WO2016135907A1 - 光加工用ノズルおよび光加工装置 - Google Patents
光加工用ノズルおよび光加工装置 Download PDFInfo
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- WO2016135907A1 WO2016135907A1 PCT/JP2015/055484 JP2015055484W WO2016135907A1 WO 2016135907 A1 WO2016135907 A1 WO 2016135907A1 JP 2015055484 W JP2015055484 W JP 2015055484W WO 2016135907 A1 WO2016135907 A1 WO 2016135907A1
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- fluid
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- optical processing
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- optical
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/144—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/24—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means incorporating means for heating the liquid or other fluent material, e.g. electrically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/53—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/70—Gas flow means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/20—Cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
- B22F12/33—Platforms or substrates translatory in the deposition plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Definitions
- the present invention relates to an optical processing nozzle and an optical processing apparatus.
- Patent Document 1 discloses a laser processing head that allows a branched carrier gas to flow into a nozzle 4 from a plurality of inflow paths 9 and 10.
- An object of the present invention is to provide a technique for solving the above-described problems.
- the optical processing nozzle comprises: A light path provided so that light emitted from the light source can pass toward the processing surface; A flow path structure provided around the light beam path for injecting a fluid toward the processing surface; With The channel structure is An inlet for inflow of fluid; At least two passage holes through which the fluid flowing in from the inflow port passes; A flow path for guiding the fluid from the inlet to the passage hole; An injection port for injecting the fluid that has passed through at least two of the passage holes toward the processing surface; With At least two of the passage holes are provided to be spatially symmetrical with respect to the inlet; The exit is provided spatially symmetrically with respect to the optical axis of the light emitted from the light path.
- an optical processing head includes the processing nozzle and a condensing optical system device that condenses light from a light source and emits the light onto a processing surface.
- an optical processing apparatus contains the optical processing head, a light source, an optical transmission unit that transmits light emitted from the light source to the optical processing head, and the fluid.
- a fluid storage device and a fluid supply unit that supplies the fluid to the optical processing nozzle are provided.
- an optical processing nozzle capable of supplying a fluid uniformly to the processing surface.
- FIG. 1 shows a configuration of an optical processing nozzle 100 attached to the head end of an optical processing apparatus.
- the optical processing nozzle 100 includes a light beam path 101 and a flow path structure 102.
- the light beam path 101 is processed using a light beam 150 guided from a light source (not shown), it is provided so that the light beam 150 can pass toward the processing surface 160.
- a light source for example, a laser light source, an LED, a halogen lamp, or a xenon lamp can be used.
- the wavelength of the light beam is, for example, 1060 nm, but is not limited thereto, and the light beam 150 may be anything as long as it is absorbed by the processing surface 160.
- the fluid flowing through the flow channel structure 102 is, for example, a carrier gas that conveys powder.
- the powder is, for example, particles such as metal particles and resin particles.
- the carrier gas is an inert gas, and may be, for example, argon gas, nitrogen gas, or helium gas.
- the fluid is not limited to the carrier gas, and this structure may be used for the purge gas. In that case, since the concentration of the purge gas injected to the processing surface can be homogenized, it is possible to reduce deterioration due to oxidation of the modeled object.
- the flow path structure 102 is provided around the light beam path 101 in order to eject the fluid 130 toward the processing surface 160.
- the flow path structure 102 includes an inflow port 121 through which the fluid 130 flows, at least two through holes 122 through which the fluid 130 flowing in from the inflow port 121 passes, and a flow path 123 that guides the fluid 130 from the inflow port 121 to the through holes 122. And. Furthermore, the flow path structure 102 includes an injection port 125 that injects the fluid that has passed through the passage hole 122 toward the processing surface 160. Although two passage holes 122 are shown in FIG. 1, the present invention is not limited to this. Moreover, in FIG. 1, although the hole provided in the thin plate is made into the passage hole 122, this invention is not limited to this, You may employ
- the passage hole 122 is provided so as to be spatially symmetric with respect to the inflow port 121.
- the passage hole 122 is spatially symmetric with respect to the inlet 121 when it coincides with the passage hole 122.
