WO2015192814A1 - 一种蓝宝石面板的双面铜盘研磨工艺 - Google Patents

一种蓝宝石面板的双面铜盘研磨工艺 Download PDF

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Publication number
WO2015192814A1
WO2015192814A1 PCT/CN2015/082600 CN2015082600W WO2015192814A1 WO 2015192814 A1 WO2015192814 A1 WO 2015192814A1 CN 2015082600 W CN2015082600 W CN 2015082600W WO 2015192814 A1 WO2015192814 A1 WO 2015192814A1
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copper
sapphire
grinding
process according
lapping
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PCT/CN2015/082600
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English (en)
French (fr)
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周群飞
饶桥兵
傅亮
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蓝思科技股份有限公司
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Publication of WO2015192814A1 publication Critical patent/WO2015192814A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials

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  • the invention relates to a sapphire processing technology, in particular to a double-sided copper disk grinding process of a sapphire panel.
  • the existing sapphire industry all uses the traditional single-sided grinding process to process the thickness of the sapphire panel.
  • the existing single-sided processing process is inefficient, the thickness difference of the surface is 5 points, and the sapphire sheet needs to be solid before processing.
  • the wax is pasted on the fixed ceramic plate. After processing, the sapphire sheet needs to be pulled out from the ceramic plate through high temperature. Therefore, the single-side grinding process is complicated and the processing efficiency is low.
  • In the process of transporting the face grinding due to the shift error
  • the presence of the surface of the two sides of the grinding surface has a large difference in thickness, and the production defect rate is high. Even during processing, the sapphire sheet is easily dropped from the ceramic disc during the transportation process, resulting in the scraping of the sapphire sheet.
  • the existing grinding processes are mostly cast iron grinding discs.
  • the grinding of the cast iron discs leads to a large surface roughness of the sapphire panels, which often fails to meet the optical requirements, which is also an important factor in the production of defects in the grinding production.
  • the technical problem to be solved by the present invention is to provide a double-sided copper disk grinding process for a sapphire panel, which solves the defects of insufficient production capacity, complicated process and high defect rate of the existing sapphire panel grinding process.
  • the invention adopts the following technical scheme: a double-sided copper disc grinding process of a sapphire panel, the sapphire panel is placed between the upper and lower grinding discs for grinding, the grinding disc adopts a rough copper disk, and the DI9002-3um is selected.
  • the diamond liquid rotates in reverse between the two copper plates, wherein the upper copper disk rotates at a speed of 15-22 r/min, and simultaneously presses the upper copper disk, and the lower copper disk rotates at 34-45 r/min.
  • the double-sided copper disk grinding process of a sapphire panel of the present invention specifically comprises the following steps: First, the sapphire product is placed in a star wheel chamber of a double-sided copper disk grinder, and the teeth on the star wheel are respectively The ring gear of the double-sided copper disc grinder is meshed with the sun gear, and the diamond liquid is applied on the upper and lower surfaces of the sapphire product; the second step is to control the upper copper disc of the double-sided copper disc grinder to move down to the upper copper disc and the lower copper disc respectively.
  • the third step add the upper copper plate Pressing, while controlling the reverse rotation of the upper and lower copper plates, simultaneously grinding the upper and lower surfaces of the sapphire product, driving the ring gear and the sun wheel to rotate, and the star wheel and the lower copper plate respectively meshing with the ring gear and the sun gear
  • the ring gear speed is 8-15r/min
  • the sun gear speed is 7-15r/min.
  • the upper copper disk rotates at 22 r/min
  • the lower copper disk rotates at 40 r/min
  • the ring gear rotates at 13 r/min
  • the sun gear rotates at 15 r/min
  • the upper copper disk The processing pressure was maintained at 200 g/cm 2 .
  • the diamond liquid is continuously supplied between the upper and lower copper disks and the sapphire product to increase the lubrication and cutting force of the upper and lower copper disks.
