WO2016101594A1 - 触摸屏的边框结构及其制造方法、触摸屏和显示装置 - Google Patents

触摸屏的边框结构及其制造方法、触摸屏和显示装置 Download PDF

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Publication number
WO2016101594A1
WO2016101594A1 PCT/CN2015/083778 CN2015083778W WO2016101594A1 WO 2016101594 A1 WO2016101594 A1 WO 2016101594A1 CN 2015083778 W CN2015083778 W CN 2015083778W WO 2016101594 A1 WO2016101594 A1 WO 2016101594A1
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WIPO (PCT)
Prior art keywords
transparent conductive
substrate
photoresist layer
insulating photoresist
touch screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2015/083778
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English (en)
French (fr)
Inventor
吴玲艳
张雷
谢涛峰
刘洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/129,907 priority Critical patent/US10007367B2/en
Publication of WO2016101594A1 publication Critical patent/WO2016101594A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • Embodiments of the present invention relate to the field of display technologies, and in particular, to a bezel structure of a touch screen, a touch screen having the bezel structure, a display device having the touch screen, and a method of manufacturing a bezel structure of the touch screen.
  • the metal frame is basically used as the edge line for the surrounding frame.
  • the metal trace has the characteristics of good conductivity, narrow line width and low resistance, which can meet the requirements of narrow frames.
  • the narrow frame that can be made by using metal lines mainly includes a 2-3 mm mobile phone touch screen, a TPC/NB touch screen of about 5 mm, and an MNT touch screen of about 10 mm.
  • OGS One Glass Solution
  • the present invention has been proposed in order to realize a borderless touch screen.
  • a bezel structure of a touch screen is provided, the touch screen having a substrate, and the bezel structure includes:
  • a BM portion provided at one end of the substrate on the back surface of the substrate
  • the bonding region is provided with a plurality of metal leads and a plurality of transparent conductive pads, each of the plurality of transparent conductive pads being electrically connected to a corresponding metal lead;
  • a first insulating photoresist layer disposed between the transparent conductive pad and the metal lead in a thickness direction of the substrate, the transparent conductive pad and the corresponding metal lead being disposed at the first insulating photoresist Electrical connection of jump holes in the layer;
  • a plurality of transparent conductive edge traces are disposed on the back sides of the substrate on both sides of the substrate, and each of the transparent conductive edge traces extends to the bonding region to form a corresponding transparent conductive pad.
  • the BM portion, the transparent conductive pad, the first insulating photoresist layer, and the metal lead are sequentially disposed from the substrate in a thickness direction of the substrate.
  • the frame structure further includes a second insulating photoresist layer disposed on a side of the metal lead away from the first insulating photoresist layer.
  • the BM portion, the metal lead, the first insulating photoresist layer, and the transparent conductive pad are sequentially disposed from the substrate in a thickness direction of the substrate.
  • the frame structure further includes a second insulating photoresist layer disposed on a side of the transparent conductive pad away from the first insulating photoresist layer.
  • the frame structure further includes an X-direction transparent conductive strip disposed at an intermediate portion of the back surface of the substrate and a Y-direction transparent conductive strip substantially parallel to the transparent conductive edge trace, wherein the X-direction transparent conductive strip and the Y The transparent conductive strips are electrically isolated from each other.
  • the X-direction transparent conductive strip is electrically connected through a corresponding transparent conductive bridge formed on the substrate, the transparent conductive bridge is provided with an auxiliary insulating photoresist layer, and the Y-transparent conductive strip is disposed at Above the auxiliary insulating photoresist layer.
  • the first insulating photoresist layer and the auxiliary insulating photoresist layer are disposed in the same layer and are made of the same material.
  • the frame structure is an OGS frame structure.
  • a touch screen including the above-described bezel structure.
  • a display device having the touch panel described above is proposed.
  • a method for forming a bezel structure of a touch screen includes the following steps:
  • each of the transparent conductive pads is electrically connected to the corresponding metal lead through the jump hole.
  • steps S100 to S400 are sequentially performed.
  • the step S200 further includes forming a plurality of transparent conductive bridges by using a material forming a transparent conductive edge trace in a middle portion of the back surface of the substrate; and the step S300 further includes utilizing a material forming the first insulating photoresist layer An auxiliary insulating photoresist layer partially covering each of the plurality of transparent conductive bridges is formed.
  • the method further includes the following steps between step S300 and step S400: forming an X-direction transparent conductive strip and a Y-direction transparent conductive strip in a middle portion of the back surface of the substrate, wherein the X-direction transparent conductive strip passes through the corresponding The transparent conductive bridge is electrically connected, and the Y-transparent conductive strip is disposed above the corresponding auxiliary insulating photoresist layer, and the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer.
  • the method further includes the step of forming a second insulating photoresist layer covering the back surface of the substrate after the step S400.
  • step S100, the step S400, the step S300, and the step S200 are sequentially performed.
  • the step S400 further includes forming a plurality of conductive bridges by using a material forming the metal leads in a middle portion of the back surface of the substrate; and the step S300 further includes forming a partial covering portion by using a material forming the first insulating photoresist layer An auxiliary insulating photoresist layer of each of the plurality of conductive bridges.
