WO2016063603A1 - 固体撮像装置およびこの固体撮像装置を備えた電子内視鏡 - Google Patents

固体撮像装置およびこの固体撮像装置を備えた電子内視鏡 Download PDF

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Publication number
WO2016063603A1
WO2016063603A1 PCT/JP2015/073112 JP2015073112W WO2016063603A1 WO 2016063603 A1 WO2016063603 A1 WO 2016063603A1 JP 2015073112 W JP2015073112 W JP 2015073112W WO 2016063603 A1 WO2016063603 A1 WO 2016063603A1
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WO
WIPO (PCT)
Prior art keywords
imaging device
solid
state imaging
core wire
connecting portion
Prior art date
Application number
PCT/JP2015/073112
Other languages
English (en)
French (fr)
Inventor
一村 博信
朋久 高橋
木村 寛之
Original Assignee
オリンパス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to EP15853210.1A priority Critical patent/EP3103381A4/en
Priority to JP2016506011A priority patent/JP5945653B1/ja
Priority to CN201580011565.2A priority patent/CN106061365A/zh
Publication of WO2016063603A1 publication Critical patent/WO2016063603A1/ja
Priority to US15/251,001 priority patent/US20160367122A1/en

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A61B1/051Details of CCD assembly
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476Non-optical details, e.g. housings, mountings, supports
    • G02B23/2484Arrangements in relation to a camera or imaging device
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/555Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/26Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes using light guides

Definitions

  • the present invention relates to a solid-state imaging device disposed at a distal end portion of an insertion portion of an electronic endoscope.
  • An imaging unit that is a solid-state imaging device that can be introduced into the living body or structure from the outside to observe an area that is difficult to observe, such as the inside of a living body or the inside of a structure, and that captures an optical image
  • An electronic endoscope equipped with the above is used in, for example, the medical field or the industrial field.
  • An imaging unit of an electronic endoscope includes an objective lens that forms a subject image, and a CCD (Charge Coupled Device), a CMOS (Complementary Metal Oxide Semiconductor) sensor, etc. that are generally disposed on the imaging surface of the objective lens.
  • An image sensor is provided.
  • an imaging unit disclosed in Japanese Patent Laid-Open No. 2005-304876 is known.
  • This conventional imaging unit of an electronic endoscope has a configuration in which outer conductors of a plurality of coaxial signal lines are wound around a ground jumper line and connected to a circuit board.
  • the imaging unit is also required to be downsized.
  • the shield bundle in which the shields of a plurality of coaxial signal lines are bundled is electrically connected to the circuit board through the ground jumper wire, the longitudinal shortening of the multilayer substrate is hindered.
  • the binding portion of the outer conductor swells in the outer diameter direction and inhibits the diameter reduction.
  • the distal end portion of the insertion portion in which the imaging unit is incorporated becomes longer and the outer diameter becomes larger, which not only prevents the insertion portion from being reduced in diameter.
  • the hard length since the hard length is extended, it has been a factor of lowering the insertability.
  • the present invention has been made in view of the above-described circumstances, and is a compact solid-state imaging device that contributes to reducing the diameter of the insertion portion and shortening the hard length, and an electronic endoscope including the solid-state imaging device.
  • the purpose is to provide a mirror.
  • a solid-state imaging device includes a solid-state imaging device that detects an image of a subject, a hard board that is electrically connected to the imaging device, and a signal cable that includes at least one coaxial line.
  • the hard substrate includes a first surface having a core wire connection portion to which the coaxial wire is connected, and an outer conductor connection portion to which the outer conductor of the coaxial wire is connected.
  • a second surface substantially parallel to the first surface, and the coaxial line is connected substantially parallel to the first and second surfaces of the hard substrate.
  • An electronic endoscope includes an imaging element that detects a subject image, a hard substrate that is electrically connected to the imaging element, and a signal cable that includes at least one coaxial line.
  • the hard substrate includes a first surface having a core wire connecting portion to which the coaxial wire is connected, and an outer conductor connecting portion to which the outer conductor of the coaxial wire is connected.
  • a solid-state imaging device comprising: a second surface substantially parallel to the first surface, wherein the coaxial line is connected substantially parallel to the first and second surfaces of the hard substrate; and the solid-state imaging
  • the apparatus includes an insertion portion built in the distal end portion, and the signal cable is disposed substantially parallel to the longitudinal direction of the insertion portion.
  • the figure which shows the structure of the endoscope of 1 aspect of this invention The front view which shows the structure of the front-end
  • Sectional drawing which shows the structure of the external conductor connection part of the circuit board of the imaging unit of the 1st modification similarly
  • Sectional drawing which shows the structure of the imaging unit along the XII-XII line of FIG.
  • the side view which shows the structure of the circuit board to which the power source line and several signal line of the 3rd modification were connected
  • Sectional drawing which shows the structure of the imaging unit along the XIV-XIV line of FIG.
  • FIG. 21 is a cross-sectional view showing the configuration of the imaging unit along the line XXII-XXII in FIG.
  • FIG. 1 is a diagram showing the configuration of the endoscope
  • FIG. 2 is a front view showing the configuration of the distal end portion of the insertion portion
  • FIG. 3 is a cross-sectional view showing the configuration of the distal end portion taken along line III-III in FIG. 4 is a cross-sectional view showing the structure of the tip portion along line IV-IV in FIG. 3
  • FIG. 5 is a partial cross-sectional view showing the structure of the imaging unit
  • FIG. 6 is a cross-sectional view showing the structure of the composite cable.
  • 7 is a sectional view showing the configuration of the imaging unit along the line VII-VII in FIG. 5
  • FIG. 8 is a sectional view showing the configuration of the imaging unit along the line VIII-VIII in FIG. 5, and
  • FIG. It is a fragmentary sectional view showing composition of a circuit board made.
  • an electronic endoscope hereinafter simply referred to as an endoscope
  • an imaging unit 1 as a solid-state imaging device according to the present invention
  • the endoscope 101 of this embodiment can be introduced into a subject such as a human body and has a configuration for optically imaging a predetermined observation site in the subject.
  • the subject into which the endoscope 101 is introduced is not limited to a human body, and may be another living body or an artificial object such as a machine or a building.
  • the endoscope 101 mainly includes an insertion unit 102 introduced into the subject, an operation unit 103 located at the proximal end of the insertion unit 102, and a universal cord 104 extending from the operation unit 103. Has been.
  • the insertion portion 102 includes a distal end portion 110 disposed at the distal end, a bendable bending portion 109 disposed on the proximal end side of the distal end portion 110, and an operation portion 103 disposed on the proximal end side of the bending portion 109.
  • a flexible tube portion 108 having flexibility is connected to the tip end side of the tube.
  • the endoscope 101 may have a form called a so-called rigid endoscope that does not include a flexible portion in the insertion portion 102.
  • the imaging unit 1 is provided at the distal end portion 110.
  • the operation unit 103 is provided with an angle operation knob 106 for operating the bending of the bending unit 109.
  • an endoscope connector 105 connected to the external device 120 is provided.
  • the external device 120 to which the endoscope connector 105 is connected is connected to an image display unit 121 such as a monitor via a cable.
  • the endoscope 101 is an optical fiber that is a light guide that transmits illumination light from a universal cable 104, an operation unit 103, a composite cable 115 inserted into the insertion unit 102, and a light source unit provided in the external device 120. It has a bundle (not shown).
  • the composite cable 115 is configured to electrically connect the endoscope connector 105 and the imaging unit 1. By connecting the endoscope connector 105 to the external device 120, the imaging unit 1 is electrically connected to the external device 120 via the composite cable 115.
  • the power supply from the external device 120 to the imaging unit 1 and the communication between the external device 120 and the imaging unit 1 are performed via the composite cable 115.
