WO2015198697A1 - 光電変換膜、固体撮像素子、および電子機器 - Google Patents
光電変換膜、固体撮像素子、および電子機器 Download PDFInfo
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- WO2015198697A1 WO2015198697A1 PCT/JP2015/061762 JP2015061762W WO2015198697A1 WO 2015198697 A1 WO2015198697 A1 WO 2015198697A1 JP 2015061762 W JP2015061762 W JP 2015061762W WO 2015198697 A1 WO2015198697 A1 WO 2015198697A1
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- substituted
- photoelectric conversion
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- solid
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/20—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising organic-organic junctions, e.g. donor-acceptor junctions
- H10K30/211—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising organic-organic junctions, e.g. donor-acceptor junctions comprising multiple junctions, e.g. double heterojunctions
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/02—Boron compounds
- C07F5/022—Boron compounds without C-boron linkages
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/17—Colour separation based on photon absorption depth, e.g. full colour resolution obtained simultaneously at each pixel location
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
- H10K85/322—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising boron
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
Definitions
- the present disclosure relates to a photoelectric conversion film, a solid-state imaging device, and an electronic device.
- Patent Document 1 discloses a solid-state imaging device in which organic photoelectric conversion films that absorb blue light, green light, and red light are stacked.
- a signal of each color is extracted by photoelectrically converting light corresponding to each color in each organic photoelectric conversion film.
- Patent Document 2 discloses a solid-state imaging device in which an organic photoelectric conversion film that absorbs green light and a silicon photodiode are stacked.
- a green light signal is extracted by an organic photoelectric conversion film, and then blue light and red light are colored using a difference in light penetration depth by a silicon photodiode. The blue light signal and the red light signal are respectively extracted.
- the photoelectric conversion unit in the vertical spectral type solid-state imaging device selectively absorbs light in a specific wavelength region corresponding thereto and transmits light outside the wavelength region to be absorbed. It is required to make it.
- the photoelectric conversion unit corresponding to green light is required to selectively absorb green light and perform photoelectric conversion, and sufficiently transmit blue light on the short wavelength side and red light on the long wavelength side.
- a photoelectric conversion film capable of selectively absorbing green light has been demanded.
- the solid-state imaging device can improve the sensitivity of green light, blue light, and red light, and improve imaging characteristics.
- the present disclosure provides a new and improved photoelectric conversion film capable of improving the imaging characteristics of a solid-state image sensor, a solid-state image sensor including the photoelectric conversion film, and an electronic apparatus including the solid-state image sensor. To do.
- a photoelectric conversion film including a subphthalocyanine derivative represented by the following general formula (1) is provided.
- X is halogen, hydroxy group, thiol group, amino group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkylamine group, substituted or Any substituent selected from the group consisting of an unsubstituted arylamine group, a substituted or unsubstituted alkylthio group, and a substituted or unsubstituted arylthio group;
- R 1 to R 3 are each independently a substituted or unsubstituted ring structure; At least one of R 1 to R 3 contains at least one hetero atom in the ring structure.
- a solid-state imaging device including a photoelectric conversion film including the subphthalocyanine derivative represented by the general formula (1) is provided.
- a solid-state imaging device including a photoelectric conversion film including the subphthalocyanine derivative represented by the general formula (1), An optical system for guiding incident light to the solid-state imaging device; An electronic device is provided that includes an arithmetic processing circuit that performs arithmetic processing on an output signal from the solid-state imaging device.
- the photoelectric conversion film can selectively absorb green light and sufficiently transmit blue light and red light.
- FIG. 1A is a schematic diagram of a vertical spectral solid-state imaging device according to an embodiment of the present disclosure
- FIG. 1B is a schematic diagram of a planar solid-state imaging device according to a comparative example. .
- absorbing light of a certain wavelength means absorbing about 70% or more of light of that wavelength.
- transmitting light of a certain wavelength or “not absorbing light of a certain wavelength” means transmitting about 70% or more of light of that wavelength and absorbing less than about 30%. Represents.
- a solid-state imaging device 1 includes a green photoelectric conversion element 3G that absorbs green light 2G, a blue photoelectric conversion element 3B that absorbs blue light 2B, A red photoelectric conversion element 3R that absorbs red light 2R is stacked.
- the green photoelectric conversion element 3G is a photoelectric conversion element that selectively absorbs green light having a wavelength of 450 nm or more and less than 600 nm
- the blue photoelectric conversion element 3B is selectively blue light having a wavelength of 400 nm or more and less than 450 nm
- the red photoelectric conversion element 3R is a photoelectric conversion element that selectively absorbs red light having a wavelength of 600 nm or more.
- the blue photoelectric conversion device 3B and the red photoelectric conversion device 3R use the difference in the light penetration depth with respect to the solid-state imaging device 1 to use the blue light 2B and the red light.
- a photodiode that separates colors of 2R may be used.
- the photodiode is a silicon photodiode that absorbs light having a wavelength of 1100 nm or less, for example.
- the red light 2R has a wavelength longer than that of the blue light 2B, and thus is not easily scattered, and enters the depth away from the incident surface.
- the blue light 2B since the blue light 2B has a shorter wavelength than the red light 2R and is likely to be scattered, the blue light 2B enters only to a depth closer to the incident surface. Therefore, the red light 2R can be separated and detected from the blue light 2B by disposing the red photoelectric conversion element 3R at a deep position away from the incident surface of the solid-state imaging element 1.
- the blue light 2B and the red light 2R are separated using the difference in the light penetration depth, and signals of each color are extracted. be able to.
- the planar solid-state imaging device 5 includes photodiodes 7R, 7G, and 7B, and color filters 6R, 6G, and 6B formed on the photodiodes 7R, 7G, and 7B.
- the color filters 6R, 6G, and 6B are films that selectively transmit only light in a specific wavelength region.
- the color filter 6R selectively transmits red light 2R having a wavelength of 600 nm or more
- the color filter 6G selectively transmits green light 2G having a wavelength of 450 nm or more and less than 600 nm
- the color filter 6B is 400 nm.
- the blue light 2B having a wavelength of less than 450 nm is selectively transmitted.
- the photodiodes 7R, 7G, and 7B are light detection elements that absorb light in a wide wavelength range.
- the photodiodes 7R, 7G, and 7B may be silicon photodiodes that absorb light having a wavelength of 1100 nm or less.
