WO2016035122A1 - プリント配線板製造用積層体及びその製造方法、並びにプリント配線板の製造方法 - Google Patents
プリント配線板製造用積層体及びその製造方法、並びにプリント配線板の製造方法 Download PDFInfo
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- WO2016035122A1 WO2016035122A1 PCT/JP2014/072921 JP2014072921W WO2016035122A1 WO 2016035122 A1 WO2016035122 A1 WO 2016035122A1 JP 2014072921 W JP2014072921 W JP 2014072921W WO 2016035122 A1 WO2016035122 A1 WO 2016035122A1
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- WIPO (PCT)
- Prior art keywords
- layer
- resin layer
- peelable metal
- resin
- positioning
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Definitions
- the present invention relates to a laminate for producing a printed wiring board, a method for producing the same, and a method for producing a printed wiring board.
- multilayered printed wiring boards have been widely used.
- Such a multilayer printed wiring board is used for the purpose of weight reduction and size reduction in many portable electronic devices.
- the multilayer printed wiring board is required to further reduce the thickness of the interlayer insulating layer and further reduce the weight of the wiring board.
- a manufacturing method using a coreless build-up method is adopted as a technology that satisfies such requirements.
- this coreless buildup method it has been proposed to use a copper foil with a carrier foil for peeling between the support substrate and the multilayer printed wiring board.
- a copper foil with a carrier foil comprising at least four layers of copper foil layer / peeling layer / heat-resistant metal layer / carrier foil is used.
- a method for producing a multilayer printed wiring board in which a substrate is separated by a release layer to obtain a multilayer laminated board, and the multilayer laminated board is subjected to necessary processing to obtain a multilayer printed wiring board.
- the reference hole is used for positioning by inserting a positioning pin when forming the build-up wiring layer.
- the cross-section of the carrier-attached copper foil is exposed on the side surface of the reference hole formed by drilling or the like, and in particular, the cross-section of the copper foil with the carrier foil (especially the peeling layer interface) does not cause mechanical damage due to cutting. Easy to receive.
- the carrier foil and the copper foil are partially peeled at the peeling layer interface, or even if not, the carrier foil and the copper foil are easily peeled off. If the build-up wiring is formed in such a state, the chemical solution used in the wet process may permeate from the interface of the release layer and the peeling of the copper foil with the carrier foil may be promoted, which may lead to a decrease in manufacturing yield.
- Patent Document 2 Japanese Patent Laid-Open No. 2007-214427
- a peelable metal foil provided with an opening is laminated on a support, and a reference hole penetrating them is formed.
- a through hole having a smaller diameter than the opening is formed by processing a support portion inside the opening of the peelable metal foil. It is disclosed that a protrusion is formed inside and a resin layer is formed on the peelable metal foil and the protrusion of the reference hole to cover the side surface of the opening.
- the present inventor has recently been able to perform complicated processing by exposing one surface side of the peelable metal foil so as to be able to form a wiring while having a highly convenient configuration including the peelable metal foil in which the positioning holes are formed in advance.
- the present inventors have obtained knowledge that a laminate for manufacturing a printed wiring board can be provided that can effectively prevent peeling of the metal foil in the positioning hole, penetration of the chemical solution into the interface of the release layer, and the like without any subsequent necessity.
- an object of the present invention is to provide a highly convenient configuration including a peelable metal layer in which positioning holes are formed in advance, but one surface side of the peelable metal layer is exposed so that wiring can be formed, and complicated processing is performed. It is an object of the present invention to provide a laminate for manufacturing a printed wiring board, which can effectively prevent peeling of a metal layer in a positioning hole, penetration of a chemical solution into an interface of a peeling layer, etc. Moreover, the objective of this invention is also providing the manufacturing method of such a laminated body for printed wiring board manufacture, and the manufacturing method of a printed wiring board using this laminated body.
- a resin layer comprising a resin;
- a peelable metal layer comprising two metal layers provided on at least one surface of the resin layer and laminated so as to be peelable from each other via a peelable layer;
- Positioning holes provided in the peelable metal layer;
- a hole surface sealing portion comprising the resin, which is provided in the positioning hole continuously from the resin layer and seals at least an inner peripheral surface of the positioning hole;
- a laminate for producing a printed wiring board is provided.
- a method for manufacturing a laminate for manufacturing a printed wiring board Preparing a resin layer containing a resin; A step of providing a peelable metal foil comprising two metal foils laminated so as to be peelable from each other via a release layer, and having a positioning hole; Laminating the peelable metal foil on at least one surface of the resin layer; Pressing the resin layer and the peelable metal foil while heating, whereby the resin is softened or fluidized by the heating to spread in the positioning holes and exposed to the positioning holes. Sealing the cross section of the metal foil to obtain a laminate; A method is provided comprising:
- a printed wiring board manufacturing method (A) preparing the laminate of the above aspect, or preparing the laminate according to the method of the above aspect; (B) inserting a positioning pin inside the positioning hole, and laminating a resin layer or a resin layer and a metal foil on the laminate; (C) forming the build-up wiring layer by processing the resin layer or the resin layer and the metal foil laminated in the step (b); (D) repeating the above steps (b) and (c) in this order to obtain a laminate with a build-up wiring layer; (E) cutting off an unnecessary region including the positioning hole from the laminate with the build-up wiring layer to expose a cross section of the peelable metal layer or the peelable metal foil; (F) separating the laminate with a buildup wiring layer by the release layer to obtain a multilayer wiring board including the buildup wiring layer; (G) processing the multilayer wiring board to obtain a printed wiring board; A method is provided comprising:
- FIG. 8A It is a process flowchart explaining an example of the manufacturing method of the printed wiring board by this invention. It is a process flowchart explaining an example of the manufacturing method of the printed wiring board by this invention, and is equivalent to the continuation of FIG. 8A. It is a schematic cross section which shows the state just before peeling in the manufacturing process of the printed wiring board by this invention. It is a schematic cross section which shows the state immediately after peeling in the manufacturing process of the printed wiring board by this invention.
- a laminate 10 for manufacturing a printed wiring board (hereinafter referred to as a laminate 10) includes a resin layer 12, a peelable metal layer 14 provided on at least one surface of the resin layer 12, and a peel A positioning hole 18 provided in the conductive metal layer 14 and a hole surface sealing portion 20 provided in the positioning hole 18.
- the resin layer 12 is a layer containing a resin, and may contain components other than the resin.
- the peelable metal layer 14 includes two metal layers 16 a and 16 b which are laminated so as to be peeled from each other via the peel layer 15.
- the hole surface sealing portion 20 is a portion that is provided in the positioning hole 18 continuously from the resin layer 12 and seals at least the inner peripheral surface of the positioning hole 18 (that is, the cross section of the peelable metal layer 14).
- the resin of the layer 12 is included.
- the hole surface sealing portion 20 may completely close the positioning hole 18 as shown in FIG. 1, and for example, as shown in FIG. 2, the inner peripheral surface of the positioning hole 18 (that is, the peelable metal). Only the cross-section of the layer 14 may be sealed, and in that case, a through-hole may exist inside the positioning hole 18. Even if a part or all of the positioning hole 18 is blocked with a resin to form a non-through hole, the through hole for passing the positioning pin when the printed wiring board is manufactured has a smaller diameter than the positioning hole 18.
- the hole surface sealing portion 20 can remain on the inner peripheral surface of the positioning hole 18.
- the positioning hole 18 is formed in the peelable metal layer 14 in advance, the user of the laminate for manufacturing a printed wiring board according to the present invention requires precision so that peeling is a complicated operation.
- the formation of the positioning hole 18 in the conductive metal layer 14 can be omitted.
- the hole surface sealing portion 20 is made of a resin (same resin) contained in the resin layer 12 as a constituent component. This configuration can be preferably realized by reaching the positioning hole 18 by pressing a part of the resin contained in the resin layer 12 while heating. Therefore, since the hole surface sealing portion 20 is continuously provided in the positioning hole 18 from the resin layer 12, the hole surface sealing portion 20 is seamlessly connected to the resin layer 12. Therefore, the cross section of the peelable metal layer 14 in the positioning hole 18 can be reliably sealed. As described above, the cross section of the peelable metal layer is susceptible to mechanical damage due to cutting by drilling or the like, and therefore, the carrier foil and the copper foil are partially peeled off at the peeling layer interface or otherwise peeled off. Easy state.
