WO2007124994A1 - Module optique et procédé de fabrication d'un module optique - Google Patents

Module optique et procédé de fabrication d'un module optique Download PDF

Info

Publication number
WO2007124994A1
WO2007124994A1 PCT/EP2007/053065 EP2007053065W WO2007124994A1 WO 2007124994 A1 WO2007124994 A1 WO 2007124994A1 EP 2007053065 W EP2007053065 W EP 2007053065W WO 2007124994 A1 WO2007124994 A1 WO 2007124994A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens device
optical module
sensor
sensor carrier
carrier
Prior art date
Application number
PCT/EP2007/053065
Other languages
German (de)
English (en)
Inventor
Oliver Menke
Christian Meyer
Harald Schmidt
Andreas Winterl
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2007124994A1 publication Critical patent/WO2007124994A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the invention relates to an optical module and a method for producing an optical module
  • DE 102 26 135 A1 discloses an optical module which has a lens device for projecting electromagnetic radiation, an image sensor and a sensor carrier with an opening and a support surface on which the image sensor is attached by flip-chip technology in the region of the opening , having.
  • the sensor carrier is attached to the optical module such that the carrier surface is remote from the lens device and the lens device projects the electromagnetic radiation onto the sensitive surface of the image sensor.
  • the components of the optical module must be geometrically relatively precisely matched to each other.
  • the tolerance range for the distance from the image sensor to the lens device in the direction of that axis which is aligned at right angles to the sensitive area of the image sensor should be kept as accurately as possible and preferably be within a range ⁇ 0.5 mm.
  • the sensor carrier has a not significant thickness tolerance or if different sensor carriers are used for the optical module, then it may be necessary to adjust the optical module, for example, with a thread on the housing of the optical module. Such an adjustment is relatively expensive, especially in mass production of optical modules.
  • the object of the present invention is therefore to design an optical module such that sensor carriers of different thickness can be used without readjusting the lens device for the optical module.
  • the task It is also an object of the invention to provide a corresponding method for producing such an optical module.
  • an optical module comprising a lens device for projecting electromagnetic radiation, an image sensor with a sensitive surface, a sensor carrier with an opening and a support surface, on which the image sensor in particular by means of flip-chip technology in the Opening is fixed, and a sensor holder holder for mounting the sensor carrier such that the support surface facing away from the lens device and the lens device projects the electromagnetic radiation on the sensitive surface of the image sensor, characterized in that the sensor holder holder is designed such that the lens device facing away from Carrier surface of the sensor carrier is aligned relative to the lens device in a fixed predetermined distance.
  • the electromagnetic radiation is, in particular, visible light which impinges on the sensitive surface of the image sensor, so that the image sensor converts it into electrical signals in a generally known manner, whereby an image data record assigned to an image is produced.
  • the image sensor is for example a CMOS or CCD image sensor and is in particular in flip-chip technology on the sensor carrier, which is for example a printed circuit board attached.
  • the image sensor is fastened in the region of the opening of the sensor carrier on the support surface facing away from the lens device, and the lens device projects the electromagnetic radiation into the region of the opening so that the electromagnetic radiation falls on the sensitive surface.
  • the optical module further comprises the sensor holder holder with which the sensor carrier is mounted.
  • the image sensor is preferably attached to the sensor carrier by flip-chip technology, whereby high tolerances due to the attachment, for example by solders, remain within relatively narrow tolerances.
  • the sensitive surface is substantially in the plane determined by the carrier surface of the sensor carrier facing away from the lens device, ie the sensitive surface of the image sensor, has the predetermined distance to the lens device, regardless of the thickness of the sensor carrier used.
  • the focusing of the lens device should be aligned as possible on the sensitive surface of the image sensor. Since, however, the distance between the lens device and the support surface facing away from the lens device of the sensor carrier is always the same regardless of the thickness of the sensor carrier, the lens device can be pre-set to this distance without an adjustment is necessary during the assembly of the optical module. As a result, the optical module can be produced relatively quickly and therefore cost-effectively.
  • this comprises a housing in which the lens device is mounted, and the sensor holder holder is part of the housing.
  • the housing with integrated sensor holder, for example by injection molding, relatively simple, but also relatively accurate tolerance.
  • the optical module whose sensor support holder is designed such that the assembly of the optical module facing away from the lens device carrier surface of the sensor carrier self-aligning reference lent to the lens device in the fixed predetermined distance aligns.
  • the optical module of the sensor holder is designed such that aligns the opening of the sensor sensor self-aligning in a predetermined position relative to the lens device when assembling the optical module, the optical module is not only relatively simple and fast and therefore cost but there are also advantages statements for a relatively consistently high quality of the optical module given.
  • the sensor carrier holder of the module comprises z. B. holding means on which the lens device facing away from the support surface of the sensor carrier and which ensure that the distance between the lens device remote from the carrier surface of the sensor carrier and the lens device does not exceed the fixed predetermined distance.
  • the optical module whose sensor carrier holder comprises at least one compression spring which presses the sensor carrier against the holding means, it can be achieved with relatively simple means that the lens surface facing away from the carrier device self-adjusting occupies the fixed predetermined distance.
  • the compression spring is, for example, collar-shaped and / or annular and / or is made of an elastomeric material. Such a compression spring not only presses the sensor holder against the holding means, but can additionally protect the image sensor or the lens device against environmental influences, such as dust or moisture.
  • the holding means also prevent a displacement of the circuit carrier in the plane defined by the sensor carrier.
  • the image sensor not only has the predetermined distance to the lens device, but the lens device always projects the electromagnetic radiation to the sensitive surface of the image sensor.
  • the holding means have at least one snap-action hook in which the sensor carrier snaps, a screw, a pin and / or a bolt and / or the sensor carrier holder has a partial surface which forms a common surface with the carrier surface of the sensor carrier facing away from the lens device forms a flat surface and the holding means are fixed to the part surface.
  • the object of the invention is also achieved by a method for producing an optical module, comprising the following method steps: attaching a lens device for projecting electromagnetic radiation in a housing such that the lens device focuses the electromagnetic radiation to a predetermined location at a predetermined distance from the lens device and attaching a sensor carrier having an opening and a support surface to which an image sensor in the region of the opening is preferably secured by flip-chip technology such that the support surface facing away from the lens device and the lens device facing away from the support surface the predetermined distance to the lens device Has.
  • the sensor carrier is attached to the housing by applying the sensor carrier to the housing such that the carrier surface is remote from the lens device. Subsequently, a stop member is applied to the housing and the sensor wearer such that the stop member against the image sensor and / or the lens device facing away from carrier surface prints such that the lens device facing away Tragerflache has the predetermined distance to the lens device. Finally, the sensor carrier is attached to the housing with an adhesive. By the stop member is ensured that the lens device facing away from Tragerflache regardless of the thickness of the sensor carrier has the fixed predetermined distance to the lens device.
