WO2016169018A1 - Dispositif et procédé de stratification - Google Patents

Dispositif et procédé de stratification Download PDF

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Publication number
WO2016169018A1
WO2016169018A1 PCT/CN2015/077274 CN2015077274W WO2016169018A1 WO 2016169018 A1 WO2016169018 A1 WO 2016169018A1 CN 2015077274 W CN2015077274 W CN 2015077274W WO 2016169018 A1 WO2016169018 A1 WO 2016169018A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressed
carrier
sealing
pressing
cavity
Prior art date
Application number
PCT/CN2015/077274
Other languages
English (en)
Chinese (zh)
Inventor
丁兴鸣
曾斌
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201580033361.9A priority Critical patent/CN106537573B/zh
Priority to PCT/CN2015/077274 priority patent/WO2016169018A1/fr
Publication of WO2016169018A1 publication Critical patent/WO2016169018A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the invention relates to the technical field of pressing, in particular to a pressing device and a method.
  • TP touch panel
  • FPC flexible printed circuit
  • the shape of the indenter of the press machine mimics the shape of the bonding body of the TP and the casing or the conforming body of the FPC and the casing, and the indenter is locked on the pressing machine, and the indenter is aligned on the table top of the pressing machine.
  • Embodiments of the present invention provide a pressing device and method for improving the pressing efficiency.
  • a first aspect of the present invention provides a press-fit apparatus comprising:
  • a gas pressure hole is also provided, and the gas pressure hole is connected to an external pressure charging device, and the external pressure charging device fills the cavity with air pressure through the air pressure hole.
  • the number of the sealing carriers is N, and the N sealing carriers are horizontally placed inside the sealed box in a regular or irregular arrangement, the N Is a positive integer greater than or equal to 2.
  • a second aspect of the invention provides a method of pressing, comprising:
  • the sealing carrier is placed inside the sealed box, a cavity is formed between the inside of the sealing box and the sealing carrier, and the sealing box is further provided a gas pressure hole is provided, and the above air pressure hole is connected to an external charging device;
  • the cavity is filled with air pressure from the air pressure hole by the external pressure charging device so that the pressure of the cavity is stronger than the internal pressure of the sealing carrier, and the composition to be pressed is pressed.
  • the composition to be pressed comprises at least a first material to be pressed and a second material to be pressed, wherein the first to be pressed is compared with the sealing carrier.
  • the pressed surface of the material is placed on the surface of the sealing carrier, and the bonding material is placed in the pressed surface of the first material to be pressed, and the pressed surface of the second material to be pressed is placed on the surface
  • the above-mentioned pressing of the above-mentioned compound to be pressed includes: pressing the first to-be-compressed material and the second to-be-compressed material by the above-mentioned binding substance.
  • the pressing device of the embodiment of the present invention comprises a sealed box body and a sealing carrier disposed inside the sealed box body, and a cavity is formed between the inside of the sealed box body and the sealing carrier, and is formed on the sealed box body.
  • the upper air pressure hole is arranged.
  • the pressing device provided by the embodiment of the invention is simple and low in cost, and a plurality of sealing carriers can be placed on the sealed box body, and multiple pieces of the compound to be pressed can be pressed at the same time, thereby achieving batch pressing of the product and increasing pressure. Efficiency.
  • 1a is a front elevational view showing the structure of a pressing device according to an embodiment of the present invention
  • FIG. 1b is a front elevational view showing the structure of a pressing device according to another embodiment of the present invention.
  • FIG. 2 is a front elevational view showing the structure of a pressing device according to another embodiment of the present invention.
  • FIG. 3 is a schematic flow chart of a pressing method according to an embodiment of the present invention.
  • the embodiment of the invention provides a pressing device for implementing batch pressing of products and improving pressing efficiency.
  • the embodiment of the invention further provides a pressing method.
  • FIG. 1a is a front view showing the structure of a pressing device according to an embodiment of the present invention.
  • a pressing device comprises: a sealed casing 10, and a seal placed inside the sealed casing 10 Carrier 20;
  • a cavity is formed between the inside of the sealed casing 10 and the sealing carrier 20, the surface of the sealing carrier 20 is used for placing at least one compound 30 to be pressed, and the sealing casing 10 is further provided with a gas pressure hole 40, the air pressure
  • the hole 40 is connected to the external charging device 50, and the external charging device 50 fills the cavity with the air pressure through the air pressure hole 40.
  • the pressure of the cavity is stronger than the internal pressure of the sealing carrier 20, and the composition 30 to be pressed is pressed.