- the chemical solution used in the wet process may permeate from the interface of the release layer and the peeling of the copper foil with the carrier foil may be promoted, which may lead to a decrease in manufacturing yield. It was a thing.
- the cross section of the peelable metal layer 14 in the positioning hole 18 can be reliably sealed, so that the above problem can be solved. Furthermore, since the positioning hole 18 is formed in advance in the laminate 10 of the present invention, complicated processing performed afterwards as disclosed in Patent Document 2 is not necessary.
- a through hole for passing the positioning pin is formed with a smaller diameter than the positioning hole 18 when the printed wiring board is manufactured.
- the hole surface sealing portion 20 can remain on the inner peripheral surface of the positioning hole 18, so that the complicated processing as in Patent Document 2 is not required.
- the wiring is directly formed on the surface of the peelable metal layer. A pattern can be formed in advance.
- one surface side of the peelable metal layer 14 is exposed so as to be able to form a wiring while having a highly convenient structure including the peelable metal layer 14 in which the positioning holes 18 are formed in advance.
- a laminate for producing a printed wiring board can be provided.
- the resin layer 12 comprises a resin, preferably an insulating resin.
- the resin layer 12 is preferably a prepreg and / or a resin sheet, and more preferably a prepreg.
- the prepreg is a general term for composite materials in which a base material such as a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, and paper is impregnated with a synthetic resin. Therefore, when the resin layer 12 is comprised with a prepreg, the hole surface sealing part 20 can be comprised with resin impregnated in a prepreg.
- the insulating resin impregnated in the prepreg include epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin and the like.
- the insulating resin that constitutes the resin sheet include insulating resins such as epoxy resins, polyimide resins, and polyester resins.
- the resin layer 12 may contain filler particles made of various inorganic particles such as silica and alumina from the viewpoint of improving the insulating properties.
- the thickness of the resin layer 12 is not particularly limited, but is preferably 3 to 1000 ⁇ m, more preferably 5 to 400 ⁇ m, and still more preferably 10 to 200 ⁇ m.
- the resin layer 12 may also include a positioning hole, and the positioning hole may have a through hole corresponding to the positioning hole 18 formed in the peelable metal layer.
- the positioning hole may have a through hole corresponding to the positioning hole 18 formed in the peelable metal layer.
- the positioning holes 18 are formed between the two peelable metal foils 14 and 14 on both sides. , 18 are also advantageous in accurately positioning. In that case, it is more preferable to insert and press a positioning pin inside the positioning holes 18 and 18.
- the inner peripheral surface of the positioning hole 18 of the peelable metal layer 14 is sealed with the hole surface sealing portion 20, so that the positioning hole at the time of forming the buildup wiring layer 18 can effectively prevent the metal layers 16a and 16b from peeling off and the penetration of the chemical solution into the peeling layer interface.
- the resin layer 12 does not have to have a positioning hole.
- all of the positioning holes 18 of the peelable metal layer 14 are formed as non-through holes (because they are blocked by the resin layer 12).
- the peelable metal layer 14 may have a larger number of positioning holes 18 than the resin layer 12, and in that case, the positioning holes 18 of the peelable metal layer 14 that do not coincide with the positioning holes of the resin layer 12. It is formed as a non-through hole (because it is blocked by the resin layer 12). That is, the positioning hole 18 of the peelable metal layer 14 may be filled with resin as shown in FIG. Even in this case, the hole surface sealing portion 20 remains on the inner peripheral surface of the positioning hole 18 if the through hole for passing the positioning pin is formed with a smaller diameter than the positioning hole 18 when the printed wiring board is manufactured. be able to.
- the peelable metal layer 14 (typically, the peelable metal foil) is composed of two metal layers 16a and 16b (typically, laminated so as to be peelable from each other via the peelable layer 15). Comprises two metal foils).
- the two metal layers 16a and 16b are preferably detachable with a desired peeling strength from each other with the release layer 15 as the release interface.
- the metal layers 16a and 16b may be the same type of metal layer or different types of metal layers.
- Each of the metal layers 16a and 16b may be aluminum, copper, stainless steel, nickel, etc., preferably copper.
- each of the metal layers 16a and 16b is not particularly limited, but is preferably 0.1 to 200 ⁇ m, more preferably 0.5 to 35 ⁇ m, and still more preferably 1 to 18 ⁇ m.
- the peelable metal layer 14 may be a known product represented by a metal foil with a carrier foil, and may be a commercially available product.
- the metal foil with carrier foil may have a known configuration, and any of the two metal layers 16a and 16b may be used as the carrier foil.
- a particularly preferable example of the peelable metal layer 14 is a copper foil with a carrier foil.
- the metal layer 16a (the inner layer in contact with the resin layer 12) and the metal layer 16b (the outer layer away from the resin layer 12) are respectively a carrier foil and a copper foil (for example, an ultrathin copper foil).
- the carrier foil include an aluminum foil, a copper foil, a resin film whose surface is metal-coated, and the like, and preferably a copper foil.
- the copper foil may be a rolled copper foil or an electrolytic copper foil.
- the thickness of the carrier foil is typically 200 ⁇ m or less, preferably 18 ⁇ m to 200 ⁇ m.
- the copper foil of the carrier foil-attached copper foil is preferably configured in the form of an ultrathin copper foil in order to take advantage of the copper foil with the carrier foil.
- a preferable thickness of the ultrathin copper foil is 0.1 ⁇ m to 8 ⁇ m, more preferably 0.5 ⁇ m to 6 ⁇ m, and still more preferably 1 ⁇ m to 3 ⁇ m.
- the ultrathin copper foil may be formed by a wet film formation method such as an electroless copper plating method and an electrolytic copper plating method, a dry film formation method such as sputtering and chemical vapor deposition, or a combination thereof.
- the peeling layer 15 weakens the peeling strength of the metal layer, ensures the stability of the strength, and can occur between the two metal layers 16a and 16b (for example, carrier foil and copper foil) during press molding. It is a layer having a function of suppressing interdiffusion.
- the release layer may be either an organic release layer or an inorganic release layer. Examples of organic components used in the organic release layer include nitrogen-containing organic compounds, sulfur-containing organic compounds, carboxylic acids and the like. On the other hand, examples of inorganic components used in the inorganic release layer include Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, and a chromate-treated film.
- the release layer may be formed by bringing the release layer component-containing solution into contact with the surface of the metal layer and fixing the release layer component to the surface of the metal layer.
- the contact of the metal layer with the release layer component-containing solution may be performed by immersion in the release layer component-containing solution, spraying of the release layer component-containing solution, flowing down of the release layer component-containing solution, or the like.
- the release layer component may be fixed to the surface of the metal layer by drying the release layer component-containing solution, electrodeposition of the release layer component in the release layer component-containing solution, or the like.
- the thickness of the release layer is typically 1 nm to 1 ⁇ m, preferably 5 nm to 500 nm.
- another functional layer may be provided between the release layer 15 and the metal layers 16a and / or 16b.
- An example of such another functional layer is an auxiliary metal layer.
- the auxiliary metal layer is preferably made of nickel and / or cobalt. By forming such an auxiliary metal layer, the interdiffusion that may occur between the two metal layers 16a and 16b (for example, carrier foil and copper foil) during high-temperature or long-time hot press molding is suppressed, and the carrier The stability of the peeling strength of a foil such as a foil can be ensured.
- the thickness of the auxiliary metal layer is preferably 0.001 to 3 ⁇ m.
- the positioning hole 18 is a hole provided in the peelable metal layer 14.
- the positioning hole 18 may not be provided in the resin layer 12. Therefore, the positioning hole 18 may be a non-through hole closed with the resin layer 12.
- the resin layer 12 is also positioned. It is preferable that the laminated body 10 is manufactured in a state where holes are provided. In this case, the positioning hole 18 of the peelable metal layer 14 in the laminated body 10 can communicate with the resin layer 12 to provide a through hole.
