WO2016194700A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

Info

Publication number
WO2016194700A1
WO2016194700A1 PCT/JP2016/065286 JP2016065286W WO2016194700A1 WO 2016194700 A1 WO2016194700 A1 WO 2016194700A1 JP 2016065286 W JP2016065286 W JP 2016065286W WO 2016194700 A1 WO2016194700 A1 WO 2016194700A1
Authority
WO
WIPO (PCT)
Prior art keywords
ece
heat
cooling
cooling device
electrodes
Prior art date
Application number
PCT/JP2016/065286
Other languages
English (en)
Japanese (ja)
Inventor
廣瀬　左京
智靖 薄井
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2016194700A1 publication Critical patent/WO2016194700A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the present invention relates to a cooling device.
  • a heat management system for controlling heat generated from various electronic components.
  • a relatively small electronic device uses a heat sink, a heat pipe, a thermal sheet, a heat storage material, etc.
  • a large electronic device uses an air conditioner such as an air conditioner, or a Peltier cooling device.
  • a cooling fan or the like is used.
  • cooling using heat radiation as described above is limited because the area of the housing is limited.
  • a large electronic device can obtain a sufficient cooling effect by the above air conditioning equipment or the like, but has a problem that it requires a power cost for heat management because the power consumption is very large.
  • Non-Patent Document 1 As a power-saving heat management system, attention has been paid to a material using an electrocaloric effect (hereinafter also referred to as “EC effect”).
  • EC effect electrocaloric effect
  • Non-Patent Document 1 ceramics exhibiting an EC effect are stacked with a space through which a fluid passes, and by applying and removing an electric field, ceramics absorb and generate heat, and at the same time, the fluid is moved by a pump.
  • a cooling device including a refrigerant unit having a ferroelectric polymer film that exhibits an EC effect. The ferroelectric polymer film is suspended between the heat sink and the heat source. By controlling the application of voltage, the ferroelectric polymer film is cooled by alternately applying a bias to the heat sink and the heat source.
  • Patent Document 1 and Non-Patent Document 1 it is necessary to induce heat absorption and heat generation of a material that exhibits the EC effect and at the same time, transport heat to the cold spot side through the material that exhibits the EC effect. For this reason, a fluid is supplied by a pump or a heat switch is used to transfer heat, or an element having an EC effect is moved to transfer heat, which requires a complicated device. In addition, since such a device becomes huge, it is difficult to apply it to a heat generation problem such as a small portable device or a server with limited space.
  • an object of the present invention is to provide a cooling device that is simple, small and capable of performing efficient cooling.
  • ECE element an element made of the material having the above-mentioned electrocaloric effect
  • a thermal contact portion that is, a hot spot
  • an ECE element comprising a pair of electrodes and a dielectric portion made of a material exhibiting an electrocaloric effect located between the pair of electrodes;
  • a cooling device is provided having a cooling member located on the ECE element.
  • an electronic component having the above cooling device is provided.
  • an electronic apparatus having the cooling device or the electronic component.
  • a heat source using an ECE element including a pair of electrodes and a dielectric portion made of a material exhibiting an electrocaloric effect located between the pair of electrodes.
  • a cooling method A part of the ECE element is brought into contact with a heat source directly or through a heat conducting member; In the ECE element, a temperature gradient is generated between the contact portion with the heat source and another portion, In the above state, by applying a voltage to the electrode, the dielectric part generates heat, There is provided a cooling method including causing the dielectric portion to absorb heat by stopping application of voltage to the electrode.
  • a simple, small, and efficient cooling device can be provided by providing a cold spot on an element that exhibits the EC effect.
  • FIG. 1 is a schematic cross-sectional view of a cooling device 1a according to the first embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing a state where the cooling device 1a of FIG. 1 is installed on a heat source.
