WO2016133039A1 - Film barrière transparent et son procédé de production - Google Patents

Film barrière transparent et son procédé de production Download PDF

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Publication number
WO2016133039A1
WO2016133039A1 PCT/JP2016/054247 JP2016054247W WO2016133039A1 WO 2016133039 A1 WO2016133039 A1 WO 2016133039A1 JP 2016054247 W JP2016054247 W JP 2016054247W WO 2016133039 A1 WO2016133039 A1 WO 2016133039A1
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Prior art keywords
compound
organic layer
barrier film
film
layer
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PCT/JP2016/054247
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English (en)
Japanese (ja)
Inventor
清司 伊関
沼田　幸裕
晃侍 伊藤
崇 江畑
稲垣　京子
ますみ 舩山
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東洋紡株式会社
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Priority to JP2016509185A priority Critical patent/JP6900191B2/ja
Publication of WO2016133039A1 publication Critical patent/WO2016133039A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10—Glass or silica
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment

Definitions

  • the present invention relates to a transparent barrier film used as a packaging material or gas barrier material that requires airtightness such as foods, pharmaceuticals, and electronic parts.
  • a film having an excellent gas barrier property a film obtained by laminating aluminum on a plastic film or a film coated with vinylidene chloride or an ethylene vinyl alcohol copolymer is known.
  • a material using an inorganic thin film a material in which a silicon oxide, an aluminum oxide thin film, or the like is laminated is known (for example, see Patent Document 1).
  • the inorganic layer formed on the plastic film is very thin, it may deteriorate when post-processing such as printing on the inorganic thin film layer. For example, in the printing process, due to rubbing with the gravure roll and pigment particles contained in the ink, the inorganic layer may be damaged and the barrier property may be lowered.
  • there is a method of coating an organic layer on an inorganic layer A solution obtained by dissolving a coating agent in a solvent is applied and dried to form an organic layer.
  • the present invention solves the above problems, and relates to a composite barrier film in which an inorganic layer and an organic layer are provided on one side of a plastic film, and there is little decrease in gas barrier properties after printing, and the amount of compound elution is small.
  • a transparent barrier film suitable for food packaging is provided.
  • the present invention is a barrier film having an inorganic layer and an organic layer on at least one side of a plastic film, wherein the organic layer is formed by crosslinking a compound having an acryloyl group and / or a methacryloyl group, and the acryloyl group and / or Or the transparent barrier film characterized by the elution rate of the compound which has a methacryloyl group being 0.1 weight% or less.
  • the compound is at least two kinds of mixed compounds and at least one kind of compound is a silane coupling agent.
  • the inorganic layer contains aluminum oxide and silicon oxide.
  • the organic layer is formed by crosslinking and curing the compound by vapor deposition on the inorganic layer by a flash vapor deposition method and then irradiating with an electron beam.
  • the organic layer is formed by depositing the compound on the inorganic layer by a flash vapor deposition method and then crosslinking and curing by irradiating with an electron beam, and the electron beam irradiation amount of the crosslinking and curing is 1 kJ / m 2 or more, 10 kJ / It is preferable that it is m 2 or less.
  • the transparent barrier film of the present invention has excellent adhesion between an organic layer and an inorganic layer and adhesive strength when laminated with another film, and the barrier property does not deteriorate even after processing such as printing or lamination with another film. Moreover, there is little compound elution from an organic layer. Therefore, it is possible to provide a transparent barrier film that can be used as a packaging material or a gas barrier material that requires safety and high airtightness, and a manufacturing method.
  • Schematic of transparent barrier film produced by the production method of the present invention Schematic of an example of an apparatus used in the production method of the present invention
  • FIG. 1 shows a laminate of the transparent gas barrier film of the present invention
  • FIGS. 2 and 3 show a production apparatus used in the production method as an example.
  • the plastic film (1) referred to in the present invention is a film obtained by melt-extrusion of an organic polymer and stretching, cooling, and heat setting in the longitudinal direction and / or the width direction as necessary.
  • an organic polymer polypropylene, polyethylene terephthalate, polyethylene-2,6-naphthalate, nylon 6, nylon 4, nylon 66, nylon 12, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, wholly aromatic polyamide, polyamideimide, Examples thereof include polyimide, polyetherimide, polysulfone, polyphenylene sulfide, and polyphenylene oxide.
  • organic polymers organic polymers may be copolymerized or blended with a small amount of other organic polymers.
  • known additives such as ultraviolet absorbers, antistatic agents, plasticizers, lubricants, colorants and the like may be added to the organic polymer, and the transparency thereof is not particularly limited.
  • a transparent gas barrier film those having a transmittance of 50% or more are preferred.
  • the plastic film (1) of the present invention is subjected to corona discharge treatment, glow discharge treatment and other surface roughening treatment prior to laminating the thin film layer.