- the shape of the positioning hole 18 may be various shapes such as a circle, a triangle, and a quadrangle, and is preferably a circle.
- the diameter of the positioning hole 18 is preferably 1 to 10 mm, more preferably 2 to 5 mm. Since the positioning hole 18 is scheduled to be inserted when the positioning hole 18 is stacked (for example, when the build-up wiring layer is formed), the shape and size of the positioning hole 18 are the same as the inner circumference of the positioning hole 18 when the positioning pin is pulled out. It is preferable that the resin is left on the surface so that the function of the hole surface sealing portion 20 can be maintained.
- the diameter of the positioning hole 18 of the peelable metal layer 14 is preferably 1.01 to 3 times, more preferably 1.05 to 2 times the diameter of the positioning pin assumed to be used.
- the positioning hole 18 is preferably provided in the vicinity of the outer edge of the peelable metal layer 14.
- the vicinity of the outer edge may be an area that is not used as a product, for example, an area 5 to 20 mm inside from the outer edge of the peelable metal layer 14. By doing so, an effective area that can be used as a printed wiring board can be widened.
- a plurality of positioning holes 18 are preferably provided. This is because, when the laminate 10 is used for manufacturing a printed wiring board, a positioning pin can be inserted into a positioning hole 18 different from the previous lamination every time one build-up wiring layer is laminated, thereby increasing positioning accuracy. Because. Also, the number of positioning holes used for one stacking is preferably more than one (for example, a total of four at the four corners of the peelable metal layer 14) because positioning can be performed more reliably. Therefore, when the number of positioning holes used for one stacking is N 1 and the number of build-up wiring layers to be stacked on one side of the stacked body is N BU , the stacked body 10 is on one side of the stacked body.
- the number of positioning holes in the peelable metal layer is preferably N 1 ⁇ N BU or more (however, N 1 is an integer of 2 or more and N BU is an integer of 1 or more).
- the number N 1 of positioning holes used for one stacking is preferably 3 or more, more preferably 4, and in this case, it is particularly preferable that the positioning holes are formed at the four corners of the peelable metal layer 14.
- the number N BU of build-up wiring layers to be laminated on one side of the laminate is preferably 3 or more. For example, it is preferable that N 1 is 4 and N BU is 2 or more.
- the number of the positioning holes 18 of the peelable metal foil 14 on one side of the laminate is the number of times of lamination. Increase to N 1 ⁇ (N BU +1) or more.
- the hole surface sealing portion 20 is provided in the positioning hole 18 continuously from the resin layer 12 and corresponds to at least the inner peripheral surface of the positioning hole 18 (the cross section of the peelable metal layer 14). ) Is sealed.
- the hole surface sealing portion 20 has continuity with the resin layer 12, and therefore includes the resin of the resin layer 12. That is, the hole surface sealing portion 20 is seamlessly connected to the resin layer 12. Therefore, the cross section of the peelable metal layer 14 in the positioning hole 18 can be reliably sealed. For this reason, peeling of the metal layers 16a and 16b in the positioning hole 18 at the time of forming the build-up wiring layer, penetration of the chemical solution into the peeling layer interface, and the like can be effectively prevented. In that sense, it is preferable that the cross section of the peelable metal layer 14 is not exposed on the inner peripheral surface of the positioning hole 18.
- end surface sealing part 24 is further provided in the end surface 22 of the outer edge of the peelable metal layer 14.
- the end surface sealing portion 24 is provided on the end surface 22 of the outer edge of the peelable metal layer 14 continuously from the resin layer 12 and seals the end surface 22 (corresponding to the cross section of the peelable metal layer 14).
- the end surface sealing portion 24 also has continuity with the resin layer 12 like the hole surface sealing portion 20, and is therefore configured to include the resin of the resin layer 12. That is, the end surface sealing portion 24 is seamlessly connected to the resin layer 12. Therefore, the end surface 22 of the outer edge of the peelable metal layer 14 can be reliably sealed.
- the resin layer 12 has a larger area than the peelable metal layer 14, the outer edge of the peelable metal layer 14 is located inside the outer edge of the resin layer 12, and the end surface sealing portion 24 peels off. It is particularly preferable that the conductive metal layer 14 is formed over the entire outer edge. By doing so, the end face 22 can be reliably sealed over the entire outer edge of the peelable metal layer 14. For this reason, peeling of the metal layers 16a and 16b in the end face 22 at the time of forming the build-up wiring layer, penetration of the chemical solution into the peeling layer interface, and the like can be further reliably prevented.
- the distance between the outer edge of the peelable metal layer 14 and the outer edge of the resin layer 12 is preferably 1 to 50 mm, more preferably 1 to 20 mm, and still more preferably 1 to 10 mm.
- the peelable metal layers 14 and 14 are preferably provided on both surfaces of the resin layer 12.
- the positioning holes 18 and 18 of the peelable metal layers 14 and 14 on both surfaces of the resin layer 12 coincide with each other, that is, be accurately positioned.
- the displacement of the positioning holes 18, 18 between the peelable metal layers 14, 14 on both sides of the resin layer 12 is preferably ⁇ 0.5 mm or less, more preferably ⁇ 0.1 mm or less. The smaller the displacement, the smaller the diameter of the positioning holes 18, 18, and as a result, the effective area of the printed wiring board can be widened.
- the size accuracy of the peelable metal layers 14 and 14 on both surfaces of the resin layer 12 is preferably a dimensional tolerance of ⁇ 1.0 mm or less, more preferably ⁇ 0.5 mm or less.
- the higher the accuracy that is, the smaller the dimensional tolerance
- the laminate for producing a printed wiring board includes (A) a peelable metal in which a resin layer 12 and positioning holes 18 are formed.
- the foil 14 is prepared, (B) the peelable metal foil 14 is laminated on at least one surface of the resin layer 12, (C) the resin layer 12 and the peelable metal foil 14 are pressed while being heated, It is preferable to manufacture the resin layer 12 by softening or fluidizing the resin by heating and spreading the resin layer 12 into the positioning hole 18 and sealing the cross section of the peelable metal foil 14 exposed in the positioning hole 18.
- FIG. 7 is an embodiment in which the peelable metal foils 14 and 14 are provided on both surfaces of the resin layer 12 using the positioning pins P, but the present invention is not limited to this.
- FIG. As shown in the drawing, the peelable metal foil 14 may be laminated without using the positioning pin P only on one surface of the resin layer 12.
- the resin layer 12 is prepared.
- the resin layer 12 includes a resin, preferably an insulating resin.
- the resin layer 12 is preferably a prepreg and / or a resin sheet, and more preferably a prepreg.
- the prepreg is a general term for composite materials in which a base material such as a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, and paper is impregnated with a synthetic resin. Therefore, when the resin layer 12 is comprised with a prepreg, the hole surface sealing part 20 can be comprised with resin impregnated in a prepreg.
- the insulating resin impregnated in the prepreg include epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin and the like.
- the insulating resin that constitutes the resin sheet include insulating resins such as epoxy resins, polyimide resins, and polyester resins.
- the resin layer 12 may contain filler particles made of various inorganic particles such as silica and alumina from the viewpoint of improving the insulating properties.
- the thickness of the resin layer 12 is not particularly limited, but is preferably 3 to 1000 ⁇ m, more preferably 5 to 400 ⁇ m, and still more preferably 10 to 200 ⁇ m.
- the positioning hole 19 may not be provided in the resin layer 12 as long as it does not hinder positioning. It is as follows.
- the positioning hole 19 may be formed by a known method such as drilling or laser processing, but laser processing is preferable from the viewpoint of preventing scattering of resin powder or the like due to processing of the positioning hole 19. Further, it is possible to adopt a method in which the resin layer 12 is previously sandwiched between a hole processing protective film, a laser absorption film, or the like, and then the positioning holes 19 are formed and the protective film is peeled off.
- a peelable metal foil 14 in which positioning holes 18 are formed is prepared.
- the peelable metal foil 14 includes two metal foils 16 a and 16 b which are laminated so as to be peeled from each other via a release layer 15.
- the two metal foils 16a and 16b are preferably detachable with a desired peeling strength from each other with the release layer 15 as the release interface.
