WO2016047128A1 - 電子部品およびその製造方法 - Google Patents

電子部品およびその製造方法 Download PDF

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Publication number
WO2016047128A1
WO2016047128A1 PCT/JP2015/004801 JP2015004801W WO2016047128A1 WO 2016047128 A1 WO2016047128 A1 WO 2016047128A1 JP 2015004801 W JP2015004801 W JP 2015004801W WO 2016047128 A1 WO2016047128 A1 WO 2016047128A1
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WO
WIPO (PCT)
Prior art keywords
lead
terminal
capacitor
terminals
pedestal
Prior art date
Application number
PCT/JP2015/004801
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English (en)
French (fr)
Japanese (ja)
Inventor
克彦 河野
Original Assignee
日本ケミコン株式会社
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Publication date
Application filed by 日本ケミコン株式会社 filed Critical 日本ケミコン株式会社
Priority to CN201580050571.9A priority Critical patent/CN106716576B/zh
Publication of WO2016047128A1 publication Critical patent/WO2016047128A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/74—Terminals, e.g. extensions of current collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Definitions

  • the technology of the present disclosure relates to a terminal technology for surface mounting of electronic components such as an electrolytic capacitor, an electric double layer capacitor, a lithium battery, and a coil.
  • the movable device is equipped with a vibration source that continuously vibrates, such as an engine or a motor.
  • a vibration source that continuously vibrates, such as an engine or a motor.
  • a chip-type capacitor is provided with an insulating plate together with the capacitor body, and the lead terminals protruding from the capacitor body are inserted into the lead terminal insertion holes of the insulating plate and bent at the seating surface side of the insulating plate.
  • Surface mount terminals are formed.
  • the insulating plate is fixed to the capacitor body by the lead terminals. That is, the fixing strength of the insulating plate depends on the bending strength of the lead terminal.
  • the capacitor body and the insulating plate may swing separately or cause vibration resonance. is there. If the weight of the capacitor body and the insulating plate are different, such oscillation and vibration resonance become significant. When the lead terminal is exposed to such oscillation or vibration resonance, excessive vibration stress is concentrated at the bent portion. As a result, there is a problem that the lead terminal is broken due to the aforementioned metal fatigue or the like.
  • ⁇ Capacitor product size varies greatly depending on the application and capacity. If the weight of the capacitor body increases, the vibration stress on the bent part of the lead terminal increases. If excessive vibration stress exceeding the allowable range continuously acts on the bent portion of the lead terminal, the lead terminal will be broken.
  • Such a problem is not limited to the electrolytic capacitor, but is the same as long as it is an electronic component having a lead terminal.
  • the technology of the present disclosure is to improve the vibration resistance of electronic components including surface mount terminals such as electrolytic capacitors, electric double layer capacitors, lithium batteries, and coils.
  • the electronic component of the present disclosure it is only necessary to include a component main body with the lead terminal protruding outward, an external terminal, and a pedestal portion.
  • the external terminal is connected to the lead terminal on the outside of the component main body, covers the connection portion, and a pedestal portion that is fixed to at least a part of the lead main portion of the component main body is molded.
  • the component main body may be provided with a resin case portion or a resin coating case portion, and the pedestal portion may be molded into the resin case portion or the resin coating case portion.
  • an insulating sheet may be further provided between the component main body and the external terminal.
  • connection portion may include a lead terminal fitting portion in which the lead terminal and the external terminal are fitted.
  • the component main body may include a caulking concave portion on a side surface of the case, and the pedestal portion may be installed in a part or all of the caulking concave portion.
  • the external terminals may be arranged on the seating surface of the pedestal portion in an orthogonal direction, a parallel direction, a Y-shaped direction, or a T-shaped direction.
  • the external terminal may include a surface-mounting connection terminal portion that has a bent portion in the pedestal portion and is exposed to the seat surface side of the pedestal portion.
  • the lead terminal Since the lead terminal and external terminal are connected on the outside of the component body, the lead terminal has no bent part, and there is no mechanical weak part of the lead terminal by the bent part. Since there are no bent portions, concentration of vibration stress on the bent portions can be avoided, and the vibration resistance of the lead terminals can be improved.
  • the vibration resistance of the electronic component can be improved by integration with the component body.
  • connection part between the lead terminal and external terminal is built in the base molded with resin, it can avoid the concentration of vibration stress on the connection part even if it receives vibration, improving the vibration resistance of the connection part Can be made.
  • the pedestal part is integrated with the component main body by molding, it is possible to make the electronic parts more robust, and the pedestal part is compared with the conventional product in which the pedestal part is assembled separately from the component main body.
  • the fixing work can be omitted.
  • a component body including a lead terminal, an external terminal connected to the lead terminal, a molded base that covers a connection portion between the lead terminal and the external terminal and is fixed to the component body What is necessary is just to provide a part.
