WO2016155190A1 - 基板检测装置及突起高度检测方法 - Google Patents

基板检测装置及突起高度检测方法 Download PDF

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Publication number
WO2016155190A1
WO2016155190A1 PCT/CN2015/086752 CN2015086752W WO2016155190A1 WO 2016155190 A1 WO2016155190 A1 WO 2016155190A1 CN 2015086752 W CN2015086752 W CN 2015086752W WO 2016155190 A1 WO2016155190 A1 WO 2016155190A1
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Prior art keywords
height
substrate
protrusion
sensor
defect
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PCT/CN2015/086752
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English (en)
French (fr)
Inventor
刘桂林
李晶晶
崔秀娟
李娟�
张红岩
于闪闪
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京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Priority to US14/912,909 priority Critical patent/US10108031B2/en
Publication of WO2016155190A1 publication Critical patent/WO2016155190A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/042—Calibration or calibration artifacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
    • G01B5/061—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness height gauges
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates

Definitions

  • the present invention relates to the field of display substrate detection technology, and in particular, to a substrate detection device and a protrusion height detection method.
  • the liquid crystal display panel is mainly composed of a synthetic TFT (English: Thin Film Transistor) array substrate and a color film (English: Color Filter, referred to as CF) substrate, a liquid crystal and a driving module, wherein the liquid crystal molecules are controlled by the electric field size. Turn to achieve color display.
  • the color film layer mainly functions as a color developing.
  • the prior art In order to overcome the protrusion defects, the prior art generally uses a defect height measuring sensor to position the protruding defect points, and removes the protrusions by grinding.
  • the disadvantage is that the measurement range of the existing defect height measuring sensor is large, and the positioning accuracy of the defect point is poor.
  • the pixel design on the color film substrate is required to be more and more miniaturized, and the spacer on the pixel (English: Post spacer, PS: abbreviation) The more intensive.
  • the PS mainly serves as a support for supporting between the TFT array substrate and the CF substrate to maintain a sufficient space to fill the liquid crystal. For high-resolution display products, the measurement of defect height is more inaccurate due to the interference of dense PS.
  • the embodiment of the invention provides a substrate detecting device and a protrusion height detecting method.
  • the technical solution is as follows:
  • a substrate detecting apparatus including: a stage for carrying a substrate to be inspected, and a sensor holder, wherein one end of the sensor holder is provided with an altimeter sensor, the altimeter sensor has a cone structure, and the diameter of the end surface of the substrate to be inspected is smaller than another The diameter of one end face.
  • the above-mentioned substrate detecting device includes a stage for carrying a substrate and a sensor holder, wherein one end of the sensor holder is provided with a cone-shaped height measuring sensor, and the height measuring sensor is used for detecting the to-be-detected
  • the diameter of the end face of the substrate is smaller than the diameter of the other end face.
  • the height measurement of the defect using such an altimeter sensor is point contact. When the defect point is found, the altimeter sensor can directly measure the center position of the defect point to obtain the measured height.
  • the technical solution of the present invention can significantly improve the accuracy of the height measurement of the protrusion defects. In particular, for a color film-intensive spacer product, the solution effectively solves the problem that the height measurement of the protrusion defect on the color film substrate is inaccurate and the calculation of the defect height is inaccurate.
  • the end surface of the altimetry sensor for detecting the substrate to be inspected is a spherical surface, and the spherical surface radius is 5-20 um.
  • the use of such an end face and its radius further promotes the accuracy and precision of the measurement and calculation of the protrusion height.
  • the stage is provided with at least one reference point for highly zeroing the height sensor with the height of the reference point as a preset reference height.
  • a protrusion height detecting method using the substrate detecting device as described above comprising:
  • the actual height of the protrusion is obtained from the measured height and the preset reference height.
  • the height measurement of the protrusion defect is point contact type.
  • the altimeter sensor can directly make a point contact measurement on the center position of the defect point to obtain the measured height.
  • the technical solution of the present invention can significantly improve the accuracy of the height measurement of the protrusion defects.
  • the solution effectively solves the problem that the height measurement of the protrusion defect on the color film substrate is inaccurate and the calculation of the defect height is inaccurate.
  • the protrusion height detecting method further includes: before the protrusion is measured,
  • the altimetry sensor is used to measure the reference point in each area separately, so that the altimetry value of the reference point in the area where the protrusion is located is taken as the reference height of the area.
