WO2016021042A1 - 基板生産方法及び基板生産の条件決定方法 - Google Patents
基板生産方法及び基板生産の条件決定方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
Definitions
- the substrate type transported in the first transport lane is different from the substrate type transported in the second transport lane. Furthermore, the calculation of the nozzle commonality is targeted for the case where each type of substrate is transported through each transport lane. Therefore, the commonality of the nozzles is related to two types of substrates that are transported in both transport lanes.
- the arrangement of each nozzle and the arrangement of the plurality of types of component groups are determined based on a plurality of types of component groups mounted on the plurality of types of substrates.
- Each determined nozzle is not replaced during the continuous production of a plurality of types of substrates.
- the cycle time is shortened.
- the arrangement of the nozzles is not determined based on the substrate transported to each of the plurality of transport lanes. Therefore, the cycle time can be shortened as described above, regardless of which type of substrate is transported to any position among the plurality of transport lanes. In other words, the degree of freedom in carrying a plurality of types of substrates is high.
- the substrate production method according to the second invention is the following in the first invention described above. That is, the substrate production method according to the second invention continuously produces one or more types of first substrates and one or more types of second substrates, and the condition determining step includes a plurality of types of first substrates mounted on the first substrate.
- the fifth substrate group The arrangement of the fifth nozzle in each mounting head and the plurality of types of fifth parts in each of the component supply units so that the fifth nozzle attached to each of the mounting heads is fixed during continuous production of And a fifth condition determining step for determining the arrangement of the group.
- the first region D1 located in the center has a plurality of types mounted on a plurality of types of substrates JOB1 and 2, which are mass-produced products. A first part group is arranged.
- the second regions D2 and D3 other than the first region D1 a plurality of types of second component groups mounted on a plurality of types of substrates JOB11 to 13 which are low-volume products are arranged.
- the mounting heads 14 and 24 adsorb the components by the component supply units 13 and 23, and then move over the part cameras 16 and 26 at the center of the apparatus and onto the substrate JOB.
- the first region D1 is located in the center of the component placement region D of the component supply units 13 and 23, and the second regions D2 and D3 are located on the end side of the component placement region D. Therefore, the distance from the first region D1 to the part cameras 16, 26 is shorter than the distance from the second region D2, D3 to the part cameras 16, 26. Therefore, when the mounting heads 14 and 24 mount a plurality of types of first component groups from the first region D1 to the board JOB, the mounting heads 14 and 24 move in the second regions D2 and D3. This is shorter than the movement distance of the mounting heads 14 and 24 when a plurality of types of second component groups are mounted on the board JOB.
- the condition determination device When it is possible to produce substrates JOB11 to 13 of low-volume products with the nozzle arrangement fixed on the basis of mass-produced products (S2: Y in FIG. 3), the condition determination device performs the second condition determination process. (S3 in FIG. 3: second condition determining step).
- the second condition determination process is performed for each type of substrate JOB11 to 13 of the small-volume product.
- the second condition determination process is based on a plurality of types of second parts mounted on the boards JOB11 to 13 of the low-volume production product, with the nozzle arrangement determined by the first condition determination process being fixed.
- the arrangement of a plurality of types of second component groups in the component supply units 13 and 23 is determined. That is, the nozzles determined to be used for mounting the plurality of types of first component groups are used as they are for mounting the plurality of types of second component groups.
- the determination of the arrangement of the plurality of types of second parts is made using the second regions D2 and D3.
- the mounting of the second parts on the boards JOB11 to 13 of the low-volume production products The first component group arranged in the first region D1 is used. That is, the determination of the arrangement of the second component group in the second regions D2 and D3 by the second condition determination process is performed for a component group that is not included in the plurality of types of first component groups among the plurality of types of second component groups. Done.
- condition determination process is a process for a production process for adding production of a substrate JOB11 of a small-volume production product.
- the next production process is a process of continuously producing the substrate JOB11 of the low-volume product while continuously producing the substrates JOB1 and 2 of the mass-produced product.
- the condition determining apparatus executes the condition determining process shown in FIG. 3 based on the plurality of types of substrates JOB1, 2, and 11.
