WO2016140377A1 - Sonde d'antenne à fente, et appareil et procédé permettant d'inspecter des défauts d'un semi-conducteur multijonction l'utilisant - Google Patents

Sonde d'antenne à fente, et appareil et procédé permettant d'inspecter des défauts d'un semi-conducteur multijonction l'utilisant Download PDF

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Publication number
WO2016140377A1
WO2016140377A1 PCT/KR2015/001993 KR2015001993W WO2016140377A1 WO 2016140377 A1 WO2016140377 A1 WO 2016140377A1 KR 2015001993 W KR2015001993 W KR 2015001993W WO 2016140377 A1 WO2016140377 A1 WO 2016140377A1
Authority
WO
WIPO (PCT)
Prior art keywords
junction semiconductor
light
slit
terahertz
defect
Prior art date
Application number
PCT/KR2015/001993
Other languages
English (en)
Korean (ko)
Inventor
김근주
김재홍
김정일
윤지녕
임미현
Original Assignee
한국전기연구원
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국전기연구원, 삼성전자주식회사 filed Critical 한국전기연구원
Priority to PCT/KR2015/001993 priority Critical patent/WO2016140377A1/fr
Priority to KR1020177021720A priority patent/KR102274264B1/ko
Publication of WO2016140377A1 publication Critical patent/WO2016140377A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G01R1/071—Non contact-making probes containing electro-optic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/24—Transmission-line, e.g. waveguide, measuring sections, e.g. slotted section
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
    • G01R31/275—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements for testing individual semiconductor components within integrated circuits

Abstract

L'invention concerne un appareil permettant d'inspecter des défauts d'un semi-conducteur multijonction selon un mode de réalisation, l'appareil étant caractérisé en ce qu'il comprend : une source de lumière ; une sonde d'antenne à fente ; une partie de rayonnement de lumière parallèle ; une partie de collecte de lumière ; une partie de distribution de lumière ; une première partie de détection de lumière ; une seconde partie de détection de lumière ; une partie de génération de signal d'image ; et une partie d'analyse de signal d'image, la sonde d'antenne à fente comprenant : une partie de guidage permettant de guider la lumière térahertz générée par la source de lumière ; et une fente pénétrant par un espace externe entre la partie de guidage et la sonde d'antenne à fente, une structure de réduction de réflexion permettant de réduire le degré de réflexion de la lumière térahertz passant par la partie de guidage et passant par la fente étant formée sur la fente.
PCT/KR2015/001993 2015-03-02 2015-03-02 Sonde d'antenne à fente, et appareil et procédé permettant d'inspecter des défauts d'un semi-conducteur multijonction l'utilisant WO2016140377A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/KR2015/001993 WO2016140377A1 (fr) 2015-03-02 2015-03-02 Sonde d'antenne à fente, et appareil et procédé permettant d'inspecter des défauts d'un semi-conducteur multijonction l'utilisant
KR1020177021720A KR102274264B1 (ko) 2015-03-02 2015-03-02 슬릿 안테나 프로브, 및 이를 이용한 다중 접합 반도체의 결함 검사 장치 및 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2015/001993 WO2016140377A1 (fr) 2015-03-02 2015-03-02 Sonde d'antenne à fente, et appareil et procédé permettant d'inspecter des défauts d'un semi-conducteur multijonction l'utilisant

Publications (1)

Publication Number Publication Date
WO2016140377A1 true WO2016140377A1 (fr) 2016-09-09

Family

ID=56848235

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/001993 WO2016140377A1 (fr) 2015-03-02 2015-03-02 Sonde d'antenne à fente, et appareil et procédé permettant d'inspecter des défauts d'un semi-conducteur multijonction l'utilisant

Country Status (2)

Country Link
KR (1) KR102274264B1 (fr)
WO (1) WO2016140377A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114096863A (zh) * 2019-07-10 2022-02-25 浜松光子学株式会社 半导体器件检查方法及半导体器件检查装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100002492A (ko) * 2008-06-30 2010-01-07 관동대학교산학협력단 도파관 슬롯 배열 안테나 및 평면형 슬롯 배열 안테나
US20100134370A1 (en) * 2008-12-03 2010-06-03 Electronics And Telecommunications Research Institute Probe and antenna using waveguide
US20120268153A1 (en) * 2011-04-22 2012-10-25 Nickel Joshua G Non-contact test system
KR20130005748A (ko) * 2011-07-07 2013-01-16 한국전기연구원 다중 접합 반도체의 공극 검사 장치 및 방법
KR20140066875A (ko) * 2012-11-23 2014-06-03 한국전기연구원 비파괴 검사를 위한 고출력 테라헤르츠 신호원 기반 실시간 검출 및 영상 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5406194A (en) * 1992-09-21 1995-04-11 At&T Corp. Alx Ga1-x as probe for use in electro-optic sampling
KR20150004146A (ko) * 2013-07-02 2015-01-12 엘아이지에이디피 주식회사 테라헤르츠를 이용한 검사 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100002492A (ko) * 2008-06-30 2010-01-07 관동대학교산학협력단 도파관 슬롯 배열 안테나 및 평면형 슬롯 배열 안테나
US20100134370A1 (en) * 2008-12-03 2010-06-03 Electronics And Telecommunications Research Institute Probe and antenna using waveguide
US20120268153A1 (en) * 2011-04-22 2012-10-25 Nickel Joshua G Non-contact test system
KR20130005748A (ko) * 2011-07-07 2013-01-16 한국전기연구원 다중 접합 반도체의 공극 검사 장치 및 방법
KR20140066875A (ko) * 2012-11-23 2014-06-03 한국전기연구원 비파괴 검사를 위한 고출력 테라헤르츠 신호원 기반 실시간 검출 및 영상 장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114096863A (zh) * 2019-07-10 2022-02-25 浜松光子学株式会社 半导体器件检查方法及半导体器件检查装置
EP3998476A4 (fr) * 2019-07-10 2023-08-09 Hamamatsu Photonics K.K. Procédé et dispositif d'inspection de dispositif à semi-conducteur et dispositif d'inspection de dispositif à semi-conducteur
US11967061B2 (en) 2019-07-10 2024-04-23 Hamamatsu Photonics K.K. Semiconductor apparatus examination method and semiconductor apparatus examination apparatus

Also Published As

Publication number Publication date
KR20170139496A (ko) 2017-12-19
KR102274264B1 (ko) 2021-07-07

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