  • the upper air pressure hole when at least one compound to be pressed is placed on the surface of the sealing carrier, the external charging device fills the cavity with the air pressure through the air pressure hole, so that the pressure of the cavity is stronger than the internal pressure of the sealing carrier, thereby pressing the compound to be pressed .
  • the pressing device provided by the embodiment of the invention is simple and low in cost, and a plurality of sealing carriers can be placed on the sealed box body, and multiple pieces of the compound to be pressed can be pressed at the same time, thereby achieving batch pressing of the product and increasing pressure. Efficiency.
  • the working principle of the press-fitting device provided by the embodiment of the present invention to complete the pressing of the compound to be pressed is as follows (in conjunction with FIG. 1a): the pressing of the composition to be pressed 30 is completed by the pressure applied to the unit area of the compound to be pressed 30.
  • the cavity is filled with air pressure by the external charging device 50, so that the pressure of the cavity inside the sealed casing 10 is continuously maintained at a suitable value and is greater than the pressure inside the sealed carrier 20, thereby forming a pressure difference P, which is assumed to be
  • the pressure of the cavity of the sealed case 10 is P1
  • the pressure inside the sealed carrier 20 is P2
  • the above P P1-P2.
  • the pressure difference P may be between 0.5 and 0.7 mpa
  • the pressure compound 30 may be pressed for 10 s under the action of the pressure F to complete the pressing of the compound 30 to be pressed.
  • the pressure difference between the cavity and the seal carrier 20 varies depending on the composition 30 to be pressed, the properties of the compound 30 to be pressed, and other actual conditions, and the press-time is also different.
  • the embodiment of the invention is not limited.
  • a sealed carrier (as shown in FIG. 1a) may be placed, or N sealed carriers may be placed, and the N may take a positive integer greater than or equal to 2.
  • the N sealing carriers may be horizontally placed inside the sealed box in a regular or irregular arrangement. It is understood that, generally, the horizontal arrangement is placed at the bottom of the sealed box.
  • the arrangement of the sealing carrier depends, in particular, on the length and width of the sealed box, and in order to achieve a greater degree of press-fitting of more of the composition to be pressed, it can be placed in a relatively regular and orderly arrangement.
  • One or more compounds to be pressed may be placed on each of the seal carriers to further effect press-fitting of the large batch of the composition to be pressed.
  • FIG. 1b is a front view showing the structure of a pressing device according to another embodiment of the present invention.
  • three sealing carriers are placed in the sealed casing 10, namely 201, 202 and 203, respectively.
  • the surface of the sealing carrier 201 is placed on the surface of the sealing carrier 202, and the surface of the sealing carrier 202 is placed on the surface of the sealing carrier 203.
  • the length of the sealing housing 10 is greater than the sum of the lengths of the three sealing carriers. Therefore, in Fig. 1b, three sealing carriers are arranged in sequence at the bottom of the sealed casing 10.
  • FIG. 2 is a front elevational view showing the structure of a pressing device according to another embodiment of the present invention.
  • the composition to be pressed 30 includes at least a first press-fit material 30a and a second press-fit material 30b, wherein the first to-be-compressed material 30a is placed on the pressed surface with respect to the seal carrier 20 The surface of the carrier 20 is sealed, and an adhesive substance 30c is placed in the pressed surface of the first to-be-compressed material 30a, and the pressed surface of the second material to be pressed 30b is placed on the adhesive substance 30c.
  • the first material to be pressed 30a may be a casing
  • the second material to be pressed 30b may be TP or FPC, etc.
  • the adhesive material 30c may be glue, tape or double-sided tape or the like.
  • the embodiment of the present invention is adapted to the above-mentioned TP and FPC pressing, and is also suitable for the pressing of similar non-breathable materials.
  • the surface of the sealing carrier provided by the embodiment of the present invention matches the surface of the above-mentioned compound to be pressed.
  • the shape of the sealing carrier provided by the embodiment of the present invention may be designed according to the shape of the compound to be pressed, and in particular, the sealing carrier for carrying the upper surface of the composition to be pressed needs to match the surface of the composition to be pressed, so as to be pressed during pressing.
  • the surface of the compact can be closely adhered to the sealing carrier, so that the force to be pressed is uniform and the pressing quality is improved.
  • a sealing carrier may correspond to a compound to be pressed, that is, a sealing carrier carries a compound to be pressed.
  • the length of the sealing carrier matches the length and width of the compound to be pressed. It can match the width of the compound to be pressed, or it can carry a plurality of compounds to be pressed on a sealing carrier, so that the sealing carrier can be according to the amount of the compound to be supported and the length of the compound to be pressed. Wide to design the seal carrier.
  • the volume of the sealed box body can be designed according to actual needs, a plurality of sealing carriers can be placed in the sealed box at the same time, and the sealing carrier can simultaneously carry one or more compounds to be pressed, thereby realizing the composition to be pressed. Batch press-fit, which effectively improves the press-fit efficiency.