- the photodiodes 7R, 7G, and 7B absorb light in a wide wavelength region, the photodiodes 7R, 7G, and 7B alone cannot perform color separation. . Therefore, in the solid-state imaging device 5, color separation is performed by selectively transmitting only light corresponding to each color by the color filters 6R, 6G, and 6B. Since only the red light 2R, the green light 2G, and the blue light 2B corresponding to the respective colors are incident on the photodiodes 7R, 7G, and 7B by the color filters 6R, 6G, and 6B, the photodiodes 7R, 7G, and 7B The signal can be extracted.
- the photodiodes 7R, 7G, and 7B can substantially use only 1/3 of the incident light for photoelectric conversion, and the solid-state imaging device 5 shown in FIG. There were limits.
- each photoelectric conversion device can selectively absorb light in a specific wavelength region corresponding to red, green, and blue. Therefore, in the solid-state imaging device 1 according to an embodiment of the present disclosure, a color filter for color-separating light incident on the photoelectric conversion element is not necessary, and thus all incident light can be used for photoelectric conversion. Therefore, since the solid-state imaging device 1 according to an embodiment of the present disclosure can increase light that can be used for photoelectric conversion approximately three times as compared with the solid-state imaging device 5 according to the comparative example, the detection sensitivity of each color Can be further improved.
- the photoelectric conversion elements 3G, 3B, and 3R selectively absorb light in specific wavelength regions corresponding to red, green, and blue, respectively. In addition, it is required to transmit light outside the wavelength region to be absorbed.
- the green photoelectric conversion element 3G sufficiently absorbs green light to improve color separation in the blue photoelectric conversion element 3B and the red photoelectric conversion element 3R disposed below the green photoelectric conversion element 3G.
- the green photoelectric conversion element 3G is required to have an absorption spectrum having a steep peak in a wavelength region of 450 nm to 600 nm.
- subphthalocyanine chloride (SubPc—Cl) having the following structural formula has been proposed as a green light absorbing material in the green photoelectric conversion element 3G.
- FIG. 2 is a graph showing the light absorption spectrum of SubPc—Cl measured with a visible ultraviolet spectrophotometer.
- the light absorption spectrum of SubPc-Cl shown in FIG. 2 was measured using a sample in which 50 nm of SubPc-Cl was vapor-deposited on a quartz substrate, and normalized so that the absorbance at the maximum absorption wavelength was 90%. .
- SubPc-Cl has a light absorption characteristic having a peak on the long wavelength side as a whole, and absorbs light in the long wavelength region more strongly than green light. Specifically, it can be seen that SubPc—Cl has a maximum absorption wavelength in the vicinity of a wavelength of 600 nm and strongly absorbs light having a wavelength of 600 nm or more. Therefore, when the green photoelectric conversion element 3G is formed using SubPc-Cl, the green photoelectric conversion element 3G also absorbs light having a wavelength corresponding to the red light, so that the red light is converted in the lower red photoelectric conversion element 3R. Sensitivity may be reduced.
- the inventors of the present disclosure have intensively studied a photoelectric conversion film suitable for the green photoelectric conversion element 3G, and as a result, have come up with a technique according to the present disclosure.
- a photoelectric conversion film suitable for the green photoelectric conversion element 3G of the solid-state imaging device will be described.
- a photoelectric conversion film according to an embodiment of the present disclosure is a photoelectric conversion film including a subphthalocyanine derivative represented by the following general formula (1).
- X is halogen, hydroxy group, thiol group, amino group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkylamine group, substituted or Any substituent selected from the group consisting of an unsubstituted arylamine group, a substituted or unsubstituted alkylthio group, and a substituted or unsubstituted arylthio group;
- R 1 to R 3 are each independently a substituted or unsubstituted ring structure; At least one of R 1 to R 3 contains at least one hetero atom in the ring structure.
- one of the bonds between central boron and nitrogen is a coordination bond.
- the subphthalocyanine derivative represented by the general formula (1) contains at least one heteroatom in the ring structure of R 1 to R 3 , thereby producing green light. It can have a light absorption characteristic suitable as a photoelectric conversion film that absorbs light. Specifically, the subphthalocyanine derivative represented by the general formula (1) has reduced absorption of light in the long wavelength region and selectively absorbs light in the green light region (for example, the wavelength is 450 nm or more and less than 600). It has light absorption characteristics that can be achieved.
- At least one of R 1 to R 3 is preferably a ring structure having a substituent.
- the subphthalocyanine derivative represented by the general formula (1) has a higher yield in the synthesis method described later. Can be synthesized at a rate.
- the subphthalocyanine derivative represented by the general formula (1) is synthesized at a higher yield. This is preferable.
- at least one of R 1 to R 3 may be a ring structure having halogen as a substituent.
- R 1 to R 3 may be a ring structure in which some hydrogens are substituted with substituents, or a ring structure in which all hydrogens are substituted with substituents. It may be. Further, the substituent may be substituted with respect to the ring structure of R 1 to R 3 so that the subphthalocyanine derivative represented by the general formula (1) has symmetry, or has no symmetry. In this way, the ring structure of R 1 to R 3 may be substituted.
- R 1 to R 3 are preferably a ring structure having a ⁇ -conjugated structure.
- the subphthalocyanine derivative represented by the general formula (1) has an absorption spectrum suitable for absorbing green light having a wavelength of 450 nm or more and less than 600 nm. Can have.
- the subphthalocyanine derivative represented by the general formula (1) has a length of the conjugated system in the whole molecule. Becomes shorter, the absorption region moves greatly to the short wavelength side. Therefore, the subphthalocyanine derivative represented by the general formula (1) is not preferable because absorption of blue light, which is a shorter wavelength region than green light, increases.
- R 1 to R 3 may be a ring structure having any number of ring constituent atoms. Further, R 1 to R 3 may be a monocyclic structure or a condensed ring structure. However, R 1 to R 3 are preferably a ring structure having 3 to 8 ring atoms, and more preferably a ring structure having 6 ring atoms. For example, when the number of ring-constituting atoms is less than 6, the ring structure is likely to be distorted and the subphthalocyanine derivative represented by the general formula (1) becomes unstable, which is not preferable. Further, when the number of ring-constituting atoms is more than 6, it is not preferable because the molecular weight of the subphthalocyanine derivative represented by the general formula (1) becomes large and handling becomes difficult.
- the heteroatom contained in the ring structure of R 1 to R 3 is preferably a nitrogen atom.