  • the external device 120 is provided with an image processing unit.
  • the image processing unit generates a video signal based on the image sensor output signal output from the imaging unit 1 and outputs the video signal to the image display unit 121. That is, in this embodiment, an optical image (endoscopic image) captured by the imaging unit 1 is displayed on the image display unit 121 as a video.
  • the endoscope 101 is not limited to the configuration connected to the external device 120 or the image display unit 121, and may be configured to include a part or all of the image processing unit or the monitor, for example.
  • the light guide is configured to transmit light emitted from the light source unit of the external device 120 to the illumination window as the illumination light emitting unit of the distal end portion 110.
  • the light source unit may be arranged on the operation unit 103 or the distal end portion 110 of the endoscope 101.
  • the configuration of the imaging unit 1 provided at the distal end portion 110 will be described.
  • the direction from the imaging unit 1 toward the subject may be referred to as the front end, the front, or the object side, and the opposite direction may be referred to as the base end, the rear, or the image side. .
  • the distal end portion 110 of the insertion portion 102 is provided with an observation window 21, two illumination windows 22 and a treatment instrument channel opening 23 on the distal end surface 111 thereof.
  • the distal end portion 110 is provided with a distal end rigid portion 30 which is a metal block body through which the imaging unit 1 and the tubular member 24 are inserted and held and fixed.
  • the distal end of the treatment instrument channel 25 is connected to the tubular member 24, and an outward flange 24a for positioning the distal end position of the treatment instrument channel 25 is formed.
  • the treatment instrument channel 25 is disposed from the insertion section 102 to the inside of the operation section 103, and a proximal end is connected to a treatment instrument insertion port provided in the operation section 103.
  • the distal end of the outer tubular member 26 that covers the distal end portions of the imaging unit 1, the tubular member 24, and the treatment instrument channel 25 is externally connected to the distal rigid portion 30.
  • the proximal end of the exterior tubular member 26 is fitted and connected to the most advanced bending piece (not shown) provided in the bending portion 109.
  • outer tubular member 26 is fixed with the end of the curved rubber 28 covering the curved portion 109 by the pincushion bonding portion 27.
  • the treatment instrument channel 25 connected to the tubular member 24 and a plurality of, here, two light guides 29 are disposed in the distal end portion 110. .
  • the plurality of light guides 29 are each covered with an outer skin 29a, and the distal end portion is inserted and fixed to the distal end hard portion 30 so that the distal end surface faces the back surface of the illumination window 22 shown in FIG.
  • the imaging unit 1 as the solid-state imaging device of the present embodiment will be described in detail below.
  • the imaging unit 1 mainly includes a lens holder 2, an imaging element holder 3, an imaging element 4, and a circuit board 5 in order from the front object side.
  • the lens holder 2 a plurality of objective lens groups 31 as an objective optical system are arranged here.
  • the state-of-the-art objective lens constitutes the observation window 21 shown in FIG. 2.
  • the lens holder 2 of the imaging unit 1 is fitted with the imaging element holder 3.
  • the imaging element holder 3 is provided with a cemented lens 33 inside the base end side, and is bonded to a cover glass 34 that protects a light receiving unit (not shown) of the solid-state imaging element 4 after adjusting the optical axis.
  • the image sensor 4 is a very small rectangular electronic component.
  • the imaging device 4 is a device in which a plurality of devices that output electrical signals corresponding to incident photographing light at a predetermined timing are arranged in a planar light-receiving unit, for example, generally a CCD (charge coupled device), CMOS A form called a (complementary metal oxide semiconductor) sensor or other various forms are applied.
  • the imaging element 4 has a back surface that is the base end side bonded to the circuit board 5.
  • the circuit board 5 is composed of, for example, a multilayer substrate as a hard substrate whose base material is composed of a laminated substrate of glass epoxy resin or ceramic.
  • the circuit board 5 is surface-bonded to the back surface of the image sensor 4 via a thermosetting adhesive or the like, a plurality of electronic components 35 and 36 are mounted, and a core wire of a plate-like block in which electronic components (not shown) are embedded.
  • the connecting portion 5a and the outer conductor connecting portion 5b serving as a protruding portion extending so as to protrude rearward from the central portion of the proximal end of the core wire connecting portion 5a.
  • the circuit board 5 as the hard board has a flexible printed circuit board (hereinafter referred to as FPC) 37 electrically connected to the lower surface of the core wire connecting portion 5a, and an inner lead extending from the front end side of the FPC 37.
  • FPC flexible printed circuit board
  • a plurality of conductor lands 43 to which the core wire 41a of the power supply line 41 and the core wires 42a of the plurality of signal lines 42 are connected by solder are disposed on the front and back surfaces of the circuit board 5 behind the core wire connection portion 5a.
  • At least one conductor land 43 and the outer skin 42d of the plurality of signal lines 42 are peeled in the extending direction along the longitudinal direction of the circuit board 5.
  • One or a plurality of outer conductor lands 44 to which the outer diameter portion of the outer conductor 42c is connected are disposed.
  • the circuit board 5 has the core wires 41a and 42a of the power supply line 41 and the signal line 42 for transmitting and receiving an imaging signal, a drive signal and the like extended from the composite cable 115, and are electrically connected to the conductor land 43 by solder.
  • the outer diameter portion of the outer conductor 42c of the signal line 42 is electrically connected to the outer conductor land 44 by solder.
  • the plurality of signal lines 42 here are coaxial cables.
  • the plurality of signal lines 42 are arranged in the composite cable 115 together with the power supply line 41 in the insertion portion 102.
  • the composite cable 115 has a configuration in which an outer shield 115 b is covered with a general shield 115 a such as a copper wire.
  • the power supply line 41 has a configuration in which the core wire 41a is covered with an outer skin 41b formed of an insulating resin.
  • a plurality of signal lines 42 that are coaxial lines are inserted into a resin-made dielectric 42b whose core wire 42a controls impedance, and a thin conductor covering, for example, the outer periphery of the dielectric 42b is braided to form GND.
  • the above-described outer conductor 42c used is covered with an outer skin 42d made of an insulating resin.
  • the power supply line 41 and the plurality of signal lines 42 When the power supply line 41 and the plurality of signal lines 42 are electrically connected to the imaging unit 1, the power supply line 41 and the plurality of signal lines 42 extend from the distal end of the composite cable 115, and the outer skins 41 b and 42 d are peeled off.
  • the power supply line 41 is soldered to at least one of the conductor lands 43 on the upper surface side as viewed from the surface of the core wire connection portion 5 a of the circuit board 5 of the circuit board 5 of the imaging unit 1. Is electrically connected. At this time, as shown in FIG. 8, the power supply line 41 is connected to the conductor land 43 by peeling the core wire 41a so that the outer skin 41b overlaps the outer conductor connecting portion 5b.
  • the plurality of signal lines 42 have respective core wires 42a on the front and back surfaces of the core wire connection portion 5a in the circuit board 5 of the imaging unit 1, here, the upper and lower surfaces as viewed toward the paper surface. It is electrically connected to a predetermined conductor land 43 by solder (see FIG. 7).
  • the plurality of signal lines 42 are stripped so that the distal end position of the dielectric 42b is close to the base end of the core wire connection portion 5a so as not to overlap the core wire connection portion 5a.
  • the core wire 42a is stripped and removed. Accordingly, since the signal line 42 can be connected in parallel to the laminated substrate 5a, it is possible to prevent the signal line 42 from bending in the vertical direction on the paper surface and increasing the outer shape of the imaging unit.
  • the outer conductor 42c is cut so that the tip is located slightly behind the tip of the dielectric 42b so as not to be short-circuited with the core wire 42a, and covers the dielectric 42b.
