WO2015196520A1 - 玻璃基板的蚀刻方法及蚀刻浸泡装置 - Google Patents

玻璃基板的蚀刻方法及蚀刻浸泡装置 Download PDF

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Publication number
WO2015196520A1
WO2015196520A1 PCT/CN2014/082131 CN2014082131W WO2015196520A1 WO 2015196520 A1 WO2015196520 A1 WO 2015196520A1 CN 2014082131 W CN2014082131 W CN 2014082131W WO 2015196520 A1 WO2015196520 A1 WO 2015196520A1
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WIPO (PCT)
Prior art keywords
etching
tank
glass substrate
soaking
immersion
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PCT/CN2014/082131
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English (en)
French (fr)
Inventor
李嘉
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/381,984 priority Critical patent/US9676661B2/en
Publication of WO2015196520A1 publication Critical patent/WO2015196520A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Definitions

  • the present invention relates to the field of process for liquid crystal displays, and more particularly to an etching method for a glass substrate and an etching soaking device. Background technique
  • Liquid Crystal Display has many advantages such as thin body, power saving, no radiation, etc., such as mobile phones, personal digital assistants (PDA digital cameras, computer screens or laptop screens, etc.).
  • LCD Liquid Crystal Display
  • a thin film transistor liquid crystal display generally includes a casing, a liquid crystal panel disposed in the casing, and a backlight module disposed in the casing (Backlight module), wherein the structure of the liquid crystal panel is formed by a thin film transistor Array Substrate (Thin Film Transistor Array Substrate)
  • the TFT Array Substrate is composed of a color filter substrate (Color Filter, CF) and a liquid crystal layer disposed between the two substrates.
  • the working principle is to apply a driving voltage on the two glass substrates. Controlling the rotation of the liquid crystal molecules of the liquid crystal layer, refracting the light of the backlight module to produce a picture.
  • the process of the above TFT-LCD generally includes: an Array process, mainly The TFT substrate and the CF substrate are manufactured; the middle cell is formed into a cell process, and the TFT substrate and the CF substrate are mainly bonded together, and liquid crystal is added between the two to form a liquid crystal panel; and the rear module assembly process is mainly liquid crystal.
  • the panel is assembled with other components such as backlight modules and PCBs.
  • the front-end array process includes: cleaning and drying of the glass substrate, coating, photoresist coating, exposure, development, etching, photoresist removal, and the like.
  • the etching process is divided into dry etching and wet etching.
  • Wet etching uses a liquid chemical, i.e., etching solution, to remove the photoresist-free film in a chemically etched manner to form the desired circuit pattern on the glass substrate.
  • a conventional method for immersing a glass substrate of a TFT-LCD includes: Step 1 ', the transmission device 100 transports the glass substrate 200 to be etched into the etching tank 300, and several blocks.
  • the plate 400 rises to form an accommodating space; in step 2 ', the supply line 500 injects an etching solution into the accommodating space formed by the rise of the plurality of baffles 400 until the glass substrate 200 to be etched is completely immersed in the etching solution. Immersion etching is performed.
  • An object of the present invention is to provide a method for etching a glass substrate, which can shorten the etching process time and improve the production efficiency.
  • the present invention provides a method for etching a glass substrate, comprising the following steps: l, providing a glass substrate to be etched, an etching bath, an etching solution, and a supply line; a soaking tank is arranged in the etching tank;
  • Step I 3.
  • the supply line injects an etching solution into the soaking tank until a predetermined amount of etching agent is injected;
  • Step I gather 4 the glass substrate to be etched is sent into the etching tank
  • Step I gather 5, raise the soaking tank until the inside of the candle is completely immersed in the glass substrate;
  • Step I gathers 6. After reaching the predetermined soaking time, P pulls the soaking trough to expose the glass substrate.
  • the material of the soaking tank is PVC.
  • the supply line is located on one side of the soaking tank to inject an etching solution.
  • the bottom of the bottom of the soaking tank is provided with a cylinder, which is the soaking tank in the step 5 and the step Lifting power.
  • the step 4 sends the glass substrate to be etched into the etching tank through a transmission device.
  • the transmission device includes a plurality of rollers located in the etching groove, and the soaking groove surrounds the plurality of rollers, and is raised in step 5. After the soaking tank, the plurality of rollers are located in the soaking tank.