- a nitrogen atom is included in the ring structure of R 1 to R 3 , the absorption region of the subphthalocyanine derivative represented by the general formula (1) moves to the short wavelength side, and the absorption of light in the long wavelength region is reduced. Therefore, it can be suitably used for a photoelectric conversion film that absorbs green light.
- heteroatoms R 1 ⁇ R 3 contain in the ring structure, the sub-phthalocyanine derivative represented by the general formula (1) is included with respect to the ring structure of R 1 ⁇ R 3 so as to have symmetry It may be included in the ring structure of R 1 to R 3 so as not to have symmetry.
- the subphthalocyanine derivative included in the photoelectric conversion film according to an embodiment of the present disclosure is a compound including a ring structure represented by the following structural examples (1) to (17).
- the ring structure of the subphthalocyanine derivative according to an embodiment of the present disclosure is not limited to the following structural examples (1) to (17).
- X is halogen, hydroxy group, thiol group, amino group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkylamine group, substituted or It is any substituent selected from the group consisting of an unsubstituted arylamine group, a substituted or unsubstituted alkylthio group, and a substituted or unsubstituted arylthio group.
- subphthalocyanine derivative represented by the general formula (1) are shown by the following general formulas (2) to (7).
- the subphthalocyanine derivative according to an embodiment of the present disclosure is not limited to the compound examples represented by the following general formulas (2) to (7).
- X is halogen, hydroxy group, thiol group, amino group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkylamine group, substituted or It is any substituent selected from the group consisting of an unsubstituted arylamine group, a substituted or unsubstituted alkylthio group, and a substituted or unsubstituted arylthio group.
- X is not limited to the above-described substituents, and is a substituent capable of bonding to boron (B). Any substituent may be used as long as it is a group. However, X is preferably a halogen. When X is halogen, the thermal stability of the subphthalocyanine derivative represented by the general formula (1) is improved, so that the stability of the photoelectric conversion film can be improved.
- the photoelectric conversion film containing the subphthalocyanine derivative represented by the general formula (1) described above is formed as a bulk hetero mixed film containing the subphthalocyanine derivative represented by the general formula (1) as an n-type photoelectric conversion material. Also good.
- the bulk hetero-mixed film is, for example, that one of the p-type photoelectric conversion material and the n-type photoelectric conversion material forming the mixed film is in the crystalline fine particle state and the other is in the amorphous state.
- the area of the pn junction that induces charge separation is increased by the fine structure, so that charge separation can be induced more efficiently and the photoelectric conversion efficiency can be improved.
- the bulk heteromixed film may be a film having a fine structure in which the p-type photoelectric conversion material and the n-type photoelectric conversion material forming the film are mixed in a fine crystalline state.
- the compound included as the p-type photoelectric conversion material has a charge transport property. It is possible to use various compounds having
- the p-type photoelectric conversion material included in the photoelectric conversion film according to an embodiment of the present disclosure may have at least one of a hole transport property and an electron transport property regardless of the wavelength to be absorbed.
- p-type photoelectric conversion materials include quinacridone derivatives, phthalocyanine derivatives, porphyrin derivatives, squarylium derivatives, naphthalene or perylene derivatives, cyanine derivatives, merocyanine derivatives, rhodamine derivatives, diphenylmethane or triphenylmethane derivatives, xanthene derivatives, acridine derivatives, phenoxazines Derivatives, quinoline derivatives, oxazole derivatives, thiazole derivatives, oxazine derivatives, thiazine derivatives, benzoquinone derivatives, naphthoquinone derivatives, anthraquinone derivatives, indigo or thioindigo derivative
- the p-type photoelectric conversion material may be a linked body, a multimer, a polymer, a copolymer, a block copolymer, or the like having the above-described substituent as a unit structure.
- a quinacridone derivative is preferable as the p-type photoelectric conversion material included in the photoelectric conversion film according to an embodiment of the present disclosure.
- the photoelectric conversion film according to an embodiment of the present disclosure has a heterojunction by stacking a subphthalocyanine derivative represented by the general formula (1) that is an n-type photoelectric conversion material and a p-type photoelectric conversion material. It may be a planar heterojunction film formed.
- the photoelectric conversion film which concerns on one Embodiment of this indication may contain the subphthalocyanine derivative represented by General formula (1) as a p-type photoelectric conversion material.
- the photoelectric conversion film according to an embodiment of the present disclosure may be formed as a single layer film including only the subphthalocyanine derivative represented by the general formula (1).
- the photoelectric conversion film according to an embodiment of the present disclosure includes the subphthalocyanine derivative represented by the general formula (1), thereby reducing absorption of light in the long wavelength region, and generating green light. Can be selectively absorbed. Therefore, the photoelectric conversion film according to an embodiment of the present disclosure is suitable as a green photoelectric conversion element of a solid-state image sensor, and improves the sensitivity of the solid-state image sensor by improving the color separation of each color light, and the imaging characteristics Can be improved.
- FIG. 3 is a schematic diagram illustrating an example of a photoelectric conversion element according to an embodiment of the present disclosure.
- the photoelectric conversion element 100 includes a substrate 102, a lower electrode 104 disposed on the substrate 102, and a p buffer layer 106 disposed on the lower electrode 104. , A photoelectric conversion layer 108 disposed on the p buffer layer 106, an n buffer layer 110 disposed on the photoelectric conversion layer 108, and an upper electrode 112 disposed on the n buffer layer 110.
- the structure of the photoelectric conversion element 100 illustrated in FIG. 3 is merely an example, and the structure of the photoelectric conversion element 100 according to an embodiment of the present disclosure is not limited to the structure illustrated in FIG.
- any one or more of the p buffer layer 106 and the n buffer layer 110 may be omitted.
- the substrate 102 is a support on which the layers constituting the photoelectric conversion element 100 are stacked.
- a substrate used in a general photoelectric conversion element can be used.
- the substrate 102 include various glass substrates such as a high strain point glass substrate, a soda glass substrate, and a borosilicate glass substrate, a quartz substrate, a semiconductor substrate, a plastic substrate such as polymethyl methacrylate, polyvinyl alcohol, polyimide, and polycarbonate. It may be.
- the substrate 102 is preferably made of a transparent material.
- the lower electrode 104 and the upper electrode 112 are made of a conductive material.
- the lower electrode 104 is disposed on the substrate 102, and the upper electrode 112 is disposed on the n buffer layer 110.
- at least one of the lower electrode 104 and the upper electrode 112 is made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).
- ITO indium tin oxide
- IZO indium zinc oxide
- both the lower electrode 104 and the upper electrode 112 are made of a transparent conductive material such as ITO.