  • the step S200 further includes forming an X-direction transparent conductive strip and a Y-direction transparent conductive strip in a middle portion of the back surface of the substrate, wherein the X-direction transparent conductive strip is electrically connected through the corresponding transparent conductive bridge, and the Y-direction transparent conductive
  • the strip is disposed above the corresponding auxiliary insulating photoresist layer, and the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer.
  • the method further includes forming a second insulating photoresist layer covering the back surface of the substrate after step S200.
  • a borderless technology can be realized to provide a better user experience for the user.
  • FIGS. 1-6 are structural diagrams illustrating a method of fabricating a bezel structure for a touch screen in accordance with an exemplary embodiment of the present invention, in each of which the left side is a schematic top view and the right side is a schematic end view Or a sectional view, where:
  • Figure 1 is a schematic view showing the formation of a BM portion on a substrate, wherein the left side is a plan view and the right side is a side view;
  • FIG. 2 is a schematic view showing the formation of a first transparent conductive layer, wherein the left side is a schematic plan view, and the right side is a side view;
  • FIG. 3 is a schematic view showing the formation of a first insulating photoresist layer, wherein the left side is a schematic plan view, and the right side is a side view;
  • FIG. 4 is a schematic view showing the formation of a second transparent conductive layer, wherein the left side is a schematic plan view, and the right side is a side view;
  • Figure 5 is a schematic view showing the formation of a metal layer or a metal wiring layer, wherein the left side is a plan view and the right side is a side view;
  • Fig. 6 shows a schematic view of forming a second insulating photoresist layer, wherein the left side is a plan view and the right side is a side view.
  • Embodiments of the present invention relate to a method of fabricating a bezel structure of a touch screen having a substrate, the method comprising the steps of:
  • each of the transparent conductive pads is electrically connected to the corresponding metal lead through the jump hole.
  • a borderless technology can be realized to provide a better user experience for the user.
  • the frame structure described above may be an OGS frame structure to reduce the thickness of the touch screen.
  • the material forming the transparent conductive edge trace, the transparent conductive pad, and the subsequent transparent conductive bridge may be a suitable transparent conductive material such as ITO, FTO, AZO or the like.
  • steps S100 to S400 are performed in sequence. The above steps will be specifically described below with reference to Figs.
  • a BM (black matrix) portion 2 is formed on one end of the substrate (the upper end of the schematic plan view shown in FIG. 1) on the back surface of the substrate 1, and the BM portion 2 is adapted to form a bonding region.
  • the back side of the substrate 1 represents the side opposite to the user-facing side.
  • the BM is only disposed in the area where the bonding area is formed, and the other three sides are not provided with the BM.
  • the BM portion can be formed by a first mask process.
  • step S200 a plurality of transparent conductive edge traces 3 are formed on both sides of the substrate on the back surface of the substrate 1, and each transparent conductive edge trace 3 extends to the bonding region to form a transparent conductive pad 31. .
  • the step S200 further includes forming a plurality of transparent conductive bridges 4 by using a material forming the transparent conductive edge traces 3 in the intermediate portion of the back surface of the substrate 1.
  • the transparent conductive edge traces 3, the transparent conductive pads 31, and the transparent conductive bridge 4 can be formed by a second mask process, which simplifies the fabrication process and reduces the manufacturing cost.
  • a first insulating photoresist layer 5 is formed on the back surface of the substrate 1, and the first insulating photoresist layer 5 forms a jump hole 51 in a region where each of the transparent conductive pads 31 is located.
  • the insulating photoresist layer acts to insulate and protect.
  • the step S300 further includes forming an auxiliary insulating photoresist layer 52 partially covering each of the plurality of transparent conductive bridges 4 by using a material forming the first insulating photoresist layer 5.
  • the first insulating photoresist layer 5 and the auxiliary insulating photoresist layer 52 can be formed by using a third mask process, which simplifies the fabrication process and reduces the manufacturing cost.
  • step S300 further comprising forming an X-direction (lateral direction) transparent conductive strip 6X and a Y-direction (longitudinal direction) transparent conductive strip 6Y in the intermediate portion of the back surface of the substrate 1 (in The schematic diagram on the right side of FIG. 4 is collectively indicated by reference numeral 6), wherein the X-direction transparent conductive strips 6X are electrically connected through the corresponding transparent conductive bridges 4, and the Y-direction transparent conductive strips 6Y are disposed on the corresponding auxiliary insulating photoresist layers.
  • the X-directed transparent conductive strips 6X and the Y-directed transparent conductive strips 6Y are electrically isolated from each other by the auxiliary insulating photoresist layer 52.
  • the X-direction transparent conductive strips 6X and the Y-direction transparent conductive strips 6Y can be formed by a fourth mask process, which simplifies the manufacturing process and reduces the manufacturing cost.
  • the above "partial coverage of the first insulating photoresist layer 5" means that in the case of electrically insulating the conductive bridge 4 through the auxiliary insulating photoresist layer 52 and the Y-transparent conductive strip 6Y, a portion of the conductive bridge 4 is also exposed, so as to facilitate The conductive bridge 4 is electrically connected to the X-transparent conductive strip. That is, in the same row, the X-direction transparent conductive strip 6X includes a plurality of sub-transparent conductive strips, and these sub-transparent conductive strips are electrically connected through the conductive bridge 4.
  • step S400 a plurality of metal leads 7 are disposed on the bonding region, and each of the transparent conductive pads 31 is electrically connected to the corresponding metal wiring 7 through the jump holes 51. Also, the pattern of the metal leads 7 can be formed using a fifth mask process.
