WO2016181684A1 - サスペンションワイヤ - Google Patents

サスペンションワイヤ Download PDF

Info

Publication number
WO2016181684A1
WO2016181684A1 PCT/JP2016/055438 JP2016055438W WO2016181684A1 WO 2016181684 A1 WO2016181684 A1 WO 2016181684A1 JP 2016055438 W JP2016055438 W JP 2016055438W WO 2016181684 A1 WO2016181684 A1 WO 2016181684A1
Authority
WO
WIPO (PCT)
Prior art keywords
suspension wire
plating layer
wire
conductivity
tensile strength
Prior art date
Application number
PCT/JP2016/055438
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
研二 坂
Original Assignee
東京特殊電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京特殊電線株式会社 filed Critical 東京特殊電線株式会社
Priority to CN201680013437.6A priority Critical patent/CN107406914B/zh
Priority to JP2016510333A priority patent/JP5997866B1/ja
Priority to KR1020177022393A priority patent/KR101932443B1/ko
Publication of WO2016181684A1 publication Critical patent/WO2016181684A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Definitions

  • the present invention relates to a suspension wire that is preferably used in a camera shake correction device for a small camera or a thin camera.
  • a suspension wire capable of buffering vibrations and shocks from the outside is known to be used for an optical pickup as shown in Patent Document 1, for example.
  • This optical pickup is an assembly part including a laser light source and a light receiving part for reproducing and recording information from an optical disk when an optical disk medium such as a CD or a DVD is loaded in an optical disk drive or a player.
  • suspension wires used for optical pickups have been proposed.
  • a Cu—Ni—Sn alloy bus is pulled out by a multi-stage wire drawing machine, back tension is applied to travel in an electric furnace, an aging treatment is performed, and then tin plating is performed.
  • Techniques for obtaining suspension wires have been proposed. This technique is said to be effective in that the reduction in tensile strength after solder immersion and the reduction in wire diameter due to solder erosion are small and can be manufactured at low cost.
  • Suspension wires used for optical pickups are required to have strength and conductivity.
  • the suspension wire described in Patent Document 1 is made of a copper-silver alloy and has a wire diameter of around 0.1 mm. When the wire is made of stranded wire, the wire diameter is about 0.06 to 0.07 mm. .
  • the tensile strength at this time is 800 MPa or more, preferably 900 MPa or more, and depending on the degree of processing, it is 1000 MPa or more, and the conductivity is 70% IACS to 80% IACS.
  • the suspension wire described in Patent Document 2 is made of a Cu—Ni—Sn alloy, has a wire diameter of about 0.1 mm, and is expected to have a tensile strength of about 1380 MPa.
  • Patent Document 3 proposes a camera shake correction apparatus that corrects camera shake (vibration) that occurs when a still image is captured with a small camera for a mobile phone so that an image without image blur can be captured.
  • This technique has a problem of being small and low-profile.
  • the solution is disclosed as follows. The entire auto-focus lens driving device or its movable part is arranged so that the lens barrel moves along the optical axis, and the focus coil is opposed to the focus coil and is radially outward of the focus coil with respect to the optical axis.
  • the entire autofocus lens driving device or its movable part moves the lens barrel in a first direction and a second direction orthogonal to the optical axis and orthogonal to each other.
  • This is a camera shake correction apparatus that corrects camera shake.
  • the camera shake correction device further includes: a base that is spaced apart from a bottom surface portion of the autofocus lens driving device; and a plurality of suspension wires each having one end fixed at an outer peripheral portion of the base.
  • a plurality of suspension wires that extend along the autofocus lens and support the entire autofocus lens driving device or the movable portion thereof in a swingable manner in the first direction and the second direction; and the permanent magnet; It is characterized by having a camera-shake correction coil arranged oppositely.
  • JP 2003-168229 A Japanese Unexamined Patent Publication No. 2011-211984 JP 2011-65140 A
  • the camera shake correction device is also extremely small, and the effective length of the suspension wire is difficult to earn.
  • the camera shake correction device cannot obtain a sufficient camera shake correction effect without a certain operating range. Therefore, there is a demand for a design in which the effective length is shortened and the suspension wire diameter is reduced.
  • the conductive member constituting the smartphone has a low electrical resistance.
  • An object of the present invention is to provide a suspension wire that is short, has a sufficient spring property, is thin, strong, and has excellent conductivity.