  • An outer peripheral portion as an outer diameter portion is electrically connected to a predetermined external conductor land 44 provided on the back surface by solder (see FIG. 8).
  • the plurality of external conductor lands 44 provided for each signal line are collectively used for the same GND, and wide cable lands may be arranged on the upper and lower surfaces of the external conductor connecting portion 5b in this embodiment. .
  • the circuit board 5 is integrally formed by a base material on which the core wire connection portion 5a and the outer conductor connection portion 5b are laminated, and one or a plurality, in this case, 2 on the front and back surfaces of the portion to become the core wire connection portion 5a
  • a step of the outer conductor connecting portion 5b is formed by further stacking the sheets 5c.
  • the dimensional difference ⁇ t between the outer diameter portion of the core wire 42a of the signal line 42 and the outer diameter portion of the outer conductor that is, the sum of the thickness of the dielectric of the signal line 42 and the thickness of the outer conductor is the sheet 5c.
  • the thickness is approximately an integral multiple of.
  • the dimensional difference ⁇ t is about twice the thickness of the sheet 5c, and the two sheets 5c are laminated to be predetermined in the inner diameter direction with respect to the core wire connecting portion 5a.
  • the step of the outer conductor connecting portion 5b having the height dimension t1 is formed.
  • the circuit board 5 to which the signal line 42 is connected is formed by combining one or a plurality of sheets 5c according to the dimensional difference ⁇ t between the outer diameter portion of the core wire 42a of the signal line 42 and the outer diameter portion of the outer conductor.
  • a step is formed in the outer conductor connecting portion 5b having a predetermined height dimension t1 in the center direction with respect to the connecting portion 5a.
  • the imaging unit 1 includes the core wire connection portion 5a to which the power supply line 41 and the core wires 41a and 42a of the plurality of signal lines 42 are connected to the circuit board 5, and the outline center direction with respect to the core wire connection portion 5a. And an outer conductor connecting portion 5b to which the outer conductors 42c of the plurality of signal lines 42 are connected.
  • the conductor land 43 of the core wire connection part 5 a to which one signal line 42 is connected and the external conductor land 44 of the external conductor connection part 5 b are along the longitudinal direction of the circuit board 5. Arranged in the direction.
  • the imaging unit 1 can connect the plurality of signal lines 42 to the circuit board 5 linearly along the longitudinal direction. That is, the plurality of signal lines 42 can connect the outer conductor 42c and the outer conductor land 44 of the outer conductor connecting portion 5b in a substantially straight state from the state where the core wire 42a is connected to the conductor land 43 of the core wire connecting portion 5a. .
  • the imaging unit 1 configured as described above does not need to entangle the external conductors 42c of the plurality of signal lines 42 with a ground jumper line or the like as in the prior art, and is connected to the GND external conductor land 44.
  • the outer cover 42d can be electrically connected in a state of being peeled off, the circuit board 5 can be shortened, and since the outer conductor 42c does not have a binding portion and does not swell in the outer diameter direction, the diameter can be reduced. .
  • the outer conductor connecting portion 5b extending from the circuit board 5 which is a hard board to the base end side uses a space for routing each signal line 42 to a predetermined position of the laminated board 5a.
  • the hard length of the circuit board 5 can be shortened without extending.
  • the imaging unit 1 according to the present embodiment can be reduced in size in the configuration built in the distal end portion 110 of the insertion portion 102 of the endoscope 101, the distal end portion 110 is also reduced in size, and the insertion portion 102. It can be set as the structure which contributes to diameter reduction.
  • the imaging unit 1 is provided with a step on the circuit board 5, so that the solder material used when soldering the core wires 41 a and 42 a of the power supply line 41 and the plurality of signal lines 42 to the conductor land 43 is affected by the surface tension. It is difficult to flow to the connection portion 5b side, and it is possible to prevent a short circuit with the external conductors 42c of the plurality of signal lines 42, and there is no need to make a space in the longitudinal direction of the insertion portion as in the prior art, and thus the advantage of shortening the hard length There is also.
  • the imaging unit 1 may have various modified configurations described below. Of course, the various configurations described below can also be combined with each other.
  • FIG. 10 is a cross-sectional view showing the configuration of the external conductor connecting portion of the circuit board of the imaging unit of the first modification.
  • the imaging unit 1 matches the shape of the external conductor 42 c in a portion where the external conductor land 44 is connected to the external conductor connection portion 5 b of the circuit board 5.
  • a concave portion 5d having an arcuate cross section may be formed.
  • the imaging unit 1 has the concave portion 5d formed in the external conductor connecting portion 5b of the circuit board 5 and the external conductor land 44 is provided on the surface of the concave portion 5d. Soldering of the conductor 42c to the outer conductor land 44 is facilitated and the assemblability is improved.
  • circuit board 5 here is also formed with a recess 5e having an arcuate cross section in which the power supply line 41 engages with the outer conductor connecting portion 5b. Therefore, positioning of the power supply line 41 to the circuit board 5 is facilitated.
  • the depth dimension of the recess 5d is the sum (sum) of the respective thickness dimensions of the outer conductor land 44, the dielectric 42b of the signal line 42, and the outer conductor 42c, so that the outer conductor with respect to the core wire connecting part 5a. There is no need to provide a step in the connecting portion 5b.
  • FIG. 11 is a side view showing the configuration of the circuit board to which the power supply line and the plurality of signal lines of the second modification are connected
  • FIG. 12 is a cross-sectional view showing the configuration of the imaging unit along the line XII-XII in FIG. FIG.
  • the imaging unit 1 may have a configuration in which a plurality of signal lines 42 are connected to both side surfaces of the external conductor connecting portion 5b of the circuit board 5.
  • the imaging unit 1 includes the conductor land 43 or the external conductor land in which the core wire 42a or the external conductor 42c of the signal line 42 is connected to both side surfaces of the core wire connection portion 5a or the external conductor connection portion 5b of the circuit board 5. 44 is formed.
  • the outer conductor connecting portion 5b here has a step in the side surface direction with respect to the core wire connecting portion 5a, and the signal lines 42 connected to both side surfaces of the circuit board 5 are arranged in the longitudinal direction. It can be connected linearly along.
  • the imaging unit 1 having such a configuration can improve the design freedom of the circuit board 5 in addition to the above-described effects.
  • FIG. 13 is a side view showing the configuration of the circuit board to which the power supply line and the plurality of signal lines of the third modification are connected
  • FIG. 14 is a cross-sectional view showing the configuration of the imaging unit along the XIV-XIV line in FIG.
  • FIG. 15 and FIG. 15 are side views showing a state before the outer conductor connecting portion is joined to the core wire connecting portion.
  • the imaging unit 1 here has a configuration in which a plurality of signal lines 42 are connected to both side surfaces of the external conductor connecting portion 5 b of the circuit board 5, as in the second modification.
  • the external conductor connection portion 5b is mounted separately from the core wire connection portion 5a of the circuit board 5.
  • the circuit board 5 has a core-shaped connecting portion 5a formed with a rectangular recess 5f from the central portion of the base end surface toward the inside, and the outer conductor connecting portion 5b is connected to the core wire from the central portion of the distal end surface.
  • a rectangular convex portion 5g similar to the concave portion 5f of the portion 5a is formed.
  • the outer conductor connecting portion 5b is attached to the core wire connecting portion 5a by engaging the convex portion 5g of the outer conductor connecting portion 5b with the concave portion 5f of the core wire connecting portion 5a.
  • the outer conductor connecting portion 5b and the core wire connecting portion 5a are fixed by an adhesive or the like.
  • the core wire connecting portion 5a is provided with two electrical contacts 45 on both side portions on the lower side of the base end face.
