WO2016208192A1 - 熱伝導シートおよびこれを用いた電子機器 - Google Patents
熱伝導シートおよびこれを用いた電子機器 Download PDFInfo
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- WO2016208192A1 WO2016208192A1 PCT/JP2016/003025 JP2016003025W WO2016208192A1 WO 2016208192 A1 WO2016208192 A1 WO 2016208192A1 JP 2016003025 W JP2016003025 W JP 2016003025W WO 2016208192 A1 WO2016208192 A1 WO 2016208192A1
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- WIPO (PCT)
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- sheet
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- top view
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- conductive sheet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
Definitions
- the present disclosure relates to a heat conductive sheet that dissipates heat generated from a heat-generating component and an electronic device using the same.
- the amount of heat generated by heat-generating components is on the rise as various electronic devices become more sophisticated and functional.
- the heat generated from the heat generating component has various effects on the heat generating component itself or other electronic components of the heat generating component, and as a result, the operation of the electronic device may be hindered.
- a heat conductive sheet for transferring heat generated from a heat-generating component is disclosed in, for example, Patent Document 1 and Patent Document 2.
- Patent Document 1 discloses a heat radiating sheet having graphite, a protective layer, and a release sheet, each of the protective layer and the release sheet having protrusions in the surface direction of the graphite, and these protrusions are joined to each other. Has been.
- Patent Document 2 discloses a heat dissipating sheet in which both main surfaces and end surfaces of graphite are covered with a heat conductive adhesive.
- the heat conductive sheet includes a heat dissipating sheet, a heat insulating layer provided above the heat dissipating sheet, a first sheet provided above the heat insulating layer, and a second provided below the heat dissipating sheet.
- the first sheet has a first protrusion that protrudes from the heat dissipation sheet in a top view.
- seat has the 2nd protrusion part which has protruded from the heat radiating sheet by the top view.
- the thermal conductivity of the first heat insulation layer is lower than any of the thermal conductivity of the first sheet, the second sheet, and the heat dissipation sheet.
- This heat conduction sheet can dissipate heat efficiently.
- FIG. 1A is a top view of an electronic device including a heat conductive sheet in the embodiment.
- FIG. 1B is a cross-sectional view taken along line 1B-1B of the electronic device shown in FIG. 1A.
- FIG. 2 is an enlarged cross-sectional view of the heat transfer sheet shown in FIG. 1B.
- FIG. 3A is a cross-sectional view illustrating the method for manufacturing the heat conductive sheet in the embodiment.
- FIG. 3B is a cross-sectional view illustrating the method for manufacturing the heat conductive sheet in the embodiment.
- FIG. 3C is a cross-sectional view illustrating the method for manufacturing the electronic device using the heat conductive sheet in the embodiment.
- FIG. 1A is a top view of an electronic device 81 provided with a heat conductive sheet 51 in the embodiment.
- 1B is a cross-sectional view taken along line 1B-1B of electronic device 81 shown in FIG. 1A.
- the heat conductive sheet 51 is provided on the heat dissipating sheet 31, the heat insulating layer 41 provided on the upper surface of the heat dissipating sheet 31, the sheet 21 provided on the upper surface of the heat insulating layer 41, and the lower surface of the heat dissipating sheet 31.
- the seat 11 is provided. That is, the heat insulating layer 41 is provided above the heat radiating sheet 31, the sheet 21 is provided above the heat insulating layer 41, and the sheet 11 is provided below the heat radiating sheet 31.
- the sheet 11 has a protruding portion 12 that protrudes in a surface direction D31 parallel to the upper surface and the lower surface of the heat dissipating sheet 31 when viewed from above.
- the protruding portion 12 surrounds the heat radiating sheet 31 along the outer periphery 31C of the heat radiating sheet 31 in a top view.
- the sheet 21 has a protruding portion 22 that protrudes in the surface direction D31 of the heat dissipation sheet 31 in a top view.
- the protruding portion 22 surrounds the heat radiating sheet 31 along the outer periphery 31 ⁇ / b> C of the heat radiating sheet 31 in a top view.
- the protruding portions 12 and 22 may completely surround the heat radiating sheet 31 in a top view.
- the thermal conductivity of the heat insulating layer 41 is lower than any of the thermal conductivity of the sheets 11 and 21 and the heat radiating sheet 31.
