WO2015170566A1 - Appareil électronique - Google Patents

Appareil électronique Download PDF

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Publication number
WO2015170566A1
WO2015170566A1 PCT/JP2015/061814 JP2015061814W WO2015170566A1 WO 2015170566 A1 WO2015170566 A1 WO 2015170566A1 JP 2015061814 W JP2015061814 W JP 2015061814W WO 2015170566 A1 WO2015170566 A1 WO 2015170566A1
Authority
WO
WIPO (PCT)
Prior art keywords
core
cooler
coil
switching element
flat plate
Prior art date
Application number
PCT/JP2015/061814
Other languages
English (en)
Japanese (ja)
Inventor
辰哉 上松
Original Assignee
株式会社 豊田自動織機
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 豊田自動織機 filed Critical 株式会社 豊田自動織機
Publication of WO2015170566A1 publication Critical patent/WO2015170566A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/10—Liquid cooling
    • H01F27/16—Water cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00—Fixed inductances not covered by group H01F17/00

Definitions

  • the present invention relates to an electronic device provided with an induction device such as a reactor or a transformer, having a core and a coil wound around the core.
  • Some electronic devices include an induction device such as a reactor or a transformer having a core and a coil wound around the core.
  • the induction device for example, the temperature rise is suppressed by being cooled by a cooler (see, for example, Patent Document 1).
  • a switching element is electrically connected to the coil.
  • the carrier frequency used to perform the switching operation of the switching element.
  • the core has a low electrical resistivity
  • increasing the carrier frequency increases the iron loss of the core. Since the temperature of the induction device rises as the core generates heat due to the iron loss of the core, it is difficult to increase the carrier frequency.
  • An object of the present invention is to provide an electronic device capable of suppressing the temperature rise of the induction device caused by the high frequency of the carrier frequency.
  • An electronic device that solves the above problems is an induction device having a core and a coil wound around the core, and a switching element electrically connected to the coil, wherein switching is performed using a high-frequency carrier frequency.
  • the switching device to be operated, and a cooler thermally coupled to the core.
  • the reactor device 10 includes an induction device 11 having two cores, ie, a first core 21 and a second core 22, and two coils, ie, a first coil 31 and a second coil 32.
  • the first core 21 and the second core 22 are U-shaped cores.
  • the first core 21 and the second core 22 are magnetic members and are formed of dust cores.
  • the first core 21 includes a flat plate portion 21a having a substantially rectangular flat plate shape, a cylindrical first leg portion 21b extending from one end in the longitudinal direction of the flat plate portion 21a toward the second core 22, and a longitudinal direction of the flat plate portion 21a. And a cylindrical second leg 21 c extending from the other end of the second core 22 to the second core 22.
  • the second core 22 includes a flat plate portion 22a having a substantially rectangular flat plate shape, a cylindrical first leg 22b extending from one end in the longitudinal direction of the flat plate portion 22a toward the first core 21, and a longitudinal direction of the flat plate portion 22a. And a cylindrical second leg 22c extending toward the first core 21 from the other end.
  • the first core 21 has the same shape as the second core 22. Further, in the first and second cores 21 and 22, the end faces in the extending direction of the first legs 21b and 22b face each other, and the end faces in the extending direction of the second legs 21c and 22c face each other It is arranged to be.
  • a gap plate 13 is interposed between the end surfaces of the first legs 21b and 22b and between the end surfaces of the second legs 21c and 22c.
  • Each gap plate 13 is a nonmagnetic material (for example, ceramic), and is formed in a disk shape having the same outer diameter as the first legs 21b and 22b and the second legs 21c and 22c.
  • the gap plate 13 forms a gap between the end faces of the first legs 21b and 22b and between the end faces of the second legs 21c and 22c.
  • a first bobbin 41 is attached to the first core 21, and a second bobbin 42 is attached to the second core 22.
  • the first bobbin 41 and the second bobbin 42 are made of resin.
  • the first bobbin 41 and the second bobbin 42 are formed of polyphenylene sulfide resin (PPS resin).
  • the first bobbin 41 has a flat plate portion 41a, a cylindrical first cylindrical portion 41b projecting from the flat plate portion 41a, and a cylindrical second cylindrical portion 41c projecting from the flat plate portion 41a.
  • the first leg portion 21b of the first core 21 is inserted into the first cylindrical portion 41b, and the second leg portion 21c of the first core 21 is inserted into the second cylindrical portion 41c.