  • FIG. 3 is a schematic cross-sectional view of a cooling device 1b according to the second embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing a state where a cooling device obtained by modifying the cooling device 1b in the second embodiment is installed on a heat source.
  • FIG. 5 is a schematic cross-sectional view of a cooling device 1c according to the third embodiment of the present invention.
  • cooling device of the present invention will be described in detail with reference to the drawings.
  • shape and arrangement of the cooling device and each component of the present embodiment are not limited to the illustrated example.
  • the cooling device 1a includes a pair of electrodes 2 and 4 and a dielectric composed of a material that exhibits an electrocaloric effect located between the pair of electrodes.
  • the ECE element 8 having the portion 6 and the cooling member 10 positioned on one surface of the ECE element 8 are provided.
  • the cooling device 1 a is installed so that the surface facing the surface on which the cooling member 10 is located (that is, the surface on which the electrode 4 exists) is in contact with the heat source H. By installing in this way, the temperature is high on the electrode 4 side and the temperature is low on the electrode 2 side, and a temperature gradient can be formed in the ECE element 8.
  • the ECE element 8 since the heat transferred to the cold spot is absorbed by the cooling member 10 and heat is supplied from the heat source H to the hot spot, the ECE element 8 always has a temperature gradient. By applying voltage in a pulse manner, the ECE element 8 repeats heat generation and heat absorption, and conveys heat from the hot spot to the cold spot. In other words, the ECE element 8 functions as a heat pump.
  • the material showing the electrocaloric effect constituting the dielectric part 6 is not particularly limited, but BaTiO 3 , Ba (Ti, Zr) O 3 , Ba (Ti, Sn) O 3 , (Ba, Sr) TiO 3 , (1-x) Pb (Mg 1/3 Nb 2/3 ) O 3 -xPbTiO 3 , (1-x) Pb (Mg 1/3 Nb 2/3 ) O 3 -xATiO 3 (where A is (1-x) Pb (Ni 1/3 Nb 2/3 ) O 3 -xPbTiO 3 , (1-x) Pb (Ni 1/3 Nb), which is at least one selected from Ba, Sr and Ca.
  • O 3 -xATiO 3 (wherein A is at least one selected from Ba, Sr and Ca), Pb (Sc, Ta) O 3 , (Pb, Ba) ZrO 3, etc. Ceramic materials, PVDF (polyvinylidene fluoride), etc. An organic piezoelectric body or a combination thereof can be used.
  • the material to be used can be selected according to the equipment in which the cooling device of the present invention is installed. For example, when the cooling device is to be operated at 120 ° C., the BaTiO 3 having a dielectric part transition temperature of around 120 ° C.
  • Ba (Ti, Zr) O 3 are suitable, and when it is desired to operate at 80 ° C., Ba (Ti, Zr) O 3 , Ba (Ti, Si, to which Sr, Zr, and Sn are added as shifters so that the transition temperature is close to 80 ° C. Sn) O 3 or (Ba, Sr) TiO 3 or (Pb, Ba) ZrO 3 is suitable.
  • (1-x) Pb (Mg 1/3 Nb 2/3 ) O 3 -xPbTiO 3 or Pb (Sc, Ta) O 3 is preferred.
  • Mn serving as an acceptor
  • Ta, Nb serving as a donor, rare earth atoms, or the like
  • the addition of Mn is effective for Ti-based oxides
  • the addition of Ta and Nb is effective for Zr-based oxides.
  • the content of the material exhibiting the electrocaloric effect is 50% by mass or more, preferably 60% by mass or more, more preferably 80% by mass or more, still more preferably 90% by mass or more, and even more preferably. It may be 98% by mass or more, for example, 98.0 to 99.8% by mass.
  • the dielectric portion 6 may be made of a material that substantially exhibits an electrocaloric effect.
  • the shape of the dielectric portion 6 is not particularly limited, and can be formed into, for example, a sheet shape, a block shape, and other various shapes.
  • the molding method is not particularly limited, and compression, sintering, or the like can be used. Moreover, you may mix and shape
  • the material constituting the electrodes 2 and 4 is not particularly limited, and examples thereof include Ag, Cu, Pt, Ni, Al, Pd, Au, and alloys thereof (for example, Ag—Pd). Among these, Pt, Ag, Pd, or Ag—Pd is preferable.
  • the material constituting the electrode has high thermal conductivity from the viewpoint of heat transfer.
  • a material such as Ag is preferred.
  • the shape of the electrodes 2 and 4 is not particularly limited, but preferably a shape that covers the entire surface of the dielectric portion 6 is preferable.
  • the cooling member 10 is not particularly limited as long as it can efficiently receive heat from the ECE element 8.
