WO2016026749A1 - Module optique muni d'un porte-objectif et carte de circuit imprimé à contact thermo-conducteur - Google Patents

Module optique muni d'un porte-objectif et carte de circuit imprimé à contact thermo-conducteur Download PDF

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Publication number
WO2016026749A1
WO2016026749A1 PCT/EP2015/068554 EP2015068554W WO2016026749A1 WO 2016026749 A1 WO2016026749 A1 WO 2016026749A1 EP 2015068554 W EP2015068554 W EP 2015068554W WO 2016026749 A1 WO2016026749 A1 WO 2016026749A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
rivet
camera
optical module
thermally conductive
Prior art date
Application number
PCT/EP2015/068554
Other languages
German (de)
English (en)
Inventor
Andrej Kholopov
Original Assignee
Basler Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basler Ag filed Critical Basler Ag
Publication of WO2016026749A1 publication Critical patent/WO2016026749A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Definitions

  • the invention relates to an optical module and a method for its production for a camera device, such as, for example, a so-called board-level camera, in which a lens carrier or lens holder is integrated directly with the circuit board of the image sensor chip.
  • the aim of the board-level camera is a powerful and cost-effective plug-and-play solution, especially for automated optical monitoring in the electronics and semiconductor industries.
  • the compact design which can be smaller than a credit card, should facilitate integration into many systems. With the achievable low weight, the camera is also suitable for robotics applications.
  • the printed circuit board (mini-board) has a power loss of approx. 1.8 W for powerful image sensors (eg Complementary Metal Oxide Semiconductor (CMOS) sensors). With such small dimensions, thermal management plays an important role and it is a challenge to derive the heat from the circuit board as efficiently as possible. For a good heat conduction, a large contact surface between the printed circuit board and the front part (lens carrier) is advantageous. Furthermore, a firm connection between the circuit board and front part, a dust-proof sensor space and a high optical accuracy of the board-level camera should be ensured, the sensor position accuracy directly depends on the attachment of the circuit board to the front part. Due to the compact design of such cameras, however, the usual attachment method is not applicable. In the case of board-level cameras, an artificial lens holder is usually fastened with two or four screws to the printed circuit board containing the image sensor. In the circuit board usually four holes are introduced through which screws can be inserted from the front as from behind.
  • CMOS Complementary Metal Oxide Semiconductor
  • the invention has for its object to provide a board-level camera, in which the circuit board space-saving, inexpensive, easy to install and safe / can be firmly attached to the lens support, at the same time the heat loss of the electronics can be well derived.
  • the printed circuit board is connected to the carrier device (for example a plastic lens carrier) via the thermally conductive (eg metallic or made of another thermally conductive material) rivet-like connection.
  • the carrier device for example a plastic lens carrier
  • the thermally conductive (eg metallic or made of another thermally conductive material) rivet-like connection At least a direct heat-conducting contact with the printed circuit board is produced by the heat-conducting rivet-type connection and the rivet-like connection can simultaneously serve as a contact surface for the fastening elements in the camera mounting, so that optimum heat transport from the printed circuit board is realized.
  • the proposed attachment via the rivet-type connection can include the functions of holding the circuit board, screwing the camera device (in a hollow rivet-like connection), attaching the circuit board to the camera body, providing attachment points for the Camera and dissipating the heat in a single component.
  • the new camera can be made much smaller than conventional cameras and an advantageous thermal management / cooling concept can be provided.
  • the riveting against screwing is an ergonomic and easy-to-assemble fastener, since no tools must be performed.
  • riveting offers a much faster and more stable fastening process than screwing.
  • riveting unlike screwing, can be performed from the bottom. This makes it possible to carry out further work steps at the mounting location of the camera, such as cleaning the image sensor, for which the sensor would normally not be accessible.
  • the at least one rivet-type connection can have a tubular cross-section for carrying out a fastening screw for fastening the camera device.
  • the circuit board with hollow rivets, blind rivets, tubular rivets, press-fit sleeves or the like be connected to the carrier device (for example, a plastic lens carrier). Through the remaining hole in the rivet then a fastening screw (eg. The size M2 or the like.) Can be inserted.
  • the rivet-like connection can also be formed by a mounted on the circuit board frame with integrated press-fit.
  • the rivets can be arranged so that they are in direct metallic or thermally conductive contact with the circuit board and at the same time as contact / contact surface for the fastening elements of the camera device at the customer, so that an optimal heat transfer from the circuit board is feasible.
  • the rivet-like connection can identify a réelleschraubgewinde for screwing the mounting screw.
  • the rivet connection can also be used directly for fastening the camera device or the camera lens to the optical module or a fastening element for the camera device.
  • the outer contour of the printed circuit board can be fitted into the carrier device.
  • a good optical accuracy can be achieved because the circuit board can be positively secured to the support device.
  • the printed circuit board has a substantially square shape and is fastened at its corners via four of the rivet-like connections to the carrier device.
  • FIG. 1 shows from left to right a front, side and rear view of an optical module of a board-level camera according to a first exemplary embodiment of the present invention