  • the outer conductor connecting portion 5b is provided with two electrical contacts 46 that are in contact with and electrically connected to the two electrical contacts 45 of the core wire connecting portion 5a on both sides of the lower end side of the base end surface of the distal end surface. Yes.
  • the electrical contacts 45 and 46 in contact with each other are ensured to be electrically connected by fillet-like solder or the like.
  • the electrical contacts 45 and 46 are electrically connected to the GND conductor, and are electrically connected to the external conductor land 44 via the internal wiring in the external conductor connecting portion 5b.
  • the imaging unit 1 assembles a unit in which a plurality of signal lines 42 are connected in advance to the external conductor connection portion 5b on the circuit board 5, and then the core wire connection portion.
  • the outer conductor connecting portion 5b can be attached and fixed to 5a, and the assemblability can be improved.
  • the circuit board 5 is formed by separating the core wire connection portion 5a and the external conductor connection portion 5b, thereby forming a small external conductor connection portion 5b by dicing or the like from a block-shaped laminate as compared with an integrated configuration. There is no need to do this, and the manufacturing becomes easy.
  • FIG. 16 is a side view showing a configuration of a circuit board to which a plurality of signal lines according to a fourth modification are connected
  • FIG. 17 is a cross-sectional view showing a configuration of an imaging unit along the line XVII-XVII in FIG. 18 is a cross-sectional view showing the configuration of the imaging unit along the line XVIII-XVIII in FIG. 16,
  • FIG. 19 is a perspective view showing the configuration of a metal outer conductor connecting portion.
  • a substantially plate-like external conductor connecting portion 51 formed of a conductor such as metal can be attached to the core wire connecting portion 5 a of the circuit board 5. It has become a separate structure.
  • the circuit board 5 is provided with two electrical contacts 49 on one side here on both side surfaces of the core wire connecting portion 5a. As shown in FIG. The two arm portions 51a (see FIG. 19) are electrically connected by solder.
  • the electrical contacts 49 provided in these core wire connection portions 5a are electrically connected to the GND conductor by internal wiring.
  • the outer conductor 42c is electrically connected to the front and back surfaces of the plate-like portion 51b of the outer conductor connecting portion 51 directly by solder.
  • the outer conductor connecting portion 51 has a structure in which two arm portions 51a are extended forward from both side portions on the front end side of the plate-like portion 51b.
  • the imaging unit 1 has a plurality of signal lines 42 connected in advance to the external conductor connecting portion 51 in the circuit board 5 as in the third embodiment.
  • the outer conductor connecting portion 5b can be attached and fixed to the core wire connecting portion 5a, and the assemblability can be improved.
  • the outer conductor connecting portion 51 is mounted and fixed at a desired position of the core wire connecting portion 5a, the surface of the core wire connecting portion 5a to which the core wire 42a is connected and the outer conductor 42c are connected as described with reference to FIG.
  • the surface of the external conductor connection portion 5b to be connected has a predetermined height.
  • the imaging unit 1 since the external conductor connection portion 51 itself of the circuit board 5 is a conductor, the imaging unit 1 does not need to provide an external conductor land for electrically connecting the external conductor 42c of the signal line 42, and can be easily provided. Electrical connection with the core wire connecting portion 5a can be performed.
  • FIG. 20 is a top view showing the configuration of a circuit board to which a plurality of signal lines of the fifth modification are connected
  • FIG. 21 is a side view showing the configuration of a circuit board to which a plurality of signal lines are connected
  • FIG. 22 is a cross-sectional view illustrating a configuration of an imaging unit along the line XXII-XXII in FIG.