  • the component body is, for example, an electrical functional unit of an electronic component, such as an electrolytic capacitor body, a battery body, or a coil body.
  • an electrolytic capacitor body a capacitor element is enclosed in an outer case.
  • a sealing body for sealing the outer case may be used for the electrolytic capacitor main body, the sealing body may be another member, and the sealing body is not necessarily an essential element.
  • This lead body is equipped with lead terminals.
  • the external terminal is a separate component with respect to the lead terminal.
  • the external terminal and the lead terminal are connected outside the component body.
  • connection part between the lead terminal and the external terminal is covered with a resin that forms the base part.
  • pedestal part molded by resin may be fixed to at least part of the lead terminal lead part side of the component main body.
  • a component main body having a lead terminal and an external terminal connected to the lead terminal are formed.
  • the lead terminal may be columnar or plate-shaped.
  • the external terminal may be an individual terminal component processed for each electronic component, or may be a chain component such as a lead frame that assumes the manufacture of a plurality of electronic components.
  • the lead terminal drawn out to the lead terminal lead-out part of the component body is connected to the external terminal. This connection may be mechanical coupling such as fitting, or may be soldering or welding.
  • the connecting portion between the lead terminal and the external terminal is covered with resin, and this resin is molded to form a pedestal portion. This pedestal is fixed to at least the lead terminal lead-out side of the component main body, and the pedestal and the component main body are integrated.
  • the molding method of the pedestal portion with resin may be either transfer molding or injection molding.
  • the resin may be a thermoplastic resin or a thermosetting resin such as an epoxy resin, a polyester resin, a polyamide resin, or a polyphenylene sulfide (PPS) resin.
  • the molding method of these resins and molding conditions such as temperature may be determined by the selected resin.
  • FIG. 1 shows the capacitor of Example 1.
  • the configuration illustrated in FIG. 1 is an example, and the technology of the present disclosure is not limited to such a configuration.
  • the capacitor 2 is an example of a surface mount capacitor as an electronic component directly attached to a wiring member such as a circuit board.
  • the capacitor 2 may be an electric double layer capacitor or an electrolytic capacitor, and may be another electronic component such as another capacitor or battery. There may be.
  • the capacitor body 4 is an example of a component body of an electronic component.
  • the capacitor main body 4 is a main body portion of the capacitor 2, for example, a portion that performs a capacitor function.
  • the capacitor body 4 is provided with, for example, an exterior case 6 that is a molded body of aluminum.
  • the exterior case 6 accommodates a capacitor element 8 and the opening is sealed with a sealing body 10.
  • a caulking recess 12 is formed on the outer peripheral portion of the outer case 6 by caulking.
  • the sealing body 10 is held on the opening side of the outer case 6 by the caulking concave portion 12, and the outer case 6 is sealed.
  • the capacitor body 4 has anode-side and cathode-side lead terminals 14-1, 14-2 projecting outward.
  • the capacitor body 4 is provided with a sealing body 10, and the lead terminals 14-1 and 14-2 are drawn out from the sealing body 10.
  • Each of the lead terminals 14-1 and 14-2 is a metal material having conductivity, for example, a columnar metal wire.
  • the lead terminal 14-1 is connected to the anode side electrode foil of the capacitor element 8, and the lead terminal 14-2 is connected to the cathode side electrode foil of the capacitor element 8.
  • the surface portion of the capacitor body 4 from which the lead terminals 14-1 and 14-2 are drawn is defined as the lead terminal lead-out side 16.
  • the lead terminal lead portion side 16 includes the outer surface of the sealing body 10 and the peripheral surface portion thereof.
  • lead terminals 14-1 and 14-2 are provided with an anode-side external terminal 18-1 and a cathode-side external terminal 18-2.
  • the external terminals 18-1 and 18-2 are rectangular strips made of conductive metal, like the lead terminals 14-1 and 14-2.
  • a lead terminal insertion hole 20 is formed in each of the external terminals 18-1 and 18-2.
  • the lead terminal 14-1 is inserted into the lead terminal insertion hole 20 of the external terminal 18-1, and may be connected, for example, by soldering or welding.
  • the lead terminal 14-2 may be inserted into the lead terminal insertion hole 20 of the external terminal 18-2 and similarly connected by soldering or welding.
  • the connecting portion 22-1 is formed on the lead terminal 14-1 and the external terminal 18-1
  • the connecting portion 22-2 is formed on the lead terminal 14-2 and the external terminal 18-2.
  • the connecting portion 22-1 performs both electrical connection and mechanical fixing of the lead terminal 14-1 and the external terminal 18-1, and this is the same for the connecting portion 22-2 on the cathode side. .
  • a pedestal portion 24 is formed on the lead terminal lead portion side 16 of the capacitor body 4 by molding.
