WO2016056106A1 - Feuille de dissipation de chaleur et dispositif thermoélectrique - Google Patents

Feuille de dissipation de chaleur et dispositif thermoélectrique Download PDF

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Publication number
WO2016056106A1
WO2016056106A1 PCT/JP2014/077078 JP2014077078W WO2016056106A1 WO 2016056106 A1 WO2016056106 A1 WO 2016056106A1 JP 2014077078 W JP2014077078 W JP 2014077078W WO 2016056106 A1 WO2016056106 A1 WO 2016056106A1
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Prior art keywords
sheet
heat
heat dissipation
region
thermoelectric device
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PCT/JP2014/077078
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English (en)
Japanese (ja)
Inventor
中川　香苗
鈴木　貴志
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富士通株式会社
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Priority to PCT/JP2014/077078 priority Critical patent/WO2016056106A1/fr
Publication of WO2016056106A1 publication Critical patent/WO2016056106A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipation sheet and a thermoelectric device.
  • thermoelectric element is formed of, for example, a plurality of p-type thermoelectric semiconductors and n-type thermoelectric semiconductors, and has a function of directly converting thermal energy into electrical energy and electrical energy into thermal energy.
  • a temperature difference occurs between both ends of the thermoelectric element, a voltage is generated due to the Seebeck effect.
  • the thermoelectric device (or thermoelectric power generation device) takes out the voltage generated by the thermoelectric element as electric energy. According to the thermoelectric device, heat energy can be directly converted into electric energy, and is attracting attention as an effective method of using heat energy as typified by waste heat utilization.
  • thermoelectric element has, for example, a plurality of two-dimensional thermocouples in which both ends of a columnar p-type thermoelectric semiconductor and an n-type thermoelectric semiconductor are paired substantially in the same length, and the p-type thermoelectric semiconductor and the n-type thermoelectric Semiconductors are alternately and regularly arranged, and thermocouples are electrically connected in series.
  • the wiring for electrically connecting the thermocouple is formed on two substrates formed of, for example, silicon (Si), a ceramic material, or the like.
  • the two substrates have a structure facing each other with an interval corresponding to the thickness of the p-type thermoelectric semiconductor or the n-type thermoelectric semiconductor and the electrodes connecting these thermoelectric semiconductors.
  • thermoelectric semiconductor pair ⁇ One substrate is placed in contact with the heat source, and heat is radiated from the other substrate, thereby generating a temperature difference in the thermoelectric semiconductor pair.
  • heat dissipation component on the heat dissipation side substrate.
  • a heat sink that is generally used as a heat dissipation component is a heat sink in which aluminum (Al) is anodized (anodized) and an aluminum oxide film is formed on the surface.
  • Al aluminum
  • the thermal emissivity of Al is, for example, about 0.03 to 0.1, but the thermal emissivity of aluminum oxide is, for example, about 0.4 to 0.6. Therefore, a heat sink whose surface is anodized is It is often used because of its excellent heat dissipation.
  • the heat sink made of Al is not flexible and difficult to deform according to the shape of the part, when using it as a heat dissipation part for parts with complicated shapes such as large unevenness, install it properly on the part Is difficult.
  • a metal film such as aluminum foil can be deformed according to the shape of the part, but because the film is thin, even if the surface is subjected to anodizing to improve heat dissipation, it is inferior in heat transfer, As a heat sink, sufficient heat dissipation cannot be demonstrated.
  • Carbonaceous materials are used in various structural materials as lightweight heat-resistant materials or high-strength materials.
  • graphite in which carbon atoms are bonded in the form of a hexagonal network has been increasingly used as a heat dissipation material and / or an electrothermal material utilizing high thermal conductivity.
  • sheet-like graphite can easily produce a graphite sheet having a large area, has a high thermal conductivity higher than that of copper (Cu), which has a high thermal conductivity among metals, and is also flexible. Yes.
  • the graphite sheet is used for, for example, a heat conductor, a heat spreader or the like formed of a material for heat transfer.
  • thermoelectric element is possible if there is a temperature difference, but depends on a naturally occurring temperature difference. For example, when the heat source is concrete, metal, or the like that is heated by solar heat, when a thermoelectric element is attached to the heat source, the heat from the heat source can be radiated to the atmosphere to generate power.
  • JP 2011-4500 A Japanese Patent Laid-Open No. 11-209618 JP 2013-190169 A
  • thermoelectric devices it is difficult to ensure a sufficient amount of power generation in an environment where a large temperature difference is unlikely to occur in the heat source according to the weather, time, and the like.
  • an object is to provide a heat dissipation sheet and a thermoelectric device that can secure a sufficient power generation amount even in an environment in which a large temperature difference is unlikely to occur in a heat source according to weather, time, and the like. To do.
  • a heat dissipation sheet having a pattern in which hydrophilic regions and hydrophobic regions are alternately arranged on the surface is provided.
  • thermoelectric element having a heat source side and a heat dissipation side, a heat sink provided on the heat dissipation side of the thermoelectric element, and a heat dissipation sheet in contact with the heat sink, the surface of the heat dissipation sheet is hydrophilic
  • thermoelectric device having a pattern in which conductive regions and hydrophobic regions are alternately arranged.
  • thermoelectric apparatus shows typically an example of a structure of the thermoelectric apparatus in one Example. It is a top view which shows an example of a thermal radiation sheet. It is a top view which shows the other example of a thermal radiation sheet. It is a figure which shows an example of the daily change of the temperature and humidity in a certain city. It is a figure explaining the state which a water
  • thermoelectric apparatus It is sectional drawing explaining the 2nd example of the manufacturing method of the thermal radiation sheet in one Example. It is a figure explaining a silane coupling agent. It is a figure explaining an example of the reaction mechanism of a silane coupling agent. It is a figure explaining an example of the reaction mechanism of a silane coupling agent. It is a figure which shows an example of the electric power generation voltage of a thermoelectric apparatus. It is a figure which shows an example of the electric power generation voltage of a different thermoelectric apparatus about the state without humidification, and the state with humidification. It is a figure which shows an example of the power generation voltage of the thermoelectric apparatus which has a thermal radiation sheet
  • thermoelectric apparatus which has a thermal radiation sheet
  • hydrophilic regions and hydrophobic regions are alternately arranged on the surface of the heat dissipation sheet.