  • the imaging unit 1 here has external conductor lands 44 to which the external conductors 42 c of the plurality of signal lines 42 are connected to the front and back surfaces of the external conductor connection portion 5 b of the circuit board 5. Step portions 5h and 5i having notches or grooves are formed.
  • the stepped portion 5i formed on the back surface of the outer conductor connecting portion 5b is formed so that the outer conductor connecting portion 5b has a concave cross section.
  • the imaging unit 1 forms the step portions 5h and 5i on the front and back surfaces of the external conductor connection portion 5b of the circuit board 5, and by providing the external conductor land 44 on each surface of the step portions 5h and 5i.
  • the positioning for connecting the signal line 42 is facilitated, the soldering of the outer conductor 42c to the outer conductor land 44 is facilitated, and the assemblability is improved.
  • the imaging unit 1 here has stepped portions 5h and 5i on the front and back surfaces of the external conductor connecting portion 5b more easily than the configuration in which the semicircular concave portion 5d is formed as in the first modification. Since it can be formed, the workability is good.
  • the depth dimension of the stepped portions 5h and 5i is the sum (sum) of the thickness dimensions of the outer conductor land 44, the dielectric 42b of the signal line 42, and the outer conductor 42c, so that the core wire connecting portion 5a.
  • the imaging unit 1 of the embodiment and the modification described above exemplifies a so-called vertical-type imaging device 4, for example, so-called horizontal detection of photographic light refracted using a reflecting member such as a prism is used. It can also be applied to a stand-up type configuration.
  • the endoscope 101 described above is exemplified as a so-called flexible mirror.
  • the endoscope 101 is not limited to a rigid endoscope used for a surgical operation or the like, and is not limited to medical use, but may be any imaging unit 1 such as an industrial endoscope. This technique is applicable to an electronic endoscope equipped with
  • the stated requirements can be deleted if the stated problem can be solved and the stated effect can be obtained.
  • the structure thus constructed can be extracted as an invention.

Abstract

 固体撮像装置(1)は、被写体像を検出する撮像素子(4)と、撮像素子(4)に電気的に接続した硬質基板(5)と、少なくとも1つ以上の同軸線(42)を内蔵する信号ケーブル(115)と、を有し、硬質基板(5)は、同軸線(42)の芯線(42a)が接続される芯線接続部(5a)を有する第1の面と、同軸線(42)の外部導体(42c)が接続される外部導体接続部(5b)を有し、第1の面と略平行な第2の面と、を備え、同軸線(42)が硬質基板(5)の第1および第2の面に対して略平行に接続されている。

Description

固体撮像装置およびこの固体撮像装置を備えた電子内視鏡
 本発明は、電子内視鏡の挿入部の先端部に配設される固体撮像装置に関する。
 生体の体内や構造物の内部などの観察が困難な箇所を観察するために、生体や構造物の外部から内部に導入可能であって、光学像を撮像するための固体撮像装置である撮像ユニットなどを具備した電子内視鏡が、例えば医療分野または工業分野において利用されている。
 電子内視鏡の撮像ユニットは、被写体像を結像する対物レンズと、対物レンズの結像面に配設された一般にCCD(電荷結合素子)、CMOS(相補型金属酸化膜半導体)センサなどの撮像素子を具備している。
 このような電子内視鏡は、例えば、日本国特開2005-304876号公報に開示されるような撮像ユニットが知られている。この従来の電子内視鏡の撮像ユニットは、複数の同軸信号線の外部導体がグランド用ジャンパ線に巻き付けられて回路基板へ接続された構成となっている。
 ところで、近年の電子内視鏡では、被検体への挿入性向上のため、挿入部の細径化および短縮化が要求され、これに伴い撮像ユニットの小型化も要求されている。
 しかしながら、従来の撮像ユニットでは、複数の同軸信号線のシールドが束ねられたシールド束がグランド用ジャンパ線を介して回路基板へ電気的に接続されるため、積層基板の長手方向の短縮化を阻害するばかりでなく、外部導体の結束部が外径方向に膨らんで細径化も阻害するという課題があった。
 このように、撮像ユニットの小型化が阻害されると、撮像ユニットが内蔵される挿入部の先端部が長くなると共に外径が大きくなってしまい、挿入部の細径化を阻害するばかりでなく、硬質長が延びるため挿入性を低下させる要因となっていた。
 そこで、本発明は、上述した事情に鑑みてなされたものであって、挿入部の細径化および硬質長の短縮化に寄与する小型な固体撮像装置およびこの固体撮像装置を備えた電子内視鏡を提供することを目的とする。
 本発明の一態様の固体撮像装置は、被写体像を検出する撮像素子と、前記撮像素子に電気的に接続した硬質基板と、少なくとも1つ以上の同軸線を内蔵する信号ケーブルと、を有する固体撮像装置において、前記硬質基板は、前記同軸線の芯線が接続される芯線接続部を有する第1の面と、前記同軸線の外部導体が接続される外部導体接続部を有し、前記第1の面と略平行な第2の面と、を備え、前記同軸線が前記硬質基板の前記第1および第2の面に対して略平行に接続されている。
 本発明の一態様の電子内視鏡は、被写体像を検出する撮像素子と、前記撮像素子に電気的に接続した硬質基板と、少なくとも1つ以上の同軸線を内蔵する信号ケーブルと、を有する固体撮像装置において、前記硬質基板は、前記同軸線の芯線が接続される芯線接続部を有する第1の面と、前記同軸線の外部導体が接続される外部導体接続部を有し、前記第1の面と略平行な第2の面と、を備え、前記同軸線が前記硬質基板の前記第1および第2の面に対して略平行に接続されている固体撮像装置と、前記固体撮像装置が先端部内に内蔵された挿入部と、を具備し、前記信号ケーブルが前記挿入部の長手方向に略平行に配置されている。
 以上に記載の本発明によれば、挿入部の先端の細径化および硬質長の短縮化に寄与する小型な固体撮像装置およびこの固体撮像装置を備えた電子内視鏡を提供できる。
