WO2018119736A1

WO2018119736A1 - Electronic governor and movable platform

Info

Publication number: WO2018119736A1
Application number: PCT/CN2016/112594
Authority: WO
Inventors: 张梁; 刘炜刚
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2016-12-28
Filing date: 2016-12-28
Publication date: 2018-07-05
Also published as: CN107113998A; CN107113998B

Abstract

An electronic governor (100), comprising: a shell and a circuit board (130) arranged in the shell. The circuit board (130) comprises an upper surface (130a) and a lower surface (130b) arranged on the back of the upper surface (130a) and facing the opposite direction; the upper surface (130a) is arranged facing one inner wall of the shell, and the lower surface (130b) is arranged facing the other opposite inner wall of the shell; the upper surface (130a) is provided with a plurality of first metal oxide semiconductor (MOS) transistors (150a), and the lower surface (130b) is provided with a plurality of second MOS transistors (150b); top surfaces of the first MOS transistors (150a) and the second MOS transistors (150b) are all embedded with heat-conduction metal plates (150c); the heat-conduction metal plates (150c) of the first MOS transistors (150a) are connected to one inner wall of the shell in a heat-conduction manner by means of a first heat-conduction pad (160a); and the heat-conduction metal plates (150c) of the second MOS transistors (150b) are connected to the other opposite inner wall of the shell in a heat-conduction manner by means of a second heat-conduction pad (160b). The heat radiation property of the electronic governor is good, and a miniaturized design of the electronic governor is facilitated. Also provided is a movable platform which is applied to the electronic governor.

Description

Electronic governor and mobile platform

Technical field

The present invention relates to motor control technology, and more particularly to an electronic governor and a movable platform to which the electronic governor is applied.

Background technique

The existing high-current electronic governor, for example, the electronic governor above 35A, is very large in size, so that the installation will be very limited, and the volume is also accompanied by heavy weight, maneuverability and endurance. Will be reduced accordingly.

However, if only the integration of a large current electronic governor is increased, the heat dissipation may be poor, and the electronic governor may not work properly due to excessive temperature.

Summary of the invention

The technical problem mainly solved by the embodiments of the present invention is to provide an electronic governor with a small volume and good heat dissipation.

An electronic governor comprising:

case,

a circuit board mounted in the housing, the circuit board including an upper surface and a lower surface disposed opposite to the upper surface, the upper surface being disposed facing one of the inner walls of the housing, the lower surface Facing another opposite inner wall arrangement of the housing,

The upper surface is provided with a plurality of first MOS tubes, and the lower surface is provided with a plurality of second MOS tubes; the top surfaces of the first MOS tubes and the second MOS tubes are each embedded with a heat conductive metal sheet;

The heat conductive metal piece of the first MOS tube is thermally connected to one of the inner walls of the housing through the first thermal pad;

The heat conductive metal piece of the second MOS tube passes through the second thermal pad and another of the housing One is thermally connected to the inner wall.

In the electronic governor, the first MOS tube and the second MOS tube are main heat sources, and the top surface of the first MOS tube and the second MOS tube are embedded with a heat conductive metal piece, and the first MOS tube and the second The MOS tube can directly dissipate heat through the heat conducting metal piece, so that the thermal resistance of the top of the first MOS tube and the second MOS tube is greatly reduced compared with the thermal resistance of the conventional MOS tube with the plastic package at the top, which greatly enhances The heat conduction capability on the heat conduction path of the first MOS transistor and the second MOS transistor; at the same time, the first MOS transistor and the second MOS transistor respectively conduct heat conduction through the first thermal pad and the second thermal pad to the housing of the electronic governor, The heat exchange area between the first MOS tube and the second MOS and the outside is increased, thereby effectively improving the heat dissipation efficiency of the electronic governor. Since the heat dissipation efficiency of the first MOS transistor and the second MOS transistor is improved, the MOS tube can be simultaneously mounted on opposite sides of the circuit board to reduce the occupation space of the circuit board; and, the first MOS transistor and the second The heat dissipation efficiency of the MOS tube is high, and it is convenient to use a MOS tube of a smaller size, thereby further reducing the occupation space of the circuit board, thereby facilitating the miniaturization design of the electronic governor.

