WO2016185679A1 - 化学センサ - Google Patents
化学センサ Download PDFInfo
- Publication number
- WO2016185679A1 WO2016185679A1 PCT/JP2016/002224 JP2016002224W WO2016185679A1 WO 2016185679 A1 WO2016185679 A1 WO 2016185679A1 JP 2016002224 W JP2016002224 W JP 2016002224W WO 2016185679 A1 WO2016185679 A1 WO 2016185679A1
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- WIPO (PCT)
- Prior art keywords
- mof
- chemical sensor
- mil
- gate electrode
- field effect
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
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- G—PHYSICS
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- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component
- G01N33/0047—Organic compounds
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
- G01N27/4145—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS specially adapted for biomolecules, e.g. gate electrode with immobilised receptors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
Definitions
- This disclosure relates to a chemical sensor capable of detecting chemical molecules such as volatile organic compounds contained in a sample.
- a chemical field effect transistor (ChemFET), an ion selective field effect transistor (ISFET), or the like is used as a chemical sensor for detecting a component such as a chemical molecule, DNA, or protein contained in a sample.
- a component such as a chemical molecule, DNA, or protein contained in a sample.
- a sensitive passivation layer is provided on the gate electrode. Chemical molecules and the like contained in the sample are adsorbed on the passivation layer. The amount of current flowing between the source electrode and the drain electrode of the field effect transistor changes due to the chemical molecules adsorbed on the passivation layer. Thereby, the chemical field effect transistor can detect chemical molecules.
- Patent Documents 1-3 there are, for example, Patent Documents 1-3.
- the chemical sensor in the present disclosure includes a field effect transistor, a detection region provided on the field effect transistor, and a sensitive film provided in the detection region.
- the sensitive film includes a metal organic structure.
- the chemical sensor according to the present disclosure can accurately detect a component to be detected in a sample.
- the perspective view which shows the chemical sensor in embodiment Sectional drawing which shows the chemical sensor in embodiment Sectional drawing which shows the other example of the chemical sensor in embodiment.
- FIG. 1 is a perspective view schematically showing a chemical sensor 50 in the present embodiment.
- FIG. 2 is a cross-sectional view schematically showing a cross section taken along line 2-2 of the chemical sensor 50 in FIG.
- the chemical sensor 50 detects a detection target component such as a chemical molecule, a nucleic acid, or a peptide contained in the sample.
- Chemical molecules are volatile organic compounds and the like.
- the sample is, for example, human or animal breath or blood.
- the sample is not limited to a sample derived from a living body, and the sample may be exhaust gas, air, or the like.
- volatile organic compound examples include ketones, amines, alcohols, aromatic hydrocarbons, aldehydes, esters, organic acids, hydrogen sulfide, methyl mercaptan, and disulfide.
- Volatile organic compounds include alkanes, alkenes, alkynes, dienes, alicyclic hydrocarbons, allenes, ethers, carbonyls, carbanio, peptides, polynuclear aromatics, heterocyclic rings, organic derivatives, biomolecules, metabolites, isoprene, Isoprenoids and derivatives thereof may be used.
- the molecular weight of the volatile organic compound is preferably 15 or more and 500 or less, and more preferably 30 or more and 400 or less from the viewpoint of volatility.
- volatile organic compounds in a broad sense are supervolatile organic compounds (VVOC, boiling point 0 ° C.-50-100 ° C.), volatile organic compounds (VOC, boiling point 50-100 ° C.-240 ° C.). 260 ° C.), semi-volatile organic compounds (SVOC, boiling point 240-260 ° C. to 380-400 ° C.), and particulate matter (POM, boiling point 380 ° C. or higher).
- VVOC supervolatile organic compounds
- VOC volatile organic compounds
- 260 ° C. volatile organic compounds
- SVOC semi-volatile organic compounds
- POM particulate matter
- VVOCs are formaldehyde (molecular weight 30, boiling point ⁇ 19.2 ° C.), acetaldehyde (molecular weight 44, boiling point 20.2 ° C.), dichloromethane (molecular weight 85, boiling point 40 ° C.).