- tin oxide TiOxide: TO
- tin oxide SnO 2
- zinc oxide-based material with a dopant added to zinc oxide ZnO
- examples of the zinc oxide-based material include aluminum zinc oxide (AZO) to which aluminum (Al) is added as a dopant, gallium zinc oxide (GZO) to which gallium (Ga) is added, and indium (In). Indium zinc oxide (IZO) can be given.
- indium gallium zinc oxide (IGZO), indium gallium oxide (IGO), aluminum gallium zinc oxide (AGZO), graphene, a metal thin film, and PEDOT may be used as the transparent conductive material.
- a bias voltage is applied to the lower electrode 104 and the upper electrode 112.
- the polarity of the bias voltage is set so that electrons move to the upper electrode 112 and holes move to the lower electrode 104 among the charges generated in the photoelectric conversion layer 108.
- the polarity of the bias voltage may be set so that holes move to the upper electrode 112 and electrons move to the lower electrode 104 among the charges generated in the photoelectric conversion layer 108.
- the positions of the p buffer layer 106 and the n buffer layer 110 are switched.
- the p buffer layer 106 is a layer that is disposed on the lower electrode 104 and performs a function of efficiently extracting holes from the photoelectric conversion layer 108.
- the p buffer layer 106 includes a p-type photoelectric conversion material having at least one of a hole transporting property and an electron transporting property.
- Examples of the p-type photoelectric conversion material include quinacridone derivatives, phthalocyanine derivatives, porphyrin derivatives, squarylium derivatives, naphthalene or perylene derivatives, cyanine derivatives, merocyanine derivatives, rhodamine derivatives, diphenylmethane or triphenylmethane derivatives, xanthene derivatives, acridine derivatives, phenoxy derivatives.
- the p-type photoelectric conversion material may be a linked body, a multimer, a polymer, a copolymer, a block copolymer, or the like having the above-described substituent as a unit structure.
- the wavelength band of light absorbed by the p-type photoelectric conversion material is not particularly limited, and may be any wavelength band.
- the p buffer layer 106 may be made of a hole transporting material, and is arylamine, oxazole, oxadiazole, triazole, imidazole, stilbene, polyarylalkane, porphyrin, anthracene, fluorenone, hydrazone. Alternatively, these derivatives may be used.
- the p buffer layer 106 includes N, N′-bis (3-methylphenyl)-(1,1′-biphenyl) -4,4′-diamine (TPD), 4,4′-bis [N- ( Naphthyl) -N-phenyl-amino] biphenyl ( ⁇ -NPD), 4,4 ′, 4 ′′ -tris (N- (3-methylphenyl) N-phenylamino) triphenylamine (m-MTDATA), tetraphenyl You may comprise porphyrin copper, phthalocyanine, copper phthalocyanine, etc.
- the photoelectric conversion layer 108 is a layer that is disposed on the p buffer layer 106 and performs a function of selectively absorbing green light (for example, light having a wavelength of 450 nm or more and less than 600 nm) and photoelectrically converting the absorbed light.
- the photoelectric conversion layer 108 includes the subphthalocyanine derivative represented by the general formula (1) described above.
- the photoelectric conversion layer 108 may be a bulk heteromixed film including a subphthalocyanine derivative represented by the general formula (1) as an n-type photoelectric conversion material and a quinacridone derivative as a p-type photoelectric conversion material.
- the photoelectric conversion layer 108 may be formed as a single layer in which an n-type photoelectric conversion material and a p-type photoelectric conversion material are mixed at a single ratio.
- the photoelectric conversion layer 108 may be formed of a plurality of layers in which the mixing ratio of the n-type photoelectric conversion material and the p-type photoelectric conversion material is changed in the stacking direction.
- the photoelectric conversion layer 108 includes a p layer formed of a p-type photoelectric conversion material from the p buffer layer 106 side, an i-layer in which an n-type photoelectric conversion material and a p-type photoelectric conversion material are mixed, and an n-type photoelectric conversion material. It may be formed in a multilayer structure in which n layers formed in (1) are stacked.
- the photoelectric conversion layer 108 is not limited to a bulk heteromixed film as long as the photoelectric conversion layer 108 includes a subphthalocyanine derivative represented by the general formula (1). Alternatively, it may be formed of a planar heterojunction film or the like.
- the n buffer layer 110 is a layer that is disposed on the photoelectric conversion layer 108 and performs a function of efficiently extracting electrons from the photoelectric conversion layer 108.
- the n buffer layer 110 is made of an electron transporting material such as fullerene, carbon nanotube, oxadiazole, triazole compound, anthraquinodimethane, diphenylquinone, distyrylarylene, silole compound, or these compounds. It may be composed of a derivative or the like.
- the n buffer layer 110 includes 1,3-bis (4-tert-butylphenyl-1,3,4-oxadiazolyl) phenylene (OXD-7), bathocuproine, bathophenanthroline, tris (8-hydroxyxyl).
- the material for forming each layer excluding the photoelectric conversion layer 108 is not particularly limited, and a known material for a photoelectric conversion element is used. It is also possible to do.
- each layer of the photoelectric conversion element 100 according to the embodiment of the present disclosure described above can be formed by selecting an appropriate film formation method according to the material such as vacuum deposition, sputtering, or various coating methods. .
- the lower electrode 104 and the upper electrode 112 are, for example, an evaporation method including an electron beam evaporation method, a hot filament evaporation method, and a vacuum evaporation method.
- Various printing methods such as sputtering, chemical vapor deposition (CVD), a combination of ion plating and etching, screen printing, ink jet printing, and metal mask printing, plating (electroplating) And an electroless plating method).
- the layers constituting the photoelectric conversion element 100 are, for example, a deposition method such as a vacuum deposition method. Further, it can be formed by a printing method such as a screen printing method and an ink jet printing method, a coating method such as a laser transfer method, and a spin coating method.
- Simulation analysis First, the spectral characteristics of the subphthalocyanine derivative according to an embodiment of the present disclosure were evaluated by simulation analysis. Specifically, simulation analysis was performed on a subphthalocyanine derivative represented by the following structural formula, and the maximum absorption wavelength ⁇ max was calculated. For comparison, simulation analysis was also performed for the subphthalocyanine derivatives (SubPc-Cl, SubPc-F) according to the comparative example, and the maximum absorption wavelength ⁇ max was calculated.
- TD-DFT Time-Dependent DFT
- the maximum absorption wavelength ⁇ max of each subphthalocyanine derivative calculated by simulation analysis is shown in Table 1 below.