  • a known anchor coat treatment, printing, or decoration may be applied.
  • the thickness of the plastic film (1) in the present invention is preferably in the range of 1 ⁇ m to 300 ⁇ m, more preferably in the range of 9 ⁇ m to 25 ⁇ m.
  • the inorganic layer (1) may be a single layer or a laminate of two or more layers.
  • a particularly preferable inorganic layer (2) is preferably a composite oxide layer prepared by vapor deposition of aluminum oxide and silicon oxide or a composite oxide layer prepared by vapor deposition of aluminum oxide and magnesium oxide.
  • the weight ratio of aluminum oxide contained in the inorganic compound thin film is not particularly limited, but the total of aluminum oxide and silicon oxide contained in the inorganic compound thin film
  • the ratio of aluminum oxide to 10% by weight is 10% by weight or more, preferably 20% by weight or more, and more preferably 30% by weight or more. Further, it is 90% by weight or less, preferably 75% by weight or less, more preferably 65% by weight or less.
  • the ratio of aluminum oxide exceeds 7% by weight, the flexibility tends to be poor, so that cracking due to handling is likely to occur, and stable barrier properties may be difficult to obtain. On the other hand, if the ratio of aluminum oxide is less than 30% by weight, the barrier property is not good.
  • the film thickness of the inorganic layer (2) of the present invention is not particularly limited, but is preferably 5 to 500 nm, more preferably 8 nm or more and 100 nm or less, and the inorganic layer (2) having a film thickness of less than 5 nm is satisfactory. However, even if the thickness exceeds 500 nm, the corresponding effect of improving the gas barrier property cannot be obtained, which is disadvantageous in terms of bending resistance and manufacturing cost. It becomes.
  • a known method for example, a vacuum process such as a vacuum deposition method, a sputtering method, a physical vapor deposition method such as an ion plating method, or a chemical vapor deposition method such as PECVD is employed. Is done.
  • the heating method resistance heating, induction heating, electron beam heating or the like is employed.
  • the organic layer (3) referred to in the present invention has a structure obtained by crosslinking a compound having an acryloyl group and / or a methacryloyl group.
  • the compound having an acryloyl group and / or a methacryloyl group include a compound having an acryloyl group and / or a methacryloyl group and not a silane coupling agent, and a compound having an acryloyl group and / or a methacryloyl group and a silane coupling agent.
  • the compound having an acryloyl group and / or a methacryloyl group and not a silane coupling agent is not particularly limited, and examples thereof include phenoxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, -Hydroxybutyl methacrylate, methacrylic acid, glycidyl methacrylate, 2-methacryloyloxyethyl acid phosphate, diethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 1.4-butanediol dimethacrylate, 2-hydroxy-3-acryloyloxypropyl methacrylate, tri Ethylene glycol dimethacrylate, PEG # 200 dimethacrylate, PEG # 400 dimethacrylate , Methoxypolyethylene glycol methacrylate, ethoxy-diethylene glycol acrylate, methoxy-triethylene glycol
  • the compound having an acryloyl group and / or a methacryloyl group and being a silane coupling agent refers to an organosilicon compound having at least an acryloyl group and / or a methacryloyl group and a hydrolyzable group. For example, raising 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, etc. Can do.
  • These compounds preferably have a viscosity at 20 ° C. of 500 mPa ⁇ s or less from the viewpoint of material supply during vapor deposition. More preferably, it is 200 mPa * s or less. From the viewpoint of safety, the skin primary irritation index (PII) is 2 or less, preferably 1 or less.
  • Silane coupling agent having acryloyl group and / or methacryloyl group with respect to the total weight of the compound having acryloyl group and / or methacryloyl group and not silane coupling agent and compound having acryloyl group and / or methacryloyl group and silane coupling agent The weight ratio of the compound can be calculated by measuring the amount of silicon atoms contained in the organic layer.
  • the compound having an acryloyl group and / or a methacryloyl group and being a silane coupling agent contributes to improving the adhesion between the inorganic layer and the organic layer, but the content is preferably 5% by weight or more. More preferably, it is 10 weight% or more.
  • the content of the compound having an acryloyl group and / or methacryloyl group and being a silane coupling agent increases, the adhesion is improved, but the compound having an acryloyl group and / or methacryloyl group and being a silane coupling agent is expensive and Moreover, since the excess which cannot react at the interface with the inorganic layer also increases, 50% by weight or less is preferable. It is more preferably 40% by weight or less, and most preferably 30% by weight or less.
  • the organic layer has a function of protecting the inorganic layer. Furthermore, there is also a function of improving the adhesion after pasting another member such as a sealant and the organic layer with an adhesive.
  • the thickness of the organic layer is preferably 50 nm or more. If it is less than 50 nm, it is difficult to protect the inorganic layer from the pigment particles contained in the pigment ink, and if it exceeds 150 nm, the strain increases and the adhesion is reduced.
  • the compound elution rate is expressed as a percentage obtained by dividing the weight of the starting compound dissolved by the weight of the organic layer when the formed organic layer is immersed in normal temperature (23 ° C.) methyl alcohol. Say the value.