- Typical VOCs are toluene (molecular weight 92, boiling point 110.7 ° C), xylene (molecular weight 106, boiling point 144 ° C), benzene (molecular weight 78, boiling point 80.1 ° C), styrene (molecular weight 104, boiling point 145.1 ° C). ) Etc.
- Typical SVOCs include tributyl phosphate (molecular weight 266, boiling point 289 ° C.), dioctyl phthalate (molecular weight 391, boiling point 370 ° C.), and the like.
- a volatile organic compound simply means a volatile organic compound in a broad sense, and includes VVOC, VOC, SVOC, and POM.
- the boiling point of the volatile organic compound is preferably ⁇ 160 ° C. or higher and 400 ° C. or lower.
- the chemical sensor 50 includes a field effect transistor 30 having a floating gate electrode 11 and a counter electrode 12, and a sensitive film 31.
- the floating gate electrode 11 indicates an electrically floating gate electrode.
- the field effect transistor 30 is preferably a MOSFET (Metal Oxide Semiconductor Field Effect Transistor).
- MOSFET Metal Oxide Semiconductor Field Effect Transistor
- the field effect transistor 30 has a semiconductor substrate 13 having p-type doping polarity.
- a material for the semiconductor substrate 13 for example, silicon, silicon carbide, gallium arsenide, gallium arsenide phosphorus, germanium, or gallium nitride can be used.
- Diffusion regions 14 and 15 having n-type doping polarity are formed on the first surface 13A of the semiconductor substrate 13.
- the diffusion region 14 is arranged separately from the diffusion region 15.
- the diffusion region 14 is a source.
- the diffusion region 14 as the source is formed using, for example, metal silicide.
- the metal silicide for example, nickel, cobalt, platinum, or palladium silicide can be used.
- a source electrode 16 is connected to the diffusion region 14.
- the diffusion region 15 is a drain.
- a drain electrode 17 is connected to the diffusion region 15.
- the diffusion region 15 that is the drain may be formed using the same material as the diffusion region 14 that is the source.
- the source electrode 16 for example, a conductive material such as copper, aluminum, titanium, titanium nitrogen, tungsten, zinc oxide, or tin oxide can be used. The same material as the source electrode 16 can be used for the drain electrode 17.
- the portion of the first surface 13A between the diffusion region 14 and the diffusion region 15 is a gate region.
- a gate oxide 18 is provided on the gate region.
- the gate oxide 18 for example, silicon dioxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, or the like can be used.
- a high dielectric constant film may be used as the gate oxide 18.
- High-k material for example, hafnium silicate, nitrogen-added hafnium aluminate, hafnium oxide, yttrium oxide, lanthanum oxide, or dysprosium oxide can be used.
- a floating gate electrode 11 is provided on the gate oxide 18.
- a material of the floating gate electrode 11 for example, a conductive metal can be used.
- the floating gate electrode 11 for example, titanium nitride, aluminum, ruthenium, tungsten, silicon tantalum nitride, gold, or platinum can be used.
- the floating gate electrode 11 may be formed using polysilicon.
- the length of the floating gate electrode 11 in the gate length direction is preferably 1 nm or more and 500 ⁇ m or less. Furthermore, the length of the floating gate electrode 11 in the gate length direction is more preferably 30 nm or more and 100 ⁇ m or less. The length of the floating gate electrode 11 in the gate width direction is preferably 1 nm or more and 500 ⁇ m or less. Furthermore, the length of the floating gate electrode 11 in the gate width direction is more preferably 30 nm or more and 100 ⁇ m or less.
- the gate length direction indicates a direction along a line connecting the source electrode 16 and the drain electrode 17, and the gate width direction is substantially the same as the gate length direction in a plane parallel to the first surface 13A. It is the direction that intersects vertically.