  • the suspension wire according to the present invention for solving the above problems is a suspension wire made of a Cu-15Ni-8Sn alloy used in a micro camera module.
  • the suspension wire according to the present invention has an outer diameter including a conductive plating layer in the range of 30 ⁇ m or more and 60 ⁇ m or less, a tensile strength of 1400 MPa or more, and a conductivity of 9% IACS or more and 18% IACS or less. It is characterized by being.
  • the outer diameter including the conductive plating layer is within the above range, it can be suitably used as a suspension wire for a camera shake correction device provided in a micro camera module built in a small portable device such as a smartphone. Can do. Even if the diameter is within the above range, the tensile strength is 1400 MPa or more, which is preferable as a suspension wire for a camera shake correction device. Furthermore, even if an impact such as a drop is applied to a small portable device such as a smartphone, the suspension wire is not broken or deformed. Further, since the conductivity of the suspension wire including the conductive plating layer is within the above range, it exhibits good conductivity and can contribute to reduction of power consumption. A Cu-15Ni-8Sn alloy within such a range can preferably have improved tensile strength by spinodal decomposition in the tension annealing step.
  • the conductive plating layer is preferably a silver plating layer, a copper plating layer, or a gold plating layer.
  • the conductivity can be enhanced by providing the above-described conductive plating layer.
  • the conductivity can be adjusted by changing the thickness of the conductive plating layer.
  • it can be suitably operated as a suspension wire for a camera shake correction device.
  • the above-mentioned electroconductive plating layer is excellent in solderability, and can improve the workability
  • the silver plating layer preferably has a cross-sectional area ratio (percentage) of the suspension wire in a range of 1% to 10%.
  • the conductivity can be increased without reducing the strength (tensile strength) of the suspension wire.
  • a suspension wire that is thin, strong and excellent in electrical conductivity with a narrow and short length and sufficient springiness. Therefore, it can be suitably used as a suspension wire for a camera shake correction device provided in a micro camera module built in a small portable device such as a smartphone.
  • FIG. 1 is a perspective view showing a suspension wire according to Embodiment 1.
  • FIG. It is a graph which shows the relationship between the cross-sectional area ratio (percentage) of a silver plating layer, tensile strength, and electrical conductivity.
  • the suspension wire 10 As shown in FIG. 1, the suspension wire 10 according to the present invention is made of a Cu-15Ni-8Sn alloy used in a micro camera module.
  • the outer diameter including the conductive plating layer is in the range of 30 ⁇ m or more and 60 ⁇ m or less, the tensile strength is 1400 MPa or more, and the conductivity is in the range of 9% IACS or more and 18% IACS or less.
  • the suspension wire 10 is preferably used as a suspension wire for a camera shake correction device provided in a micro camera module built in a small portable device such as a smartphone. Can do. Even if the diameter is within the above range, the tensile strength is 1400 MPa or more, which is preferable as a suspension wire for a camera shake correction device. In addition, even if an impact such as a drop is applied to a small portable device such as a smartphone, the suspension wire is not broken or deformed. Further, since the conductivity of the suspension wire including the conductive plating layer is within the above range, it exhibits good conductivity and can contribute to reduction of power consumption. A Cu-15Ni-8Sn alloy within such a range can preferably have improved tensile strength by spinodal decomposition in the tension annealing step.
  • the Cu-15Ni-8Sn alloy can be preferably used as a strand of a suspension wire for a camera shake correction device.
  • this alloy is preferable in terms of workability, strength, conductivity, and the like.
  • this alloy is non-magnetic, it is not affected by magnets (permanent magnets, etc.) mounted around the suspension wire in the camera shake correction device provided in the ultra-small camera module built in a small portable device such as a smartphone. .
  • the main component of the Cu-15Ni-8Sn alloy is Cu, it can be easily processed into a predetermined wire diameter by cold drawing.
  • this alloy can be easily processed into a thin strand having a diameter of 30 ⁇ m or more and 60 ⁇ m or less.