  • a heat storage material a member formed from a material having high thermal conductivity, or a combination thereof can be used.
  • the heat storage material is not particularly limited, VO 2, or VO 2 in W, Mo, Nb, Ti, Ta, Cr, those were dissolved with Al, or, LiVO 2, or LiVO 2 to Fe, Mn, Examples include Co, Ti added, metal halides, metal nitrates, metal carbonates, metal hydrates, paraffins, fatty acids and the like.
  • a heat storage material can be selected according to the apparatus which installs the cooling device of this invention, and may use 1 type or in combination of 2 or more types.
  • vanadium oxide when used in electronic equipment, the following vanadium oxide is preferred: V and M (wherein M is at least one selected from W, Ta, Mo and Nb), and the molar content of M is 0 mole part when the total of V and M is 100 mole parts Vanadium oxide which is not less than 5 mol parts; Vanadium oxide containing A (where A is Li or Na) and V, and the content mole part of A when V is 100 mole parts is 50 mole parts or more and 100 mole parts or less; When Ti or another atom selected from the group consisting of W, Ta, Mo and Nb is doped and the other atom is W, for a total of 100 mole parts of V, Ti and other atoms, When the content mole part of other atoms is larger than 0 mole part and 5 mole parts or less, and the other atom is Ta, Mo or Nb, with respect to a total of 100 mole parts of V, Ti and other atoms, The mole part of other atoms is larger than
  • Vanadium oxide which is less than or equal to parts; V, Li, and transition metals (eg, W, Ta, Mo or Nb), the molar ratio of V to other atoms is in the range of 995: 5 to 850: 150, and the sum of V and other atoms Vanadium oxide in which the molar ratio of Li to Li is in the range of 100: 70-110;
  • V 1-x M x O 2 [Wherein M is W, Ta, Mo or Nb, and x is 0 or more and 0.05 or less] Vanadium oxide represented by: Formula: A y VO 2 [In the formula, A is Li or Na, and y is 0.5 or more and 1.0 or less] Vanadium oxide represented by: Formula: V 1-x-y Ti x M y O 2 [Wherein M is W, Ta, Mo or Nb; x is 0.02 or more and 0.3 or less, y is 0 or more, When M is W, y is 0.05 or less, When M is W, y is
  • the halide of the metal is not particularly limited, for example, lithium fluoride (LiF), lithium chloride (LiCl), sodium fluoride (NaF), include magnesium fluoride (MgF 2) or the like.
  • the nitrate of the metal is not particularly limited, for example, lithium nitrate (LiNO3), sodium nitrate (NaNO 3), potassium nitrate (KNO 3), and the like.
  • carbonate of the metal is not particularly limited, for example, lithium carbonate (Li 2 CO 3), and the like potassium carbonate (K 2 CO 3) is.
  • hydrated salt of a metal is not particularly limited, for example, NaCH 3 COO ⁇ 3H 2 O , Ba (OH) 2 ⁇ 8H 2 O, Sr (OH) 2 ⁇ 8H 2 O , and the like.
  • Paraffins are not particularly limited, and examples thereof include n-docosane (C 22 H 46 ), n-tetracosane (C 24 H 50 ), and n-triacontane (C 30 H 62 ).
  • the fatty acid is not particularly limited, and examples thereof include stearic acid, polymitic acid, myristic acid and the like.
  • the member formed from a material having a high thermal conductivity is not particularly limited, and examples thereof include a heat sink, a thermal sheet, and other members formed by molding a material having a high thermal conductivity into a specific shape.
  • the shape of the member formed from a material having high thermal conductivity is not particularly limited, and may be a sheet shape, a block shape, an uneven shape, or the like.
  • the material having high thermal conductivity is not particularly limited.
  • metal for example, tin, nickel, copper, bismuth, silver, iron and aluminum, or an alloy containing them
  • resin for example, Teflon, polyimide, silicone
  • Graphite carbon, or a composite in which they are combined.
  • the member formed from a material having high thermal conductivity can be, for example, a heat sink, a thermal sheet, a housing, or the like.
  • the cooling member 10 is on a plate, and the size of the contact surface with the electrode 2 and the size of the contact surface of the electrode 2 are the same. It may have the shape and size.
  • the cooling member 10 may be formed in a sheet shape so as to extend from the end of the ECE element 8. Further, the cooling member 10 may be provided with unevenness. Thus, by setting it as a sheet form or uneven
  • connection between the electrodes 2 and 4, the dielectric portion 6 and the cooling member 10 can be performed using, for example, an adhesive, paste, solder, brazing, or the like.