  • the second bobbin 42 has a flat plate portion 42a, a cylindrical first cylindrical portion 42b projecting from the flat plate portion 42a, and a cylindrical second cylindrical portion 42c projecting from the flat plate portion 42a.
  • the first leg 22b of the second core 22 is inserted into the first cylindrical portion 42b, and the second leg 22c of the second core 22 is inserted into the second cylindrical portion 42c.
  • the tips in the projecting direction of the first cylindrical portions 41b and 42b face each other, and the tips in the projecting direction of the second cylindrical portions 41c and 42c face each other Is located in
  • the first coil 31 has an annular shape, and is wound around the first cylindrical portions 41b and 42b into which the first legs 21b and 22b are inserted.
  • the second coil 32 has an annular shape, and is wound around the second cylindrical portions 41c and 42c into which the second legs 21c and 22c are inserted.
  • each of the first and second coils 31 and 32 is formed by edgewise bending a single conductive plate, and the tip of the first coil 31 is the tip of the second coil 32 and the connecting part It is linked at 33.
  • the second coil 32 and the second coil 32 are disposed radially adjacent to each other, and a connecting portion 33 is provided in a gap between the coils 31 and 32.
  • the winding direction of the first coil 31 is different from the winding direction of the second coil 32.
  • the first and second coils 31 and 32 may be integrally formed by edgewise bending a single conductive plate.
  • the reactor system 10 includes two coolers, ie, a first cooler 51 and a second cooler 52.
  • the first cooler 51 is thermally coupled to the first core 21.
  • the second cooler 52 is thermally coupled to the second core 22.
  • Each of the first and second coolers 51 and 52 is flat and has square box-like main portions 51a and 52a.
  • the main body portions 51a and 52a are made of aluminum.
  • Each main body 51a, 52a has a first plate 51b, 52b, a second plate 51c, 52c, and a corrugated inner fin 51d, 52d.
  • the inner fins 51d are disposed between the first and second plates 51b and 51c and brazed to the plates 51b and 51c, and the outer peripheral edge portion of the first plate 51b is the second plate It is brazed to the outer peripheral edge of 51c.
  • the first plate 51b, the second plate 51c, and the inner fins 51d form a refrigerant flow passage 51e in which cooling water as a refrigerant flows in the main body 51a.
  • the inner fins 52d are disposed between the first and second plates 52b and 52c and brazed to the plates 52b and 52c, and the outer peripheral edge of the first plate 52b is It is brazed to the outer peripheral edge of the second plate 52c.
  • the first plate 52b, the second plate 52c, and the inner fins 52d form a refrigerant flow passage 52e through which cooling water as a refrigerant flows in the main body 52a.
  • the flat plate portion 21 a of the first core 21 has a surface (outside surface) opposite to the second core 22.
  • the first plate 51b of the first cooler 51 is in close contact with the outer surface of the flat plate portion 21a of the first core 21 in a state of surface contact via a heat release grease (not shown).
  • the flat plate portion 22 a of the second core 22 has a surface (outside surface) opposite to the first core 21.
  • the second plate 52c of the second cooler 52 is in close contact with the outer surface of the flat plate portion 22a of the second core 22 in a surface contact via a heat release grease (not shown). Therefore, in the present embodiment, the two coolers 51 and 52 are disposed on both sides of the cores (the first core 21 and the second core 22) to sandwich the cores.
  • the first cooler 51 and the core (first core 21) are in surface contact with each other
  • the second cooler 52 and the core (second core 22) are in surface contact with each other.
  • the switching element 53 (for example, an insulated gate bipolar transistor (IGBT)) is mounted on the second plate 51 c of the first cooler 51 via the substrate 53 a.
  • the first cooler 51 is thermally coupled to the switching element 53.
  • the switching element 53 is electrically connected to the first coil 31 and the second coil 32.
  • a control substrate 54 electrically connected to the switching element 53 is mounted on the second plate 51 c of the first cooler 51.
  • the control board 54 controls the switching operation of the switching element 53.
  • the control substrate 54 controls the switching operation of the switching element 53 using a carrier frequency (for example, a carrier frequency of 10 kHz or more) which has been increased in frequency.
  • a carrier frequency for example, a carrier frequency of 10 kHz or more
  • the carrier frequency for performing the switching operation of the switching element 53 is increased.
  • the electrical resistivity of the first core 21 and the second core 22 is small, the iron loss of the first core 21 and the second core 22 is increased by increasing the carrier frequency, which is caused by the iron loss. An exotherm occurs.
  • the first core 21 is thermally coupled to the first cooler 51, and the second core 22 is thermally coupled to the second cooler 52. According to this, the first core 21 is efficiently cooled by the cooling water flowing through the refrigerant flow passage 51e of the first cooler 51, and the second core is cooled by the cooling water flowing through the refrigerant flow passage 52e of the second cooler 52 22 is cooled efficiently.
  • the switching element 53 generates a large amount of heat as the carrier frequency increases. However, the switching element 53 is cooled by the cooling water flowing through the refrigerant flow path 51e of the first cooler 51, so that the temperature rise of the switching element 53 is suppressed.
  • the switching element 53 performs switching operation using the carrier frequency whose frequency is increased.
  • the first core 21 is thermally coupled to the first cooler 51, and the second core 22 is thermally coupled to the second cooler 52. According to this, the first core 21 can be efficiently cooled by the first cooler 51, and the second core 22 can be efficiently cooled by the second cooler 52. As a result, it is possible to suppress the temperature rise of the induction device 11 caused by the increase of the carrier frequency.
  • the first cooler 51 is thermally coupled to the switching element 53. According to this, the switching element 53 that generates heat as the carrier frequency becomes higher can be cooled by the first cooler 51.
  • Reactor apparatus 10 includes two coolers 51 and 52, and coolers 51 and 52 are disposed on both sides of cores 21 and 22 so as to sandwich first core 21 and second core 22. . According to this, the first and second cores 21 and 22 can be cooled more efficiently, and the temperature rise of the induction device 11 can be further suppressed.
  • the first plate 51 b of the first cooler 51 is in surface contact with the flat plate portion 21 a of the first core 21.
  • the second plate 52 c of the second cooler 52 is in surface contact with the flat plate portion 22 a of the second core 22. According to this, uniformization of the temperature distribution in the first and second cores 21 and 22 can be promoted. As a result, an increase in local eddy current loss in the first and second cores 21 and 22 can be suppressed.
  • the above embodiment may be modified as follows. ⁇ As shown in the second embodiment of FIG. 2, even if the resin 55 is disposed between the first coil 31 and the coolers 51 and 52 and between the second coil 32 and the coolers 51 and 52 Good.
  • the resin 55 is, for example, a thermoplastic resin such as polyphenylene sulfide resin (PPS resin) containing glass filler, or polybutylene terephthalate resin (PBT resin).
  • PPS resin polyphenylene sulfide resin
  • PBT resin polybutylene terephthalate resin
  • the resin 55 may be a thermosetting resin such as unsaturated polyester resin. According to this, the heat from the first coil 31 and the second coil 32 is dissipated to the coolers 51 and 52 through the resin 55, so that the first coil 31 and the second coil 32 can be efficiently cooled. it can. As a result, the temperature rise of the induction device 11 can be further suppressed.
  • At least a portion of the first plate 51b of the first cooler 51 may be in contact with the flat plate portion 21a of the first core 21, and the first cooler 51 and the first core 21 may be It does not have to be in face contact with each other.
  • At least a portion of the second plate 52c of the second cooler 52 may be in contact with the flat plate portion 22a of the second core 22, and the second cooler 52 and the second core 22 may be It does not have to be in face contact with each other.
  • one of the two coolers 51 and 52 may be omitted.
  • the switching element 53 may be mounted on the second cooler 52. In this case, the switching element 53 may not be thermally coupled to the second cooler 52.
  • the switching element 53 may not be thermally coupled to the first cooler 51.
  • the shape of the inner fins 51d and 52d is not particularly limited.
  • the inner fins 51d and 52d may be pin fins.
  • the coolers 51 and 52 may be air-cooled.
  • a cooling gas such as air flows as a refrigerant through each of the refrigerant channels 51e and 52e.
  • the coolers 51 and 52 may be made of aluminum die-cast.
  • the first core 21 may have a shape different from that of the second core 22.
  • the induction device 11 may have the first coil 31 and the second coil 32 wound around one core. Alternatively, only one coil may be provided.
  • the induction device 11 may have three or more cores. In each of the above embodiments, the induction device 11 may have three or more coils.
  • the first coil 31 and the second coil 32 may be wound round wires.
  • the switching element 53 may be, for example, a metal oxide semiconductor field effect transistor (MOSFET) or the like.
  • the switching element 53 may be mounted on the control board 54.
  • the control board 54 may not be mounted on the second plate 51c of the first cooler 51, but may be fixed to another member such as a housing, for example.
  • the induction device 11 may be a device other than a reactor (for example, a transformer).
  • the reactor device 10 may be a reactor device other than for use in vehicles.

Abstract

La présente invention concerne un appareil électronique, comprenant : un appareil à induction ; un élément de commutation ; et un dispositif de refroidissement. Ledit appareil à induction présente un noyau et une bobine enroulée autour du noyau. L'élément de commutation est connecté électriquement à la bobine, et une opération de commutation est déclenchée dans l'élément de commutation à l'aide d'une fréquence porteuse conçue pour être une haute fréquence. Le dispositif de refroidissement est couplé thermiquement au noyau.
PCT/JP2015/061814 2014-05-09 2015-04-17 Appareil électronique WO2015170566A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-097742 2014-05-09
JP2014097742A JP6064943B2 (ja) 2014-05-09 2014-05-09 電子機器

Publications (1)

Publication Number Publication Date
WO2015170566A1 true WO2015170566A1 (fr) 2015-11-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/061814 WO2015170566A1 (fr) 2014-05-09 2015-04-17 Appareil électronique

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JP (1) JP6064943B2 (fr)
TW (1) TW201603063A (fr)
WO (1) WO2015170566A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019092800A1 (fr) * 2017-11-08 2019-05-16 三菱電機株式会社 Transformateur et dispositif de conversion de puissance

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Publication number Priority date Publication date Assignee Title
JP2017168489A (ja) * 2016-03-14 2017-09-21 オムロン株式会社 コイル部品の放熱構造およびそれに用いられるコイル部品
JP6469146B2 (ja) 2017-02-16 2019-02-13 ファナック株式会社 リアクトル、モータ駆動装置、パワーコンディショナおよび機械

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JP2001275360A (ja) * 2000-03-27 2001-10-05 Mitsubishi Electric Corp コンバータ装置および冷凍サイクル装置
JP2009212141A (ja) * 2008-02-29 2009-09-17 Denso Corp 電源トランス及びインダクタンス部品
JP2011172431A (ja) * 2010-02-22 2011-09-01 Daikin Industries Ltd スイッチング電源回路
JP2013033924A (ja) * 2011-07-05 2013-02-14 Kobe Steel Ltd インバータ用筐体およびインバータ装置

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JP2000100633A (ja) * 1998-09-25 2000-04-07 Tokin Corp 巻線部品
JP2009049082A (ja) * 2007-08-15 2009-03-05 Toyota Motor Corp リアクトル冷却システム
JP2012079951A (ja) * 2010-10-04 2012-04-19 Mitsubishi Electric Corp リアクトル装置
JP2013074063A (ja) * 2011-09-27 2013-04-22 Sumitomo Electric Ind Ltd リアクトル
JP5745995B2 (ja) * 2011-10-27 2015-07-08 トヨタ自動車株式会社 スイッチング素子装置
JP6098786B2 (ja) * 2012-09-21 2017-03-22 住友電気工業株式会社 複合材料、リアクトル、コンバータ、及び電力変換装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001275360A (ja) * 2000-03-27 2001-10-05 Mitsubishi Electric Corp コンバータ装置および冷凍サイクル装置
JP2009212141A (ja) * 2008-02-29 2009-09-17 Denso Corp 電源トランス及びインダクタンス部品
JP2011172431A (ja) * 2010-02-22 2011-09-01 Daikin Industries Ltd スイッチング電源回路
JP2013033924A (ja) * 2011-07-05 2013-02-14 Kobe Steel Ltd インバータ用筐体およびインバータ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019092800A1 (fr) * 2017-11-08 2019-05-16 三菱電機株式会社 Transformateur et dispositif de conversion de puissance
US11640871B2 (en) 2017-11-08 2023-05-02 Mitsubishi Electric Corporation Transformer and power conversion device

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JP2015216209A (ja) 2015-12-03
TW201603063A (zh) 2016-01-16
JP6064943B2 (ja) 2017-01-25

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