  • the protrusion height detecting method further includes: grinding the protrusion when an actual height of the protrusion is greater than or equal to a repair threshold. By using a subsequent grinding step, the protrusion defects in the display device are eliminated in time.
  • the actual height of the protrusion is the difference between the measured height of the protrusion and the reference height. Thereby, the actual height of the protrusions is easily calculated.
  • FIG. 1 is a schematic structural diagram of a substrate detecting apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a stage in a substrate detecting apparatus according to an embodiment of the present invention
  • FIG. 3 is a schematic flow chart of a substrate detecting method according to an embodiment of the present invention.
  • 1-substrate to be inspected 2-stage, 3-sensor holder, 4-leveling sensor, 5-spacer, 6-protrusion defect, 7-reference point.
  • the substrate detecting device provided by the embodiment of the present invention, as shown in FIG. 1 , includes: a carrier 2 for carrying the substrate 1 to be inspected and a sensor holder 3 , wherein one end of the sensor holder 3 is provided with a height measuring sensor 4 and a height measuring sensor. 4 is a cone structure, and it is for detecting that the diameter of the end surface of the substrate 1 to be inspected is smaller than the diameter of the other end surface.
  • the substrate detecting device includes a stage for carrying a substrate and a sensor holder, wherein one end of the sensor holder is provided with a cone-shaped height measuring sensor, and the height measuring sensor is used for detecting the substrate to be detected.
  • the diameter of the end face is smaller than the diameter of the other end face.
  • the height measurement of the defect using such a height measuring sensor is point contact type.
  • the altimeter sensor can directly make a point contact measurement on the center position of the defect point to obtain the measured height.
  • the technical solution of the present invention can significantly improve the accuracy of the height measurement of the protrusion defects. Especially for the color film-intensive spacer product, the solution effectively solves the problem that the height measurement of the protrusion defect on the color film substrate is inaccurate and the calculation of the defect height is inaccurate.
  • the substrate 1 to be inspected is a dense spacer color filter substrate as an example.
  • the surface of the substrate 1 to be inspected is spaced apart from the spacers 5, the protrusion defects 6 are located between the two spacers 5, and the altimeter sensor 4 is aligned.
  • the protrusion defect 6 is used to measure the protrusion defect 6.
  • the altimeter sensor is typically cylindrical in shape and has a radius of 250 um.
  • Corresponding defect height measurement method is as follows: the color film pixel is used as a reference surface, the defect is centered, and the line contact scanning is performed at right and left equidistance to obtain the height measurement result.
  • the cylinder height sensor cannot touch the reference surface when the height is measured.
  • the cylinder height sensor actually touches the spacer, so the scan measures a flat curve, so that the actual height of the protrusion defect cannot be accurately measured.
  • the grinding threshold of the protrusion defect on the color film product is 1.5 um, and the defect height is calculated by the measurement result of the cylinder height measuring sensor, so that the problem of insufficient grinding and grinding is easily caused in the product repairing process, and the product quality is seriously affected.
  • the end surface of the altimetry sensor 4 for detecting the substrate 1 to be inspected is a spherical surface, and its spherical radius is 5-20 um.
  • the spherical radius size can be selected as needed, for example, preferably 10 um.
  • Such a spherical size corresponds to a common raised defect size. Therefore, accurate point contact measurement can be realized by adopting such a spherical structure, thereby ensuring the accuracy of detection.
  • the stage 2 may further be provided with at least one reference point 7 for making the height sensor 4 high with the height of the reference point 7 as a preset reference height. Zero school.
  • the stage 2 can be divided into several areas, each of which can correspond to one reference point, and the height of the reference point can be preset according to actual needs. For example, the actual average height of a certain area can be set to the reference point height of the area before the protrusion height defect detection is performed. Further, a reference point 7 corresponding to the area can be provided on the surface of the stage. In this way, the height sensor 4 can be aligned with the reference point 7 of the area to complete the height zeroing before each time the protrusion defect in a certain area is measured. Then, the altimeter sensor 4 is aligned with the protruding defect point, so that the relative defect height of the defect point can be accurately obtained.
  • the description is made by taking the stage 2 as a complete area as an example, wherein the complete area corresponds to one reference point 7.
  • the stage 2 can be divided into a plurality of areas.
  • the stage 2 can be divided into four areas.
  • four reference points corresponding to four regions may be respectively disposed at four corner positions of the stage 2. The invention is not limited thereto.
  • the protrusion height detecting method provided by the embodiment of the present invention adopts the substrate detecting device as described above, as shown in FIG. 3, the method includes:
  • Step 303 using a substrate detecting device to measure the protrusion defect to obtain the measured height
  • Step 304 Obtain an actual height of the protrusion defect according to the measured height and a preset reference height.