  • the pedestal 24 is a plate-like body that includes the entire surface of the lead terminal lead-out side 16 of the capacitor body 4, for example, has a substantially square shape, and has two corners omitted for polarity determination.
  • the pedestal portion 24 covers the connection portions 22-1 and 22-2, and is fixed to the lead terminal lead portion side 16 of the capacitor body 4. Thereby, the capacitor body 4 and the pedestal portion 24 are integrated, and the resin sealing by the pedestal portion 24 is added to the rubber sealing of the sealing body 10, and the sealing function of the outer case 6 is enhanced.
  • the pedestal portion 24 extends to the caulking concave portion 12 of the outer case 6.
  • 2A shows an enlarged cross section of the IIA portion of FIG. Resin for molding the pedestal 24 is inserted into the caulking recess 12, and in this embodiment, the entire caulking recess 12 is concealed in the pedestal 24.
  • the formation of the pedestal portion 24 may be in a range that covers at least the lead terminal lead-out portion side 16 of the capacitor body 4 or may be in a range that hides a part of the caulking concave portion 12.
  • a plurality of terminal storage recesses 26 for storing the external terminals 18-1 and 18-2 are formed in the pedestal portion 24 by molding.
  • Each terminal storage recess 26 is formed from the side surface side of the pedestal portion 24 to the seat surface 28 side.
  • the external terminals 18-1 and 18-2 exposed to the pedestal portion 24 are bent from the side surface side of the pedestal portion 24 to the seat surface 28 side, and are disposed in the terminal accommodating recess 26.
  • the seating surface 28 of the pedestal portion 24 means a connection surface of the pedestal portion 24 to the conductor pattern.
  • terminal receiving recesses 26 are formed on the seating surface 28 of the pedestal portion 24 at four locations corresponding to the locations of the external terminals 18-1 and 18-2.
  • a surface mounting connection terminal portion 30-1 on each end side of the external terminal 18-1 and a surface mounting connection terminal portion 30-2 on each end side of the external terminal 18-2 are arranged. ing.
  • the surface mount connection terminal portions 30-1 and 30-2 and the conductor pattern are connected using solder.
  • FIG. 3 shows the external terminals 18-1 and 18-2 and the pedestal portion 24 before molding. If the width of the base portion 24 is L1, the width between the terminal storage recesses 26 is L2, and the storage length of each terminal storage recess 26 is L3, L2 ⁇ L1 (1)
  • ⁇ L is a margin length of the external terminals 18-1 and 18-2 corresponding to the depth of each terminal storage recess 26.
  • the diameter of the lead terminal insertion hole 20 into which each lead terminal 14-1 and 14-2 is inserted is d
  • the distance between the centers of the lead terminals 14-1 and 14-2 is D1
  • the external terminals 18-1 and 18- 2 is W
  • the insulation distance between the external terminals 18-1 and 18-2 is D2
  • each lead terminal insertion hole 20 is formed at the center of the external terminals 18-1 and 18-2.
  • D1 + W D2 + W ⁇ 2 (4) It becomes the relationship.
  • the insulation interval D2 is larger than the width W, for example. If the range is smaller than twice, that is, W ⁇ D2 ⁇ W ⁇ 2, the widths W of the external terminals 18-1 and 18-2 are: D1 ⁇ 3 ⁇ W ⁇ D1 ⁇ 2 (5) It may be in the range.
  • the width W of the terminals 18-1 and 18-2 can be obtained from the equation (5).
  • FIGS 4A and 4B show an example of processes included in the assembly process of the capacitor 2.
  • This assembly process is an example of an electronic component manufacturing method according to the present disclosure.
  • This assembly process includes the capacitor body 4 formation process, the external terminals 18-1 and 18-2 formation process, the lead terminal insertion process, the external terminals 18-1 and 18-2 connection process, and the pedestal 24 molding.
  • the process includes the process of forming the external terminals 18-1 and 18-2.
  • a known forming method may be used for forming the capacitor body 4. Thereby, the capacitor body 4 including the lead terminals 14-1 and 14-2 is formed. Since the structure of the capacitor body 4 has already been described, its description is omitted.
  • the external terminals 18-1 and 18-2 may be formed of a highly conductive metal as described above, for example, as shown in FIG.
  • the band-shaped material or the plate-shaped material may be cut to the above-described length Lm.
  • a lead terminal insertion hole 20 is formed at the center of each of the external terminals 18-1 and 18-2.
  • Each lead terminal insertion hole 20 may be formed simultaneously with the molding of the external terminals 18-1 and 18-2.
  • the external terminals 18-1 and 18-2 are positioned, and the lead terminals 14-1 and 14-2 of the capacitor body 4 are inserted into the lead terminal insertion holes 20, respectively. It penetrates through 18-2.