  • the wire drawing is performed using a die, and after processing to a predetermined wire diameter within a range of 30 ⁇ m or more and 60 ⁇ m or less, tension annealing can be performed to give a predetermined straightness.
  • Straightness is not particularly limited, but the radius of curvature is preferably 600 mm or more.
  • a Cu-15Ni-8Sn alloy is used as a suspension wire for a camera shake correction device, high straightness is necessary to realize high-precision positioning and operation.
  • the tension annealing conditions for obtaining a predetermined radius of curvature are not particularly limited.
  • a Cu-15Ni-8Sn alloy wire loaded with a predetermined back tension is placed in a heating furnace at about 400 ° C. It can be controlled by passing at a speed.
  • a rotary die type straightening device or the like can be applied as a process for setting the straightness within a predetermined range.
  • aging treatment can be performed to give a predetermined strength.
  • the improvement in strength due to this aging treatment is due to spinodal decomposition of the alloy components.
  • Spinodal decomposition is a phenomenon in which mechanical strength is improved by aging treatment, and is a phenomenon in which two types of chemically different phases having the same crystal structure are formed.
  • the aging treatment conditions are not limited because they are controlled in order to obtain a predetermined strength. Time treatment is preferred.
  • the components of the Cu-15Ni-8Sn alloy are preferably that Ni is around 15% by mass, Sn is around 8% by mass, Cu is the balance, and inevitable impurities.
  • a Cu-15Ni-8Sn alloy within such a range is easy to process, so that a desired tensile strength can be obtained in the aging treatment step after the tension annealing step.
  • Ni content is around 15% by mass, but a range of 10% by mass to 20% by mass is allowed. When Ni is less than 10% by mass, the strength is lowered, and specifically, the tensile strength may not be 1400 MPa or more. On the other hand, if Ni exceeds 20% by mass, the electrical conductivity may decrease, and the electrical conductivity of 9% IACS to 18% IACS may not be reached. By setting it within this range, there is an advantage that an increase in strength due to solid solution hardening and spinodal decomposition can be effectively obtained. On the other hand, if the Ni content is outside the above range, a single-phase homogeneous supersaturated solid solution may not be formed in the solution treatment, and the subsequent spinodal decomposition may not occur suitably. In addition, preferable Ni content exists in the range of 12 mass% or more and 18 mass% or less.
  • the Sn-containing layer is about 8% by mass, but allows a range of 6% by mass to 10% by mass. By setting it within this range, there is an advantage that an increase in strength due to solid solution hardening and spinodal decomposition can be effectively obtained.
  • the Ni content and the Sn content are outside the above ranges, a single-phase homogeneous supersaturated solid solution may not be formed in the solution treatment, and the subsequent spinodal decomposition may not occur suitably.
  • a preferable Sn content layer exists in the range of 7% or more and 9 mass% or less.
  • Cu is the balance other than Ni, Sn, and inevitable impurities, and the inevitable impurities are less than about 0.1% by mass. When inevitable impurities are contained in such a range, workability and tensile strength are improved.
  • the inevitable impurities include one or more elements such as S, P, O, H, Nb, Fe, V, and Ta. Some of these elements are included from the time of manufacture of the master alloy of Cu-15Ni-8Sn alloy, while others are included during the processing.
  • the content of inevitable impurities is about 0.1% by mass or less in total, and each element is contained at about 0.05% by mass or less.
  • the conductive plating layer 2 is provided on the outer periphery of the Cu-15Ni-8Sn alloy wire, and is preferably provided in order to obtain a suspension wire for a camera shake correction device having excellent conductivity.
  • the thickness of the conductive plating layer is provided such that the outer diameter of the suspension wire including the conductive plating layer is in the range of 30 ⁇ m to 60 ⁇ m.
  • the conductive plating layer is provided so that the conductivity of the suspension wire is in the range of 9% IACS to 18% IACS. Since the conductivity of the suspension wire including the conductive plating layer is within the above range, the suspension wire exhibits good conductivity, can contribute to a reduction in power consumption, and is preferably operated as a suspension wire for a camera shake correction device. Can do.
  • the conductivity is a value measured by a four-terminal resistance measurement method.
  • the conductivity can be adjusted by changing the type of the conductive plating layer or changing the thickness of the conductive plating layer.