  • FIG. 1 is a cross-sectional view schematically showing an example of the configuration of a thermoelectric device in one embodiment.
  • the thermoelectric device 1 includes a thermoelectric element 11, heat sinks 12-1 and 12-2 provided above and below the thermoelectric element 11, and circuit boards 13-1 and 13 provided on the left and right sides of the thermoelectric element 11. -2, sealing resin 14 for sealing the connection between the thermoelectric element 11 and the circuit boards 13-1, 13-2, resin 15 for sealing the thermoelectric element 11, and heat dissipation provided on the heat source side of the resin 15
  • a sheet 16 is provided.
  • thermoelectric element 11 includes, for example, a plurality of thermocouples having a pair of both ends of a columnar p-type thermoelectric semiconductor 111 and an n-type thermoelectric semiconductor 112 that are substantially the same length, and the p-type thermoelectric semiconductor 111 and n-type.
  • the thermoelectric semiconductors 112 may be arranged alternately and regularly, and may have a known structure in which thermocouples are electrically connected in series. Wirings for electrically connecting the thermocouples are formed on two substrates 113-1, 113-2 made of, for example, silicon (Si), a ceramic material, or the like.
  • the two substrates 113-1 and 113-2 are spaced apart by a thickness corresponding to the thickness of the p-type thermoelectric semiconductor 111 or the n-type thermoelectric semiconductor 111 and electrodes (not shown) connecting these thermoelectric semiconductors 111 and 112. It has a structure that faces each other.
  • the heat sink 12-1 is provided on the heat dissipation side (upper side in FIG. 1) of the thermoelectric element 11.
  • the heat sink 12-2 is provided on the heat source side (lower side in FIG. 1) of the thermoelectric element 11.
  • the heat sinks 12-1 and 12-2 are made of a heat radiating material, and the material is not particularly limited.
  • the heat sinks 12-1 and 12-2 have a structure in which, for example, aluminum (Al) is anodized (anodized) and an aluminum oxide film is formed on the surface.
  • the heat-dissipating material may be, for example, a carbonaceous material in addition to a metal such as Al and Cu.
  • the surface is formed of a material having a heat-dissipating property equivalent to, for example, alumina. An additional film may be provided.
  • the shape of the heat sinks 12-1 and 12-2 is as long as they are arranged on the heat source side (upper side in FIG. 1) of the thermoelectric element 11 and on the heat dissipation side (lower side in FIG. 1) of the thermoelectric element 11.
  • the heat sink 12-1 is a plate-like rectangular member having a step and having an outer peripheral portion partially overlapping with the inner portions of the circuit boards 13-1 and 13-2.
  • the heat sink 12-2 is a plate-like rectangular member whose outer peripheral portion does not overlap with the inner portions of the circuit boards 13-1 and 13-2.
  • the heat sink 12-2 is preferably in contact with a heat source when the thermoelectric device 1 is mounted on a mounting surface described later.
  • the area where the heat sink 12-2 is in contact with the heat source is preferably large.
  • the heat source may be, for example, a metal housing that houses the thermoelectric device 1.
  • the circuit boards 13-1 and 13-2 have circuit components having functions according to the use of the thermoelectric device 1.
  • a semiconductor chip 131 including a sensor such as a temperature sensor, a circuit that processes the output of the sensor, a memory that stores the output of the temperature sensor, and the like is provided on the circuit board 13-2.
  • a secondary battery 133 is provided in addition to a semiconductor chip 132 including a controller, a communication circuit, and the like.
  • the number of circuit boards provided in the thermoelectric device 1 is not limited to two, and may be one or three or more.
  • the sealing resin 14 seals an electrical connection portion between the thermoelectric element 11 and the circuit boards 13-1 and 13-2. As a result, the thermoelectric element 11 is sealed in a space formed by the heat sinks 12-1 and 12-2, the circuit boards 13-1 and 13-2, the sealing resin 14, and the resin 15.
  • the type of resin 15 is not particularly limited.
  • the resin 15 is molded so that the upper cross-sectional shape has a plurality of triangular peaks.
  • the surface area of the upper part (heat source side) of the resin 15 is larger than the surface area of the lower part (heat radiation side) of the resin 15.
  • the cross-sectional shape of the upper portion of the resin 15 is not limited to a triangular shape as shown in FIG. 1 and is not particularly limited as long as it has a shape having a substantially inclined surface.
  • the inclined surface is inclined with respect to a normal to the substrate surfaces of the circuit boards 13-1 and 13-2 (or the bottom surface of the thermoelectric device 1 that comes into contact with the attachment surface when the thermoelectric device 1 is attached to the attachment surface).
  • thermoelectric device 1 when the thermoelectric device 1 is mounted on a mounting surface perpendicular to the direction of gravity, the water droplets that are adsorbed and grown on the heat radiation sheet 16 formed on the inclined surface of the resin 15 are caused by the weight of the water droplets as will be described later. Roll down the slope.
  • the heat radiation sheet 16 is provided on the upper surface on the heat radiation side of the heat sink 12-1 and the upper surface on the heat radiation side of the resin 15.
  • the heat radiating sheets 16 provided on the upper surfaces of the heat sink 12-1 and the resin 15 are provided along the upper surface shapes of the heat sink 12-1 and the resin 15, respectively.
  • the heat-dissipating sheet 16 has a hydrophilic region and a hydrophobic region alternately arranged on a base sheet having heat dissipation and plasticity, such as a graphite sheet, a metal sheet, and a sheet having a multilayer structure in which a graphite sheet and a metal sheet are laminated. A structure in which a patterned pattern is formed. It is preferable that the heat radiating sheet 16 has an appropriate thickness and an appropriate plasticity in that the heat radiating sheet 16 can be easily provided by bonding the heat radiating sheet 16 along the upper surface shape of the heat sink 12-1 and the resin 15.