  • the flow rate of the diamond liquid was controlled at 7 ml/min.
  • the upper and lower copper disks are made of a resin synthetic ground copper disk.
  • the processed surface of the upper and lower copper disks is provided with a spiral pattern for improving the polishing efficiency.
  • the star wheel mainly functions as a fixed product. Since the thickness of the product gradually decreases during the processing, the thickness of the star wheel is closely related to the thickness of the sapphire product. Generally, we require the thickness of the star wheel to be compared.
  • the thickness of the sapphire is 0.15mm, so as to avoid the situation of grinding the star wheel on the upper and lower plates due to the change of the disk surface during the processing.
  • the invention has the advantages that the two surfaces of the sapphire panel are ground at one time, the processing time of the grinding process is shortened, the processing steps are simplified, and the waxing and drawing in the traditional process are saved.
  • the process and the cost of using the ceramic disk increase the production efficiency; the resin synthetic copper grinding disc is used for grinding, which has the advantages of high precision and high grinding efficiency compared with the conventional cast iron grinding disc, and the surface roughness and flatness of the polished copper disc The degree can meet the process requirements and improve the processing yield of the products.
  • Figure 1 is a schematic view showing the position of a star wheel in a grinding machine in the method of the present invention
  • FIG. 2 is a schematic structural view of a star wheel in the present invention.
  • FIG. 1 is a schematic view showing the position of a star wheel in a grinding machine in the method of the present invention.
  • this drawing is also a structural view of a planetary gear train which is common in the prior art.
  • 1 is a star wheel
  • 2 is a sun wheel
  • 3 is a ring gear.
  • FIG. 1 only schematically shows the positional relationship of the components in the planetary gear train, and its components.
  • the specific shape and size are not limited to the shape and size shown in FIG. 2 is a schematic structural view of a star wheel in the present invention.
  • the drawing is also a structure diagram of a star wheel which is common in the prior art.
  • the star wheel in Figure 2 The cavity 11 is also merely a schematic structure, and does not mean that the shape and size of the star wheel cavity 11 in the present invention need to be the same as that shown in FIG.
  • the double-sided copper disc grinding process of the sapphire panel includes the following steps in the specific production:
  • the sapphire product is placed in the star wheel of the double-sided copper disc grinder, and the teeth on the star wheel respectively mesh with the ring gear and the sun gear of the double-sided copper disc grinder to form a planetary gear train.
  • the star wheel rotates and revolves, and the grinding efficiency of both sides of the sapphire panel is improved, and the grinding cutting fluid is applied on the upper and lower surfaces of the sapphire product, and the grinding fluid can be used as the diamond liquid;
  • the second step is to control the upper copper plate of the double-sided copper disc grinder to move downward, and the upper copper plate and the lower copper plate respectively contact the upper and lower surfaces of the sapphire product;
  • the third step is to pressurize the upper copper plate and maintain the pressure on the sapphire panel at 200 g/cm 2 to control the reverse rotation of the upper and lower copper plates to simultaneously grind the upper and lower surfaces of the sapphire product while driving the The ring gear and the sun wheel rotate in opposite directions.
  • the star wheel and the lower copper disk that mesh with the ring gear and the sun wheel are revolved in the same direction. Specifically, the upper copper disk rotates at 15-22r/min, the lower copper disk rotates at 34-45r/min, the ring gear rotates at 8-15r/min, the sun gear rotates at 7-15r/min, the ring gear and the sun gear The speed of rotation is different, which makes the star wheel produce a certain revolution.
  • a diamond liquid having a flow rate of 7 ml/min was continuously supplied between the upper and lower copper disks and the sapphire product to increase the lubrication and cutting force of the upper and lower copper disks.
  • the upper and lower copper disks are made of a resin synthetic ground copper disk, and the surface thereof is processed with a spiral pattern for improving the polishing efficiency.