- the protruding portion 12 and the protruding portion 22 overlap each
- the heat conductive sheet 51 further includes a heat insulating layer 42 in contact with the end surface 32 connected to the upper surface and the lower surface of the heat radiating sheet 31.
- the heat insulating layer 42 is surrounded by the end surface 32 of the heat radiating sheet 31, the lower surface of the sheet 11, and the upper surface of the sheet 21.
- the heat conductivity of the heat insulating layer 42 is lower than any of the heat conductivity of the heat radiating sheet 31 and the sheets 11 and 21.
- a mounting substrate 61 on which the heat generating component 62, the electronic component 63, and the temperature dependent component 64 are mounted is provided below the sheet 11.
- the heat generating component 62 is bonded to the lower surface of the sheet 11 and overlaps the heat radiating sheet 31 in a top view.
- the electronic component 63 is not joined to the lower surface of the sheet 11.
- the temperature dependent component 64 is joined to the lower surface of the sheet 11 and does not overlap the heat radiating sheet 31 in a top view.
- a liquid crystal panel 71 is provided on the upper surface of the sheet 21.
- the heat dissipating sheet 31 is a graphite sheet generated by thermally decomposing a polyimide resin.
- the thickness of the heat radiating sheet 31 is 0.05 mm, and the thermal conductivity in the surface direction D31 of the heat radiating sheet 31 is about 1300 W / m ⁇ K.
- the heat conductivity in the direction perpendicular to the surface direction D31 of the heat dissipation sheet 31 is about 1/100 of the heat conductivity in the surface direction D31 and is about 13 W / m ⁇ K.
- the heat dissipating sheet 31 may be a natural graphite sheet formed by pressurizing graphite powder.
- the sheet 11 is a double-sided tape using an acrylic adhesive and has a thickness of 0.01 mm.
- the sheet 11 may be a double-sided tape using a silicon adhesive.
- the sheet 21 is PET (polyethylene terephthalate) and has a thickness of 0.01 mm. Note that polyimide may be used for the sheet 21.
- the heat insulation layer 41 and the heat insulation layer 42 are both voids and are filled with air. That is, the lower surface of the sheet 21 is disposed with a gap from the upper surface of the heat radiating sheet 31, and the lower surface of the sheet 21 is disposed with a gap (heat insulating layer 42) from the upper surface of the sheet 11 outside the heat radiating sheet 31.
- the thermal conductivity of air is lower than that of graphite sheet and PET, and the heat insulating layer 41 and the heat insulating layer 42 which are air have a high heat insulating effect.
- the heat insulating layer 41 and the heat insulating layer 42 only have to be lower than the thermal conductivity of each of the sheet 11, the sheet 21, and the heat radiating sheet 31, and the configuration of the sheet 11, the sheet 21, and the heat radiating sheet 31 described above.
- the material may be formed of a urethane material other than air.
- the heat insulating layer 41 and the heat insulating layer 42 filled with air may be communicated with each other at a part thereof.
- FIG. 2 is an enlarged cross-sectional view showing the vicinity of the heat insulating layer 41 in the heat conductive sheet 51 shown in FIG. 1B.
- the heat insulation layer 41 is a space formed between the unevenness 33 of the heat dissipation sheet 31 and the sheet 21 and filled with air.
- the heat insulating layer 41 is formed in a layered manner in continuity with the surface direction D31 of the heat radiating sheet 31.
- the heat insulating layer 41 is formed by disposing the sheet 21 on the upper surface of the heat radiating sheet 31 having the unevenness 33.
- the heat generating component 62 is a CPU (Central Processing Unit) that generates a large amount of heat during operation, for example.
- the heat generating component 62 is provided at a position overlapping the heat dissipating sheet 31 through the sheet 11 in a top view.
- the liquid crystal panel 71 generally has low heat resistance, and there is a possibility that the color of the image is partially uneven due to the influence of heat.
- the temperature-dependent component 64 is a component whose characteristics are likely to change due to temperature changes. Examples of the temperature dependent component 64 include TCXO (Temperature Compensated Crystal Oscillator). The temperature dependent component 64 is preferably disposed at a position away from the heat generating component 62 in consideration of the influence of heat, but may be affected by the heat transmitted from the heat radiating sheet 31.
- TCXO Temporal Compensated Crystal Oscillator
- the heat conductive sheet 51 will be described in detail below.