  • the strength tensile strength
  • the electrical conductivity is less than 9% IACS, the strength (tensile strength) is increased because it is obtained when the thickness of the conductive plating layer is thin.
  • the electrical conductivity is not sufficient, it contributes enough to reduce power consumption. There are things that cannot be done.
  • the electrical conductivity exceeds 18% IACS, the electrical conductivity is increased because it is obtained when the thickness of the conductive plating layer is thick, but the strength (tensile strength) may be decreased to be less than 1400 MPa.
  • the conductive plating layer is selected from a silver plating layer, a copper plating layer, and a gold plating layer. By providing such a conductive plating layer, the conductivity can be enhanced without reducing the strength (tensile strength). Note that these conductive plating layers are excellent in solderability and also have the advantage that the workability can be improved.
  • the thickness of the silver plating layer is in the range of 1% to 10% in terms of the cross-sectional area ratio (percentage) of the entire suspension wire. It is preferable to be within. If the cross-sectional area ratio of the entire suspension wire is less than 1%, the strength (tensile strength) is increased, but the conductivity may be smaller than 9% IACS. On the other hand, if the cross-sectional area ratio of the entire suspension wire exceeds 10%, the electrical conductivity increases, but the silver plating layer becomes considerably thick and the cost increases, and the strength of the entire suspension wire decreases.
  • the “suspension wire as a whole” here refers to the suspension wire itself and is synonymous with a suspension wire composed of a Cu-15Ni-8Sn alloy wire and a conductive plating layer provided on the outer periphery thereof.
  • the thickness of the copper plating layer is preferably in the range of 1.2% to 10.6% in terms of the cross-sectional area ratio (percentage) of the entire suspension wire.
  • the reason why this range is slightly different from the case of the silver plating layer is based on the difference in conductivity between the silver plating layer and the copper plating layer. If the cross-sectional area ratio of the entire suspension wire is less than 1.2%, the strength (tensile strength) is high, but the conductivity may be smaller than 9% IACS. On the other hand, if the cross-sectional area ratio of the entire suspension wire exceeds 10.6%, the electrical conductivity increases, but the copper plating layer becomes considerably thick and costs increase, and the strength of the entire suspension wire decreases.
  • the cross-sectional area ratio of the entire suspension wire is set based on the conductivity difference between the silver plating layer or the copper plating layer and the gold plating layer as described above.
  • the solderability by providing the electroconductive plating layer chosen from a silver plating layer, a copper plating layer, and a gold plating layer is favorable.
  • a silver plating layer is provided, more excellent solderability is exhibited.
  • good solderability was confirmed in 0.1 seconds when a silver plating layer was provided with a thickness of 0.3 ⁇ m.
  • the Sn plating layer was provided at 0.75 ⁇ m, it was 0.3 seconds. From these test results, it was found that by providing the silver plating layer, soldering can be performed in about 1/3 of the time when the Sn plating layer is provided. Therefore, by providing the silver plating layer, it is possible to reduce the decrease in the outer diameter due to solder erosion.
  • the suspension wire may be provided with other layers as necessary.
  • an insulating film may be provided.
  • the insulating film at least one or two or more resin films selected from polyurethane resin, polyester resin, polyesterimide resin, and polyamideimide resin can be provided.
  • a solderable urethane resin film or the like is preferable as the insulating film.
  • the thickness of an insulating film is not specifically limited, For example, it is preferable to exist in the range of 3 micrometers or more and 10 micrometers or less. Further, a layer such as nylon or fusion coating may be provided on the insulating film.
  • a base film for the conductive plating layer may be provided.
  • the conductive plating layer is a copper plating layer
  • the suspension wire 10 according to the present invention has a thin outer diameter including a conductive plating layer, and is suitable as a suspension wire for a camera shake correction device included in a micro camera module built in a small portable device such as a smartphone. Can be used for Even if the diameter is small, the tensile strength is 1400 MPa or more, which is preferable as a suspension wire for a camera shake correction device. In addition, even if an impact such as dropping is applied to a small portable device such as a smartphone, there is an effect that disconnection or deformation does not occur. In addition, since the suspension wire including the conductive plating layer exhibits good conductivity, it can contribute to reduction of power consumption.