- the maximum absorption wavelength ⁇ max of each subphthalocyanine derivative shown in Table 1 is a simulation analysis result in a single molecule, an absolute value does not coincide with an actually measured value of an absorption spectrum measured in a solution described later. However, as can be seen from the measured values of the absorption spectrum in the solution described later, the following simulation analysis results and the measured results have the same tendency.
- the subphthalocyanine derivatives according to Examples 1 to 8 have a shorter maximum absorption wavelength ⁇ max than the subphthalocyanine derivatives according to Comparative Examples 1 and 2, and the long wavelength region It can be seen that the absorption of light is reduced.
- Example 1 and Comparative Examples 1 and 2 when Example 1 and Comparative Examples 1 and 2 are compared, the ring structure of R 1 to R 3 in the general formula (1) does not depend on the substituent bonded to the central boron. It can be seen that ⁇ max is shortened by introducing a nitrogen atom which is a heteroatom. In addition, when Examples 1 and 5 to 7 are compared, it can be seen that even when a substituent is introduced into the ring structure of R 1 to R 3 in the general formula (1), ⁇ max similarly shortens the wavelength. . Further, when Examples 1 to 4 are compared, the heteroatoms contained in the ring structures of R 1 to R 3 are independent of the number of ring constituent atoms of the ring structures of R 1 to R 3 in the general formula (1). It can be seen that ⁇ max has a shorter wavelength regardless of the number and position of.
- the subphthalocyanine derivative according to one embodiment of the present disclosure has a maximum absorption wavelength by including at least one hetero atom in at least one of the ring structures R 1 to R 3 in the general formula (1). It can be seen that the wavelength can be shortened.
- the subphthalocyanine derivative according to an embodiment of the present disclosure can be synthesized by a generalized synthesis method represented by the following reaction formula 1. Note that the synthesis method described below is merely an example, and the synthesis method of the subphthalocyanine derivative according to an embodiment of the present disclosure is not limited to the following example.
- a 2,3-dicyanopyrazine derivative and boron trichloride are mixed in a solvent and heated to reflux to synthesize a subphthalocyanine derivative according to an embodiment of the present disclosure. be able to.
- the substituent Y substituted with the 2,3-dicyanopyrazine derivative is the same, but the substituent Y in the 2,3-dicyanopyrazine derivative may be different from each other. Needless to say, it is good.
- 6Cl-SubNPc-Cl having the following structural formula was synthesized by the same synthesis method as that for SubNPc-Cl.
- each subphthalocyanine derivative was dissolved in o-xylene, and a light absorption spectrum was obtained with a visible ultraviolet spectrophotometer using a quartz cell.
- the obtained light absorption spectrum of each subphthalocyanine derivative is shown in FIG.
- the light absorption spectrum shown in FIG. 4 is normalized so that the absorbance at the maximum absorption wavelength of each subphthalocyanine derivative is 1.
- SubNPc-Cl and 6Cl-SubNPc-Cl which are subphthalocyanine derivatives according to an embodiment of the present disclosure, have a short maximum absorption wavelength with respect to SubPc-Cl according to the comparative example. It turns out that it has become.
- the trend of the maximum absorption wavelength of 6Cl-SubNPc-Cl and SubPc-Cl measured is consistent with the trend of the maximum absorption wavelength of Example 5 and Comparative Example 1 of the above simulation analysis. Is appropriate.
- a photoelectric conversion element according to an embodiment of the present disclosure was manufactured using 6Cl-SubNPc-Cl synthesized above, and it was confirmed that the photoelectric conversion element functions as a photoelectric conversion element.
- Example 9 First, an indium tin oxide (ITO) film having a thickness of 100 nm was formed on a quartz substrate by a sputtering method, the formed ITO thin film was patterned by a photolithography method, and then etched to form a transparent lower electrode. Next, the formed transparent electrode is cleaned by UV / ozone treatment, and a photoelectric conversion layer is formed by vacuum-depositing 6Cl-SubNPc-Cl and quinacridone at a film formation ratio of 1: 1 using a shadow mask. Formed.
- ITO indium tin oxide
- a photoelectric conversion element was manufactured by the above manufacturing method.
- the photoelectric conversion function of the produced photoelectric conversion element according to Example 9 was evaluated. Specifically, using a prober connected to a semiconductor parameter analyzer, a bias voltage is applied to the upper electrode and the lower electrode of the photoelectric conversion element according to Example 1, and in the dark and during light irradiation through the quartz substrate. The current value was measured.
- FIG. 5 is a graph showing a change in current density with respect to the bias voltage of the photoelectric conversion element according to Example 9.
- the current density at the time of light irradiation is higher than the current density at the time of light irradiation in the bias voltage range of 0 to ⁇ 3V, and the photoelectric conversion function It can be seen that Therefore, it turns out that the subphthalocyanine derivative which concerns on one Embodiment of this indication can be used suitably as a photoelectric conversion material contained in a photoelectric converting film.
- the photoelectric conversion film according to an embodiment of the present disclosure includes a subphthalocyanine derivative represented by the general formula (1), thereby reducing light absorption in the long wavelength region, Light can be selectively absorbed. Therefore, it can be seen that the photoelectric conversion film according to an embodiment of the present disclosure can be suitably used for a green photoelectric conversion element of a solid-state imaging element, and can improve imaging characteristics of the solid-state imaging element.
- FIG. 6 is a schematic diagram illustrating a structure of a solid-state imaging element to which the photoelectric conversion element according to an embodiment of the present disclosure is applied.
- pixel areas 201, 211, and 231 are areas in which photoelectric conversion elements including a photoelectric conversion film according to an embodiment of the present disclosure are disposed.
- the control circuits 202, 212, and 242 are arithmetic processing circuits that control each configuration of the solid-state imaging device, and the logic circuits 203, 223, and 243 process signals that are photoelectrically converted by the photoelectric conversion elements in the pixel region. This is a signal processing circuit.
- a solid-state imaging device to which a photoelectric conversion device according to an embodiment of the present disclosure is applied includes a pixel region 201, a control circuit 202, and a logic circuit 203 in one semiconductor chip 200. And may be formed.
- a pixel region 211 and a control circuit 212 are formed in the first semiconductor chip 210.
- a multilayer solid-state imaging device in which a logic circuit 223 is formed in the second semiconductor chip 220 may be used.
- the pixel region 231 is formed in the first semiconductor chip 230, and the second semiconductor chip 240 is formed.