  • the upper surface of the heat sink 12-1 is not parallel to the mounting surface perpendicular to the direction of gravity but is inclined with respect to the mounting surface, as described later. It is preferable from the viewpoint of making it easy for the water droplet on the sheet 16 to roll off due to its own weight.
  • the upper surface of the heat sink 12-1 may have a shape having a plurality of triangular peaks, for example, like the upper surface of the resin 15.
  • the heat radiation sheet 16 has a surface other than the surface perpendicular to the direction of gravity in a state where the thermoelectric device 1 is attached to the attachment surface from the viewpoint of facilitating the falling of water droplets by its own weight.
  • FIG. 2 is a plan view showing an example of the heat dissipation sheet 16.
  • the heat dissipation sheet 16 has a pattern in which hydrophilic regions 162 and hydrophobic regions 163 are alternately arranged in a striped pattern on the base sheet 161.
  • the hydrophobic region 163 is shown with a satin finish.
  • the direction in which the hydrophilic region 162 and the hydrophobic region 163 extend is preferably, for example, a direction perpendicular to the direction in which the water droplets grown on the heat radiation sheet 16 roll, but the water droplets grown on the heat radiation sheet 16 There is no particular limitation as long as the direction is other than the direction parallel to the rolling direction.
  • FIG. 3 is a plan view showing another example of the heat dissipation sheet 16.
  • the heat dissipation sheet 16 has a pattern in which hydrophilic regions 162 and hydrophobic regions 163 are alternately arranged in a checkered pattern on the base sheet 161.
  • the direction in which the hydrophilic region 162 and the hydrophobic region 163 extend intermittently does not need to have a specific relationship with the direction in which the water droplets grown on the heat dissipation sheet 16 roll, for example.
  • the area occupied by all the hydrophilic regions 162 on the base sheet 161 and the area occupied by all the hydrophobic regions 163 on the base sheet 161 may be the same or different.
  • the pattern in which the hydrophilic regions 162 and the hydrophobic regions 163 are alternately arranged is not limited to a striped pattern and a checkered pattern. As described later, moisture in the air is efficiently removed from the surface of the heat radiation sheet 16. Any pattern may be used as long as it is easy to grow water droplets by condensing in (hydrophilic region 162), and the grown water droplets easily roll off the surface (hydrophobic region 163) of the heat dissipation sheet 16.
  • FIG. 4 is a diagram illustrating an example of a daily change in temperature and humidity in a certain city.
  • the left vertical axis represents temperature (° C.)
  • the right vertical axis represents humidity (%)
  • the horizontal axis represents time (from 1 o'clock to 24 o'clock).
  • the temperature sample is marked with ⁇ and the humidity sample is marked with ⁇ .
  • the temperature is low at night and reaches a minimum temperature around 5 o'clock before dawn, and is high in the daytime and reaches a maximum temperature around 14:00.
  • the humidity is high at night and reaches a maximum humidity around 5 o'clock before dawn, and is low at noon and around 14:00 at noon. Under such environmental conditions where a large temperature difference cannot be expected, it is difficult to secure a sufficient power generation amount even if a heat sink or a material that improves heat dissipation is provided.
  • the moisture 500 in the air easily collects on the hydrophilic region 162 of the heat dissipation sheet 16 in a high humidity environment such as cloudy weather, rainy weather, or nighttime. As shown in FIG. 5, it is condensed and adsorbed onto the hydrophilic region 162.
  • the water droplet 501 that has grown by adsorbing on the hydrophilic region 162 rolls down on the hydrophobic region 163 in the direction of the arrow as shown in FIG. Needless to say, when one water drop 501 rolls in the direction of the arrow in FIG. 6, it contacts with another water drop 501 and grows into a larger water drop 501.
  • FIG. 5 is a diagram illustrating a state in which moisture 500 is adsorbed on the hydrophilic region 162
  • FIG. 6 illustrates a state in which the water droplet 501 grown on the hydrophilic region 162 rolls down on the hydrophobic region 163 with its own weight. It is a figure explaining. 5 and 6, the same parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted.
  • the heat source of concrete or metal is often lower than the ambient temperature, but the surface of the heat dissipation sheet 16 of the thermoelectric device 1 that is in contact with the heat source of concrete or metal, etc.
  • Water vapor condenses and condenses (especially on the hydrophilic region 162). Thereby, the condensation energy of water vapor is released from the surface of the heat dissipation sheet 16, the surface temperature of the heat dissipation sheet 16 rises, and the temperature difference in the thermoelectric element 11 increases, so the power generation amount of the thermoelectric device 1 increases.
  • thermoelectric device 1 Eventually, the water 500 grows and the water droplets 501 roll on the hydrophobic region 163 of the heat dissipation sheet 16, but dew condensation occurs again on the hydrophilic region 162 of the heat dissipation sheet 16, increasing the power generation amount of the thermoelectric device 1. .
  • thermoelectric device 1 By repeating such a cycle of condensation and adsorption (or condensation) of moisture on the surface of the heat radiation sheet 16 and growth of water into water droplets, a hydrophilic region 162 and a hydrophobic region are formed on the surface of the heat radiation sheet 16. Compared with the case where 163 is not alternately arranged, the power generation amount of the thermoelectric device 1 can be increased.
  • a method for manufacturing a heat dissipation sheet in one embodiment will be described.
  • a base sheet 161 of the heat dissipation sheet 16 is formed, for example, as in a first method described below with reference to FIG.
  • aluminum oxide may be used as the heat dissipating material
  • heat dissipating paint may be used as the heat dissipating material of the base sheet 161 of the heat dissipating sheet 16 as in the second method described later with reference to FIG.
  • a mask 601 masks a portion where the surface is formed of, for example, aluminum oxide and becomes a hydrophilic region 162 on the hydrophilic base sheet 161. Then, the hydrophobic material 602 is applied to the portion to become the hydrophobic region 163 and cured.
