WO2018119736A1 - Régulateur électronique et plate-forme mobile - Google Patents

Régulateur électronique et plate-forme mobile Download PDF

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Publication number
WO2018119736A1
WO2018119736A1 PCT/CN2016/112594 CN2016112594W WO2018119736A1 WO 2018119736 A1 WO2018119736 A1 WO 2018119736A1 CN 2016112594 W CN2016112594 W CN 2016112594W WO 2018119736 A1 WO2018119736 A1 WO 2018119736A1
Authority
WO
WIPO (PCT)
Prior art keywords
mos
electronic governor
housing
tubes
governor according
Prior art date
Application number
PCT/CN2016/112594
Other languages
English (en)
Chinese (zh)
Inventor
张梁
刘炜刚
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201680004259.0A priority Critical patent/CN107113998B/zh
Priority to PCT/CN2016/112594 priority patent/WO2018119736A1/fr
Publication of WO2018119736A1 publication Critical patent/WO2018119736A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Definitions

  • the present invention relates to motor control technology, and more particularly to an electronic governor and a movable platform to which the electronic governor is applied.
  • the existing high-current electronic governor for example, the electronic governor above 35A, is very large in size, so that the installation will be very limited, and the volume is also accompanied by heavy weight, maneuverability and endurance. Will be reduced accordingly.
  • the technical problem mainly solved by the embodiments of the present invention is to provide an electronic governor with a small volume and good heat dissipation.
  • An electronic governor comprising:
  • circuit board mounted in the housing, the circuit board including an upper surface and a lower surface disposed opposite to the upper surface, the upper surface being disposed facing one of the inner walls of the housing, the lower surface Facing another opposite inner wall arrangement of the housing,
  • the upper surface is provided with a plurality of first MOS tubes, and the lower surface is provided with a plurality of second MOS tubes; the top surfaces of the first MOS tubes and the second MOS tubes are each embedded with a heat conductive metal sheet;
  • the heat conductive metal piece of the first MOS tube is thermally connected to one of the inner walls of the housing through the first thermal pad;
  • the heat conductive metal piece of the second MOS tube passes through the second thermal pad and another of the housing One is thermally connected to the inner wall.
  • the first MOS tube and the second MOS tube are main heat sources, and the top surface of the first MOS tube and the second MOS tube are embedded with a heat conductive metal piece, and the first MOS tube and the second The MOS tube can directly dissipate heat through the heat conducting metal piece, so that the thermal resistance of the top of the first MOS tube and the second MOS tube is greatly reduced compared with the thermal resistance of the conventional MOS tube with the plastic package at the top, which greatly enhances The heat conduction capability on the heat conduction path of the first MOS transistor and the second MOS transistor; at the same time, the first MOS transistor and the second MOS transistor respectively conduct heat conduction through the first thermal pad and the second thermal pad to the housing of the electronic governor, The heat exchange area between the first MOS tube and the second MOS and the outside is increased, thereby effectively improving the heat dissipation efficiency of the electronic governor.
  • the MOS tube can be simultaneously mounted on opposite sides of the circuit board to reduce the occupation space of the circuit board; and, the first MOS transistor and the second The heat dissipation efficiency of the MOS tube is high, and it is convenient to use a MOS tube of a smaller size, thereby further reducing the occupation space of the circuit board, thereby facilitating the miniaturization design of the electronic governor.
  • the thermally conductive metal sheet is directly encapsulated in the first MOS tube and the second MOS tube, and a top surface of the thermally conductive metal sheet is at least partially exposed.
  • a plurality of the first MOS tubes are disposed opposite to the plurality of the second MOS tubes;
  • a plurality of the first MOS transistors are interleaved with a plurality of the second MOS transistors.
  • the number of the first MOS tubes is greater than or equal to six;
  • the number of the second MOS tubes is greater than or equal to six.
  • a plurality of the first MOS transistors are arranged in parallel and arranged in a matrix
  • a plurality of the second MOS tubes are arranged in parallel and arranged in a matrix.
  • the thermal pad is a thermal adhesive layer or a thermal grease layer.
  • the thermally conductive adhesive layer is a thermally conductive silicone layer.
  • the thermally conductive grease layer is a thermally conductive silicone layer.
  • the width of the first MOS transistor and the second MOS transistor Degree and length are less than 4 mm.
  • the first MOS transistor and the second MOS transistor have a width and a length of 3.3 mm.
  • the maximum allowable operating current of the ESC is greater than or equal to 30 amps.
  • the upper and lower shells are both metal shells.