  • the abutment part is also designed such that it holds the opening in a predetermined position relative to the lens device, then the opening of the sensor carrier and thus the sensitive surface of the image sensor is always at a predetermined position relative to the lens device, so that the Focusing the lens device does not need to be readjusted.
  • the sensor carrier is fastened to the housing on a sensor carrier holder of the housing.
  • the sensor carrier holder preferably comprises holding means, which align the sensor carrier self-aligning with respect to the lens device in the fixed predetermined distance.
  • FIG. 1 is a sectional view of a first embodiment of an optical module
  • FIG. 2 shows the optical module of FIG. 1 in an exploded view
  • FIG. 3 is a sectional view of a second embodiment of an optical module
  • FIG. 4 shows the optical module shown in FIG. 3 in an exploded view
  • Figure 5 shows a third embodiment of an optical module in a sectional view
  • FIG. 6 shows the optical module of Figure 5 in an exploded view.
  • FIG. 1 shows an optical module 1 in a sectional representation and
  • FIG. 2 shows the optical module 1 in an exploded view.
  • the optical module 1 comprises a housing 2, in which optical lenses 3 are firmly anchored during assembly of the optical module 1, so that no further optical adjustment is possible. Furthermore, the lenses 3 are focused during assembly to a point at a fixed predetermined distance from the lenses 3.
  • the housing 2 comprises in the case of the present exemplary embodiment, three snap hooks 5, of which only two snap hooks 5 are visible in Figures 1 and 2.
  • the snap hooks 5 are intended to receive a printed circuit board 6 with a thickness d and an opening 6a.
  • the printed circuit board 6 has a first board surface 6c and a second board surface 6c.
  • an image sensor 7 with a photosensitive surface in flip-chip technology is soldered in the region of the opening 6a such that the photosensitive surface is accessible through the opening 6a.
  • the second board surface 6b faces away from the lenses 3, so that a light bundle 13 passing through the lenses 3 and focused by the lenses 3 is directed onto the opening 6a of the printed circuit board 6 and thus strikes the photosensitive surface of the image sensor 7 ,
  • the sensor 7 converts this light into corresponding electrical signals which are further processed by electronic components 12 located on the printed circuit board 6, whereby an image data record is generated whose associated image is displayed, for example, with a screen, not shown in the figures can be.
  • an annular spring element 10 made of an elastomer, in the case of the present exemplary embodiment of silicone rubber, is placed in an annular groove 9 of the housing 2.
  • the annular spring element 10 is so thick that, when the printed circuit board 6 is snapped into the snap hooks 5, it is printed together and thus the printed circuit board 6 against bearing surfaces 4 of the snap hooks 5 prints. This ensures that the lenses 3 remote from the second support surface 6c of the printed circuit board 6 regardless of the thickness d in a fixed by the bearing surfaces 4 of the snap hook 5 level relative to the lenses 3 runs.
  • the annular spring element 10 not only prints the printed circuit board 6 against the bearing surfaces 4 of the snap hooks 5, but also seals the printed circuit board 6 and the housing 2, for example against moisture, dust or other environmental influences.
  • the housing 2 of the optical module 1 further comprises two centering pins 11, which engage in corresponding bores 8 of the printed circuit board 6 in the attached state of the printed circuit board 6.
  • the printed circuit board 6 is automatically adjusted when attaching the circuit board 6 to the housing 2 such that the opening 6a a predetermined position relative to the plane defined by the lenses 3 second support surface 6c plane is aligned relative to the lenses 3.
  • the image sensor 7 is angelotet at a fixed predetermined location on the lenses 3 remote from the second support surface 6c of the printed circuit board 6, and the sensitive surface of the image sensor 7 has set in the plane facing away from the lenses 3 second support surface 6c certain level Position.
  • the snap hook 5 thus results in a relatively simple mounting of the optical module 1, since during assembly, only the circuit board 6 with the already angelote- th image sensor 7 needs to be snapped.
  • the spring element 10 ensured in combination with the spring element 10 that the lens carrier 3 facing away from the second support surface 6c regardless of the thickness d of the printed circuit board 6 used in a fixed predetermined distance to the lenses 3 is aligned, which is already known and prior to assembly the support surfaces 4 of the snap hook is determined. This distance is also the distance with which the lenses 3 are focused during assembly.
  • FIG. 3 shows a sectional view of a further optical module 14 and FIG. 4 shows the optical module 14 in an exploded view.
  • components of the optical module 14 shown in FIGS. 3 and 4 which are substantially identical in construction and function to components of the optical module 1 shown in FIGS. 1 and 2, are given the same reference numerals.
  • the optical module 14 shown in FIGS. 3 and 4 differs substantially from the optical module 1 shown in FIGS. 1 and 2 in that the printed circuit board 6 only has two snap hooks 5, of which only one of the snap hooks in FIGS 5 is shown, in addition to a screw 15 is attached to the housing 2.
  • the housing 2 comprises a threaded bore 16 into which the screw 15 is screwed during assembly of the optical module 14.
  • the bore 16 is in the case of the present exemplary embodiment in a socket 17 of the housing 2.
  • the nozzle 17 in turn comprises at its end facing away from the housing 2 a taper 21 with a support surface 18, to which the screw contact surface 19 of the screw head 20 of Screw 15 in the assembled state of the optical see module 14 firmly.
  • the printed circuit board 6 has a further opening 22, in which the taper 21 of the nozzle 17 is inserted when the optical module 14 is assembled.
  • the support surface 18 of the nozzle 17 is der- aligned art that it lies in the same plane, which is defined by the support surfaces 4 of the two snap hooks 5.
  • the spring element 10 is placed in the groove 9 of the housing 2. Subsequently, the printed circuit board 6 is pushed with the image sensor 7 laterally into the snap hooks 5 and inserted with its further opening 22 in the taper 21 of the nozzle 17. Thereafter, the screw 15 is tightened. As a result, the opening 6a and thus the photosensitive surface of the image sensor 7 are in a fixed predetermined position relative to the lenses 3.
  • FIG. 5 shows a further optical module 23 in a sectional illustration and FIG. 6 shows the optical module 23 in an exploded view.
  • components of the optical module 23 shown in FIGS. 5 and 6, which are substantially identical in construction and function to components of the optical module 1 shown in FIGS. 1 and 2, are given the same reference numerals.
  • the optical module 23 in turn, comprises a housing 2, in which lenses 3 fixedly mounted fixedly at a fixed distance.
  • the printed circuit board 6 provided with the image sensor 7 is first held with a stop member 24 against abutment surfaces 25 of the housing 2.
  • the stopper part 24 has position cams 26 which can be pushed through corresponding openings 27 in the printed circuit board 6.
  • the stop member 24 also includes stop cams 28, which rest on the rear side of the optical sensor 7 and thereby limit the maximum distance of the lens 3 remote from the carrier surface 6c of the printed circuit board 6. If the printed circuit board 6 or the image sensor 7 prints against the stop cam 28 of the stop member 24, then a gap arises between the printed circuit board 6 and a lower boundary surface 29 of the housing 2. The gap is filled with an adhesive 30. After the adhesive 30 has cured, the circuit board 6 is fixed to the housing 2, so that the abutment member 24 can be removed. During the curing of the adhesive 30, the stop member 24 prints the image sensor 7 against the housing 2, so that the lens 3 remote from the carrier surface 6c of the board 6 is aligned after curing of the adhesive 30 at a fixed predetermined distance from the lenses 3. In the case of the present exemplary embodiment, the adhesive 30 also protects the image sensor 7 from dust, moisture or other environmental influences.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