In one embodiment, the thermally conductive metal sheet is directly encapsulated in the first MOS tube and the second MOS tube, and a top surface of the thermally conductive metal sheet is at least partially exposed.

In one embodiment, a plurality of the first MOS tubes are disposed opposite to the plurality of the second MOS tubes;

Alternatively, a plurality of the first MOS transistors are interleaved with a plurality of the second MOS transistors.

In one embodiment, the number of the first MOS tubes is greater than or equal to six;

Or/and, the number of the second MOS tubes is greater than or equal to six.

In one embodiment, a plurality of the first MOS transistors are arranged in parallel and arranged in a matrix;

Or/and, a plurality of the second MOS tubes are arranged in parallel and arranged in a matrix.

In one embodiment, the thermal pad is a thermal adhesive layer or a thermal grease layer.

In one embodiment, the thermally conductive adhesive layer is a thermally conductive silicone layer.

In one embodiment, the thermally conductive grease layer is a thermally conductive silicone layer.

In one embodiment, the width of the first MOS transistor and the second MOS transistor Degree and length are less than 4 mm.

In one embodiment, the first MOS transistor and the second MOS transistor have a width and a length of 3.3 mm.

In one of the embodiments, the maximum allowable operating current of the ESC is greater than or equal to 30 amps.

In one of the embodiments, the ESC allows a maximum operating current of 35 to 60 amps.

In one embodiment, the upper and lower shells are both metal shells.

In one embodiment, the upper and lower shells are all aluminum shells.

In one embodiment, the outer surface of the upper case is provided with a plurality of heat dissipation fins corresponding to the area of the first MOS;

Or/and, the outer surface of the lower case is provided with a plurality of heat dissipation fins corresponding to the area of the second MOS tube.

In one embodiment, a plurality of the first MOS transistors share a thermal pad;

Or/and, a plurality of the second MOS tubes share a thermal pad.

A mobile platform that includes:

frame;

a plurality of motors mounted on the frame;

a plurality of electronic governors electrically connected to the plurality of motors for controlling a plurality of the plurality of motors;

a controller, communicably connected to the plurality of electronic governors; the controller separately controls an operating state of the motor through a plurality of the electronic governors

Wherein the electronic governor includes a housing and a circuit board mounted in the housing, the circuit board including an upper surface and a lower surface disposed opposite to the upper surface, the upper surface facing One of the inner walls of the housing is disposed, and the lower surface is disposed facing the other opposite inner wall of the housing;

The heat conductive metal piece of the first MOS tube passes through the first thermal pad and the case An inner wall is thermally connected;

The heat conductive metal piece of the second MOS tube is thermally connected to the other opposite inner wall of the housing through the second thermal pad.

Or/and, the number of the second MOS tubes is greater than or equal to six.

In one embodiment, the width and length of the first MOS transistor and the second MOS transistor are both less than 4 mm.

In one of the embodiments, the housing is a metal shell.

In one of the embodiments, the housing is an aluminum housing.

In one embodiment, the outer surface of the housing is provided with a plurality of heat dissipation fins corresponding to the area of the first MOS;

Or/and, the outer surface of the housing is provided with a plurality of heat dissipation fins corresponding to the area of the second MOS tube.

Or/and, a plurality of the second MOS tubes share a thermal pad.

In one of the embodiments, the movable platform is an unmanned aerial vehicle, or an unmanned undercarriage.

DRAWINGS

Figure 1 is an exploded view of the electronic governor of the present invention;

Figure 2 is a perspective view of the electronic governor shown in Figure 1;

Figure 3 is a cross-sectional view taken along line C-C of Figure 2;

4 is a schematic view of a movable platform to which the electronic governor shown in FIG. 1 is applied.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that when a component is referred to as being "fixed" to another component, it can be directly on the other component or the component can be present. When a component is considered to "connect" another component, it can be directly connected to another component or possibly a central component. The terms "vertical," "horizontal," "left," "right," and the like, as used herein, are for illustrative purposes only.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.