  • a material having high thermal conductivity for example, a high thermal conductivity paste or solder is used.
  • the cooling device 1b includes a heat conducting member 12 on the electrode 4 in addition to the structure of the cooling device 1a.
  • the cooling device 1b is installed such that the heat conducting member 12 contacts the heat source.
  • the material which comprises the heat conductive member 12 is not specifically limited, It may be mentioned as a material with said high heat conductivity.
  • the heat conducting member 12 is on a plate, and the size of the contact surface with the electrode 2 and the size of the contact surface of the electrode 4 are the same, but not limited to this, various shapes and You may have a size.
  • the heat conducting member 12 may extend from the end of the ECE element 8. With such a configuration, the heat source existing at a distant place and the ECE element 8 can be thermally coupled.
  • the ECE element 8 is located on one main surface of the heat conducting member 12 and the heat source H exists on the opposite surface, but the ECE element 8 and the heat source H are on the same face of the heat conducting member 12. May be present.
  • FIG. 5 shows a cooling device 1c according to the third embodiment of the present invention.
  • a plurality of internal electrodes 14a and 14b and a plurality of dielectric portions 16 are alternately stacked.
  • the internal electrodes 14a and 14b are electrically connected to external electrodes 20a and 20b disposed on the end face of the ECE element 18, respectively.
  • an electric field is formed between the internal electrodes 14a and 14b. Due to this electric field, the dielectric portion 16 generates heat.
  • the dielectric portion 16 absorbs heat.
  • the cooling member 10 is disposed on the upper surface of the ECE element 18.
  • the ECE element can function as a heat pump by forming a hot spot and a cold spot and giving a temperature gradient to the ECE element. By using this function, efficient cooling becomes possible.
  • the present invention is a method of cooling a heat source using an ECE element comprising a pair of electrodes and a dielectric portion made of a material exhibiting an electrocaloric effect located between the pair of electrodes.
  • a part of the ECE element is brought into contact with a heat source directly or through a heat conducting member;
  • a temperature gradient is generated between the contact portion with the heat source and another portion,
  • the dielectric part generates heat
  • a cooling method including causing a dielectric part to absorb heat by stopping application of a voltage to the electrode.
  • the dielectric part absorbs and generates heat when voltage is applied and stops.
  • the dielectric part generates heat when applied and may absorb heat when stopped, or absorbs heat when applied and stops when stopped. It may generate heat.
  • the present invention also provides an electronic component having the cooling device of the present invention and an electronic apparatus having the cooling device or the electronic component.
  • a central processing unit CPU
  • a hard disk HDD
  • a power management IC PMIC
  • PA power amplifier
  • transceiver IC a voltage regulator
  • Light emitting elements such as integrated circuits (ICs), light emitting diodes (LEDs), incandescent bulbs, semiconductor lasers, parts that can be heat sources such as field effect transistors (FETs), and other parts such as lithium ion batteries, substrates, heat sinks And parts commonly used in electronic devices such as housings.
  • the electronic device is not particularly limited, and examples thereof include a mobile phone, a smartphone, a personal computer (PC), a tablet terminal, a hard disk drive, and a data server.
  • the cooling device of the present invention can be used as a cooling device for various devices, for example, electronic devices in which the heat countermeasure problem has become prominent.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement qui comprend : un élément ECE comprenant une paire d'électrodes et un corps conducteur qui est positionné entre la paire d'électrodes et qui est conçu à partir d'un matériau ayant un effet électrocalorimétrique (ECE); et un élément de refroidissement positionné au-dessus de l'élément ECE.
PCT/JP2016/065286 2015-06-04 2016-05-24 Dispositif de refroidissement WO2016194700A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-114198 2015-06-04
JP2015114198 2015-06-04