  • the hydrophobic material 602 is, for example, polytetrafluoroethylene (PTFE: PolyTetraFluoroEthylene), polyvinylidene fluoride (PVDF), polypropylene (PP: PolyPropylene), polyethylene (PE: PolyEthylene), polysulfone (PSF: PolySulFone), and the like.
  • step S12 as shown in FIG. 7B, a portion that becomes the hydrophilic region 162 on the base sheet 161 is masked with, for example, a resist film 603, and an aqueous solution 604 of the coupling agent hydrolyzed is used. It applies to the location of the hydrophobic material 602 used as the hydrophobic area
  • step S13 as shown in FIG. 7C, the resist film 603 is removed.
  • a silane coupling agent having a hydrophobic organic functional group may be used in the aqueous solution of the coupling agent.
  • the hydrophobic organic functional group may be, for example, a coupling agent having a vinyl group or a phenyl group, a coupling agent having a large number of carbon atoms, or the like.
  • the mask 601 used for masking in step S11 and the resist film 603 used for masking in step S12 may be the same mask or resist film.
  • a heat radiation sheet 16 in which a heat radiation paint 700 is applied to the surface of the base sheet 161 is used.
  • the heat radiation paint 700 includes a binder 701 and ceramic particles 702.
  • the resin used for the binder 701 is a hydrophobic resin such as polyester or acrylic.
  • the ceramic particle 702 has a hydrophilic surface because OH groups are generated on the exposed surface.
  • O 2 plasma etching, laser etching (or laser ablation), UV, or the like is formed on the portion that becomes the hydrophilic region 162 on the heat radiation paint 700 through the mask 607.
  • Reactive etching such as exposure to ozone is performed, and a functional group such as a hydrophilic hydroxyl group or a carboxyl group is imparted to the surface of the binder 701 subjected to the reactive etching.
  • step S22 the portion that becomes the hydrophilic region 162 on the heat radiation coating 700 is etched to expose the ceramic particles 702 in the region 703 etched into a concave shape as shown in FIG. 8B. Let Thereby, the region 703 where the ceramic particles 702 are exposed becomes hydrophilic.
  • the etching in step S22 may be, for example, polishing with polishing paper or the like, physical etching using sandblasting, water, laser, or the like.
  • step S22 may be omitted by continuing the reactive etching in step S21 for a longer time, and the ceramic particles 702 in the region 703 may be exposed.
  • the surface of the ceramic particle 702 exposed in the region 703 is hydrophilic, and a hydrophilic functional group is imparted to the surface of the binder 701 in the region 703 as in the case of step S21 described above. Is done.
  • step S23 as shown in a partially enlarged view in FIG. 8C, the binder 701 and the exposed ceramic particles 702 in the region 703 subjected to the processing in step S21 or steps S21 and S22 are removed.
  • the containing surface is modified with a silane coupling agent having a hydrophilic organic functional group.
  • the hydrophilic organic functional group may be a functional group having, for example, an amino group, a mercapto group, a carboxyl group, or the like.
  • FIG. 9 is a diagram illustrating a silane coupling agent, where Y represents a reactive functional group containing a hydrophilic functional group such as NH or SH, and OR represents a hydrolyzable group.
  • 10 and 11 are diagrams for explaining an example of the reaction mechanism of the silane coupling agent.
  • FIG. 11 shows a reaction mechanism in which a covalent bond is generated by dehydration from an orientation state due to a hydrogen bond.
  • step S24 contrary to the case of FIG. 7B, the portion (that is, the region 703) that becomes the hydrophobic region 163 on the heat radiation paint 700 is masked by, for example, a resist film (not shown), and then hydrolyzed.
  • the aqueous solution of the coupling agent thus applied is applied to the portion that becomes the hydrophilic region 162 and dried.
  • step S25 the resist film is removed as in the case of FIG.
  • the region 703 on the heat dissipating paint 700 becomes a hydrophilic region 162, and the region other than the region 703 on the heat dissipating paint 700 becomes a hydrophobic region 163.
  • the hydrophilic region 162 of the heat dissipation sheet 16 has a concave shape that is recessed from the hydrophobic region 163. For this reason, it becomes easier to store more water in the hydrophilic region 162 by the depth of the concave shape.
  • the film thickness of the heat radiation paint 700 is, for example, several tens of ⁇ m or less
  • the etching depth of the region 703 is preferably in the range of several ⁇ m to several tens of ⁇ m, for example.
  • the surface of the heat-dissipating paint 700 in the region 703 is uneven by etching, so that the wettability is improved by the surface shape in the region 703. .
  • thermoelectric device 1 As shown in FIG. 1 having the heat radiation sheet 16 in which the hydrophilic region 162 and the hydrophobic region 163 are formed in stripes as shown in FIG. 2 by the second method will be described. .
  • the power generation performance was evaluated by attaching the thermoelectric device 1 on a heater in a case with good airtightness and changing the humidity with a humidifier provided in the case.
  • FIG. 12 is a diagram illustrating an example of the generated voltage of the thermoelectric device 1.
  • the vertical axis indicates the generated voltage Vot (V) of the thermoelectric device 1
  • the horizontal axis indicates time (minutes).
  • the generated voltage Vot was measured for 25 minutes from the start of measurement while the humidifier in the casing was off.
  • the power generation voltage Vot was measured with the humidifier in the housing turned on.
  • the generation voltage Vot increases by repeating the cycle of condensation and adsorption (or condensation) of moisture on the surface of the heat radiation sheet 16 and growth of moisture into water droplets. I was able to confirm.
  • FIG. 13 shows a thermoelectric device 1A having a heat dissipation sheet 16 that does not include a hydrophilic region 162 and a hydrophobic region 163, and the hydrophilic region 162 manufactured without performing the coupling process of steps S23 to S25 in the second method.
  • thermoelectric device 1B having the heat dissipation sheet 16 including the hydrophobic region 163, and the heat dissipation sheet 16 including the hydrophilic region 162 and the hydrophobic region 163 manufactured by the second method including the coupling process of steps S23 to S25.