- the fluid conductance is the same if the shape of the flow path from the inlet 121 to the passage hole 122 is the same. At this time, the gas flowing in from the inlet 121 is equally divided in the passage hole 122, and the flow rate through the passage hole 122 becomes equal.
- the exit port 125 is provided spatially symmetrically with respect to the optical axis 151 of the light beam 150 emitted from the light beam path 101.
- the exit port 125 is spatially symmetric with respect to the optical axis 151 when the exit port 125 coincides with a rotation angle of less than 360 °. .
- FIG. 1 one injection port 125 having a rotationally symmetric shape with respect to the optical axis 151 is shown.
- the present invention is not limited to this, and for optical processing having two or more injection ports. Nozzles are also included in the technical scope.
- the outlet 125 when the outlet 125 is rotated around the optical axis 151, the outlet 125 is light when the layout of the outlet 125 (position and shape of the whole outlet) matches at a rotation angle of less than 360 °.
- the rotational axis is symmetrical with respect to the axis 151.
- the outlets of the passage holes 122 may each function as an injection port, in which case the downstream cone portion 140 is unnecessary.
- the optical processing nozzle 100 capable of supplying fluid uniformly to the processing surface with a very simple configuration, and to reduce the uneven flow rate of the carrier gas on the processing surface, thereby improving processing accuracy. be able to.
- FIG. 2 is a diagram showing an internal configuration of the optical processing nozzle 200.
- the nozzle 200 Since the nozzle 200 performs processing using the light beam guided from the light source, the nozzle 200 is provided around the light beam path 201 and the light beam path 201 provided so that the light beam can pass toward the processing surface 260. And a flow path structure 202 for injecting a carrier gas 270 containing powder (hereinafter simply referred to as carrier gas) 270.
- carrier gas a carrier gas containing powder
- the flow path layer 220 includes an inlet 221 through which the carrier gas 270 flows, two passage holes 222 through which the carrier gas 270 that flows in from the inlet 221 passes, and a flow that guides the carrier gas 270 from the inlet 221 to the passage hole 222. Path 224.
- the flow path layer 230 includes two inlets 231 through which the carrier gas 270 flows, four passage holes 232 through which the carrier gas 270 that flows in from the inlet 231 passes, and the carrier gas 270 from the inlet 231 to the passage hole 232. And a flow path 234 for guiding.
- the flow path layer 230 is continuous with the flow path layer 220, and the openings on the downstream side of the passage holes 222 function as the inflow ports 231 as they are.
- the flow path layer 240 includes four inlets 241 through which the carrier gas 270 flows, eight passage holes 242 through which the carrier gas 270 that flows in from the inlet 241 passes, and the carrier gas 270 from the inlet 241 to the passage hole 242. And a channel 244 for guiding.
- the flow path layer 240 is continuous with the flow path layer 230, and the openings on the downstream side of the passage holes 232 function as the inflow ports 241 as they are.
- the injection layer 250 includes eight inflow ports 251 through which the carrier gas 270 flows, a channel 252 through which the carrier gas 270 that flows in from the inflow port 251 passes, and the carrier gas 270 from the channel 252 to the outside of the optical processing nozzle 200. And an injection port 253 for injecting.
- the injection layer 250 is continuous with the flow path layer 240, and the openings on the downstream side of the passage holes 242 function as the inflow ports 251 as they are.
- the passage hole 222 is provided so as to be spatially symmetric with respect to the inflow port 221.
- the passage hole 232 is provided so as to include at least one combination of a plurality of passage holes that are spatially symmetric with respect to the inlet 231, and the passage hole 242 is spatially defined with respect to the inlet 241.
- the passage holes 222 are arranged symmetrically with respect to a plane including the optical axis 254 of the light beam and passing through the center of the inflow port 221.
- any two passage holes 232 are arranged symmetrically with respect to a plane including the optical axis 254 of the light beam and passing through the center of the inflow port 231, and any two of the passage holes 242 are optical axes of the light beam. 254 and the plane passing through the center of the inflow port 241 is arranged symmetrically.
- the exit port 253 is provided spatially symmetrically with respect to the optical axis 254 of the light beam emitted from the light beam path 201.
- the exit 253 is an annular slit that is rotationally symmetric about the optical axis 254.
- the injection port 253 may be at least two arc-shaped slits arranged on the circumference.