  • FIG. 2 shows two perspective exploded views from obliquely anterior or obliquely rearward direction onto the optical module according to the first exemplary embodiment
  • 3 is a sectional view of a spacer bolt according to a second embodiment
  • 4 is a sectional view of a solderable socket according to a third embodiment
  • 5A and 5B show a sectional view of an optical module with tubular rivets and a side view of a tubular rivet according to a fourth embodiment
  • FIG. 6A and 6B front, side and rear view of an optical module with mounting frame with press-fit pins and a perspective view of the mounting frame according to a fifth embodiment
  • FIG. 7 shows from left to right a side view and perspective front and rear views of an optical module fastened to a fastening element with the rear side according to various embodiments
  • FIG. 8 shows from left to right a side view and perspective front and rear views of an optical module fastened to the front side on a fastening element according to various embodiments.
  • FIG. 9 shows a side sectional view from top to bottom as well as two perspective exploded views from an obliquely rearward or obliquely anterior direction to the optical module according to the first exemplary embodiment for illustrating the heat conduction.
  • a board-level camera with modified and thus more effective attachment of the circuit board to the lens carrier (carrier device) will be described.
  • Fig. 1 shows a front, side and rear view (from left to right) of an optical module of a board-level camera according to a first embodiment.
  • the optical module comprises a lens holder or lens carrier 60 made of plastic with a flange-like cylindrical projection 20 for snug fitting a camera lens (not shown).
  • the lens carrier 60 has through holes, blind holes or blind hole thread into which metallic hollow rivets 10 for fixing a printed circuit board 50 are pressed.
  • rivets or fasteners with a blind hole (no through hole) and internal thread can be used.
  • the fastening screws eg for a camera installation at a customer
  • spacer bolts with an internal thread can be used as fastening elements. Internal threads are both at the
  • the lens carrier 60 with the holes 62 can have a region of plastic (about 3 mm on the front side) for tapping by means of commercially available screws only on the front side. This allows the customer or user to easily attach the camera or the camera lens from the front by screwing the screws in the plastic area without passing the screws.
  • the printed circuit board As can be seen from the middle side view and the right-hand rear view in FIG. 1, 50 are different on the printed circuit board. dene components and integrated circuits for the electronic image acquisition and processing, for example, in surface-mounted device (SMD) technology applied. Furthermore, the printed circuit board has a connection region 52 for an interface (USB, GigE or the like) for data transmission and / or control of the camera.
  • the camera itself can be used, for example, as a peripheral element for a computer or a central unit.
  • Fig. 2 shows two perspective exploded views obliquely forward or obliquely rearward direction of the optical module according to the first embodiment.
  • this exploded view also called exploded view
  • the hollow rivets 10 with the provided on the outer circumference Fixierrillen are clearly visible.
  • the image sensor 30 configured as an integrated circuit or chip for capturing images and additional through holes in the printed circuit board 50 for the hollow rivets 10 are also clearly visible in the left-hand view of FIG.
  • the inner wall of the through-bores 62 of the objective carrier 60 can have web-like beads or ribs in the axial direction, so that better fixing of the hollow rivets 10 is ensured by means of their outer grooves.
  • the web-like axial ridges or ribs for the secure fixed rivet connection of the circuit board 50 to the lens carrier 60 may also be provided only as deep as is necessary for the rivet.
  • an improved removal of the heat generated in the circuit board due to the local power loss heat can be achieved.
  • riveting is a faster, more stable and easy-to-install fastener and can be performed from the bottom.
  • the optical module can thus be manufactured by providing the printed circuit board 50 with image sensor 30 and other circuit components.
  • the through holes 62 are introduced, which are to be used for mounting a camera lens or the camera and the circuit board 50.
  • the circuit board 50 may then be secured to the lens mount 60 by inserting or fitting the metallic rivets 10 or other metallic rivet-type connections (such as blind rivets, tubular rivets, press-fit sleeves, bushings, or the like) into the through-bore 62.
  • This leads to an automatic metallic and therefore thermally conductive contacting the hollow rivets 10 with the circuit board or such contact can by complementary measures such as. Soldering, plating or the like. be achieved.
  • the camera lens or the camera can then be attached to the lens carrier 60 or a fastening element in a further step by means of a fastening screw passed or screwed through the then existing through hole in the riveted connection.
  • a fastening screw passed or screwed through the then existing through hole in the riveted connection.
  • the outer contour of the printed circuit board 50 may optionally be fitted in a corresponding recess of the lens carrier 60, so that a good optical alignment is achieved. This is, for example, in the first embodiment shown in FIG. 2 recognizable.
  • rivet-like fastening solutions for heat dissipation There are various alternative rivet-like fastening solutions for heat dissipation conceivable.
  • Fig. 3 shows a sectional view of a spacer bolt according to a second embodiment.
  • the standoff pin has a hexagon head with an internal bore and a narrower cylindrical foot portion for insertion into the bore of the lens mount 60.
  • a spacer rivets can be used. By using such a spacer bolt or spacer rivets, a predetermined distance above the printed circuit board 50 can be ensured when screwing fasteners.
  • Fig. 4 shows a sectional view of a solderable socket according to a third embodiment.
  • the circuit board 50 is fastened by means of a rivet-like bushing with internal thread.