- the first condition determination process (S1 in FIG. 3) relating to the mass-produced product substrates JOB1 and 2 has already been executed.
- the board JOB11 of the low-volume production product can be produced by each nozzle determined based on the first component group mounted on the boards JOB1 and 2 of the mass-production product. Therefore, S2: Y in FIG. 3, and the second condition determination process of S3 is performed, and the arrangement of a plurality of types of second component groups mounted on the board JOB11 is determined.
- the mass-produced product boards JOB1 and 2 are transported through the first transport lanes 11 and 21 at T2 in FIG.
- Substrate JOB11 is transported through the second transport lanes 12 and 22.
- the distance between the first transport lanes 11 and 21 and the component supply units 13 and 23 is shorter than the distance between the second transport lanes 12 and 22 and the component supply units 13 and 23. Therefore, when the mass-produced product boards JOB1 and 2 are transported on the first transport lanes 11 and 21, the moving distance of the mounting heads 14 and 24 is shortened when the mass-produced product boards JOB1 and 2 are produced. Accordingly, the cycle time required for producing the mass-produced substrates JOB1 and 2 is shortened.
- the nozzle arrangement at T2 is the same as the nozzle arrangement at T1. That is, even at T2, the nozzles attached to the mounting heads 14 and 24 are arranged so as to be optimal for the mass-produced substrates JOB1 and 2, and during the continuous production of the substrates JOB1, 2, 11 Is not exchanged.
- the condition determining device performs a condition determining process for the next production process.
- the next production process is a process of continuously producing the substrate JOB12 as a small-volume product instead of producing the substrate JOB11 while continuously producing the substrates JOB1 and 2 as mass-produced products.
- the nozzle is replaced at T4 in FIG.
- the nozzles are arranged based on the arrangement determined in the third condition determination process at T2.
- the production of the mass-produced substrates JOB1 and 2 in the first transport lanes 11 and 21 is temporarily stopped.
- the nozzle after replacement by T4 is not optimal for the production of only the substrates JOB1 and JOB2. Therefore, in order to lengthen the production of the substrates JOB1 and JOB2 using the optimal nozzle before replacement, the replacement with the non-optimal nozzle is performed after the end of the arrangement changing process of the second component group.
- the condition determining apparatus executes the condition determining process shown in FIG. 3 based on the plurality of types of substrates JOB1, 2, and 13.
- the board JOB13 of the low-volume production product can be produced by each nozzle determined based on the first component group mounted on the boards JOB1 and 2 of the mass-production product. Therefore, S2: Y in FIG. 3, and the second condition determination process of S3 is performed, and the arrangement of a plurality of types of second component groups mounted on the board JOB 13 is determined.
- the arrangement of the nozzles means to return to the original arrangement, that is, the arrangement of the nozzles in T1 to T3 after the production of the substrate JOB12 is completed.
- the production of the mass-produced substrates JOB1 and 2 in the first transport lanes 11 and 21 is temporarily stopped.
- the nozzle is exchanged and returned to the initial nozzle arrangement. That is, the nozzles are arranged based on the arrangement determined in the first condition determination process at the beginning of the current production.
- the worker arranges the second component group to be mounted on the board JOB 13 based on the determined arrangement of the second component group. That is, when the nozzle arrangement is returned to the optimum state for the production of JOBs 1 and 2, nozzle replacement is performed simultaneously with the arrangement changing process of the second component group.
- the second component group mounted on the substrate JOB 13 is arranged in the second regions D2 and D3 (shown in FIG. 1) of the component supply units 13 and 23. That is, in the second regions D2 and D3, the worker selects a plurality of types of second components mounted on the substrate JOB13, which is the next production target, from a plurality of types of second component groups mounted on the substrate JOB12, which is the previous production target. An arrangement change process is performed on the second component group.
- the production of the mass-produced substrates JOB1 and TOB2 at T7 and T8 in FIG. 4 is in an optimal state (a state in which the cycle time is shortened), similarly to T1 to T3 in FIG.
- the condition determining device uses the state in which the arrangement of the first component group mounted on the boards JOB1 and 2 of the mass-produced product is fixed as the constraint condition in the second condition determining process and the third condition determining process. is there.
