WO2016143462A1 - 薄膜トランジスタ基板、表示パネル、レーザーアニール方法 - Google Patents
薄膜トランジスタ基板、表示パネル、レーザーアニール方法 Download PDFInfo
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- WO2016143462A1 WO2016143462A1 PCT/JP2016/054286 JP2016054286W WO2016143462A1 WO 2016143462 A1 WO2016143462 A1 WO 2016143462A1 JP 2016054286 W JP2016054286 W JP 2016054286W WO 2016143462 A1 WO2016143462 A1 WO 2016143462A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
- H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
- H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6732—Bottom-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6746—Amorphous silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
- H10D86/0229—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials characterised by control of the annealing or irradiation parameters
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
Definitions
- laser annealing is performed by selecting a channel region and irradiating laser light in a TFT region arranged for each pixel electrode or subpixel arranged in parallel in a dot matrix.
- the amorphous silicon layer in the entire channel region is made polysilicon, the charge mobility becomes high, and the reverse current cannot be kept low, and the off-current becomes high. For this reason, the potential holding characteristic is lowered, and a leakage current increases, which causes a problem of increasing power consumption.
- a pattern of the gate line 3 is formed on the substrate 1A, the gate line 3 is covered with a gate insulating film, and an amorphous silicon layer is laminated thereon. After that, annealing is performed by irradiating a specific portion where the channel region of the TFT 10 is to be formed with laser light.
- the position along the scanning direction S of the laser annealing portion 10A is determined by the setting pitch P0 set by the scanning speed and the pulse frequency of the laser light L. To increase the throughput, the scanning speed is increased and the pulse frequency is increased. Is increased, a position error is likely to occur along the scan direction S due to a laser oscillation time delay with respect to the pulse signal output. On the other hand, by making the direction of the channel width W orthogonal to the scan direction S, such a position error along the scan direction S causes the positional accuracy of the laser annealing portion 10A along the channel width W direction. No longer affects.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
- Electromagnetism (AREA)
Abstract
Description
基板上の縦列と横列に沿ってそれぞれ複数の薄膜トランジスタを配列した薄膜トランジスタ基板であって、各薄膜トランジスタは、チャネル領域を形成するアモルファスシリコン層をレーザーアニールしてポリシリコン層としたレーザーアニール部を備え、該レーザーアニール部は、レーザーアニールを行うレーザ光と前記基板とが相対的に移動するスキャン方向に沿った設定ピッチで配置され、前記スキャン方向に直交する方向に形成されたチャネル幅内に該チャネル幅よりも狭い前記レーザーアニール部を有することを特徴とする薄膜トランジスタ基板。
2:データ線,3:ゲート線,4:透明電極形成部,