In the process of implementing the present invention, the inventors have found that improving the heat dissipation efficiency of the MOS tube can be In order to effectively reduce the size of the electronic governor and increase the maximum operating current of the electronic governor.

The invention provides an electronic governor comprising a housing, a circuit board and a plurality of MOS tubes respectively mounted on opposite surfaces of the circuit board. A heat conductive metal piece is embedded on the top surface of each MOS tube. The thermally conductive metal sheets of the MOS tubes on opposite sides of the circuit board respectively abut against the inner wall of the housing through the thermal pad to transfer heat generated by the MOS tube to the housing.

In the above electronic governor, since the top surface of each MOS tube is embedded with a heat conductive metal piece, the thermal resistance at the top thereof is greatly reduced compared with the conventional MOS tube having a plastic package at the top, which is greatly enhanced. The thermal conductivity of the MOS tube on the heat conduction path. At the same time, the MOS tube conducts heat conduction through the inner wall of the housing of the electronic governor through the thermal pad, respectively, which increases the heat exchange area between the MOS tube and the outside, thereby effectively improving the heat dissipation efficiency of the electronic governor. Since the heat dissipation efficiency of the MOS tube is improved, the MOS tube can be mounted on opposite sides of the circuit board at the same time to reduce the occupation space of the circuit board; and the heat dissipation efficiency of the first MOS tube and the second MOS tube is high. It is convenient to use a smaller size MOS tube, thereby further reducing the footprint of the circuit board, thereby facilitating the miniaturization design of the electronic governor.

In one of the embodiments, the housing includes an upper case and a lower case spliced with the upper case. The lower case and the upper case together form a housing. A circuit board is mounted within the housing.

In one embodiment, the type and size of the MOS tube mounted on opposite sides of the circuit board may be the same or different.

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below can be combined with each other without conflict.

Referring to FIGS. 1 through 3, an electronic governor 100 of an embodiment of the present invention includes an upper case 110, a lower case 120, and a circuit board 130. The lower case 120 is disposed corresponding to the upper case 110. The lower case 120 and the upper case 110 together form a housing. A circuit board 130 is mounted within the housing.

The circuit board 130 includes an upper surface 130a and a lower surface 130b disposed opposite the upper surface 130a. The upper surface 130a is disposed facing an inner wall of the upper case 110, and the lower surface 130b is disposed facing an inner wall of the lower case 120.

The upper surface 130a is provided with a plurality of first MOS tubes 150a, and the lower surface 130b is provided with a plurality of second MOS tubes 150b. The top surface of the first MOS tube 150a and the second MOS tube 150b are embedded with a heat conductive metal piece 150c. The heat conductive metal piece 150c of the first MOS tube 150a is thermally connected to the inner wall of the upper case 110 through the first thermal pad 160a. The heat conductive metal piece 150c of the second MOS tube 150b is thermally connected to the inner wall of the lower case 120 through the second thermal pad 160b.

In the electronic governor 100, the first MOS tube 150a and the second MOS tube 150b are main heat sources, and the top surface of the first MOS tube 150a and the second MOS tube 150b are embedded with a heat conductive metal piece 150c, and A MOS transistor 150a and a second MOS transistor 150b can be directly radiated through the heat conductive metal piece 150c, so that the thermal resistance of the top of the first MOS transistor 150a and the second MOS transistor 150b is compared with the conventional MOS of the plastic package at the top. The thermal resistance of the tube is greatly reduced, and the thermal conductivity of the first MOS tube 150a and the second MOS tube 150b is greatly enhanced. Meanwhile, the first MOS tube 150a and the second MOS tube 150b respectively pass through the first thermal pad 160a. And the second thermal pad 160b is thermally conducted to the upper case 110 and the lower case 120 of the electronic governor 100, thereby increasing the heat exchange area between the first MOS tube 150a and the second MOS and the outside, thereby effectively improving the electronic governor 100. Cooling efficiency. Since the heat dissipation efficiency of the first MOS tube 150a and the second MOS tube 150b is improved, the MOS tube can be simultaneously mounted on opposite sides of the circuit board 130 to reduce the occupied space of the circuit board 130; and, the first MOS The heat dissipation efficiency of the tube 150a and the second MOS tube 150b is high, and the MOS tube of a smaller size is facilitated, thereby further reducing the occupied space of the circuit board 130, thereby facilitating the miniaturization design of the electronic governor 100.

