WO2016117016A1 - Dispositif d'aide à l'inspection - Google Patents

Dispositif d'aide à l'inspection Download PDF

Info

Publication number
WO2016117016A1
WO2016117016A1 PCT/JP2015/051317 JP2015051317W WO2016117016A1 WO 2016117016 A1 WO2016117016 A1 WO 2016117016A1 JP 2015051317 W JP2015051317 W JP 2015051317W WO 2016117016 A1 WO2016117016 A1 WO 2016117016A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
component
image data
display
circuit board
Prior art date
Application number
PCT/JP2015/051317
Other languages
English (en)
Japanese (ja)
Inventor
裕高 平山
茂人 大山
諭 吉岡
智史 牛居
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2016570233A priority Critical patent/JP6571116B2/ja
Priority to PCT/JP2015/051317 priority patent/WO2016117016A1/fr
Publication of WO2016117016A1 publication Critical patent/WO2016117016A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to an inspection support apparatus applied to a component mounter for mounting an electronic component on a circuit board.
  • the component mounter sucks an electronic component at a supply position with a suction nozzle and mounts the electronic component at a predetermined coordinate position (mounting position) on the circuit board.
  • a circuit board on which a plurality of electronic components are mounted by a component mounting machine is automatically inspected for the mounting state of the electronic components by an appearance inspection device located on the downstream side of the component mounting machine in the production line (see Patent Document 2).
  • the mounting state of the electronic component includes the shift amount of the electronic component with respect to the mounting position, the posture of the electronic component, the presence or absence of breakage, and the like.
  • the inspection of the circuit board includes a visual inspection by an operator who targets the circuit board being mounted, in addition to the automatic inspection by the appearance inspection apparatus as described above.
  • the visual inspection is required, for example, when an electronic component that particularly requires mounting accuracy or an electronic component that is easily damaged is mounted.
  • the operator visually checks the electronic component to be inspected mounted on the circuit board and determines whether the mounting state is good or bad.
  • the present invention has been made in view of such circumstances, and an object thereof is to provide an inspection support apparatus that improves the efficiency of visual inspection of the mounting state of electronic components in a component mounter.
  • the inspection support apparatus is applied to a component mounting machine including a transfer device that holds an electronic component supplied to a supply position and transfers the electronic component to a mounting position on a circuit board.
  • the inspection support device supports a visual inspection of the mounted state performed on the electronic component mounted on the circuit board.
  • the inspection support apparatus includes a camera provided in the transfer apparatus so as to be able to image the circuit board, an appearance feature in the inspection part to be subject to visual inspection among the electronic parts, and the periphery of the mounting position.
  • the reference part on the circuit board located in the inspection reference information associated with the inspection part and the inspection reference information when the inspection part is mounted on the circuit board in the mounting process by the component mounting machine An image pickup control unit for controlling image pickup processing of the camera based on the image to obtain image data in which the feature part and the reference part corresponding to the inspection part are stored; and the image data obtained by image pickup by the camera A display control unit to be displayed.
  • the inspection support apparatus enables visual inspection by an operator by displaying image data obtained by imaging of a camera provided in the component mounting machine. Therefore, the operator can surely visually check the electronic component (inspection component) to be inspected regardless of the dimensions of the inspection component. Further, the inspection support apparatus controls the imaging process so that the characteristic part of the inspection part and the preset reference portion are included in the image data to be displayed. Thereby, the operator can determine the quality of the mounting state of the inspection part based on the displayed characteristic portion and the reference part. Therefore, with the configuration as described above, it is possible to improve the efficiency of the visual inspection of the mounted state.
  • FIG. 1 is an overall view showing a component mounter in an embodiment. It is a block diagram which shows the control apparatus of the component mounting machine to which the test
  • the component mounter is a device that sucks an electronic component at a supply position with a suction nozzle and mounts the electronic component at a predetermined coordinate position (mounting position) on a circuit board.
  • the inspection support device is applied to the above-described component mounter and supports visual inspection in the component mounter.
  • the component mounter 1 includes a substrate transfer device 11, a component supply device 12, a component transfer device 13, a component camera 15, a substrate camera 16, and a control device 30.
  • the horizontal width direction of the component mounter 1 (the direction from the upper left to the lower right in FIG. 1) is the X-axis direction
  • the horizontal longitudinal direction of the component mounter 1 (the direction from the upper right to the lower left in FIG. 1).
  • the vertical direction (vertical direction in FIG. 1) perpendicular to the X-axis and Y-axis is the Z-axis direction.
  • the substrate transfer device 11 is configured by a belt conveyor or the like, and sequentially transfers the circuit boards 40 in the transfer direction.
  • the board transfer device 11 positions the circuit board 40 at a predetermined position in the component mounting machine 1.
  • substrate conveyance apparatus 11 carries out the circuit board 40 out of the machine of the component mounting machine 1, after the mounting process by the component mounting machine 1 is performed.