10:薄膜トランジスタ(TFT),10A:レーザーアニール部,
11:ゲート電極,12:ゲート絶縁膜,13:アモルファスシリコン層,
14,15:ソース・ドレイン電極,16:保護層,17:透明導電パターン,
20:レーザ光照射装置,21:レーザ光源,22:ビームホモジナイザ,
23:照射光学系,24:マスク,
25:マイクロレンズアレイ,25L:レンズ,
26:基板搬送装置,
L:レーザ光,W:チャネル幅,S:スキャン方向,
Claims (9)
- 基板上の縦列と横列に沿ってそれぞれ複数の薄膜トランジスタを配列した薄膜トランジスタ基板であって、
各薄膜トランジスタは、チャネル領域を形成するアモルファスシリコン層をレーザーアニールしてポリシリコン層としたレーザーアニール部を備え、
該レーザーアニール部は、レーザーアニールを行うレーザ光と前記基板とが相対的に移動するスキャン方向に沿った設定ピッチで配置され、
前記スキャン方向に直交する方向に形成されたチャネル幅内に該チャネル幅よりも狭い前記レーザーアニール部を有することを特徴とする薄膜トランジスタ基板。 - 前記設定ピッチは、前記レーザ光と前記基板とが相対的に移動するスキャンの速度とレーザ光のパルス周波数で設定されることを特徴とする請求項1記載の薄膜トランジスタ基板。
- 前記レーザーアニール部は、前記スキャン方向に沿った幅が前記スキャン方向に直交する方向の幅より長いことを特徴とする請求項1又は2記載の薄膜トランジスタ基板。
- 前記レーザーアニール部は、前記スキャン方向の長さが前記スキャン方向に沿った前記チャネル幅の長さより長いことを特徴とする請求項1~3のいずれか1項に記載の薄膜トランジスタ。
- 各薄膜トランジスタは、前記基板上の縦列と横列に沿ってそれぞれ複数配列された透明電極パターン毎に配置され、
前記透明電極パターンは、前記スキャン方向に沿った幅が前記スキャン方向に直交する方向の幅より短いことを特徴とする請求項1~4のいずれか1項に記載の薄膜トランジスタ基板。 - 請求項1~5のいずれか1項に記載の薄膜トランジスタ基板を備えた表示パネル。
- 基板とレーザー光とを一軸方向に沿ってスキャンしながら、前記一軸方向に直交する方向に沿って、複数のレンズを配列したマイクロレンズアレイを移動させ、前記レーザ光を、前記レンズを通して、薄膜トランジスタのチャネル領域となる特定箇所に集光させ、前記特定箇所に前記基板上のアモルファスシリコン層をポリシリコン層とするレーザーアニール部を形成する方法であって、
前記レーザーアニール部は、前記一軸方向に沿って設定ピッチで配列され、
前記スキャンの方向に直交する方向に形成予定のチャネル幅内に所定形状の前記レーザーアニール部が形成されることを特徴とするレーザーアニール方法。 - 前記設定ピッチは、前記スキャンの速度と前記レーザ光のパルス周波数で設定されることを特徴とする請求項7記載のレーザーアニール方法。
- 前記レーザーアニール部は、前記スキャンの方向の長さが前記スキャンの方向に沿った前記チャネル幅の長さより長いことを特徴とする請求項7又は8に記載のレーザーアニール方法。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020177023620A KR20170123617A (ko) | 2015-03-11 | 2016-02-15 | 박막 트랜지스터 기판, 표시 패널, 레이저 어닐링 방법 |
| CN201680014402.4A CN107430990B (zh) | 2015-03-11 | 2016-02-15 | 薄膜晶体管基板、显示面板以及激光退火方法 |
| US15/556,728 US10026623B2 (en) | 2015-03-11 | 2016-02-15 | Thin film transistor substrate, display panel, and laser annealing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2015048394A JP6086394B2 (ja) | 2015-03-11 | 2015-03-11 | 薄膜トランジスタ基板、表示パネル、レーザーアニール方法 |
| JP2015-048394 | 2015-03-11 |
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| WO2016143462A1 true WO2016143462A1 (ja) | 2016-09-15 |
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| PCT/JP2016/054286 Ceased WO2016143462A1 (ja) | 2015-03-11 | 2016-02-15 | 薄膜トランジスタ基板、表示パネル、レーザーアニール方法 |
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| Country | Link |
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| US (1) | US10026623B2 (ja) |
| JP (1) | JP6086394B2 (ja) |
| KR (1) | KR20170123617A (ja) |
| CN (1) | CN107430990B (ja) |
| TW (1) | TWI678809B (ja) |
| WO (1) | WO2016143462A1 (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20190140102A1 (en) | 2016-04-25 | 2019-05-09 | Sakai Display Products Corporation | Thin film transistor, display device, and thin film transistor manufacturing method |
| CN111162129A (zh) * | 2020-01-21 | 2020-05-15 | 京东方科技集团股份有限公司 | 晶体管及其制备方法、显示基板和显示装置 |
| CN113903653A (zh) * | 2020-06-22 | 2022-01-07 | 中国科学院微电子研究所 | 晶圆的处理方法及激光退火装置 |