  • the tensile strength of the suspension wire 10 is 1400 MPa or more within an outer diameter range of 30 ⁇ m or more and 60 ⁇ m or less.
  • the tensile strength of the suspension wire 10 is more preferably 1500 MPa or more.
  • a suspension wire having a tensile strength of 1500 MPa or more and an outer diameter of 30 ⁇ m or more and 60 ⁇ m or less is used for a camera shake correction device provided in a micro camera module built in a small portable device such as a smartphone from the viewpoint of improving drop impact resistance.
  • Particularly preferred as a suspension wire Particularly preferred as a suspension wire.
  • the tensile strength of the suspension wire can also be controlled by aging treatment conditions.
  • the suspension wire according to the present invention is used in various types of camera shake correction devices as described in Patent Document 3.
  • the camera shake correction device is provided in a small portable device such as a smartphone equipped with a micro camera module.
  • the camera shake correction device has a camera shake correction function that corrects a lens position that is displaced by vibration when taking a picture. Since the unit having such a camera shake correction function is extremely small, it is sufficient to use a thin and high tensile strength wire having an outer diameter of 30 ⁇ m or more and 60 ⁇ m or less like the above-described suspension wire according to the present invention. Cannot be configured.
  • the ultra-small camera module for example, generates a lens, a suspension wire that elastically urges the lens to an initial position in the optical axis direction, and an electromagnetic force that resists the urging force of the suspension wire to cause the lens to be an optical axis.
  • it basically includes electromagnetic driving means that can be driven in the vertical direction.
  • the electromagnetic drive means For example, a cylindrical yoke, a coil accommodated inside the inner peripheral wall of the yoke, and surrounding the coil and accommodated inside the outer peripheral wall of the yoke. Some have a magnet.
  • the suspension wire acts to elastically bias the lens to the initial position in the direction perpendicular to the optical axis, and also acts as a power feeding path to the coil. Therefore, the suspension wire is required to have high tensile strength and conductivity. Since the suspension wire is soldered to the lead wire as a power feeding path to the coil, good solderability is also required.
  • the lens is mounted on a lens carrier, and a coil is mounted on the lens carrier. Normally, this lens carrier is supported by 4 to 10 suspension wires at four corners.
  • a camera shake correction device for a small portable device such as a smartphone equipped with a micro camera module has a small space at the base of the suspension wire. Moreover, the space is indirectly given. For this reason, there is a structural difference in that the impact on the suspension wire is increased due to a drop impact or the like, and the impact is hardly absorbed.
  • the lens has a large diameter due to the need for higher pixels, and the mass of the movable part on which the suspension wire is suspended tends to increase. Such an increase in the mass of the movable part causes a large stress to be applied to the suspension wire that has become thinner due to the low profile.
  • the present invention can effectively solve such problems and can provide a suspension wire for a camera shake correction apparatus that cannot be applied to a conventional suspension wire for an optical pickup.
  • Example 1 A bus bar of an outer diameter of 0.3 mm of a Cu-15Ni-8Sn alloy (trade name: Equimet 3, Materialion Brush) was used. This Cu-15Ni-8Sn alloy has Ni: 15% by mass, Sn: 8% by mass, and Cu: balance (about 77% by mass).
  • the bus bar was subjected to silver plating with a thickness of 1.5 ⁇ m, and cold-drawn to 0.040 mm by a multistage wire drawing machine.
  • the cross-sectional area reduction rate per die was in the range of 5% to 20%, and the drawing speed was 300 m / min.
  • a back tension of 30 to 70 g was added to the wire rod after the wire drawing step, and the wire rod was run in an electric furnace having a furnace temperature of 400 ° C., a furnace length of 3 m, and an inert atmosphere at a linear speed of 7.5 m / min.
  • the radius of curvature after this step was 1000 mm.
  • the wire rod after the tension annealing step was passed through an electric furnace having a furnace temperature of 400 ° C., a furnace length of 3 m, and an inert atmosphere at a line speed of 10 m / min.