- the field effect transistor 30 is covered with an insulator layer 19 so that a part (upper surface) of the floating gate electrode 11, the source electrode 16, and the drain electrode 17 is exposed.
- the insulator layer 19 is formed of the same material as the gate oxide 18, for example.
- the counter electrode 12 is provided so as to face the floating gate electrode 11. A hollow region is provided between the floating gate electrode 11 and the counter electrode 12.
- the counter electrode 12 As the material of the counter electrode 12, for example, a conductive metal can be used.
- the counter electrode 12 may be formed of titanium nitride, aluminum, ruthenium, tungsten, silicon tantalum nitride, gold, or platinum.
- the counter electrode 12 may be made of the same material as that of the floating gate electrode 11.
- the distance between the floating gate electrode 11 and the counter electrode 12 is preferably 10 nm or more and 10 ⁇ m or less. Furthermore, the distance between the floating gate electrode 11 and the counter electrode 12 is more preferably 10 nm or more and 500 nm or less.
- the length of the counter electrode 12 in the gate length direction is preferably 1 nm or more and 500 ⁇ m or less. Furthermore, the length of the counter electrode 12 in the gate length direction is more preferably 30 nm or more and 100 ⁇ m or less. The length of the counter electrode 12 in the gate width direction is preferably 1 nm or more and 500 ⁇ m or less. Further, the length of the counter electrode 12 in the gate width direction is more preferably 30 nm or more and 100 ⁇ m or less. The length of the counter electrode 12 in the gate length direction is preferably larger than the gate length of the floating gate electrode 11. The length of the counter electrode 12 in the gate width direction is preferably larger than the length of the floating gate electrode 11 in the gate width direction. The area of the counter electrode 12 is preferably larger than the area of the floating gate electrode 11.
- a side wall 20 is formed between the floating gate electrode 11 and the counter electrode 12.
- a region surrounded by the floating gate electrode 11, the counter electrode 12, and the side wall 20 is a detection region 21.
- the sample is filled in the detection region 21.
- the detection region 21 is preferably a part of a flow path through which the sample flows.
- the side wall 20 may be a part of the counter electrode 12.
- a sensitive film 31 is provided in the detection area 21, a sensitive film 31 is provided.
- the sensitive film 31 is provided on each of the upper surface of the floating gate electrode 11 and the lower surface of the counter electrode 12.
- the detection region 21 may be provided by being pulled out from the upper portion of the floating gate electrode 11.
- the sensitive film 31 captures the detection target component contained in the sample.
- the sensitive film 31 includes a metal organic structure (MOF: Metal Organic Frameworks).
- the metal organic structure is a material having a porous structure having a high specific surface area.
- the porous structure is formed by the interaction of metal ions and organic ligands. Since it can be adjusted to have a pore size suitable for capturing the detection target component, the metal organic structure selectively has high affinity in capturing the detection target component such as a chemical molecule.
- metal ions can be used for the metal organic structure. Therefore, metal ions can impart functions such as magnetism, electrical conductivity, thermal conductivity, catalytic properties, dielectric properties, redox properties, photophysical properties, and chemical reactivity to the metal organic structure.
- the designed organic ligand can impart functions such as asymmetry, hydrophobicity / hydrophilicity, photoresponsiveness, chemical bonding, and chemical reactivity to the metal organic structure.
- the metal organic structure can be adjusted to have an affinity suitable for capturing the detection target component. Therefore, the metal organic structure can selectively capture a detection target component such as a chemical molecule. Therefore, the chemical sensor 50 can detect the detection target component with high accuracy.
- metal organic structures examples include MOF801-P, MOF801-SC, MOF-802, UiO-66, MOF-808, MOF-841, DUT-67, PIZOF-2, MOF-804, MOF-805, and MOF.
- the metal organic structure may contain one or more metal ions of metal ions such as Zn 2+ , Co 2+ , Ni 2+ , and Cu 2+ .
- the organometallic structure may contain two or more kinds of metal ions.