  • the component supply device 12 supplies the electronic component mounted on the circuit board 40 to the supply position Sp.
  • the above-described electronic components include electronic components accommodated in a carrier tape at a predetermined pitch and chips obtained by cutting the wafer Wf in units of components.
  • the carrier tape is fed and moved by a feeder that is detachably set in a plurality of slots of the component supply device 12.
  • the component supply apparatus 12 supplies an electronic component in the taking-out part of the front end side of a feeder.
  • the component supply device 12 includes a wafer supply device 12a for supplying chips of the wafer Wf.
  • a wafer supply device 12a for supplying chips of the wafer Wf.
  • chips of the wafer Wf For example, a large number of chips are formed in a lattice pattern on the wafer body, and are cut into parts by a laser cutter or the like while being attached to an adhesive sheet.
  • the electronic component housed in the carrier tape and the chip of the wafer Wf correspond to the “electronic component” of the present invention.
  • the component transfer device 13 is configured to be movable in the X-axis direction and the Y-axis direction.
  • the component transfer device 13 is disposed from the rear side in the longitudinal direction of the component mounter 1 (upper right side in FIG. 1) to the upper side of the component supply device 12 on the front side.
  • the component transfer device 13 includes a head driving device 21, a moving table 22, and a mounting head 23.
  • the head driving device 21 is configured to be able to move the moving table 22 in the XY axis directions by a linear motion mechanism.
  • the mounting head 23 is detachably provided on the moving base 22 of the head driving device 21.
  • the mounting head 23 supports a plurality of suction nozzles 24 that are detachably provided on the plurality of nozzle holders.
  • the mounting head 23 supports the suction nozzle 24 so as to be rotatable about an R axis parallel to the Z axis and to be movable up and down.
  • Each of the suction nozzles 24 is controlled in the elevation position (position in the Z-axis direction), the angle, and the negative pressure supply state with respect to the mounting head 23.
  • the suction nozzle 24 sucks and holds the electronic component supplied in the feeder take-out portion and the chip of the wafer Wf supplied by the wafer supply device 12a by being supplied with a negative pressure.
  • the component camera 15 and the substrate camera 16 are digital imaging devices having imaging elements such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor).
  • the component camera 15 and the board camera 16 take an image of a range that falls within the camera visual field based on a control signal from the control device 30 that is communicably connected, and send image data acquired by the image pickup to the control device 30.
  • the component camera 15 is fixed to the base 2 of the component mounter 1 so that the optical axis is in the vertical direction (Z-axis direction), and is configured to be able to image from below the component transfer device 13. More specifically, the component camera 15 is configured to be able to image the lower surface of the electronic component held by the suction nozzle 24.
  • the lens unit of the component camera 15 is set so as to focus on an object at a certain distance from the image sensor.
  • the camera field of view of the lens unit of the component camera 15 is set to a size that can accommodate all the suction nozzles 24 supported by the mounting head 23.
  • the substrate camera 16 (corresponding to the “camera” of the present invention) is provided on the moving table 22 of the component transfer device 13 so that the optical axis Ax is in the vertical direction (Z-axis direction).
  • the board camera 16 is configured to be able to image the circuit board 40.
  • the control device 30 that has acquired the image data from the substrate camera 16 recognizes the positioning state of the circuit board 40 by the substrate transport device 11 by recognizing, for example, a positioning mark attached to the substrate by image processing. Then, the control device 30 corrects the position of the movable table 22 according to the positioning state of the circuit board 40 and controls the mounting process so as to mount the electronic component.
  • the board camera 16 performs an imaging process for acquiring image data used for visual inspection in the component mounter 1.
  • the quality of the mounting state of the electronic component is determined for the inspection component 50 that is the target of the visual inspection among the electronic components mounted on the circuit board 40. That is, the board camera 16 is used for acquiring image data used for visual inspection in addition to acquiring image data used for mounting processing.
  • the substrate camera 16 constitutes an inspection support apparatus 90 that supports visual inspection.
  • the control device 30 is mainly configured by a CPU, various memories, and a control circuit, and controls the mounting process of the electronic component on the circuit board 40 based on the image data acquired by the imaging of the component camera 15 and the board camera 16.
  • the control device 30 has an input / output interface 36 connected to a mounting control unit 31, an image processing unit 32, an imaging control unit 33, a display control unit 34, and a storage device 35 via a bus.
  • a motor control circuit 37 and an imaging control circuit 38 are connected to the input / output interface 36.
  • the mounting control unit 31 controls the position of the mounting head 23 and the operation of the suction mechanism via the motor control circuit 37. More specifically, the mounting control unit 31 inputs information output from various sensors provided in the component mounting machine 1 and results of various recognition processes. The mounting control unit 31 sends a control signal to the motor control circuit 37 based on the control program stored in the storage device 35, information from various sensors, and the results of image processing and recognition processing. Thereby, the position and rotation angle of the suction nozzle 24 supported by the mounting head 23 are controlled.
  • the image processing unit 32 acquires image data captured by the component camera 15 and the board camera 16 via the imaging control circuit 38, and executes image processing according to the application.