- the flow path structure 202 has a structure in which four ring-shaped disks having openings at the center and the periphery are fitted around the light beam path 201. The number of openings provided in the ring-shaped disk increases as it goes downstream.
- the most upstream flow path layer 220 has a flow path 224 larger than the other flow path layers 230 and 340.
- the flow path 252 is tapered toward the downstream side by the cover 255. Thereby, the powder can be converged from the injection port 253 toward the processing surface 260. That is, the diameter of the powder spot formed on the processed surface 260 can be reduced, and high-definition modeling is possible.
- FIG. 3 is a longitudinal sectional view of the optical processing nozzle 200 cut along a plane passing through the optical axis.
- FIG. 4 is a diagram showing the AA section 401, the BB section 402, the CC section 403, and the DD section 404 in FIG. 3 in comparison. Each cross section corresponds to a cross-sectional view of each ring-shaped disk of the flow channel structure 202.
- the passage holes 222 (shown as passage holes 222 a and 222 b for easy understanding in FIG. 4) are provided so as to be spatially symmetric with respect to the inflow port 221.
- the spatial separation from the inlet 221 to the passage hole 222a is the same as the spatial separation from the inlet 221 to the passage hole 222b, and the carrier gas flowing in from the inlet 221 passes evenly. It flows into the holes 222a and 222b and is discharged to the next layer.
- the position of the inlet 231 in the cross section 402 is the same as that of the passage hole 222, so the passage hole 232 (shown here as passage holes 232 a to d for the sake of clarity) is connected to the inlet 231. On the other hand, they are provided so as to be spatially symmetrical (for example, arranged at equal distances). Further, since the position of the inlet 241 in the cross section 403 is the same as the passage hole 232, the passage hole 242 (shown here as passage holes 242a to h for the sake of clarity) is a space with respect to the inlet 241. It is provided so that it may become symmetrical.
- the fluid that has passed through the passage holes 222a is evenly guided to the passage holes 232a and 232b.
- the fluid passing through the passage hole 222b is equally guided to the passage holes 232c and 232d.
- the fluid that has passed through the passage hole 232a is equally guided to the passage holes 242a and 242b, and the fluid that has passed through the passage hole 232b is equally guided to the passage holes 242c and 242c.
- the fluid passing through the passage hole 232c is evenly guided to the passage holes 242e and 242f, and the fluid passing through the passage hole 232d is guided equally to the passage holes 242g and 242h.
- the flow path structure 202 including the three flow path layers 220 to 240 having the inlet and the passage hole has been described.
- the present invention is not limited to this, and the flow path layer is 1 One, two, or four or more may be used.
- the upstream side (opposite direction to the light beam direction) is the Ath flow path layer
- the downstream side (light beam direction and forward direction side) is the Bth flow path layer.
- the A-th channel layer includes an A-inlet through which fluid flows in, at least two A-thru holes through which the carrier gas that flows in from the A-inlet passes, and fluid from the A-inlet.
- An A-th flow path leading to the A-th passage hole is provided.
- the B-th flow path layer includes a B-th inlet that allows a fluid to flow in from the A-th passage hole, and has at least two B-th passage holes through which the fluid that flows in from the B-th inlet passes, and the B-th inlet.
- a B-th flow path that leads to the B-th passage hole is provided.
- the Ath passage hole is provided so as to be spatially symmetrical with respect to the inflow direction of the Ath inlet, and the Bth passage hole is spatially symmetrical with respect to the inflow direction of the Bth inlet. Is provided.
- the number of passage holes in the final layer is the Mth power of 2.
- the gap may be set to zero. This is because, when the gap is set to 0, the powder around the optical axis is uniformly distributed in any direction and is most isotropically distributed.
- the fluid can be most isotropic with a small number of layers.
- the carrier gas flowing in from the inflow port 221 can be equally divided in the nozzle 200, and finally the isotropy of the carrier gas injection to the processing surface can be improved. Thereby, a uniform powder spot without unevenness can be realized. At this time, the processing accuracy such as overlay welding is improved by condensing the light beam on the processing surface and forming a powder spot in the melted portion.
