WO2016139278A1 - Verkleben von abdichtungsmembranen auf elektrisch leitenden untergründen mittels induktion - Google Patents
Verkleben von abdichtungsmembranen auf elektrisch leitenden untergründen mittels induktion Download PDFInfo
- Publication number
- WO2016139278A1 WO2016139278A1 PCT/EP2016/054476 EP2016054476W WO2016139278A1 WO 2016139278 A1 WO2016139278 A1 WO 2016139278A1 EP 2016054476 W EP2016054476 W EP 2016054476W WO 2016139278 A1 WO2016139278 A1 WO 2016139278A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- adhesive layer
- electrically conductive
- sealing
- adhesive
- Prior art date
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Classifications
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
- C09J2463/006—Presence of epoxy resin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/16—Flooring, e.g. parquet on flexible web, laid as flexible webs; Webs specially adapted for use as flooring; Parquet on flexible web
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2201/00—Joining sheets or plates or panels
- E04F2201/07—Joining sheets or plates or panels with connections using a special adhesive material
Definitions
- the invention relates to the field of sealing substrates, especially in the construction sector, e.g. of floors or roofs, with sealing membranes.
- Substrates that need to be sealed against water, especially concrete structures, are found in many civil engineering. Such substrates and substrates are typically sealed by bituminous sheets or plastic membranes. However, due to the viscoelastic behavior with a wide phase transition at room temperature, bitumen membranes are susceptible to temperature variations. In contrast, elastic plastic membranes have a constant elastic behavior over a wide temperature range and thus fulfill their function as a seal even under extreme temperature conditions.
- Roof membranes are either loosely laid and weighted, selectively mechanically fixed or glued over their entire surface.
- an applied force such as e.g. Wind load
- an applied force distributed over a large area, while stress peaks occur during mechanical fixation.
- the membrane is not pierced when sticking.
- Rhinobond system Another approach to attaching sealing membranes is the Rhinobond system available on the market.
- the Rhinobond system is a mixture of mechanically fixed and selectively inductive bonded membrane.
- metal plates on which a hot melt adhesive is applied, fixed on the substrate to be sealed. It is advantageous that no penetration of the membrane is required.
- the sealing membrane need not have an adhesive layer, since the adhesive already applied to the Rhinobond plate.
- the disadvantage is still the selective fixation.
- the adhesive is thermally "activated” (melted) in practice with a gas flame or, if a pressure sensitive adhesive (PSA) is used, a release film is peeled off
- Activation of the adhesive layer for example, a treatment of the hot melt adhesive layer with hot air, flame, ultrasound or
- EP 2 662 213 A1 proposes indirect heating with hot air or flame treatment, but on the one hand this is sufficiently heat-resistant
- Membrane material and on the other hand requires a higher heat input.
- the object of the present invention is therefore to provide a
- Sealing system to provide which does not have the disadvantages of the prior art.
- the sealing system should be easy and efficient to create and apply and lead to a good bond between the sealing membrane and substrate. It should also be possible a full-surface bonding. Furthermore, a high watertightness is to be ensured. Surprisingly, it has been found that this problem can be solved by inductive bonding of a sealing membrane to a substrate having electrically conductive surface areas.
- the invention relates to a method of sealing a substrate having one or more electrically conductive surface regions
- the sealing method according to the invention makes it possible to seal a substrate having an electrically conductive surface area in a quick and cost-efficient manner, in particular a concrete structure having electrically conductive surface areas.
- Rewind sealing membrane to allow the heating of the adhesive as is necessary for example in gas flame heating, ie the aligned membrane does not have to be moved to effect the bonding.
- “above” in the context of the positioning of the induction heater it is meant that the induction heater is to be positioned on the side of the sealing membrane facing away from the hot melt adhesive layer.
- thermal stress on the sealing membrane is largely avoided because the electrically conductive surface regions are selectively heated by the induction and the heat can then be transferred directly to the hotmelt adhesive layer.
- a major advantage of this approach is that the adhesive already during his Liquefaction with the substrate in contact, so that the membrane after liquefaction does not have to be moved. This facilitates exact positioning and bonding of the membrane.
- an advantageous, full-surface bonding can be achieved because the adhesive coating on the back of the membrane and not on the inductively heated, electrically conductive material is present.
- sealing devices can also without open
- Flame are applied to a substrate, which is in particular a safety advantage.
- FIGs 1 and 2 show schematically sealing foils which are suitable for the invention.