  • the step 4 sends the glass substrate to be etched to a predetermined position in the etching bath.
  • the glass substrate is a glass substrate for a TFT-LCD.
  • the invention also provides an etching and immersing device for a glass substrate, comprising: an etching tank, a transmission device, a immersion tank, and a supply pipeline, wherein the immersion tank is located in the etch tank, and the transmission device comprises a plurality of etch grooves
  • the inner roller, the immersion tank surrounds the plurality of rollers, and the supply pipeline is used for supplying an etching solution to the immersion tank.
  • the material of the soaking tank is PVC.
  • the etching soaking apparatus further includes a cylinder disposed at both ends of the bottom of the soaking tank to provide power for the lifting and lowering of the soaking tank in the etching tank.
  • the invention also provides an etching and immersing device for a glass substrate, comprising: an etching tank, a transmission device, a immersion tank, and a supply pipeline, wherein the immersion tank is located in the etch tank, and the transmission device comprises a plurality of etch grooves a roller inside, the soaking groove surrounds the plurality of rollers, and the supply line is used for Giving the etching solution to the soaking tank;
  • the material of the soaking tank is PVC
  • the etching soaking apparatus further includes a cylinder disposed at both ends of the bottom of the soaking tank to provide power for the lifting and lowering of the soaking tank in the etching tank.
  • a immersion tank is disposed in the etch tank, and a predetermined amount of etching liquid is injected into the immersion tank before the glass substrate enters the etch tank, and the glass substrate enters the engraving Immediately after the etching of the groove, the immersion tank is raised by the cylinder, so that the glass substrate is completely immersed in the etching solution instantaneously, the etching process time is reduced, and the production efficiency is improved;
  • the etching immersion device of the present invention is provided with a soaking tank in the etching tank, and The cylinder is arranged at both ends of the bottom of the soaking tank, and the rapid lifting of the soaking tank is realized by the cylinder, so that the etching liquid can be immersed in the glass substrate in a very short time, which is advantageous for improving production efficiency, and has a simple structure and is easy to implement.
  • FIG. 1 is a schematic view showing a step r of an etching immersion method of a conventional glass substrate
  • FIG. 2 is a schematic view showing a step 2' of an etching immersion method of a conventional glass substrate
  • FIG. 3 is a flow chart of a method of etching a glass substrate of the present invention.
  • FIG. 4 is a schematic structural view of an etching and immersing device for a glass substrate of the present invention
  • Figure 5 is a schematic view showing the step 4 of the etching method of the glass substrate of the present invention.
  • Figure 6 is a schematic view showing the fifth step of the etching method of the glass substrate of the present invention. detailed description
  • the present invention provides a method for etching a glass substrate, comprising the following steps: providing a glass substrate 1 to be etched, an etching bath 3, an etching solution 6 and a supply line.
  • Step 2 a soaking trough 9 is disposed in the etching tank 3;
  • Step 3 the supply line 7 into the immersion tank 9 into the etching solution 6 until a predetermined amount of etching solution 6 is injected;
  • Step 4 the glass substrate 1 to be etched is sent into the etching tank 3;
  • Step 5 Raise the immersion tank 9 until the etching liquid 6 is completely immersed in the glass substrate 1;
  • Step 6 After the predetermined immersion time is reached, P pulls the immersion tank 9 to expose the glass substrate 1.
  • the glass substrate 1 to be etched in the step 1 is a glass substrate for a TFT-LCD; one end of the supply line 7 is placed in the etching tank 3, and the other end is inserted and stored in the machine table (not shown).
  • the etching solution in the inside is used to supply the etching solution 6 to the soaking tank 9 in the subsequent step 3.
  • a soaking tank 9 is disposed in the etching tank 3.
  • the immersion tank 9 is for holding the etchant liquid 6 for etching immersion of the glass substrate 1, which is made of a material having corrosion resistance.
  • the immersion tank 9 is made of PVC. It is particularly pointed out that a cylinder 11 is respectively disposed at both ends of the bottom of the soaking tank 9, and the cylinder 11 serves as a power source for powering the lifting of the soaking tank 9 in the subsequent steps 5 and 6.
  • the step 3 is to inject the etching solution 6 into the soaking tank 9 for the supply line 7 until a predetermined amount of the etching solution 6 is injected.