- the protective layer and the adhesive layer are in contact with the end face of the heat-dissipating graphite sheet.
- the heat insulating layer 42 abuts on the end surface 32 of the heat radiating sheet 31 and surrounds the heat radiating sheet 31 along the outer periphery of the heat radiating sheet 31 in a top view. The heat transmitted through the heat dissipation sheet 31 in the surface direction D31 of the heat dissipation sheet 31 can be blocked.
- the temperature-dependent component 64 provided at a position that does not overlap the heat radiating sheet 31 in a top view is less susceptible to the heat transmitted from the heat radiating sheet 31.
- the heat conductive sheet disclosed in Patent Document 2 has a heat-dissipating graphite sheet and a protective sheet joined together with an adhesive.
- the heat conductive sheet 51 in the embodiment since the heat insulating layer 41 is provided between the heat radiating sheet 31 and the sheet 11, the liquid crystal panel 71 is not easily affected by heat.
- the graphite sheet used for the heat-dissipating sheet 31 has conductivity, if a part of it is detached and falls, there is a possibility of causing a short circuit in the electronic device.
- the heat dissipating sheet 31 is hermetically sealed by bonding the protruding portion 12 and the protruding portion 22 made of double-sided tape, so that the heat dissipating sheet 31 does not fall on the electronic device 81.
- the heat radiating sheet 31 may be sealed by heating and melting the protruding portion 12 and the protruding portion 22 and fusing them together.
- FIG. 3A and FIG. 3B are flowcharts showing a manufacturing method in the heat conductive sheet 51.
- a release sheet 91 made of PET is prepared, and a sheet 11 made of double-sided tape is provided on the upper surface of the release sheet 91.
- a heat radiating sheet 31 made of a graphite sheet is provided on the upper surface of the sheet 11. The heat radiating sheet 31 is provided so that the sheet 11 has the protruding portion 12 in the surface direction D31 of the heat radiating sheet 31.
- release sheet 91 is provided to improve handling at the time of manufacture.
- the sheet 21 is provided so as to cover the upper side of the heat radiating sheet 31 and to have the protruding portion 22 in the surface direction of the heat radiating sheet 31.
- the heat dissipation sheet 31 is sealed by adhering the protruding portion 22 to the upper surface of the protruding portion 12 made of double-sided tape.
- the thickness of the heat insulating layer 41 made of a gap and the width of the heat insulating layer 42 in the surface direction D31 of the heat radiation sheet 31 are adjusted by adjusting the position where the protruding portion 12 and the protruding portion 22 made of double-sided tape are bonded. can do.
- the heat conductive sheet 51 is manufactured through the above steps.
- FIG. 3C is a cross-sectional view of an electronic device 81 using the heat conductive sheet 51.
- a heat generating component 62 is provided on the lower surface of the sheet 11 which is a double-sided tape exposed by peeling off the release sheet 91 so as to overlap the heat radiating sheet in a top view. Further, a temperature-dependent component 64 is provided on the lower surface of the sheet 11 so as not to overlap the heat radiating sheet in a top view. A liquid crystal panel 71 is provided on the upper surface of the sheet 21. The electronic device 81 using the heat conductive sheet 51 is manufactured by the above method.
- terms indicating directions such as “upper surface”, “lower surface”, “upper”, “lower”, and “top view” indicate relative directions determined only by the relative positional relationship of the constituent members of the heat transfer sheet, It does not indicate an absolute direction such as a vertical direction.
- the heat conductive sheet according to the present disclosure can efficiently dissipate heat generated by the heat-generating component, and is industrially useful.
