EP1046938B1 - Dispositif de connection - Google Patents

Dispositif de connection Download PDF

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Publication number
EP1046938B1
EP1046938B1 EP00103522A EP00103522A EP1046938B1 EP 1046938 B1 EP1046938 B1 EP 1046938B1 EP 00103522 A EP00103522 A EP 00103522A EP 00103522 A EP00103522 A EP 00103522A EP 1046938 B1 EP1046938 B1 EP 1046938B1
Authority
EP
European Patent Office
Prior art keywords
pin
connection device
accordance
shaped
coupling element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00103522A
Other languages
German (de)
English (en)
Other versions
EP1046938A2 (fr
EP1046938A3 (fr
Inventor
Hartmut Damm
Günter Böckel
Hainer Wetteborn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sick AG
Original Assignee
Sick AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sick AG filed Critical Sick AG
Publication of EP1046938A2 publication Critical patent/EP1046938A2/fr
Publication of EP1046938A3 publication Critical patent/EP1046938A3/fr
Application granted granted Critical
Publication of EP1046938B1 publication Critical patent/EP1046938B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides

Definitions

  • the present invention relates to a connecting device for optical and / or electronic components, having at least two corresponding coupling elements, one of which is to be arranged on one of the components to be connected and which are fixable to each other in an adjustable relative position.
  • the transceiver unit of a groping laser scanner called whose three components (tube, transmitter, receiver) must be adjusted very closely to each other before they are firmly connected together.
  • the mechanical support of the individual components z.
  • the screw connections are slightly biased by spring washers.
  • the mechanical support of the components can then be moved for the purpose of adjustment against the biasing forces of the spring discs in two axes. Subsequently, the support of the components are firmly screwed and additionally secured with adhesive against misalignment.
  • a device and a method for a chip arrangement is described, in which case a mounted on a film chip is adjusted and fixed to a housing.
  • a housing For this purpose, there are recesses in the film, in which pins are fixed to the housing.
  • the recesses may be larger than the pin diameter to position the film with the chip on the housing surface can. After this positioning, the film is glued to the housing.
  • connection device in which two components are adjusted and fixed by inserting a first component equipped with a projection into a second component equipped with a groove, wherein a non-hardened adhesive is located on the underside of the component carrying the projection , so that the components along the groove can be moved against each other, as long as the adhesive is not cured.
  • the document EP 0 573 941 A1 describes an optical fiber to be connected to an end portion with an annular receptacle of a chip.
  • the free inner diameter of the annular receiving measure is dimensioned larger than the outer diameter of the end portion, so that the end portion can be adjusted within the annular receptacle.
  • the end portion of the optical fiber is also of surrounded by a sleeve which has a flange at its end facing the annular receptacle. The sleeve is glued or welded after the adjustment process on the one hand with the end portion and on the other hand with the annular receptacle.
  • the object of the present invention has been made to provide a connecting device for optical and / or electronic components, which allows in a simple manner a precise adjustment and fixation of the components. It should be possible in particular to make the adjustment and fixation in a series production automatically.
  • the coupling elements are connected to each other by means of a flowable in the processing state and in use solid mass.
  • the connecting device according to the invention for optoelectronic components therefore contains two corresponding coupling elements, one of which is to be arranged on each of the components to be connected and which can be fixed to each other in an adjustable relative position.
  • the adjustability of the relative position allows the adjustment of the coupling elements - and thus the components - against each other.
  • the connecting device is characterized in that the fixing of the coupling elements to each other by a flowable in the processing state and in use solid mass (hereinafter: “fixing mass”) is produced.
  • the use of the fixing compound according to the invention has the advantage that a very precise adjustment of the components is achieved in a simple manner, which is also retained during subsequent fixing.
  • the fixing compound Before the final fixing of the components, the fixing compound is in its processing state, ie it is flowable. Under “flowable” is to be understood a state in which the mass is plastically deformable with little effort. The viscosity of the fixation mass should be so great that the mass, although distributed at its destination, but does not immediately flow away from it.
  • the flowable fixing compound fills the free space between the coupling elements. If the fixation mass has already been introduced into the area of the coupling elements during the adjustment process, it only counteracts a negligibly small resistance due to its plasticity of the adjustment, so that the adjustment can take place virtually free of forces. If the fixing mass is introduced into the area of the coupling elements only after the adjustment process, the adjustment can be done almost without force anyway.
  • the fixing mass is transferred to its solid state of use, ie it solidifies or hardens.