  • FIG. 13 shows a thermoelectric device 1A having a heat dissipation sheet 16 that does not include a hydrophilic region 162 and a hydrophobic region 163, and the hydrophilic region 162 manufactured without performing the coupling process of steps S23 to S25
  • the vertical axis indicates the generated voltage Vot (V) of the thermoelectric devices 1A to 1C, and the horizontal axis indicates time (minutes).
  • ⁇ indicates the thermoelectric device 1A
  • ⁇ indicates the thermoelectric device 1B
  • ⁇ indicates the generated voltage Vot of the thermoelectric device 1C.
  • FIG. 14 is a diagram illustrating an example of the power generation voltage of the thermoelectric device 1A having the heat dissipation sheet 16 that does not include the hydrophilic region 162 and the hydrophobic region 163.
  • FIG. 15 is a diagram illustrating an example of the power generation voltage of the thermoelectric device 1 ⁇ / b> C having the heat radiation sheet 16 including the hydrophilic region 162 and the hydrophobic region 163.
  • the vertical axis indicates the generated voltage Vot (V) of the thermoelectric devices 1A and 1C
  • the horizontal axis indicates time (minutes).
  • the thermoelectric device 1A as can be seen from, for example, the changing portion X1 in FIG.
  • thermoelectric device 1C As can be seen from the change portion X2 in FIG. 16, for example, the time change of the generated voltage Vot is not greatly affected by the temperature fluctuation of the heater in the housing, and the moisture on the surface of the heat radiation sheet 16 It was confirmed that the temperature difference in the thermoelectric element 11 was increased and the power generation voltage Vot was increased by repeating the cycle of condensation and adsorption (or dew condensation) and growth of water into water droplets.
  • Example 1 PELCOOL H-7020 made by Pelcourt Co., Ltd., in which highly heat-dissipating ceramic particles were mixed in acrylic resin, was used as the heat dissipating paint.
  • the heat-dissipating paint was applied to one surface of an aluminum sheet having a thickness of 0.1 mm by spray coating, and dried in an oven at 120 ° C. for 20 minutes.
  • the film thickness of the heat-dissipating paint after drying was 20 ⁇ m.
  • a metal mask having 0.5 mm slits formed at a pitch of 2 mm was brought into close contact with the surface of the heat dissipating paint, and the resin surface was etched by reactive ion etching using O 2 plasma.
  • the etching depth averaged 0.1 ⁇ m.
  • thermoelectric device as shown in FIG. 1 in which a thermoelectric element, a circuit board and the like were molded with resin.
  • the heat radiating sheet was bonded to the surface of the molded resin so that the heat radiating paint side of the heat radiating sheet was exposed.
  • the thermoelectric device has a structure in which the heat dissipation sheet is thermally connected to the thermoelectric element.
  • thermoelectric device formed as described above was installed in an outdoor installation type device having a metal casing, and power was generated using the casing as a heat source.
  • the thermoelectric device In the daytime, the thermoelectric device generates electricity due to the temperature difference between the casing temperature and the ambient air temperature due to the temperature rise of the casing due to sunlight.
  • the casing temperature At night, the casing temperature is lower than the ambient temperature, and power is generated due to the temperature difference between the casing temperature and the ambient ambient temperature.
  • the difference is smaller than the daytime temperature difference, and the amount of power generation is also small.
  • the humidity is higher than in the daytime, and depending on the season and weather, there are many days when the humidity is 80% or more.
  • thermoelectric device If the surface of the thermoelectric device becomes lower than the atmospheric temperature and there is a certain amount of humidity, condensation starts in the hydrophilic region of the heat dissipation sheet. At the time of dew condensation, the heat of condensation is radiated to the surface of the heat transfer device, and this heat dissipation increases the temperature difference in the thermoelectric element, thereby increasing the amount of power generated by the thermoelectric device.
  • the water droplets become large and come into contact with the hydrophobic region of the heat radiating sheet, the water droplets roll down from the hydrophobic region and new condensation starts on the surface of the heat radiating sheet, so that the increased power generation amount is maintained.
  • a metal mask with 0.5 mm slits formed at a pitch of 2 mm is brought into close contact with the surface of the heat dissipating paint, and the resin portion is etched by reactive ion etching using CF 4 and H 2 as etching gases. Ceramic particles were exposed. The etching depth was 3 ⁇ m on average.
  • thermoelectric device as shown in FIG. 1 in which a thermoelectric element, a circuit board and the like were molded with resin.
  • the heat radiating sheet was bonded to the surface of the molded resin so that the heat radiating paint side of the heat radiating sheet was exposed.
  • the thermoelectric device has a structure in which the heat dissipation sheet is thermally connected to the thermoelectric element.
  • thermoelectric device formed as described above was installed in an outdoor installation type device having a metal casing, and power was generated using the casing as a heat source.
  • the thermoelectric device In the daytime, the thermoelectric device generates electricity due to the temperature difference between the casing temperature and the ambient air temperature due to the temperature rise of the casing due to sunlight.
  • the casing temperature At night, the casing temperature is lower than the ambient temperature, and power is generated due to the temperature difference between the casing temperature and the ambient ambient temperature.
  • the difference is smaller than the daytime temperature difference, and the amount of power generation is also small.
  • the humidity is higher than in the daytime, and depending on the season and weather, there are many days when the humidity is 80% or more.
  • thermoelectric device If the surface of the thermoelectric device becomes lower than the atmospheric temperature and there is a certain amount of humidity, condensation starts in the hydrophilic region of the heat dissipation sheet. At the time of dew condensation, the heat of condensation is radiated to the surface of the heat transfer device, and this heat dissipation increases the temperature difference in the thermoelectric element, thereby increasing the amount of power generated by the thermoelectric device.
  • the water droplets become large and come into contact with the hydrophobic region of the heat radiating sheet, the water droplets roll down from the hydrophobic region and new condensation starts on the surface of the heat radiating sheet, so that the increased power generation amount is maintained.