  • the sealing carrier provided by the embodiment of the present invention may be a sealing fixture, that is, a fixing fixture for fixing the compound to be pressed is designed on the sealing carrier to prevent the composite to be pressed, or a general sealing structural member, and the shape of the sealing carrier may be
  • the rectangular or trapezoidal shape can also be designed as a support member of other shapes. It can be understood that other support members capable of achieving the different shapes of the above-mentioned objects are within the scope of the present invention and will not be enumerated here.
  • the material of the sealed box body and the sealing carrier provided by the embodiment of the present invention may be selected according to the composition to be pressed.
  • the aluminum alloy may be selected as the material of the sealed box body and the sealing carrier.
  • FIG. 3 is a schematic flowchart of a pressing method of a pressing device according to an embodiment of the present invention. As shown in FIG. 3, a pressing method may include:
  • 301 placing at least one compound to be pressed on a surface of a sealing carrier, wherein the sealing carrier is placed inside the sealed box, a cavity is formed between the inside of the sealing box and the sealing carrier, and the sealing box is further provided with a pressure hole.
  • the above air pressure hole is connected to an external charging device;
  • the chamber is filled with air pressure from the air pressure hole by the external pressure charging device, so that the pressure of the cavity is stronger than the internal pressure of the sealing carrier, and the pressure compound is pressed.
  • a seal carrier 20 may be placed in the sealed casing 10, the sealant 30 is carried by the seal carrier 20, and the inside of the sealed casing 10 is sealed by the air pressure hole 40 on the sealed casing 10.
  • the cavity is filled with air pressure so that the cavity continues to maintain a pressure greater than the internal pressure of the seal carrier 20, and then the pressure generated by the pressure difference between the cavity pressure and the seal carrier 20 can be pressed against the compact 30.
  • the pressure difference P may be between 0.5 and 0.7 mpa, and the pressure compound 30 may be pressed for 10 s under the action of the pressure F to complete the pressing of the compound 30 to be pressed.
  • the pressure difference between the cavity and the seal carrier 20 varies depending on the composition 30 to be pressed, the properties of the compound 30 to be pressed, and other actual conditions, and the press-time is also different.
  • the embodiment of the invention is not limited.
  • the composition to be pressed includes at least a first material to be pressed and a second material to be pressed, wherein, with respect to the sealing carrier, the pressed material of the first material to be pressed is placed on the surface Sealing the surface of the carrier, and placing an adhesive substance on the pressed surface of the first material to be pressed, placing the pressed surface of the second material to be pressed on the adhesive substance, and filling the cavity by the air pressure
  • the pressure applied to the compact is increased, and the first material to be pressed and the second material to be pressed are pressed together by the adhesive substance.
  • the surface of the sealing carrier provided by the embodiment of the present invention matches the surface of the above-mentioned compound to be pressed.
  • the shape of the sealing carrier provided by the embodiment of the present invention may be designed according to the shape of the compound to be pressed, and in particular, the sealing carrier for carrying the upper surface of the composition to be pressed needs to match the surface of the composition to be pressed, so as to be pressed during pressing.
  • the surface of the compact can be closely adhered to the sealing carrier, so that the force to be pressed is uniform and the pressing quality is improved.
  • the material of the sealed box body and the sealing carrier provided by the embodiment of the present invention may be based on the material to be pressed
  • the article 30 is selected, preferably, the aluminum alloy may be selected as the material of the sealed case and the seal carrier.
  • the pressing of the pressure to be pressed since the pressing of the pressure to be pressed is completed, the pressing of a plurality of compounds to be pressed can be simultaneously achieved, thereby realizing the batch pressing which cannot be achieved by the prior art, and the pressure is increased.
  • the surface of the sealing carrier to match the surface of the composition to be pressed, the sealing carrier and the compound to be pressed can be closely adhered during pressing, so that the pressed composite is uniformly stressed by the pressing surface.
  • the entire press-fit device has a simple structure, and the press-fit device provided by the embodiment of the present invention has lower cost than the prior art.
  • the technical solution of the present invention may be embodied in the form of a software product in the form of a software product, or a part of the technical solution, which is stored in a storage medium, including a plurality of instructions.
  • a computer device which may be a personal computer, a server, or a network device, etc.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Packages (AREA)