  • the supply line 7 is located at one side of the immersion tank 9 and is aligned with the immersion tank 9 to inject an etching solution 6; the predetermined amount of etching liquid 6 can ensure complete immersion in the subsequent step 5.
  • the glass substrate 1 is described.
  • step 4 the glass substrate 1 to be etched is sent to a predetermined position in the etching bath 3.
  • the glass substrate 1 to be etched is sent into the etching tank 3 through the transmission device 13; the transmission device 13 includes several
  • the roller 131 is located in the etching tank 3, and the immersion tank 9 surrounds the plurality of rollers 131. Further, the plurality of rollers 131 are arranged in parallel on the upper and lower sides of the glass substrate 1.
  • the immersion tank 9 containing a predetermined amount of the etching liquid 6 is located below the glass substrate 1 to be etched.
  • the immersion tank 9 is raised by the cylinder 11 until the etching liquid therein completely immerses the glass substrate 1, and correspondingly, the plurality of rollers 131 are also located in the immersion tank 9.
  • This process can be completed in an instant, and the glass substrate 1 is completely immersed in the etching solution in a very short time, which can reduce the etching process time and increase the production efficiency.
  • the operation of the step 6 is performed, and the glass substrate 1 is exposed by the cylinder 11 P to lower the dip tank 9, thereby completing the etching of the glass substrate 1.
  • the cylinder 11 can be quickly moved away from the glass substrate, thereby allowing faster entry into the next operating step and increasing efficiency.
  • the present invention also provides an etching and immersing device for a glass substrate, comprising an etching tank 3, a transmission device 13, a immersion tank 9, and a supply line 7.
  • the immersion tank 9 is used for etching the medicinal solution 6 , which is located in the etch tank 3 , and the immersion tank 9 can be lifted and lowered in the etch tank 3; the transmission device 13 is used for conveying the glass substrate 1 To a predetermined position in the etching tank 3, the plurality of rollers 131 are arranged in the etching tank 3, and the plurality of rollers 131 are arranged in parallel on the upper and lower sides of the glass substrate 1, and the soaking tank 9 surrounds the Number
  • the feeding line 7 is located at one side of the immersion tank 9 and is aligned with the immersion tank 9 for supplying the etching liquid 6 to the immersion tank 9.
  • the soaking tank 9 is made of PVC and has corrosion resistance.
  • the etching and soaking device of the glass substrate further comprises a cylinder 11 disposed at both ends of the bottom of the soaking tank 9, which serves as a power source for powering the lifting and lowering of the soaking tank 9 in the etching tank 3.
  • the soaking tank 9 is at a low position in the etching tank 3, and the supply line 7 injects a predetermined amount of etching liquid 6 into the soaking tank 9; when the transmission device 13 when the glass substrate 1 is transferred to a predetermined position in the etching tank 3, the cylinder 11 immediately drives the soaking tank 9 to rise rapidly, so that the etching liquid 6 in the soaking tank 9 is in a very short time.
  • the glass substrate 1 is immersed in the interior; after the predetermined etching immersion time is reached, the cylinder 11 drives the immersion tank 9 to return to the initial position.
  • a immersion tank is disposed in the etch tank, and a predetermined amount of etching liquid is injected into the immersion tank before the glass substrate enters the etch tank, and the glass substrate enters the engraving.
  • the immersion tank is raised by the cylinder, so that the glass substrate is completely immersed in the etching solution instantaneously, the etching process time is reduced, and the production efficiency is improved;
  • the etching and immersing device of the glass substrate of the invention is provided by immersing in the etching groove a tank, and a cylinder is arranged at both ends of the bottom of the soaking tank, and the cylinder is used for rapid lifting of the soaking tank, which can make the etching liquid in a very short time
  • the immersion of the glass substrate in the interior facilitates the improvement of production efficiency, and the structure is simple and easy to implement.