  • the method for detecting a height of a protrusion defect uses a substrate detecting device, wherein the substrate detecting device includes a stage for carrying a substrate and a sensor holder, wherein one end of the sensor holder is provided with a height measuring sensor of a cone structure, and The diameter of the end face of the altimetry sensor for detecting the substrate to be inspected is smaller than the diameter of the other end face.
  • the height measurement of the defect sensor using such a structure is point contact type.
  • the altimeter sensor can directly make a point contact measurement on the center position of the defect point to obtain the measured height.
  • the technical solution of the present invention can significantly improve the accuracy of the height measurement of the protrusion defects. Especially for the color film-intensive spacer product, the solution effectively solves the problem that the height measurement of the protrusion defect on the color film substrate is inaccurate and the calculation of the defect height is inaccurate.
  • the method may further include: Before setting the height,
  • Step 301 Divide the stage on which the substrate is placed into several areas
  • Step 302 Using the altimetry sensor to respectively measure the reference point in each area, so that the altimetry value of the reference point of the area where the protrusion defect is located is taken as the reference height of the area.
  • the method may further include:
  • Step 305 Grinding the protrusion of the defect point when the actual height of the protrusion defect is greater than or equal to the repair threshold.
  • the measurement of the defect height is usually based on the minimum value in the height measurement sensor scanning measurement area, and the defect height is obtained by subtracting the reference height from the maximum height.
  • the calculation method will make the calculation of the defect height inaccurate, resulting in the product being produced during the repair process. Insufficient grinding and grinding problems.
  • the area calculating method is used to calculate the defect height.
  • the reference height is selected for different regions of the machine on which the substrate is placed by using the altimeter reference point, and the actual height of the protrusion defect is obtained by subtracting the reference height of the corresponding region from the measured height measured by the altimeter at the defect.
  • the specific calculation process is as follows:
  • the reference height of the area 1 is ⁇ X 1
  • the reference height of the area 2 is ⁇ X 2
  • the reference height of the area 3 is ⁇ X 3
  • the reference height of the area 4 is ⁇ X 4 , .
  • the height obtained by directly measuring the position of the defect center by the altimeter sensor is the measured height measured by the altimeter sensor.
  • the area calculation method makes the calculation of the defect height more precise, thus avoiding problems such as excessive grinding and grinding during the repair process.
  • the cone height measuring sensor design and the area calculation method can effectively avoid the interference of the dense spacers, and at the same time, the calculation of the defect height is accurate, thereby avoiding problems such as excessive grinding and grinding during the repair process, and This improves product quality.
  • Adopt The height measurement of such a height sensor is point contact type. When the defect point is found, the altimeter sensor can directly make a point contact measurement on the center position of the defect point to obtain the measured height.
  • the technical solution of the present invention can significantly improve the accuracy of the height measurement of the protrusion defects. Especially for the color film-intensive spacer product, the solution effectively solves the problem that the height measurement of the protrusion defect on the color film substrate is inaccurate and the calculation of the defect height is inaccurate.