  • This image processing can include, for example, binarization of image data, filtering, hue extraction, super-resolution processing, and the like.
  • the image processing unit 32 executes an extraction process for cutting out a part of image data, an inversion process, and a process for superposing a plurality of pieces of image data in an aligned state.
  • the imaging control unit 33 sends a control signal to each device so that a predetermined object is imaged by the component camera 15 and the board camera 16. Specifically, the imaging controller 33 obtains the image data in which the positioning marks attached on the circuit board 40 are stored, and the board camera 16 provided on the moving table 22 with respect to the component supply device 12. A control signal is sent to move the mark above the positioning mark. And the imaging control part 33 sends out a control signal so that an imaging process may be performed with respect to the board
  • the display control unit 34 causes the display device 17 to display image data captured by the substrate camera 16.
  • the display device 17 is, for example, a liquid crystal monitor or a touch screen arranged on the operation panel of the control device 30 (see FIG. 4B).
  • the display control unit 34 displays the image data that has been subjected to various types of image processing by the image processing unit 32 so as to be within the range of the display frame 80.
  • the image data display frame 80 is preset in a rectangular shape.
  • the imaging control unit 33 controls an imaging process for acquiring image data used for visual inspection in the component mounter 1. Further, the display control unit 34 displays the image data in various display modes so that the operator can perform a visual inspection. Details of the control of the imaging process by the imaging control unit 33 for supporting the visual inspection and the control of the display process by the display control unit 34 will be described later.
  • the storage device 35 is configured by an optical drive device such as a hard disk device or a flash memory.
  • the storage device 35 is transferred from the component camera 15 and the board camera 16 to the control device 30 via a control program for operating the component mounting machine 1, inspection standard information SI used for visual inspection, and a bus and a communication cable.
  • Image data, temporary data for processing by the image processing unit 32, and the like are stored.
  • the input / output interface 36 is interposed between the CPU and the storage device 35 and the control circuits 76 and 77, and adjusts data format conversion and signal strength.
  • the motor control circuit 37 is used for controlling each axis motor provided in the component transfer device 13 based on a control signal from the mounting control unit 31. Thereby, the mounting head 23 is positioned in each axial direction. Further, by controlling the motors of the respective axes, a predetermined lifting position (Z-axis direction position) and rotation angle of the suction nozzle 24 are determined.
  • the imaging control circuit 38 controls the imaging by the component camera 15 and the board camera 16 based on the imaging control signal sent out by the imaging control unit 33. Further, the imaging control circuit 38 acquires image data obtained by imaging of the component camera 15 and the board camera 16 and stores the acquired image data in the storage device 35 via the input / output interface 36.
  • the inspection support apparatus 90 that supports visual inspection includes the board camera 16, the inspection reference information SI, the image processing unit 32, the imaging control unit 33, and the display control unit 34 in the component mounter 1. It is prepared for.
  • the inspection support device 90 supports visual inspection of the mounting state of the target inspection component 50 among the electronic components that the component mounter 1 has mounted on the circuit board 40.
  • Inspection reference information SI used for visual inspection is stored in the storage device 35 of the control device 30.
  • the inspection standard information SI is the appearance feature of the inspection component 50 to be visually inspected among the plurality of electronic components mounted by the component mounter 1, and the periphery of the mounting position Mp (see FIG. 4A and the like).
  • the reference part on the circuit board 40 located at is information related to the inspection component 50. More specifically, as shown in FIG. 3, the inspection standard information SI includes an ID for identifying the inspection part, a part type of the inspection part, a characteristic part, a reference part, and dimension information.
  • the “characteristic part” of the inspection component 50 is represented by a shape, a pattern, a color, or a combination thereof in the inspection component 50 that is captured for the operator to recognize the mounting state of the inspection component in the visual inspection by the operator. It is a part. More specifically, the characteristic part of the inspection component 50 may be a straight end that is a corner or one side when the outer shape of the inspection component 50 is rectangular. In addition, depending on the component type, a lead portion, a mark attached to the upper surface of the component, or the like can be set as the characteristic portion.
  • the mounting state of the inspection component 50 includes the amount of deviation of the inspection component 50 with respect to the mounting position Mp, the posture of the inspection component 50, the presence or absence of breakage, and the like.
  • the “reference part” on the circuit board 40 means a shape, pattern, color, or these on the circuit board 40 that is regarded as a reference for the operator to recognize the mounting state of the inspection component in the visual inspection by the operator.
  • the reference portion on the circuit board 40 may be a positioning mark provided on the circuit board 40 for positioning the circuit board 40 or the electronic component, or a component arranged on the circuit board 40.
  • the components arranged on the circuit board 40 include components arranged in a process different from the mounting process by the component mounting machine 1, and other electronic parts mounted in advance of the inspection part by the mounting process. It is.