  • the upper and lower shells are all aluminum shells.
  • the outer surface of the upper case is provided with a plurality of heat dissipation fins corresponding to the area of the first MOS;
  • the outer surface of the lower case is provided with a plurality of heat dissipation fins corresponding to the area of the second MOS tube.
  • a plurality of the first MOS transistors share a thermal pad
  • a plurality of the second MOS tubes share a thermal pad.
  • a mobile platform that includes:
  • a plurality of electronic governors electrically connected to the plurality of motors for controlling a plurality of the plurality of motors
  • controller communicably connected to the plurality of electronic governors; the controller separately controls an operating state of the motor through a plurality of the electronic governors
  • the electronic governor includes a housing and a circuit board mounted in the housing, the circuit board including an upper surface and a lower surface disposed opposite to the upper surface, the upper surface facing One of the inner walls of the housing is disposed, and the lower surface is disposed facing the other opposite inner wall of the housing;
  • the upper surface is provided with a plurality of first MOS tubes, and the lower surface is provided with a plurality of second MOS tubes; the top surfaces of the first MOS tubes and the second MOS tubes are each embedded with a heat conductive metal sheet;
  • the heat conductive metal piece of the first MOS tube passes through the first thermal pad and the case An inner wall is thermally connected;
  • the heat conductive metal piece of the second MOS tube is thermally connected to the other opposite inner wall of the housing through the second thermal pad.
  • the thermally conductive metal sheet is directly encapsulated in the first MOS tube and the second MOS tube, and a top surface of the thermally conductive metal sheet is at least partially exposed.
  • a plurality of the first MOS tubes are disposed opposite to the plurality of the second MOS tubes;
  • a plurality of the first MOS transistors are interleaved with a plurality of the second MOS transistors.
  • the number of the first MOS tubes is greater than or equal to six;
  • the number of the second MOS tubes is greater than or equal to six.
  • a plurality of the first MOS transistors are arranged in parallel and arranged in a matrix
  • a plurality of the second MOS tubes are arranged in parallel and arranged in a matrix.
  • the thermal pad is a thermal adhesive layer or a thermal grease layer.
  • the thermally conductive adhesive layer is a thermally conductive silicone layer.
  • the thermally conductive grease layer is a thermally conductive silicone layer.
  • the width and length of the first MOS transistor and the second MOS transistor are both less than 4 mm.
  • the first MOS transistor and the second MOS transistor have a width and a length of 3.3 mm.
  • the maximum allowable operating current of the ESC is greater than or equal to 30 amps.
  • the ESC allows a maximum operating current of 35 to 60 amps.
  • the housing is a metal shell.
  • the housing is an aluminum housing.
  • the outer surface of the housing is provided with a plurality of heat dissipation fins corresponding to the area of the first MOS;
  • the outer surface of the housing is provided with a plurality of heat dissipation fins corresponding to the area of the second MOS tube.
  • a plurality of the first MOS transistors share a thermal pad
  • a plurality of the second MOS tubes share a thermal pad.
  • the movable platform is an unmanned aerial vehicle, or an unmanned undercarriage.
  • the movable platform is an unmanned aerial vehicle, or an unmanned undercarriage.
  • Figure 1 is an exploded view of the electronic governor of the present invention
  • FIG 2 is a perspective view of the electronic governor shown in Figure 1;
  • Figure 3 is a cross-sectional view taken along line C-C of Figure 2;
  • FIG. 4 is a schematic view of a movable platform to which the electronic governor shown in FIG. 1 is applied.
  • the inventors have found that improving the heat dissipation efficiency of the MOS tube can be In order to effectively reduce the size of the electronic governor and increase the maximum operating current of the electronic governor.
  • the invention provides an electronic governor comprising a housing, a circuit board and a plurality of MOS tubes respectively mounted on opposite surfaces of the circuit board.
  • a heat conductive metal piece is embedded on the top surface of each MOS tube.
  • the thermally conductive metal sheets of the MOS tubes on opposite sides of the circuit board respectively abut against the inner wall of the housing through the thermal pad to transfer heat generated by the MOS tube to the housing.
  • each MOS tube since the top surface of each MOS tube is embedded with a heat conductive metal piece, the thermal resistance at the top thereof is greatly reduced compared with the conventional MOS tube having a plastic package at the top, which is greatly enhanced.
  • the MOS tube conducts heat conduction through the inner wall of the housing of the electronic governor through the thermal pad, respectively, which increases the heat exchange area between the MOS tube and the outside, thereby effectively improving the heat dissipation efficiency of the electronic governor.