L'invention concerne un module optique (1, 14, 23) constitué d'un système de lentille (3) prévu pour projeter un rayonnement électromagnétique (13), d'un capteur d'image (7) présentant une surface sensible, d'un porte-capteur (6) présentant une ouverture (6a) et une surface de support (6c), sur laquelle le capteur d'image (7) est fixé au niveau de l'ouverture (6a), et d'un support de porte-capteur (5, 10, 15, 17, 30) servant à fixer le porte-capteur (6) de sorte que la surface de support (6c) est opposée au système de lentille (3) et ce système de lentille (3) projette le rayonnement électromagnétique (13) sur la surface sensible du capteur d'image (7). Le support de porte-capteur (5, 10, 15, 17, 30) est conçu, de sorte que la surface de support (6c) du porte-capteur (6), opposée au système de lentille (3), est placée à une distance prédéfinie fixe du système de lentille (3). Cette invention concerne également un procédé de fabrication d'un tel module optique (1, 14, 23).
PCT/EP2007/053065 2006-04-27 2007-03-30 Module optique et procédé de fabrication d'un module optique WO2007124994A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006019717A DE102006019717A1 (de) 2006-04-27 2006-04-27 Optisches Modul und Verfahren zum Herstellen eines optischen Moduls
DE102006019717.8 2006-04-27