The heat conductive metal piece 150c is directly encapsulated in the first MOS tube 150a and the second MOS tube 150b, and the top surface of the heat conductive metal piece 150c is at least partially exposed. That is, when the first MOS transistor 150a and the second MOS transistor 150b are packaged, the heat conductive metal sheets 150c are directly packaged together.

The installation positions of the first MOS tube 150a and the second MOS tube 150b can be designed according to different needs. For example, in one embodiment, a plurality of the first MOS tubes 150a are disposed opposite to the plurality of the second MOS tubes 150b to further save the space occupied by the circuit board 130, facilitating the small size of the electronic governor 100. Design. In other embodiments, multiple The first MOS tube 150a is interleaved with the plurality of the second MOS tubes 150b to increase the effective heat dissipation area of the single MOS tube, and further improve the heat dissipation efficiency of the MOS tube.

The number of the first MOS tube 150a and the second MOS tube 150b can be set according to actual needs, and a large number of MOS tubes of a small size can be used to replace a large-sized MOS tube of the conventional electronic governor 100 to improve MOS. The heat dissipation efficiency of the tube reduces the occupied space. For example, in the illustrated embodiment, the number of the first MOS tubes 150a is six or more, and the number of the second MOS tubes 150b is six or more.

The relative positions of the number of the first MOS tube 150a and the second MOS tube 150b may be designed according to different requirements. For example, in the illustrated embodiment, the plurality of the first MOS tubes 150a are arranged in parallel and arranged in a matrix. In order to facilitate uniform heat dissipation of the plurality of first MOS tubes 150a. A plurality of the second MOS tubes 150b are arranged in parallel and arranged in a matrix to facilitate uniform heat dissipation of the plurality of second MOS tubes 150b.

Since the heat dissipation efficiency of the MOS tube is greatly improved, the MOS tube can be packaged by a small-sized packaging process. For example, the width and length of the first MOS tube 150a and the second MOS tube 150b are both less than 4 mm, for example, The width and length of the first MOS tube 150a and the second MOS tube 150b may be 4 mm, 3.8 mm, 3.6 mm, 3.5 mm, 3.2 mm, 3.0 mm, 2.8 mm, 2.6 mm, 2.5 mm, and the like. The width and length of the first MOS tube 150a and the second MOS tube 150b may be different. Specifically, in the illustrated embodiment, the first MOS transistor 150a and the second MOS transistor 150b have a width and a length of 3.3 mm.

The maximum allowable operating current of the ESC is greater than or equal to 30 amps, and the number of the first MOS transistor 150a and the second MOS transistor 150b may be increased according to the maximum operating current allowed by the ESC. For example, the maximum operating current allowed by the ESC can be 35 amps, 40 amps, 45 amps, 50 amps, 55 amps, 60 amps, and the like.

The thermal pad is a thermal adhesive layer or a thermal grease layer. The thermal conductive adhesive layer can be made of a thermally conductive adhesive. For example, the thermal conductive adhesive layer is a thermally conductive silicone layer. The thermal grease layer may be made of a resin having better thermal conductivity. For example, the thermal grease layer may be a thermal grease layer.

The arrangement of the thermal pad can be designed according to different requirements. For example, in the illustrated embodiment, the plurality of the first MOS tubes 150a share one thermal pad, and the plurality of the second MOS The tube 150b shares a thermal pad to increase the conduction efficiency of the first MOS tube 150a and the second MOS tube 150b with the upper and

lower shells

110, 120. Of course, in other embodiments, each of the first MOS tubes 150a may individually correspond to one thermal pad, and each of the second MOS tubes 150b may be separately provided with a thermal pad to prevent mutual influence between the MOS tubes.