- the supply unit (inlet unit) for supplying powder to the nozzle it is not necessary to equally divide the powder, so that the inlet unit can be simplified. Thereby, the restriction
- FIG. 5 is a partially transparent perspective view for explaining the configuration of the optical processing nozzle 500 according to the present embodiment.
- the optical processing nozzle 500 according to the present embodiment is different from the second embodiment in that the cover 255 is not provided. Since other configurations and operations are the same as those of the second embodiment, the same configurations and operations are denoted by the same reference numerals, and detailed description thereof is omitted.
- the opening on the downstream side of the passage hole 242 becomes the injection port 553 as it is. That is, the injection port 553 includes a plurality of openings having the same shape. Of course, also in this case, the exit 553 is provided spatially symmetrically with respect to the optical axis 254.
- FIG. 6 and 7 show the fluid simulation results in this embodiment.
- the fluid is, for example, a powder flow in which SUS having a particle diameter of 30 ⁇ m is mixed in nitrogen gas as a carrier gas.
- FIG. 6 is a diagram showing the flow velocity distribution of the powder flow as grayscale concentration contour lines. From this figure, it can be seen that the powder flow is equally branched by each layer, and the powder flow is distributed in a rotationally symmetric (isotropic) manner with respect to the optical axis 254.
- FIG. 7 shows a flow velocity distribution in a cross section passing through the injection port 553. Referring to FIG.
- the maximum concentration is almost the same for all the injection ports 553, and the maximum flow velocity is the same for each injection port 553.
- the flow rate can be calculated by integrating the flow velocity with the opening area of each injection port. From this, it can be seen that the flow rate of each injection port is almost the same, the variation is 5.2% or less, and the variation in the flow velocity is sufficiently small. From the experimental findings, if the variation is 10% or less, no anisotropy is observed in the properties of the shaped object, but in this example it is about 5.2%, so it can be said that it is sufficiently small.
- This simulation result can be referred to even in the configuration shown in the second embodiment including the cover 255. That is, it is understood that isotropic powder injection can be realized even with the configuration shown in the second embodiment.
- the cover 255 is easily detachably provided, so that the configuration of the second embodiment and the configuration of the present embodiment can be freely switched. That is, one nozzle can be used for two types of applications for high-definition modeling and high-speed modeling.
- FIG. 8 is a partially transparent perspective view for explaining the configuration of the optical processing nozzle 800 according to the present embodiment.
- the optical processing nozzle 800 according to the present embodiment has eight pipe-shaped passage holes 842 extending downstream from the flow path layer 240, and the opening end thereof is an injection port. 853 is different. Since other configurations and operations are the same as those of the third embodiment, the same configurations and operations are denoted by the same reference numerals and detailed description thereof is omitted.
- the injection direction can be changed by changing the angle of the passage hole 842.
- the shape of the powder spot can be controlled.
- the passage hole 842 is lengthened, the variation in injection can be reduced and the powder convergence spot diameter can be reduced.
- by directing the injection direction in the direction along the cone shape arranged at the tip of the nozzle it becomes possible to flow the fluid along the cone shape. That is, the fluid flow becomes a laminar flow along the cone-shaped wall surface. Thereby, powder convergence can further be improved.
- FIG. 8 is a partially transparent perspective view for explaining the configuration of the optical processing nozzle 900 according to this embodiment.
- the optical processing nozzle 900 according to the present embodiment is different from the second embodiment in that it has a pipe-shaped passage hole 942 that extends slightly from the flow path layer 240 to the downstream side. Since other configurations and operations are the same as those of the second embodiment, the same configurations and operations are denoted by the same reference numerals, and detailed description thereof is omitted.
- carrier gas is sprayed on the cone-shaped side surface formed in the cover 255 to disperse the carrier gas.
- the cone shape is composed of a dispersion part for dispersing the carrier gas and a part tapering toward the tip.
- the dispersion portion is tapered toward the upstream portion (opposite to the optical axis direction), but is not limited thereto.
- a cylinder may be used.
- the passage hole 942 is configured to be adjustable in such a direction that the carrier gas is sprayed toward the dispersing portion.
- the optical processing apparatus 1000 includes any of the optical processing nozzles 100, 200, 500, 800, and 900 described in the above-described embodiment, and is an apparatus that generates a three-dimensional structure (or overlay welding). .