- the metal organic structure may be composed of an organic ligand such as an oxygen donor ligand or a nitrogen donor ligand.
- the organic ligand may be 1,4-benzenecarboxylic acid, 4,4′-bipyridine, imidazole, and the like.
- the organic ligand preferably has a functional group showing affinity with the component to be detected.
- Organic ligands include amino groups, aldehyde groups, hydrocarbon groups, carboxyl groups, hydroxy groups, acyl groups, amide groups, carbonyl groups, imino groups, cyano groups, azo groups, thiol groups, sulfo groups, nitro groups, alkyl groups, It may have a functional group such as vinyl group, Allyl group, Aryl group, phenyl group, naphthyl group, araalkyl group, benzyl group, cycloalkyl group, alkoxy group, methoxy group, and ethoxy group.
- the metal organic structure may be composed of two or more kinds of organic ligands. The combination of the metal ion and the organic ligand may be 1: 1 or a different ratio.
- the metal organic structure preferably captures the detection target component by chemical or physical bonding.
- the metal organic structure preferably captures the detection target component by a covalent bond, a coordinate bond, an ionic bond, a hydrogen bond, a van der Waals bond, or an intermolecular force.
- the pore diameter of the metal organic structure is preferably 0.1 nm or more and 20 nm or less. Furthermore, the pore diameter of the metal organic structure is more preferably 0.4 nm or more and 6 nm or less.
- the pore diameter of the metal organic structure is preferably larger than the diameter of the detection target component such as a chemical molecule.
- the shape of the pores of the metal organic structure may be a bottleneck type, a straight pipe type, or a horn type.
- the pores of the metal organic structure may also have flexibility.
- the BET specific surface area of the metal organic structure is preferably 500 m 2 / g or more. Furthermore, the BET specific surface area of the metal organic structure is more preferably 6000 m 2 / g or more. The BET specific surface area is a specific surface area determined by the BET method.
- the metal organic structure can be synthesized by a solution method, a microwave method, an ultrasonic method, or a solid phase mixing method. From the viewpoint of ease of synthesis and controllability of crystal size, a diffusion method, a stirring method, or a hydrothermal method can be used as a solution method.
- the sensitive film 31 may be made of a material other than the metal organic structure as long as it can capture the detection target component.
- a covalent organic structure COF: Covalent Organic Frameworks
- ZIF zeolite type imidazolate structure
- MOP Metal Organic Polyhedron
- PCP Porous Coordination Polymer
- the sensitive film 31 Only the metal organic structure may be used as the sensitive film 31.
- a plurality of types of metal organic structures may be laminated.
- a plurality of metal organic structures, covalently bonded organic structures, zeolitic imidazolate structures, metal organic polyhedra, and porous coordination polymers may be combined.
- a plurality of metal organic structures, covalently bonded organic structures, zeolite type imidazolate structures, metal organic polyhedra, and porous coordination polymers may be laminated.
- membrane 31 should just be provided in the inside of the detection area
- the sensitive film 31 may be provided on one of the upper surface of the floating gate electrode 11 or the lower surface of the counter electrode 12.
- the sensitive film 31 may be provided on a part of the side wall 20.
- the sensitive film 31 provided on the upper surface of the floating gate electrode 11, the lower surface of the counter electrode 12, and a part of the side wall 20 may be made of the same material, but may be made of different materials.
- the thickness of the sensitive film 31 is preferably 0.1 nm or more and 1 ⁇ m or less. Furthermore, the thickness of the sensitive film 31 is more preferably 10 nm or more and 100 nm or less.
- the sensitive film 31 can be formed by a casting method, a spin coating method, a sputtering method, a vapor deposition method, a liquid phase growth method, a vapor phase growth method, a printing method, a pasting method, an electric field polymerization method, or the like.
- a bonding layer may be provided between the sensitive film 31 and the floating gate electrode 11.
- a bonding layer may be provided between the sensitive film 31 and the counter electrode 12.
- the sensitive film 31 is preferably formed after the counter electrode 12 is formed.