  • the tensile strength after this step was 1543 MPa. This improvement in tensile strength is due to the spinodal decomposition of the alloy components.
  • the Larson mirror value (LM value) at this time was 12.0.
  • the Larson mirror value is a parameter determined by the heat treatment temperature and time. When this LM value is large, it can be said that the heat treatment load is large. On the other hand, when the LM value is small, it can be said that the heat treatment load is small.
  • a Cu-15Ni-8Sn alloy wire having an outer diameter of 0.040 mm having a silver plating layer of 0.2 ⁇ m was obtained.
  • the cross-sectional area ratio of the silver plating layer at this time is 2%.
  • the alloy wire was cut into a length of 20 mm to produce a suspension wire for a camera shake correction device.
  • the obtained suspension wire had an outer diameter of 0.040 mm, a length of 20.0 mm, and a tensile strength of 1543 MPa.
  • the conductivity was 10% IACS.
  • the cross-sectional area ratio of the silver plating layer in the cross section of the suspension wire was 2%.
  • the tensile strength was measured with a small desktop tensile tester (Shimadzu Corporation, EZ-TEST).
  • the conductivity was measured by a 4-terminal resistance measurement method.
  • Example 2 In Example 1, the outer diameter of the Cu-15Ni-8Sn alloy wire was 0.030 mm, and the silver plating layer was provided with a thickness of 0.15 ⁇ m. Otherwise, the suspension wire of Example 2 was obtained in the same manner as Example 1. The obtained suspension wire had an outer diameter of 0.030 mm and a tensile strength of 1550 MPa. The conductivity was 10% IACS.
  • Example 3 In Example 1, the outer diameter of the Cu-15Ni-8Sn alloy wire was 0.060 mm, and the silver plating layer was provided with a thickness of 0.3 ⁇ m. Otherwise, the suspension wire of Example 3 was obtained in the same manner as Example 1. The obtained suspension wire had an outer diameter of 0.060 mm and a tensile strength of 1530 MPa. The conductivity was 10% IACS.
  • Example 1 In Example 1, the outer diameter of the Cu-15Ni-8Sn alloy wire was 0.100 mm, and the silver plating layer was provided with a thickness of 0.5 ⁇ m. Otherwise, the suspension wire of Comparative Example 1 was obtained in the same manner as Example 1. The obtained suspension wire had an outer diameter of 0.100 mm and a tensile strength of 1350 MPa. The conductivity was 10% IACS.
  • Example 2 In Example 1, the outer diameter of the Cu-15Ni-8Sn alloy wire was 0.070 mm, and the silver plating layer was provided with a thickness of 0.35 ⁇ m. Otherwise, the suspension wire of Comparative Example 1 was obtained in the same manner as Example 1. The obtained suspension wire had an outer diameter of 0.070 mm and a tensile strength of 1380 MPa. The conductivity was 10% IACS.
  • the outer diameter including the conductive plating layer is in the range of 0.030 to 0.060 mm, the tensile strength is 1400 MPa or more, and the conductivity is 9% IACS or more and 18% IACS or less.
  • the suspension wire in the range was excellent as a suspension wire for a camera shake correction device.
  • the tensile strength was 1500 MPa or more, it was possible to show more excellent durability in a drop impact test using a camera shake correction device.
  • FIG. 2 is a graph which shows the relationship between the cross-sectional area ratio (percentage) of a silver plating layer, tensile strength, and electrical conductivity.
  • suspension wire provided with the silver plating layer so that the electrical conductivity is 9% IACS or more was excellent in low power consumption and DC (low frequency) sensitivity in the basic operation characteristic evaluation with the camera shake correction device.
  • suspension wires having an outer diameter exceeding 0.060 mm and a tensile strength of less than 1400 were inferior in drop impact resistance and a reduction in unit height in a camera shake correction device.
  • the suspension wire provided with the silver plating layer so that the electrical conductivity is less than 9% IACS was slightly inferior in power consumption in the basic operation characteristic evaluation with the image stabilizer.
  • the suspension wire obtained with preferable results in the drop impact resistance and the power consumption in the camera shake correction device was the suspension wire according to the present invention.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)
  • Adjustment Of Camera Lenses (AREA)
PCT/JP2016/055438 2015-05-11 2016-02-24 サスペンションワイヤ WO2016181684A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201680013437.6A CN107406914B (zh) 2015-05-11 2016-02-24 悬挂线
JP2016510333A JP5997866B1 (ja) 2015-05-11 2016-02-24 サスペンションワイヤ
KR1020177022393A KR101932443B1 (ko) 2015-05-11 2016-02-24 서스펜션 와이어