Publications (1)

Publication Number Publication Date
WO2007124994A1 true WO2007124994A1 (fr) 2007-11-08

Family

ID=38434752

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/053065 WO2007124994A1 (fr) 2006-04-27 2007-03-30 Module optique et procédé de fabrication d'un module optique

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DE (1) DE102006019717A1 (fr)
WO (1) WO2007124994A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021063673A1 (fr) * 2019-10-02 2021-04-08 Robert Bosch Gmbh Procédé de fabrication d'un module de caméra

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010018921A1 (de) * 2010-04-30 2011-11-03 Conti Temic Microelectronic Gmbh Kameramodul mit Bildaufnahmeelement für ein Kraftfahrzeug
DE202013104607U1 (de) 2013-10-11 2015-01-12 Sick Ag Optisches Modul
DE102013111255B3 (de) * 2013-10-11 2014-08-14 Sick Ag Optisches Modul und Verfahren zur Herstellung eines optoelektronischen Sensors

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20020057468A1 (en) * 2000-11-14 2002-05-16 Masao Segawa Image pickup apparatus, method thereof, and electric apparatus
DE10226135A1 (de) * 2002-06-12 2004-01-08 Siemens Ag Optisches Modul und optisches System
DE10344768B3 (de) * 2003-09-26 2005-08-18 Siemens Ag Optisches Modul mit federndem Element zwischen Linsenhalter und Schaltungsträger und optisches System

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
US7375757B1 (en) * 1999-09-03 2008-05-20 Sony Corporation Imaging element, imaging device, camera module and camera system
DE10043344C2 (de) * 1999-10-06 2001-12-13 Jenoptik Jena Gmbh Elastische Linsenträger

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020057468A1 (en) * 2000-11-14 2002-05-16 Masao Segawa Image pickup apparatus, method thereof, and electric apparatus
DE10226135A1 (de) * 2002-06-12 2004-01-08 Siemens Ag Optisches Modul und optisches System
DE10344768B3 (de) * 2003-09-26 2005-08-18 Siemens Ag Optisches Modul mit federndem Element zwischen Linsenhalter und Schaltungsträger und optisches System

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021063673A1 (fr) * 2019-10-02 2021-04-08 Robert Bosch Gmbh Procédé de fabrication d'un module de caméra

Also Published As

Publication number Publication date
DE102006019717A1 (de) 2007-10-31

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