本発明の一態様の内視鏡の構成を示す図 同、挿入部の先端部の構成を示す正面図 同、図2のIII-III線に沿った先端部の構成を示す断面図 同、図3のIV-IV線に沿った先端部の構成を示す断面図 同、撮像ユニットの構成を示す部分断面図 同、複合ケーブの構成を示す断面図 同、図5のVII-VII線に沿った撮像ユニットの構成を示す断面図 同、図5のVIII-VIII線に沿った撮像ユニットの構成を示す断面図 同、信号線が接続された回路基板の構成を示す部分断面図 同、第1の変形例の撮像ユニットの回路基板の外部導体接続部の構成を示す断面図 同、第2の変形例の電源線および複数の信号線が接続された回路基板の構成を示す側面図 同、図11のXII-XII線に沿った撮像ユニットの構成を示す断面図 同、第3の変形例の電源線および複数の信号線が接続された回路基板の構成を示す側面図 同、図13のXIV-XIV線に沿った撮像ユニットの構成を示す断面図 同、芯線接続部に外部導体接続部が接合される前の状態を示す側面図 同、第4の変形例の複数の信号線が接続された回路基板の構成を示す側面図 同、図16のXVII-XVII線に沿った撮像ユニットの構成を示す断面図 同、図16のXVIII-XVIII線に沿った撮像ユニットの構成を示す断面図 同、金属製の外部導体接続部の構成を示す斜視図 同、第5の変形例の複数の信号線が接続された回路基板の構成を示す上面図、 同、複数の信号線が接続された回路基板の構成を示す側面図 同、図21のXXII-XXII線に沿った撮像ユニットの構成を示す断面
 以下に、本発明の好ましい形態について図面を参照して説明する。なお、以下の説明に用いる各図においては、各構成要素を図面上で認識可能な程度の大きさとするため、構成要素毎に縮尺を異ならせてあるものであり、本発明は、これらの図に記載された構成要素の数量、構成要素の形状、構成要素の大きさの比率、および各構成要素の相対的な位置関係のみに限定されるものではない。また、以下の説明においては、図の紙面に向かって見た上下方向を構成要素の上部および下部、構成要素の内側方向を外形中心方向などとして説明している場合がある。
 先ず、本発明の一態様の固体撮像装置としての撮像ユニットおよび電子内視鏡について、図面に基づいて、以下に説明する。
 なお、図1は、内視鏡の構成を示す図、図2は挿入部の先端部の構成を示す正面図、図3は図2のIII-III線に沿った先端部の構成を示す断面図、図4は図3のIV-IV線に沿った先端部の構成を示す断面図、図5は撮像ユニットの構成を示す部分断面図、図6は複合ケーブの構成を示す断面図、図7は図5のVII-VII線に沿った撮像ユニットの構成を示す断面図、図8は図5のVIII-VIII線に沿った撮像ユニットの構成を示す断面図、図9は信号線が接続された回路基板の構成を示す部分断面図である。
 先ず、図1を参照して、本発明に係る固体撮像装置としての撮像ユニット1を具備する電子内視鏡(以下、単に内視鏡と記載する)101の構成の一例を説明する。
 本実施形態の内視鏡101は、人体などの被検体内に導入可能であって被検体内の所定の観察部位を光学的に撮像する構成を有している。
 なお、内視鏡101が導入される被検体は、人体に限らず、他の生体であっても良いし、機械、建造物などの人工物であっても良い。
 内視鏡101は、被検体の内部に導入される挿入部102と、この挿入部102の基端に位置する操作部103と、この操作部103から延出するユニバーサルコード104とで主に構成されている。
 挿入部102は、先端に配設される先端部110、この先端部110の基端側に配設される湾曲自在な湾曲部109およびこの湾曲部109の基端側に配設され操作部103の先端側に接続される可撓性を有する可撓管部108が連設されて構成されている。
 なお、内視鏡101は、挿入部102に可撓性を有する部位を具備しない、所謂硬性鏡と称される形態のものであってもよい。
 詳しくは後述するが、先端部110には、撮像ユニット1が設けられている。また、操作部103には、湾曲部109の湾曲を操作するためのアングル操作ノブ106が設けられている。
 ユニバーサルコード104の基端部には、外部装置120に接続される内視鏡コネクタ105が設けられている。内視鏡コネクタ105が接続される外部装置120は、モニタなどの画像表示部121にケーブルを介して接続されている。
 また、内視鏡101は、ユニバーサルコード104、操作部103および挿入部102内に挿通された複合ケーブル115および外部装置120に設けられた光源部からの照明光を伝送するライトガイドである光ファイバ束(不図示)を有している。
 複合ケーブル115は、内視鏡コネクタ105と撮像ユニット1とを電気的に接続するように構成されている。内視鏡コネクタ105が外部装置120に接続されることによって、撮像ユニット1は、複合ケーブル115を介して外部装置120に電気的に接続される。
 この複合ケーブル115を介して、外部装置120から撮像ユニット1への電力の供給および外部装置120と撮像ユニット1との間の通信が行われる。
 外部装置120には、画像処理部が設けられている。この画像処理部は、撮像ユニット1から出力された撮像素子出力信号に基づいて映像信号を生成し、画像表示部121に出力する。即ち、本実施形態では、撮像ユニット1により撮像された光学像(内視鏡像)が、映像として画像表示部121に表示される。
 なお、内視鏡101は、外部装置120または画像表示部121に接続する構成に限定されず、例えば、画像処理部またはモニタの一部または全部を有する構成であっても良い。
 また、ライトガイドは、外部装置120の光源部から発せられた光を、先端部110の照明光出射部としての照明窓まで伝送するように構成されている。さらに、光源部は、内視鏡101の操作部103または先端部110に配設される構成であってもよい。
 次に、先端部110に設けられる撮像ユニット1の構成を説明する。なお、以下の説明においては、撮像ユニット1から被写体へ向かう方向(各図において左方)を先端、前方または物体側と称し、その反対の方向を基端、後方または像側と称する場合がある。
 図2に示すように、挿入部102の先端部110は、その先端面111に観察窓21と、ここでは2つの照明窓22と、処置具チャンネル開口部23と、が配設されている。
 そして、先端部110には、図3に示すように、撮像ユニット1および管状部材24が挿通して保持固定される金属ブロック体である先端硬質部30が配設されている。
 管状部材24は、処置具チャンネル25の先端が接続され、この処置具チャンネル25の先端位置を位置決めする外向フランジ24aが形成されている。
 処置具チャンネル25は、挿入部102から操作部103の内部に配設され、基端が操作部103に設けられた処置具挿通口に接続されている。
 先端硬質部30は、撮像ユニット1、管状部材24および処置具チャンネル25の先端部分を覆う外装管状部材26の先端が外嵌接続されている。そして、外装管状部材26の基端は、湾曲部109に設けられる最先端の湾曲駒(不図示)に嵌合接続されている。
 また、外装管状部材26は、糸巻接着部27によって、湾曲部109を被覆する湾曲ゴム28の先端が固定されている。
 なお、先端部110内には、図4に示すように、撮像ユニット1の他、管状部材24に接続された処置具チャンネル25および複数、ここでは2つの上述したライトガイド29が配置されている。
 複数のライトガイド29は、それぞれ外皮29aに被覆されており、先端端面が図2に示した照明窓22の背面に対向するように先端部分が先端硬質部30に挿通固定されている。
 また、内視鏡101におけるその他の構成要素は、従来と同様であるため、それら構成要素の詳細な説明を省略する。
 ここで、本実施の形態の固体撮像装置としての撮像ユニット1について、以下に詳しく説明する。 
 撮像ユニット1は、図5に示すように、前方となる物体側から順に、レンズホルダ2、撮像素子ホルダ3、撮像素子4および回路基板5を有して主に構成されている。
 レンズホルダ2内には、ここでは対物光学系としての複数の対物レンズ群31が配設されている。最先端の対物レンズは、図2に示した観察窓21を構成している、撮像ユニット1のレンズホルダ2は、撮像素子ホルダ3と嵌合されている。撮像素子ホルダ3は、基端側の内部に接合レンズ33が設けられると共に、固体撮像素子4の図示しない受光部を保護するカバーガラス34と光軸調整をした上で接合されている。
 撮像素子4は、非常に小型な矩形状の電子部品である。この撮像素子4は、入射される撮影光に応じた電気信号を所定のタイミングで出力する複数の素子が面状の受光部に配列されたものであり、例えば一般にCCD(電荷結合素子)、CMOS(相補型金属酸化膜半導体)センサなどと称される形式、あるいはその他の各種の形式が適用されている。この撮像素子4は、基端側となる背面が回路基板5と接合されている。
 ここでの回路基板5は、基材がガラスエポキシ樹脂またはセラミックの積層基板から構成された硬質基板として、例えば多層基板から構成されている。この回路基板5は、撮像素子4の背面に熱硬化接着剤などを介して面接合され、複数の電子部品35,36が実装され、内部に図示しない電子部品が埋設された板状ブロックの芯線接続部5aと、この芯線接続部5aの基端中央部分から段差を有して後方に突出するように延設された突出部となる外部導体接続部5bと、を有している。
 この硬質基板としての回路基板5は、芯線接続部5aの下面にフレキシブルプリント基板(以下、FPCと記載する)37が電気的に接続されており、このFPC37の先端側から延設されたインナーリードが撮像素子4の下方前面に形成されたバンプと電気的に接続されている。これにより、撮像素子4に駆動電源が供給され、回路基板5との信号の授受が行われる。
 回路基板5の芯線接続部5aの後方の表裏面には、電源線41の芯線41aおよび複数の信号線42の芯線42aが半田によって接続される複数の導体ランド43が配設されている。
 また、回路基板5の外部導体接続部5bの表裏面には、少なくとも1つの導体ランド43と回路基板5の長手方向に沿った延長方向に、複数の信号線42における外皮42dが剥かれた状態の外部導体42cの外径部が接続される1つ乃至複数の外部導体ランド44が配設されている。
 即ち、回路基板5は、複合ケーブル115から延設された撮像信号、駆動信号などを授受する電源線41のおよび信号線42の芯線41a,42aが導体ランド43に半田によって電気的に接続されており、信号線42の外部導体42cの外径部が外部導体ランド44に半田によって電気的に接続されている。