- the source electrode 16 and the drain electrode 17 are connected via a power supply device 32.
- the chemical sensor 50 is connected to a measuring device 33 that measures a current flowing between the source electrode 16 and the drain electrode 17.
- the counter electrode 12 is connected to a power supply device 34 that controls the charge of the floating gate electrode 11.
- a signal amplifier may be connected to the chemical sensor 50.
- the chemical sensor 50 may be connected to a negative feedback circuit and a temperature compensation circuit.
- the chemical sensor 50 can control the amount of current flowing from the source electrode 16 to the drain electrode 17 by controlling the charge of the floating gate electrode 11 by the power supply device 34.
- a sample is inserted into the detection region 21 of the chemical sensor 50.
- the detection target component contained in the sample is captured by the sensitive film 31.
- the chemical sensor 50 can detect the detection target component by detecting a change in the current value.
- the chemical sensor 50 can also detect the concentration of the detection target component by measuring the amount of change in the current value.
- the chemical sensor 50 may detect the detection target component by measuring the voltage value applied to the counter electrode 12 when the current value flowing from the source electrode 16 to the drain electrode 17 becomes constant.
- the chemical sensor 50 may control the potential of the semiconductor substrate 13.
- the chemical sensor 50 may ground the semiconductor substrate 13.
- the chemical sensor 50 may be operated with direct current or may be operated with alternating current.
- a through hole 41 may be formed in the counter electrode 12. There may be one or more through holes 41. By providing the through hole 41, the sample is efficiently filled into the hollow region.
- a flow from the outside to the inside of the detection area 21 may be generated.
- Pumps, blowers, and convection can be used to generate the flow.
- the sample in the detection region 21 may be flowing or may be stationary.
- the sensitive film 31 is preferably cooled so that more detection target components can be captured. Therefore, the chemical sensor 50 may include a cooler 35. In detecting the detection target component, the temperature of the sensitive film 31 is preferably ⁇ 80 ° C. or higher and 25 ° C. or lower. Further, in detection, the temperature of the sensitive film 31 is more preferably ⁇ 15 ° C. or higher and 25 ° C. or lower.
- the cooler 35 is provided in the counter electrode 12, for example.
- the chemical sensor 50 may further include a heater 36.
- a heater for example, a resistance element heater, an infrared heater, or a carbon heater can be used.
- the temperature of the sensitive film 31 is preferably 40 ° C. or higher and 500 ° C. or lower. Furthermore, in detection, it is more preferably 40 ° C. or higher and 200 ° C. or lower.
- the heater 36 is provided in the counter electrode 12, for example.
- thermoelectric element may be used to cool or heat the sensitive film 31.
- the thermoelectric element can easily reverse the cooling surface and the heating surface. Therefore, the thermoelectric element serves as a cooler 35 and a heater 36.
- the chemical sensor 50 may be further provided with a temperature sensor.
- the chemical sensor 50 can perform temperature compensation on the detection result based on the temperature of the chemical sensor measured by the temperature sensor.
- the detection target component captured by the sensitive film 31 can be removed with a clean gas that does not contain the detection target component.
- the clean gas is, for example, dry nitrogen gas, dry air, or calibration gas.
- the metal organic structure preferably contains an organic ligand exhibiting hydrophobicity in order to efficiently detect a sample containing moisture. Further, moisture may be removed from the sample before detecting the detection target component.
- the chemical sensor 50 may further include a humidity sensor.
- the chemical sensor 50 may be initialized before detecting the detection target component.
- the chemical sensor 50 may be initialized using the detection target component before detecting the detection target component.
- the chemical sensor 50 may be initialized by raising the temperature of the chemical sensor 50 before detecting the detection target component.
- the chemical sensor 50 may be provided with control units 37 and 38 for controlling the chemical sensor 50 electrically or mechanically.
- the control unit 37 is connected to the power supply device 32.
- the control unit 38 is connected to the power supply device 34.