  • the weight of the organic layer uses a value calculated from the film thickness with the density of the organic layer being 1 g / cm 3 .
  • Flash evaporation refers to a method in which a material to be deposited is brought into contact with a heated plate or the like in small portions and evaporated instantaneously.
  • a known technique can be used as a method of heating the heating plate. Examples include a method of installing a heating wire so that thermal contact is good on the opposite surface where the vapor deposition material contacts the heating plate, a method of circulating a heating medium, and a method of heating with an IR heater.
  • the flash evaporation method in which the material is brought into contact with a heating plate that has been sufficiently raised above the evaporation temperature of the organic compound to evaporate instantaneously, the mixing ratio of the evaporation material and the composition of the deposited film are stable and stable. An organic layer can be obtained.
  • the temperature of the heating plate is preferably 200 ° C. or higher for a compound of 500 mPa ⁇ s or less that has fluidity as a liquid supply. High temperature is preferable for flash vapor deposition, but if it is too high, the compound decomposes and is not preferable. Moreover, 300 degrees C or less is preferable from mechanical factors, such as a dimensional change with temperature.
  • a known radiation source can be used as the electron beam source.
  • an electron gun type radiation source can irradiate a certain area by scanning an electron beam. Moreover, it can also set and irradiate on the film which drive
  • the acceleration voltage of electrons is preferably 500 V or higher. If it is 500 V or less, electrons do not sufficiently enter the compound, and radicals necessary for initiation of crosslinking are not sufficiently generated. At an acceleration voltage of 10 kV or more, the number of electrons that pass through the organic layer increases and efficiency decreases. In addition, the generation of X-rays also occurs, causing a problem in safety and health.
  • the electron beam dose is suitably 1 kJ / m 2 or more and 10 kJ / m 2 or less. If it is 1 kJ / m 2 or less, curing crosslinking is insufficient. When it is 10 kJ / m 2 or more, excess electrons are charged on the film surface, causing static troubles.
  • the electron beam irradiation amount can be calculated from the acceleration voltage and current of the electron gun, and can be calculated from the area of the irradiation range. It is also possible to measure from the relationship between dose and dose using a dosimeter.
  • the heat-sealable resin layer is usually laminated by an extrusion lamination method or a dry lamination method.
  • the thermoplastic polymer for forming the heat-sealable resin layer is not particularly limited as long as the sealant adhesiveness can be sufficiently exhibited, such as polyethylene resins such as HDPE, LDPE, and LLDPE, polypropylene resin, and ethylene-vinyl acetate. Polymers, ethylene- ⁇ -olefin random copolymers, ionomer resins and the like can be used.
  • the printing ink for forming the printing layer on the transparent barrier film of the present invention may be a water-based resin-containing printing ink or a solvent-based resin-containing printing ink.
  • the resin used in the printing ink include acrylic resins, urethane resins, polyester resins, vinyl chloride resins, vinyl acetate copolymer resins, and mixtures thereof.
  • the printing method for providing the printing layer is not particularly limited, and a known printing method such as an offset printing method, a gravure printing method, a screen printing method, or the like can be used.
  • a known printing method such as an offset printing method, a gravure printing method, a screen printing method, or the like
  • known drying methods such as hot air drying, hot roll drying and infrared drying can be used.
  • FIGS. 1-10 Schematic diagram of the method for producing the composite barrier film of the present invention will be described with reference to FIGS.
  • the plastic film roll of the substrate is set on the unwinding roll (4).
  • the unrolled plastic film (1) passes through the plasma processor (5) to treat the surface.
  • the ceramic contained in the crucible (7) is heated and evaporated by the electron gun (6) to form an inorganic layer on the plastic film running on the inorganic coating roll (8).
  • a mixed liquid (13) of a compound having an acryloyl group and / or a methacryloyl group is put into a liquid container (14).
  • the compound (13) is transferred into the organic vapor deposition source (16) by the liquid pump (15).
  • the transferred compound (13) comes into contact with the heating plate (18) heated by the heating wire (17) and becomes steam.
  • the vapor moves in the organic vapor deposition source (16) heated so as not to condense and reaches the organic nozzle (9).
  • Vapor deposition is performed on a plastic film in which an inorganic layer traveling on the organic coating roll (10) is laminated from the heated organic nozzle (9).
  • a liquid layer of the compound is formed on the inorganic layer.
  • the formed liquid layer is irradiated with an electron beam using an electron beam irradiation device (11) and cured by crosslinking. In this way, an organic layer is formed on the inorganic layer and wound on a winding roll.
  • the elution rate of the raw material compound was calculated from the film thickness of the organic layer with a specific gravity of 1 g / cm 3 , the weight of the entire organic layer was calculated, and the value obtained by dividing the elution amount of the raw material compound was expressed as a percentage.