  • the MOS tube can be mounted on opposite sides of the circuit board at the same time to reduce the occupation space of the circuit board; and the heat dissipation efficiency of the first MOS tube and the second MOS tube is high. It is convenient to use a smaller size MOS tube, thereby further reducing the footprint of the circuit board, thereby facilitating the miniaturization design of the electronic governor.
  • the housing includes an upper case and a lower case spliced with the upper case.
  • the lower case and the upper case together form a housing.
  • a circuit board is mounted within the housing.
  • the circuit board 130 includes an upper surface 130a and a lower surface 130b disposed opposite the upper surface 130a.
  • the upper surface 130a is disposed facing an inner wall of the upper case 110
  • the lower surface 130b is disposed facing an inner wall of the lower case 120.
  • the upper surface 130a is provided with a plurality of first MOS tubes 150a
  • the lower surface 130b is provided with a plurality of second MOS tubes 150b.
  • the top surface of the first MOS tube 150a and the second MOS tube 150b are embedded with a heat conductive metal piece 150c.
  • the heat conductive metal piece 150c of the first MOS tube 150a is thermally connected to the inner wall of the upper case 110 through the first thermal pad 160a.
  • the heat conductive metal piece 150c of the second MOS tube 150b is thermally connected to the inner wall of the lower case 120 through the second thermal pad 160b.
  • the first MOS tube 150a and the second MOS tube 150b are main heat sources, and the top surface of the first MOS tube 150a and the second MOS tube 150b are embedded with a heat conductive metal piece 150c, and A MOS transistor 150a and a second MOS transistor 150b can be directly radiated through the heat conductive metal piece 150c, so that the thermal resistance of the top of the first MOS transistor 150a and the second MOS transistor 150b is compared with the conventional MOS of the plastic package at the top.
  • the thermal resistance of the tube is greatly reduced, and the thermal conductivity of the first MOS tube 150a and the second MOS tube 150b is greatly enhanced.
  • first MOS tube 150a and the second MOS tube 150b respectively pass through the first thermal pad 160a.
  • second thermal pad 160b is thermally conducted to the upper case 110 and the lower case 120 of the electronic governor 100, thereby increasing the heat exchange area between the first MOS tube 150a and the second MOS and the outside, thereby effectively improving the electronic governor 100. Cooling efficiency.
  • the MOS tube can be simultaneously mounted on opposite sides of the circuit board 130 to reduce the occupied space of the circuit board 130; and, the first MOS The heat dissipation efficiency of the tube 150a and the second MOS tube 150b is high, and the MOS tube of a smaller size is facilitated, thereby further reducing the occupied space of the circuit board 130, thereby facilitating the miniaturization design of the electronic governor 100.
  • the heat conductive metal piece 150c is directly encapsulated in the first MOS tube 150a and the second MOS tube 150b, and the top surface of the heat conductive metal piece 150c is at least partially exposed. That is, when the first MOS transistor 150a and the second MOS transistor 150b are packaged, the heat conductive metal sheets 150c are directly packaged together.
  • the installation positions of the first MOS tube 150a and the second MOS tube 150b can be designed according to different needs.
  • a plurality of the first MOS tubes 150a are disposed opposite to the plurality of the second MOS tubes 150b to further save the space occupied by the circuit board 130, facilitating the small size of the electronic governor 100.
  • multiple The first MOS tube 150a is interleaved with the plurality of the second MOS tubes 150b to increase the effective heat dissipation area of the single MOS tube, and further improve the heat dissipation efficiency of the MOS tube.
  • the number of the first MOS tube 150a and the second MOS tube 150b can be set according to actual needs, and a large number of MOS tubes of a small size can be used to replace a large-sized MOS tube of the conventional electronic governor 100 to improve MOS.
  • the heat dissipation efficiency of the tube reduces the occupied space.
  • the number of the first MOS tubes 150a is six or more
  • the number of the second MOS tubes 150b is six or more.
  • the relative positions of the number of the first MOS tube 150a and the second MOS tube 150b may be designed according to different requirements.
  • the plurality of the first MOS tubes 150a are arranged in parallel and arranged in a matrix.
  • a plurality of the second MOS tubes 150b are arranged in parallel and arranged in a matrix to facilitate uniform heat dissipation of the plurality of second MOS tubes 150b.
  • the MOS tube can be packaged by a small-sized packaging process.
  • the width and length of the first MOS tube 150a and the second MOS tube 150b are both less than 4 mm, for example, The width and length of the first MOS tube 150a and the second MOS tube 150b may be 4 mm, 3.8 mm, 3.6 mm, 3.5 mm, 3.2 mm, 3.0 mm, 2.8 mm, 2.6 mm, 2.5 mm, and the like.
