes a step of bonding a substrate (hereinafter also referred to as “one substrate”) coated with the electronic device sealing agent of the present invention and the other substrate. May be.
• the one substrate may be a substrate on which a laminate having an organic light emitting material layer is formed, or a substrate on which the laminate is not formed. It may be a material.
• said one base material is a base material in which the said laminated body is not formed, when the said other base material is bonded together, it can seal the said laminated body from external air of this invention sealing for electronic devices What is necessary is just to apply
• the sealant portion having a closed pattern may be formed in a shape that completely fits.
• the step of curing the electronic device sealant by light irradiation may be performed before the step of bonding the one base material and the other base material, or the one base material and the other base material. You may carry out after the process of bonding a base material.
• the step of curing the electronic device sealant by light irradiation is performed before the step of laminating the one base material and the other base material, the electronic device sealant of the present invention is light It is preferable that the pot life is 1 minute or longer from the irradiation until the curing reaction proceeds and adhesion cannot be performed. When the pot life is 1 minute or longer, higher adhesion strength can be obtained without excessive curing before the one base material and the other base material are bonded together.
• a method of bonding the one base material and the other base material is not particularly limited, but it is preferable to bond them in a reduced-pressure atmosphere.
• the preferable lower limit of the degree of vacuum in the reduced-pressure atmosphere is 0.01 kPa, and the preferable upper limit is 10 kPa.
• the degree of vacuum in the reduced-pressure atmosphere is within this range, the one base material and the other base material are not spent for a long time to achieve a vacuum state due to the airtightness of the vacuum device and the ability of the vacuum pump. Bubbles in the electronic device sealant of the present invention at the time of bonding to the material can be more efficiently removed.
• sealing agent for electronic devices of this invention can be used suitably as sealing agent for organic EL display elements.
• the sealing agent for electronic devices which can be apply
• the manufacturing method of an electronic device using this sealing agent for electronic devices can be provided.
• Examples 1 to 13, Comparative Examples 1 to 4 According to the blending ratios described in Tables 1 and 2, each material was stirred and mixed uniformly at a stirring speed of 3000 rpm using a homodisper type stirring mixer (Primix Co., Ltd., “Homodisper L type”). Sealants for electronic devices of Examples 1 to 13 and Comparative Examples 1 to 4 were prepared.
• a glass substrate (length 25 mm, width 25 mm, thickness 0.7 mm) on which an ITO electrode was formed to a thickness of 1000 mm was used as the substrate.
• the substrate was ultrasonically washed with acetone, an aqueous alkali solution, ion-exchanged water, and isopropyl alcohol for 15 minutes, respectively, then washed with boiled isopropyl alcohol for 10 minutes, and a UV-ozone cleaner (manufactured by Nippon Laser Electronics Co., Ltd.). The last treatment was performed with “NL-UV253”).
• this substrate is fixed to the substrate folder of the vacuum deposition apparatus, and 200 mg of N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine ( ⁇ -NPD) is put into an unglazed crucible and other different types.
• 200 mg of tris (8-quinolinolato) aluminum (Alq 3 ) was put in an unglazed crucible, and the inside of the vacuum chamber was depressurized to 1 ⁇ 10 ⁇ 4 Pa. Thereafter, the crucible containing ⁇ -NPD was heated, and ⁇ -NPD was deposited on the substrate at a deposition rate of 15 s / s to form a 600 ⁇ ⁇ hole transport layer.
• the crucible containing Alq 3 was heated to form an organic light emitting material layer having a thickness of 600 ⁇ at a deposition rate of 15 ⁇ / s. Thereafter, the substrate on which the hole transport layer and the organic light emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is added to a tungsten resistance heating boat in the vacuum vapor deposition apparatus, and aluminum is added to another tungsten boat. 1.0 g of wire was added.
• the inside of the vapor deposition unit of the vacuum vapor deposition apparatus is depressurized to 2 ⁇ 10 ⁇ 4 Pa to form a lithium fluoride film with a thickness of 5 mm at a deposition rate of 0.2 kg / s, and then aluminum with a film thickness of 1000 mm at a rate of 20 kg / s. did.
• the inside of the vapor deposition unit was returned to normal pressure with nitrogen, and the substrate on which the laminate having the organic light emitting material layer of 10 mm ⁇ 10 mm was arranged was taken out.
• a mask having an opening of 13 mm ⁇ 13 mm was placed so as to cover the entire laminated body of the substrate on which the obtained laminated body was arranged, and an inorganic material film A was formed by a plasma CVD method.
• SiH 4 gas and nitrogen gas are used as source gases, the flow rates of each are SiH 4 gas 10 sccm, nitrogen gas 200 sccm, RF power 10 W (frequency 2.45 GHz), chamber temperature 100 ° C., chamber The test was performed under the condition that the internal pressure was 0.9 Torr.
• the formed inorganic material film A had a thickness of about 1 ⁇ m.
• the sealing agent for electronic devices obtained by the Example and the comparative example was pattern-coated on the board
• the obtained organic EL display element is exposed for 100 hours in an environment of a temperature of 85 ° C. and a humidity of 85%, and then a voltage of 3 V is applied, and the light emission state of the organic EL display element (whether dark spots and pixel periphery quenching) Was visually observed.
• the organic EL display element is indicated as “ ⁇ ” when there is no dark spot or peripheral extinction, “ ⁇ ” when the dark spot or peripheral extinction is recognized, and “ ⁇ ” when the non-light emitting part is significantly enlarged. Display performance was evaluated.
• the sealing agent for electronic devices which can be apply
• the manufacturing method of an electronic device using this sealing agent for electronic devices can be provided.

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• Chemical & Material Sciences (AREA)
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• Organic Chemistry (AREA)
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• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
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• Optics & Photonics (AREA)
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• Computer Hardware Design (AREA)
• Electromagnetism (AREA)
• Electroluminescent Light Sources (AREA)
• Sealing Material Composition (AREA)
• Photovoltaic Devices (AREA)

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• 2016
  • 2016-09-20 CN CN201680010832.9A patent/CN107251650B/zh active Active
  • 2016-09-20 WO PCT/JP2016/077659 patent/WO2017051795A1/ja active Application Filing
  • 2016-09-20 JP JP2016560846A patent/JP6804980B2/ja active Active
  • 2016-09-20 KR KR1020177021823A patent/KR20180059391A/ko not_active Application Discontinuation
  • 2016-09-22 TW TW105130532A patent/TW201725218A/zh unknown

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