Abstract

一种基板检测装置及突起高度检测方法。该基板检测装置包括：用于承载待检测基板（1）的载台（2）以及传感器支架（3），所述传感器支架（3）的一端设置有测高传感器（4），其中所述测高传感器（4）为圆锥体结构，并且其用于检测待检测基板（1）的端面的直径小于另一端面的直径。该基板检测装置及突起高度检测方法能够解决彩膜基板上突起缺陷高度测量不准确以及缺陷高度计算不准确的问题。

Description

基板检测装置及突起高度检测方法
相关申请
本申请要求2015年3月30日提交的中国专利申请号201510145225.0的优先权，该中国专利申请以其整体通过引用并入本文。
技术领域
本发明涉及显示基板检测技术领域，特别地涉及一种基板检测装置及突起高度检测方法。
背景技术
液晶显示面板主要由对合成型的TFT(英文：Thin Film Transistor，薄膜晶体管)阵列基板与彩膜(英文：Color Filter，简称：CF)基板、液晶及驱动模块组成，其中通过电场大小控制液晶分子转向以实现彩色显示。在液晶面板工艺中，彩膜层主要起彩色显像作用。
在彩膜基板的生产过程中，不可避免地会产生各种缺陷点，尤其是具有高度的突起缺陷，其在基板对合后易产生亮点不良。为了克服突起缺陷，现有技术通常采用缺陷高度测定传感器对突起缺陷点进行定位，并且采用研磨方式消除突起。其中不足之处在于，现有的缺陷高度测定传感器的测定范围较大，而且缺陷点定位精度较差。随着目前市场对液晶显示器分辨率的要求越来越高，这就要求彩膜基板上的像素设计越来越小型化，像素上的隔垫物(英文：Post spacer，简称：PS)也越来越密集。PS主要起支撑作用，用于在TFT阵列基板与CF基板中间进行支撑以保持足够的空间填入液晶。对于高分辨率显示产品，由于密集型PS的干扰，使得缺陷高度的测定更加不准确。
发明内容
为了解决彩膜基板上突起缺陷高度测量不准确以及缺陷高度计算不准确的问题，本发明实施例提供了一种基板检测装置及突起高度检测方法。所述技术方案如下：
在本发明实施例的一方面中，提供了一种基板检测装置，包括： 用于承载待检测基板的载台以及传感器支架，其中所述传感器支架的一端设置有测高传感器，所述测高传感器为圆锥体结构，并且其用于检测待检测基板的端面的直径小于另一端面的直径。
本发明实施例所提供的上述基板检测装置，包括用于承载基板的载台以及传感器支架，其中传感器支架的一端设置有圆锥体结构的测高传感器，并且该测高传感器中用于检测待检测基板的端面的直径小于另一端面的直径。利用这样的测高传感器对缺陷进行的测高是点接触式的。当寻找到缺陷点后，测高传感器能够直接对缺陷点的中心位置进行点接触测定，以得到测定高度。与现有技术相比，本发明的技术方案能够显著提高突起缺陷高度测量的准确性。特别地，对于彩膜密集型隔垫物产品，该方案有效地解决了彩膜基板上突起缺陷高度测量不准确以及缺陷高度计算不准确的问题。
在本发明的实施例中，所述测高传感器中用于检测待检测基板的端面为球面，并且所述球面半径为5-20um。利用这样的端面及其半径，进一步促进了突起高度测量和计算的准确性和精度。
在本发明的实施例中，所述载台上设置有至少一个基准点，以用于以所述基准点的高度作为预设的基准高度对所述测高传感器进行高度校零。通过设置至少一个基准点并以其高度为基准高度，促进了对基准高度的准确限定，由此进一步改善突起高度测量和计算的准确性和精度。
在本发明实施例的另一方面中，提供了一种突起高度检测方法，其采用如上所述的基板检测装置，所述方法包括：
采用所述基板检测装置对突起进行测高，以得到测定高度；以及
根据所述测定高度与预设的基准高度得到突起的实际高度。
当采用本发明的上述基板检测装置对突起高度进行检测时，对突起缺陷进行的测高是点接触式的。当寻找到缺陷点后，测高传感器能够直接对缺陷点中心位置进行点接触测定，以得到测定高度。与现有技术相比，本发明的技术方案能够显著提高突起缺陷高度测量的准确性。特别地对于彩膜密集型隔垫物产品，该方案有效解决了彩膜基板上突起缺陷高度测量不准确以及缺陷高度计算不准确的问题。
在本发明的实施例中，所述突起高度检测方法还包括：在对突起进行测高之前，
将基板所放置的载台划分为若干区域；以及
采用测高传感器分别对每个区域内的基准点进行测高，以将突起所在区域的基准点的测高值作为该区域的基准高度。
通过设置载台的若干区域及对应的若干基准点，并且以相应基准点的高度作为相应区域的基准高度，促进了对基准高度的准确限定，由此进一步改善突起高度测量和计算的准确性和精度。
在本发明的实施例中，所述突起高度检测方法还包括：当所述突起的实际高度大于等于修复阈值时，对所述突起进行研磨。通过采用后续研磨步骤，及时消除了显示装置中的突起缺陷。