 なお、ここでの複数の信号線42は、同軸ケーブルが用いられている。これら複数の信号線42は、挿入部102内において、電源線41と共に複合ケーブル115内に配設されている。
 複合ケーブル115は、図6に示すように、銅線などの総合シールド115aに外皮115bが被覆された構成となっている。また、電源線41は、芯線41aが絶縁樹脂から形成された外皮41bによって被覆された構成となっている。
 同軸線である複数の信号線42は、芯線42aがインピーダンスをコントロールする樹脂製の誘電体42b内に挿通しており、この誘電体42bの外周を覆う、例えば細い導体が編組されて、GNDとして利用される上述の外部導体42cが絶縁樹脂から形成された外皮42dに被覆された構成となっている。
 これら電源線41および複数の信号線42は、撮像ユニット1と電気的に接続される際に、複合ケーブル115の先端から延出し、それぞれの外皮41b,42dが剥ぎ取られる。
 電源線41は、図7に示すように、芯線41aが撮像ユニット1の回路基板5における芯線接続部5aの表面、ここでは紙面に向かって見た上面側の導体ランド43の少なくとも1つに半田によって電気的に接続される。このとき、電源線41は、図8に示すように、外皮41bが外部導体接続部5bと重畳するように芯線41aが剥き出されて導体ランド43に接続される。
 また、複数の信号線42も電源線41と同様に、ぞれぞれの芯線42aが撮像ユニット1の回路基板5における芯線接続部5aの表裏面、ここでは紙面に向かって見た上下面の所定の導体ランド43に半田によって電気的に接続される(図7参照)。
 このとき、複数の信号線42は、図5に示したように、誘電体42bの先端位置が芯線接続部5aに重ならないように芯線接続部5aの基端に近接した位置となるように剥ぎ取られて芯線42aが剥き出された状態となっている。これにより信号線42は積層基板5aに対して平行に接続できるため、信号線42が紙面の上下方向に曲がって撮像ユニットの外形が大きくなることを防ぐことができる。
 そして、外部導体42cは、芯線42aと短絡しないように誘電体42bの先端よりも若干後方側に先端が位置するように切り取られて、誘電体42bを覆った状態で外部導体接続部5bの表裏面に設けられた所定の外部導体ランド44に外径部としての外周部が半田によって電気的に接続される(図8参照)。
 なお、各信号線用に設けられた複数の外部導体ランド44は、同じGND用のため一括にまとめ、本実施例では外部導体接続部5bの上下面に各々広いケーブルランドを配置しても良い。
 回路基板5は、図9に示すように、芯線接続部5aおよび外部導体接続部5bを積層する基材によって一体形成し、芯線接続部5aとなる部分の表裏面に単数または複数、ここでは2枚のシート5cをさらに積層して外部導体接続部5bの段差が形成されている。
 具体的には、先ず、信号線42の芯線42aの外径部と外部導体の外径部の寸法差δt、即ち、信号線42の誘電体の厚さと外部導体の厚さの和がシート5cの略整数倍の厚さとなっている。なお、回路基板5は、ここでは、上記寸法差δtがシート5cの厚さの約2倍となっており、2枚のシート5cを積層して、芯線接続部5aに対して内径方向に所定の高さ寸法t1を有した外部導体接続部5bの段差が形成される。
 したがって、回路基板5に形成される外部導体接続部5bの段差の高さ寸法t1は、芯線42aの外径部と外部導体の外径部の寸法差δtと略同じ(t1=δt)となっている。
 なお、芯線接続部5aの導体ランド43の厚さ寸法t2と外部導体接続部5bの外部導体ランド44の厚さ寸法t3も、同じ金属箔となっているため同じ(t2=t3)となっている。
 このように、信号線42が接続される回路基板5は、信号線42の芯線42aの外径部と外部導体の外径部の寸法差δtに応じて、シート5cを単数または複数組み合わせて芯線接続部5aに対して中心方向に所定の高さ寸法t1を有した外部導体接続部5bの段差を形成される。
 以上に説明したように撮像ユニット1は、回路基板5に電源線41および複数の信号線42の芯線41a,42aが接続される芯線接続部5aと、この芯線接続部5aに対して外形中心方向に段差を有して、複数の信号線42の外部導体42cが接続される外部導体接続部5bと、を備えた構成となっている。
 そして、撮像ユニット1は、回路基板5において、1つの信号線42が接続される芯線接続部5aの導体ランド43と外部導体接続部5bの外部導体ランド44が回路基板5の長手方向に沿った方向に配置されている。
 これにより、撮像ユニット1は、複数の信号線42を長手方向に沿って直線的に回路基板5に接続することができる。即ち、複数の信号線42は、芯線42aを芯線接続部5aの導体ランド43に接続された状態から略直線状態で外部導体42cを外部導体接続部5bの外部導体ランド44と接続することができる。
 以上のように構成された撮像ユニット1は、従来のようにグランド用ジャンパ線などに複数の信号線42の外部導体42cを絡げることをしなくてよく、GND用の外部導体ランド44に外皮42dを剥いただけの状態で電気的に接続でき、回路基板5を短縮化することができると共に、外部導体42cの結束部がなく外径方向に膨らむことがないため細径化することができる。
 即ち、硬質基板である回路基板5から基端側に延出した外部導体接続部5bは、各信号線42を積層基板5aの所定の位置に引き回すためのスペースを利用しており、デットスペースの有効利用によって、回路基板5の硬質長が延びることなく短縮化することができる。
 以上により、本実施の形態の撮像ユニット1は、内視鏡101の挿入部102の先端部110に内蔵される構成において、小型化することができるため、先端部110も小型となり、挿入部102の細径化にも寄与する構成とすることができる。
 さらに、撮像ユニット1は、回路基板5に段差を設けることで、電源線41および複数の信号線42の芯線41a,42aを導体ランド43に半田付けするときの半田材が表面張力によって、外部導体接続部5b側に流れ難く、複数の信号線42の外部導体42cとの短絡も防止することができ、従来のように挿入部長手方向にスペースをとる必要がないので硬質長を短縮するという利点もある。
(変形例)
 撮像ユニット1は、以下に説明する種々の変形例の構成としてもよい。なお、以下に説明する各種変形例において、それぞれの構成を組み合わせることもできることは勿論である。
(第1の変形例)
 図10は、第1の変形例の撮像ユニットの回路基板の外部導体接続部の構成を示す断面図である。
 図10に示すように、撮像ユニット1は、回路基板5の外部導体接続部5bに複数の信号線42の外部導体42cが接続される外部導体ランド44を設ける部分に外部導体42cの形状に合わせた断面円弧状の凹部5dを形成してもよい。
 このように撮像ユニット1は、回路基板5の外部導体接続部5bに凹部5dを形成して、凹部5d表面に外部導体ランド44を設けることで、信号線42を接続する位置決めが容易となり、外部導体42cの外部導体ランド44への半田付けが容易となり組立性が良くなる。
 なお、ここでの回路基板5は、外部導体接続部5bに電源線41が係合する断面円弧状の凹部5eも形成されている。そのため、電源線41の回路基板5への位置決めも容易となる。
 さらに、凹部5dの深さ寸法を外部導体ランド44、信号線42の誘電体42bおよび外部導体42cのそれぞれの厚さ寸法の合計(和)とすることで、芯線接続部5aに対して外部導体接続部5bの段差を設けなくてもよくなる。
(第2の変形例)
 図11は、第2の変形例の電源線および複数の信号線が接続された回路基板の構成を示す側面図、図12は図11のXII-XII線に沿った撮像ユニットの構成を示す断面図である。
 図11および図12に示すように、撮像ユニット1は、複数の信号線42が回路基板5の外部導体接続部5bの両側面に接続する構成としてもよい。
 具体的には、撮像ユニット1は、回路基板5の芯線接続部5aまたは外部導体接続部5bの両側面に、信号線42の芯線42aまたは外部導体42cが接続される導体ランド43または外部導体ランド44が形成されている。
 そして、ここでの外部導体接続部5bは、芯線接続部5aに対して側面方向にも段差を有した構成となっており、回路基板5の両側面に接続される信号線42を長手方向に沿って直線的に接続することができるようになっている。
 このような構成とした撮像ユニット1は、上述の効果に加え、回路基板5の設計の自由度を向上させることができる。
(第3の変形例)
 図13は、第3の変形例の電源線および複数の信号線が接続された回路基板の構成を示す側面図、図14は図13のXIV-XIV線に沿った撮像ユニットの構成を示す断面図、図15は芯線接続部に外部導体接続部が接合される前の状態を示す側面図である。
 ここでの撮像ユニット1は、図13から図15に示すように、第2の変形例と同様に、複数の信号線42が回路基板5の外部導体接続部5bの両側面に接続する構成となっており、回路基板5の芯線接続部5aに対して外部導体接続部5bが装着自在な別体構成となっている。
 具体的には、回路基板5は、芯線接続部5aが基端面の中央部分から内部に向けて矩形状の凹部5fが形成されており、外部導体接続部5bが先端面の中央部分から芯線接続部5aの凹部5fと相似の矩形状の凸部5gが形成されている。
 このように、回路基板5は、外部導体接続部5bの凸部5gが芯線接続部5aの凹部5fと係合されることで、外部導体接続部5bが芯線接続部5aに装着される。なお、外部導体接続部5bと芯線接続部5aは、接着剤などによって固着される。
 また、芯線接続部5aは、基端面の下部側の両側部分に2つの電気接点45が設けられている。そして、外部導体接続部5bは、先端面の基端面の下部側の両側部分に芯線接続部5aの2つの電気接点45に接触して電気的に接続される2つの電気接点46が設けられている。