  • thermoelectric device increased by about 5% to about 10% when the humidity was 80% compared to the amount of electricity generated when no hydrophilic area was formed on the heat-dissipating sheet.
  • This heat radiating paint was applied to one surface of a graphite sheet having a thickness of 0.1 mm by spray coating, and was naturally dried at 25 ° C. for 8 hours.
  • the film thickness of the heat-dissipating paint after drying was 20 ⁇ m.
  • a metal mask having 0.5 mm slits formed at a pitch of 2 mm was brought into close contact with the heat radiation paint surface, and the resin portion was etched by reactive ion etching using CF 4 and H 2 as etching gases. Ceramic particles were exposed. Etching conditions were the same as those in Example 1 above.
  • thermoelectric device as shown in FIG. 1 in which a thermoelectric element, a circuit board and the like were molded with resin.
  • thermoelectric device After the thermoelectric device was formed, it was immersed in a 1% aqueous solution of a silane coupling agent having an amino group as a reactive group, for example, KBE-903 or KBM-603 manufactured by Shin-Etsu Silicone, and dried in an oven at 100 ° C. for 30 minutes. Thereby, the hydrophilic amino group was formed on the exposed filler surface, and the etched surface became a more hydrophilic surface. Even if the silane coupling agent has a mercapto group, a carboxy group or the like as a reactive group, the same effect was obtained.
  • a silane coupling agent having an amino group as a reactive group for example, KBE-903 or KBM-603 manufactured by Shin-Etsu Silicone
  • Example 4 As a heat dissipating paint, UNIQOOL manufactured by Godo Ink Co., Ltd. mixed with epoxy resin high heat dissipating ceramic particles was used. This heat-dissipating paint was coated on one surface of a 0.1 mm thick copper sheet by spray coating and dried in an oven at 100 ° C. for 10 minutes. The film thickness of the heat-dissipating paint after drying was 20 ⁇ m. An etching pattern of 0.5 mm ⁇ 0.5 mm was formed on the surface of the heat radiation paint with a 2 mm pitch by a CO 2 laser. The etching depth was 3 ⁇ m to 5 ⁇ m.
  • thermoelectric device as shown in FIG. 1 in which a thermoelectric element, a circuit board and the like were molded with resin.
  • thermoelectric device After the thermoelectric device was formed, it was immersed in a 1% aqueous solution of a silane coupling agent having an amino group as a reactive group, for example, KBE-903 or KBM-603 manufactured by Shin-Etsu Silicone, and dried in an oven at 100 ° C. for 30 minutes. Thereby, the hydrophilic amino group was formed on the exposed filler surface, and the etched surface became a more hydrophilic surface. Even if the silane coupling agent has a mercapto group or a carboxyl group as a reactive group, the same effect was obtained.
  • a silane coupling agent having an amino group as a reactive group for example, KBE-903 or KBM-603 manufactured by Shin-Etsu Silicone
  • a silane coupling agent having an amino group as a reactive group which is made of aluminum having an aluminum oxide film on its surface, a film mask having 0.5 mm slits formed at a pitch of 2 mm on the fin surface of a heat sink having fins,
  • a 1% aqueous solution of KBE-903 or KBM-603 manufactured by Shin-Etsu Silicone was sprayed or immersed in the aqueous solution, and dried in an oven at 100 ° C. for 30 minutes.
  • the hydrophilic amino group was formed on the exposed filler surface, and the etched surface became a more hydrophilic surface. Even if the silane coupling agent has a mercapto group or a carboxyl group as a reactive group, the same effect was obtained.
  • the amount of power generation at night obtained was increased by about 5% when the humidity was 80% compared to the amount of power generated when no hydrophilic region was formed on the heat dissipation sheet.
  • thermoelectric device using a heat-dissipating sheet having a pattern in which hydrophilic regions and hydrophobic regions are alternately arranged on the surface should be used in places where the humidity is high, for example, 80% or more, such as in a sewer pipe.
  • the humidity is high, for example, 80% or more, such as in a sewer pipe.
  • a thermoelectric device that uses a heat-dissipating sheet having a pattern in which hydrophilic and hydrophobic regions are alternately arranged on the surface is sufficient even in an environment where a large temperature difference is unlikely to occur in the heat source depending on the weather, time, etc. Therefore, it is not necessary that the humidity be 80% or higher. For example, in an environment having a certain level of humidity of 20% or higher, an effect of improving the power generation can be obtained.
  • FIG. 16 is a block diagram schematically illustrating an example of the configuration of an integrated module.
  • the integrated module 60 includes a power generation module 61, a power storage module 62, a sensor 63, a controller 64, a memory 65, a communication circuit 66, and an antenna 67.
  • the power generation module 61 is formed by, for example, the thermoelectric device 1 shown in FIG.
  • the power storage module 62 is connected to the power generation module 61 and stores power generated by the power generation module 61.
  • the power storage module 62 is not particularly limited as long as it has a function of storing electric power, and is formed of, for example, the secondary battery 133 shown in FIG.
  • the power generation module 61 and the power storage module 62 form a power supply unit 68. Power is supplied to the sensor 63, the controller 64, and the communication circuit 66 from at least one of the power generation module 61 and the power storage module 62 that form the power supply unit 68. If stable power can be supplied by the power generation module 61, the power storage module 62 can be omitted.
  • the sensor 63 can be formed by, for example, a sensor that detects temperature, humidity, pressure, light, sound, electromagnetic waves, acceleration, vibration, gas, fine particles, and the like, and may be included in the semiconductor chip 131 shown in FIG. 1, for example. . Furthermore, the sensor 63 includes, for example, a distance measuring sensor that measures the distance to the object by emitting infrared rays to the object and receives light reflected from the object, a weight sensor that measures the weight of the object, and You may form with the water level sensor which detects data, such as a water level.
  • the controller 64 transmits various data detected by the sensor 63 to the server 75 shown in FIG. 17 via the communication circuit 66 and the antenna 67, for example.
  • the controller 64 may transmit secondary data based on various data detected by the sensor 63 and other data to the server 75.