  • Liquid chromatography was performed under the following conditions using ACQUITY UPLC manufactured by Waters. Column: BEH-C18 manufactured by Waters 2.1 ⁇ 150mm Mobile phase: 90% of 0.1% formic acid and 10% methanol at the start of measurement. Gradient was applied to change the mixing ratio to 0.1% formic acid 2% and methanol 98% over 20 minutes. It was maintained as it was for 10 minutes.
  • Laminate adhesive strength A polyethylene film (Toyobo Co., Ltd. L4102) with a thickness of 40 ⁇ m was adhered to a transparent vapor-deposited barrier film using an adhesive for dry lamination (TM590, CAT56 manufactured by Toyo Morton Co., Ltd.) to prepare a laminate film. .
  • the adhesive strength of the laminate is measured by cutting the laminate film to a width of 15 mm, peeling a part of the laminate film, using a universal material testing machine (Tensilon), pulling the peel piece at a speed of 300 mm / min, and peeling it 180 °. did.
  • Oxygen permeation amount is in accordance with JIS K7126-2 A method, and an oxygen permeation amount measuring device (manufactured by OXTRAN 2/21 MOCOM) is prepared in an atmosphere with a temperature of 23 degrees and a humidity of 65% RH. Measured with Even white ink (Toyo Ink Co., Ltd. Finestar R641 white) was printed on the organic layer of the composite film by gravure printing.
  • the deposition amount per unit area of aluminum oxide is Ma (g / cm 2 ), the density of the bulk is ⁇ a (3.97 g / cm 3 ), and the deposition amount per unit area of silicon oxide is Ms (g / cm 2).
  • the film thickness t (nm) is obtained by the following formula (3).
  • t ((Ma / ( ⁇ a ⁇ 0.8) + Ms / ( ⁇ s ⁇ 0.8)) ⁇ 10 ⁇ 7 ...
  • Formula (3) Several types of inorganic oxide thin films that define the film thickness and composition are prepared and fluorescence is obtained.
  • a calibration curve was prepared by measuring with an X-ray apparatus. Using a fluorescent X-ray analyzer (“ZSX100e” manufactured by Rigaku Corporation), the film thickness composition was measured with a calibration curve prepared in advance. The conditions for the excitation X-ray tube were 50 kV and 70 mA.
  • This organic layer was measured with a fluorescent X-ray analyzer, and a calibration curve of the organic layer thickness consisting of the fluorescent X-ray intensity of silicon atoms and the compound alone as the silane coupling agent was prepared.
  • the film thickness of an organic layer obtained by crosslinking and copolymerizing a compound having an acryloyl group and / or a methacryloyl group and not a silane coupling agent and a compound having an acryloyl group and / or a methacryloyl group and a silane coupling agent was measured.
  • TEM transmission electron microscope
  • a method of measuring using interference by an ellipsometer can be used. In this case, a correlation is obtained with the value obtained by TEM, and the value is converted into the value.
  • the content ratio was calculated by dividing the equivalent film thickness of the compound having an acryloyl group and / or methacryloyl group calculated from the result of fluorescent X-ray and being a silane coupling agent by the total film thickness of the organic layer.
  • an organic layer composed of a compound alone having an acryloyl group and / or a methacryloyl group and a silane coupling agent, a compound having an acryloyl group and / or a methacryloyl group and not a silane coupling agent, and an acryloyl group and / or a methacryloyl group
  • the density of the organic layer crosslinked and copolymerized with the compound that is a silane coupling agent was calculated as the same.
  • Example 1 While a polyethylene terephthalate film (E5100 thickness 12 ⁇ m, manufactured by Toyobo Co., Ltd.) was run as a plastic film at 50 m / min, aluminum oxide and silicon oxide were separately charged into the crucible and individually heated with an electron gun for vapor deposition. . The formed inorganic layer had a thickness of 18 nm and an aluminum oxide content of 28% by weight. Subsequently, 9 parts of PEG200 # diacrylate (Kyoeisha Chemical Co., Ltd. Light Ester 4EG) and silane coupling agent 3-methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd.
  • KBM-503 1 part on the inorganic layer 7 ml / min was dropped on the heating plate.
  • the heating plate is heated by a heating wire, and the temperature is controlled at 250 ° C. by a thermocouple installed behind the heating plate.
  • Mixed compound vapor was applied onto the inorganic layer from an organic nozzle heated to 200 ° C.
  • the formed liquid layer was crosslinked and cured by irradiating electrons from an electron gun at an acceleration voltage of -8 kV and a current of 100 mA.
  • the electron beam dose was 4.2 kJ / m 2 and the organic film thickness was 91 nm.
  • Table 1 shows the elution rate, oxygen permeation amount and laminate strength of the raw material compound of the transparent barrier film.
  • Example 1 (Examples 2 to 7, Comparative Examples 1 and 2)
  • Example 1 an inorganic layer and an organic layer were prepared in the same manner as in Example 1 except that the traveling speed, the amount of compound dropped, and the amount of electron beam irradiation were changed as shown in Table 2.
  • the results are shown in Table 1.
  • Comparative Example 1 the elution rate of the raw material compound was high.
  • Comparative Example 2 although the elution rate of the raw material compound was low, many discharge traces were observed on the film organic layer side. The results are shown in Table 2.
  • a transparent barrier film that can be used as a packaging material or a gas barrier material that does not deteriorate the barrier property even after processing such as laminating or a gas barrier material, and a manufacturing method thereof can be provided.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
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Abstract