  • a second insulating photoresist layer 8 covering the back surface of the substrate 1 may be formed to improve the light blocking property of the back surface of the substrate 1.
  • the second insulating photoresist layer 8 can be formed using a sixth mask process.
  • the second insulating photoresist layer 8 needs to vacate the corresponding portion of the bonding region. As shown in FIG. 6, the second insulating photoresist layer 8 has an opening portion 81 for exposing the metal lead 7 of the bonding region, so as to facilitate the FPC (Flexible Printed Circuit) to pass through the ACF (Anisotropic Conductive Film) and the metal lead of the bonding region. 7 electrical connection.
  • FPC Flexible Printed Circuit
  • Figures 1-6 illustrate a method of fabricating a bezel structure of a touch screen by six mask processes.
  • the mask structure of the touch screen can also be fabricated using 4 mask processes. Specifically, the BM portion is first formed by a first mask process; then, a conductive bridge is formed in a central region of the back surface of the substrate by a second mask process, and a metal lead is formed at a bonding region of the substrate; and then a third mask is passed through Forming a first insulating photoresist layer and an auxiliary insulating photoresist layer, wherein the first insulating photoresist layer is provided with a jump hole; after the first insulating photoresist layer is formed, the fourth mask process may be performed on the back surface of the substrate Forming a plurality of transparent conductive edge traces on both sides of the substrate, each transparent conductive edge trace extending to the bonding region to form a transparent conductive pad, The transparent conductive pad is electrically connected to the corresponding metal lead through the jump hole, and the X-direction transparent conductive strip and the Y-direction transparent conductive
  • the Y-transparent conductive strip is disposed above the corresponding auxiliary insulating photoresist layer, and the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer 52.
  • the mask structure of the touch screen can also be fabricated using 5 mask processes.
  • the BM portion is first formed by a first mask process; then, a conductive bridge is formed in a central region of the back surface of the substrate by a second mask process, and a metal lead is formed at a bonding region of the substrate; and then a third mask is passed through Forming a first insulating photoresist layer and an auxiliary insulating photoresist layer, wherein the first insulating photoresist layer is provided with a jump hole; after the first insulating photoresist layer is formed, the fourth mask process may be performed on the back surface of the substrate Forming a plurality of transparent conductive edge traces on both sides of the substrate, each transparent conductive edge trace extending to the bonding region to form a transparent conductive pad, and the transparent conductive pad is electrically connected to the corresponding metal lead through the jump hole, and
  • the back intermediate portion of the substrate forms an X-direction transparent conductive strip and
  • the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer 52; thereafter, the cover substrate back is formed by a fifth mask process a second insulating photoresist layer.
  • etching is required.
  • the etchant is generally acidic and adversely affects the metal leads.
  • the transparent conductive layer is covered by the first insulating photoresist layer and the auxiliary insulating photoresist layer after the transparent conductive layer is formed, the developer is generally alkaline when etching the first insulating photoresist layer, and does not It has an adverse effect on metal leads and metal bridge points.
  • steps S100 to S400 are described as being sequentially performed.
  • step S100, step S400, step S300, and step S200 are performed in sequence. That is, the step S200 of forming the transparent conductive pad and the step S400 of forming the metal lead are interchangeable, but the step S300 for forming the first insulating photoresist layer is performed between step S200 and step S400, Electrical isolation of the transparent conductive pads and formation of the metal leads is achieved.
  • the above embodiments are merely illustrative.
  • the transparent conductive edge trace when the transparent conductive edge trace is formed, the transparent conductive bridge, the X-direction transparent conductive strip and the Y-direction transparent conductive strip may be formed at different times; when the metal lead layer is formed, the metal bridge point may not be formed at the same time. .
  • an embodiment of the further aspect of the present invention further provides a frame structure of the touch screen.
  • the touch screen has a substrate 1.
  • the frame structure includes:
  • a BM portion 2 provided at one end of the substrate on the back surface of the substrate 1;
  • the bonding region is provided with a plurality of metal leads 7 and a plurality of transparent conductive pads 31, each of the plurality of transparent conductive pads 31 being electrically connected to the corresponding metal leads 7;
  • a first insulating photoresist layer 5 is disposed between the transparent conductive pad 31 and the metal lead 7 in the thickness direction of the substrate 1, and the transparent conductive pad 31 and the corresponding metal lead 7 are disposed on the first insulating photoresist layer 5
  • a plurality of transparent conductive edge traces 3 are disposed on the back side of the substrate 1 on both sides of the substrate, and each of the transparent conductive edge traces 3 extends to the bonding region to form a corresponding transparent conductive pad 31.
  • the BM portion 2 in the bonding region, the transparent conductive pad 31, the first insulating photoresist layer 5, and the metal wiring 7 are sequentially disposed on the back surface of the substrate 1.
  • the frame structure further includes a second insulating photoresist layer 8 in which: in the thickness direction of the substrate 1, in the bonding region, the BM portion 2, the transparent conductive pad 31, and the first layer are sequentially disposed on the back surface of the substrate 1.
  • the second insulating photoresist layer is disposed on a side of the metal lead remote from the first insulating photoresist layer.