  • the sapphire product is fixed on the lower surface of the copper plate with the star wheel clamp, and the upper and lower copper plates are simultaneously ground on the upper and lower surfaces of the sapphire product.
  • the DI9002-3um diamond liquid of Diamond Lnnovations is used, and the flow of the diamond liquid is polished.
  • the control flows between the copper plate and the sapphire product at 7 ml/min, increasing the lubrication and cutting force of the upper and lower plates.
  • the upper copper disk speed is set to 17r/min
  • the lower copper disk speed is set to 35r/min
  • the ring gear speed is set to 11r/min
  • the sun gear speed is set to 12r/min
  • the sapphire product is installed.
  • the processing pressure of the upper copper plate maintains a state of 200g/cm 2 for the sapphire panel.
  • the sapphire The removal efficiency of the double-sided copper disc grinding process can reach: 0.8um/min.
  • the difference of the 5-point thickness of the surface of the sapphire panel can reach between 0.003-0.005mm, and the surface roughness Ra can reach 6- Between 8nm.
  • the sapphire product is fixed on the lower surface of the copper plate with the star wheel clamp, and the upper and lower copper plates are simultaneously ground on the upper and lower surfaces of the sapphire product.
  • the DI9002-3um diamond liquid of Diamond Lnnovations is used, and the flow of the diamond liquid is polished.
  • the control flows between the copper plate and the sapphire product at 7 ml/min, increasing the lubrication and cutting force of the upper and lower plates.
  • the upper copper disk speed is set to 22r/min
  • the lower copper disk speed is set to 40r/min
  • the ring gear speed is set to 13r/min
  • the sun gear speed is set to 15r/min
  • the sapphire product is installed.