  • the lead terminals 14-1 and 14-2 are crimped on the back side of the external terminals 18-1 and 18-2. After deforming, cut. As a result, the external terminals 18-1 and 18-2 and the lead terminals 14-1 and 14-2 are coupled and electrically connected.
  • the aforementioned connecting portions 22-1 and 22-2 are formed. In this case, you may connect using soldering or welding.
  • a gap 32 is set between each of the external terminals 18-1 and 18-2 and the lead terminal lead part side 16 of the capacitor body 4.
  • the gap 32 may be set to a gap width ⁇ d necessary to allow the resin used for molding the pedestal portion 24 to enter.
  • the gap 32 is formed of a resin sheet having a good affinity with the resin for molding the pedestal portion 24, or an insulating sheet made of natural fiber or synthetic fiber, and leads to the external terminals 18-1 and 18-2 and the capacitor body 4. It may be formed by being inserted between the terminal lead portion side 16.
  • connection portions 22-1 and 22-2 instead of crushing the tips of the lead terminals 14-1 and 14-2 described above, only soldering or welding may be used. Or you may use welding together. If soldering or welding is used, it is possible to reduce the protruding amount of the leading end portions of the lead terminals 14-1 and 14-2 from the external terminals 18-1 and 18-2. This reduction contributes to a reduction in the height of the capacitor 2.
  • the capacitor body 4 to which the external terminals 18-1 and 18-2 are connected is, for example, placed in a molding die, and if the cavity is filled with resin, the pedestal 24 is molded as shown in FIG. 4B. . By this molding, the connection portions 22-1 and 22-2 are covered with the pedestal portion 24. Resin enters the gap 32 described above to insulate the connecting portions 22-1 and 22-2.
  • the pedestal portion 24 formed of resin is fixed to the lead terminal lead portion side 16 of the capacitor body 4.
  • the side surface of the pedestal portion 24 and the terminal receiving recess 26 on the seat surface 28 side are simultaneously formed.
  • the resin for molding the pedestal portion 24 extends to the caulking concave portion 12 in the capacitor main body 4 and enters the caulking concave portion 12 to be in close contact therewith.
  • the cured resin pedestal 24 is present in the caulking recess 12, and an anchor effect is obtained by fitting the pedestal 24 with the ingress resin protruding into the caulking recess 12 of the outer case 6. Therefore, the base portion 24 and the capacitor body 4 can have a strong fitting or coupling strength exceeding the adhesion strength between the lead terminal lead portion side 16.
  • the external terminals 18-1 and 18-2 integrated with the pedestal portion 24 protrude from the side surface side of the pedestal portion 24.
  • the external terminals 18-1 and 18-2 are bent and formed on the side of the seat surface 28 along the terminal storage recesses 26 of the pedestal portion 24 and stored in the terminal storage recesses 26. As shown in FIG. 2B, the front end sides of the external terminals 18-1 and 18-2 are formed into the surface mount connection terminal portions 30-1 and 30-2. Since the depth of each terminal storage recess 26 is shallower than each surface mount connection terminal portion 30-1, 30-2 (shallow than the thickness of each surface mount connection terminal portion 30-1, 30-2), The surface mount connection terminal portions 30-1 and 30-2 protrude from the seat surface 28 of the pedestal portion 24. As a result, the seating surface 28 is lifted from a circuit board (not shown), and a good connection state is obtained by soldering or the like between the surface mounting connection terminal portions 30-1 and 30-2 and the conductor pattern.
  • the manufactured capacitor of Example 1 was attached to a test substrate, and a resonance point detection test was performed.
  • the test conditions were a maximum acceleration of 40 [G], a maximum total amplitude of 1.5 [mm], a vibration frequency of 10 to 2000 [Hz], and a single sweep, and vibration in the X and Y directions shown in FIG. I let you.
  • the lead terminal of the capacitor body formed in the same manner as in Example 1 was inserted into the lead terminal insertion hole of a separate insulating plate, and the lead terminal was bent along the insulating substrate to form a capacitor.
  • the insulating plate used in the conventional example an insulating plate provided with auxiliary terminals was used, and a product having high vibration resistance performance was used among conventional products.
  • the capacitor was attached to a test substrate, and the test was performed in the same manner as in Example 1.
  • the vibration direction of the conventional example the X direction was “perpendicular to the lead terminal bent on the insulating plate”, and the Y direction was “parallel to the lead terminal bent along the insulating plate”.
  • Example 1 The resonance point detection test of Example 1 and the conventional example is performed, and the peak acceleration and its frequency are shown.
  • Example 1 vibration of 53 [G] in the X direction and 49 [G] in the Y direction was confirmed with respect to the setting of the maximum acceleration 40 [G].
  • the reason why the peak acceleration is detected is considered to be the influence of measurement error and noise, and it has been found that there is no resonance point at the maximum acceleration of 40 [G].