在本发明的实施例中，所述突起的实际高度为突起的测定高度与基准高度的差值。由此，容易地计算出所述突起的实际高度。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本发明的一些实施例。对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的一种基板检测装置的结构示意图；
图2是本发明实施例提供的基板检测装置中的载台的结构示意图；以及
图3是本发明实施例提供的一种基板检测方法的流程示意图。
附图标记：
1-待检测基板，2-载台，3-传感器支架，4-测高传感器，5-隔垫物，6-突起缺陷，7-基准点。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步的详细描述。
本发明实施例提供的基板检测装置，如图1所示，包括：用于承载待检测基板1的载台2以及传感器支架3，其中传感器支架3的一端设置有测高传感器4，测高传感器4为圆锥体结构，并且其用于检测待检测基板1的端面的直径小于另一端面的直径。
本发明实施例提供的基板检测装置，包括用于承载基板的载台以及传感器支架，其中传感器支架的一端设置有圆锥体结构的测高传感器，并且该测高传感器中用于检测待检测基板的端面的直径小于另一端面的直径。采用这样的测高传感器对缺陷进行的测高是点接触式的。当寻找到缺陷点后，测高传感器能够直接对缺陷点中心位置进行点接触测定，以得到测定高度。与现有技术相比，本发明的技术方案能够显著提高突起缺陷高度测量的准确性。特别地对于彩膜密集型隔垫物产品，该方案有效解决了彩膜基板上突起缺陷高度测量不准确以及缺陷高度计算不准确的问题。
需要说明的是，在如图1所示的基板检测装置中，是以待检测基板1为密集型隔垫物彩膜基板为例进行的说明。为了清楚地说明突起缺陷的高度检测，在图1中，待检测基板1的表面上间隔设置有隔垫物5，突起缺陷6位于两个隔垫物5之间，并且测高传感器4对准突起缺陷6以对该突起缺陷6进行测高。
在现有的测高传感器中，测高传感器通常为圆柱体结构，并且半径为250um。对应的缺陷高度测定方法为：以彩膜像素为基准面，缺陷为中心，并且左右等距离进行线接触式扫描，以得到测高结果。对于密集型隔垫物产品上的突起缺陷，因其体积大且为线接触式，圆柱体测高传感器在测高时无法接触到基准面。尤其对于高度为隔垫物高度±0.5um的缺陷，圆柱体测高传感器实际接触到的是隔垫物，因而扫描测得的是一条较平坦的曲线，使得突起缺陷的实际高度无法准确测量。目前彩膜产品上突起缺陷的研磨阈值为1.5um，以圆柱体测高传感器测定结果来计算缺陷高度，从而在产品修复过程中易造成过研磨和研磨不足问题，并且严重影响产品品质。
具体地，在如图1所示的基板检测装置中，测高传感器4中用于检测待检测基板1的端面为球面，并且其球面半径为5-20um。在实际应用的过程中，该球面半径尺寸可以根据需要进行选择，例如，可以优选为10um。这样一种球面尺寸对应于常见的突起缺陷尺寸。因而通过采用这样一种球面结构能够实现精确的点接触式测量，从而保证检测的精度。
进一步地，如图2所示，载台2上还可以设置有至少一个基准点7，以用于以该基准点7的高度作为预设基准高度对测高传感器4进行高 度校零。
具体地，可以将载台2划分为若干区域，每一个区域均可以对应一个基准点，并且该基准点的高度可以根据实际需要预先设置。例如，在进行突起高度缺陷检测之前，可以将某一区域的实际平均高度设定为该区域的基准点高度。进一步地，可以在载台的表面上设置一个对应该区域的基准点7。这样一来，在每一次对某一区域内的突起缺陷进行测高之前，可以将测高传感器4对准该区域的基准点7以完成高度校零。然后，再将测高传感器4对准突起缺陷点，从而可以准确地得到该缺陷点的相对缺陷高度。
需要说明的是，在如图2所示的载台中，是以载台2具体划分为一个完整区域为例进行的说明，其中该完整区域对应一个基准点7。在实际应用的过程中，当载台2所承载的待检测基板的面积较大时，可以将载台2划分为多个区域，例如可以将载台2划分为4个区域。进一步地，可以在载台2的4个边角位置处分别设置与4个区域对应的4个基准点。本发明对此并不做限定。
本发明实施例提供的突起高度检测方法，采用如上所述的基板检测装置，如图3所示，所述方法包括：
步骤303、采用基板检测装置对突起缺陷进行测高，以得到测定高度；以及
步骤304、根据所述测定高度与预设的基准高度得到突起缺陷的实际高度。