  • the reference portion on the circuit board 40 is set for each inspection component 50. That is, even if the two inspection components 50 are of the same component type, the mounting positions Mp are different, so that different reference parts can be set for each inspection component 50.
  • the reference part is set as a peripheral component.
  • the reference portion on the circuit board 40 may be a background region from the peripheral edge of the ideal component to a specified distance.
  • the above-mentioned “ideal part” corresponds to a virtual inspection part mounted in an ideal posture at the mounting position Mp of the inspection part 50.
  • the background area from the ideal component to the specified distance is displayed together with the inspection component as a reference portion.
  • the background region can be a reference site in visual inspection by an operator.
  • the “dimension information” in the inspection standard information SI is information relating to the dimensions of the inspection part determined for each part type. Specifically, for example, the dimension information is set based on the length of the characteristic portion of the inspection component 50, the longest diagonal length, the area of the upper surface of the inspection component 50, and the like. In the present embodiment, this dimension information is used for calculating the enlargement ratio in the display process by the display control unit 34.
  • the imaging control unit 33 controls imaging processing by the substrate camera 16 in order to acquire image data used for visual inspection. Specifically, the imaging control unit 33 controls the imaging process of the board camera 16 based on the inspection reference information SI when the inspection component 50 is mounted on the circuit board 40 in the mounting process by the component mounter 1.
  • the imaging control unit 33 first reads out the characteristic portion and the reference portion corresponding to the inspection component 50 set in the inspection reference information SI. Next, the imaging control unit 33 controls the imaging process so as to acquire image data in which the read characteristic part and reference part are stored.
  • the display control unit 34 causes the display device 17 to display the acquired image data so that the operator can perform a visual inspection.
  • FIGS. 3 and 4A to 6C show image data acquired by executing the imaging process of each aspect.
  • FIG. 5A, and FIG. 6A show image data acquired by executing the imaging process of each aspect.
  • 4B, 5B, and 6C show the display state of the image data displayed on the display device 17 by executing the display processing of each aspect.
  • the imaging control unit 33 is provided on the movable table 22 so that the corner 51 and the positioning mark 41 of the inspection component 50 are within the camera field of view at a predetermined timing after the inspection component 50 is mounted. The substrate camera 16 is moved.
  • the imaging control unit 33 sends a control signal so that the board camera 16 performs an imaging process next.
  • the imaging control circuit 38 of the control device 30 acquires the image data 71 (see FIG. 4A) obtained by the imaging of the substrate camera 16, and the image data 71 is stored in the storage device 35.
  • the inspection support apparatus 90 calculates the enlargement ratio of the image data to be displayed based on the dimension information of the inspection reference information SI, and determines whether or not super-resolution processing is necessary.
  • the inspection support apparatus 90 increases the size and size of the inspection component 50 so that the apparent size of the inspection component 50 displayed in an enlarged manner is similar to the various dimensions of the inspection component 50.
  • the enlargement ratio is calculated from the ratio with the later dimensions.
  • the inspection support apparatus 90 determines that super-resolution processing is necessary.
  • the determination result of the enlargement ratio and the necessity of super-resolution processing is stored in the storage device 35 after being set in the display information DI.
  • the imaging control unit 33 moves the substrate camera 16 and sends a control signal so as to execute the imaging process.
  • the inspection support apparatus 90 calculates the enlargement ratio of the image data 72 and determines whether or not super-resolution processing is necessary.
  • the background region 43 which is the reference portion, is a region from the peripheral edge of the ideal component 60 (shown by a broken line in FIG. 5A) to a specified distance Lr, as indicated by a dashed line in FIG. 5A.
  • the characteristic part of the inspection component 50 is set to “linear end”. Therefore, as shown in FIG. 5B, the display control unit 34 displays a linear peripheral edge 43 a located at a specified distance Lr from the linear end 62 of the ideal component 60 in the background region 43 as a display frame 80 of the image data 72. To be displayed on the display device 17.
  • the display control unit 34 uses both of the linear end portions 52 of the image data 72.
  • the display frame 80 may be displayed so as to match.
  • the display control unit 34 causes the display device 17 to display the extraction area 72 a of the image data 72 by matching the center 63 of the ideal component 60 with the center 81 of the display frame 80 of the image data 72. Thereby, the operator who performs the visual inspection can estimate the mounting position Mp on the circuit board 40 on which the inspection component 50 should be mounted based on the display frame 80.
  • the imaging control unit 33 moves the substrate camera 16 and sends a control signal so as to execute the imaging process. Further, as in the first aspect, the examination support apparatus 90 calculates the enlargement ratio of the image data 73 (see FIG. 6A) and determines whether or not super-resolution processing is necessary.
  • the “bump portion” which is a characteristic portion of the inspection component 50 is a protrusion provided on the lower surface of an electronic component such as a chip component.
  • the chip of the wafer Wf supplied by the wafer supply device 12a is used as the inspection component 50 to be visually inspected, and a plurality of protruding terminals provided on the lower surface of the chip are used as the bump portion 53.