| TWI887269B (zh) * | 2020-09-17 | 2025-06-21 | 晶智達光電股份有限公司 | 雷射封裝結構 |
| CN113325625B (zh) * | 2021-06-24 | 2022-07-29 | 业成科技(成都)有限公司 | 显示面板的制备方法 |
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| JP2009026877A (ja) * | 2007-07-18 | 2009-02-05 | Sharp Corp | 半導体装置及びその製造方法 |
| JP2009289874A (ja) * | 2008-05-28 | 2009-12-10 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| JP2014120686A (ja) * | 2012-12-18 | 2014-06-30 | Japan Steel Works Ltd:The | 結晶半導体膜の製造方法 |
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| JP3580033B2 (ja) * | 1996-06-20 | 2004-10-20 | ソニー株式会社 | 薄膜半導体装置及びその製造方法とレーザアニール装置 |
| JP3845569B2 (ja) * | 2001-11-08 | 2006-11-15 | セイコーエプソン株式会社 | 薄膜半導体装置及びその製造方法並びに当該装置を備える電子デバイス |
| KR100462862B1 (ko) * | 2002-01-18 | 2004-12-17 | 삼성에스디아이 주식회사 | 티에프티용 다결정 실리콘 박막 및 이를 이용한디스플레이 디바이스 |
| JP5471046B2 (ja) | 2009-06-03 | 2014-04-16 | 株式会社ブイ・テクノロジー | レーザアニール方法及びレーザアニール装置 |
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| WO2013061383A1 (ja) * | 2011-10-28 | 2013-05-02 | パナソニック株式会社 | 薄膜半導体装置及びその製造方法 |
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| KR102151751B1 (ko) * | 2013-07-19 | 2020-10-27 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 이를 포함하는 유기 발광 표시 장치 |
| US10038098B2 (en) * | 2014-11-07 | 2018-07-31 | Sakai Display Products Corporation | Method for manufacturing thin film transistor, thin film transistor and display panel |
| JP6334057B2 (ja) * | 2015-03-27 | 2018-05-30 | 堺ディスプレイプロダクト株式会社 | 薄膜トランジスタ及び表示パネル |
-
2015
- 2015-03-11 JP JP2015048394A patent/JP6086394B2/ja active Active
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2016
- 2016-02-15 US US15/556,728 patent/US10026623B2/en not_active Expired - Fee Related
- 2016-02-15 KR KR1020177023620A patent/KR20170123617A/ko not_active Withdrawn
- 2016-02-15 WO PCT/JP2016/054286 patent/WO2016143462A1/ja not_active Ceased
- 2016-02-15 CN CN201680014402.4A patent/CN107430990B/zh not_active Expired - Fee Related
- 2016-03-09 TW TW105107242A patent/TWI678809B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006725A (ja) * | 2002-03-26 | 2004-01-08 | Semiconductor Energy Lab Co Ltd | 半導体装置、その作製方法及び設計方法 |
| JP2009026877A (ja) * | 2007-07-18 | 2009-02-05 | Sharp Corp | 半導体装置及びその製造方法 |
| JP2009289874A (ja) * | 2008-05-28 | 2009-12-10 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| JP2014120686A (ja) * | 2012-12-18 | 2014-06-30 | Japan Steel Works Ltd:The | 結晶半導体膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107430990A (zh) | 2017-12-01 |
| US20180061661A1 (en) | 2018-03-01 |
| JP6086394B2 (ja) | 2017-03-01 |
| TWI678809B (zh) | 2019-12-01 |
| KR20170123617A (ko) | 2017-11-08 |
| US10026623B2 (en) | 2018-07-17 |
| JP2016171116A (ja) | 2016-09-23 |
| TW201637204A (zh) | 2016-10-16 |
| CN107430990B (zh) | 2020-08-14 |
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