  • a BM portion, a metal lead, a first insulating photoresist layer, and a transparent conductive pad are sequentially disposed on the back side of the substrate in the thickness direction of the substrate.
  • the frame structure further includes a second insulating photoresist layer, wherein: in the thickness direction of the substrate, in the bonding region, the BM portion, the metal wire, the first insulating photoresist layer, and the transparent conductive pad are sequentially disposed on the back surface of the substrate.
  • a second insulating photoresist layer such that the second insulating photoresist layer is disposed on a side of the transparent conductive pad away from the first insulating photoresist layer. That is, in embodiments of the invention, the locations of the metal leads and the transparent conductive pads are interchangeable, but with a first insulating photoresist layer therebetween.
  • the bezel structure according to an embodiment of the present invention further includes an X-direction transparent conductive strip 6X extending in the lateral direction disposed substantially in the intermediate portion of the back surface of the substrate 1 (the region outside the bonding region) and substantially parallel to the transparent conductive edge trace 3
  • the Y-direction transparent conductive strip 6Y extending in the longitudinal direction, wherein the X-direction transparent conductive strip 6X and the Y-transparent conductive strip 6Y are electrically isolated from each other.
  • the X-direction transparent conductive strips 6X and the Y-transparent conductive strips 6Y are electrically connected to the corresponding transparent conductive edge traces 3 to control the X-direction transparent conductive strips 6X and the Y-direction transparent conductive strips 6Y by the control circuit through the flexible circuit board, thereby realizing Display function.
  • the X-direction transparent conductive strips 6X are electrically connected through corresponding transparent conductive bridges 4 formed on the substrate 1.
  • the transparent conductive bridge 4 is provided with an auxiliary insulating photoresist layer 52, and the Y-direction transparent conductive strips 6Y are disposed.
  • the auxiliary insulating photoresist layer 52 Above the auxiliary insulating photoresist layer 52, the X-direction transparent conductive strips 6X and the Y-transparent conductive strips 6Y are electrically isolated from each other.
