WO2017117937A1 - Dispositif de dissipation de chaleur pour puce - Google Patents

Dispositif de dissipation de chaleur pour puce Download PDF

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Publication number
WO2017117937A1
WO2017117937A1 PCT/CN2016/088209 CN2016088209W WO2017117937A1 WO 2017117937 A1 WO2017117937 A1 WO 2017117937A1 CN 2016088209 W CN2016088209 W CN 2016088209W WO 2017117937 A1 WO2017117937 A1 WO 2017117937A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat dissipation
chip
heat dissipating
components
Prior art date
Application number
PCT/CN2016/088209
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English (en)
Chinese (zh)
Inventor
鲁进
李帅
么东升
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2017117937A1 publication Critical patent/WO2017117937A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Definitions

  • the present application relates to, but is not limited to, the field of electronic device heat dissipation technology, and relates to a chip heat sink.
  • the internal electronic components generate a large amount of heat, which causes the temperature of each device inside the device to rise. If the temperature of the device is too high, the life may be reduced or even damaged.
  • a conventional heat sink generally has a heat dissipation fin welded to a substrate, and can only be applied to a heat dissipation scene in a single wind direction; however, as the electronic device is integrated more and more, the internal air passage of the device is also coming. The more complicated, when the air channel above the power chip is more complicated, the heat sink design requirements for the power device are more demanding, and the conventional heat sink cannot meet the heat dissipation requirement.
  • the present application provides a chip heat sink, which can be applied to a multi-wind direction heat dissipation scene to improve heat dissipation efficiency of the chip.
  • the present application provides a chip heat sink, comprising: a plurality of stacked heat dissipating components, each layer of heat dissipating components comprising: a heat dissipating substrate and heat dissipating fins mounted on the heat dissipating substrate; wherein two adjacent heat dissipating components are connected to each other Together.
  • the heat dissipating fins of the adjacent two layers of heat dissipating components have an angle greater than 0° and less than 180°.
  • the heat dissipation fins of two adjacent heat dissipation components are perpendicular to each other.
  • a heat dissipation conduit is disposed in the heat dissipation substrate of each layer of the heat dissipation component.
  • the heat dissipation substrates of the adjacent two layers of heat dissipation components are connected by a heat pipe.
  • the heat dissipation fins are soldered on the heat dissipation substrate.
  • the heat dissipation fin is inserted on the heat dissipation substrate.
  • the beneficial effects of the present application are embodied in the following aspects:
  • the present application can be applied to a plurality of heat dissipation scenarios of different wind directions, and is more adaptable to a single heat dissipation scene than a conventional heat sink, and can better meet the heat dissipation requirements of electronic device devices.
  • Other aspects will be apparent upon reading and understanding the drawings and detailed description.
  • Figure 1 is a conventional air-cooled radiator that is only suitable for a single wind direction cooling scene
  • FIG. 2 is a schematic structural view of a chip heat sink applying two heat dissipation scenarios of mutually perpendicular wind directions according to Embodiment 1 of the present application;
  • FIG. 3 is a schematic structural diagram of a chip heat sink applying three heat dissipation scenarios of mutually perpendicular and staggered wind directions according to Embodiment 2 of the present application;
  • FIG. 4 is a schematic structural view of a chip heat sink according to Embodiment 3 of the present application.
  • the present application provides a chip heat sink comprising: a plurality of stacked heat dissipating components, as shown in FIGS. 2 to 4, each of the heat dissipating components includes: a heat dissipating substrate 1 and a heat dissipating fin 2 mounted on the heat dissipating substrate 1; Two adjacent heat dissipation components are connected to each other.
  • the present application designs the angle between the heat dissipation fins 2 of the adjacent two heat dissipation components to be greater than 0° and less than 180° according to specific needs.
  • the chip heat sink of this embodiment includes two layers of heat dissipating components, and the heat dissipating fins 2 of the two layers of heat dissipating components are perpendicular to each other to accommodate two heat dissipation scenes of mutually perpendicular wind directions.
  • the chip heat sink of this embodiment includes three layers of heat dissipating components, and the heat dissipating fins 2 of two adjacent heat dissipating components are perpendicular to each other to accommodate three heat dissipation scenes that are perpendicular to each other and staggered in the wind direction.
  • the chip heat sink of the embodiment includes two heat dissipating components, and the heat dissipating fins 2 of the two heat dissipating components are perpendicular to each other, and the heat dissipating substrates 1 of the two heat dissipating components are connected through the heat pipe 3 to improve heat dissipation. effectiveness.
  • the heat-dissipating substrate 1 of the two-layer heat dissipating component provided in the above third embodiment can be applied to the multi-layer heat dissipating component through the heat pipe, so that the heat dissipating substrate 1 of the adjacent two-layer heat dissipating component of the multi-layer heat dissipating component is Connected by heat pipes to improve heat dissipation efficiency.
  • the present application provides a heat dissipation conduit in the heat dissipation substrate 1 of each of the heat dissipation components of the multilayer heat dissipation assembly to improve the heat conduction capability of the heat dissipation substrate.
  • the heat dissipation fins 2 of the present application When the heat dissipation fins 2 of the present application are connected to each of the heat dissipation substrates 1 , they may be welded or may be plugged, but the connection manner is not limited thereto.
  • the above technical solution can be applied to a multi-wind direction heat dissipation scene to improve the heat dissipation efficiency of the chip.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention porte sur un dispositif de dissipation de chaleur pour puce, qui comprend : de multiples couches d'ensemble de dissipation de chaleur agencées en une pile. Chaque couche d'ensemble de dissipation de chaleur comprend : un substrat de dissipation de chaleur (1) et une ailette de dissipation de chaleur (2) montée sur le substrat de dissipation de chaleur (1). Dans chaque paire de couches d'ensemble de dissipation de chaleur adjacentes, les deux couches sont reliées l'une à l'autre. L'invention est applicable à un scénario dans lequel une dissipation de chaleur doit être effectuée dans de multiples directions, ce qui permet d'augmenter l'efficacité de dissipation de chaleur pour une puce.
PCT/CN2016/088209 2016-01-04 2016-07-01 Dispositif de dissipation de chaleur pour puce WO2017117937A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201620006640.8 2016-01-04
CN201620006640.8U CN205452264U (zh) 2016-01-04 2016-01-04 一种芯片散热器