- the optical processing apparatus 1000 provided with the optical processing nozzle 200 will be described as an example.
- the optical processing device 1000 includes a light source 1001, an optical transmission unit 1002, a refrigerant supply device 1003, a refrigerant supply unit 1004, a stage 1005, a fluid storage device 1006, a fluid supply unit 1030, a gas supply device 1008, a gas supply unit 1040, and an optical processing head. 1020.
- the optical processing nozzle 200 is attached to the tip of the optical processing head 1020 as part of the optical processing head 1020.
- the light source 100 for example, a laser light source, an LED, a halogen lamp, or a xenon lamp can be used.
- the wavelength of the light beam is, for example, 1060 nm.
- the present invention is not limited to this, and any light can be used as long as it is absorbed by the processing surface 260.
- the optical transmission unit 1002 is an optical fiber having a core diameter of ⁇ 0.01 to 1 mm, for example, and guides light generated by the light source 1001 to the optical processing head 1020.
- the core diameter of the optical transmission unit 1002 is the diameter of the incident end 1012.
- the refrigerant supply device 1003 stores, for example, water as a refrigerant, and supplies the refrigerant to the refrigerant supply unit 1004 with a pump.
- the refrigerant supply unit 1004 is a resin or metal hose having an inner diameter ⁇ 2 to 6.
- the coolant is supplied into the optical processing head 1020, circulated inside the optical processing head 1020, and returned to the coolant supply device 1003, thereby suppressing the temperature rise of the optical processing head 1020.
- the supply amount of the refrigerant is, for example, 1 to 10 L / min.
- the stage 1005 is, for example, an X stage, an XY stage, or an XYZ stage, and can operate each axis (X, Y, Z).
- the fluid storage device 1006 supplies a carrier gas containing a material to the optical processing nozzle 200 via the fluid supply unit 1007.
- the material is particles such as metal particles and resin particles.
- the carrier gas is an inert gas, and may be, for example, argon gas, nitrogen gas, or helium gas.
- the fluid supply unit 1030 is, for example, a resin or metal hose, and guides a powder flow in which a material is mixed into a carrier gas to the nozzle 200. However, when the material is a wire, no carrier gas is required.
- the gas supply device 1008 supplies purge gas to the optical processing head 1020 via the gas supply unit 1040.
- the purge gas is, for example, nitrogen, argon, or helium. However, the purge gas is not limited to this, and may be another gas as long as it is an inert gas.
- the purge gas supplied to the optical processing head 1020 is ejected from the nozzle 200 along the light beam described above.
- the optical processing head 1020 includes at least the optical processing nozzle 200 described in the above embodiment and the condensing optical system device 1021 that condenses the light from the light source 1001 and emits it to the processing surface 260.
- the optical processing apparatus 1000 includes an attitude control mechanism and a position control mechanism that control the attitude and position of the optical processing head 1020.
- the modeled object 1010 is created on the stage 1005.
- Light emitted from the optical processing head 1020 is collected on the processed surface 260 on the modeled object 1010.
- the processing surface 260 is heated by melting and melted to form a molten pool in part.
- Material is injected from the nozzle 200 into the molten pool on the work surface 260.
- the material then melts into the molten pool. Thereafter, the molten pool is cooled and solidified, so that material is deposited on the processed surface 260 and three-dimensional modeling is realized.
- the purge gas is injected from the nozzle 200 to the processing surface 260. Therefore, the surrounding environment of the molten pool is purged with the purge gas. By selecting an inert gas that does not contain oxygen as the purge gas, oxidation of the processed surface 260 can be prevented.
- the optical processing head 1020 is cooled by the coolant supplied from the coolant supply device 1003 via the coolant supply unit 1004, and temperature rise during processing is suppressed.
- the optical processing head 1020 is scanned along the processing surface 260, so that desired modeling can be performed while depositing materials. That is, overlay welding or three-dimensional modeling can be created by this apparatus.