  • the attachment process can, for example, be simplified by an automatically mountable and solderable socket. This allows the fixing screw used to attach the camera lens or camera to be screwed directly into the socket.
  • the printed circuit board 50 can also be fastened by means of a rivet-type bushing with unthreaded bore.
  • the fastening screw used to fasten the camera lens or the camera can only be passed through the unthreaded bushing and must be screwed on elsewhere.
  • FIG. 5A and 5B show a sectional view of an optical module with tubular rivets 10 and a single tubular rivet 10 with internal thread according to a fourth embodiment.
  • the tube rivet 10 does not have to extend over the entire through hole of the lens carrier 60.
  • the heat conduction contact can then also be achieved by means of the fastening screw (not shown) of the camera lens or other fastening elements screwed in from the other side.
  • the printed circuit board 50 may also be fastened by means of a rivet-type press-fit bushing with or without an internal thread.
  • the Einpressbuchse has a larger end face, so that a simplified pressurization for pressing is possible.
  • FIGS. 6A and 6B show front, side and rear views of an optical module with mounting frames 70 with press-fit pins 72 and a perspective view, respectively, of the mounting frame according to a fifth embodiment.
  • the mounting frame can be manufactured as a molded plastic part from a good heat-conducting plastic, wherein the integrated press-fit pins 72 are attached later or can be present directly in the injection mold.
  • the fastening frame 70 also has recesses for the connection region 52 so that it remains accessible after the mounting frame 70 has been mounted.
  • the press-fit pins 72 of the mounting frame 70 are pressed into the lens carrier 60 through corresponding holes in the printed circuit board 50, so that the printed circuit board 50 is clamped between the lens carrier 60 and the mounting frame 70. Due to the optional cutouts at the corners of the mounting frame 70, further bores of the lens carrier 60 also remain accessible from the circuit board side.
  • 7 and 8 show mounting possibilities of the optical module on a fastening element 80 (for example a sheet metal, a plate, or the like) for achieving good heat dissipation from the printed circuit board 50.
  • 7 shows a side view and perspective front and rear views of an optical module fastened to the rear side on the fastening element 80 according to various exemplary embodiments.
  • the fastening element 80 can serve for fastening the optical module or the camera in a user device or a user system.
  • the heat is dissipated via the rivet-like connection according to the aforementioned embodiments directly into the fastener 80.
  • the proposed solution is therefore very space-saving because the attachment points of the camera and the heat transport paths are combined.
  • FIG. 8 shows a side view and perspective front and rear views of an optical module fastened to the front side on the fastening element 80 according to various exemplary embodiments.
  • the heat is dissipated via the rivet-like connection according to the aforementioned embodiments to the front in the fastening screws for the camera.
  • This solution is very space-saving, because the attachment points of the camera are also united here.
  • the circuit board has on the upper side a first metallization 54 (eg copper layer) as annular contact surfaces for the nodes (which are soldered or pressed on), so that a first heat transport path from the circuit board into the rivets results.
  • the printed circuit board has a second metallization 56 (eg, copper layer, also multi-layered) on the lower side facing the microscope slide for the ective carrier, so that a second heat transport path from the printed circuit board results directly in the objective carrier.
  • a first metallization 54 eg copper layer
  • second metallization 56 eg, copper layer, also multi-layered
  • heat dissipation takes place on the one hand from the lower side of the printed circuit board to the lens carrier and on the other hand from the printed circuit board to the respective rivet and from the respective rivet to the lens carrier.
  • the circuit board is connected by the first and second metallization 54 and 56 to the metallized bearing or contact surfaces good thermal conductivity, thereby providing improved thermal conductivity.
  • the presented alternative solutions according to the exemplary embodiments can be used in connection with a wide variety of image recording devices and camera devices in which a printed circuit board is integrated directly with a lens carrier.
  • other fastening solutions with fewer rivet connections by combination with other fixing or locking means are conceivable and included within the scope of the appended claims.
  • sufficient heat dissipation can be achieved by solid rivets, provided that they are contacted on the camera side with metallic or heat-conducting surfaces or components.
  • an optical module and a method for its production have been described, for use with a camera device, comprising a printed circuit board 50 with image sensor 30 and a support device 60 provided for attaching a camera lens of the camera device, wherein the support device
  • the circuit board 50 has at least one bore 62 for attachment of the camera apparatus, wherein the circuit board 50 is secured by means of at least one in a bore 62 of the support device 60 heat conductive rivet-like compound 10 to the support device 60, and wherein the rivet-like connection 10 with the Printed circuit board 50 is thermally conductive (eg, metallic or via a thermally conductive material) contacted.
  • the printed circuit board 50 can thus be connected to the carrier device (for example plastic lens carrier) by means of thermally conductive rivet-like connections (for example hollow rivets). If the rivet-like compound as Einpresshülse, blind rivets, hollow rivets or the like. is configured, a hole remains in the connection through which a fixing screw for the camera device can be performed. Due to the thermally conductive design of the rivet-like compound 10, optimum heat dissipation from the circuit board 50 is realized.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