- a stacked solid-state imaging device in which a control circuit 242 and a logic circuit 243 are formed may be used.
- the pixel region is formed on a semiconductor chip different from the semiconductor chip on which at least one of the control circuit and the logic circuit is formed. Therefore, the solid-state imaging device shown in FIGS. 6B and 5C can expand the pixel region as compared with the solid-state imaging device shown in FIG. 6A. The resolution can be improved. Therefore, the solid-state image sensor to which the photoelectric conversion element according to an embodiment of the present disclosure is applied is more preferably the stacked solid-state image sensor illustrated in FIGS. 6B and 5C.
- FIG. 7 is a cross-sectional view illustrating a schematic structure of a unit pixel of a solid-state imaging element to which a photoelectric conversion element according to an embodiment of the present disclosure is applied.
- 7 is a back-illuminated solid-state image sensor in which light enters from a surface opposite to the surface on which the pixel transistors and the like are formed, and the upper side of the drawing is a light receiving surface. The lower side is a circuit formation surface on which pixel transistors and peripheral circuits are formed.
- the solid-state imaging device 300 includes a photoelectric conversion element including a first photodiode PD1 formed on the semiconductor substrate 330 and a second photodiode PD2 formed on the semiconductor substrate 330 in the photoelectric conversion region 320. And a photoelectric conversion element including the organic photoelectric conversion film 310 formed on the back surface side of the semiconductor substrate 330 is stacked in the light incident direction.
- the first photodiode PD1 and the second photodiode PD2 are formed in a well region 331 that is a first conductivity type (for example, p-type) semiconductor region of a semiconductor substrate 330 made of silicon.
- the first photodiode PD1 has an n-type semiconductor region 332 formed by a second conductivity type (for example, n-type) impurity formed on the light receiving surface side of the semiconductor substrate 330, and a part thereof reaches the surface side of the semiconductor substrate 330. And an extension portion 332a formed by extension. A high-concentration p-type semiconductor region 334 serving as a charge storage layer is formed on the surface of the extension 332a.
- the extension 332a is formed as an extraction layer for extracting signal charges accumulated in the n-type semiconductor region 332 of the first photodiode PD1 to the surface side of the semiconductor substrate 330.
- the second photodiode PD2 includes an n-type semiconductor region 336 formed on the light receiving surface side of the semiconductor substrate 330 and a high-concentration p-type semiconductor region 338 formed on the surface side of the semiconductor substrate 330 as a charge storage layer. Configured.
- the first photodiode PD1 and the second photodiode PD2 by forming a p-type semiconductor region at the interface of the semiconductor substrate 330, dark current generated at the interface of the semiconductor substrate 330 can be suppressed.
- the second photodiode PD2 formed in the region farthest from the light receiving surface is, for example, a red photoelectric conversion element that absorbs red light and performs photoelectric conversion.
- the first photodiode PD1 formed on the light receiving surface side of the second photodiode PD2 is, for example, a blue photoelectric conversion element that absorbs blue light and performs photoelectric conversion.
- the organic photoelectric conversion film 310 is formed on the back surface of the semiconductor substrate 330 with the antireflection film 302 and the insulating film 306 interposed therebetween.
- the organic photoelectric conversion film 310 is sandwiched between the upper electrode 312 and the lower electrode 308 to form a photoelectric conversion element.
- the organic photoelectric conversion film 310 is, for example, an organic film that absorbs green light having a wavelength of 450 nm or more and less than 600 nm and performs photoelectric conversion, and is formed of the photoelectric conversion film according to the embodiment of the present disclosure described above. Is done.
- the upper electrode 312 and the lower electrode 308 are formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).
- the lower electrode 308 is connected to a vertical transfer path 348 formed from the back surface side to the front surface side of the semiconductor substrate 330 via a contact plug 304 that penetrates the antireflection film 302.
- the vertical transfer path 348 is formed from a back surface side of the semiconductor substrate 330 with a stacked structure of a connection portion 340, a potential barrier layer 342, a charge storage layer 344, and a p-type semiconductor region 346.
- connection portion 340 is formed of an n-type impurity region having a high impurity concentration formed on the back surface side of the semiconductor substrate 330, and is formed for ohmic contact with the contact plug 304.
- the potential barrier layer 342 is made of a low-concentration p-type impurity region, and forms a potential barrier between the connection portion 340 and the charge storage layer 344.
- the charge storage layer 344 stores the signal charge transferred from the organic photoelectric conversion film 310 and is formed of an n-type impurity region having a lower concentration than the connection portion 340.
- a high-concentration p-type semiconductor region 346 is formed on the surface of the semiconductor substrate 330. Such p-type semiconductor region 346 suppresses dark current generated at the interface of the semiconductor substrate 330.
- a multilayer wiring layer 350 including wirings 358 stacked in a plurality of layers via an interlayer insulating layer 351 is formed on the surface side of the semiconductor substrate 330.
- readout circuits 352, 354, and 356 corresponding to the first photodiode PD1, the second photodiode PD2, and the organic photoelectric conversion film 310 are formed in the vicinity of the surface of the semiconductor substrate 330.
- the read circuits 352, 354, and 356 read output signals from the respective photoelectric conversion elements and transfer them to a logic circuit (not shown).
- a support substrate 360 is formed on the surface of the multilayer wiring layer 350.
- a light shielding film 316 is formed on the light receiving surface side of the upper electrode 312 so as to shield the extension 332a of the first photodiode PD1 and the vertical transfer path 348.
- a region divided by the light shielding films 316 is a photoelectric conversion region 320.
- An on-chip lens 318 is formed on the light shielding film 316 with a planarizing film 314 interposed therebetween.
- the solid-state imaging device 300 to which the photoelectric conversion device according to an embodiment of the present disclosure is applied has been described above.
- color separation or the like is not formed in the unit pixel because color separation is performed in the vertical direction.
- FIG. 8 is a block diagram illustrating a configuration of an electronic device to which the photoelectric conversion element according to an embodiment of the present disclosure is applied.
- the electronic apparatus 400 includes an optical system 402, a solid-state imaging device 404, a DSP (Digital Signal Processor) circuit 406, a control unit 408, an output unit 412, an input unit 414, and a frame memory. 416, a recording unit 418, and a power supply unit 420.
- DSP Digital Signal Processor
- the DSP circuit 406, the control unit 408, the output unit 412, the input unit 414, the frame memory 416, the recording unit 418, and the power supply unit 420 are connected to each other via the bus line 410.