  • the width and length of the first MOS tube 150a and the second MOS tube 150b may be different.
  • the first MOS transistor 150a and the second MOS transistor 150b have a width and a length of 3.3 mm.
  • the maximum allowable operating current of the ESC is greater than or equal to 30 amps, and the number of the first MOS transistor 150a and the second MOS transistor 150b may be increased according to the maximum operating current allowed by the ESC.
  • the maximum operating current allowed by the ESC can be 35 amps, 40 amps, 45 amps, 50 amps, 55 amps, 60 amps, and the like.
  • the thermal pad is a thermal adhesive layer or a thermal grease layer.
  • the thermal conductive adhesive layer can be made of a thermally conductive adhesive.
  • the thermal conductive adhesive layer is a thermally conductive silicone layer.
  • the thermal grease layer may be made of a resin having better thermal conductivity.
  • the thermal grease layer may be a thermal grease layer.
  • the upper case 110 and the lower case 120 are both metal shells.
  • the upper and lower shells 110, 120 are both aluminum shells.
  • the upper case 110 and the lower case 120 may also be other metal shells, such as aluminum alloys, alloys, and the like.
  • the opening edge of the upper casing 110 is provided with a first upper groove and a second lower groove
  • the opening edge of the lower casing 120 is provided with a first lower groove and a second lower groove.
  • the first upper groove is disposed corresponding to the first lower groove, and is collectively spliced into one threading hole 170a.
  • the second upper groove is disposed corresponding to the second lower groove, and is collectively spliced into a receiving hole 170b for receiving a capacitor.
  • the outer surface of the upper case 110 is provided with a plurality of heat dissipation fins 180a corresponding to the first MOS.
  • the outer surface of the lower case 120 is provided with a plurality of heat dissipation fins 180b corresponding to the area of the second MOS tube 150b.
  • the present invention also provides a movable platform that drives the motor using the electronic governor 100 described above.
  • the movable platform is an unmanned aerial vehicle or an unmanned undercarriage.
  • the movable platform 10 of the embodiment of the present invention includes a plurality of electronic governors 100, a frame 200, a plurality of motors 300, and a controller 400.
  • a plurality of motors 300 are mounted on the frame 200.
  • a plurality of electronic governors 100 are electrically connected to the plurality of motors 300 for controlling a plurality of the plurality of motors 300.
  • the controller 400 is communicatively coupled to the plurality of electronic governors 100.
  • the controller 400 controls the operating states of the plurality of motors 300 through a plurality of the electronic governors 100, respectively.
  • the movable platform is an unmanned aerial vehicle
  • the controller 400 is a flight controller
  • the motor 300 is used to drive propeller rotation to provide flight power to the unmanned aerial vehicle.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un régulateur électronique (100), comprenant : une coque et une carte de circuit imprimé (130) disposée dans la coque. La carte de circuit imprimé (130) comprend une surface supérieure (130a) et une surface inférieure (130b) disposée au dos de la surface supérieure (130a) et orientée dans le sens contraire ; la surface supérieure (130a) est disposée en regard d'une paroi intérieure de la coque, et la surface inférieure (130b) est disposée en regard de l'autre paroi intérieure opposée de la coque ; la surface supérieure (130a) est pourvue d'une pluralité de premiers transistors à semi-conducteurs à oxyde métallique (MOS) (150a), et la surface inférieure (130b) est pourvue d'une pluralité de seconds transistors MOS (150b) ; les surfaces supérieures des premiers transistors MOS (150a) et des seconds transistors MOS (150b) ont toutes fait l'objet d'une incorporation de plaques métalliques de conduction thermique (150c) ; les plaques métalliques de conduction thermique (150c) des premiers transistors MOS (150a) sont reliées à une paroi intérieure de la coque à des fins de conduction thermique au moyen d'un plot de conduction thermique (160a) ; et les plaques métalliques de conduction thermique (150c) des seconds transistors MOS (150b) sont reliées à l'autre paroi intérieure opposée de la coque à des fins de conduction thermique au moyen d'un second plot de conduction thermique (160b). L'invention permet d'obtenir une bonne propriété de rayonnement thermique du régulateur électronique et de faciliter une conception miniaturisée du régulateur électronique. L'invention concerne également une plate-forme mobile qui est appliquée au régulateur électronique.
PCT/CN2016/112594 2016-12-28 2016-12-28 Régulateur électronique et plate-forme mobile WO2018119736A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680004259.0A CN107113998B (zh) 2016-12-28 2016-12-28 电子调速器、以及可移动平台
PCT/CN2016/112594 WO2018119736A1 (fr) 2016-12-28 2016-12-28 Régulateur électronique et plate-forme mobile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/112594 WO2018119736A1 (fr) 2016-12-28 2016-12-28 Régulateur électronique et plate-forme mobile