In order to improve the heat exchange efficiency between the MOS tube and the outside, the upper case 110 and the lower case 120 are both metal shells. For example, in the illustrated implementation, the upper and

lower shells

110, 120 are both aluminum shells. Of course, in other embodiments, the upper case 110 and the lower case 120 may also be other metal shells, such as aluminum alloys, alloys, and the like.

The opening edge of the upper casing 110 is provided with a first upper groove and a second lower groove, and the opening edge of the lower casing 120 is provided with a first lower groove and a second lower groove. The first upper groove is disposed corresponding to the first lower groove, and is collectively spliced into one threading hole 170a. The second upper groove is disposed corresponding to the second lower groove, and is collectively spliced into a receiving hole 170b for receiving a capacitor.

In order to further improve the heat exchange efficiency between the MOS tube and the outside, the outer surface of the upper case 110 is provided with a plurality of heat dissipation fins 180a corresponding to the first MOS. The outer surface of the lower case 120 is provided with a plurality of heat dissipation fins 180b corresponding to the area of the second MOS tube 150b.

Based on the electronic governor 100 described above, the present invention also provides a movable platform that drives the motor using the electronic governor 100 described above. The movable platform is an unmanned aerial vehicle or an unmanned undercarriage.

Referring to FIG. 4 together, the movable platform 10 of the embodiment of the present invention includes a plurality of electronic governors 100, a frame 200, a plurality of motors 300, and a controller 400. A plurality of motors 300 are mounted on the frame 200. A plurality of electronic governors 100 are electrically connected to the plurality of motors 300 for controlling a plurality of the plurality of motors 300. The controller 400 is communicatively coupled to the plurality of electronic governors 100.

The controller 400 controls the operating states of the plurality of motors 300 through a plurality of the electronic governors 100, respectively. Specifically in the illustrated embodiment, the movable platform is an unmanned aerial vehicle, the controller 400 is a flight controller, and the motor 300 is used to drive propeller rotation to provide flight power to the unmanned aerial vehicle.

The above is only the embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformation of the present invention and the contents of the drawings may be directly or indirectly applied to other related technologies. The fields are all included in the scope of patent protection of the present invention.

Claims

An electronic governor characterized by comprising:

case,

a circuit board mounted in the housing, the circuit board including an upper surface and a lower surface disposed opposite to the upper surface, the upper surface being disposed facing one of the inner walls of the housing, the lower surface Facing another opposite inner wall arrangement of the housing,

The upper surface is provided with a plurality of first MOS tubes, and the lower surface is provided with a plurality of second MOS tubes; the top surfaces of the first MOS tubes and the second MOS tubes are each embedded with a heat conductive metal sheet;

The heat conductive metal piece of the first MOS tube is thermally connected to one of the inner walls of the housing through the first thermal pad;

The heat conductive metal piece of the second MOS tube is thermally connected to the other opposite inner wall of the housing through the second thermal pad.
The electronic governor according to claim 1, wherein the heat conductive metal piece is directly encapsulated in the first MOS tube and the second MOS tube, and a top surface of the heat conductive metal piece is at least partially exposed. .
The electronic governor according to claim 1, wherein a plurality of said first MOS tubes are disposed opposite to said plurality of said second MOS tubes;

Alternatively, a plurality of the first MOS transistors are interleaved with a plurality of the second MOS transistors.
The electronic governor according to claim 1, wherein the number of the first MOS tubes is greater than or equal to six;

Or/and, the number of the second MOS tubes is greater than or equal to six.
The electronic governor according to claim 1, wherein a plurality of said first MOS tubes are arranged in parallel and arranged in a matrix;

Or/and, a plurality of the second MOS tubes are arranged in parallel and arranged in a matrix.
The electronic governor according to claim 1, wherein the thermal pad is a thermal adhesive layer or a thermal grease layer.
The electronic governor according to claim 6, wherein the thermal conductive adhesive layer is a thermally conductive silicone layer.
The electronic governor of claim 6 wherein said thermally conductive grease layer is a thermally conductive silicone layer.
The electronic governor according to claim 1, wherein the first MOS tube and the second MOS tube have a width and a length of less than 4 mm.
The electronic governor according to claim 9, wherein said first MOS transistor and said second MOS transistor have a width and a length of 3.3 mm.
The electronic governor of claim 1 wherein said ESC allows a maximum operating current of greater than or equal to 30 amps.
The electronic governor of claim 11 wherein said ESC allows a maximum operating current of 35 to 60 amps.
The electronic governor of claim 1 wherein said housing is a metal shell.
The electronic governor of claim 13 wherein said housing is an aluminum housing.
The electronic governor according to claim 1, wherein an outer surface of the casing is provided with a plurality of fins corresponding to the first MOS;