  • the processing pressure of the upper copper plate maintains a state of 200g/cm 2 for the sapphire panel.
  • the sapphire The removal efficiency of the double-sided copper disc grinding process can reach: 1um/min, and finally, after reaching the grinding thickness, the difference of the 5-point thickness of the surface of the sapphire panel can reach between 0.003-0.005mm, and the surface roughness Ra can reach 5-7nm. between.
  • the removal efficiency is only half of the present invention, 0.50 um / min, using the traditional cast iron grinding disc, the difference of the thickness of the surface of the final sapphire panel can only be 0.015-0.020mm,
  • the present invention and the conventional single-side grinding process are as shown in Table 1. The results show that the method provided by the present invention increases the processing capacity by more than two times, and improves the yield of the product and saves the cost.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

一种蓝宝石面板的双面铜盘研磨工艺，包括将蓝宝石面板置于上下两块研磨盘之间进行研磨，研磨盘采用表面粗糙的铜盘，配合选用粒径为2-3微米的钻石液，两块铜盘之间反向转动，其中上铜盘转速为15-22r/min，同时对上铜盘加压，下铜盘转速为34-45r/min。采用一次研磨蓝宝石面板的两个面的工艺，缩短了研磨工艺的加工时间，精简了加工工艺步骤，降低了生产成本，提高了生产效率；同时采用树脂合成铜研磨盘进行研磨，具有精度高，研磨效率高的优点，提高了产品加工良率。

Description

一种蓝宝石面板的双面铜盘研磨工艺 技术领域
本发明涉及蓝宝石加工工艺，具体涉及一种蓝宝石面板的双面铜盘研磨工艺。
背景技术
现有的蓝宝石行业全部都是采用传统的单面研磨工艺加工蓝宝石面板的厚度，现有的单面加工工艺效率低，表面5点的厚度差异比较大，而且在加工前需要将蓝宝石片用固体蜡粘贴在固定的陶瓷盘上面，加工后需要通过高温将蓝宝石片从陶瓷盘上面拔下来，因此，单面研磨的加工工艺复杂、加工效率低下，在转运换面研磨过程中，由于移位误差的存在导致研磨两面后表面的厚度差异大，生产的不良率高，甚至在加工时蓝宝石片在转运过程中容易从陶瓷盘上面掉下来，导致蓝宝石片报废。
以4寸的蓝宝石片面板研磨为例，单面研磨一次只能生产24片，而且完成研磨工序需要两面加工2次(A、B面各1次)，通常表面5点的厚度差异在0.015-0.020mm，离工艺要求的5点厚度差异(0.003-0.005mm之间)相差很大。另外，现有的研磨工艺大都是采用的铸铁研磨盘，铸铁盘研磨导致蓝宝石面板的表面粗糙度较大，往往达不到光学要求，这也是研磨生产中产生不良的一个重要因素。随着工业化的发展，社会的不断进步，为了节约成本、提高生产效率和改善产品的TTV(表面平整度)，对蓝宝石的加工效率和精度要求越来越高，现有的单面铜盘研磨工艺已经不能满足蓝宝石的生产需要。
发明内容
本发明所要解决的技术问题是：提供一种蓝宝石面板的双面铜盘研磨工艺，解决现有蓝宝石面板研磨加工存在的产能不足、工艺复杂、不良率高的缺陷。