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015096530 2015-05-11
JP2015-096530 2015-05-11

Publications (1)

Publication Number Publication Date
WO2016181684A1 true WO2016181684A1 (ja) 2016-11-17

Family

ID=57248031

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/055438 WO2016181684A1 (ja) 2015-05-11 2016-02-24 サスペンションワイヤ

Country Status (3)

Country Link
KR (1) KR101932443B1 (ko)
CN (1) CN107406914B (ko)
WO (1) WO2016181684A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235458A1 (ja) * 2017-06-22 2018-12-27 日本精線株式会社 ばね用銅合金極細線及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111719065B (zh) * 2020-06-08 2021-11-16 广东中发摩丹科技有限公司 一种Cu-Ni-Sn-Si-Ag-P多元合金箔材及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56265A (en) * 1979-06-14 1981-01-06 Mitsubishi Electric Corp Method of reinforcing cu-ni-sn alloy
JPH11506804A (ja) * 1995-06-07 1999-06-15 キャステック，インコーポレーテッド 未加工連続鋳造銅−ニッケル−スズスピノーダル合金
JP2011219840A (ja) * 2010-04-14 2011-11-04 Totoku Electric Co Ltd サスペンションワイヤ
JP2013127492A (ja) * 2011-06-09 2013-06-27 Panasonic Corp レンズアクチュエータ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103334135A (zh) 2013-06-19 2013-10-02 西北工业大学 一种超细晶铜线的制备方法
CN104299719A (zh) * 2013-07-17 2015-01-21 河南九发高导铜材股份有限公司 一种单晶铜银复合导线及其制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56265A (en) * 1979-06-14 1981-01-06 Mitsubishi Electric Corp Method of reinforcing cu-ni-sn alloy
JPH11506804A (ja) * 1995-06-07 1999-06-15 キャステック，インコーポレーテッド 未加工連続鋳造銅−ニッケル−スズスピノーダル合金
JP2011219840A (ja) * 2010-04-14 2011-11-04 Totoku Electric Co Ltd サスペンションワイヤ
JP2013127492A (ja) * 2011-06-09 2013-06-27 Panasonic Corp レンズアクチュエータ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
W.RAYMOND CRIBB ET AL.: "Performance Advances in Copper- Nickel-Tin Spinodal Alloys", ADVANCED MATERIALS & PROCESSES, September 2013 (2013-09-01), pages 20 - 25, XP055328169 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235458A1 (ja) * 2017-06-22 2018-12-27 日本精線株式会社 ばね用銅合金極細線及びその製造方法
KR20200021441A (ko) * 2017-06-22 2020-02-28 니폰 세이센 가부시키가이샤 스프링용 구리 합금 극세선 및 그 제조 방법
JPWO2018235458A1 (ja) * 2017-06-22 2020-04-16 日本精線株式会社 ばね用銅合金極細線及びその製造方法
JP7145070B2 (ja) 2017-06-22 2022-09-30 日本精線株式会社 ばね用銅合金極細線及びその製造方法
KR102450302B1 (ko) 2017-06-22 2022-09-30 니폰 세이센 가부시키가이샤 스프링용 구리 합금 극세선 및 그 제조 방법

Also Published As

Publication number Publication date
CN107406914B (zh) 2019-06-07
CN107406914A (zh) 2017-11-28
KR101932443B1 (ko) 2018-12-26
KR20170105052A (ko) 2017-09-18

Similar Documents

Publication Publication Date Title
US11526021B2 (en) Camera assembly
JP4220535B2 (ja) カメラレンズアセンブリの手振れ補正装置
US11483459B2 (en) Camera module that drives image sensor
EP3044628B1 (en) Insulation of sma actuator wires in a miniature camera
US8064153B2 (en) Lens driving device
US20170075192A1 (en) Insulation of components of an sma actuation arrangement in a miniature camera
US10209479B2 (en) Lens drive device, and imaging device and electronic apparatus provided with same
JP2016050341A (ja) 高強度チタン銅箔及びその製造方法
WO2016181684A1 (ja) サスペンションワイヤ
JP5997866B1 (ja) サスペンションワイヤ
JP6618410B2 (ja) チタン銅箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール
WO2017065273A1 (ja) サスペンションワイヤ
US10092970B2 (en) Titanium-copper alloy having plating layer
KR20210020820A (ko) 안정화 서스펜션 및 제조 방법
JP2004334923A (ja) 光ピックアップ用サスペンションワイヤおよびその製造方法
JP2019031741A (ja) チタン銅箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール
JP6650987B1 (ja) チタン銅箔、伸銅品、電子機器部品及びオートフォーカスカメラモジュール
KR100560051B1 (ko) 카메라 자동 초점 조절장치용 하부커버
JP6157269B2 (ja) 板バネフレーム部材

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2016510333

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16792410

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20177022393

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16792410

Country of ref document: EP

Kind code of ref document: A1