  • the first insulating photoresist layer 5 and the auxiliary insulating photoresist layer 52 are disposed in the same layer and are made of the same material, which can be formed by a single mask process, which simplifies the manufacturing process and reduces the manufacturing cost.
  • the present invention provides a touch screen including the above-described bezel structure.
  • the present invention provides a display device having the above touch screen.
  • the display device may be any product or component having a display function, such as a liquid crystal panel, an electronic paper, an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the technical solution of the present invention is particularly suitable for a small-sized touch screen, such as a touch screen of 10 inches or less.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种触摸屏的边框结构、具有该边框结构的触摸屏、具有该触摸屏的显示装置以及制造触摸屏的边框结构的方法，其中该边框结构包括：在基板（1）的背面设置在基板一端的BM部（2）；设置在BM部（2）上的结合区，所述结合区设置有多根金属引线（7）以及多个透明导电焊盘（31），每个所述多个透明导电焊盘（31）与对应的金属引线（7）电连接；在基板的厚度方向上设置在透明导电焊盘（31）与金属引线（7）之间的第一绝缘光阻层（5），所述透明导电焊盘（31）与对应的金属引线（7）利用设置在第一绝缘光阻层（5）中的跳孔（51）电连接；以及在基板（1）的背面设置在基板（1）的两侧的多根透明导电边缘走线（3），每一根透明导电边缘走线（3）延伸到结合区而形成对应的所述透明导电焊盘（31）。利用透明导电材料作为边缘走线，可以实现无边框的技术，为用户提供更好的用户体验。

Description

触摸屏的边框结构及其制造方法、触摸屏和显示装置 技术领域
本发明的实施例涉及显示技术领域，尤其涉及触摸屏的边框结构，具有该边框结构的触摸屏，具有该触摸屏的显示装置以及制造触摸屏的边框结构的方法。
背景技术
随着触摸屏行业的发展，基于市场需求，触摸屏的边框部分也越来越趋向于窄边框。
目前，四周边框基本采用金属线路作为边缘走线。金属走线具有导通性好、线宽窄、电阻低的特性，可以满足窄边框的需求。但由于金属材料的不透明性，同时考虑到外观需求，利用金属线路作为边缘走线不可能实现无边框触摸屏。目前采用金属线路可做的窄边框主要包括2-3mm的手机触摸屏、5mm左右的TPC/NB触摸屏、以及10mm左右的MNT触摸屏。
目前市面上的OGS(One Glass Solution)产品均以金属走线作为边缘走线。但该产品仍无法实现无边框，且在小尺寸产品部分，窄边框最窄只能做到2mm左右。
现有技术中存在对无边框触摸屏的需求。
发明内容
为实现无边框触摸屏，提出本发明。
根据本发明的实施例的一个方面，提出了一种触摸屏的边框结构，所述触摸屏具有基板，所述边框结构包括：
在基板的背面设置在基板一端的BM部；
设置在BM部上的结合区，所述结合区设置有多根金属引线以及多个透明导电焊盘，每个所述多个透明导电焊盘与对应的金属引线电连接；
在基板的厚度方向上设置在透明导电焊盘与金属引线之间的第一绝缘光阻层，所述透明导电焊盘与对应的金属引线利用设置在第一绝缘光阻 层中的跳孔电连接；以及
在基板的背面设置在基板的两侧的多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成对应的所述透明导电焊盘。
可选地，所述BM部、透明导电焊盘、第一绝缘光阻层和金属引线在基板的厚度方向上从所述基板依次设置。
进一步可选地，所述边框结构还包括第二绝缘光阻层，所述第二绝缘光阻层设置在所述金属引线的远离第一绝缘光阻层的一侧。
可选地，所述BM部、金属引线、第一绝缘光阻层和透明导电焊盘在基板的厚度方向上从所述基板依次设置。
进一步可选地，所述边框结构还包括第二绝缘光阻层，所述第二绝缘光阻层设置在所述透明导电焊盘的远离所述第一绝缘光阻层的一侧。
可选地，所述边框结构还包括设置在基板的背面中间区域的X向透明导电条和与所述透明导电边缘走线大致平行的Y向透明导电条，其中，X向透明导电条与Y向透明导电条相互电隔离。
可选地，所述X向透明导电条通过形成在所述基板上的对应的透明导电桥电连接，所述透明导电桥上设有辅助绝缘光阻层，所述Y向透明导电条设置在所述辅助绝缘光阻层上方。
可选地，所述第一绝缘光阻层与辅助绝缘光阻层设置在同一层并由相同的材料制成。
可选地，所述边框结构为OGS边框结构。
根据本发明的实施例的另一个方面，提出了一种触摸屏，包括上述的边框结构。
根据本发明的实施例的再一个方面，提出了一种显示装置，具有上述的触摸屏。
根据本发明的实施例的还一个方面，提出了一种触摸屏的边框结构的形成方法，所述触摸屏具有基板，所述方法包括如下步骤：
S100、在基板的背面在基板一端形成BM部，BM部上适于形成结合区；
S200、在基板的背面在基板的两侧形成多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成透明导电焊盘；