- the metal foils 16a and 16b may be the same type of metal foil or different types of metal foils.
- Each of the metal foils 16a and 16b may be an aluminum foil, a copper foil, a stainless steel foil, a nickel foil or the like, and is preferably a copper foil.
- each of the metal foils 16a and 16b is not particularly limited, but is preferably 0.1 to 200 ⁇ m, more preferably 0.5 to 35 ⁇ m, and further preferably 1 to 18 ⁇ m.
- the peelable metal foil 14 may be a known product represented by a metal foil with a carrier foil, and may be a commercially available product.
- a particularly preferred example of the peelable metal foil 14 is a copper foil with a carrier foil, the preferred details of which are as described above.
- the details of the release layer 15 and other functional layers that may be provided as desired are also as described above.
- a positioning hole 18 is formed in the peelable metal foil 14.
- the positioning hole 18 may be formed by a known method such as drilling, lasering, or blasting. In particular, drilling is preferable when the positioning holes 18 are collectively formed in a state where a plurality of peelable metal foils 14 are stacked. Moreover, when pursuing improvement in positional accuracy with the outer edge portion of the peelable metal foil 14, laser processing is preferable.
- the shape of the positioning hole 18 may be various shapes such as a circle, a triangle, and a quadrangle, and is preferably a circle. In the case of a circular shape, the diameter of the positioning hole 18 is preferably 1 to 10 mm, more preferably 2 to 5 mm.
- the shape and size of the positioning hole 18 are the same as those of the positioning hole 18 when the positioning pin is pulled out. It is preferable that the resin is left on the inner peripheral surface so that the function of the hole surface sealing portion 20 can be maintained.
- the diameter of the positioning hole 18 of the peelable metal foil 14 is preferably 1.01 to 3 times, more preferably 1.05 to 2 times the diameter of the positioning pin assumed to be used. .
- the positioning hole 18 is preferably provided in the vicinity of the outer edge of the peelable metal foil 14.
- the vicinity of the outer edge may be an area that is not used as a product, for example, an area 5 to 20 mm inside from the outer edge of the peelable metal foil 14. By doing so, an effective area that can be used as a printed wiring board can be widened.
- a plurality of positioning holes 18 are preferably provided, the details of which are as described above.
- the peelable metal foil 14 is laminated on at least one surface of the resin layer 12.
- This lamination may be performed in accordance with known conditions and techniques adopted for lamination of copper foil and prepreg in a normal printed wiring board manufacturing process, but the releasable metal foil 14 and the resin layer 12 are positioned with desired accuracy. It is preferable to do so.
- the resin layer 12 also includes a positioning hole 19, and the positioning hole 19 of the resin layer 12 forms a through hole corresponding to the positioning hole 18 formed in the peelable metal foil 14. You may laminate
- the positioning holes 18 and 18 of the peelable metal foils 14 and 14 on both surfaces are aligned with each other. It is preferable to perform lamination. At this time, if the resin layer 12 has the positioning hole 19, it is advantageous in accurately positioning the positioning holes 18 and 18 between the two peelable metal foils 14 and 14 on both sides.
- a resin layer 12 is provided by applying a resin to one surface of the peelable metal foil 14 in which the positioning holes 18 are formed, and the side without the peelable metal foil 14 (resin layer 12 On the side), another peelable metal foil 14 having positioning holes 18 may be laminated.
- the lamination when the lamination is performed such that the resin layer 12 has a larger area than the peelable metal foil 14 and the outer edge of the peelable metal foil 14 is located inside the outer edge of the resin layer 12.
- the positioning hole 19 is also provided in the resin layer 12, it is advantageous in that it is possible to prevent displacement during pressing with respect to the positioning hole 18.
- the positioning pin P may be pulled out after lamination or pressing. That is, it is more preferable to insert the positioning pin into the positioning hole 18 and press it.
- (C) Pressing process The laminated resin layer 12 and the peelable metal foil are pressed while being heated, whereby the resin is softened or fluidized by heating to be distributed in the positioning holes 18 and exposed in the positioning holes 18.
- the cross section of the peelable metal foil 14 to be sealed is sealed to obtain the laminate 10.
- the hole surface sealing part 20 can be formed in the form connected with the resin layer 12 seamlessly. Therefore, the cross section of the peelable metal foil 14 in the positioning hole 18 can be reliably sealed. For this reason, it is possible to effectively prevent peeling of the metal foils 16a and 16b in the positioning hole 18 at the time of forming the build-up wiring layer, penetration of the chemical solution into the peeling layer interface, and the like.
- the heating temperature at the time of pressing is not particularly limited as long as the resin can be softened or fluidized by heating, but is preferably 100 to 350 ° C, more preferably 150 to 250 ° C.
- the softened or fluidized resin is spread over the end face 22 of the outer edge of the peelable metal foil 14 to seal the cross section of the peelable metal foil exposed on the end face 22.
- the end surface sealing part 24 can be formed in the form connected with the resin layer 12 seamlessly. Therefore, the end surface 22 of the outer edge of the peelable metal foil 14 can be reliably sealed. For this reason, it is possible to effectively prevent peeling of the metal foils 16a and 16b in the end face 22 at the time of forming the build-up wiring layer, penetration of the chemical solution into the peeling layer interface, and the like.
- the end face 22 is masked with a tape or the like to prevent the penetration of the chemical solution.
- a tape or the like By forming it, such complicated masking becomes unnecessary, and the manufacturing process can be simplified. In that sense, it is preferable to perform pressing so that the cross section of the peelable metal foil 14 is not exposed at the end face 22.
- the resin layer 12 has a larger area than the peelable metal foil 14, and the outer edge of the peelable metal foil 14 is located on the inner side of the outer edge of the resin layer 12. May be sealed with resin.
- the end face 22 can be reliably sealed over the entire outer edge of the peelable metal foil 14. For this reason, peeling of the metal foils 16a and 16b in the end face 22 at the time of forming the build-up wiring layer, penetration of the chemical solution into the peeling layer interface, and the like can be further reliably prevented.
- the preferred conditions for this embodiment are as described above.
- the resin layer 12 does not have to have a positioning hole.
- all the positioning holes 18 of the peelable metal foil 14 are formed as non-through holes closed by the resin layer 12 at the time of lamination. Will be.
- the peelable metal foil 14 may have a larger number of positioning holes 18 than the resin layer 12, and in that case, the positioning holes of the peelable metal foil 14 that do not coincide with the positioning holes of the resin layer 12 at the time of lamination. 19 is formed as a non-through hole closed by the resin layer 12. That is, the positioning hole 18 of the peelable metal foil 14 may be filled with a resin as shown in FIG. If the through hole for passing the positioning pin is formed with a diameter smaller than that of the positioning hole 18 in the subsequent drilling process or printed wiring board manufacturing, the hole surface sealing portion 20 remains on the inner peripheral surface of the positioning hole 18. So there is no problem.
- a non-through hole of the laminate 10 may be drilled to form a through hole having a diameter smaller than that of the positioning hole 18. If the through hole is formed with a diameter smaller than that of the positioning hole 18, the hole surface sealing portion 20 can be left on the inner peripheral surface of the positioning hole 18. Will not be damaged.
- a printed wiring board can be preferably produced using the above-described laminate for producing a printed wiring board according to the present invention.
- the laminate for manufacturing a printed wiring board according to the present invention it is possible to effectively peel off the metal layers 16a and 16b in the positioning holes 18 and permeate the chemical solution into the peeling layer interface when forming the build-up wiring layer.
- a printed wiring board on which a build-up wiring layer is formed with high accuracy using the positioning hole can be manufactured with a high yield.
- FIGS. 8A and 8B In the production of the printed wiring board according to the present invention, as shown in FIGS. 8A and 8B, (a) the above-described printed wiring board production laminate 10 is prepared, and (b) the positioning pin P inside the positioning hole 18. The resin layer 30 and optionally a metal foil are laminated on the laminate 10, and (c) the build-up wiring layer 28 is processed by processing the resin layer 30 and optionally the metal foil laminated in step (b). (D) The steps (b) and (c) are repeated in this order to obtain the laminate 26 with a buildup wiring layer. Next, as shown in FIGS.