  • the space between the coupling elements is then filled by a solid mass, resulting in a stable positive connection between the coupling elements.
  • an adhesive bond may exist if adhesion forces or even chemical bonds are formed between the fixation compound and the coupling elements.
  • the connecting device according to the invention is less expensive than the known solutions of the prior art, since it does not require highly accurate machined mounting hardware. Furthermore, it allows a cost-effective automated mass production, since the assembly does not require high force and therefore can be done well by machine.
  • the fixing compound is preferably a solder, in particular solder.
  • solder in particular solder.
  • This can - optionally together with soldering aids such as solder paste - be stored before assembly to the coupling elements and melted for adjustment.
  • the liquid solder can also be supplied from outside before, during or after the adjustment. The liquid solder is distributed in the space between the coupling elements and establishes a stable contact between them. After adjustment, the solder solidifies by cooling, ie without any external force. The adjustment therefore remains unchanged.
  • the described use of solder is particularly suitable for automated production, since the transition from flowable to solid state, for example by an electric heater can be controlled at will.
  • the fixing compound is adhesive. Similar to the solder mentioned above, an adhesive can be well processed in an automated process. It is preferred if the time of curing of the adhesive can be controlled from the outside, such. with a radiation-curable adhesive. Preferably, a UV curable adhesive is used so that the curing process can be initiated and performed by irradiation with UV light.
  • the first coupling element according to the invention is formed in a pin shape, wherein the second coupling element includes an opening into which the first coupling element is inserted.
  • the term "pin-shaped" is to be interpreted broadly and includes all arrangements in which a protruding survey is present. This may be round or angular in cross-section and does not necessarily have a constant cross-sectional area over the entire length. It is important that the pin-shaped elevation can be introduced into the opening in the second coupling element. The opening must therefore have a corresponding cross section, which allows the inclusion of the pin-shaped element.
  • the opening is slightly larger than the pin cross-section, so that the pin can be positioned with play in the opening. After insertion of the pin in the opening is still a change in the relative position between the pin and the opening and thus an adjustment possible.
  • the described system of pin-shaped element and opening is advantageous because it can be both easy and thus inexpensive to produce and on the other hand, it can be mounted well in an automated process.
  • the described embodiment of the coupling elements as a pin-shaped element and corresponding opening is preferably additionally improved in that a sleeve or an annular element is present, which can be placed on the pin-shaped element after passing through the opening.
  • the opening in this arrangement is designed as a passage opening in a carrier body (eg a plate), and the pin-shaped element is so long that it extends through the opening and protrudes from the opening at the rear side of the carrier body. On this protruding end of the pin-shaped element, the above-mentioned sleeve or the annular element can then be placed.
  • the opening is closed on the back and prevents leakage of the (flowable) fixation compound.
  • fixation compound can thus be reduced. Furthermore, via the sleeve (and to a lesser extent also via the annular element) a better power transmission between pin-shaped element and carrier body takes place. Finally, it is also conceivable to stockpile the fixing compound in the sleeve or on the ring so that it does not interfere with the pre-assembly of the components and is easy to handle separately.
  • the first pin-shaped coupling element is bendable in a transverse direction to the pin axis and rigid in the transverse direction perpendicular to the pin axis.
  • the classification as “flexible” or “bending stiff” is to be made on the basis of the forces usually encountered during assembly, which are yielded (“bendable”) or not yielded (“rigid") pliable component has the advantage that certain inevitably occurring forces during solidification or curing of the fixing mass can be given.
  • the axis of flexibility is therefore preferably oriented in the direction of these expected constraining forces.
  • the stiffness provides the necessary stability of the connection against disturbing external forces, which could cause an unwanted misalignment.
  • the last described flexibility of the pin-shaped element in the one and stiffness in the other direction can be structurally eg achieved in that the coupling element has a strip-shaped base.
  • the cross section of the pin-shaped element is therefore not rotationally symmetrical, but substantially rectangular, wherein the ratio of the side lengths of the rectangle deviates significantly from 1: 1 1 (square). It is preferably between 1: 4 and 1:20. This ensures that the element is flexible in the direction of the short rectangle side and rigid in the direction of the long rectangle side.
  • the absolute height and the ratio of flexibility and stiffness can be controlled as desired. So that the pin-shaped element still fits into the opening in the other coupling element, either this opening must be dimensioned accordingly or the pin-shaped element to be extended by a matching essay, with only this essay is inserted into the opening.