- FIG. 3 is a diagram showing the required surface energy for
- Figure 4 is a graph showing the penetration depth of the electromagnetic field into various metals versus frequency.
- Figure 5 is a graph showing the heating time versus power output of the various metal induction apparatus.
- the sealing membrane is adhered to a substrate having electrically conductive surface areas.
- the material of the substrate is for example wood, metal, a metal alloy, a mineral binder such as concrete or plaster, plastic or thermal insulation such as foamed polyurethane, mineral wool or foamed glass (foam glass).
- the material is particularly preferably wood, metal, a metal alloy or concrete, in particular concrete.
- the substrate has one or more electrically conductive surface areas.
- the substrate may be provided with the electrically conductive surface over part of its area or over its entire area, wherein the substrate is preferably provided with the electrically conductive surface over its full area. If the substrate is partially provided with the electrically conductive surface, the areas may be e.g. as webs distributed at the edges of the substrate and / or as isolated areas on the substrate in a suitable pattern or in any convenient pattern.
- the electrically conductive surface is generally made of a metal or a metal alloy.
- a suitable metal are steel, in particular stainless steel, aluminum, brass, copper or zinc.
- the electrically conductive surface may e.g. be formed of at least one part selected from metal plates, aluminum foil, sheets, especially edge plates or vapor barriers.
- Metal plates are e.g. used in structures for fixing the insulation.
- Aluminum foil can be used as a vapor barrier on the insulation.
- the substrate may be composed of one or more parts made of the same or a different material, at least part of which is electrically conductive.
- the electrically conductive parts can be arranged on a base body of the substrate, preferably a concrete structure, and optionally fixed.
- the substrate is preferably a concrete structure having one or more electrically conductive surface areas formed by parts arranged on the concrete structure and possibly fixed.
- the concrete structure may have further layers applied thereto, such as an insulating layer, which are then located between the concrete structure and the electrically conductive parts.
- the concrete surface may be pretreated with an epoxy resin based primer.
- the substrate is preferably part of a building, in particular civil engineering.
- the substrate having one or more electrically conductive surface regions is particularly preferably a floor or a roof, in particular a flat roof, or a part thereof.
- the sealing membrane 1 comprises a plastic layer 2, which is also referred to as a Schott layer, and an outer adhesive layer 3 made of a hotmelt adhesive.
- Figure 1 shows a sealing membrane consisting of these two layers.
- the sealing membrane may also comprise further layers and / or reinforcing elements.
- As a plastic layer in particular films in particular flexible films are suitable. Such films are widely used for sealing purposes in civil engineering in the art and are commercially available. These can easily be rolled. The sealing membrane can thus be unrolled on site and optionally cut to the required dimensions.
- the plastic layer is preferably made of a material having a softening temperature of over 60 ° C, more preferably in the range of 70 to 150 ° C, more preferably in the range of 80 ° C and 130 ° C.
- the plastic layer preferably has a thickness of 0.05 to 10 mm, in particular 1 to 5 mm.
- the plastic layer 2 has a foamed part 2a on the side facing the adhesive layer 3. This is shown for example in FIG. This is advantageous in that less heat input is needed to heat the adhesive layer. Furthermore, it is advantageous if the thickness of the foamed part of the plastic layer 2a is 20 to 80%, in particular 45 to 65%, of the total thickness of the plastic layer 2.
- the foamed part of the plastic layer preferably has a density of 200-700 kg / m 3 , in particular 300-500 kg / m 3 .
- the plastic layer preferably comprises at least one thermoplastic polymer.
- the thermoplastic polymer are high density polyethylene (HDPE), medium density polyethylene (MDPE), low density polyethylene (LDPE), polyethylene (PE), polypropylene (PP), Polyethylene terephthalate (PET), polystyrene (PS), polyvinyl chloride (PVC), polyamides (PA), ethylene-vinyl acetate (EVA), chlorosulfonated polyethylene, and polyolefin-based thermoplastic elastomers (TPO), and mixtures thereof.
- HDPE high density polyethylene
- MDPE medium density polyethylene
- LDPE low density polyethylene
- PE polyethylene
- PP polypropylene
- PET Polyethylene terephthalate
- PS polystyrene
- PVC polyvinyl chloride
- PA polyamides
- EVA ethylene-vinyl acetate
- TPO polyolefin-based thermoplastic elastomers
- the thermoplastic polymer is a thermoplastic polyolefin and / or polyvinyl chloride (PVC).