- an unnecessary region including the positioning hole 18 is cut out from the laminate 26 with a buildup wiring layer to expose a cross section of the peelable metal layer 14
- a support with a buildup wiring layer is separated by a release layer to obtain a multilayer wiring board including a buildup wiring layer, and (h) the multilayer wiring board is processed to obtain a printed wiring board.
- the laminated body 10 for printed wiring board manufacture by this invention (henceforth, laminated body 10) is prepared.
- the configuration of the laminate 10 and the manufacturing method thereof are as described above.
- the number of positioning holes used for one stacking is N 1 and the number of build-up wiring layers to be stacked on one side of the stacked body 10 is N BU
- the stacked body 10 is on one side of the stacked body 10.
- the number of positioning holes in the peelable metal layer is preferably N 1 ⁇ N BU or more (however, N 1 is an integer of 2 or more and N BU is an integer of 1 or more). This is because it is desirable to use a positioning hole 18 different from that at the previous lamination every time one build-up wiring layer is formed.
- the number N 1 of positioning holes used for one stacking is preferably 3 or more, more preferably 4, and in this case, it is particularly preferable that the positioning holes are formed at the four corners of the peelable metal layer 14.
- the number N BU of build-up wiring layers to be laminated on one side of the laminate is preferably 3 or more.
- N 1 is 4
- N BU is 2 or more.
- the positioning hole 18 is formed also for positioning when laminating the peelable metal foil 14 on the resin layer 12
- the number of the positioning holes 18 of the peelable metal layer 14 on one side of the laminate is the number of times of lamination. Increase to N 1 ⁇ (N BU +1) or more.
- a through hole smaller than the positioning hole 18 is formed by drilling the inside of the positioning hole 18 into which the positioning pin P is to be inserted.
- the hole surface sealing portion 20 can be left on the inner peripheral surface of the positioning hole 18, and as a result, the cross section of the peelable metal layer 14 is sufficient. It is possible to prevent the peeling in the positioning hole 18 and the penetration of the chemical solution.
- a positioning pin P is inserted inside the positioning hole 18, and a resin layer 30 (insulating layer) (for forming a build-up wiring layer) and, if desired, a metal foil are laminated. Laminate on top.
- the positioning hole 18 can be formed with a very high accuracy, whereby the resin layer 30 and the like can be laminated at a very accurate position.
- the positioning pin P can have various cross-sectional shapes such as a round shape and a square shape.
- step (C) Build-up wiring layer formation process
- the resin layer 30 (insulating layer) laminated in the above-described process (b) and a metal foil as desired are formed to form the build-up wiring layer 28.
- the build-up method that can be adopted in steps (b) and (c) is not particularly limited, and subtractive method, MSAP (modified semi-additive process) method, SAP (semi-additive) method, full additive method, etc. are used. Is possible.
- MSAP modified semi-additive process
- SAP sini-additive
- full additive method etc.
- the metal foil is etched in combination with the formation of interlayer conduction means 34 such as via holes, and the wiring pattern 32 is formed. Can be formed.
- the wiring pattern 32 can be formed on the surface by a semi-additive method.
- wiring can be formed on the surface of the peelable metal layer 14 prior to the formation of the build-up wiring layer 28 in the step (c). That is, in the first stage of forming the build-up wiring layer 28, the surface of the peelable metal layer 14 is coated with a plating resist or the like to cover a portion other than the portion where the wiring is formed, and the portion where the wiring is formed from copper or the like A wiring pattern may be formed and used in advance. Further, a wiring pattern made of gold, tin, nickel, or the like may be formed in advance at a site where wiring is formed. By doing so, it is possible to obtain the laminate 26 with the build-up wiring layer in a state where the outer layer wiring pattern on the one surface side has already been incorporated.
- step D Repeating process for forming build-up wiring layer
- the build-up wiring layer 28 in which the resin layers 30 and the wiring layers including the wiring patterns 32 are alternately stacked is formed on both surfaces of the laminate 10 (that is, each surface of the peelable metal layer 14).
- a stacked body 26 with a build-up wiring layer as shown in FIGS. 8B and 9A is obtained (however, FIG. 9A shows a state after the subsequent cutting step (e) is performed).
- This process may be repeated until a desired number of build-up wiring layers are formed.
- a solder resist 38 may be formed on the outer layer surface as necessary. Further, the outermost layer surface of the build-up wiring layer may be formed in the subsequent printed wiring board forming step (h).
- the positioning pin P is inserted inside the positioning hole 18 other than the positioning hole in which the positioning pin P has already been inserted. Needless to say, prior to the step (b) in the case of repetition, the positioning pin P already inserted in the previous step (b) should be removed.
- the laminated body 26 with the buildup wiring layer is separated by a release layer to obtain a multilayer wiring board including the buildup wiring layer.
- the laminate 26 with the buildup wiring layer obtained in the above step is separated at the interface between the metal layer 16b and the release layer 15 to obtain the multilayer metal-clad laminate 40 separated from each other. Separation at the interface between the metal layer 16b and the release layer 15 can be performed by peeling off the metal layer 16b and / or the metal layer 16a.
- a multilayer wiring board is processed to obtain a printed wiring board.
- each of the multilayer metal-clad laminates 40 obtained in the separation step is processed into a desired multilayer printed wiring board.
- Various known methods may be adopted as a processing method from the multilayer metal laminate to the multilayer printed wiring board.
- a multilayer printed wiring board can be obtained by etching the metal layer 16b on the outer layer of the multilayer metal-clad laminate 40 to form an outer circuit wiring.
- the metal layer 16b in the outer layer of the multilayer metal-clad laminate 40 can be completely removed by etching and used as it is as a multilayer printed wiring board.
- the metal layer 16b on the outer layer of the multilayer metal-clad laminate 40 is completely removed by etching, and a circuit shape is formed on the surface of the exposed resin layer with a conductive paste, or an outer layer circuit is directly formed by a semi-additive method or the like. It is also possible to form a multilayer printed wiring board by forming it.
- the said example is a manufacture example using the laminated body 10 provided with the peelable metal layer 14 on both surfaces, it can apply similarly regarding the said single side also to the laminated body 10 provided with the peelable metal layer 14 only on one side. Needless to say.