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  • Engineering & Computer Science (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
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Abstract

一种玻璃基板（1）的蚀刻方法及蚀刻浸泡装置，该玻璃基板（1）的蚀刻方法包括如下步骤：步骤1、提供待蚀刻的玻璃基板（1）、刻蚀槽（3）、蚀刻药液（6）及供给管路（7）；步骤2、在刻蚀槽（3）内设置一浸泡槽（9）；步骤3、所述供给管路（7）向浸泡槽（9）内注入蚀刻药液（6）直至注入预定量的蚀刻药液（6）；步骤4、将待蚀刻的玻璃基板（1）送入刻蚀槽（3）内；步骤5、升高浸泡槽（9）直至其内蚀刻药液（1）完全浸没玻璃基板（1）；步骤6、达到预定浸泡时间后，降低浸泡槽（9）露出玻璃基板（1）。该玻璃基板（1）的蚀刻方法简单、易操作，能够缩短蚀刻制程时间，提高生产效率。

Description

玻璃基板的蚀刻方法及蚀刻浸泡装置 技术领域
本发明涉及液晶显示器的制程领域，尤其涉及一种玻璃基板的蚀刻方 法及蚀刻浸泡装置。 背景技术
液晶显示器（ Liquid Crystal Display , LCD )具有机身薄、 省电、 无辐 射等众多优点，得到了广泛的应用，如：移动电话、个人数字助理（ PDA 数字相机、 计算机屏幕或笔记本电脑屏幕等。
薄膜晶体管液晶显示器一般包括壳体、 设于壳体内的液晶面板及设于 壳体内的背光模组（ Backlight module \ 其中，液晶面板的结构是由一薄膜 晶体管阵歹J基板 ( Thin Film Transistor Array Substrate , TFT Array Substrate 一彩色滤光片基板（ Color Filter , CF )、 以及一配置于两基板间的液晶层 ( Liquid Crystal Layer )所构成，其工作原理是通过在两片玻璃基板上施加 驱动电压来控制液晶层的液晶分子的旋转，将背光模组的光线折射出来产 生画面。
上述 TFT-LCD的制程过程一般包括：前段阵列 ( Array )制程，主要是 制造 TFT基板及 CF基板；中段成盒 ( Cell )制程，主要是将 TFT基板与 CF基板贴合，在二者之间添加液晶，形成液晶面板；及后段模组组装制程， 主要是将液晶面板与背光模组、 PCB等其它零部件进行组装。
前段阵列制程又包括：玻璃基板的清洗与干燥、 镀膜、 涂光刻胶、 曝 光、 显影、 蚀刻、 去除光刻胶等制程。 蚀刻制程分为干法蚀刻与湿法蚀刻。 湿法蚀刻是使用液体化学试剂，即蚀刻药液以化学腐蚀的方式去除无光刻 胶覆盖的薄膜，以在玻璃基板上形成所需的电路图案。
现有技术中，对 TFT-LCD的玻璃基板进行湿法蚀刻有喷淋和浸泡两种 方式。 浸泡是将玻璃基板完全浸入蚀刻药液进行蚀刻。 请参阅图 1、 图 2 , 传统的对 TFT-LCD的玻璃基板进行浸泡的方法，主要包括：步骤 1 '、 传动 装置 100将待蚀刻的玻璃基板 200输送入刻蚀槽 300内，数个挡板 400上 升构成一容置空间；步骤 2'、 供给管路 500向该由数个挡板 400上升构成 的容置空间内注入蚀刻药液，直至待蚀刻的玻璃基板 200完全浸入蚀刻药 液，进行浸泡蚀刻。 上述方法需要先将玻璃基板 200输送至刻蚀槽 300内， 再注满蚀刻药液，才能进行浸泡蚀刻，造成蚀刻制程的时间较长，不利于 提高生产效率。 发明内容 本发明的目的在于提供一种玻璃基板的蚀刻方法，能够缩短蚀刻制程 时间，提高生产效率。