本发明采用如下技术方案：一种蓝宝石面板的双面铜盘研磨工艺，将蓝宝石面板置于上下两块研磨盘之间进行研磨，所述研磨盘采用表面粗糙的铜盘，配合选用DI9002-3um钻石液，两块铜盘之间反向转动，其中上铜盘转速为15-22r/min，同时对上铜盘加压，下铜盘转速为34-45r/min。
本发明的一种蓝宝石面板的双面铜盘研磨工艺具体包括如下步骤：第一步、将蓝宝石产品放置在双面铜盘研磨机的游星轮行腔内，游星轮上的轮齿分别与双面铜盘研磨机的齿圈和太阳轮啮合，并在蓝宝石产品上下表面涂抹钻石液；第二步、控制双面铜盘研磨机的上铜盘下移，至上铜盘与下铜盘分别接触蓝宝石产品的上、下表面；第三步、对上铜盘加 压，同时控制上、下铜盘反向转动实现同时对蓝宝石产品上、下表面进行研磨，驱动所述齿圈和太阳轮转动，分别与齿圈和太阳轮啮合的游星轮与下铜盘同向公转，齿圈转速为8-15r/min，太阳轮转速为7-15r/min。
进一步的，在所述第三步中，所述上铜盘转速为22r/min、下铜盘转速为40r/min，齿圈转速为13r/min、太阳轮转速为15r/min、上铜盘的加工压力保持在200g/cm2。
进一步的，在所述第三步中，所述上、下铜盘与蓝宝石产品之间持续通入钻石液，增加上、下铜盘的润滑和切削力。
进一步的，所述钻石液的流量控制在7ml/min。
在本发明中，所述上、下铜盘采用树脂合成研磨铜盘。
进一步的，所述上、下铜盘的加工表面设有提高研磨效率的螺旋纹路。
在本发明中，游星轮主要起到固定产品的作用，由于产品的厚度在加工过程中逐渐下降，所以游星轮厚度的选择与蓝宝石产品的厚度息息相关，一般我们要求游星轮厚度相比蓝宝石厚度薄0.15mm，这样避免在加工过程中由于盘面的变化，出现上下盘面磨游星轮的情况。
与现有技术相比，本发明的有益效果在于：采用一次研磨蓝宝石面板的两个面，缩短了研磨工艺的加工时间，精简了加工工艺步骤，还节省了传统工艺中的贴蜡、拔片的工艺和使用陶瓷盘的成本，提高了生产效率；采用树脂合成铜研磨盘进行研磨，相比传统的铸铁磨盘，具有精度高，研磨效率高的优点，研磨后的铜盘表面粗糙度和平整度均能达到工艺要求，提高了产品加工良率。
以下结合具体实施方式对本发明做进一步说明。
附图说明
图1为本发明方法中的游星轮在研磨机上所处位置示意图，
图2为本发明中游星轮的结构示意图。
图中，1、游星轮，11、游星轮型腔，2、太阳轮，3、齿圈。
具体实施方式
本发明中图1为本发明方法中的游星轮在研磨机上所处位置示意图，实际上这个附图也是现有技术中常见的行星轮系的结构图。图中，1为游星轮、2为太阳轮，3为齿圈，本领域技术人员知晓的，图1仅示意性地给出所述行星轮系中的各部件结构的位置关系，其部件的具体形状和尺寸均不仅限于图1中所示形状和尺寸。图2为本发明中游星轮的结构示意图，实际上该附图也是现有技术中常见的游星轮结构图。同样的，图2中的游星轮型 腔11也仅仅是示意性结构，并不代表本发明中的游星轮型腔11的形状和尺寸需要与图2中所示相同。
蓝宝石面板的双面铜盘研磨工艺在具体生产中包括如下步骤：
第一步、将蓝宝石产品放置在双面铜盘研磨机的游星轮行腔内，游星轮上的轮齿分别与双面铜盘研磨机的齿圈和太阳轮啮合，形成行星轮系，通过齿圈和太阳轮的转动带动游星轮自转和公转，提高蓝宝石面板两面的研磨效率，并在蓝宝石产品上下表面涂抹研磨切削液，研磨切削液可采用钻石液；
第二步、控制双面铜盘研磨机的上铜盘下移，至上铜盘与下铜盘分别接触蓝宝石产品的上、下表面；
第三步、对上铜盘加压，保持在对蓝宝石面板上的压力在200g/cm2，控制上、下铜盘反向转动实现同时对蓝宝石产品上、下表面进行研磨，同时驱动所述齿圈和太阳轮反向转动，根据行星轮系的特点，实现与齿圈和太阳轮啮合的游星轮与下铜盘同向公转。具体的，上铜盘转速为15-22r/min、下铜盘转速为34-45r/min，齿圈转速为8-15r/min、太阳轮转速为7-15r/min，齿圈和太阳轮的转速不同，使游星轮产生一定的公转。在上述第三步中，在上、下铜盘与蓝宝石产品之间持续通入流量为7ml/min的钻石液用以增加上、下铜盘的润滑和切削力。
在本发明中，上、下铜盘采用树脂合成研磨铜盘，其表面加工有提高研磨效率的螺旋纹路。
实施例1