La présente invention concerne un film barrière haute performance présentant une excellente résistance d'adhérence lorsqu'il est stratifié, et un matériau d'emballage hautement sûr. Ce film barrière transparent est un film barrière comprenant une couche inorganique et une couche organique sur au moins une surface d'un film plastique, la couche organique étant fabriquée par réticulation d'un composé comprenant un groupe acryloyle et/ou un groupe méthacryloyle, et le taux d'élution dudit composé comprenant un groupe acryloyle et/ou un groupe méthacryloyle, qui est le matériau de la couche organique, étant de 0,1 % en poids ou moins.
PCT/JP2016/054247 2015-02-20 2016-02-15 Film barrière transparent et son procédé de production WO2016133039A1 (fr)

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JP2016509185A JP6900191B2 (ja) 2015-02-20 2016-02-15 透明バリアフィルムおよびその製法

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JP2015031697 2015-02-20
JP2015-031697 2015-02-20

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WO2016133039A1 true WO2016133039A1 (fr) 2016-08-25

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012176519A (ja) * 2011-02-25 2012-09-13 Fujifilm Corp バリア性積層体およびバリア性積層体の製造方法
WO2013122103A1 (fr) * 2012-02-13 2013-08-22 東洋紡株式会社 Film stratifié formant barrière au gaz
JP2014172231A (ja) * 2013-03-07 2014-09-22 Fujifilm Corp バリア性積層体およびガスバリアフィルム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006095932A (ja) * 2004-09-30 2006-04-13 Toppan Printing Co Ltd 積層体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012176519A (ja) * 2011-02-25 2012-09-13 Fujifilm Corp バリア性積層体およびバリア性積層体の製造方法
WO2013122103A1 (fr) * 2012-02-13 2013-08-22 東洋紡株式会社 Film stratifié formant barrière au gaz
JP2014172231A (ja) * 2013-03-07 2014-09-22 Fujifilm Corp バリア性積層体およびガスバリアフィルム

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