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Abstract
Description
光源から発せられる光線が加工面に向けて通過できるように設けられた光線経路と、
前記光線経路の周囲に設けられ、前記加工面に向けて流体を射出するための流路構造と、
を備え、
前記流路構造は、
流体を流入させる流入口と、
前記流入口から流入した前記流体が通過する少なくとも2つの通過孔と、
前記流体を前記流入口から前記通過孔に導く流路と、
少なくとも2つの前記通過孔を通過した前記流体を前記加工面に向けて射出する射出口と、
を備え、
少なくとも2つの前記通過孔は、前記流入口に対し、空間的に対称になるように設けられ、
前記射出口は、前記光線経路から射出される光線の光軸に対して空間的に対称に設けられたことを特徴とする。
本発明の第1実施形態としての光加工用ノズルについて、図1を用いて説明する。図1は、光加工装置のヘッド先端に取り付けられる光加工用ノズル100の構成を示している。この光加工用ノズル100は、光線経路101と流路構造102とを含む。
次に本発明の第2実施形態としての光加工用ノズルについて、図2および図3を用いて説明する。図2は、光加工用ノズル200の内部構成を示す図である。
となる。つまり、上式を満たす径Dの通過孔を設ければ、少ない層数で、流体を最も等方化することができる。
次に本発明の第3実施形態に係る光加工用ノズル500について、図5を用いて説明する。図5は、本実施形態に係る光加工用ノズル500の構成を説明するための一部透過斜視図である。本実施形態に係る光加工用ノズル500は、上記第2実施形態と比べると、カバー255を有さない点で異なる。その他の構成および動作は、第2実施形態と同様であるため、同じ構成および動作については同じ符号を付してその詳しい説明を省略する。
次に本発明の第4実施形態に係る光加工用ノズル800について、図8を用いて説明する。図8は、本実施形態に係る光加工用ノズル800の構成を説明するための一部透過斜視図である。本実施形態に係る光加工用ノズル800は、上記第3実施形態と比べると、流路層240から下流側に延びた8本のパイプ状の通過孔842を有し、その開口端を射出口853としている点で異なる。その他の構成および動作は、第3実施形態と同様であるため、同じ構成および動作については同じ符号を付してその詳しい説明を省略する。
次に本発明の第5実施形態に係る光加工用ノズル900について、図9を用いて説明する。図8は、本実施形態に係る光加工用ノズル900の構成を説明するための一部透過斜視図である。本実施形態に係る光加工用ノズル900は、上記第2実施形態と比べると、流路層240から下流側に少し延びたパイプ状の通過孔942を有している点で異なる。その他の構成および動作は、第2実施形態と同様であるため、同じ構成および動作については同じ符号を付してその詳しい説明を省略する。
本発明の第6実施形態としての光加工装置(Optical Machining apparatus)1000について、図10を用いて説明する。光加工装置1000は、上述の実施形態で説明した光加工用ノズル100、200、500、800、900のいずれかを含み、三次元的な造形物(あるいは肉盛溶接)を生成する装置である。ここでは一例として、光加工用ノズル200を備えた光加工装置1000について説明する。
光加工装置1000は、光源1001、光伝送部1002、冷媒供給装置1003、冷媒供給部1004、ステージ1005、流体収容装置1006、流体供給部1030、ガス供給装置1008、ガス供給部1040および光加工ヘッド1020を備えている。そして、光加工用ノズル200は、光加工ヘッド1020の一部として、その先端に取り付けられている。
次に、光加工装置1000の動作について説明する。造形物1010は、ステージ1005の上で作成される。光加工ヘッド1020から射出される射出光は、造形物1010上の加工面260において集光される。加工面260は、集光によって昇温され、溶融され、一部に溶融プールを形成する。
以上、実施形態を参照して本願発明を説明したが、本願発明は上記実施形態に限定されるものではない。本願発明の構成や詳細には、本願発明の範疇で当業者が理解し得る様々な変更をすることができる。また、それぞれの実施形態に含まれる別々の特徴を如何様に組み合わせたシステムまたは装置も、本発明の範疇に含まれる。
Claims (12)
- 光源から発せられる光線が加工面に向けて通過できるように設けられた光線経路と、
前記光線経路の周囲に設けられ、前記加工面に向けて流体を射出するための流路構造と、