  • the controller 64 may calculate secondary data by performing predetermined calculations using various data detected by the sensor 63, for example, and may transmit the secondary data to the server 75.
  • the controller 64 and the communication circuit 66 may be included in the semiconductor chip 132 shown in FIG.
  • the memory 65 stores various data detected by the sensor 63 and the calculated secondary data according to a command from the controller 64.
  • the stored information is read by an instruction from the controller 64.
  • the memory 65 may be included in the semiconductor chip 131 shown in FIG.
  • the communication circuit 66 and the antenna 67 form a communication unit 69.
  • the communication unit 69 transmits and receives data between the controller 64 and the server 75.
  • the communication unit 69 employs wireless communication, but wired communication may be employed instead of wireless communication.
  • the antenna 67 can be omitted.
  • a signal line is connected to the communication circuit 66.
  • the communication unit 69 may be included in, for example, the semiconductor chip 132 illustrated in FIG. In this case, the antenna 67 may be externally connected to the semiconductor chip 132.
  • the integrated module 60 may be applied to, for example, the processing system 70 shown in FIG.
  • FIG. 17 is a diagram illustrating an example of a processing system 70 to which the integrated module 60 is applied.
  • the processing system 70 includes a plurality of integrated modules 60 and a server 75.
  • the plurality of integrated modules 60 are installed in the manhole 76, for example.
  • the plurality of integrated modules 60 installed in the plurality of manholes 76 are connected to the server 75 via a network (in this example, a wireless network) 77.
  • the integrated module 60 may be installed anywhere as long as it is a manhole 76 structure.
  • the integrated module 60 is fixed to a lid 78, a concrete pipe 79, or the like, which is a structure of the manhole 76, according to the detection target of the sensor 63 or the type of the sensor 63.
  • the power generation module 61 provided in the integrated module 60 is thermally connected to a structure of a manhole 76 that is an example of an installation target, and is caused by a temperature difference between the structure of the manhole 76 and the outside air or the temperature inside the manhole 76. Generate electricity.
  • FIG. 18 is a diagram illustrating a first application example of the processing system 70.
  • the processing system 70 is used to grasp the deterioration of the structure (the lid 78 and the concrete pipe 79) of the manhole 76.
  • the sensor 63 detects the temperature and humidity in the manhole 76, vibration (or acceleration) acting on the structure of the manhole 76, and the data detected by the sensor 63 is stored in the memory 65.
  • the controller 64 transmits the data stored in the memory 65 via the communication circuit 66 and the antenna 67.
  • the server 75 provided in the measurement vehicle 80 collects data.
  • the server 75 combines the positional information of the vehicle 80 by GPS (Global Positioning System) and the collected data, and displays the collected data on a map displayed on, for example, an in-vehicle monitor (not shown). Thereby, the degree of deterioration of the concrete pipe 79 of each manhole 76 can be estimated from information displaying temperature, humidity, vibration, and the like.
  • GPS Global Positioning System
  • a camera 82 that acquires an image of the lid 78 of the manhole 76 is attached to the lower part of the measurement vehicle 80, and deterioration of the lid 78 of the manhole 76 is determined by image recognition. Based on this result, the local government may be notified of the replacement time of the lid 78 of the manhole 76.
  • the measurement vehicle 80 may not be a special vehicle, but may be, for example, a garbage truck operated by a local government.
  • the sensor 63 may detect the concentration of the gas generated in the manhole 76.
  • the gas generated in the manhole 76 include hydrogen sulfide gas. It is known that hydrogen sulfide gas generated in the sewer 83 abruptly deteriorates the structure of the manhole 76. The generation of hydrogen sulfide gas is also a cause of complaints for neighboring residents. By using a hydrogen sulfide gas sensor as the sensor 63, the accuracy of deterioration prediction of the structure of the manhole 76 can be improved, and complaints from residents can be quickly handled.
  • the sensor 63 may detect at least one of the temperature, humidity, vibration in the manhole 76, and the concentration of the gas generated in the manhole 76.
  • the humidity in the manhole 76 is always high, and the water in the sewer 83 (or water supply) overflows in the manhole 76.
  • the inside of the manhole 76 has a substantially constant temperature.
  • the lid 78 is hot in summer and low in winter, and hydrogen sulfide gas that dissolves various metals including the metal forming the lid 78 is generated. It has been.
  • the electronic components such as the sensor 63 and the power generation module 61 are sealed with the resin 15 as shown in FIG. 1, for example, so that long-term reliability can be maintained.
  • FIG. 19 is a diagram illustrating a second application example of the processing system 70.
  • the processing system 70 is used to predict the flow rate of the sewer 83 connected to the manhole 76.
  • the sensor 63 for example, a water level meter, a flow meter or the like is used. By installing a sensor 63 such as a water level meter or a flow meter in the manhole 76, the flow rate of the sewer 83 can be grasped in detail.
  • the sensor 63 is incorporated in the integrated module 60, but a sensor control unit (not shown) for controlling the operation of an external sensor may be provided instead of the sensor 63, for example.
  • the sensor control unit may control sensors (not shown) such as a water level meter and a flow meter arranged in the sewer 83 and acquire information detected by these sensors. Information detected by these sensors may be transmitted to the sensor control unit wirelessly.
  • the flow rate of the sewer 83 is detected by the sensor 63 once a day or once an hour and is collected in the server 75 of the data center 84 through a high-speed communication line.
  • the flow rate data of the sewer 83 detected by the sensor 63 may be transmitted simultaneously with the measurement, or may be transmitted after accumulating for one day or one week in order to reduce power consumption.
  • the measurement vehicle may collect the flow rate data.
  • the relationship between the meteorological phenomenon and the flow rate of the sewer 83 can be established from the analysis result of the flow rate data of the sewer 83 and the rainfall data of the Japan Meteorological Agency. Then, prediction data may be provided or distributed by predicting the flow rate of the sewer 83 in each place from the rainfall data of the Japan Meteorological Agency. Since the flow rate of the sewer 83 varies from year to year in accordance with the residential building, living conditions, and land development conditions, the processing system 70 that can continuously update data is useful.