Or/and, the outer surface of the housing is provided with a plurality of heat dissipation fins corresponding to the area of the second MOS tube.
The electronic governor according to claim 1, wherein a plurality of said first MOS tubes share a thermal pad;

Or/and, a plurality of the second MOS tubes share a thermal pad.
A mobile platform, comprising:

frame;

a plurality of motors mounted on the frame;

a plurality of electronic governors electrically connected to the plurality of motors for controlling a plurality of the plurality of motors;

a controller communicatively coupled to the plurality of electronic governors; The electronic governor separately controls the working state of the motor

Wherein the electronic governor includes a housing and a circuit board mounted in the housing, the circuit board including an upper surface and a lower surface disposed opposite to the upper surface, the upper surface facing One of the inner walls of the housing is disposed, and the lower surface is disposed facing the other opposite inner wall of the housing;

The upper surface is provided with a plurality of first MOS tubes, and the lower surface is provided with a plurality of second MOS tubes; the top surfaces of the first MOS tubes and the second MOS tubes are each embedded with a heat conductive metal sheet;

The heat conductive metal piece of the first MOS tube is thermally connected to one of the inner walls of the housing through the first thermal pad;

The heat conductive metal piece of the second MOS tube is thermally connected to the other opposite inner wall of the housing through the second thermal pad.
The electronic governor according to claim 17, wherein the heat conductive metal piece is directly encapsulated in the first MOS tube and the second MOS tube, and a top surface of the heat conductive metal piece is at least partially exposed. .
The electronic governor according to claim 17, wherein a plurality of said first MOS tubes are disposed opposite to said plurality of said second MOS tubes;

Alternatively, a plurality of the first MOS transistors are interleaved with a plurality of the second MOS transistors.
The electronic governor according to claim 17, wherein the number of the first MOS tubes is greater than or equal to six;

Or/and, the number of the second MOS tubes is greater than or equal to six.
The electronic governor according to claim 17, wherein a plurality of said first MOS tubes are arranged in parallel and arranged in a matrix;

Or/and, a plurality of the second MOS tubes are arranged in parallel and arranged in a matrix.
The electronic governor according to claim 17, wherein the thermal pad is a thermal adhesive layer or a thermal grease layer.
The electronic governor according to claim 22, wherein the thermal conductive adhesive layer is a thermally conductive silicone layer.
The electronic governor according to claim 22, wherein said thermally conductive grease layer is a thermally conductive silicone layer.
The electronic governor according to claim 17, wherein said first MOS transistor and said second MOS transistor have a width and a length of less than 4 mm.
The electronic governor according to claim 25, wherein said first MOS transistor and said second MOS transistor have a width and a length of 3.3 mm.
The electronic governor of claim 17 wherein said ESC allows a maximum operating current greater than or equal to 30 amps.
The electronic governor according to claim 27, wherein said ESC allows a maximum operating current of 35 to 60 amps.
The electronic governor of claim 28 wherein said housing is a metal shell.
The electronic governor of claim 29 wherein said housing is an aluminum housing.
The electronic governor according to claim 17, wherein the outer surface of the casing is provided with a plurality of heat dissipating fins corresponding to the region of the first MOS;

Or/and, the outer surface of the housing is provided with a plurality of heat dissipation fins corresponding to the area of the second MOS tube.
The electronic governor according to claim 17, wherein a plurality of said first MOS tubes share a thermal pad;

Or/and, a plurality of the second MOS tubes share a thermal pad.
The mobile platform of claim 17, wherein the movable platform is an unmanned aerial vehicle or an unmanned undercarriage.