S300、在基板的背面形成第一绝缘光阻层，所述第一绝缘光阻层在每 一个透明导电焊盘所在区域形成跳孔；以及
S400、在结合区上设置多根金属引线；
其中，通过所述跳孔每一个透明导电焊盘与对应的金属引线电连接。
可选地，上述方法中，步骤S100至S400依次执行。
进一步地，所述步骤S200还包括在基板的背面中间区域利用形成透明导电边缘走线的材料形成多个透明导电桥；且所述步骤S300还包括利用形成所述第一绝缘光阻层的材料形成部分覆盖所述多个透明导电桥中的每一个的辅助绝缘光阻层。
进一步可选地，上述方法还包括在步骤S300与步骤S400之间的如下步骤：在基板的背面中间区域形成X向透明导电条和Y向透明导电条，其中，X向透明导电条通过对应的透明导电桥电连接，Y向透明导电条设置在对应的辅助绝缘光阻层上方，且X向透明导电条与Y向透明导电条通过所述辅助绝缘光阻层相互电隔离。
可选地，上述方法还包括步骤：在步骤S400之后形成覆盖基板背面的第二绝缘光阻层。
或者可选地，上述方法中，所述步骤S100、步骤S400、步骤S300和步骤S200依次执行。
进一步地，所述步骤S400还包括在基板的背面中间区域利用形成金属引线的材料形成多个导电桥；且所述步骤S300还包括利用形成所述第一绝缘光阻层的材料形成部分覆盖所述多个导电桥中的每一个的辅助绝缘光阻层。进一步可选地，所述步骤S200还包括在基板的背面中间区域形成X向透明导电条和Y向透明导电条，其中，X向透明导电条通过对应的透明导电桥电连接，Y向透明导电条设置在对应的辅助绝缘光阻层上方，且X向透明导电条与Y向透明导电条通过所述辅助绝缘光阻层相互电隔离。可选地，所述方法还包括：在步骤S200之后形成覆盖基板背面的第二绝缘光阻层。
在本发明的实施例中，利用透明导电材料作为边缘走线，可以实现无边框的技术，为用户提供更好的用户体验。
附图说明
图1-6示出了体现根据本发明的一个示例性实施例的制造触摸屏的边框结构的方法的结构示意图，在每幅图中，左侧为示意性俯视图，而右侧为示意性端视图或截面图，其中：
图1示出了在基板上形成BM部的示意图，其中左侧的为平面示意图，右侧的为侧视图；
图2示出了形成第一透明导电层的示意图，其中左侧的为平面示意图，右侧的为侧视图；
图3示出了形成第一绝缘光阻层的示意图，其中左侧的为平面示意图，右侧的为侧视图；
图4示出了形成第二透明导电层的示意图，其中左侧的为平面示意图，右侧的为侧视图；
图5示出了形成金属层或金属引线层的示意图，其中左侧的为平面示意图，右侧的为侧视图；以及
图6示出了形成第二绝缘光阻层的示意图，其中左侧的为平面示意图，右侧的为侧视图。
具体实施方式
下面结合附图，对本发明实施例提供的触摸屏的边框结构、具有该边框结构的触摸屏、具有该触摸屏的显示装置以及制造触摸屏的边框结构的方法进行详细地说明。
附图中各部件的大小和形状不反映触摸屏或边框结构的真实比例，甚至右侧的端视图或截面图与左侧的俯视图也存在不对应之处，附图的目的只是示意性说明本发明的内容。
本发明的实施例涉及一种制造触摸屏的边框结构的方法，所述触摸屏具有基板，所述方法包括如下步骤：
S100、在基板的背面在基板一端形成BM部，BM部上适于形成结合区；
S200、在基板的背面在基板的两侧形成多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成透明导电焊盘；
S300、在基板的背面形成第一绝缘光阻层，所述第一绝缘光阻层在每一个透明导电焊盘所在区域形成跳孔；以及
S400、在结合区上设置多根金属引线；
其中，通过所述跳孔每一个透明导电焊盘与对应的金属引线电连接。
基于上述方法，利用透明导电材料作为边缘走线，可以实现无边框的技术，为用户提供更好的用户体验。
在本发明的实施例中，上述的边框结构可以是OGS边框结构，以降低触摸屏的厚度。
在本发明的实施例中，形成透明导电边缘走线、透明导电焊盘以及后续的透明导电桥的材料可以是ITO、FTO、AZO等适合的透明导电材料。
在一种示例性实施例中，步骤S100至S400依次执行。下面参照附图1-6具体说明上述步骤。
如图1所示，步骤S100中，在基板1的背面在基板一端(图1中所示的平面示意图的上端)形成BM(black matrix)部2，BM部2上适于形成结合区。在本发明的实施例中，基板1的背面表示与面向用户侧相反的一侧。BM仅仅设置在形成结合区的区域，其他3边均没有设置BM。例如，BM部可以由一次第一掩膜(mask)工艺形成。
如图2所示，步骤S200中，在基板1的背面在基板的两侧形成多根透明导电边缘走线3，每一根透明导电边缘走线3延伸到结合区而形成透明导电焊盘31。如图2所示，所述步骤S200还包括在基板1的背面中间区域利用形成透明导电边缘走线3的材料形成多个透明导电桥4。这样，透明导电边缘走线3、透明导电焊盘31以及透明导电桥4可以通过一次第二掩膜工艺形成，简化了制作工艺，降低了制作成本。
如图3所示，在步骤S300中，在基板1的背面形成第一绝缘光阻层5，所述第一绝缘光阻层5在每一个透明导电焊盘31所在区域形成跳孔51。在本发明的实施例中，绝缘光阻层起到了绝缘和保护的作用。如图3所示，所述步骤S300还包括利用形成第一绝缘光阻层5的材料形成部分覆盖所述多个透明导电桥4中的每一个的辅助绝缘光阻层52。这样，第一绝缘光阻层5和辅助绝缘光阻层52可以通过用一次第三掩膜工艺形成，简化了制作工艺，降低了制作成本。
如图4所示，在步骤S300之后，还包括在基板1的背面中间区域形成X向(横向方向)透明导电条6X和Y向(纵向方向)透明导电条6Y(在 图4的右侧的示意图中统一以附图标记6表示)，其中，X向透明导电条6X通过对应的透明导电桥4电连接，Y向透明导电条6Y设置在对应的辅助绝缘光阻层52上方，且X向透明导电条6X与Y向透明导电条6Y通过辅助绝缘光阻层52相互电隔离。这样，X向透明导电条6X和Y向透明导电条6Y可以通过一次第四掩膜工艺形成，简化了制作工艺，降低了制作成本。