Publications (1)

Publication Number Publication Date
WO2016194700A1 true WO2016194700A1 (fr) 2016-12-08

Family

ID=57440953

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/065286 WO2016194700A1 (fr) 2015-06-04 2016-05-24 Dispositif de refroidissement

Country Status (1)

Country Link
WO (1) WO2016194700A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021131142A1 (fr) * 2019-12-23 2021-07-01
WO2022102617A1 (fr) * 2020-11-10 2022-05-19 株式会社村田製作所 Élément à effet électrocalorique
US11598561B2 (en) 2017-06-16 2023-03-07 Carrier Corporation Electrocaloric element, a heat transfer system comprising an electrocaloric element and a method of making them
WO2023190558A1 (fr) * 2022-03-31 2023-10-05 株式会社村田製作所 Céramique
WO2023190437A1 (fr) * 2022-03-31 2023-10-05 株式会社村田製作所 Céramique
JP7467967B2 (ja) 2020-02-13 2024-04-16 株式会社デンソー 電界駆動型の機能素子、固体冷媒サイクル、および、アクチュエータ
JP7467966B2 (ja) 2020-02-13 2024-04-16 株式会社デンソー 電界駆動型の機能素子、固体冷媒サイクル、および、アクチュエータ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013505571A (ja) * 2009-09-17 2013-02-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ウィンドウ要素を組み込んだモールドレンズ
JP2015059739A (ja) * 2013-09-20 2015-03-30 パロ・アルト・リサーチ・センター・インコーポレーテッドＰａｌｏ Ａｌｔｏ Ｒｅｓｅａｒｃｈ Ｃｅｎｔｅｒ Ｉｎｃｏｒｐｏｒａｔｅｄ 電気熱量冷却装置およびヒートポンプ
US20150102702A1 (en) * 2012-05-08 2015-04-16 Peter Jeney Thermal power cell and apparatus based thereon
JP2015094552A (ja) * 2013-11-13 2015-05-18 株式会社デンソー 冷却装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013505571A (ja) * 2009-09-17 2013-02-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ウィンドウ要素を組み込んだモールドレンズ
US20150102702A1 (en) * 2012-05-08 2015-04-16 Peter Jeney Thermal power cell and apparatus based thereon
JP2015059739A (ja) * 2013-09-20 2015-03-30 パロ・アルト・リサーチ・センター・インコーポレーテッドＰａｌｏ Ａｌｔｏ Ｒｅｓｅａｒｃｈ Ｃｅｎｔｅｒ Ｉｎｃｏｒｐｏｒａｔｅｄ 電気熱量冷却装置およびヒートポンプ
JP2015094552A (ja) * 2013-11-13 2015-05-18 株式会社デンソー 冷却装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11598561B2 (en) 2017-06-16 2023-03-07 Carrier Corporation Electrocaloric element, a heat transfer system comprising an electrocaloric element and a method of making them
JPWO2021131142A1 (fr) * 2019-12-23 2021-07-01
WO2021131142A1 (fr) * 2019-12-23 2021-07-01 株式会社村田製作所 Élément à effet électrocalorique
JP7272467B2 (ja) 2019-12-23 2023-05-12 株式会社村田製作所 電気熱量効果素子
EP4053471A4 (fr) * 2019-12-23 2023-11-29 Murata Manufacturing Co., Ltd. Élément à effet électrocalorique
JP7467967B2 (ja) 2020-02-13 2024-04-16 株式会社デンソー 電界駆動型の機能素子、固体冷媒サイクル、および、アクチュエータ
JP7467966B2 (ja) 2020-02-13 2024-04-16 株式会社デンソー 電界駆動型の機能素子、固体冷媒サイクル、および、アクチュエータ
WO2022102617A1 (fr) * 2020-11-10 2022-05-19 株式会社村田製作所 Élément à effet électrocalorique
JP7439954B2 (ja) 2020-11-10 2024-02-28 株式会社村田製作所 電気熱量効果素子
WO2023190558A1 (fr) * 2022-03-31 2023-10-05 株式会社村田製作所 Céramique
WO2023190437A1 (fr) * 2022-03-31 2023-10-05 株式会社村田製作所 Céramique

Similar Documents

Publication Publication Date Title
WO2016194700A1 (fr) Dispositif de refroidissement
JP4949832B2 (ja) 熱電変換モジュール
JP2009252553A (ja) 組電池モジュール
WO2018119736A1 (fr) Régulateur électronique et plate-forme mobile
WO2015176353A1 (fr) Circuit de refroidissement et terminal et procédé de refroidissement de terminal
CN103515522A (zh) 热电冷却模块及其制造方法
JP6693113B2 (ja) 熱搬送デバイス
KR20130104165A (ko) 열전소자를 이용한 배터리 냉각시스템
JP2015094552A (ja) 冷却装置
JP2015075312A (ja) 相変化モジュール及びそれを搭載した電子機器装置
JP2014029892A (ja) 冷暖房装置
JP2005136211A (ja) 冷却装置
WO2018042708A1 (fr) Dispositif de conversion thermoélectrique et dispositif électronique
JP2004221409A (ja) ペルチェモジュール装置
TW201223426A (en) Cooling system for cooling a heat source and projector having the same
JP6414636B2 (ja) 冷却デバイス
WO2015198770A1 (fr) Dispositif électronique
JP6772878B2 (ja) 熱マネジメント方法
RU2584143C2 (ru) Способ отвода тепла от мощных эри, электронных узлов, блоков и модулей и устройство для его осуществления
Shao et al. Radiator heightens power density of piezoelectric transformers
CN103208904A (zh) 一种液态金属电磁泵
CN108713259A (zh) 热电转换模块
JPWO2020022228A1 (ja) 熱電変換ユニット
WO2017006726A1 (fr) Dispositif de refroidissement
JP2016139297A (ja) 携帯端末

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16803135

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16803135

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP