WO2015182801A1 - Ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection de surface en traitement par laser - Google Patents

Ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection de surface en traitement par laser Download PDF

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Publication number
WO2015182801A1
WO2015182801A1 PCT/KR2014/004819 KR2014004819W WO2015182801A1 WO 2015182801 A1 WO2015182801 A1 WO 2015182801A1 KR 2014004819 W KR2014004819 W KR 2014004819W WO 2015182801 A1 WO2015182801 A1 WO 2015182801A1
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WO
WIPO (PCT)
Prior art keywords
adhesive tape
heat
silicon film
film layer
polyethylene
Prior art date
Application number
PCT/KR2014/004819
Other languages
English (en)
Korean (ko)
Inventor
나영수
안창덕
Original Assignee
세계화학공업(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세계화학공업(주) filed Critical 세계화학공업(주)
Priority to PCT/KR2014/004819 priority Critical patent/WO2015182801A1/fr
Publication of WO2015182801A1 publication Critical patent/WO2015182801A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to a surface protective adhesive tape for heat-resistant laser cutting having a silicon film layer, and more particularly, laser cutting process used for precise processing of stainless steel used in elevators, railway vehicles, and home appliances.
  • the present invention relates to an adhesive tape for surface protection for heat-resistant laser processing, which protects a stainless steel surface due to heat or contaminants generated during the process.
  • Bending of the iron plate is a typical forming method used to make a variety of shapes from the plate of the iron plate, is a processing method to form a variety of shapes while folding the iron plate at a vertical or close to 180 degrees when bending.
  • the above iron plate processing method uses a protective tape on the surface to protect the surface of the iron plate from the bending machine in the process of folding the iron plate, wherein the thin steel plate less than 1mm damages the surface of the protective tape because the force applied during bending
  • the steel sheet of 1mm or more has a very high bending force, so the protective tape made of general PE and PVC substrates is damaged to damage the surface of the iron plate to be protected, such as indentation and scratches.
  • the tape is peeled off from the adherend from the high heat and gas pressure during laser processing, or the adhesive is pressed by heat on the surface of the adherend after processing.
  • the laser cutting protective tape is not widely used, and the process of peeling the protective tape before the laser cutting and reattaching after the laser cutting is applied, or the double process time of weakly melting the protective tape with the laser and cutting the sheet. There was a problem.
  • An object of the present invention is to prevent surface contamination generated during the laser cutting process used for precision processing of stainless steel, to prevent surface damage and contamination of the workpiece during the transfer process after laser cutting, in particular bending after the post-processing process It is to provide a pressure-sensitive adhesive tape for surface protection for heat-resistant laser processing in which a silicon film layer is formed, which can be pressed or the like.
  • the surface protection adhesive tape for heat-resistant laser processing the silicon film layer of the present invention is a silicon film layer 5 to 30 parts by weight of silicon mixed with 100 parts by weight of polyethylene; A polyethylene layer formed on an upper surface of the silicon film layer; And an adhesive layer formed on an upper surface of the polyethylene layer.
  • the polyethylene has good adhesion and strong softness, Low Density Polyethylene (LDPE), Linear Low Density Polyethylene (LLDPE), or a mixture thereof.
  • LDPE Low Density Polyethylene
  • LLDPE Linear Low Density Polyethylene
  • the adhesive applied to the upper portion of the polyethylene layer may be acrylic, rubber, or silicone, and the adhesive force is less than 1kgf / 25mm is configured to facilitate removal after laser processing.
  • the surface protection adhesive tape for heat-resistant laser processing in which the silicon film layer according to the present invention is used is a stainless steel during laser cutting process used for the precise processing of stainless steel by using a soft and heat-resistant silicon film layer as a base layer. It can be used as a surface protection adhesive tape for heat-resistant laser processing which can protect a surface.
  • FIG. 1 is an exploded perspective view of a surface protective adhesive tape for heat-resistant laser processing, the silicon film layer is formed according to a preferred embodiment of the present invention.
  • FIG. 1 is an exploded perspective view of a surface protection adhesive tape for heat-resistant laser processing in which a silicon film layer is formed, according to a preferred embodiment of the present invention.
  • the pressure-sensitive adhesive tape for heat-resistant laser processing on which the silicon film layer of the present invention is formed includes a silicon film layer 10 in which silicon is mixed with polyethylene; A polyethylene layer 20 formed on an upper surface of the silicon film layer; And an adhesive layer 30 formed on an upper surface of the polyethylene layer.
  • the thickness of the pressure-sensitive adhesive tape for heat-resistant laser processing in which the silicon film layer according to the present invention is formed can be freely formed and used from several tens of micrometers to several hundred micrometers, but is not particularly limited, but preferably 120 micrometers, more preferably 80 To a thickness of from 100 micrometers.
  • the silicon film layer 10 used as the base material layer is formed by adding silicon to the polyethylene that is soft and relatively excellent in heat resistance as compared to pure PE (polyethylene).
  • PE polyethylene
  • the polyethylene is excellent in adhesiveness and strong in flexibility, low density polyethylene (LDPE), linear low density polyethylene (LLDPE), or a mixture thereof.
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • the silicon film layer 10 may be added 0.1 to 3 parts by weight of UV stabilizer, 0.1 to 3 parts by weight of pigment, and 1 to 3 parts by weight of filler based on 100 parts by weight of polyethylene.
  • the filler is made of one or more selected from the group consisting of titanium dioxide and calcium carbonate, and serves to improve mechanical properties such as impact resistance and scratch resistance of the silicon film layer 10, and apply adhesive tape to the adherend.
  • the lower surface is formed on the outermost side and serves to block damage of the iron plate to be adhered from external forces such as indentation and scratches. It is preferable that the thickness of the silicone film layer 10 is 50% or less of the total thickness of the whole adhesive tape, and about 10-60 micrometers is preferable.
  • Polyethylene layer 20 formed on top of the silicon film layer may be used a variety of PE material, the same as the polyethylene used in the silicon film layer, LDPE (Low Density Polyethylene: low density polyethylene), LLDPE (Linear Low Density) Polyethylene: linear low density polyethylene) or mixtures thereof. It is preferable that the thickness of the polyethylene layer 20 is 40 to 90% or less of the total thickness of the whole adhesive tape, and about 40-90 micrometers is preferable.
  • the adhesive layer 30 applied to the upper portion of the polyethylene layer 20 is adhered to the iron plate (stainless steel) of the surface protection adhesive tape for heat-resistant laser processing according to the present invention, after the laser processing of the iron plate is an adherend It serves to easily remove the adhesive tape from the iron plate.
  • the adhesive layer 40 is made of one selected from the group consisting of rubber-based, acrylic-based, silicone-based, and mixtures thereof, and is preferably formed at 10% or less of the total thickness of the flame-retardant surface protective adhesive tape.
  • the adhesive force of the adhesive layer should be easy to remove after laser processing as the adhesive force is less than 1 kgf / 25mm.
  • the silicone film layer and the polyethylene layer are prepared by co-extrusion, respectively, and then the two layers are immediately bonded. Then, the pressure-sensitive adhesive is applied to the polyethylene layer by a gravure method or a comma method to produce the same.
  • a pneumatic press for producing an adhesive tape was used to prepare a silicone film (100 parts by weight of polyethylene and 20 parts by weight of silicon) and a polyethylene film, respectively, and then the films were bonded to each other. Then, the pressure-sensitive adhesive was applied onto the polyethylene film using the gravure method.
  • the pressure-sensitive adhesive tape was produced by varying the thickness of each film while maintaining the components of each film in the same component.
  • Table 1 shows the thickness of the film of each example.
  • the adhesive tape produced in Example was attached to a stainless steel 304 having a thickness of 2 mm, which is a supper mirror, and the adhesion state at the time of laser processing and the adhesion state at the time of bending were confirmed.
  • the adhesive tape prepared in each example was attached to the prepared stainless steel 304 (horizontal 200 mm * length 200), and then the stainless steel 304 was cut in half in a nitrogen atmosphere using a laser device using CO 2 . It was. At this time, the discharge pressure of nitrogen was 7 bar.
  • the adhesion tape was attached during and after laser processing.
  • both the adhesive tape is attached to the surface of the stainless steel during and after laser processing on stainless steel, so that it is excellent in heat resistance and high adhesion to high temperature laser processing. I could confirm it.
  • the adhesive tape was attached to the stainless steel without falling or lifting from the stainless steel, it was confirmed that the bendability is also excellent.
  • the adhesive tape of the present invention will have excellent heat resistance and adhesion enough to be used as a film of the laser protective tape.
  • the present invention relates to a surface protective adhesive tape for heat-resistant laser cutting having a silicon film layer, and more particularly, laser cutting process used for precise processing of stainless steel used in elevators, railway vehicles, and home appliances. It can be used in the field of adhesive tape for surface protection for heat-resistant laser processing, which protects the stainless steel surface due to heat or contaminants generated.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention porte sur un ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection d'une surface en découpe par laser et, plus précisément, sur un ruban adhésif thermorésistant pour la protection d'une surface dans un traitement par laser, qui protège une surface en acier inoxydable de la chaleur, de contaminants, etc. produits au cours d'un processus de découpe par laser utilisé pour le traitement précis d'acier inoxydable utilisé dans des ascenseurs, des véhicules de chemin de fer, des appareils électroniques, etc. Le ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection d'une surface dans un traitement de découpe par laser selon la présente invention comprend : une couche de film de silicium dans laquelle 5 à 30 parties en poids de silicium sont mélangées dans 100 parties en poids de polyéthylène ; une couche de polyéthylène formée sur le côté supérieur de la couche de film de silicium ; et une couche adhésive formée sur le côté supérieur de la couche de polyéthylène.
PCT/KR2014/004819 2014-05-30 2014-05-30 Ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection de surface en traitement par laser WO2015182801A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2014/004819 WO2015182801A1 (fr) 2014-05-30 2014-05-30 Ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection de surface en traitement par laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2014/004819 WO2015182801A1 (fr) 2014-05-30 2014-05-30 Ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection de surface en traitement par laser

Publications (1)

Publication Number Publication Date
WO2015182801A1 true WO2015182801A1 (fr) 2015-12-03

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PCT/KR2014/004819 WO2015182801A1 (fr) 2014-05-30 2014-05-30 Ruban adhésif thermorésistant sur lequel est formée une couche de film de silicium pour la protection de surface en traitement par laser

Country Status (1)

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WO (1) WO2015182801A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010098335A (ko) * 2000-04-24 2001-11-08 마쓰모토 치아키 표면보호필름
JP2005252094A (ja) * 2004-03-05 2005-09-15 Nitto Denko Corp レーザーダイシング・ダイボンド用粘着シート及びこれを用いた半導体装置の製造方法
KR100730503B1 (ko) * 2006-07-12 2007-06-20 (주)반도 도광판 표면 보호용 방향성 점착 필름
JP4991024B1 (ja) * 2010-12-06 2012-08-01 株式会社きもと レーザーダイシング用補助シート
KR20140037160A (ko) * 2014-01-24 2014-03-26 세계화학공업(주) 보호필름 및 이를 이용한 점착테이프

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010098335A (ko) * 2000-04-24 2001-11-08 마쓰모토 치아키 표면보호필름
JP2005252094A (ja) * 2004-03-05 2005-09-15 Nitto Denko Corp レーザーダイシング・ダイボンド用粘着シート及びこれを用いた半導体装置の製造方法
KR100730503B1 (ko) * 2006-07-12 2007-06-20 (주)반도 도광판 표면 보호용 방향성 점착 필름
JP4991024B1 (ja) * 2010-12-06 2012-08-01 株式会社きもと レーザーダイシング用補助シート
KR20140037160A (ko) * 2014-01-24 2014-03-26 세계화학공업(주) 보호필름 및 이를 이용한 점착테이프

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