L'invention concerne un module optique et un procédé de fabrication de celui-ci à destination d'un dispositif de caméra, le module optique comprenant une carte de circuit imprimé (50) muni d'un capteur d'image (30) et un dispositif de support (60) destiné à la fixation d'un objectif du dispositif de caméra (60); le dispositif de support (60) comporte au moins un trou (62) destiné au montage d'un objectif du dispositif de caméra; la carte de circuit imprimé (50) est fixé au dispositif de support (60) au moyen d'au moins une liaison de type rivet (10) thermo-conductrice enchâssée dans un trou (62) du dispositif de support (60) et la liaison de type rivet (10) est mis en contact thermo-conducteur avec la carte de circuit imprimé (50). La carte de circuit imprimé (50) peut ainsi être reliée au dispositif de support (par exemple un porte-objectif en matière plastique) au moyen de liaisons de type rivet (par exemple des rivets creux) en matière thermo-conductrice métallique ou autre. Si la liaison de type rivet ou similaire se présente sous la forme de douille à encastrer, de rivets aveugles, de rivets tubulaires ou analogue, il subsiste dans la liaison un trou par lequel une vis de fixation du dispositif de caméra peut être guidée. Le caractère thermo-conducteur de la liaison de type rivet (10) confère à la carte de circuit imprimé (50) une dissipation optimale de la chaleur.
PCT/EP2015/068554 2014-08-18 2015-08-12 Module optique muni d'un porte-objectif et carte de circuit imprimé à contact thermo-conducteur WO2016026749A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014012202.6A DE102014012202B4 (de) 2014-08-18 2014-08-18 Optisches Modul mit Objektivträger und wärmeleitend kontaktierter Leiterplatte und Herstellungsverfahren eines optischen Moduls
DE102014012202.6 2014-08-18