  • the position of the bump portion 53 with respect to the outer shape of the chip may be different due to the influence of processing accuracy and the like.
  • the component mounter 1 controls the mounting process as follows.
  • the control apparatus 30 acquires the lower surface image data 75 (refer FIG. 6B) of an electronic component by the imaging of the component camera 15.
  • the image processing unit 32 recognizes the holding state of the electronic component by the component transfer device 13 based on the position of the bump unit 53 included in the acquired lower surface image data 75. By this recognition processing, the position of the bump part 53 of the electronic component with respect to the axial center of the suction nozzle 24 that holds the electronic component is recognized.
  • the control device 30 controls the operation of the component transfer device 13 based on a preset control program and the recognized holding state of the electronic component.
  • the electronic component is mounted on the circuit board 40 so that the bump part 53 of the electronic component is electrically connected to the electrode part on the circuit board 40.
  • the bump portion 53 provided on the lower surface of the electronic component is a feature portion on the appearance of the electronic component, and corresponds to the “lower surface feature portion” of the present invention.
  • the characteristic part of the inspection component 50 is set to “linear end part” and “bump part”, and the reference part is set to “virtual bump part”. Therefore, the display control unit 34 causes the display device 17 to display the extraction area 73a of the image data 73 as shown in FIG. 6C. More specifically, the display control unit 34 inverts the bump portion 53 included in the lower surface image data 75 used for the recognition processing of the holding state of the inspection component 50 by the image processing unit 32, and the lower surface feature portion after the inversion. The virtual bump portion 76 is superimposed on the extraction area 73a of the image data 73 and displayed.
  • the electrode part to which the bump part 53 is electrically connected is extracted from the image data of the circuit board 40 before the inspection component 50 is mounted, and the image data 73 is used as the virtual electrode part 77. And the virtual bump part 76 are displayed. Thereby, in the displayed image data 73, the positional relationship between the characteristic portion of the inspection component 50 (the linear end portion 52 of the inspection component 50), the lower surface characteristic portion (bump portion 53), the reference portion (virtual bump portion 76), and the like. Based on this, a visual inspection is performed by an operator. In the present embodiment, since the virtual electrode portion 77 is also displayed, it is possible to inspect whether or not the electronic component is mounted so that the bump portion 53 is connected to the corresponding electrode portion.
  • the inspection support device 90 includes a transfer device (component transfer device 13) that holds the electronic component supplied to the supply position Sp and transfers the electronic component to the mounting position Mp on the circuit board 40. It is applied to the component mounter 1 provided.
  • the inspection support device 90 supports a visual inspection of the mounted state performed on the electronic component mounted on the circuit board 40.
  • the inspection support device 90 includes a camera (substrate camera 16) provided in the transfer device so as to be able to take an image of the circuit board 40, and external features and mountings on the inspection component 50 to be visually inspected among electronic components.
  • the imaging control of the camera is controlled to acquire the image data 71 to 73 containing the characteristic part and the reference part corresponding to the inspection component 50, and the imaging by the camera And a display control unit 34 for displaying the image data 71 to 73 on the display device 17.
  • the inspection support apparatus 90 displays the image data 71 to 73 captured by the board camera 16 provided in the component mounter 1 to enable visual inspection by the operator. Therefore, the operator can reliably visually inspect the inspection component 50 to be inspected regardless of the size of the inspection component 50.
  • the inspection support apparatus 90 controls the imaging process so that the characteristic part of the inspection component 50 and the preset reference portion are included in the image data 71 to 73 to be displayed. Thereby, the operator can determine the quality of the mounting state of the inspection component 50 based on the displayed characteristic part and the reference part. Therefore, with the configuration as described above, it is possible to improve the efficiency of the visual inspection of the mounted state.
  • the inspection reference information SI includes dimension information of the inspection component 50 associated with the inspection component 50.
  • the display control unit 34 enlarges the image data 71 to 73 at an enlargement rate based on the dimension information and causes the display device 17 to display the image data. According to such a configuration, when the dimensions of the inspection part 50 are different for each part type, the enlargement ratio is automatically adjusted based on these dimensions, and the image data 71 to 73 are displayed. Thereby, the operator can visually inspect efficiently the characteristic part and the reference
  • the reference part in the inspection reference information SI is a positioning mark 41 provided on the circuit board 40 or a component (peripheral component 42) arranged on the circuit board 40.
  • a positioning mark 41 provided on the circuit board 40 or a component (peripheral component 42) arranged on the circuit board 40.
  • the reference part in the inspection reference information SI is the background region 43 from the peripheral part of the ideal component 60 to the specified distance Lr, with the inspection component 50 mounted in an ideal posture at the mounting position Mp as an ideal component 60.