Publications (1)

Publication Number Publication Date
WO2018119736A1 true WO2018119736A1 (fr) 2018-07-05

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PCT/CN2016/112594 WO2018119736A1 (fr) 2016-12-28 2016-12-28 Régulateur électronique et plate-forme mobile

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CN (1) CN107113998B (fr)
WO (1) WO2018119736A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018119736A1 (fr) * 2016-12-28 2018-07-05 深圳市大疆创新科技有限公司 Régulateur électronique et plate-forme mobile
CN107472523A (zh) * 2017-09-20 2017-12-15 湖南基石信息技术有限公司 涵道推进器及小型无人飞机
CN107472501A (zh) * 2017-09-20 2017-12-15 湖南基石信息技术有限公司 超声波防干扰结构及小型无人飞机
CN109263823B (zh) * 2018-11-29 2024-05-17 深圳市苇渡智能科技有限公司 一种冲浪装置
CN110828922A (zh) * 2019-12-06 2020-02-21 联动天翼新能源有限公司 一种bms散热结构

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US20110139427A1 (en) * 2009-12-10 2011-06-16 Ming-Shun Lee Heat dissipation device
JP2012182398A (ja) * 2011-03-03 2012-09-20 Hitachi Ltd 冷却構造
CN202907403U (zh) * 2012-11-13 2013-04-24 徐学峰 一种电动车新型水冷控制器
CN203120363U (zh) * 2013-02-07 2013-08-07 刘友辉 一种高导热导电的电子调速器
CN205793923U (zh) * 2016-06-21 2016-12-07 深圳市好盈科技有限公司 一种电子调速器电路板的散热结构
CN107113998A (zh) * 2016-12-28 2017-08-29 深圳市大疆创新科技有限公司 电子调速器、以及可移动平台

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CN203661497U (zh) * 2013-12-18 2014-06-18 苍南县华仲机电有限公司 无刷电动车控制器
CN205542751U (zh) * 2016-02-03 2016-08-31 江苏协昌电子科技股份有限公司 基于导热基板的大功率电动车控制器mos管固定结构
CN206524322U (zh) * 2016-12-28 2017-09-26 深圳市大疆创新科技有限公司 电子调速器、以及可移动平台

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110139427A1 (en) * 2009-12-10 2011-06-16 Ming-Shun Lee Heat dissipation device
JP2012182398A (ja) * 2011-03-03 2012-09-20 Hitachi Ltd 冷却構造
CN202907403U (zh) * 2012-11-13 2013-04-24 徐学峰 一种电动车新型水冷控制器
CN203120363U (zh) * 2013-02-07 2013-08-07 刘友辉 一种高导热导电的电子调速器
CN205793923U (zh) * 2016-06-21 2016-12-07 深圳市好盈科技有限公司 一种电子调速器电路板的散热结构
CN107113998A (zh) * 2016-12-28 2017-08-29 深圳市大疆创新科技有限公司 电子调速器、以及可移动平台

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CN107113998A (zh) 2017-08-29

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