  • the processing system 70 can also be used for measuring the flow rate of the sewer 83 when local heavy rain occurs.
  • a local heavy rain in the city it is necessary to measure the water level of the sewer 83 and transmit information in minutes in order to ensure the safety of workers of the sewer 83 and prevent the sewer 83 from overflowing.
  • data is collected only for the integrated module 60 installed in a small number of manholes 76 having a relatively low altitude.
  • FIG. 20 is a diagram for explaining a third application example of the processing system 70.
  • the processing system 70 is used for manhole 76 security and work history.
  • the sensor 63 detects opening / closing of the lid 78 of the manhole 76.
  • the sensor 63 for example, an acceleration sensor, an open / close switch, or the like is used.
  • the sensor 63 may detect at least one of acceleration generated in the lid 78 of the manhole 76 and an open / closed state of the lid 78 of the manhole 76 in order to detect opening and closing of the lid 78 of the manhole 76.
  • Data output from the sensor 63 in response to opening / closing of the lid 78 of the manhole 76 is received by the server 75.
  • FIG. 21 is a diagram illustrating a fourth application example of the processing system 70.
  • the processing system 70 is used for acquiring road traffic information.
  • the sensor 63 detects the vehicles 85, 86, and 87 that pass on the manhole 76.
  • an acceleration sensor, a magnetic sensor, a microphone, or the like is used for this sensor 63.
  • a signal corresponding to the number of vehicles passing over the manhole 76 is obtained from the sensor 63.
  • Data output from the sensor 63 is received by the server 75.
  • this processing system 70 it is possible to obtain traffic jam information even on narrow roads and alleys that are not measured by the current road traffic information communication system. This makes it possible to provide detailed traffic information.
  • the type of the vehicles 85, 86, 87 passing through the manhole 76 may be detected from the strength of the detection value of the sensor 63.
  • a data set in which the detection value of the sensor 63 is associated with the type of vehicle is stored in the memory 65 in advance. From the controller 64, information on the vehicle type determined from the detection value of the sensor 63 and the data set is transmitted to the server 75. Thereby, the kind of vehicle which passes on the manhole 76 can be grasped
  • the individual identification information of the vehicles 85, 86 and 87 passing over the manhole 76 may be detected by the sensor 63.
  • the characteristics of the vehicle may be obtained by the reaction of the magnetic sensor. That is, for example, each vehicle can be identified by mounting on the vehicle a medium that generates a characteristic magnetism for each vehicle. Analyzing the difference in the flow of cars in the city depending on the type of car leads to urban road control and evaluation, such as planning to guide a specific vehicle to a specific road.
  • FIG. 22 is a diagram for explaining a fifth application example of the processing system 70.
  • the processing system 70 is used for measuring rainfall.
  • an X-band radar for weather prediction is used for the sensor 63.
  • the radio wave of the X-band radar does not reach the tip of the heavy rain area, for example, during heavy rain, and cannot exceed a large object such as a mountain. Also, with current radars, it is often difficult to find and track heavy rain areas that suddenly occur or develop rapidly. High-precision prediction requires high temporal and spatial resolution.
  • the resolution of the X-band radar is, for example, 250 m.
  • the sensor 63 in the manhole 76 with an average interval of about 30 m, finer weather observation is possible, and measurement of local heavy rain and the like It seems to be useful for prediction.
  • Data output from the sensor 63 is received by the server 75.
  • the dedicated server 75 is used.
  • a general-purpose computer may be used as the server 75.
  • a program for executing the operations performed by the controller 64 and the server 75 may be installed and executed in a general-purpose computer that functions as the server 75.
  • the program may be supplied on a recording medium or downloaded from a network.
  • the first to fifth application examples may be appropriately combined and implemented.
  • thermoelectric device of an indication were demonstrated by the Example, this invention is not limited to the said Example, It cannot be overemphasized that various deformation

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Abstract

　La présente invention concerne une feuille de dissipation de chaleur qui présente sur sa surface un motif dans lequel des régions hydrophiles et des régions hydrophobes sont disposées en alternance.
PCT/JP2014/077078 2014-10-09 2014-10-09 Feuille de dissipation de chaleur et dispositif thermoélectrique WO2016056106A1 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021093474A (ja) * 2019-12-12 2021-06-17 いすゞ自動車株式会社 発電装置
WO2021152848A1 (fr) * 2020-01-31 2021-08-05 株式会社Ｎｊｓ Dispositif de mesure, système de mesure, procédé et programme
JP2022027685A (ja) * 2020-07-29 2022-02-14 株式会社新日本コンサルタント マンホールポンプの監視システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011208937A (ja) * 2011-06-30 2011-10-20 Mitsubishi Electric Corp 空気調和機及びコーティング組成物
JP2013048581A (ja) * 2011-08-31 2013-03-14 Fujitsu Ltd 鼻輪
JP2013190169A (ja) * 2012-03-14 2013-09-26 Sharp Corp 熱交換器
JP2014180217A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 発電機能を備えた電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011208937A (ja) * 2011-06-30 2011-10-20 Mitsubishi Electric Corp 空気調和機及びコーティング組成物
JP2013048581A (ja) * 2011-08-31 2013-03-14 Fujitsu Ltd 鼻輪
JP2013190169A (ja) * 2012-03-14 2013-09-26 Sharp Corp 熱交換器
JP2014180217A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 発電機能を備えた電子装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021093474A (ja) * 2019-12-12 2021-06-17 いすゞ自動車株式会社 発電装置
WO2021152848A1 (fr) * 2020-01-31 2021-08-05 株式会社Ｎｊｓ Dispositif de mesure, système de mesure, procédé et programme
JP2022027685A (ja) * 2020-07-29 2022-02-14 株式会社新日本コンサルタント マンホールポンプの監視システム
JP7344935B2 (ja) 2020-07-29 2023-09-14 ＮｉＸＪＡＰＡＮ株式会社 マンホールポンプの監視システム

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