- the optical system 402 takes in incident light from a subject and forms an image on the imaging surface of the solid-state imaging device 404.
- the solid-state imaging device 404 includes a photoelectric conversion device according to an embodiment of the present disclosure, and converts the amount of incident light imaged on the imaging surface by the optical system 402 into an electrical signal in units of pixels to generate a pixel signal. Output as.
- the DSP circuit 406 processes the pixel signal transferred from the solid-state image sensor 404 and outputs it to the output unit 412, the frame memory 416, the recording unit 418, and the like.
- the control unit 408 includes, for example, an arithmetic processing circuit and the like, and controls the operation of each component of the electronic device 400.
- the output unit 412 is a panel type display device such as a liquid crystal display or an organic electroluminescence display, and displays a moving image or a still image captured by the solid-state imaging device 404. Note that the output unit 412 may include an audio output device such as a speaker and headphones.
- the input unit 414 is a device for a user to input an operation, such as a touch panel or a button, and issues operation commands for various functions of the electronic device 400 according to the user's operation.
- the frame memory 416 temporarily stores a moving image or a still image captured by the solid-state imaging device 404.
- the recording unit 418 records a moving image or a still image captured by the solid-state imaging device 404 on a removable storage medium such as a magnetic disk, an optical disk, a magneto-optical disk, or a semiconductor memory.
- the power source unit 420 appropriately supplies various power sources serving as operation power sources for the DSP circuit 406, the control unit 408, the output unit 412, the input unit 414, the frame memory 416, and the recording unit 418 to these supply targets.
- the electronic device 400 to which the photoelectric conversion element according to an embodiment of the present disclosure is applied has been described above.
- the electronic device 400 to which the photoelectric conversion element according to an embodiment of the present disclosure is applied may be, for example, an imaging device.
- the photoelectric conversion film according to an embodiment of the present disclosure includes the subphthalocyanine derivative represented by the general formula (1), thereby reducing the absorption on the long wavelength side and reducing the light in the green light region. Can be selectively absorbed.
- the photoelectric conversion film according to an embodiment of the present disclosure can selectively absorb green light, it can be suitably used as a green photoelectric conversion element of a solid-state imaging device. Therefore, since the photoelectric conversion film according to an embodiment of the present disclosure can improve color separation of each color light, the sensitivity of the solid-state imaging device can be improved and imaging characteristics can be improved. In particular, since the photoelectric conversion film according to an embodiment of the present disclosure has improved red light transmittance on the long wavelength side, the sensitivity of red light can be improved in a solid-state imaging device.
- a photoelectric conversion film comprising a subphthalocyanine derivative represented by the following general formula (1).
- X is halogen, hydroxy group, thiol group, amino group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkylamine group, substituted or Any substituent selected from the group consisting of an unsubstituted arylamine group, a substituted or unsubstituted alkylthio group, and a substituted or unsubstituted arylthio group;
- R 1 to R 3 are each independently a substituted or unsubstituted ring structure; At least one of R 1 to R 3 contains at least one hetero atom in the ring structure.
- X is halogen, hydroxy group, thiol group, amino group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkylamine group, substituted or Any substituent selected from the group consisting of an unsubstituted arylamine group, a substituted or unsubstituted alkylthio group, and a substituted or unsubstituted arylthio group;
- R 1 to R 3 are each independently a substituted or unsubstituted ring structure; At least one of R 1 to R 3 contains at least one hetero atom in the ring structure.
- a solid-state imaging device comprising a photoelectric conversion film containing a subphthalocyanine derivative represented by the following general formula (1); An optical system for guiding incident light to the solid-state imaging device; An electronic device comprising: an arithmetic processing circuit that performs arithmetic processing on an output signal from the solid-state imaging device.