- PVC polyvinyl chloride
- Most preferred is polyethylene (PE) or a copolymer of ethylene and propylene.
- the plastic layer preferably comprises more than 40% by weight of one or more thermoplastic polymers, in particular the preferred thermoplastic polymers listed above, based on the total weight of the plastic layer.
- the plastic layer comprises 70 to 100 wt .-%, in particular 90 to 100 wt .-% of polyethylene (PE) and / or copolymer of ethylene and propylene, based on the total weight of the polymers in the plastic layer.
- PE polyethylene
- the plastic layer comprises polyvinyl chloride, in particular soft PVC, which is preferably a flexible polyvinyl chloride sealing film.
- Soft PVC contains especially plasticizers, typically phthalate plasticizers.
- the plastic layer may also contain additives and / or processing agents, such as e.g. Fillers, UV and heat stabilizers, plasticizers, lubricants, biocides, flame retardants, antioxidants, pigments, e.g. Titanium dioxide or carbon black, and dyes.
- additives and / or processing agents such as e.g. Fillers, UV and heat stabilizers, plasticizers, lubricants, biocides, flame retardants, antioxidants, pigments, e.g. Titanium dioxide or carbon black, and dyes.
- the plastic layer may optionally and preferably a
- Carrier layer have.
- the carrier layer contributes to the dimensional stability of the plastic layer.
- the carrier layer may be formed of fibers or a grid, preferred are carrier layers of fibers. They may be organic, inorganic or synthetic fibers. Examples of organic fibers are cellulose, cotton and protein fibers. Examples of inorganic fibers are glass fibers. Examples of synthetic fibers are fibers of polyester or of a homo- or copolymers of ethylene and / or propylene and of viscose.
- the carrier layer of fibers is, for example, a woven fabric, scrim or knitted fabric, wherein the carrier layer is preferably a felt or non-woven.
- the carrier layer is embedded in the plastic layer.
- the carrier layer advantageously has gaps, which are at least partially penetrated by the material of the plastic layer.
- the sealing membrane comprises an outer adhesive layer of a hot melt adhesive.
- the adhesive layer is disposed on an outer side of the sealing membrane.
- the adhesive layer is preferably connected directly to the plastic layer.
- the adhesive layer can be present over the whole or partial area, preferably over the whole area, on the outside of the sealing membrane.
- Hot melt adhesives are solid at room temperature (23 ° C) and can be melted or fused by heating. Upon cooling, they solidify again and thereby build up an adhesive force with the object to be bonded.
- the adhesive layer is a melt adhesive layer, i. she is at
- the adhesive layer is tack-free at 23 ° C.
- the term "tack-free” is understood here to be an instant tack or "tack” which is so low at 23 ° C. that when pressing with a thumb with a pressure of approximately 5 kg for 1 second on the surface of the adhesive layer, the thumb does not sticking to the surface of the adhesive layer or the adhesive layer can not be raised.
- the sealing device can be stored, transported and processed more easily. In particular, a displacement on the substrate for positioning is possible.
- the hot-melt adhesive used is a hot-melt adhesive based on ethylene-vinyl acetate (EVA), ie with ethylene-vinyl acetate as the essential functional constituent.
- EVA ethylene-vinyl acetate
- the hot melt adhesive has a softening point which is below the softening point of the plastic of the plastic layer, and in particular at least about 10 Kelvin below the softening point of the plastic of the plastic layer, since otherwise the membrane can be damaged during heating.
- the softening point is measured here by the Ring & Ball method, eg in accordance with DIN EN 1238.
- the thickness of the applied hotmelt adhesive or the layer thickness of the adhesive layer is preferably in the range of about 0.01 to 5 mm, preferably about 0.05 to 2 mm, and most preferably in the range of about 0.1 to 1 mm.
- the hot melt adhesive of the adhesive layer may be a non-reactive or reactive hot melt adhesive, with a non-reactive hot melt adhesive being preferred.
- the adhesive layer may be a chemical
- Propellants especially azodicarbonamide.
- the hotmelt adhesive or the adhesive layer preferably comprises at least one polymer selected from ethylene-vinyl acetate (EVA), thermoplastic polyolefin, in particular atactic poly- ⁇ -olefin (APAO), polyurethane (PUR), in particular thermoplastic polyurethane
- EVA ethylene-vinyl acetate
- APAO atactic poly- ⁇ -olefin
- PUR polyurethane
- thermoplastic polyurethane is also called thermoplastic
- the hot melt adhesive or the adhesive layer preferably comprises
- Propellant in particular azodicarbonamide, or
- Plastic layer and the outer adhesive layer may be arranged a barrier layer.