本发明的目的还在于提供一种蚀刻浸泡装置，能够使得蚀刻药液在极 短的时间内浸没送到的待蚀刻的玻璃基板，利于提高生产效率，且结构简 单、 易实现。
为实现上述目的，本发明提供一种玻璃基板的蚀刻方法，包括如下步 步 I聚 1、 提供待蚀刻的玻璃基板、 刻蚀槽、 蚀刻药液及供给管路； 步 I聚 2、 在刻蚀槽内设置一浸泡槽；
步 I聚 3、所述供给管路向浸泡槽内注入蚀刻药液直至注入预定量的蚀刻 药;
步 I聚 4、 将待蚀刻的玻璃基板送入刻蚀槽内；
步 I聚 5、 升高浸泡槽直至其内烛刻药液完全浸没玻璃基板；
步 I聚 6、 达到预定浸泡时间后， P牵低浸泡槽露出玻璃基板。
所述浸泡槽的材质为 PVC。
所述供给管路位于浸泡槽的一侧以注入蚀刻药液。
所述浸泡槽的底部两端设有气缸，为步骤 5与步骤 ό中所述浸泡槽的 升降提供动力。
所述步骤 4通过传动装置将待蚀刻的玻璃基板送入刻蚀槽内，所述传 动装置包括数个位于刻蚀槽内的滚轮，所述浸泡槽包围该数个滚轮，在步 骤 5升高该浸泡槽后，所述数个滚轮位于浸泡槽内。
在所述步骤 3注入到预定量的蚀刻药液时，所述步骤 4将待蚀刻的玻 璃基板送入到刻蚀槽内预定的位置。
所述玻璃基板为用于 TFT-LCD的玻璃基板。
本发明还提供一种玻璃基板的蚀刻浸泡装置，包括刻蚀槽、 传动装置、 浸泡槽、 及供给管路，所述浸泡槽位于刻蚀槽内，所述传动装置包括数个 位于刻蚀槽内的滚轮，所述浸泡槽包围该数个滚轮，所述供给管路用于供 给蚀刻药液给浸泡槽。
所述浸泡槽的材质为 PVC。
该蚀刻浸泡装置还包括设于所述浸泡槽的底部两端的气缸，为所述浸 泡槽于刻蚀槽内的升降提供动力。
本发明还提供一种玻璃基板的蚀刻浸泡装置，包括刻蚀槽、 传动装置、 浸泡槽、 及供给管路，所述浸泡槽位于刻蚀槽内，所述传动装置包括数个 位于刻蚀槽内的滚轮，所述浸泡槽包围该数个滚轮，所述供给管路用于供 给蚀刻药液给浸泡槽；
所述浸泡槽的材质为 PVC；
该蚀刻浸泡装置还包括设于所述浸泡槽的底部两端的气缸，为所述浸 泡槽于刻蚀槽内的升降提供动力。
本发明的有益效果：本发明玻璃基板的蚀刻方法，在刻蚀槽内设置浸 泡槽，在玻璃基板进入刻蚀槽之前向所述浸泡槽内注入预定量的蚀刻药液， 在玻璃基板进入刻蚀槽之后立即通过气缸升高浸泡槽，使玻璃基板瞬时完 全浸入蚀刻药液，减少了蚀刻制程的时间，提高了生产效率；本发明蚀刻 浸泡装置，通过在刻蚀槽内设置浸泡槽，并在浸泡槽的底部两端设置气缸， 由气缸实现浸泡槽的快速升降，能够使得蚀刻药液在极短的时间内浸没玻 璃基板，利于提高生产效率，且结构简单、 易实现。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本 发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发 明加以限制。 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明 的技术方案及其它有益效果显而易见。 附图中， 图 1为现有的玻璃基板的蚀刻浸泡方法步骤 r的示意图；
图 2为现有的玻璃基板的蚀刻浸泡方法步骤 2'的示意图；
图 3为本发明玻璃基板的蚀刻方法的流程图；
图 4为本发明玻璃基板的蚀刻浸泡装置的结构示意图；
图 5为本发明玻璃基板的蚀刻方法的步骤 4的示意图；