 そして、これら接触した電気接点45,46は、フィレット状の半田などによって電気的な接続が確保される。
 なお、これら電気接点45,46は、GND用の導体と電気的に接続され、外部導体接続部5bにおいては外部導体ランド44と内部配線を介して電気的に接続されている。
 このような構成とすることで、撮像ユニット1は、上述の効果に加え、回路基板5において、外部導体接続部5bに予め複数の信号線42が接続されたユニットを組立てた後に、芯線接続部5aに外部導体接続部5bを装着固定することができ、組立性を向上させることができる。
 さらに、回路基板5は、芯線接続部5aと外部導体接続部5bを別体とすることで、一体の構成に比して、ブロック状の積層体からダイシングなどによって小さな外部導体接続部5bを形成する必要が無くなり、製作が容易となる。
(第4の変形例)
 図16は、第4の変形例の複数の信号線が接続された回路基板の構成を示す側面図、図17は図16のXVII-XVII線に沿った撮像ユニットの構成を示す断面図、図18は図16のXVIII-XVIII線に沿った撮像ユニットの構成を示す断面図、図19は金属製の外部導体接続部の構成を示す斜視図である。
 ここでの撮像ユニット1は、図16から図19に示すように、回路基板5の芯線接続部5aに対して金属などの導電体から形成された略板状の外部導体接続部51が装着自在な別体構成となっている。
 具体的には、回路基板5は、芯線接続部5aの両側面に、ここでは片側2つの電気接点49が設けられており、図17に示すように、電気接点49に外部導体接続部51の2つの腕部51a(図19参照)が半田によって電気的に接続されている。
 これら芯線接続部5aに設けられた電気接点49は、内部配線によってGND用の導体と電気的に接続されている。
 また、複数の信号線42は、図18に示すように、外部導体42cが外部導体接続部51の板状部51bの表裏面に直接、半田によって電気的に接続されている。
 なお、外部導体接続部51は、図19に示すように、板状部51bの先端側の両側部から前方に2つの腕部51aが延設された構成となっている。
 このような構成とすることで、撮像ユニット1は、上述の効果に加え、第3の実施の形態と同様に、回路基板5において、外部導体接続部51に予め複数の信号線42が接続されたユニットを組立てた後に、芯線接続部5aに外部導体接続部5bを装着固定することができ、組立性を向上させることができる。
 なお、芯線接続部5aの所望の位置に外部導体接続部51を装着固定すると、上述の図9を用いて説明したように、芯線42aが接続される芯線接続部5aの面と外部導体42cが接続される外部導体接続部5bの面が決められた高さになっている。
 さらに、撮像ユニット1は、回路基板5の外部導体接続部51自体が導電体であるため、信号線42の外部導体42cを電気的に接続するための外部導体ランドを設ける必要がなく、容易に芯線接続部5aとの電気的接続が行える。
(第5の変形例)
 図20は、第5の変形例の複数の信号線が接続された回路基板の構成を示す上面図、図21は複数の信号線が接続された回路基板の構成を示す側面図、図22は図21のXXII-XXII線に沿った撮像ユニットの構成を示す断面図である。
 ここでの撮像ユニット1は、図20から図21に示すように、回路基板5の外部導体接続部5bの表裏面に複数の信号線42の外部導体42cが接続される外部導体ランド44を設ける部分を切り欠き形成または溝形成された段差部5h,5iを有している。
 なお、外部導体接続部5bの裏面に形成された段差部5iは、外部導体接続部5bの断面が凹部状となるように形成されている。
 このように撮像ユニット1は、回路基板5の外部導体接続部5bの表裏面に段差部5h,5iを形成して、これら段差部5h,5iの各表面に外部導体ランド44を設けることで、第1の変形例と同様に、信号線42を接続する位置決めが容易となり、外部導体42cの外部導体ランド44への半田付けが容易となり組立性が良くなる。
 そして、ここでの撮像ユニット1は、第1の変形例のように半円状の凹部5dを形成する構成に比して、外部導体接続部5bの表裏面に段差部5h,5iを容易に形成することができるため加工性が良い構成となっている。
 さらに、ここでも段差部5h,5iの深さ寸法を外部導体ランド44、信号線42の誘電体42bおよび外部導体42cのそれぞれの厚さ寸法の合計(和)とすることで、芯線接続部5aに対して外部導体接続部5bに段差を更に設けなくてもよくなる。
 なお、上述した実施の形態および変形例の撮像ユニット1は、所謂縦置きタイプの撮像素子4を例示したが、例えば、プリズムなどの反射部材を用いて屈折させた撮影光を検出する、所謂横置きタイプの構成にも適用可能である。
 また、上述の内視鏡101は、所謂軟性鏡を例示したが、勿論、外科手術などに用いられる硬性鏡、さらには医療用に限られることなく、工業用内視鏡などのあらゆる撮像ユニット1を備えた電子内視鏡に適用可能な技術である。
 そして、以上の各実施の形態に記載した発明は、それら実施の形態および変形例に限ることなく、その他、実施段階ではその要旨を逸脱しない範囲で種々の変形を実施し得ることが可能である。さらに、上記各実施の形態には、種々の段階の発明が含まれており、開示される複数の構成要件における適宜な組合せにより種々の発明が抽出され得るものである。
 例えば、各実施の形態に示される全構成要件から幾つかの構成要件が削除されても、述べられている課題が解決でき、述べられている効果が得られる場合には、この構成要件が削除された構成が発明として抽出され得るものである。
 本出願は、2014年10月20日に日本国に出願された特願2014-213605号を優先権主張の基礎として出願するものであり、上記の内容は、本願明細書、請求の範囲、および図面に引用されたものである。

Claims (10)

  1.  被写体像を検出する撮像素子と、
     前記撮像素子に電気的に接続した硬質基板と、
     少なくとも1つ以上の同軸線を内蔵する信号ケーブルと、
     を有する固体撮像装置において、
     前記硬質基板は、前記同軸線の芯線が接続される芯線接続部を有する第1の面と、
     前記同軸線の外部導体が接続される外部導体接続部を有し、前記第1の面と略平行な第2の面と、
     を備え、
     前記同軸線が前記硬質基板の前記第1および第2の面に対して略平行に接続されることを特徴とする固体撮像装置。
  2.  前記外部導体接続部を有する第2の面は、前記芯線接続部を有する第1の面に対して外形中心方向に段差を有していることを特徴とする請求項1に記載の固体撮像装置。
  3.  前記段差の高さ寸法は、前記同軸線の前記芯線の外径部と前記外部導体の外径部の寸法差と略同一であることを特徴とする請求項2に記載の固体撮像装置。
  4.  前記第1の面と前記第2の面における前記段差は、シート状基板の積層枚数を変えることによって形成されていることを特徴とする請求項2または請求項3に記載の固体撮像装置。
  5.  前記同軸線の前記芯線の外径部と前記外部導体の外径部の寸法差は、前記シート状基板の略整数倍であることを特徴とする請求項4に記載の固体撮像装置。
  6.  前記同軸線は、前記硬質基板の表裏面または側面に接続されていることを特徴とする請求項1から請求項5のいずれか1項に記載の固体撮像装置。
  7.  前記芯線接続部に装着自在な前記外部導体接続部を有していることを特徴とする請求項1から請求項6のいずれか1項に記載の固体撮像装置。
  8.  前記芯線接続部には、前記同軸線の外部導体の外周部が電気的に接続される外部導体ランドが少なくとも1つ以上配設されていることを特徴とする請求項1から請求項7のいずれか1項に記載の固体撮像装置。
  9.  前記外部導体接続部は、導電体によって形成されていることを特徴とする請求項1から請求項7のいずれか1項に記載の固体撮像装置。
  10.  請求項1から請求項9のいずれか1項に記載の固体撮像装置と、
     前記撮像ユニットが先端部内に内蔵された挿入部と、
     を具備し、
     前記信号ケーブルが前記挿入部の長手方向に略平行に配置されていることを特徴とする電子内視鏡。
PCT/JP2015/073112 2014-10-20 2015-08-18 固体撮像装置およびこの固体撮像装置を備えた電子内視鏡 WO2016063603A1 (ja)

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CN201580011565.2A CN106061365A (zh) 2014-10-20 2015-08-18 固体摄像装置及具有该固体摄像装置的电子内窥镜
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WO2018003510A1 (ja) * 2016-06-29 2018-01-04 オリンパス株式会社 撮像ユニット、および内視鏡
WO2018078766A1 (ja) * 2016-10-27 2018-05-03 オリンパス株式会社 撮像ユニット、内視鏡、および撮像ユニットの製造方法
WO2018158897A1 (ja) * 2017-03-01 2018-09-07 オリンパス株式会社 ケーブル実装構造体および内視鏡
JPWO2018078767A1 (ja) * 2016-10-27 2019-06-24 オリンパス株式会社 内視鏡
JP2019118762A (ja) * 2018-01-11 2019-07-22 オリンパス株式会社 内視鏡の基板ユニット

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EP3103381A1 (en) 2016-12-14
US20160367122A1 (en) 2016-12-22

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