- a barrier layer If e.g. as a hot melt adhesive, a composition containing ingredients, e.g. in the form of plasticizers, which migrate into the plastic layer, which is usually impermeable to water, and may affect their functionality, it may be useful to apply such a barrier layer between the coating of the hot melt adhesive and the water-impermeable substrate layer.
- the sealing membrane has a covering layer, which is preferably mounted on the plastic layer on the side facing away from the adhesive layer.
- the topcoat may contain the sealant membrane e.g. protect from aging by sunlight.
- the topcoat contains color pigments, damage on the side of the sealing membrane facing away from the adhesive layer, e.g. due to transport or laying, be detected by a lack of topcoat at the damaged site.
- a release paper e.g. a siliconized release paper to apply before rolling the membrane, which is removed before bonding again.
- the release paper can serve to prevent blocking during rolling up and transport.
- the sealing membrane is typically used as a prefabricated sheet, particularly in the form of a roll.
- the sealing membrane can also be used in the form of strips with a width of, for example, 1 to 20 cm, for example, to seal joints between two roofing membranes.
- the sealing membrane can also be present and used in the form of flat bodies for repairing damaged areas in seals, for example roofing membranes.
- the sealing membrane is arranged on the substrate, wherein the outer adhesive layer faces the substrate.
- the arrangement of the sealing membrane on the substrate can take place, for example, by unrolling the sealing membrane or laying the sealing membrane.
- the sealing membrane is cut to size as needed. If the adhesive layer is tack-free, the sealing membrane can be conveniently slid or positioned on the substrate prior to heating.
- the hot melt adhesive is heated to melt or melt.
- the heating is done inductively.
- an induction heater is positioned over the arranged sealing membrane. It is understood that the term “over” refers to the side of the sealing membrane that is opposite to the substrate.
- the induction heater is conveniently positioned directly on or just slightly above the sealing membrane, i. the distance between the induction heater and the sealing membrane is preferably less than 10 mm, or the induction heater and the sealing membrane touch each other.
- the induction heater is positioned so that it is also over an electrically conductive surface area of the substrate. It is further understood that after bonding, the induction heater is positioned at one point continuously or discontinuously to another site to be bonded, and the process is repeated until all areas to be bonded have been heated in this manner.
- Hot melt adhesive is accomplished by inductively heating the electrically conductive surface areas of the substrate with the induction heater positioned above the sealing membrane.
- the hot-melt adhesive is melted or fused and, after cooling, forms an adhesive bond between the hot-melt adhesive and the substrate or, respectively, the electrically conductive regions of the substrate.
- the sealing membrane and the substrate are bonded in this way.
- the hot melt adhesive or the adhesive layer is preferably heated to a temperature in the range of 60 to 250 ° C, preferably 90 to 200 ° C, for melting or melting.
- Melting is understood to mean the melting of a layer near the surface. Thus, not the entire layer thickness of the hotmelt is heated above its melting point (T m ) or softening point, but only a part thereof, from the surface to a certain, not precisely defined penetration depth.
- the electrically conductive parts or surface regions of the substrate are heated under the sealing membrane from above the membrane by means of an induction device and melt or melt or activate by thermal radiation the hot melt adhesive thereon, which is pre-applied on the underside of the membrane. After cooling, this results in an adhesive bond between the membrane and the electrically conductive part or the electrically conductive surface or between the membrane and the substrate.
- Induction heaters are known in the art and commercially available.
- the induction heater is preferably at a frequency in the range of 10 to 1000 kHz, the power output preferably being at least 1 W, more preferably a frequency in the range of 50 to 600 kHz, the power output preferably being at least 10 W, and most preferred a frequency in the range of 50 to 400 kHz, wherein the power output is preferably at least 100 W operated.
- the induction heater is preferably operated with a power output of at least 1 W, more preferably at least 10 W, and most preferably at least 100 W.
- the minimum energy required to be incorporated into the hot melt adhesive results from the energy for heating and melting a near-surface layer of the adhesive to the electrically conductive surface.
- the former is due to the specific heat capacity and the melting or Softening temperature of the adhesive defined, the latter by the heat of fusion.