  • two such elements are arranged in pairs so that the axes of flexibility or stiffness are aligned substantially perpendicular to each other.
  • the arrangement of the coupling elements is preferably carried out so that it fits into the symmetry of the components.
  • This axis is preferred in optical or optoelectronic devices whose optical axis. The constraining forces are then introduced into the coupling elements and cancel out due to the symmetry in their cumulative effect to the outside.
  • the opening in the second coupling element is surrounded by an electric heater.
  • the fixation mass located in the opening can be specifically heated to control the transition from the flowable processing state to the fixed use state or vice versa.
  • the inventive arrangement of an electric heater has the advantage that the heat is generated directly at the place of use, which is energy efficient and protects surrounding components from damage. Furthermore, the timing and extent of the heating can be controlled very accurately, and any external forces acting on the connecting device are avoided.
  • the transceiver unit of a probing laser scanner is shown in perspective. It consists of the tube 7 with built-in transmitter and receiver lens, the transmitter 2 ', and the receiver. 2 The transmitter 2 'and the receiver 2 must be firmly connected to the tube 7, although previously a precise adjustment must be made. The connection takes place with the aid of the connecting device 1 according to the invention, which is formed in the illustrated case as an integral part of the tube 7 and the transmitter 2 'and receiver 2.
  • pin-shaped elements 4 are arranged at the corners of a square perpendicular to the tube 7 (per connecting device) projecting from the surface of the tube. With these pins 4 correspond to the openings 3 in the transmitter 2 'and receiver. 2
  • the transmitter 2 'and the receiver 2 are constructed on a plate-shaped ceramic.
  • the ceramic in addition to the actual control electronics on the holes 3, which the openings for the connecting device 1 form.
  • FIG. 2 is a cross section through the connecting device 1 is shown, on which two pin-shaped elements 4 can be seen, which protrude through two corresponding openings 3 of the receiver 2.
  • the fixing compound 6 can be seen, which fills the space between each pin 4 and the opening 3 and provides for the fixation of the receiver 2 on the tube 7.
  • the fixing compound 6 consists of solder.
  • connection device The assembly of the connection device is as follows:
  • the assembly 2 is placed on the pins 4 of the tube 7 and automatically adjusted in all three orthogonal axes without the action of opposing forces.
  • the advantage here is the number of adjustable axes. It is possible to adjust in all three orthogonal axes and in the three axes of rotation.
  • To fix a voltage is then applied to the printed heating resistors 5 for a few seconds, which leads to melting of the now supplied solder 6 or the already located in the holes 3 solder paste and the assembly 2 fixed after hardening of the solder forces.
  • For force-free fixing of the assemblies 2 and 2 ' can be used as an alternative to the described soldering method and UV-curing adhesive. In this case, instead of applying an electrical voltage to the heating resistors, the adjusted arrangement is irradiated with UV light and the UV adhesive introduced into the holes is cured.
  • the described procedure takes place both during the adjustment and fixation of the transmitter module 2 'as well as in the receiver module 2.
  • FIG. 3 A preferred variant of the connecting device is in FIG. 3 shown schematically.
  • the plate of the assembly 2 through the opening 3 of the pin 4 projects.
  • a sleeve 9 is pushed.
  • an annular element can be used, but then the latter advantage is not or less pronounced achievable.
  • the use of cylindrical pins can have the disadvantage that the ceramic contracts on cooling, so that the pins bend. This leads to bending stresses in the ceramic, which can eventually cause the ceramic to break. This potential problem is encountered in an arrangement which is shown in FIG. 4 in plan view.
  • the pins 4 are flexible and arranged symmetrically about the optical axis 10. The flexibility avoids bending stresses in the ceramic, and the symmetrical arrangement ensures that no misalignment occurs during cooling. Because of the symmetry, the forces acting on the pins 4 cancel in pairs.
  • the pins 4 do not cause that when handling the assembled unit a misalignment occurs by a manual bending of the pins, the pins have the in FIG. 5 in the side view shown shape. They therefore consist of a base 4a in the form of a flat cuboid ("strip shape"), on which the cap 4 b is arranged, which fits through the openings 3.
  • the flat strip shape of the base 4a results in the element 4 being bendable transversely to the large side surface of the base while rigidly parallel to the side surface.
  • this has the effect that the opposing elements 4 can bend towards each other (or away from each other) individually, if corresponding forces occur during cooling of the fixing mass.
  • the arrangement as a whole can not be bent, as this would inevitably be a bending of each transverse elements would be required, which are however rigid in this direction.
  • a transmitter-receiver unit can be automatically adjusted without having external forces acting on the unit. After fixing the transmitter or the receiver, no misalignment occurs.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Seal Device For Vehicle (AREA)
  • Surgical Instruments (AREA)
  • Paper (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Claims (10)