Abstract

L'invention concerne un dispositif de stratification qui comprend un contenant de joint (10) et un support de joint (20) placé à l'intérieur du contenant de joint (10), et une cavité est formée entre un intérieur du contenant de joint (10) et le support de joint (20). Une surface du support du joint (20) est utilisée pour porter au moins un objet à stratifier (30). Un trou de pression (40) est également ménagé sur le contenant de joint (10), et raccordé à un dispositif de mise sous pression externe (50). Le dispositif de mise sous pression externe (50) augmente la pression dans la cavité par l'intermédiaire du trou de pression (40). L'invention concerne en outre un procédé de stratification utilisant le dispositif. Le dispositif et le procédé de stratification sont utilisés pour réaliser une stratification par lots d'un produit, ce qui permet d'améliorer l'efficacité de stratification.
PCT/CN2015/077274 2015-04-23 2015-04-23 Dispositif et procédé de stratification WO2016169018A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580033361.9A CN106537573B (zh) 2015-04-23 2015-04-23 一种压合装置及方法
PCT/CN2015/077274 WO2016169018A1 (fr) 2015-04-23 2015-04-23 Dispositif et procédé de stratification

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/077274 WO2016169018A1 (fr) 2015-04-23 2015-04-23 Dispositif et procédé de stratification

Publications (1)

Publication Number Publication Date
WO2016169018A1 true WO2016169018A1 (fr) 2016-10-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/077274 WO2016169018A1 (fr) 2015-04-23 2015-04-23 Dispositif et procédé de stratification

Country Status (2)

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CN (1) CN106537573B (fr)
WO (1) WO2016169018A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110431014A (zh) * 2017-11-30 2019-11-08 华为技术有限公司 显示屏和电子器件的组装方法、显示屏组件及终端

Citations (5)

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Publication number Priority date Publication date Assignee Title
CN1130565A (zh) * 1994-10-20 1996-09-11 株式会社村田制作所 薄膜粘贴方法
TW200425229A (en) * 2003-03-13 2004-11-16 Tokyo Seimitsu Co Ltd DAF tape adhering apparatus and DAF tape adhering method
US20090126872A1 (en) * 2005-08-30 2009-05-21 Sampica James D System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
JP2010103137A (ja) * 2008-10-21 2010-05-06 Nec Electronics Corp 粘着テープの貼付装置及び粘着テープの貼付方法
CN102047408A (zh) * 2008-06-06 2011-05-04 琳得科株式会社 薄片粘贴装置及粘贴方法

Family Cites Families (5)

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CN1804694A (zh) * 2006-01-11 2006-07-19 深圳市科创数字显示技术有限公司 液晶显示器lcos的制作方法及其压合装置
CN101086973B (zh) * 2007-05-28 2011-05-25 东莞彩显有机发光科技有限公司 一种有机发光器件的密封压合方法以及用于该方法中的封装设备
CN101336018B (zh) * 2007-06-27 2011-05-25 东莞彩显有机发光科技有限公司 一种有机电致发光器件的封装压合方法及封装压合设备
CN101295751B (zh) * 2008-06-16 2010-06-09 东莞宏威数码机械有限公司 太阳电池的封装制备装置和封装太阳电池的方法
CN202293573U (zh) * 2011-10-19 2012-07-04 洋华光电股份有限公司 构造改良的面板压合装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1130565A (zh) * 1994-10-20 1996-09-11 株式会社村田制作所 薄膜粘贴方法
TW200425229A (en) * 2003-03-13 2004-11-16 Tokyo Seimitsu Co Ltd DAF tape adhering apparatus and DAF tape adhering method
US20090126872A1 (en) * 2005-08-30 2009-05-21 Sampica James D System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
CN102047408A (zh) * 2008-06-06 2011-05-04 琳得科株式会社 薄片粘贴装置及粘贴方法
JP2010103137A (ja) * 2008-10-21 2010-05-06 Nec Electronics Corp 粘着テープの貼付装置及び粘着テープの貼付方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110431014A (zh) * 2017-11-30 2019-11-08 华为技术有限公司 显示屏和电子器件的组装方法、显示屏组件及终端
CN110431014B (zh) * 2017-11-30 2021-09-14 华为技术有限公司 显示屏和电子器件的组装方法、显示屏组件及终端

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Publication number Publication date
CN106537573B (zh) 2019-05-03
CN106537573A (zh) 2017-03-22

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