- the arrangement of the nozzles is determined based on a plurality of types of first component groups in the mass-produced products JOB1 and 2, and in the second condition determination process (FIG. 3).
- S3 the arrangement of the plurality of types of second component groups is determined in a state where the arrangement of the nozzles determined in the first condition determination process is fixed. Therefore, at T2, T3, and T8 in FIG. 4, it is possible to produce substrates JOB11 and 13 as small-volume products while maintaining the optimal production of the substrates JOB1 and 2 as mass-produced products.
- the component placement region D of each of the component supply units 33 and 43 includes a fourth region D4 (a left region in FIG. 5) in which a plurality of types of fourth component groups are disposed, and a fifth region in which a plurality of types of fifth component groups are disposed. It is divided into D5 (the right region in FIG. 5).
- the fourth region D4 and the fifth region D5 have substantially the same region, and approximately the same number of tape-type feeders or tray-type feeders are arranged in the fourth region D4 and the fifth region D5.
- the fourth substrate group U4 (1) includes a plurality of types of substrates JOB1 to 3, and the plurality of types of substrates JOB1 to 3 are mounted with a plurality of types of fourth component groups P4 (1).
- a plurality of types of fourth nozzles N4 (1) are used for mounting the plurality of types of fourth component groups P4 (1). That is, the fourth nozzles in the mounting heads 14 and 24 are fixed so that the fourth nozzles N4 (1) attached to the mounting heads 14 and 24 are fixed during the continuous production of the fourth substrate group U4 (1).
- the arrangement of N4 (1) and the arrangement of a plurality of types of fourth component groups P4 (1) in the component supply units 13 and 23 are determined (fourth condition determination step). In other words, the plurality of types of component groups P4 (1) are mounted while the plurality of types of fourth nozzles N4 (1) are attached to the mounting heads 14 and 24.
- the plural types of fourth component groups P4 (1) are component groups arranged in the fourth region D4 (shown in FIG. 5) in the component arrangement regions of the component supply units 33 and 43.
- the number of types of the plurality of types of fourth component groups P4 (1) is equal to or less than the maximum number of arrangement of the fourth region D4.
- the fourth region D4 is about half of the component placement region of all the component supply units 13 and 23.
- the determination of the fourth substrate group U4 (1) is performed as follows. First, it is determined whether or not a plurality of types of component groups mounted on the boards JOB 1 and 2 can be mounted in the fourth region D 4. In this case, the nozzle arrangement is determined so that the nozzles attached to the mounting heads 14 and 24 are common to the JOBs 1 and 2. As a result, if it is determined that the parts cannot be arranged or the nozzles cannot be arranged in common, the fourth board group U4 (1) is only the board JOB1.
- a component group including a plurality of types of component groups mounted on the next substrate JOB3 can be mounted in the fourth region D4, and Determine whether nozzles can be placed in common. If it is determined that the nozzles cannot be arranged or the nozzles cannot be arranged in common, the fourth substrate group U4 (1) becomes the substrates JOB1 and JOB2.
- the component group including a plurality of types of component groups mounted on the next board JOB4 can be mounted in the fourth region D4, and the nozzle is arranged in common. Determine if you can.
- the substrates of the fourth substrate group U4 (1) are determined repeatedly.
- the substrates JOB1 to JOB3 are determined as the substrates of the fourth substrate group U4 (1).
- the worker places the fourth component group P4 (1) of the boards JOB1 to 3 included in the fourth board group U4 (1) in the fourth region D4.
- the fourth part group P4 (1) is determined in advance based on the production plan (fourth condition determining step).
- the substrates JOB1 to JOB3 are transported to the first transport lanes 11 and 21 and the second transport lanes 12 and 22, respectively.
- the substrates JOB1 to 3 are continuously produced (production process).
- the fourth nozzle N4 (1) is not changed.
- nozzle replacement from the fifth nozzle N5 (1) to the fourth nozzle N4 (2) is performed at T15 in FIG.
- the fourth nozzle N4 (2) is determined in advance based on the production plan (fourth condition determining step). Further, the mounting heads 14 and 24 are stopped during the nozzle replacement.