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Abstract
Description
12 はみ出し部
21 シート(第2シート)
22 はみ出し部
31 放熱性シート
32 端面
33 凹凸
41 断熱層(第1断熱層)
42 断熱層(第2断熱層)
51 熱伝導シート
61 実装基板
62 発熱部品
63 電子部品
64 温度依存性部品
71 液晶パネル
81 電子機器
91 剥離シート
Claims (10)
- 放熱性シートと、
前記放熱性シートの上方に設けられている第1断熱層と、
前記第1断熱層の上方に設けられている第1シートと、
前記放熱性シートの下方に設けられている第2シートと、
を備え、
前記第1シートは、上面視で前記放熱性シートからはみ出している第1はみ出し部を有し、
前記第2シートは、上面視で前記放熱性シートからはみ出している第2はみ出し部を有し、
前記第1断熱層の熱伝導率は、前記第1シート、前記第2シートおよび前記放熱性シートのいずれの熱伝導率よりも低く、
前記第1はみ出し部と前記第2はみ出し部は上面視で互いに重なっている、熱伝導シート。 - 前記第1シートと前記第2シートとを接着する接着層をさらに備えた、請求項1に記載の熱伝導シート。
- 前記第1シートと前記第2シートは互いに融着して接合されている、請求項1に記載の熱伝導シート。
- 前記第1はみ出し部は、上面視で前記放熱性シートの外周に沿って前記放熱性シートを囲い、
前記第2はみ出し部は、上面視で前記放熱性シートの前記外周に沿って前記放熱性シートを囲っている、請求項1に記載の熱伝導シート。 - 前記放熱性シートの上面と下面とに繋がる端面に当接している第2断熱層をさらに備え、
前記第2断熱層の熱伝導率は、前記放熱性シートの熱伝導率よりも低い、請求項1に記載の熱伝導シート。 - 前記第2断熱層は、前記放熱性シートの前記端面と前記第1シートと前記第2シートとに囲まれており、
前記第2断熱層の熱伝導率は、前記第1シートと前記第2シートのそれぞれの熱伝導率よりも低い、請求項5に記載の熱伝導シート。 - 前記第2断熱層は、上面視で記放熱性シートの前記外周に沿って前記放熱性シートを囲っている、請求項6に記載の熱伝導シート。
- 前記第1断熱層および前記第2断熱層は空隙である、請求項7に記載の熱伝導シート。
- 請求項1に記載の熱伝導シートと、
前記熱伝導シートの前記第1シートの上方に設けられている液晶パネルと、
前記熱伝導シートの前記第2シートの下方に設けられている発熱部品と、
を備え、
前記液晶パネルと前記発熱部品は、いずれも上面視で前記熱伝導シートの前記放熱性シートと重なっている、電子機器。 - 請求項5に記載の熱伝導シートと、
前記熱伝導シートの前記第2シートの下方に設けられている発熱部品と、
前記熱伝導シートの前記第2シートの下方に設けられている温度依存性部品と、
を備え、
前記発熱部品は、上面視で前記熱伝導シートの前記放熱性シートと重なり、
前記温度依存性部品は、上面視で前記放熱性シートとは重ならない、電子機器。
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US15/563,649 US10244658B2 (en) | 2015-06-26 | 2016-06-23 | Heat conductive sheet and electronic apparatus using same |
CN201680025559.7A CN107535076B (zh) | 2015-06-26 | 2016-06-23 | 导热片以及使用其的电子设备 |
JP2017524640A JP6634610B2 (ja) | 2015-06-26 | 2016-06-23 | 熱伝導シートおよびこれを用いた電子機器 |
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JP2015128250 | 2015-06-26 | ||
JP2015-128250 | 2015-06-26 |
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JP (1) | JP6634610B2 (ja) |
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US20220059431A1 (en) * | 2019-02-08 | 2022-02-24 | Panasonic Intellectual Property Management Co., Ltd. | Heat conducting sheet and electronic device using same |
US11315852B2 (en) * | 2019-10-11 | 2022-04-26 | Aptiv Technologies Limited | Thermal interface layer for electronic device |
EP3944010B1 (en) * | 2020-07-23 | 2023-02-15 | Ficosa Adas, S.L.U. | Display assembly for an imaging device |
CN112165840B (zh) * | 2020-10-26 | 2021-11-30 | 华为技术有限公司 | 包边式散热片及电子设备 |
AU2022204614A1 (en) * | 2021-08-27 | 2023-03-16 | Ametek, Inc. | Temperature dependent electronic component heating system |
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JP2009094196A (ja) * | 2007-10-05 | 2009-04-30 | Nec Corp | 携帯通信機の放熱構造 |
JP2010251386A (ja) * | 2009-04-10 | 2010-11-04 | Nec Corp | 熱拡散部材を備える電子機器、熱拡散部材を備える電子機器の製法及び熱拡散部材 |
JP2011105531A (ja) * | 2009-11-13 | 2011-06-02 | Kaneka Corp | グラファイトフィルムおよびグラファイト複合フィルム |
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