  • the lead terminals 14-1 and 14-2 on the capacitor body 4 side are not bent and the lead terminals 14-1 and 14-2 are connected to the external terminals 18-1 and 18-2. That is, there is no bent portion in each lead terminal 14-1, 14-2. For this reason, since there is no mechanical fragile portion due to the bent portion, concentration of vibration stress can be avoided even if vibration is applied to the capacitor body 4 and the pedestal portion 24 from the outside, so that the lead terminals 14-1, 14- 2's vibration resistance can be improved. Metal fatigue due to vibration of the lead terminals 14-1 and 14-2 can be avoided.
  • the saddle pedestal 24 is molded with resin and is fixed to the capacitor body 4 so that it is integrated with the capacitor body 4. Thereby, the vibration resistance of the capacitor 2 can be improved.
  • connection portions 22-1 and 22-2 between the lead terminals 14-1 and 14-2 and the external terminals 18-1 and 18-2 are covered with resin for molding the pedestal portion 24, In addition, it is maintained in a fixed state. For this reason, even if the capacitor body 4 and the pedestal 24 are subjected to vibration, concentration of vibration stress on the connection parts 22-1 and 22-2 can be avoided, and the vibration resistance of the connection parts 22-1 and 22-2 is improved. Is planned.
  • a gap 32 is maintained between the capacitor body 4 and the external terminals 18-1 and 18-2 by a gap 32, and the resin for molding the pedestal portion 24 sufficiently enters the gap 32. Can be cured. Thereby, the adhesiveness between the capacitor body 4 and the pedestal portion 24 and the adhesiveness between the capacitor body 4 and the external terminals 18-1, 18-2 and the connection portions 22-1 and 22-2 can be improved.
  • this resin sheet is integrated with the resin to fill the gap 32 and complement the adhesion between the pedestal 24 and the capacitor body 4. can do.
  • an insulating sheet is disposed between the capacitor body 4 and the external terminals 18-1 and 18-2, the resin enters the gap, thereby ensuring insulation.
  • the insulating sheet include a sheet made of natural fiber or synthetic fiber.
  • a plurality of surface mount connection terminal portions 30-1 and 30-2 are arranged symmetrically from the line passing through the center point of the pedestal portion 24.
  • the mounting state of the capacitor 2 can be maintained in a stable state, vibration resistance can be improved, and the influence of moment and stress due to the displacement of the center of gravity can be avoided.
  • the capacitor main body 4 is reinforced by the pedestal portion 24, and the pedestal portion 24 is reinforced by the rigidity of the capacitor main body 4.
  • the strength of the capacitor 2 is increased by complementation of the strength of the portion 24 and the capacitor body 4.
  • the saddle pedestal 24 is closely fixed to the capacitor body 4 and integrated with the capacitor body 4 without depending on the strength of the lead terminals 14-1 and 14-2.
  • the shape and thickness of the lead terminals 14-1 and 14-2 can be designed with a degree of freedom in designing the lead terminals 14-1 and 14-2.
  • the pedestal 24 Since the pedestal 24 is molded by inserting resin into the caulking recess 12 of the outer case 6, an anchor effect in which a part of the pedestal 24 is coupled to the caulking recess 12 is obtained, and the capacitor body 4 can prevent separation and peeling of the pedestal portion 24 from the base 4. Since the same effect can be obtained even if the resin is inserted into a part of the caulking recess 12, the weight of the product can be suppressed as compared with the case where the capacitor body 4 is entirely molded.
  • the connecting portions 22-1 and 22-2 of the lead terminals 14-1 and 14-2 and the external terminals 18-1 and 18-2 are integrated and protected inside the molded pedestal 24.
  • the The reinforcing effect of the connecting portions 22-1 and 22-2 by the pedestal portion 24 fixed to the capacitor body 4 can be obtained.
  • the connection portions 22-1 and 22-2 can be protected, and vibration to the capacitor body 4 can be reduced.
  • the pedestal portion 24 is formed by molding the capacitor body 4 and the capacitor body 4 is reinforced, the outer case of the capacitor body 4 is lighter than the conventional product in which the pedestal portion is a separate part.
  • the thickness can be reduced, the weight can be reduced, and the mechanical strength can be arbitrarily selected by selecting the resin. This contributes to reducing the weight and height of the capacitor 2.
  • an increase in the product weight of the capacitor 2 can be suppressed, and the capacitor 2 can be reduced in weight.
  • the connecting portions 22-1 and 22-2 installed in the pedestal portion 24 can be set to the minimum strength and size with emphasis on electrical connection. Thereby, the pedestal part 24 can be thinned, and the thickness can also be adjusted by the resin layer forming the pedestal part 24.
  • the outer case 6 can be directly exposed to the outside air, and the heat dissipation is improved as compared with the case where the capacitor body 4 is completely molded. To do.