- the fourth nozzles N4 (1), N4 (2) are not exchanged, and the cycle time can be shortened. That is, by grouping a plurality of types of substrates JOB1 to 14 as a group (fourth substrate group U4 (1), U4 (2) or fifth substrate group U5 (1), U5 (2)) according to the order of the production plan, The number of nozzle replacements can be reduced.
- the component placement areas of the component supply units 13 and 23 are partitioned into the fourth area D4 and the fifth area D5, so that the mounting heads 14 and 24 are in the fourth part group P4 (1) in the fourth area D4,
- P4 (2) the operator can freely arrange the fifth component groups P5 (1) and P5 (2) in the fifth region D5. While the worker is performing the arrangement process of the fifth component group P5 (1) and P5 (2) in the fifth region D5, the mounting heads 14 and 24 are the fourth component group in the fourth region D4. Since the mounting of P4 (1) and P4 (2) is performed, even if the worker performs the placement process of the fifth parts group P5 (1) and P5 (2) in the fifth area D5, the cycle time Does not increase.
Abstract
Description
第一発明に係る基板生産方法は、直列に配置された複数台の部品実装機を用いて、複数種の基板の連続生産を行う基板生産方法である。前記複数台の部品実装機の各々は、前記複数種の基板を搬送する複数の搬送レーンと、複数種の部品群を配置する部品配置領域を備える部品供給部と、少なくとも1以上のノズルが取り付けられ、前記搬送レーンを搬送する前記基板に前記部品供給部から供給される前記複数種の部品群を装着する1つの実装ヘッドと、を備える。
本発明は、基板生産方法の他に、基板生産の条件決定方法としても捉えることができる。すなわち、本発明に係る基板生産の条件決定方法は、直列に配置された複数台の部品実装機を用いて複数種の基板の連続生産を行う際の生産条件を決定する基板生産の条件決定方法である。前記複数台の部品実装機の各々は、前記複数種の基板を搬送する複数の搬送レーンと、複数種の部品群を配置する部品配置領域を備える部品供給部と、少なくとも1以上のノズルが取り付けられ、前記搬送レーンを搬送する前記基板に前記部品供給部から供給される前記複数種の部品群を装着する1つの実装ヘッドと、を備える。
(電子部品実装システムの構成)
電子部品実装システム1の構成について図1を参照して説明する。電子部品実装システム1は、直列に配置された複数台の部品実装機10,20を備え、複数種の基板の連続生産を行う。複数台の部品実装機10,20の各々は、デュアル搬送レーンで且つシングル実装ヘッドのタイプである。
次に、図1に示す電子部品実装システム1を用いる基板の生産計画について、図2を参照して説明する。図2に示すように、生産計画は、量産製品としての複数種の基板JOB1,2(第一基板)を連続して生産すると共に、量産製品としての複数種の基板JOB1,2の連続生産中に、少量生産製品としての基板JOB11~13(第二基板)を連続生産する計画であるとする。