- the chemical sensor 50 may be provided with an analysis unit 39 for analyzing the detected result.
- the analysis unit 39 is connected to the measuring device 33, for example.
- the chemical sensor 50 may perform multivariate analysis such as principal component analysis, absolute value expression analysis, discriminant analysis, factor analysis, cluster analysis, and conjoint analysis, or may perform other statistical analysis such as multiple regression analysis. Good.
- the chemical sensor 50 may be provided with an electromagnetic shield. By providing an electromagnetic shield, electromagnetic noise from the outside can be shielded, so that the chemical sensor 50 can efficiently detect a weak signal.
- the chemical sensor 50 can efficiently detect the detection target component in the sample by providing the sensitive film 31 including the metal organic structure.
- the floating gate electrode 11 as the gate electrode, it is possible to accurately detect the change in the work function of the detection region due to the capture of the detection target component.
- FIG. 4 is a perspective view schematically showing a chemical sensor 60 in a first modification of the present embodiment.
- the chemical sensor 60 in this modification has a configuration in which a plurality of chemical sensors 50 according to the embodiment are combined. About another structure, it is the same as that of the chemical sensor 50 shown in embodiment. About the same structure as embodiment, description is abbreviate
- the chemical sensor 60 is provided with a plurality of chemical sensors 50 on one semiconductor substrate 13. One region separated by a dotted line is one chemical sensor 50.
- the chemical sensor 60 includes a plurality of field effect transistors 30 formed on one semiconductor substrate 13.
- the detection regions 21 are connected to the chemical sensors 50 arranged side by side.
- the chemical sensor 60 has a flow path through which the sample flows.
- the cooler 35 and the heater 36 are provided separately for each chemical sensor 50.
- the cooler 35 and the heater 36 may be connected by chemical sensors 50 arranged side by side.
- the chemical sensor 60 can be reduced in size.
- the chemical sensor 50 may arrange a plurality of field effect transistors 30 one-dimensionally, two-dimensionally or three-dimensionally.
- a plurality of field effect transistors may be arranged in a linear shape, a lattice shape, a concentric circle shape, a radial shape, or a random shape.
- the plurality of field effect transistors 30 may be arranged in parallel to the sample flow, or may be arranged at an angle with respect to the sample flow.
- the chemical sensor 50 may include a plurality of sensitive films 31 in each of the plurality of field effect transistors 30.
- the chemical sensor 50 may include the sensitive film 31 made of the same material in each of the plurality of field effect transistors 30 or may include the sensitive film 31 made of different materials.
- the chemical sensor 60 can improve the detection accuracy of the detection target component.
- the chemical sensor 60 can detect a plurality of components to be detected at the same time by providing different types of sensitive films 31 on each chemical sensor 50.
- FIG. 5 is a cross-sectional view schematically showing a chemical sensor 70 according to a second modification of the present embodiment.
- the chemical sensor 70 in this modification is different from the chemical sensor 50 of the embodiment in that a gate electrode 71 is provided instead of the floating gate electrode 11.
- a gate electrode 71 is provided instead of the floating gate electrode 11.
- Other configurations and operations are the same as those in the embodiment.
- description is abbreviate
- a gate electrode 71 is provided on the gate oxide 18.
- a frame 72 is formed on the gate electrode 71 so as to form the detection region 21.
- the frame 72 is made of resin or the like. At this time, the frame body 72 is provided such that a part of the gate electrode 71 is exposed from the frame body 72.
- the sensitive film 31 is provided on the gate electrode 71.
- the gate electrode 71 is connected to the power supply device 34.
- the power supply device 34 controls the voltage applied to the gate electrode 71.
- the chemical sensor 70 can detect the detection target component by measuring a change in the value of the current flowing from the source electrode 16 to the drain electrode 17.
- the chemical sensor 70 may detect the detection target component by measuring the voltage value applied to the gate electrode 71 when the current value flowing from the source electrode 16 to the drain electrode 17 becomes constant.