图 6为本发明玻璃基板的蚀刻方法的步骤 5的示意图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 3至图 6 ,本发明提供一种玻璃基板的蚀刻方法，包括如下步 步骤 1、 提供待蚀刻的玻璃基板 1、 刻蚀槽 3、 蚀刻药液 6及供给管路
7；
步骤 2、 在刻蚀槽 3内设置一浸泡槽 9；
步骤 3、所述供给管路 7向浸泡槽 9内注入蚀刻药液 6直至注入预定量 的蚀刻药液 6；
步骤 4、 将待蚀刻的玻璃基板 1送入刻蚀槽 3内； 步骤 5、 升高浸泡槽 9直至其内蚀刻药液 6完全浸没玻璃基板 1； 步骤 6、 达到预定浸泡时间后， P牵低浸泡槽 9露出玻璃基板 1。
具体的，所述步骤 1中待蚀刻的玻璃基板 1为用于 TFT-LCD的玻璃基 板；所述供给管路 7一端置于刻蚀槽 3内，另一端插入储存于机台（未图 示）内的蚀刻药液中，用于供给蚀刻药液 6给后续所述步骤 3中的浸泡槽 9。
所述步骤 2为在刻蚀槽 3内设置一浸泡槽 9。所述浸泡槽 9用于盛装蚀 刻药液 6 ,以对玻璃基板 1进行蚀刻浸泡，其由具有耐腐蚀性的材料制成， 优选的，所述浸泡槽 9由 PVC制成。 特别需要指出的是，所述浸泡槽 9的 底部两端分别设有一气缸 11 ,所述气缸 11作为动力源，为后续步骤 5、 步 骤 6中所述浸泡槽 9的升降提供动力。
所述步骤 3为所述供给管路 7向浸泡槽 9内注入蚀刻药液 6直至注入 预定量的蚀刻药液 6。所述供给管路 7位于所述浸泡槽 9的一侧，并对准浸 泡槽 9 ,以注入蚀刻药液 6；所述预定量的蚀刻药液 6 ,能够保证在后续步 骤 5中完全浸没所述玻璃基板 1。
当所述步骤 3注入预定量的蚀刻药液 6完成时，进入步骤 4 ,将待蚀刻 的玻璃基板 1送入刻蚀槽 3内预定的位置。 在所述步骤 4中，通过传动装 置 13将待蚀刻的玻璃基板 1送入刻蚀槽 3内；所述传动装置 13包括数个 位于刻蚀槽 3内的滚轮 131 ,所述浸泡槽 9包围该数个滚轮 131；进一步的， 所述数个滚轮 131平行排布于玻璃基板 1的上下两侧。 此时，盛装有预定 量的蚀刻药液 6的浸泡槽 9位于待蚀刻的玻璃基板 1的下方。
所述步骤 5中，通过所述气缸 11升高浸泡槽 9直至其内蚀刻药液完全 浸没玻璃基板 1 ,相应的，此时所述数个滚轮 131也位于浸泡槽 9内。此过 程可在瞬时内完成，玻璃基板 1在极短时间内即完全浸入蚀刻药液，能够 减少蚀刻制程的时间，提高生产效率。
当达到预定浸泡时间后，进行步骤 6的操作，通过所述气缸 11 P牵低浸 泡槽 9露出玻璃基板 1 ,完成对所述玻璃基板 1的蚀刻。 通过气缸 11可以 实现快速让蚀刻药液 6离开玻璃基板，从而更快速进入下一个操作步骤， 提高效率。
请参阅图 4 ,本发明还提供一种玻璃基板的蚀刻浸泡装置，包括刻蚀槽 3、 传动装置 13、 浸泡槽 9及供给管路 7。
所述浸泡槽 9用于盛装蚀刻药液 6 ,其位于刻蚀槽 3内，并且所述浸泡 槽 9可于所述刻蚀槽 3内进行升降；所述传动装置 13用于传送玻璃基板 1 至所述刻蚀槽 3内的预定位置，其包括数个位于刻蚀槽 3内的滚轮 131 ,该 数个滚轮 131平行排布于玻璃基板 1的上下两侧，所述浸泡槽 9包围该数 个滚轮 131；所述供给管路 7位于所述浸泡槽 9的一侧，并对准浸泡槽 9 , 用于供给蚀刻药液 6给浸泡槽 9。
所述浸泡槽 9的材质为 PVC ,具有耐腐蚀性。