Publications (1)

Publication Number Publication Date
WO2016026749A1 true WO2016026749A1 (fr) 2016-02-25

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PCT/EP2015/068554 WO2016026749A1 (fr) 2014-08-18 2015-08-12 Module optique muni d'un porte-objectif et carte de circuit imprimé à contact thermo-conducteur

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DE (1) DE102014012202B4 (fr)
WO (1) WO2016026749A1 (fr)

Cited By (4)

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CN107656348A (zh) * 2017-10-20 2018-02-02 深圳市道通合创软件开发有限公司 镜头模组及具有此镜头模组的摄像组件和无人飞行器
CN108406854A (zh) * 2018-03-07 2018-08-17 深圳市东恒达智能科技有限公司 一种机器人用视觉传感器
CN114205499A (zh) * 2021-12-07 2022-03-18 信利光电股份有限公司 一种摄像模组的固定装置、摄像模组及摄像模组的固定装置的制作方法
CN114650670A (zh) * 2020-12-18 2022-06-21 宏恒胜电子科技（淮安）有限公司 具有散热块的电路板及其制备方法

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DE102020216390A1 (de) 2020-12-21 2022-06-23 Vitesco Technologies Germany Gmbh Steuermodul für ein Fahrzeug mit mindestens einem Elektromotor

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US20140118612A1 (en) * 2011-06-14 2014-05-01 Kyocera Corporation Imaging module
US20140211083A1 (en) * 2013-01-29 2014-07-31 Panasonic Corporation Imaging unit

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DE102013200966B4 (de) * 2012-02-10 2023-11-16 Robert Bosch Gmbh Modulvorrichtung für ein Kamerasystem und entsprechendes Kamerasystem

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US20140118612A1 (en) * 2011-06-14 2014-05-01 Kyocera Corporation Imaging module
KR20140029371A (ko) * 2012-08-02 2014-03-10 주식회사 중앙정공 카메라 모듈의 제조 방법
US20140211083A1 (en) * 2013-01-29 2014-07-31 Panasonic Corporation Imaging unit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107656348A (zh) * 2017-10-20 2018-02-02 深圳市道通合创软件开发有限公司 镜头模组及具有此镜头模组的摄像组件和无人飞行器
CN108406854A (zh) * 2018-03-07 2018-08-17 深圳市东恒达智能科技有限公司 一种机器人用视觉传感器
CN114650670A (zh) * 2020-12-18 2022-06-21 宏恒胜电子科技（淮安）有限公司 具有散热块的电路板及其制备方法
CN114650670B (zh) * 2020-12-18 2024-03-12 宏恒胜电子科技（淮安）有限公司 具有散热块的电路板及其制备方法
CN114205499A (zh) * 2021-12-07 2022-03-18 信利光电股份有限公司 一种摄像模组的固定装置、摄像模组及摄像模组的固定装置的制作方法

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