を備え、
前記流路構造は、
流体を流入させる流入口と、
前記流入口から流入した前記流体が通過する少なくとも2つの通過孔と、
前記流体を前記流入口から前記通過孔に導く流路と、
少なくとも2つの前記通過孔を通過した前記流体を前記加工面に向けて射出する射出口と、
を備え、
少なくとも2つの前記通過孔は、前記流入口に対し、空間的に対称になるように設けられ、
前記射出口は、前記光線経路から射出される光線の光軸に対して空間的に対称に設けられたことを特徴とする光加工用ノズル。 - 前記少なくとも2つの通過孔が、前記光線の光軸を含み前記流入口の中心を通る面を挟んで、面対称に配置されたことを特徴とする請求項1に記載の光加工用ノズル。
- それぞれ同じ形状を有する前記射出口が前記光軸を中心に回転対称となる位置に少なくとも2つ設けられたことを特徴とする請求項1または2に記載の光加工用ノズル。
- 前記射出口は円環状または円弧状のスリットであることを特徴とする請求項1または2に記載の光加工用ノズル。
- 前記少なくとも2つの通過孔が、前記流入口から等距離に配置された一対の通過孔を少なくとも1つ含むことを特徴とする請求項1乃至4のいずれか1項に記載の光加工用ノズル。
- 前記流路構造は、
前記流体を流入させる第1流入口、前記第1流入口から流入した前記流体が通過する少なくとも2つの第1通過孔、および、前記流体を前記第1流入口から前記第1通過孔に導く第1流路を備えた第1流路層と、
前記第1通過孔から前記流体を流入させる第2流入口、前記第2流入口から流入した前記流体が通過する少なくとも2つの第2通過孔、および、前記流体を前記第2流入口から前記第2通過孔に導く第2流路を備えた第2流路層と、
を少なくとも含み、
前記第1通過孔は、前記第1流入口に対し、空間的に対称になるように設けられ、
前記第2通過孔は、前記第2流入口に対し、空間的に対称になるように設けられたことを特徴とする請求項1乃至5のいずれか1項に記載の光加工用ノズル。 - 前記流路構造は、
前記流体を流入させる第1流入口、前記第1流入口から流入した前記流体が通過する少なくとも2つの第1通過孔、および、前記流体を前記第1流入口から前記第1通過孔に導く第1流路を備えた第1流路層と、
前記第1通過孔から前記流体を流入させる第2流入口、前記第2流入口から流入した前記流体が通過する少なくとも2つの第2通過孔、および、前記流体を前記第2流入口から前記第2通過孔に導く第2流路を備えた第2流路層と、
前記第2通過孔から前記流体を流入させる第3流入口、前記第3流入口から流入した前記流体が通過する少なくとも2つの第3通過孔、および、前記流体を前記第3流入口から前記第3通過孔に導く第3流路を備えた第3流路層と、
を少なくとも含み、
前記第1通過孔は、前記第1流入口に対し、空間的に対称になるように設けられ、
前記第2通過孔は、前記第2流入口に対し、空間的に対称になるように設けられ、
前記第3通過孔は、前記第3流入口に対し、空間的に対称になるように設けられたことを特徴とする請求項1乃至5のいずれか1項に記載の光加工用ノズル。 - 最下流に位置する流路層から前記射出口までの流路は、下流側に向けて先細りする形状であることを特徴とする請求項6または7に記載の光加工用ノズル。
- 前記流体は、粉体を搬送するキャリアガスであることを特徴とする請求項1乃至9のいずれか1項に記載の光加工用ノズル。
- 請求項1乃至10のいずれか1項に記載の光加工用ノズルと、
光源からの光を集光して加工面に射出する集光光学系装置と、
を含むことを特徴とする光加工ヘッド。 - 請求項11に記載の光加工ヘッドと、
光源と、
前記光源から射出された光を前記光加工ヘッドに伝送する光伝送部と、
前記流体を収容する流体収容装置と、
前記流体を前記光加工用ノズルに供給する流体供給部と、
を備えた光加工装置。
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EP3231587A4 (en) | 2018-10-10 |
US20170050198A1 (en) | 2017-02-23 |
US10449560B2 (en) | 2019-10-22 |
EP3231587A1 (en) | 2017-10-18 |
JP6151436B2 (ja) | 2017-06-21 |
EP3231587B1 (en) | 2020-01-01 |
JPWO2016135907A1 (ja) | 2017-04-27 |
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