Publications (1)

Publication Number Publication Date
WO2017117937A1 true WO2017117937A1 (fr) 2017-07-13

Family

ID=56600961

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/088209 WO2017117937A1 (fr) 2016-01-04 2016-07-01 Dispositif de dissipation de chaleur pour puce

Country Status (2)

Country Link
CN (1) CN205452264U (fr)
WO (1) WO2017117937A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109413931A (zh) * 2017-08-18 2019-03-01 泽鸿(广州)电子科技有限公司 散热装置
CN108566760A (zh) * 2018-01-16 2018-09-21 东莞市远鑫电子科技有限公司 不规则状散热器及其生产工艺
CN111370378B (zh) * 2020-03-17 2022-08-05 电子科技大学 一种芯片散热器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2839943Y (zh) * 2005-06-20 2006-11-22 中兴通讯股份有限公司南京分公司 空气热交换器及具有该空气热交换器的通讯户外机柜
US7167364B2 (en) * 2003-03-27 2007-01-23 Rotys Inc. Cooler with blower between two heatsinks
CN1967437A (zh) * 2005-11-16 2007-05-23 富准精密工业(深圳)有限公司 散热器
CN101146423A (zh) * 2006-09-15 2008-03-19 富准精密工业(深圳)有限公司 散热装置
CN203167506U (zh) * 2013-03-19 2013-08-28 深圳市汇川技术股份有限公司 散热结构及具有该散热结构的设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7167364B2 (en) * 2003-03-27 2007-01-23 Rotys Inc. Cooler with blower between two heatsinks
CN2839943Y (zh) * 2005-06-20 2006-11-22 中兴通讯股份有限公司南京分公司 空气热交换器及具有该空气热交换器的通讯户外机柜
CN1967437A (zh) * 2005-11-16 2007-05-23 富准精密工业(深圳)有限公司 散热器
CN101146423A (zh) * 2006-09-15 2008-03-19 富准精密工业(深圳)有限公司 散热装置
CN203167506U (zh) * 2013-03-19 2013-08-28 深圳市汇川技术股份有限公司 散热结构及具有该散热结构的设备

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Publication number Publication date
CN205452264U (zh) 2016-08-10

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