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Abstract
Description
前記樹脂層の少なくとも一方の面に設けられ、剥離層を介して互いに剥離可能に積層されてなる二枚の金属層を備えた剥離性金属層と、
前記剥離性金属層に設けられる位置決め孔と、
前記樹脂層から連続的に前記位置決め孔内に設けられて前記位置決め孔の少なくとも内周面を封止する、前記樹脂を含んでなる孔表面封止部と、
を備えてなる、プリント配線板製造用積層体が提供される。
樹脂を含んでなる樹脂層を用意する工程と、
剥離層を介して互いに剥離可能に積層されてなる二枚の金属箔を備えてなり、位置決め孔が形成された剥離性金属箔を用意する工程と、
前記樹脂層の少なくとも一方の面に前記剥離性金属箔を積層する工程と、
前記樹脂層及び前記剥離性金属箔を加熱しながらプレスし、それにより、前記樹脂を前記加熱により軟化又は流動化させて前記位置決め孔内に行き渡らせて、前記位置決め孔内に露出する前記剥離性金属箔の断面を封止し、積層体を得る工程と、
を含む、方法が提供される。
(a)上記態様の積層体を用意する、又は上記態様の方法に従い積層体を用意する工程と、
(b)前記位置決め孔の内側に位置決めピンを挿入し、樹脂層、又は樹脂層及び金属箔を前記積層体上に積層する工程と、
(c)上記工程(b)で積層された、前記樹脂層、又は前記樹脂層及び前記金属箔を加工してビルドアップ配線層を形成する工程と、
(d)上記工程(b)及び(c)をこの順に繰り返してビルドアップ配線層付積層体を得る工程と、
(e)前記ビルドアップ配線層付積層体から前記位置決め孔を包含する不要な領域を切除して、前記剥離性金属層又は剥離性金属箔の断面を露出させる工程と、
(f)前記ビルドアップ配線層付積層体を前記剥離層で分離して前記ビルドアップ配線層を含む多層配線板を得る工程と、
(g)前記多層配線板を加工してプリント配線板を得る工程と、
を含む、方法が提供される。
図1に本発明によるプリント配線板製造用積層体の一例が示される。図1に示されるように、プリント配線板製造用積層体10(以下、積層体10という)は、樹脂層12と、樹脂層12の少なくとも一方の面に設けられる剥離性金属層14と、剥離性金属層14に設けられる位置決め孔18と、位置決め孔18内に設けられる孔表面封止部20を備えてなる。樹脂層12は樹脂を含んでなる層であり、樹脂以外の成分も含みうる。剥離性金属層14は、剥離層15を介して互いに剥離可能に積層されてなる二枚の金属層16a,16bを備えてなる。孔表面封止部20は、樹脂層12から連続的に位置決め孔18内に設けられて位置決め孔18の少なくとも内周面(すなわち剥離性金属層14の断面)を封止する部分であり、樹脂層12の樹脂を含んでなる。孔表面封止部20は、図1に示されるように位置決め孔18を完全に塞ぐものであってもよいし、例えば図2に示されるように位置決め孔18の内周面(すなわち剥離性金属層14の断面)のみを封止する構成としてもよく、その場合には位置決め孔18の内側に貫通孔が存在しうる。位置決め孔18内の一部又は全部が樹脂で塞がれ非貫通孔とされている場合であっても、プリント配線板製造時に位置決めピンを通すための貫通孔を位置決め孔18よりも小さい径で形成すれば、孔表面封止部20は位置決め孔18の内周面に残存させることができる。いずれにしても、剥離性金属層14に位置決め孔18が予め形成されていることで、本発明のプリント配線板製造用積層体のユーザーは精緻さが要求されるが故に煩雑な作業である剥離性金属層14への位置決め孔18の形成を省略することができる。
樹脂層12は、樹脂、好ましくは絶縁性樹脂を含んでなる。樹脂層12はプリプレグ及び/又は樹脂シートであるのが好ましく、より好ましくはプリプレグである。プリプレグとは、合成樹脂板、ガラス板、ガラス織布、ガラス不織布、紙等の基材に合成樹脂を含浸させた複合材料の総称である。したがって、樹脂層12がプリプレグで構成される場合、プリプレグに含浸される樹脂で孔表面封止部20を構成することができる。プリプレグに含浸される絶縁性樹脂の好ましい例としては、エポキシ樹脂、シアネート樹脂、ビスマレイミドトリアジン樹脂(BT樹脂)、ポリフェニレンエーテル樹脂、フェノール樹脂等が挙げられる。また、樹脂シートを構成する絶縁性樹脂の例としては、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂等の絶縁樹脂が挙げられる。また、樹脂層12には絶縁性を向上する等の観点からシリカ、アルミナ等の各種無機粒子からなるフィラー粒子等が含有されていてもよい。樹脂層12の厚さは特に限定されないが、3~1000μmが好ましく、より好ましくは5~400μmであり、さらに好ましくは10~200μmである。
剥離性金属層14(典型的には剥離性金属箔)は、剥離層15を介して互いに剥離可能に積層されてなる二枚の金属層16a,16b(典型的には二枚の金属箔)を備えてなる。二枚の金属層16a,16bは剥離層15を剥離界面として互いに所望の引き剥がし強さで剥離可能なものであるのが好ましい。金属層16a,16bは互いに同種の金属層であってもよいし、異種の金属層であってもよい。金属層16a,16bの各々はアルミニウム、銅、ステンレス、ニッケル等であってよく、好ましくは銅である。また、金属層16a,16bの各々の厚さは特に限定されないが、好ましくは0.1~200μm、より好ましくは0.5~35μm、さらに好ましくは1~18μmである。いずれにしても、剥離性金属層14はキャリア箔付金属箔に代表されるような公知のものを用いればよく、市販の製品であってよい。キャリア箔付金属箔は公知の構成であってよく、二枚の金属層16a,16bのいずれをキャリア箔としてもよい。
位置決め孔18は剥離性金属層14に設けられる孔である。樹脂層12には位置決め孔18を設けなくてよく、それ故、位置決め孔18は樹脂層12で塞がれた非貫通孔でありうる。もっとも、樹脂層12の両面に剥離性金属層14を設ける場合や樹脂層12と大きさの異なる剥離性金属層14を設ける場合等に精度良く位置決めを行いたい場合には樹脂層12にも位置決め孔を設けた状態で積層体10が製造されるのが好ましく、この場合、積層体10において剥離性金属層14の位置決め孔18が樹脂層12にまで連通して貫通孔をもたらす構成となりうる。位置決め孔18の形状は、円形、三角形、四角形等の様々な形状であってよく、好ましくは円形である。円形の場合、位置決め孔18の直径は1~10mmが好ましく、より好ましくは2~5mmである。位置決め孔18は積層時(例えばビルドアップ配線層形成時)に位置決めピンが挿入されることが予定されているため、その形状及び大きさは、位置決めピンを引き抜いた際に位置決め孔18の内周面に樹脂を残存させて孔表面封止部20の機能を保持できるように設計されるのが好ましい。例えば、剥離性金属層14の位置決め孔18の径は、使用が想定される位置決めピンの径に対して1.01~3倍とするのが好ましく、より好ましくは1.05~2倍である。位置決め孔18は剥離性金属層14の外縁近傍に設けられるのが好ましい。この外縁近傍は、製品として使用されない領域であればよく、例えば剥離性金属層14の外縁から5~20mm内側の領域である。こうすることでプリント配線板として使用可能な有効エリアを広くすることができる。
孔表面封止部20は、樹脂層12から連続的に位置決め孔18内に設けられて位置決め孔18の少なくとも内周面(剥離性金属層14の断面に相当する)を封止する。このように孔表面封止部20は樹脂層12との連続性を有し、それ故、樹脂層12の樹脂を含んで構成される。すなわち、孔表面封止部20は樹脂層12とシームレスにつながっている。したがって、位置決め孔18内における剥離性金属層14の断面を確実に封止することができる。このため、ビルドアップ配線層形成時における位置決め孔18内における金属層16a,16bの剥がれや剥離層界面への薬液の染み込み等を効果的に防止することができる。その意味で、位置決め孔18の内周面には剥離性金属層14の断面が露出していないのが好ましい。