- X is halogen, hydroxy group, thiol group, amino group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkylamine group, substituted or Any substituent selected from the group consisting of an unsubstituted arylamine group, a substituted or unsubstituted alkylthio group, and a substituted or unsubstituted arylthio group;
- R 1 to R 3 are each independently a substituted or unsubstituted ring structure; At least one of R 1 to R 3 contains at least one hetero atom in the ring structure.
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Abstract
Description
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。
前記固体撮像素子に入射光を導く光学系と、
前記固体撮像素子からの出力信号を演算処理する演算処理回路と、を備える電子機器が提供される。
1.本開示の技術的背景
2.本開示の一実施形態
2.1.本開示の一実施形態に係る光電変換膜
2.2.本開示の一実施形態に係る光電変換素子
2.3.本開示の一実施形態に係る実施例
3.本開示に係る一実施形態に係る光電変換膜の適用例
3.1.固体撮像素子の構成
3.2.電子機器の構成
4.まとめ
図1および2を参照して、本開示の技術的背景について説明する。図1(A)は、本開示の一実施形態に係る縦分光型の固体撮像素子の概略図であり、図1(B)は、比較例に係る平面型の固体撮像素子の概略図である。
[2.1.本開示の一実施形態に係る光電変換膜]
本開示の一実施形態に係る光電変換膜は、下記一般式(1)で表されるサブフタロシアニン誘導体を含む光電変換膜である。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基である。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基である。
次に、図3を参照して、本開示の一実施形態に係る光電変換素子について説明する。図3は、本開示の一実施形態に係る光電変換素子の一例を示す概略図である。
以下では、実施例および比較例を参照しながら、本開示の一実施形態に係るサブフタロシアニン誘導体、光電変換膜、および光電変換素子について具体的に説明する。なお、以下に示す実施例は、あくまでも一例であって、本開示の一実施形態に係る光電変換膜および光電変換素子が下記の例に限定されるものではない。
まず、本開示の一実施形態に係るサブフタロシアニン誘導体の分光特性をシミュレーション解析にて評価した。具体的には、以下で構造式を示すサブフタロシアニン誘導体に対してシミュレーション解析を行い、極大吸収波長λmaxを計算した。なお、比較のために、比較例に係るサブフタロシアニン誘導体(SubPc-Cl、SubPc-F)についてもシミュレーション解析を行い、極大吸収波長λmaxを計算した。
次に、本開示の一実施形態に係るサブフタロシアニン誘導体の合成方法について説明する。本開示の一実施形態に係るサブフタロシアニン誘導体は、下記の反応式1で表される一般化された合成方法により合成することができる。なお、以下に述べる合成方法はあくまでも一例であって、本開示の一実施形態に係るサブフタロシアニン誘導体の合成方法が下記の例に限定されるものではない。
以下の方法により、下記に構造式を示すSubNPc-Clを合成した。
また、SubNPc-Clと同様の合成方法により、下記に構造式を示す6Cl-SubNPc-Clを合成した。
また、例えば、下記反応式2で表される合成方法により、R1~R3の環構造が互いに異なるサブフタロシアニン誘導体(2Cl-SubNPc-Cl、および4Cl-SubNPc-Cl)を合成することができる。
次に、上記で合成したSubNPc-Cl、6Cl-SubNPc-Clの分光特性を溶液法により評価した。また、比較のために、同様の方法でSubPc-Clについても分光特性を評価した。
また、上記で合成した6Cl-SubNPc-Clを用いて、本開示の一実施形態に係る光電変換素子を作製し、光電変換素子として機能することを確認した。
まず、石英基板上にスパッタリング法によって酸化インジウムスズ(ITO)を100nm成膜し、成膜したITO薄膜をフォトリソグラフィ法によってパターニングした後、エッチングを行うことで透明な下部電極を形成した。次に、形成した透明電極をUV/オゾン処理にて洗浄し、シャドウマスクを用いて6Cl-SubNPc-Cl、およびキナクリドンを成膜比率が1:1となるように真空蒸着して光電変換層を形成した。
以下では、図6~8を参照して本開示の一実施形態に係る光電変換膜を含む光電変換素子の適用例について説明する。
まず、図6および7を参照して、本開示の一実施形態に係る光電変換素子が適用される固体撮像素子の構成について説明する。図6は、本開示の一実施形態に係る光電変換素子が適用される固体撮像素子の構造を示す概略図である。
続いて、図8を参照して、本開示の一実施形態に係る光電変換素子が適用される電子機器の構成について説明する。図8は、本開示の一実施形態に係る光電変換素子が適用される電子機器の構成を説明するブロック図である。
以上説明したように、本開示の一実施形態に係る光電変換膜は、一般式(1)で表されるサブフタロシアニン誘導体を含むことにより、長波長側の吸収を低下させ、緑色光領域の光を選択的に吸収することができる。
(1)
下記一般式(1)で表されるサブフタロシアニン誘導体を含む、光電変換膜。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。
(2)
前記R1~R3のうち少なくとも1つ以上は、置換基を有する環構造である、前記(1)に記載の光電変換膜。
(3)
前記R1~R3が有する置換基は、ハロゲンである、前記(2)に記載の光電変換膜。
(4)
前記R1~R3は、π共役系構造を有する環構造である、前記(1)~(3)のいずれか一項に記載の光電変換膜。
(5)
前記R1~R3は、環構成原子数が3以上8以下の環構造である、前記(1)~(4)のいずれか一項に記載の光電変換膜。
(6)
前記R1~R3は、環構成原子数が6の環構造である、前記(5)に記載の光電変換膜。
(7)
前記R1~R3の環構造中に含まれるヘテロ原子は、窒素原子である、前記(1)~(6)のいずれか一項に記載の光電変換膜。
(8)
前記Xは、ハロゲンである、前記(1)~(7)のいずれか一項に記載の光電変換膜。
(9)
下記一般式(1)で表されるサブフタロシアニン誘導体を含む光電変換膜を備える固体撮像素子。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。
(10)
前記光電変換膜は、450nm以上600nm以下の波長の緑色光を吸収し、吸収した緑色光を光電変換する、前記(9)に記載の固体撮像素子。
(11)
前記光電変換膜が形成された第1チップと、
前記光電変換膜によって光電変換された信号を処理する信号処理回路が形成され、前記第1チップと積層される第2チップと、
を備え、積層型固体撮像素子として構成された、前記(9)または(10)に記載の固体撮像素子。
(12)
下記一般式(1)で表されるサブフタロシアニン誘導体を含む光電変換膜を備える固体撮像素子と、
前記固体撮像素子に入射光を導く光学系と、
前記固体撮像素子からの出力信号を演算処理する演算処理回路と、を備える電子機器。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。
102 基板
104 下部電極
106 pバッファ層
108 光電変換層
110 nバッファ層
112 上部電極
Claims (12)
- 下記一般式(1)で表されるサブフタロシアニン誘導体を含む、光電変換膜。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。 - 前記R1~R3のうち少なくとも1つ以上は、置換基を有する環構造である、請求項1に記載の光電変換膜。
- 前記R1~R3が有する置換基は、ハロゲンである、請求項2に記載の光電変換膜。
- 前記R1~R3は、π共役系構造を有する環構造である、請求項1に記載の光電変換膜。
- 前記R1~R3は、環構成原子数が3以上8以下の環構造である、請求項1に記載の光電変換膜。
- 前記R1~R3は、環構成原子数が6の環構造である、請求項5に記載の光電変換膜。
- 前記R1~R3の環構造中に含まれるヘテロ原子は、窒素原子である、請求項1に記載の光電変換膜。
- 前記Xは、ハロゲンである、請求項1に記載の光電変換膜。
- 下記一般式(1)で表されるサブフタロシアニン誘導体を含む光電変換膜を備える固体撮像素子。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。 - 前記光電変換膜は、450nm以上600nm以下の波長の緑色光を吸収し、吸収した緑色光を光電変換する、請求項9に記載の固体撮像素子。
- 前記光電変換膜が形成された第1チップと、
前記光電変換膜によって光電変換された信号を処理する信号処理回路が形成され、前記第1チップと積層される第2チップと、
を備え、積層型固体撮像素子として構成された、請求項9に記載の固体撮像素子。 - 下記一般式(1)で表されるサブフタロシアニン誘導体を含む光電変換膜を備える固体撮像素子と、
前記固体撮像素子に入射光を導く光学系と、
前記固体撮像素子からの出力信号を演算処理する演算処理回路と、を備える電子機器。
Xは、ハロゲン、ヒドロキシ基、チオール基、アミノ基、置換もしくは無置換のアルコキシ基、置換もしくは無置換のアリールオキシ基、置換もしくは無置換のアルキル基、置換もしくは無置換のアルキルアミン基、置換もしくは無置換のアリールアミン基、置換もしくは無置換のアルキルチオ基、および置換もしくは無置換のアリールチオ基からなる群より選択されるいずれかの置換基であり、
R1~R3は、互いに独立して、置換または無置換の環構造であり、
R1~R3のうち少なくとも1つ以上は、前記環構造中に少なくとも1つ以上のヘテロ原子を含む。
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