  • the pedestal portion 24 covers the lead terminal lead portion side 16 of the capacitor body 4 and is firmly fixed. For this reason, the sealing body 10 on the lead terminal lead portion side 16 is covered with the resin forming the pedestal portion 24. For this reason, the sealing function by the resin of the base part 24 is added to the sealing function by the material of the sealing body 10 such as rubber, and the sealing function of the sealing body 10 is reinforced by the base part 24. As a result, it is possible to suppress the electrolyte from coming off from the sealing body 10 side of the capacitor 2 and to extend the life of the capacitor 2. When the pedestal portion 24 is installed, the thickness of the sealing body 10 can be reduced, so that the capacitor 2 can be reduced in height.
  • FIG. 5 shows the relationship between the current i flowing through the capacitor 2 and the magnetic flux ⁇ .
  • the current i flows from the anode-side external terminal 18-1 to the lead terminal 14-1, and flows from the capacitor element 8 to the external terminal 18-2 via the cathode-side lead terminal 14-2.
  • Each current i generates a magnetic flux ⁇ individually at each of the external terminals 18-1 and 18-2, and the circulation direction of each magnetic flux ⁇ is opposite to the direction of the current i.
  • the external terminals 18-1 and 18-2 forming the path of the current i are arranged in parallel, the generated magnetic flux ⁇ cancels each other.
  • the inductance L proportional to the number of linkages between the current i and the magnetic flux ⁇ can be reduced, and the ESL of the capacitor 2 can be reduced.
  • connection parts 22-1 and 22-2 If fitting or welding is used to connect the connection parts 22-1 and 22-2, the connection of the connection parts 22-1 and 22-2 can be protected from overheating when the capacitor 2 is mounted and soldered. The reliability of the capacitor 2 is improved.
  • connection portions 22-1 and 22-2 are formed on the lead terminals 14-1 and 14-2 and the external terminals 18-1 and 18-2. Since the bent portions are not formed in the lead terminals 14-1 and 14-2, metal fatigue due to vibration of the bent portions can be prevented.
  • the lead terminal insertion holes 20 of the external terminals 18-1 and 18-2 may be configured to be fitted with the lead terminals 14-1 and 14-2 to be inserted instead of the circular holes described above.
  • the inner diameter of the lead terminal insertion hole 20 is made narrower than the lead terminal diameter, and a plurality of fitting pieces and a plurality of fitting pieces are sandwiched inside the lead terminal insertion hole 20 at an angle of, for example, 90 degrees.
  • a plurality of through portions may be provided in the X direction.
  • a pair of through portions may be provided in parallel, and a pair of fitting pieces facing each other may be provided between these through portions.
  • Each fitting piece has a V-shaped notch at the opposite end, and the interval between the notches may be set narrower than the lead terminal diameter.
  • a plurality of through portions may be formed in the Y-shape, a plurality of fitting pieces may be formed, and the interval between the opposing surfaces of the fitting pieces may be narrower than the lead terminal diameter.
  • each fitting piece is bent according to the insertion direction of the lead terminals 14-1 and 14-2, and the lead terminals 14-1 and 14-2 and the external terminal 18- are spring-backed by the elasticity of each fitting piece.
  • the connection portions 22-1 and 22-2 can be maintained in a strong connection state.
  • the resin can enter the deformed portion of each fitting piece, and the adhesion strength due to the integration of each of the connection portions 22-1 and 22-2 and the resin can be increased.
  • 6A shows an example of a capacitor using the lead frame of Example 2 and a method for manufacturing the same.
  • the external terminals 18-1 and 18-2 are formed by the lead frame 42.
  • the lead frame 42 is made of a conductive metal plate.
  • a pair of parallel frame portions 44 are formed in the longitudinal direction, and a plurality of bridge portions 46 are formed between the parallel frame portions 44.
  • a plurality of processing regions 48 are formed by pressing. Each processing region 48 is a molding unit of the pedestal portion 24.
  • Each processing region 48 is provided with external terminals 18-1 and 18-2 projecting from each parallel frame portion 44 in the opposing direction, and from each bridge portion 46 in a direction orthogonal to the external terminals 18-1 and 18-2.
  • a pair of protruding dummy terminals 50-1 and 50-2 are provided in the cross direction.
  • the dummy terminals 50-1 and 50-2 are examples of other external terminals.
  • An insulation interval 52 is set between the distal ends of the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2.
  • the external terminals 18-1 and 18-2 and the dummy terminal 50 are set.
  • an insulation interval 52 may be set between -1 and 50-2.
  • a lead terminal insertion hole 20 is formed in the external terminals 18-1 and 18-2, and a dummy through hole 54 is formed in the dummy terminals 50-1 and 50-2.
  • the pedestal 24 is formed by resin molding by arranging the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 in a cross direction.
  • a pedestal portion 24 is formed as shown in FIG. 6B.