将蓝宝石产品用游星轮夹具固定在铜盘下盘面，上、下铜盘对蓝宝石产品的上、下表面同时进行研磨，选用Diamond Lnnovations公司的DI9002-3um钻石液，研磨时将钻石液的流量控制在7ml/min流入到铜盘与蓝宝石产品之间，增加上下盘面的润滑和切削力。在加工参数为上铜盘转速设置为17r/min、下铜盘转速设置为35r/min、齿圈转速设置为11r/min、太阳轮转速设置为12r/min，装夹蓝宝石产品的游星轮在齿圈和太阳轮之间自转，同时会产生缓慢的公转，两者结合进一步提升了研磨效率，上铜盘的加工压力对蓝宝石面板保持200g/cm2的状态，在此工艺状态下，蓝宝石双面铜盘研磨工艺的移除效率可以达到：0.8um/min，最终达到研磨厚度后，蓝宝石面板表面的5点厚度差异可以达到0.003-0.005mm之间，表面粗糙度Ra值可以达到6-8nm之间。
实施例2
将蓝宝石产品用游星轮夹具固定在铜盘下盘面，上、下铜盘对蓝宝石产品的上、下表 面同时进行研磨，选用Diamond Lnnovations公司的DI9002-3um钻石液，研磨时将钻石液的流量控制在7ml/min流入到铜盘与蓝宝石产品之间，增加上下盘面的润滑和切削力。在加工参数为上铜盘转速设置为22r/min、下铜盘转速设置为40r/min、齿圈转速设置为13r/min、太阳轮转速设置为15r/min，装夹蓝宝石产品的游星轮在齿圈和太阳轮之间自转，同时会产生缓慢的公转，两者结合进一步提升了研磨效率，上铜盘的加工压力对蓝宝石面板保持200g/cm2的状态，在此工艺状态下，蓝宝石双面铜盘研磨工艺的移除效率可以达到：1um/min，最终达到研磨厚度后，蓝宝石面板表面的5点厚度差异可以达到0.003-0.005mm之间，表面粗糙度Ra值可以达到5-7nm之间。
采用传统的单面研磨工艺，移除效率则只有本发明的一半，为0.50um/min，采用传统的铸铁磨盘，最终的蓝宝石面板的表面的5点厚度差异只能做到0.015-0.020mm，对比本发明和传统的单面研磨工艺如表1。结果显示本发明提供的方法提升了不止两倍的加工产能，并且提高了产品的良品率，节省了成本。
表1
Figure PCTCN2015082600-appb-000001
上述为本发明的优选实施方式，但所属领域的技术人员应该明白，在不脱离所附权利说明书所限定的本发明的精神和范围内，在形式和细节上对本发明所作出的各种变化，都属于本发明的保护范围。

Claims (10)

  1. 一种蓝宝石面板的双面铜盘研磨工艺，其特征在于，将蓝宝石面板置于上下两块研磨盘之间进行研磨，所述研磨盘采用表面粗糙的铜盘，配合选用粒径为2-3微米的钻石液，两块铜盘之间反向转动，其中上铜盘转速为15-22r/min，同时对上铜盘加压，下铜盘转速为34-45r/min。
  2. 根据权利要求1所述的研磨工艺，其特征在于具体包括如下步骤：第一步、将蓝宝石产品放置在双面铜盘研磨机的游星轮行腔内，游星轮上的轮齿分别与双面铜盘研磨机的齿圈和太阳轮啮合，并在蓝宝石产品上下表面涂抹钻石液；第二步、控制双面铜盘研磨机的上铜盘下移，至上铜盘与下铜盘分别接触蓝宝石产品的上、下表面；第三步、对上铜盘加压，同时控制上、下铜盘反向转动实现同时对蓝宝石产品上、下表面进行研磨，驱动所述齿圈和太阳轮转动，分别与齿圈和太阳轮啮合的游星轮与下铜盘同向公转，齿圈转速为8-15r/min，太阳轮转速为7-15r/min。
  3. 根据权利要求2所述的研磨工艺，其特征在于：在所述第三步中，所述上铜盘转速为22r/min、下铜盘转速为40r/min，齿圈转速为13r/min、太阳轮转速为15r/min、上铜盘的加工压力保持在200g/cm2。
  4. 根据权利要求3所述的研磨工艺，其特征在于：在所述第三步中，所述上、下铜盘与蓝宝石产品之间持续通入钻石液，增加上、下铜盘的润滑和切削力。
  5. 根据权利要求4所述的研磨工艺，其特征在于：所述钻石液的流量控制在7ml/min。
  6. 根据权利要求1-5中任一项所述的研磨工艺，其特征在于：所述上、下铜盘采用树脂合成研磨铜盘。
  7. 根据权利要求6所述的研磨工艺，其特征在于：所述上、下铜盘的加工表面设有提高研磨效率的螺旋纹路。
  8. 根据权利要求7所述的研磨工艺，其特征在于：所述游星轮的厚度比所述蓝宝石面板薄0.15mm。
  9. 根据权利要求1-5中任一项所述的研磨工艺，其特征在于：研磨过程中，所述齿圈与太阳轮的转速不同，使得游星轮产生公转。
  10. 根据权利要求1-5中任一项所述的研磨工艺，其特征在于：装夹蓝宝石产品的游星轮在齿圈和太阳轮之间自转。
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