  1. Dispositif de connexion (1) pour composants optiques et/ou électroniques (2, 2', 7), comprenant au moins deux éléments de couplage correspondants (3, 4) qu'il s'agit d'agencer respectivement sur l'un des composants à connecter, et qui peuvent être fixés dans une position relative réglable l'un par rapport à l'autre et être reliés l'un à l'autre au moyen d'une masse (6) qui s'écoule dans l'état de préparation et qui est solide dans l'état d'utilisation, dans lequel
    - l'un des éléments de couplage (4) est réalisé en forme de tige et l'élément de couplage correspondant (3) contient une ouverture dans laquelle l'élément de couplage (4) en forme de tige peut être introduit,
    - l'élément de couplage (4) en forme de tige est flexible dans une direction transversale à l'axe de la tige et rigide vis-à-vis de la flexion dans la direction transversale à l'axe de la tige, perpendiculaire à cette dernière, et
    - le dispositif de connexion (1) contient au moins deux, et en particulier quatre, éléments de couplage (4) en forme de tige, dont les axes définissant la flexibilité ou respectivement la rigidité vis-à-vis de la flexion sont orientés au moins sensiblement perpendiculairement l'un à l'autre.
  2. Dispositif de connexion selon la revendication 1,
    caractérisé en ce que la masse (6) est un apport de brasage, de préférence à base de zinc.
  3. Dispositif de connexion selon l'une des revendications 1 ou 2,
    caractérisé en ce que la masse est une colle, de préférence une colle durcissable par application de rayonnement.
  4. Dispositif de connexion selon l'une des revendications précédentes,
    caractérisé en ce qu'il comprend une douille (9) ou un élément de forme annulaire, qui peut être posé(e) sur l'élément de couplage (4) en forme de tige et qui touche ici la région de bordure de l'ouverture dans l'élément de couplage (3) correspondant.
  5. Dispositif de connexion selon l'une des revendications précédentes,
    caractérisé en ce que l'élément de couplage (4) en forme de tige comprend une base (4a) en forme de ruban.
  6. Dispositif de connexion selon l'une des revendications précédentes,
    caractérisé en ce qu'il contient quatre éléments de couplage (4) en forme de tige dont les axes définissant la flexibilité ou respectivement la rigidité en flexion sont orientés au moins sensiblement perpendiculairement l'un à l'autre.
  7. Dispositif de connexion selon l'une des revendications précédentes,
    caractérisé en ce que l'ouverture dans l'élément de couplage (3) est entourée par un élément (5) à chauffage électrique.
  8. Dispositif de connexion selon l'une des revendications précédentes,
    caractérisé en ce que pour le couplage de deux composants, il est prévu deux ou plusieurs éléments de couplage (4) en forme de tige et un nombre correspondant d'ouvertures (3) dans l'élément de couplage correspondant (3).
  9. Composant optoélectronique, de préférence unité émettrice et/ou réceptrice,
    caractérisé en ce qu'il contient au moins un dispositif de connexion (1) selon l'une des revendications 1 à 8.
  10. Composant optoélectronique selon la revendication 9,
    caractérisé en ce que le dispositif de connexion (1) est un composant intégral du composant.
EP00103522A 1999-04-23 2000-02-18 Dispositif de connection Expired - Lifetime EP1046938B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29907270U 1999-04-23
DE29907270U DE29907270U1 (de) 1999-04-23 1999-04-23 Verbindungsvorrichtung