  • a plurality of pedestal portions 24 can be simultaneously formed on the capacitor body 4 on the lead frame 42, and productivity can be improved.
  • Resin enters the insulating space 52, and between the external terminals 18-1 and 18-2, between the external terminals 18-1 and 18-2, and the dummy terminals 50-1 and 50-2. Insulation between the terminals by the resin is enhanced.
  • each surface mounting connection terminal portion 30-1, 30-2 of each of the external terminals 18-1, 18-2, and each dummy terminal 50- are also arranged in the first and second 50-2. Since these are arranged in a cross direction on the seat surface 28, the installation of the pedestal portion 24 can be stabilized with respect to the mounting surface of the wiring board or the like. Thereby, the vibration resistance of all the directions of the capacitor
  • the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 of the lead frame 42 include surface mount connection terminal portions 30-1 and 30-2 as shown in A and B of FIG. You may provide the bending part 56 which stood up in the inner side direction of the base part 24 from the side. Since the other structure is the same as that of Example 2, it attaches
  • the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 are connected to the surface mounting connection terminal portions 30-1 and 30-2 by the pedestal portion 24. It is possible to mold the resin by exposing it to the seating surface 28.
  • the surface mount connection terminal portions 30-1 and 30-2 can be exposed on the seat surface 28 and the pedestal portion 24 can be molded, so that the lead frame 42 and the external terminal 18- 1 and 18-2 and dummy terminals 50-1 and 50-2 may be separated, and a forming process such as bending is unnecessary. After molding the pedestal 24, the external terminals 18-1 and 18-2 are not required to be molded, and the shape accuracy of the product can be improved.
  • the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 are provided with the bent portions 56, so that the internal distance with respect to the pedestal portion 24 is larger than that of the second embodiment, and the resin and The adhesion area with the pedestal 24 can be increased.
  • the external terminals 18-1 and 18-2 similar to those in the second example are formed by the lead frame 42, and a plurality of processings are provided with a plurality of bridging portions 46. Region 48 is formed by pressing.
  • the same parts as those in the second embodiment are denoted by the same reference numerals.
  • external terminals 18-1 and 18-2 are formed by the parallel frame portion 44.
  • the lead frame 42 is used for positioning, and a plurality of pedestals 24 are formed on the lead frame 42 at once. Can increase productivity.
  • the plurality of surface mount connection terminal portions 30-1 and 30-2 are arranged on the seat surface 28 of the base portion 24 at four locations without providing the dummy terminals 50-1 and 50-2.
  • the capacitor 2 can be arranged in parallel, and a stable arrangement of the capacitor 2 can be obtained, and even if it receives vibration, the vibration can be received by the pedestal portion 24 in a balanced manner, so that the vibration resistance of the capacitor 2 is improved.
  • a single dummy terminal may be provided in a direction orthogonal to the external terminals 18-1 and 18-2 within the insulation interval 52 of the external terminals 18-1 and 18-2.
  • the ends of the dummy terminals are bent into the terminal housing recess 26 of the pedestal portion 24 and formed in a pair of surface mount connection terminal portions 30-1 and 30-2, as in the first embodiment (B in FIG. 2). It's okay.
  • the lead frame 42 can be reinforced and deformation can be suppressed, and the external terminals 18-1, 18-2 with respect to the pedestal portion 24 can be suppressed. And the molding accuracy of insert molding of dummy terminals can be increased.
  • the dummy terminal is provided with the dummy through hole described above, the dummy terminal and the pedestal portion 24 can be integrated, and the adhesion and adhesion between the dummy terminal and the pedestal portion 24 can be improved.
  • the capacitor body 4 may be formed with a resin coating on the outer surface of the outer case 6.
  • the exterior case 6 may be configured as a resin coating case portion by the resin coating portion.
  • the base part 24 is integrated with the resin coating part.
  • the base portion 24 can be integrated with the resin coating portion in close contact with the outer case 6 and fixed to the capacitor body 4, the fixing strength between the capacitor body 4 and the base portion 24 can be increased.
  • the pedestal portion 24 can be made thinner and the amount of resin used for molding the pedestal portion 24 can be reduced.
  • the pedestal 24 can be reduced in weight, thereby contributing to the reduction in the weight of the capacitor 2.
  • the resin case is applied to the outer case 6, but a part or all of the outer case 6 may be formed of resin, and the capacitor main body 4 may be provided with the resin case portion.
  • thermoplastic resin any of a thermoplastic resin and a thermosetting resin such as an epoxy resin, a thermosetting polyester resin, a thermoplastic polyester resin, a PPS resin, and a polyamide resin may be used.
  • transfer molding may be used, and it is excellent in chemical resistance, heat resistance, strength and adhesion, and the pedestal portion 24 which is the molded product has these characteristics.