  • the inspection component 50 In the visual inspection of the mounting state, it may be difficult to determine the suitability of the mounting state even if the inspection component 50 is placed on the circuit board 40. This is because, simply by visually inspecting the inspection component 50, the ideal mounting position Mp for control is unknown, and it is not easy to determine how much the inspection component 50 is displaced from the mounting position Mp. Therefore, by setting the background region 43 from the peripheral edge of the ideal component 60 to the specified distance Lr as the reference portion, the operator determines whether the mounting state is good or not based on the relative position of the inspection component 50 with respect to the reference portion. can do.
  • the characteristic part in the inspection reference information SI is a linear end 52 in the inspection part 50.
  • the display control unit 34 displays on the display device 17 a linear peripheral edge 43 a located at a specified distance Lr from the linear edge 52 of the ideal component 60 in the background region 43 in alignment with the display frame 80 of the image data 72.
  • the image data 72 is displayed with the display frame 80 parallel to the linear end portion 52 of the ideal component 60.
  • the display control unit 34 causes the display device 17 to display the image data 72 by matching the center portion 63 of the ideal component 60 with the center portion 81 of the display frame 80 of the image data 72. According to such a configuration, the operator can grasp the ideal mounting position Mp for control with the display frame 80. Therefore, the operator can determine the quality of the mounting state by visual observation based on the positional relationship between the inspection component 50 and the display frame 80 housed in the display frame 80.
  • the component mounter 1 is included in the component camera 15 that can image the lower surface of the electronic component held by the transfer device (component transfer device 13), and the lower surface image data 75 of the electronic component captured by the component camera 15.
  • Image processing unit 32 for recognizing the holding state of the electronic component by the transfer device based on the lower surface feature (bump portion 53) of the electronic component to be held, and the holding state of the electronic component recognized as a preset control program
  • a control device 30 for controlling the operation of the transfer device based on the above.
  • the display control unit 34 inverts the lower surface feature portion included in the lower surface image data 75 used for the recognition processing of the holding state of the inspection component 50 by the image processing unit 32, and the inverted lower surface feature portion (virtual bump unit 76). ) Is superimposed on the image data 73 and displayed on the display device 17.
  • the display device 17 has a lower surface characteristic portion (bump portion 53) that can be different for each inspection component 50 superimposed on the image data 73. Is displayed. Thereby, the operator can see as if he had seen through the lower surface characteristic part (bump part 53) of the inspection component 50 actually mounted. Therefore, since it can be determined whether or not the inspection component 50 is properly mounted based on the position of the lower surface feature (bump portion 53), it is easy to determine whether or not the inspection component 50 is mounted. Therefore, the efficiency of visual inspection can be improved.
  • the display control unit 34 of the image data 71 to 73 displayed on the display device 17 is rectangular.
  • the display frame 80 can be set to an arbitrary shape.
  • the inspection component 50 displayed by the extraction areas 71a to 73a is only a part of the electronic component if the feature set in the inspection standard information SI is accommodated in consideration of the size of the display frame 80 and the like. May be displayed.
  • the extraction area 72 a of the image data 72 is displayed on the display device 17 by matching the center part 63 of the ideal component 60 with the center part 81 of the display frame 80.
  • image data is displayed in the center portion 81 of the display frame 80 by matching the reference part or the middle point between the feature part and the reference part. You may make it make it.
  • the imaging control unit 33 may control the imaging process corresponding to the visual inspection of the fine electronic component based on the dimension information of the inspection standard information SI. Specifically, for example, when the variable focus lens of the substrate camera 16 is employed, the operation of the variable focus lens is controlled so as to increase the ratio of the area of the inspection component in the image data. Further, when the substrate camera 16 employs a fixed focus lens, control is performed so that the inspection component 50 is imaged a plurality of times in order to obtain a plurality of image data used for the super-resolution processing.
  • the display control unit 34 may perform various auxiliary displays when displaying the image data 71 to 73. Specifically, the display of the ideal component 60, the actual position of the inspection component 50 with respect to the ideal component 60, the display of the angle deviation amount, and the display of the preset allowable error may be superimposed on the image data. . With such a configuration, the visual inspection by the operator is supported, and the efficiency of the visual inspection can be improved.
  • Component mounter 2: Base 13: Component transfer device (transfer device) 22: moving table, 23: mounting head, 24: suction nozzle, 15: Component camera 16: Board camera (camera) 17: Display device 30: Control device 32: Image processing unit 33: Imaging control unit 34: Display control unit SI: Inspection standard information DI: Display information 40: Circuit board 41: Positioning mark (reference part) 42: Peripheral parts (reference part) 43: Background region (reference part), 43a: Peripheral portion Lr: Specified distance 50: Inspection component (electronic component) 51: Linear end portion (characteristic portion) 52: Center portion 53: Bump portion (lower surface characteristic portion) 60: Ideal part 61: Linear end part (characteristic part), 62: Center part 71 to 73: Image data, 71a to 73a: Extraction range 75: Lower surface image data, 76: Virtual bump part (lower surface characteristic part after inversion) ) 80: Display frame 81: Center portion 82: Horizontal frame portion 90:

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention a pour objet un dispositif d'aide à l'inspection permettant une inspection visuelle plus efficace de l'état de montage d'un composant électrique dans une machine de montage du composant. Le dispositif d'aide à l'inspection d'après la présente invention comporte : des informations de référence d'inspection obtenues en associant à un composant d'inspection qui fait l'objet d'une inspection visuelle, parmi des composants électroniques, une partie visuellement caractéristique du composant d'inspection et une région de référence sur une carte à circuits imprimés, ladite région étant située à proximité d'un emplacement de montage ; une unité de commande de capture d'image qui commande un traitement de capture d'image d'une caméra sur la base des informations de référence d'inspection et obtient des données d'image qui correspondent au composant d'inspection et dans lesquelles la partie caractéristique et la région de référence sont stockées ; et une unité de commande d'affichage qui affiche sur un dispositif d'affichage des données d'image obtenues au moyen de la capture d'image par la caméra.
PCT/JP2015/051317 2015-01-20 2015-01-20 Dispositif d'aide à l'inspection WO2016117016A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016570233A JP6571116B2 (ja) 2015-01-20 2015-01-20 検査支援装置
PCT/JP2015/051317 WO2016117016A1 (fr) 2015-01-20 2015-01-20 Dispositif d'aide à l'inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/051317 WO2016117016A1 (fr) 2015-01-20 2015-01-20 Dispositif d'aide à l'inspection