值得一提的是，该玻璃基板的蚀刻浸泡装置还包括设于所述浸泡槽 9 的底部两端的气缸 11 ,其作为动力源为所述浸泡槽 9于刻蚀槽 3内的升降 提供动力。 在玻璃基板 1进入刻蚀槽 3之前，所述浸泡槽 9在刻蚀槽 3内 处于低位，所述供给管路 7向浸泡槽 9内注入预定量的蚀刻药液 6；当所述 传动装置 13传送玻璃基板 1至所述刻蚀槽 3内的预定位置时，所述气缸 11 立即带动所述浸泡槽 9快速升高，使得所述浸泡槽 9内的蚀刻药液 6在极 短的时间内浸没玻璃基板 1；当达到预定的蚀刻浸泡时间后，所述气缸 11 再带动所述浸泡槽 9下降返回至初始位置。
综上所述，本发明的玻璃基板的蚀刻方法，在刻蚀槽内设置浸泡槽， 在玻璃基板进入刻蚀槽之前向所述浸泡槽内注入预定量的蚀刻药液，在玻 璃基板进入刻蚀槽之后立即通过气缸升高浸泡槽，使玻璃基板瞬时完全浸 入蚀刻药液，减少了蚀刻制程的时间，提高了生产效率；本发明玻璃基板 的蚀刻浸泡装置，通过在刻蚀槽内设置浸泡槽，并在浸泡槽的底部两端设 置气缸，由气缸实现浸泡槽的快速升降，能够使得蚀刻药液在极短的时间 内浸没玻璃基板，利于提高生产效率，且结构简单、 易实现。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

杈 利 要 求
1、 一种玻璃基板的蚀刻方法，包括如下步骤：
步聚 1、 提供待蚀刻的玻璃基板、 刻蚀槽、 蚀刻药液及供给管路； 步 I聚 2、 在刻蚀槽内设置一浸泡槽；
步 I聚 3、所述供给管路向浸泡槽内注入蚀刻药液直至注入预定量的蚀刻 步 I 4、 将待蚀刻的玻璃基板送入刻蚀槽内；
步 I 5、 升高浸泡槽直至其内烛刻药液完全浸没玻璃基板；
步 I聚 6、 达到预定浸泡时间后， P牵低浸泡槽露出玻璃基板。
2、 如权利要求 1所述的玻璃基板的蚀刻方法，其中，所述浸泡槽的材 质为 PVC。
3、 如权利要求 1所述的玻璃基板的蚀刻方法，其中，所述供给管路位 于浸泡槽的一侧以注入蚀刻药液。
4、 如权利要求 1所述的玻璃基板的蚀刻方法，其中，所述浸泡槽的底 部两端设有气缸，为步骤 5与步骤 6中所述浸泡槽的升降提供动力。
5、 如权利要求 1所述的玻璃基板的蚀刻方法，其中，所述步骤 4通过 传动装置将待蚀刻的玻璃基板送入刻蚀槽内，所述传动装置包括数个位于 刻蚀槽内的滚轮，所述浸泡槽包围该数个滚轮，在步骤 5升高该浸泡槽后， 所述数个滚轮位于浸泡槽内。
6、 如权利要求 1所述的玻璃基板的蚀刻方法，其中，在所述步骤 3注 入到预定量的蚀刻药液时，所述步骤 4将待蚀刻的玻璃基板送入到刻蚀槽 内预定的位置。
7、 如权利要求 1所述的玻璃基板的蚀刻方法，其中，所述玻璃基板为 用于 TFT-LCD的玻璃基板。
8、一种蚀刻浸泡装置，包括刻蚀槽、传动装置、浸泡槽、及供给管路 , 所述浸泡槽位于刻蚀槽内，所述传动装置包括数个位于刻蚀槽内的滚轮， 所述浸泡槽包围该数个滚轮，所述供给管路用于供给蚀刻药液给浸泡槽。
9、如权利要求 8所述的蚀刻浸泡装置其中所述浸泡槽的材质为 PVC。
10、 如权利要求 8所述的蚀刻浸泡装置，还包括设于所述浸泡槽的底 部两端的气缸，为所述浸泡槽于刻蚀槽内的升降提供动力。
11、 一种蚀刻浸泡装置，包括刻蚀槽、 传动装置、 浸泡槽、 及供给管 路，所述浸泡槽位于刻蚀槽内，所述传动装置包括数个位于刻蚀槽内的滚 轮，所述浸泡槽包围该数个滚轮，所述供给管路用于供给蚀刻药液给浸泡 槽； 其中，所述浸泡槽的材质为 PVC；
所述的蚀刻浸泡装置，还包括设于所述浸泡槽的底部两端的气缸，为 所述浸泡槽于刻蚀槽内的升降提供动力。
PCT/CN2014/082131 2014-06-26 2014-07-14 玻璃基板的蚀刻方法及蚀刻浸泡装置 WO2015196520A1 (zh)

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