  • thermosetting polyester resin transfer molding may be used, and the adhesiveness is excellent and inexpensive, and the pedestal portion 24 that is the molded product has heat resistance, strength, and adhesiveness compared to other resins. Excellent characteristics can be obtained.
  • thermoplastic polyester resin injection molding may be used and it is inexpensive.
  • the base part 24 which is a molded product can be provided at low cost.
  • injection molding may be used, which is excellent in heat resistance and strength, and the pedestal portion 24 that is a molded product has these characteristics.
  • injection molding may be used, which is excellent in heat resistance and strength, and the pedestal portion 24 that is a molded product has these characteristics.
  • a metal material such as copper, copper alloy, tough pitch copper, iron, or nickel may be used.
  • a capacitor is illustrated as an example of an electronic component, but the technology of the present disclosure may be applied to components such as an electronic component other than a capacitor, a resistor, a battery, and a coil.
  • the cylindrical capacitor body 4 is illustrated, but the external shape of the component body may be a prismatic body, and the technology of the present disclosure is not limited to the cylindrical body.
  • the external terminals are illustrated as being installed on the seat surface 28 of the pedestal portion 24 in the orthogonal or parallel direction, but they may be arranged in the Y-shape or T-shape.
  • the external terminals are arranged in a two-dimensional manner and have an extension with respect to the seating surface 28, the mounting of not only the capacitor 2 but also the electronic component can be stabilized, and the vibration resistance of the electronic component can be improved. Can be increased.
  • the external terminal and the lead terminal protruding outside the component main body are molded, and the pedestal portion covering the connection portion between the lead terminal connected to the outside of the component main body and the external terminal is molded. It can be widely applied to parts and can realize electronic parts with high vibration resistance, which is useful.
  • Capacitor 4 Capacitor body 6 Exterior case 8 Capacitor element 10 Sealing body 12 Clamping recess 14-1, 14-2 Lead terminal 16 Lead terminal lead-out side 18-1, 18-2 External terminal 20 Lead terminal insertion hole 22-1 22-2 Connection part 24 Base part 26 Terminal receiving recess 28 Seat surface 30-1, 30-2 Surface mount connection terminal part 32 Gap 42 Lead frame 44 Parallel frame part 46 Bridge part 48 Processing area 50-1, 50- 2 Dummy terminal 52 Insulation interval 54 Dummy through hole 56 Bent part

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
PCT/JP2015/004801 2014-09-22 2015-09-18 電子部品およびその製造方法 WO2016047128A1 (ja)

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WO2018020993A1 (ja) * 2016-07-29 2018-02-01 パナソニックＩｐマネジメント株式会社 電解コンデンサ
WO2018079358A1 (ja) * 2016-10-31 2018-05-03 パナソニックＩｐマネジメント株式会社 電解コンデンサ
WO2018123525A1 (ja) * 2016-12-27 2018-07-05 パナソニックＩｐマネジメント株式会社 電解コンデンサ

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JPS6146723U (ja) * 1984-08-31 1986-03-28 日本ケミコン株式会社 電子部品
JP2002190430A (ja) * 2000-12-20 2002-07-05 Nippon Chemicon Corp チップ形コンデンサ
JP2005033109A (ja) * 2003-07-10 2005-02-03 Elna Co Ltd チップ型電子部品
JP2007103531A (ja) * 2005-09-30 2007-04-19 Nippon Chemicon Corp 電解コンデンサの製造方法

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JP2006041125A (ja) * 2004-07-26 2006-02-09 Nichicon Corp チップ形アルミニウム電解コンデンサ
JPWO2006061879A1 (ja) * 2004-12-06 2008-06-05 株式会社ルネサステクノロジ 点火装置、半導体装置及びその製造方法
JP5040715B2 (ja) * 2007-07-19 2012-10-03 パナソニック株式会社 電子部品及びリード線、それらの製造方法
CN102523759B (zh) * 2010-09-10 2013-08-14 松下电器产业株式会社 电子部件及电子部件用导线
JP5802387B2 (ja) * 2010-12-24 2015-10-28 サン電子工業株式会社 チップ形コンデンサ及びその製造方法
CN103221860A (zh) * 2011-01-13 2013-07-24 株式会社村田制作所 连接器
JP5878054B2 (ja) * 2012-03-27 2016-03-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法及び半導体装置

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JPS6146723U (ja) * 1984-08-31 1986-03-28 日本ケミコン株式会社 電子部品
JP2002190430A (ja) * 2000-12-20 2002-07-05 Nippon Chemicon Corp チップ形コンデンサ
JP2005033109A (ja) * 2003-07-10 2005-02-03 Elna Co Ltd チップ型電子部品
JP2007103531A (ja) * 2005-09-30 2007-04-19 Nippon Chemicon Corp 電解コンデンサの製造方法

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CN106716576A (zh) 2017-05-24

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