- the near-surface layer is subsequently assumed to be 0.1 mm thick.
- the required energy is determined by the volume of the adhesive to be heated.
- the thickness of the adhesive layer is predetermined by the sealing membrane.
- the volume to be heated is defined.
- the inductor of the induction heater emits the electromagnetic field which heats the electrically conductive parts by inducing an "eddy" current.
- FIG. 3 shows the required surface energy for heating and melting for the near-surface adhesive layer of 0.1 mm for adhesives comprising EVA, TPU or PP-based polymers.
- the minimum required surface energy is preferably at least about 0.015 J / mm 2 .
- the area energy refers to the energy radiated by the inductor of the induction heater based on the area of the inductor.
- the penetration depth of the electromagnetic field into the electrical conductor is decisive for the efficiency of inductive heating.
- the penetration depth generally decreases with increasing conductivity.
- the penetration depths of aluminum and stainless steel differ by a factor of 5 at the same frequency.
- the penetration depths of copper are even lower than of aluminum, while brass lies between aluminum and stainless steel.
- Another aspect of the present invention relates to a substrate sealed with a sealing membrane obtainable by the method of the invention.
- Another aspect of the present invention relates to the use of a sealing membrane comprising a plastic layer and an outer adhesive layer of a hot melt adhesive for inductive bonding to a substrate.
- the substrate has metallic surface areas which may be attached beforehand.
- a preferred use of the sealing membrane is the use for inductive bonding to substrates, which are parts of buildings of civil engineering, in particular of roofs and floors or parts thereof, wherein the glued sealing membrane, in particular seals against moisture.
- a sealing membrane SikaPlan G410 - 12EL from Sika für AG a PVC roof membrane with a layer thickness of 1, 2 mm, was used.
- an EVA hot melt adhesive was applied as an adhesive layer with a layer thickness of 0.2 mm.
- the substrates used were stainless steel with layer thicknesses of about 30 ⁇ m or 125 ⁇ m and aluminum with layer thicknesses of about 30 ⁇ m.
- the PVC membrane was placed with the adhesive layer down on the substrate.
- Figure 5 shows the measured heating time of 25-100 ° C for an area of 15x460 mm of the combination membrane / adhesive of Examples 1-7 at an induction frequency of 100kHz as a function of output power.
- the open triangles represent the same heating times as the full rhombuses, but plotted as a function of 6 times power.
- Examples 3 and 7 show that for both tested electrically conductive materials aluminum and stainless steel, the increase in the frequency leads to a reduction in the heating time, or to an increase in the heating rate.
- Example 4 shows that a thicker layer of the electrical conductor at the same frequency also leads to a reduction of the heating time. Both observations (frequency and layer thickness of the conductor) are in line with the penetration depth of the electromagnetic field into the electrical conductor. The increased frequency concentrates the output power output in a thinner layer while the thicker layer absorbs an increased level of the output power output. The efficiency of inductive heating is thus increased.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US15/551,585 US20180179418A1 (en) | 2015-03-04 | 2016-03-02 | Adhering sealing membranes onto electrically conductive substrates by means of induction |
DE112016001025.7T DE112016001025A5 (de) | 2015-03-04 | 2016-03-02 | Verkleben von Abdichtungsmembranen auf elektrisch leitenden Untergründen mittels Induktion |
GB1714801.6A GB2553437A (en) | 2015-03-04 | 2016-03-02 | Adhering sealing membranes onto electrically conductive substrates by means of induction |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15157504 | 2015-03-04 | ||
EP15157504.0 | 2015-03-04 |
Publications (1)
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WO2016139278A1 true WO2016139278A1 (de) | 2016-09-09 |