上文中的“第一绝缘光阻层5部分覆盖”表示：在使得导电桥4通过辅助绝缘光阻层52与Y向透明导电条6Y电绝缘的情况下，还露出部分导电桥4，以便于使得导电桥4与X向透明导电条电连接。也就是说，在同一行中，X向透明导电条6X包括多条子透明导电条，而且这些子透明导电条通过导电桥4电连接。
如图5所示，在步骤S400中，在结合区上设置多根金属引线7，通过跳孔51每一个透明导电焊盘31可以与对应的金属引线7电连接。同样，可以利用一次第五掩膜工艺形成金属引线7的图案。
如图6所示，在步骤S400之后，还可以形成覆盖基板1背面的第二绝缘光阻层8，以提高基板1背面的遮光性。可以使用一次第六掩膜工艺形成第二绝缘光阻层8。
明显地，第二绝缘光阻层8需要空出结合区中相应的部分。如图6中所示，第二绝缘光阻层8具有开口部81，用于露出结合区的金属引线7，以便于FPC(Flexible Printed Circuit)通过ACF(Anisotropic Conductive Film)与结合区的金属引线7电连接。
图1-6示出了通过6次掩模(mask)工艺制造触摸屏的边框结构的方法。
可选地，为节省制造成本，也可以使用4次掩模工艺制造触摸屏的边框结构。具体地，首先通过第一次掩膜工艺形成BM部；然后通过一次第二掩膜工艺在基板的背面的中心区域形成导电桥以及在基板的结合区形成金属引线；之后通过一次第三掩膜工艺形成第一绝缘光阻层和辅助绝缘光阻层，第一绝缘光阻层上设置有跳孔；在形成了第一绝缘光阻层之后，可以通过一次第四掩膜工艺在基板的背面在基板的两侧形成多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成透明导电焊盘， 透明导电焊盘通过跳孔与对应的金属引线电连接，同时在基板的背面中间区域形成X向透明导电条和Y向透明导电条，其中，X向透明导电条通过对应的透明导电桥电连接，Y向透明导电条设置在对应的辅助绝缘光阻层上方，且X向透明导电条与Y向透明导电条通过辅助绝缘光阻层52相互电隔离。
可选地，为节省制造成本，也可以使用5次掩模工艺制造触摸屏的边框结构。具体地，首先通过一次第一掩膜工艺形成BM部；然后通过一次第二掩膜工艺在基板的背面的中心区域形成导电桥以及在基板的结合区形成金属引线；之后通过一次第三掩膜工艺形成第一绝缘光阻层和辅助绝缘光阻层，第一绝缘光阻层上设置有跳孔；在形成了第一绝缘光阻层之后，可以通过一次第四掩膜工艺在基板的背面在基板的两侧形成多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成透明导电焊盘，透明导电焊盘通过跳孔与对应的金属引线电连接，同时在基板的背面中间区域形成X向透明导电条和Y向透明导电条，其中，X向透明导电条通过对应的透明导电桥电连接，Y向透明导电条设置在对应的辅助绝缘光阻层上方，且X向透明导电条与Y向透明导电条通过辅助绝缘光阻层52相互电隔离；此后，通过一次第五掩膜工艺形成覆盖基板背面的第二绝缘光阻层。
在4掩模工艺和5掩模工艺中，形成透明导电层(包括透明导电边缘走线、透明导电焊盘、透明导电桥、X向透明导电条和Y向透明导电条)时，需要使用蚀刻液，该蚀刻液一般为酸性，会对金属引线产生不良影响。但是，因为在形成了该透明导电层之后，利用第一绝缘光阻层和辅助绝缘光阻层覆盖透明导电层，在蚀刻第一绝缘光阻层时，显影液一般为碱性，并不会对金属引线、金属桥点产生不良影响。
在上面的实施例中，描述了步骤S100至S400依次执行。在一种可替换的实施例中，步骤S100、步骤S400、步骤S300和步骤S200依次执行。也就是说，形成透明导电焊盘的步骤S200和形成金属引线的步骤S400是可以互换的，但在步骤S200和步骤S400之间需执行用于形成第一绝缘光阻层的步骤S300，以实现对透明导电焊盘和形成金属引线的电隔离。
需要指出的是，以上实施例仅仅是说明性的。例如，在制造触摸屏的 边框结构的方法中，在形成透明导电边缘走线时，可以不同时形成透明导电桥、X向透明导电条和Y向透明导电条；在形成金属引线层时，也可以不同时形成金属桥点。
基于以上实施例，如图5-6所示，本发明进一步方面的实施例还提出了一种触摸屏的边框结构，触摸屏具有基板1，边框结构包括：
在基板1的背面设置在基板一端的BM部2；
设置在BM部上的结合区，结合区设置有多根金属引线7以及多个透明导电焊盘31，多个透明导电焊盘31中的每一个与对应的金属引线7电连接；
在基板1的厚度方向上设置在透明导电焊盘31与金属引线7之间的第一绝缘光阻层5，透明导电焊盘31与对应的金属引线7利用设置在第一绝缘光阻层5中的跳孔51电连接；以及
在基板1的背面设置在基板的两侧的多根透明导电边缘走线3，每一根透明导电边缘走线3延伸到结合区而形成对应的透明导电焊盘31。
上述边框结构中，利用透明导电材料作为边缘走线，可以实现无边框的技术，为用户提供更好的用户体验。
可选地，在基板1的厚度方向上，在结合区，在基板1的背面依次设置BM部2、透明导电焊盘31、第一绝缘光阻层5、金属引线7。
进一步可选地，边框结构还包括第二绝缘光阻层8，其中：在基板1的厚度方向上，在结合区，在基板1的背面依次设置BM部2、透明导电焊盘31、第一绝缘光阻层5、金属引线5、第二绝缘光阻层8。这样，所述第二绝缘光阻层设置在所述金属引线的远离第一绝缘光阻层的一侧。
在一种可替换的实施例中，在基板的厚度方向上，在结合区，在基板的背面依次设置BM部、金属引线、第一绝缘光阻层、透明导电焊盘。进一步地，边框结构还包括第二绝缘光阻层，其中：在基板的厚度方向上，在结合区，在基板的背面依次设置BM部、金属引线、第一绝缘光阻层、透明导电焊盘、第二绝缘光阻层，这样，所述第二绝缘光阻层设置在所述透明导电焊盘的远离所述第一绝缘光阻层的一侧。也就是说，在本发明的实施例中，金属引线和透明导电焊盘的位置是可以互换的，但二者之间具有第一绝缘光阻层。
根据本发明一种实施例的边框结构还包括设置在基板1的背面中间区域(结合区之外的区域)的在横向方向延伸的X向透明导电条6X和与透明导电边缘走线3大致平行的在纵向方向延伸的Y向透明导电条6Y，其中，X向透明导电条6X与Y向透明导电条6Y相互电隔离。X向透明导电条6X和Y向透明导电条6Y与相应的透明导电边缘走线3电连接，以由控制电路通过柔性电路板控制X向透明导电条6X与Y向透明导电条6Y，进而实现显示功能。