Publications (1)

Publication Number Publication Date
WO2016117016A1 true WO2016117016A1 (fr) 2016-07-28

Family

ID=56416582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/051317 WO2016117016A1 (fr) 2015-01-20 2015-01-20 Dispositif d'aide à l'inspection

Country Status (2)

Country Link
JP (1) JP6571116B2 (fr)
WO (1) WO2016117016A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019110224A (ja) * 2017-12-19 2019-07-04 ヤマハ発動機株式会社 部品実装装置
JPWO2018203373A1 (ja) * 2017-05-01 2019-12-12 株式会社Ｆｕｊｉ 実装装置、情報処理装置、実装システム、実装方法及び情報処理方法
CN111066380A (zh) * 2017-09-08 2020-04-24 株式会社富士 对基板作业机
JP2020174184A (ja) * 2020-06-19 2020-10-22 株式会社Ｆｕｊｉ 生産管理方法及び生産管理システム
US11367170B2 (en) 2016-12-01 2022-06-21 Fuji Corporation Manufacturing management system for component mounting line
WO2023135710A1 (fr) * 2022-01-13 2023-07-20 株式会社Fuji Dispositif d'affichage

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09307299A (ja) * 1996-05-17 1997-11-28 Sony Corp 実装基板の検査装置
JPH10290098A (ja) * 1997-04-15 1998-10-27 Nippon Avionics Co Ltd 目視検査用部品実装位置指示装置
JP2007327757A (ja) * 2006-06-06 2007-12-20 Mega Trade:Kk 目視検査装置
JP2013088291A (ja) * 2011-10-18 2013-05-13 Fuji Electric Co Ltd 目視検査支援装置及び目視検査支援装置の制御方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3358401B2 (ja) * 1995-08-25 2002-12-16 ソニー株式会社 物品検査方法及び装置
JP4481192B2 (ja) * 2005-02-24 2010-06-16 ヤマハ発動機株式会社 検査条件管理システムおよび部品実装システム
JP2010251415A (ja) * 2009-04-13 2010-11-04 Hitachi High-Technologies Corp 作業処理装置あるいは表示基板モジュール組立ラインまたは表示基板モジュール組立方法
JP5875401B2 (ja) * 2012-02-16 2016-03-02 富士機械製造株式会社 基板検査システムおよびデータ記憶方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09307299A (ja) * 1996-05-17 1997-11-28 Sony Corp 実装基板の検査装置
JPH10290098A (ja) * 1997-04-15 1998-10-27 Nippon Avionics Co Ltd 目視検査用部品実装位置指示装置
JP2007327757A (ja) * 2006-06-06 2007-12-20 Mega Trade:Kk 目視検査装置
JP2013088291A (ja) * 2011-10-18 2013-05-13 Fuji Electric Co Ltd 目視検査支援装置及び目視検査支援装置の制御方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11367170B2 (en) 2016-12-01 2022-06-21 Fuji Corporation Manufacturing management system for component mounting line
JPWO2018203373A1 (ja) * 2017-05-01 2019-12-12 株式会社Ｆｕｊｉ 実装装置、情報処理装置、実装システム、実装方法及び情報処理方法
CN111066380A (zh) * 2017-09-08 2020-04-24 株式会社富士 对基板作业机
CN111066380B (zh) * 2017-09-08 2021-04-23 株式会社富士 对基板作业机
JP2019110224A (ja) * 2017-12-19 2019-07-04 ヤマハ発動機株式会社 部品実装装置
JP2020174184A (ja) * 2020-06-19 2020-10-22 株式会社Ｆｕｊｉ 生産管理方法及び生産管理システム
JP6991277B2 (ja) 2020-06-19 2022-01-12 株式会社Fuji 生産管理方法及び生産管理システム
WO2023135710A1 (fr) * 2022-01-13 2023-07-20 株式会社Fuji Dispositif d'affichage

Also Published As

Publication number Publication date
JP6571116B2 (ja) 2019-09-04
JPWO2016117016A1 (ja) 2017-10-26

Similar Documents

Publication Publication Date Title
JP6571116B2 (ja) 検査支援装置
JP4629584B2 (ja) 実装システムおよび電子部品の実装方法
JP2006220426A (ja) 実装された電子部品の検査方法及び装置
JP2017152651A (ja) 部品検査装置及び部品実装装置
WO2016117017A1 (fr) Dispositif d'aide à l'inspection et procédé d'aide à l'inspection
US20150363957A1 (en) Support pin arrangement determination assisting apparatus and support pin arrangement determination assisting method
WO2016174763A1 (fr) Machine d'inspection de composants et machine de montage de composants
JP2008091815A (ja) 実装機およびその部品撮像方法
JP5903588B2 (ja) 下受けピンの配置決定支援装置および配置決定支援方法
JP6271514B2 (ja) 生産設備
WO2017081773A1 (fr) Dispositif de traitement d'image et procédé de traitement d'image pour plaque de base
JP2007189029A (ja) 実装システム、実装機、印刷機および電子部品の実装方法
JP2019011960A (ja) 電子部品搬送装置および電子部品検査装置
JP2011014946A (ja) 電子部品実装方法及び実装機
JP6715714B2 (ja) 検査支援装置および検査支援方法
JP2003101299A (ja) 電気回路製造装置、電気回路製造方法および電気回路製造用プログラム
CN109219339B (zh) 零件安装装置及存储介质
JPWO2015052755A1 (ja) 実装装置
JP2005353750A (ja) 電子部品搭載装置の保守管理装置
JP4901451B2 (ja) 部品実装装置
JP2013074231A (ja) ハンダ付け検査装置
US11154000B2 (en) Substrate work machine
JP2016063182A (ja) 作業機
US10354036B2 (en) Model data generation device, method of generating model data, mounting reference point determination device, and method of determining mounting reference point
JP6012150B2 (ja) 部品実装方法および部品実装システム

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15878712

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2016570233

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15878712

Country of ref document: EP

Kind code of ref document: A1