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PCT/EP2016/054476 WO2016139278A1 (de) | 2015-03-04 | 2016-03-02 | Verkleben von abdichtungsmembranen auf elektrisch leitenden untergründen mittels induktion |
Country Status (4)
Country | Link |
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US (1) | US20180179418A1 (de) |
DE (1) | DE112016001025A5 (de) |
GB (1) | GB2553437A (de) |
WO (1) | WO2016139278A1 (de) |
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CN109844241A (zh) * | 2018-06-13 | 2019-06-04 | 浙江晶通塑胶有限公司 | 一种轻质塑胶地板及其生产工艺 |
WO2020049022A1 (en) * | 2018-09-04 | 2020-03-12 | Sika Technology Ag | Adhesive composition and use thereof for enabling detection of leakages in fully-adhered roof systems |
US11168232B2 (en) * | 2018-02-23 | 2021-11-09 | Ardex Group Gmbh | Methods of installing tile using a reactivatable tile bonding mat |
WO2024083444A1 (de) * | 2022-10-18 | 2024-04-25 | Robert Bosch Gmbh | Klebemittel zur bestückung von leiterplatten, leiterplatte dieses umfassend und deren verwendung |
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DE102019101375B4 (de) | 2018-07-31 | 2022-09-29 | Textilforschungsinstitut Thüringen-Vogtland e.V. | Verfahren zur Ausbildung einer flächigen elektrischen Kontaktierung und mechanischen Verbindung und textiles Bekleidungsstück |
CN114292598A (zh) * | 2021-12-30 | 2022-04-08 | 广东汇齐新材料有限公司 | 一种高粘着强度的tpu热熔胶膜及其制备方法 |
CN115287013A (zh) * | 2022-07-28 | 2022-11-04 | 广东汇齐新材料有限公司 | 一种生物质tpu热熔胶膜及其制备方法 |
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WO2001042576A1 (de) * | 1999-12-10 | 2001-06-14 | Cmv Ag, Consulting-Montage- Verfahrenstechnik | Verfahren, vorrichtung und hotmelt-klebstoff zur abdichtung von fugen und/oder oberflächen von bauwerken |
EP2428537A1 (de) * | 2010-09-13 | 2012-03-14 | Sika Technology AG | Abdichtungsmembran mit verbesserter Haftung |
EP2662213A1 (de) * | 2012-05-07 | 2013-11-13 | Sika Technology AG | Abdichtungsvorrichtung mit verbesserter Haftung |
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JPS6299550A (ja) * | 1985-10-24 | 1987-05-09 | 株式会社ブリヂストン | 防水積層シ−トおよび防水施工法 |
SE501045C2 (sv) * | 1990-09-17 | 1994-10-24 | Roofer Int Ab | Sätt vid läggning av takpapp och anordning för genomförande av förfarandet |
WO2001033909A2 (en) * | 1999-11-03 | 2001-05-10 | Nexicor Llc | Hand held induction tool |
BR112013011465A2 (pt) * | 2010-11-08 | 2016-08-09 | Amcol International Corp | impermeabilização soldada por indução |
-
2016
- 2016-03-02 WO PCT/EP2016/054476 patent/WO2016139278A1/de active Application Filing
- 2016-03-02 DE DE112016001025.7T patent/DE112016001025A5/de not_active Withdrawn
- 2016-03-02 US US15/551,585 patent/US20180179418A1/en not_active Abandoned
- 2016-03-02 GB GB1714801.6A patent/GB2553437A/en not_active Withdrawn
Patent Citations (3)
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WO2001042576A1 (de) * | 1999-12-10 | 2001-06-14 | Cmv Ag, Consulting-Montage- Verfahrenstechnik | Verfahren, vorrichtung und hotmelt-klebstoff zur abdichtung von fugen und/oder oberflächen von bauwerken |
EP2428537A1 (de) * | 2010-09-13 | 2012-03-14 | Sika Technology AG | Abdichtungsmembran mit verbesserter Haftung |
EP2662213A1 (de) * | 2012-05-07 | 2013-11-13 | Sika Technology AG | Abdichtungsvorrichtung mit verbesserter Haftung |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11168232B2 (en) * | 2018-02-23 | 2021-11-09 | Ardex Group Gmbh | Methods of installing tile using a reactivatable tile bonding mat |
CN109844241A (zh) * | 2018-06-13 | 2019-06-04 | 浙江晶通塑胶有限公司 | 一种轻质塑胶地板及其生产工艺 |
WO2020049022A1 (en) * | 2018-09-04 | 2020-03-12 | Sika Technology Ag | Adhesive composition and use thereof for enabling detection of leakages in fully-adhered roof systems |
WO2024083444A1 (de) * | 2022-10-18 | 2024-04-25 | Robert Bosch Gmbh | Klebemittel zur bestückung von leiterplatten, leiterplatte dieses umfassend und deren verwendung |
Also Published As
Publication number | Publication date |
---|---|
GB201714801D0 (en) | 2017-11-01 |
GB2553437A (en) | 2018-03-07 |
US20180179418A1 (en) | 2018-06-28 |
DE112016001025A5 (de) | 2017-12-21 |
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