Publications (3)

Publication Number Publication Date
EP1046938A2 EP1046938A2 (fr) 2000-10-25
EP1046938A3 EP1046938A3 (fr) 2003-03-12
EP1046938B1 true EP1046938B1 (fr) 2008-05-21

Family

ID=8072644

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00103522A Expired - Lifetime EP1046938B1 (fr) 1999-04-23 2000-02-18 Dispositif de connection

Country Status (3)

Country Link
EP (1) EP1046938B1 (fr)
AT (1) ATE396416T1 (fr)
DE (2) DE29907270U1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006016913B4 (de) 2006-04-11 2008-10-09 Leuze Electronic Gmbh & Co Kg Optischer Sensor
USRE46672E1 (en) 2006-07-13 2018-01-16 Velodyne Lidar, Inc. High definition LiDAR system
DE102007062459B4 (de) 2007-12-22 2022-10-27 Leuze Electronic Gmbh + Co. Kg Vorrichtung zum Verbinden zweier optischer und/oder elektronischer Bauteile
US10627490B2 (en) 2016-01-31 2020-04-21 Velodyne Lidar, Inc. Multiple pulse, LIDAR based 3-D imaging
CN109154661A (zh) 2016-03-19 2019-01-04 威力登激光雷达有限公司 用于基于lidar的3-d成像的集成照射和检测
CA3024510C (fr) 2016-06-01 2022-10-04 Velodyne Lidar, Inc. Lidar a balayage a pixels multiples
DE102016120712B4 (de) * 2016-10-28 2022-04-28 Mimatic Gmbh Gehäuse zur Aufnahme einer Platine, Funktionselement
US10386465B2 (en) 2017-03-31 2019-08-20 Velodyne Lidar, Inc. Integrated LIDAR illumination power control
JP2020519881A (ja) 2017-05-08 2020-07-02 ベロダイン ライダー, インク. Lidarデータ収集及び制御
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
US11885958B2 (en) 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
US11556000B1 (en) 2019-08-22 2023-01-17 Red Creamery Llc Distally-actuated scanning mirror
EP4016009B1 (fr) * 2020-12-17 2023-10-25 Leuze electronic GmbH + Co. KG Capteur optique

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
SE508763C2 (sv) * 1995-11-29 1998-11-02 Ericsson Telefon Ab L M Förfarande och anordning för chipmontering
US5745624A (en) * 1996-08-23 1998-04-28 The Boeing Company Automatic alignment and locking method and apparatus for fiber optic module manufacturing
US5896481A (en) * 1997-05-30 1999-04-20 The Boeing Company Optical subassembly with a groove for aligning an optical device with an optical fiber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HOROWITZ P.; HILL W.: "The Art of Electronics", 1990, CAMBRIDGE UNIVERSITY PRESS, USA *

Also Published As

Publication number Publication date
DE29907270U1 (de) 1999-07-29
EP1046938A2 (fr) 2000-10-25
ATE396416T1 (de) 2008-06-15
EP1046938A3 (fr) 2003-03-12
DE50015164D1 (de) 2008-07-03

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