次に、図1を参照して、部品供給部13,23における各部品群の配置について説明する。図1に示すように、部品供給部13,23における部品配置領域Dのうち、中央に位置する第一領域D1には、量産製品である複数種の基板JOB1,2に実装される複数種の第一部品群が配置される。一方、第一領域D1以外の第二領域D2,D3には、少量生産製品である複数種の基板JOB11~13に実装される複数種の第二部品群が配置される。第二領域D2,D3には、基板JOB11~13の種類毎の複数種の第二部品群が交換されながら配置される。また、第一領域D1の割合は、複数種の第一部品群の数に応じて異なる。また、第一領域D1の割合は、図1に示すように、部品実装機10,20によっても異なる。
次に、各実装ヘッド14,24におけるノズルの配置、及び、各部品供給部13,23における複数種の部品群の配置の決定方法について、図3を参照して説明する。条件決定方法は、条件決定装置としてのコンピュータによって実行される。条件決定装置は、生産計画に基づいて、少量生産製品の基板JOB11~13が存在するか否かを判定する。少量生産製品の基板JOB11~13が存在しなければ、以下に説明する条件決定処理を行うことはない。
次に、図2に示す生産計画に基づいて基板生産を行う場合に、第一搬送レーン11,21及び第二搬送レーン12,22を搬送される基板JOBの種類、条件決定処理、ノズルの交換、並びに、部品群の配置処理について、図4を参照して説明する。
本実施形態の電子部品実装システム2の構成について図5を参照して説明する。ただし、本実施形態のシステム2における各構成のうち上記実施形態のシステム1と同一構成については、同一符号を付す。各部品供給部33,43の部品配置領域Dは、複数種の第四部品群を配置する第四領域D4(図5の左側領域)と、複数種の第五部品群を配置する第五領域D5(図5の右側領域)とに区画される。第四領域D4と第五領域D5とは、ほぼ同程度の領域を有しており、第四領域D4と第五領域D5には、ほぼ同数のテープ型フィーダ又はトレー型フィーダが配置される。
次に、図5に示す電子部品実装システム2を用いる基板の生産計画について、図6を参照して説明する。図6に示すように、生産計画は、複数種の基板JOB1~14を順に生産終了する計画である。ただし、後述する個々の基板群の中においては、各基板を順に生産することに限定しなくてもよい。例えば、基板JOB2の生産は、基板JOB1の生産が終了してから行うことに限定されず、基板JOB1と同時に生産することは許容されるようにしてもよい。
次に、図6に示す生産計画に基づいて基板生産を行う場合に、第一搬送レーン11,21及び第二搬送レーン12,22を搬送される基板JOBの種類、ノズルの交換、並びに、第四部品群及び第五部品群の配置処理について、図7を参照して説明する。
Claims (11)
- 直列に配置された複数台の部品実装機を用いて、複数種の基板の連続生産を行う基板生産方法であって、
前記複数台の部品実装機の各々は、
前記複数種の基板を搬送する複数の搬送レーンと、
複数種の部品群を配置する部品配置領域を備える部品供給部と、
少なくとも1以上のノズルが取り付けられ、前記搬送レーンを搬送する前記基板に前記部品供給部から供給される前記複数種の部品群を装着する1つの実装ヘッドと、
を備え、
前記基板生産方法は、
連続生産を行う前記複数種の基板に実装される複数種の部品群に基づいて、前記複数種の基板の連続生産中に各前記実装ヘッドに取り付けられる前記ノズルを固定した状態となるように、各前記実装ヘッドにおける前記ノズルの配置及び各前記部品供給部における前記複数種の部品群の配置を決定する条件決定工程と、
前記条件決定工程にて決定された各前記ノズルの配置及び前記複数種の部品群の配置において、前記複数種の基板の連続生産を行う生産工程と、
を備える、基板生産方法。 - 前記基板生産方法は、1種以上の第一基板及び1種以上の第二基板を連続生産し、
前記条件決定工程は、
前記第一基板に実装される複数種の第一部品群に基づいて、各前記実装ヘッドに取り付けられる前記ノズルの配置及び各前記部品供給部における前記複数種の第一部品群の配置を決定する第一条件決定工程と、
前記第一条件決定工程により決定された各前記ノズルの配置を固定した状態を拘束条件として、前記第二基板に実装される複数種の第二部品群に基づいて、各前記部品供給部における前記複数種の第二部品群の配置を決定する第二条件決定工程と、
を備え、
前記生産工程は、前記第一条件決定工程にて決定された各前記ノズルの配置及び前記複数種の第一部品群の配置、並びに、前記第二条件決定工程にて決定された前記複数種の第二部品群の配置において、前記第一基板及び前記第二基板の連続生産を行う、請求項1に記載の基板生産方法。 - 前記第二条件決定工程は、前記部品配置領域のうち前記複数種の第一部品群が配置される第一領域以外の第二領域を使用して、前記複数種の第二部品群の配置を決定する、請求項2に記載の基板生産方法。