本发明实施例提供的突起缺陷高度检测方法采用基板检测装置，其中该基板检测装置包括用于承载基板的载台以及传感器支架，其中传感器支架的一端设置有圆锥体结构的测高传感器，并且该测高传感器中用于检测待检测基板的端面的直径小于另一端面的直径。采用这样一种结构的测高传感器对缺陷进行的测高是点接触式的。当寻找到缺陷点后，测高传感器能够直接对缺陷点中心位置进行点接触测定，以得到测定高度。与现有技术相比，本发明的技术方案能够显著提高突起缺陷高度测量的准确性。特别地对于彩膜密集型隔垫物产品，该方案有效解决了彩膜基板上突起缺陷高度测量不准确以及缺陷高度计算不准确的问题。
进一步地，如图3所示，所述方法还可以包括：在对突起缺陷位 置进行测高之前，
步骤301、将基板所放置的载台划分为若干区域；
步骤302、采用测高传感器分别对每个区域内的基准点进行测高，以将突起缺陷所在区域的基准点的测高值作为该区域的基准高度。
进一步地，如图3所示，所述方法还可以包括：
步骤305、当突起缺陷的实际高度大于等于修复阈值时，对缺陷点的突起进行研磨。
在现有技术中，缺陷高度的测量通常是以测高传感器扫描测定区域内的最小值为基准高度，并且利用最大高度减去基准高度得出缺陷高度。尤其地对于密集型隔垫物产品上的缺陷，因测高传感器在测高时受到隔垫物的影响，用此计算方法会使缺陷高度的计算不准确，从而造成产品在修复过程中产生过研磨和研磨不足的问题。
在本发明实施例中，结合圆锥体测高传感器的测高方法，采用区域计算方法计算缺陷高度。具体地，利用测高传感器基准点针对基板所放置的机台的不同区域选取基准高度，并且利用测高传感器在缺陷处所测量的测定高度减去相应区域的基准高度得出突起缺陷的实际高度。具体计算过程如下：
获取基准高度：将基板所放置的机台划分为若干区域，并且利用测高传感器针对每个区域选取基准高度。例如，区域一的基准高度为△X1，区域二的基准高度为△X2，区域三的基准高度为△X3，区域四的基准高度为△X4，…。
获取测高传感器所测量的测定高度：采用测高传感器直接对缺陷中心位置进行点接触测定所获得的高度为测高传感器所测量的测定高度。
计算缺陷高度：利用测高传感器所测量的测定高度减去机台上相应区域的基准高度得出突起缺陷的实际高度。如缺陷在机台上的区域一中的位置，则缺陷实际高度＝H测高传感器测定值-△X1。
区域计算方法使得缺陷高度的计算更为精确化，从而避免了产品在修复过程中产生过研磨和研磨不足等问题。
利用圆锥体测高传感器设计和区域计算法，有效避免了密集型隔垫物的干扰，同时使缺陷高度的计算精确化，从而避免了产品在修复过程中产生过研磨和研磨不足等问题，并且由此提高产品品质。采用 这样的测高传感器对缺陷进行的测高是点接触式的。当寻找到缺陷点后，测高传感器能够直接对缺陷点中心位置进行点接触测定，以得到测定高度。与现有技术相比，本发明的技术方案能够显著提高突起缺陷高度测量的准确性。特别地对于彩膜密集型隔垫物产品，该方案有效解决了彩膜基板上突起缺陷高度测量不准确以及缺陷高度计算不准确的问题。
以上所述仅为本发明的较佳实施例，并不用以限制本发明。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 一种基板检测装置，包括：
    用于承载待检测基板的载台；以及
    传感器支架，
    其中所述传感器支架的一端设置有测高传感器，所述测高传感器为圆锥体结构，并且其用于检测待检测基板的端面的直径小于另一端面的直径。
  2. 根据权利要求1所述的基板检测装置，其中，所述测高传感器中用于检测待检测基板的端面为球面，并且所述球面半径为5-20um。
  3. 根据权利要求1所述的基板检测装置，其中，所述载台上设置有至少一个基准点，以用于以所述基准点的高度作为预设的基准高度对所述测高传感器进行高度校零。
  4. 一种突起高度检测方法，其采用如权利要求1-3中任一项所述的基板检测装置，所述方法包括：
    采用所述基板检测装置对突起进行测高，以得到测定高度；以及
    根据所述测定高度与预设的基准高度得到突起的实际高度。
  5. 根据权利要求4所述的突起高度检测方法，还包括：在对突起进行测高之前，
    将基板所放置的载台划分为若干区域；以及
    采用测高传感器分别对每个区域内的基准点进行测高，以将突起所在区域的基准点的测高值作为该区域的基准高度。
  6. 根据权利要求4所述的突起高度检测方法，还包括：
    当所述突起的实际高度大于等于修复阈值时，对所述突起进行研磨。
  7. 根据权利要求4-6中任一所述的突起高度检测方法，其中，所述突起的实际高度为突起的测定高度与基准高度的差值。
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