剥離性金属層14の外縁の端面22には端面封止部24がさらに設けられるのが好ましい。この端面封止部24は、樹脂層12から連続して剥離性金属層14の外縁の端面22に設けられてこの端面22(剥離性金属層14の断面に相当する)を封止する。このように端面封止部24も、孔表面封止部20と同様、樹脂層12との連続性を有し、それ故、樹脂層12の樹脂を含んで構成される。すなわち、端面封止部24は樹脂層12とシームレスにつながっている。したがって、剥離性金属層14の外縁の端面22を確実に封止することができる。このため、ビルドアップ配線層形成時における端面22内における金属層16a,16bの剥がれや剥離層界面への薬液の染み込み等を効果的に防止することができる。特に、剥離性金属層14が樹脂層12と同じ大きさの場合は、端面22をテープ等でマスキングして薬液の染み込みを防止することが従前行われていたが、端面封止部24を予め備えていることで、そのような煩雑なマスキングが不要となり、製造工程の簡略化を図ることができる。その意味で、端面22には剥離性金属層14の断面が露出していないのが好ましい。
本発明によるプリント配線板製造用積層体は、図6及び7に示されるように、(A)樹脂層12と、位置決め孔18が形成された剥離性金属箔14とを用意し、(B)樹脂層12の少なくとも一方の面に剥離性金属箔14を積層し、(C)樹脂層12及び剥離性金属箔14を加熱しながらプレスし、それにより、樹脂層12の樹脂を加熱により軟化又は流動化させて位置決め孔18内に行き渡らせて、位置決め孔18内に露出する剥離性金属箔14の断面を封止することにより製造するのが好ましい。なお、図7に示される製造工程は位置決めピンPを用いて樹脂層12の両面に剥離性金属箔14,14を設ける態様であるが、本発明はこれに限定されず、例えば、図6に示されるように樹脂層12の片面にのみ位置決めピンPを用いないで剥離性金属箔14を積層する態様であってもよい。
樹脂層12を用意する。樹脂層12は、樹脂、好ましくは絶縁性樹脂を含んでなる。樹脂層12はプリプレグ及び/又は樹脂シートであるのが好ましく、より好ましくはプリプレグである。プリプレグとは、合成樹脂板、ガラス板、ガラス織布、ガラス不織布、紙等の基材に合成樹脂を含浸させた複合材料の総称である。したがって、樹脂層12がプリプレグで構成される場合、プリプレグに含浸される樹脂で孔表面封止部20を構成することができる。プリプレグに含浸される絶縁性樹脂の好ましい例としては、エポキシ樹脂、シアネート樹脂、ビスマレイミドトリアジン樹脂(BT樹脂)、ポリフェニレンエーテル樹脂、フェノール樹脂等が挙げられる。また、樹脂シートを構成する絶縁性樹脂の例としては、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂等の絶縁樹脂が挙げられる。また、樹脂層12には絶縁性を向上する等の観点からシリカ、アルミナ等の各種無機粒子からなるフィラー粒子等が含有されていてもよい。樹脂層12の厚さは特に限定されないが、3~1000μmが好ましく、より好ましくは5~400μmであり、さらに好ましくは10~200μmである。なお、図7に示される樹脂層12には位置決め孔19が設けられているが、位置決めに支障を来さないかぎり、樹脂層12に位置決め孔19を設けない構成としてもよいことについては前述したとおりである。なお、位置決め孔19の形成は、ドリル加工やレーザー加工等の公知の手法により行えばよいが、位置決め孔19の加工による樹脂粉等の飛散防止の観点から、レーザー加工が好ましい。また、予め樹脂層12を孔加工用の保護フィルムやレーザー吸収フィルム等で挟持しておき、その後位置決め孔19の形成及び保護フィルム等の剥離を行う方法も採用することができる。
樹脂層12の少なくとも一方の面に剥離性金属箔14を積層する。この積層は、通常のプリント配線板製造プロセスにおいて銅箔とプリプレグ等との積層に採用される公知の条件及び手法に従って行えばよいが、剥離性金属箔14及び樹脂層12を所望の精度で位置決めして行うのが好ましい。例えば、図7に示されるように、樹脂層12も位置決め孔19を備えてなり、樹脂層12の位置決め孔19が剥離性金属箔14に形成された位置決め孔18と対応して貫通孔を形成するように積層してもよい。こうすることで、貫通孔を基準に樹脂層12と剥離性金属箔14との位置決めをより正確に行うことができる。
積層した樹脂層12及び剥離性金属箔を加熱しながらプレスし、それにより、樹脂を加熱により軟化又は流動化させて位置決め孔18内に行き渡らせて、位置決め孔18内に露出する剥離性金属箔14の断面を封止し、積層体10を得る。こうすることで、孔表面封止部20を樹脂層12とシームレスにつながった形態で形成することができる。したがって、位置決め孔18内における剥離性金属箔14の断面を確実に封止することができる。このため、ビルドアップ配線層形成時における位置決め孔18内における金属箔16a,16bの剥がれや剥離層界面への薬液の染み込み等を効果的に防止することができる。その意味で、位置決め孔18の内周面で剥離性金属箔14の断面が露出しないようにプレスを行うのが好ましい。プレス時の加熱温度は加熱により樹脂を軟化又は流動化可能な温度であれば特に限定されないが、好ましくは100~350℃、より好ましくは150~250℃である。
所望により、プレス後に、積層体10の非貫通孔を穿孔して、位置決め孔18よりも小さい径の貫通孔を形成してもよい。貫通孔を位置決め孔18よりも小さい径で形成すれば、孔表面封止部20を位置決め孔18の内周面に残存させることができるので、孔表面封止部20によってもたらされる所期の効果が損なわれることはない。
上述した本発明によるプリント配線板製造用積層体を用いて、プリント配線板を好ましく製造することができる。特に、本発明のプリント配線板製造用積層体を用いることで、ビルドアップ配線層形成時において、位置決め孔18内における金属層16a,16bの剥がれや剥離層界面への薬液の染み込み等を効果的に防止することができ、その結果、位置決め孔を用いて高精度にビルドアップ配線層が形成されたプリント配線板を高い歩留まりで製造することが可能となる。
本発明によるプリント配線板製造用積層体10(以下、積層体10)を用意する。積層体10の構成及びその製造方法については前述したとおりである。積層体10は、1回の積層に用いられる位置決め孔の数をN1、積層体10の片側に積層されるべきビルドアップ配線層の数をNBUとした場合に、積層体10の片面における剥離性金属層の位置決め孔の数が、N1×NBU以上である(ただし、N1が2以上の整数であり、NBUが1以上の整数である)のが好ましい。これは、ビルドアップ配線層を1層形成する度に前回積層時とは別の位置決め孔18を使用することが望ましいからである。1回の積層に用いられる位置決め孔の数N1は好ましくは3以上であり、より好ましくは4であり、この場合、剥離性金属層14の四隅に形成されるのが特に好ましい。積層体の片側に積層されるべきビルドアップ配線層の数NBUは3以上が好ましい。例えば、N1が4であり、かつ、NBUが2以上であるのが好ましい。なお、樹脂層12に剥離性金属箔14を積層させる際の位置決め用にも位置決め孔18を形成した場合、積層体の片面における剥離性金属層14の位置決め孔18の数は積層回数が1回増えてN1×(NBU+1)以上となる。
図8Aに示されるように、位置決め孔18の内側に位置決めピンPを挿入し、(ビルドアップ配線層形成用の)樹脂層30(絶縁層)及び所望により金属箔を積層体上に積層する。本発明の積層体10においては高精度に位置決め孔18を極めて高い精度で形成することができ、それにより樹脂層30等を極めて正確な位置で積層させることができる。位置決めピンPは丸型、角型等の種々の断面形状であることができる。
図8Aに示されるように、上記工程(b)で積層された樹脂層30(絶縁層)及び所望により金属箔を加工してビルドアップ配線層28を形成する。工程(b)及び(c)において採用可能なビルドアップ工法は特に限定されず、サブトラクティブ法、MSAP(モディファイド・セミ・アディティブ・プロセス)法、SAP(セミアディティブ)法、フルアディティブ法等が使用可能である。例えば、樹脂層30及び銅箔に代表される金属箔を同時にプレス加工で張り合わせる場合は、ビアホール等の層間導通手段34の形成と組み合わせて、当該金属箔をエッチング加工して、配線パターン32を形成することができる。また、剥離性金属層14の表面に樹脂層30のみをプレス加工により張り合わせる場合は、その表面にセミアディティブ法で配線パターン32を形成することもできる。
上記工程(b)及び(c)をこの順に繰り返してビルドアップ配線層付積層体26を得る。この工程では、積層体10の両面(すなわち剥離性金属層14の各表面)に、樹脂層30と配線パターン32を含む配線層とを交互に積層配置したビルドアップ配線層28を形成して、図8B及び図9Aに示されるようなビルドアップ配線層付積層体26を得る(ただし、図9Aは後続の切除工程(e)が施された後の状態を示している)。この工程の繰り返しは所望の層数のビルドアップ配線層が形成されるまで行えばよい。この段階で、必要に応じて、外層面にソルダーレジスト38を形成してもよい。また、ビルドアップ配線層の最外層面は後続プリント配線板の形成工程(h)で外層配線パターン36形成してもよい。