在一种实施例中，X向透明导电条6X通过形成在基板1上的对应的透明导电桥4电连接，透明导电桥4上设有辅助绝缘光阻层52，Y向透明导电条6Y设置在辅助绝缘光阻层52上方，以实现X向透明导电条6X与Y向透明导电条6Y相互电隔离。进一步地，第一绝缘光阻层5与辅助绝缘光阻层52设置在同一层并由相同的材料制成，这样可以通过一次掩模工艺形成，简化了制作工艺，降低了制作成本。
相应地，本发明提出一种触摸屏，包括上述的边框结构。
相应地，本发明提出一种显示装置，具有上述的触摸屏。所述显示装置可以为：液晶面板、电子纸、OLED面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。基于消影工艺，本发明的技术方案尤其适用于小尺寸的触摸屏，例如10寸以下的触摸屏。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (20)

  1. 一种触摸屏的边框结构，所述触摸屏具有基板，所述边框结构包括：
    在基板的背面设置在基板一端的BM部；
    设置在BM部上的结合区，所述结合区设置有多根金属引线以及多个透明导电焊盘，每个所述多个透明导电焊盘与对应的金属引线电连接；
    在基板的厚度方向上设置在透明导电焊盘与金属引线之间的第一绝缘光阻层，所述透明导电焊盘与对应的金属引线利用设置在第一绝缘光阻层中的跳孔电连接；以及
    在基板的背面设置在基板的两侧的多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成对应的所述透明导电焊盘。
  2. 根据权利要求1所述的边框结构，其中：
    所述BM部、透明导电焊盘、第一绝缘光阻层和金属引线在基板的厚度方向上从所述基板依次设置。
  3. 根据权利要求2所述的边框结构，还包括第二绝缘光阻层，所述第二绝缘光阻层设置在所述金属引线的远离第一绝缘光阻层的一侧。
  4. 根据权利要求1所述的边框结构，其中：
    所述BM部、金属引线、第一绝缘光阻层和透明导电焊盘在基板的厚度方向上从所述基板依次设置。
  5. 根据权利要求4所述的边框结构，还包括第二绝缘光阻层，所述第二绝缘光阻层设置在所述透明导电焊盘的远离所述第一绝缘光阻层的一侧。
  6. 根据权利要求1-5中的任一项所述的边框结构，还包括设置在基板的背面中间区域的X向透明导电条和与所述透明导电边缘走线大致平行 的Y向透明导电条，其中，X向透明导电条与Y向透明导电条相互电隔离。
  7. 根据权利要求6所述的边框结构，其中，所述X向透明导电条通过形成在所述基板上的对应的透明导电桥电连接，所述透明导电桥上设有辅助绝缘光阻层，所述Y向透明导电条设置在所述辅助绝缘光阻层上方。
  8. 根据权利要求7所述的边框结构，其中，所述第一绝缘光阻层与辅助绝缘光阻层设置在同一层并由相同的材料制成。
  9. 根据权利要求1-8中任一项所述的边框结构，其中：
    所述边框结构为OGS边框结构。
  10. 一种触摸屏，包括根据权利要求1-9中任一项所述的边框结构。
  11. 一种显示装置，具有根据权利要求10所述的触摸屏。
  12. 一种制造触摸屏的边框结构的方法，所述触摸屏具有基板，所述方法包括如下步骤：
    S100、在基板的背面在基板一端形成BM部，BM部上适于形成结合区；
    S200、在基板的背面在基板的两侧形成多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成透明导电焊盘；
    S300、在基板的背面形成第一绝缘光阻层，所述第一绝缘光阻层在每一个透明导电焊盘所在区域形成跳孔；以及
    S400、在结合区上设置多根金属引线；
    其中，通过所述跳孔每一个透明导电焊盘与对应的金属引线电连接。
  13. 根据权利要求12所述的方法，其中：
    所述步骤S100至S400依次执行。
  14. 根据权利要求13所述的方法，其中：
    所述步骤S200还包括在基板的背面中间区域利用形成透明导电边缘走线的材料形成多个透明导电桥；且
    所述步骤S300还包括利用形成所述第一绝缘光阻层的材料形成部分覆盖所述多个透明导电桥中的每一个的辅助绝缘光阻层。
  15. 根据权利要求14所述的方法，还包括在步骤S300与步骤S400之间的如下步骤：
    在基板的背面中间区域形成X向透明导电条和Y向透明导电条，其中，X向透明导电条通过对应的透明导电桥电连接，Y向透明导电条设置在对应的辅助绝缘光阻层上方，且X向透明导电条与Y向透明导电条通过所述辅助绝缘光阻层相互电隔离。
  16. 根据权利要求12-15中任一项所述的方法，还包括步骤：
    在步骤S400之后形成覆盖基板背面的第二绝缘光阻层。
  17. 根据权利要求9所述的方法，其中：
    所述步骤S100、步骤S400、步骤S300和步骤S200依次执行。
  18. 根据权利要求17所述的方法，其中：
    所述步骤S400还包括在基板的背面中间区域利用形成金属引线的材料形成多个导电桥；且
    所述步骤S300还包括利用形成所述第一绝缘光阻层的材料形成部分覆盖所述多个导电桥中的每一个的辅助绝缘光阻层。
  19. 根据权利要求18所述的方法，其中：
    所述步骤S200还包括在基板的背面中间区域形成X向透明导电条和Y向透明导电条，其中，X向透明导电条通过对应的透明导电桥电连接，Y向透明导电条设置在对应的辅助绝缘光阻层上方，且X向透明导电条与Y向透明导电条通过所述辅助绝缘光阻层相互电隔离。
  20. 根据权利要求12-19中任一项所述的方法，还包括：
    在步骤S200之后形成覆盖基板背面的第二绝缘光阻层。
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