- the chemical sensor 70 may detect the detection target component by measuring a change in threshold voltage.
- the frame 72 may have a through hole.
- the basic operation method and configuration of the chemical sensor 70 can be the same as those of the other chemical sensors 50 and 60 described in the embodiment.
- the field effect transistor 30 is a p-type field effect transistor, but is not limited thereto.
- the field effect transistor 30 may be an n-type field effect transistor.
- the field effect transistor 30 is not limited to a MOSFET.
- the field effect transistor 30 may be an organic thin film transistor or an electric double layer transistor using an ionic liquid.
- the field effect transistor 30 may be an enhancement type or a depletion type.
- the chemical sensor of the present disclosure is useful for detecting chemical molecules such as volatile organic compounds.
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Abstract
Description
図1は、本実施の形態における化学センサ50を模式的に示す斜視図である。図2は、図1における化学センサ50の2-2線における断面を模式的に示す断面図である。
以下、本実施の形態の第1変形例について説明する。
以下、本実施の形態の第2変形例について説明する。
12 対向電極
13 半導体基板
14,15 拡散領域
16 ソース電極
17 ドレイン電極
18 ゲート酸化物
19 絶縁体層
20 側壁
21 検出領域
30 電界効果トランジスタ
31 感応膜
32,34 電源装置
33 計測機器
35 冷却器
36 加熱器
37,38 制御ユニット
39 解析ユニット
41 貫通孔
50,60,70 化学センサ
71 ゲート電極
72 枠体
Claims (7)
- 電界効果トランジスタと、
前記電界効果トランジスタ上に設けられる検出領域と、
前記検出領域内に設けられる感応膜と、を備え、
前記感応膜は、金属有機構造体を含む、
化学センサ。 - 前記電界効果トランジスタは、フローティングゲート電極と、前記フローティングゲート電極と前記検出領域を介して対向する対向電極とを有する、
請求項1に記載の化学センサ。 - 前記電界効果トランジスタは、ゲート電極と、前記ゲート電極上に前記検出領域を形成するように設けられた枠体とを有する、
請求項1に記載の化学センサ。 - 前記金属有機構造体は、Zn2+、Co2+、Ni2+およびCu2+の金属イオンの少なくとも1つを含む、
請求項1~3のいずれか1項に記載の化学センサ。 - 前記金属有機構造体は、酸素ドナー性配位子または窒素ドナー性配位子の有機リガンドにより構成される、
請求項1~3のいずれか1項に記載の化学センサ。 - 前記金属有機構造体は、MOF801-P、 MOF801-SC、MOF-802、UiO-66、MOF-808、MOF-841、DUT-67、PIZOF-2、MOF-804、MOF-805、MOF-806、MOF-812、MOF-5、MOF-177、HKUST-1、MIL-53、MIL-96、MIL-101、MAMS-1、Pt/Y MOF、MIL-47、ZMOF-Rho、Dy-btc、Ln-pda、Mn-formata、IRMOF-3、IRMOF-8、IRMOF-111、Zn-IDC、Pd-pymo、Co/DOBDC、Ni/DOBDC、Al-MIL-110、Ni-bpe、MOF-69C、MOF-144、PCN-5、Pt/Zn-MOF、MIL-53calc、UMCM-1、Tb-MOF-76、Mg/DOBDC、PCN-13、ZIF-95、CUK-1、UMCM-150、UMCM-150A、Zn-bdc-DABCO、Ga-MIL-68、Zr-UiO-66、Ti-MIL-125、Pt/ZIF-8、Mg-MOF-74、Co-MOF-74、Ni-MOF-74、CAU-6,CAU-10、SIM-1、テレフタル酸アルミニウム、ベンゼン-1,3,5-トリカルボン酸銅、zeolite 13X、MCM-41、BPL carbonのいずれかである、
請求項1~3のいずれか1項に記載の化学センサ。 - 前記対向電極は、貫通孔を有する、
請求項2に記載の化学センサ。
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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