- 前記第二条件決定工程は、前記第二基板の種類毎に、前記第二領域を使用して前記複数種の第二部品群の配置を決定し、
前記第二領域において、前の生産対象である前記第二基板に実装される前記複数種の第二部品群から、次の生産対象である前記第二基板に実装される前記複数種の第二部品群への配置変更処理は、前記第一基板の生産中に行われる、請求項3に記載の基板生産方法。 - 前記条件決定工程は、
前記第一条件決定工程により決定された各前記ノズルの配置を固定した状態を拘束条件としたときに前記第二基板の生産が不可の場合に、
前記第一条件決定工程により決定された前記複数種の第一部品群の配置を固定した状態を拘束条件とし、且つ、前記第一条件決定工程にて決定された前記ノズルに含まれていないノズルであって前記第二部品群の実装と前記第一部品群の実装とに共用可能なノズルを用いつつ、
各前記実装ヘッドに取り付けられる前記ノズルの配置の再決定及び前記複数種の第二部品群の配置の決定を行う第三条件決定工程を備える、請求項2~4の何れか一項に記載の基板生産方法。 - 前記第一基板は、量産製品の基板であり、
前記第二基板は、少量生産製品の基板である、
請求項2~5の何れか一項に記載の基板生産方法。 - 前記部品供給部は、前記複数の搬送レーンのうち第一搬送レーンに近接する側のみに配置され、
前記第一搬送レーンは、前記量産製品の基板のみを搬送し、
前記少量生産製品の基板は、前記複数の搬送レーンのうち前記部品供給部から遠い側に位置する第二搬送レーンのみを搬送される、
請求項6に記載の基板生産方法。 - 前記基板生産方法は、複数種の第四基板を含む第四基板群を連続生産し、次いで複数種の第五基板を含む第五基板群を連続生産する生産計画に基づいて実行され、
各前記部品供給部における前記部品配置領域は、前記第四基板群に実装される複数種の第四部品群を配置する第四領域と、前記第五基板群に実装される複数種の第五部品群を配置する第五領域と、に区画され、
各前記実装ヘッドには、前記複数種の第四部品群の実装時には第四ノズルが取り付けられ、前記第五部品群の実装時には第五ノズルが取り付けられ、
前記条件決定工程は、
前記複数種の第四部品群に基づいて、前記第四基板群の連続生産中に各前記実装ヘッドに取り付けられる前記第四ノズルを固定した状態となるように、各前記実装ヘッドにおける前記第四ノズルの配置及び各前記部品供給部における前記複数種の第四部品群の配置を決定する第四条件決定工程と、
前記複数種の第五部品群に基づいて、前記第五基板群の連続生産中に各前記実装ヘッドに取り付けられる前記第五ノズルを固定した状態となるように、各前記実装ヘッドにおける前記第五ノズルの配置及び各前記部品供給部における前記複数種の第五部品群の配置を決定する第五条件決定工程と、
を備える、請求項1に記載の基板生産方法。 - 前記部品供給部の前記第五領域における前記複数種の第五部品群の配置処理は、前記第四基板群の生産中に行われる、請求項8に記載の基板生産方法。
- 前記生産工程は、
前記第四基板群のうちの同種基板を前記複数の搬送レーンのうち2以上の搬送レーンに搬送して、前記第四基板群のうちの同種基板の生産を行う、
又は、前記第五基板群のうちの同種基板を前記複数の搬送レーンのうち2以上の搬送レーンに搬送して、前記第五基板群のうちの同種基板の生産を行う、請求項8又は9に記載の基板生産方法。 - 直列に配置された複数台の部品実装機を用いて複数種の基板の連続生産を行う際の生産条件を決定する基板生産の条件決定方法であって、
前記複数台の部品実装機の各々は、
前記複数種の基板を搬送する複数の搬送レーンと、
複数種の部品群を配置する部品配置領域を備える部品供給部と、
少なくとも1以上のノズルが取り付けられ、前記搬送レーンを搬送する前記基板に前記部品供給部から供給される前記複数種の部品群を装着する1つの実装ヘッドと、
を備え、
前記条件決定方法は、
連続生産を行う前記複数種の基板に実装される複数種の部品群に基づいて、前記複数種の基板の連続生産中に各前記実装ヘッドに取り付けられる前記ノズルを固定した状態となるように、各前記実装ヘッドにおける前記ノズルの配置及び各前記部品供給部における前記複数種の部品群の配置を決定する、
基板生産の条件決定方法。
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