ビルドアップ配線層付積層体26から位置決め孔18を包含する不要な領域を切除して、剥離性金属層14の断面を露出させる。これは、位置決め孔18を有する領域は製品化に適さないためである。また、剥離性金属層14の断面を露出させることで、後続の分離工程(f)において金属層16bを他方の金属層16aから分離しやすくなる。
ビルドアップ配線層付積層体26を剥離層で分離して前記ビルドアップ配線層を含む多層配線板を得る。この工程では、上記工程により得られたビルドアップ配線層付積層体26を、金属層16bと剥離層15との界面で分離して、互いに分離された多層金属張積層板40を得る。金属層16bと剥離層15との界面での分離は、金属層16b及び/又は金属層16aを引き剥がすことにより行うことができる。
多層配線板を加工してプリント配線板を得る。この工程では、上記分離工程により得られた多層金属張積層板40の各々を用いて、所望の多層プリント配線板に加工する。多層金属積層板から多層プリント配線板への加工方法は公知の種々の方法を採用すればよい。例えば、多層金属張積層板40の外層にある金属層16bをエッチング加工して外層回路配線を形成して、多層プリント配線板を得ることができる。また、多層金属張積層板40の外層にある金属層16bを、完全にエッチング除去し、そのままの状態で多層プリント配線板として使用することもできる。さらに、多層金属張積層板40の外層にある金属層16bを、完全にエッチング除去し、露出した樹脂層の表面に、導電性ペーストで回路形状を形成する又はセミアディティブ法等で外層回路を直接形成する等して多層プリント配線板とすることも可能である。
Claims (26)
- 樹脂を含んでなる樹脂層と、
前記樹脂層の少なくとも一方の面に設けられ、剥離層を介して互いに剥離可能に積層されてなる二枚の金属層を備えた剥離性金属層と、
前記剥離性金属層に設けられる位置決め孔と、
前記樹脂層から連続的に前記位置決め孔内に設けられて前記位置決め孔の少なくとも内周面を封止する、前記樹脂を含んでなる孔表面封止部と、
を備えてなる、プリント配線板製造用積層体。 - 前記位置決め孔が剥離性金属層の外縁近傍に設けられる、請求項1に記載の積層体。
- 前記位置決め孔の内周面には前記剥離性金属層の断面が露出していない、請求項1又は2に記載の積層体。
- 前記樹脂層から連続して前記剥離性金属層の外縁の端面に設けられて該端面を封止する、前記樹脂を含んでなる端面封止部をさらに備えてなる、請求項1~3のいずれか一項に記載の積層体。
- 前記端面には前記剥離性金属層の断面が露出していない、請求項4に記載の積層体。
- 前記樹脂層が前記剥離性金属層よりも面積が大きく、前記剥離性金属層の外縁が前記樹脂層の外縁よりも内側に位置し、前記端面封止部が前記剥離性金属層の外縁の全域にわたって形成されてなる、請求項4又は5に記載の積層体。
- 前記樹脂層がプリプレグ及び/又は樹脂シートである、請求項1~6のいずれか一項に記載の積層体。
- 前記剥離性金属層が前記樹脂層の両面に設けられてなり、該両面の剥離性金属層の位置決め孔が互いに一致する、請求項1~7のいずれか一項に記載の積層体。
- 前記樹脂層も位置決め孔を備えてなり、該位置決め孔が前記剥離性金属層に形成された位置決め孔と対応して貫通孔を形成する、請求項1~8のいずれか一項に記載の積層体。
- 前記樹脂層が位置決め孔を有していないか、又は前記剥離性金属層が前記樹脂層よりも多い数の位置決め孔を有しており、それにより前記剥離性金属層の位置決め孔の全て、又は前記樹脂層の位置決め孔と一致しない前記剥離性金属層の位置決め孔が非貫通孔として形成される、請求項1~9のいずれか一項に記載の積層体。
- プリント配線板製造用積層体の製造方法であって、
樹脂を含んでなる樹脂層を用意する工程と、
剥離層を介して互いに剥離可能に積層されてなる二枚の金属箔を備えてなり、位置決め孔が形成された剥離性金属箔を用意する工程と、
前記樹脂層の少なくとも一方の面に前記剥離性金属箔を積層する工程と、
前記樹脂層及び前記剥離性金属箔を加熱しながらプレスし、それにより、前記樹脂を前記加熱により軟化又は流動化させて前記位置決め孔内に行き渡らせて、前記位置決め孔内に露出する前記剥離性金属箔の断面を封止し、積層体を得る工程と、
を含む、方法。 - 前記位置決め孔が剥離性金属箔の外縁近傍に設けられる、請求項11に記載の方法。
- 前記プレスの際、前記軟化又は流動化された樹脂を前記剥離性金属箔の外縁の端面にも行き渡らせて、前記端面に露出する前記剥離性金属箔の断面をも封止する、請求項11又は12に記載の方法。
- 前記樹脂層が前記剥離性金属箔よりも面積が大きく、前記剥離性金属箔の外縁が前記樹脂層の外縁よりも内側に位置し、それにより前記剥離性金属箔の外縁の全域が前記樹脂で封止される、請求項11~13のいずれか一項に記載の方法。
- 前記樹脂層がプリプレグ及び/又は樹脂シートである、請求項11~14のいずれか一項に記載の方法。
- 前記積層工程において、前記樹脂層の両面に前記剥離性金属箔が積層され、その際、前記両面の剥離性金属箔の位置決め孔が互いに一致するように前記積層が行われる、請求項11~15のいずれか一項に記載の方法。
- 前記樹脂層も位置決め孔を備えてなり、該樹脂層の位置決め孔が前記剥離性金属箔の位置決め孔と対応して貫通孔を形成するように前記積層が行われる、請求項11~16のいずれか一項に記載の方法。
- 前記積層工程が、前記貫通孔に位置決めピンを挿入して前記積層体の位置決めを行う工程を含み、かつ、前記方法が、前記プレス後に前記位置決めピンを引き抜く工程をさらに含んでなる、請求項17に記載の方法。
- 前記樹脂層が位置決め孔を有していないか、又は前記剥離性金属箔が前記樹脂層よりも多い数の位置決め孔を有しており、それにより前記積層時に前記剥離性金属箔の位置決め孔の全て、又は前記樹脂層の位置決め孔と一致しない前記剥離性金属箔の位置決め孔が、前記樹脂層で塞がれた非貫通孔として形成される、請求項11~18のいずれか一項に記載の方法。
- 前記プレス後に、前記積層体の前記非貫通孔を穿孔して、前記位置決め孔よりも小さい径の貫通孔を形成する工程をさらに含む、請求項19に記載の方法。
- プリント配線板の製造方法であって、
(a)請求項1~10のいずれか一項に記載の積層体を用意する、又は請求項11~20のいずれか一項に記載の方法に従い積層体を用意する工程と、
(b)前記位置決め孔の内側に位置決めピンを挿入し、樹脂層、又は樹脂層及び金属箔を前記積層体上に積層する工程と、
(c)上記工程(b)で積層された、前記樹脂層、又は前記樹脂層及び前記金属箔を加工してビルドアップ配線層を形成する工程と、
(d)上記工程(b)及び(c)をこの順に繰り返してビルドアップ配線層付積層体を得る工程と、
(e)前記ビルドアップ配線層付積層体から前記位置決め孔を包含する不要な領域を切除して、前記剥離性金属層又は剥離性金属箔の断面を露出させる工程と、
(f)前記ビルドアップ配線層付積層体を前記剥離層で分離して前記ビルドアップ配線層を含む多層配線板を得る工程と、
(g)前記多層配線板を加工してプリント配線板を得る工程と、
を含む、方法。 - 前記(d)工程において繰り返される場合の前記(b)工程において、前記位置決めピンが、既に位置決めピンが挿入された位置決め孔以外の位置決め孔の内側に挿入される、請求項21に記載の方法。
- 前記(b)工程が、前記位置決めピンの挿入に先立ち、前記位置決めピンが挿入されるべき位置決め孔の内側を穿孔して、前記位置決め孔よりも小さい貫通孔を形成する工程をさらに含む、請求項21又は22に記載の方法。
- 1回の積層に用いられる位置決め孔の数をN1、前記積層体の片側に積層されるべき前記ビルドアップ配線層の数をNBUとした場合に、前記(a)工程で用意される積層体の片面における前記剥離性金属層又は剥離性金属箔の位置決め孔の数が、N1×NBU以上である(ただし、N1が2以上の整数であり、NBUが1以上の整数である)、請求項21~23のいずれか一項に記載の方法。
- 前記N1が4であり、かつ、前記NBUが2以上である、請求項24に記載の方法。
- 前記(c)工程におけるビルドアップ配線層の形成に先立ち、前記剥離性金属層又は剥離性金属箔の表面に配線を形成する工程をさらに含んでなる、請求項21~25のいずれか一項に記載の方法。
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