WO2015170566A1

WO2015170566A1 - Electronic apparatus

Info

Publication number: WO2015170566A1
Application number: PCT/JP2015/061814
Authority: WO
Inventors: 辰哉上松
Original assignee: 株式会社豊田自動織機
Priority date: 2014-05-09
Filing date: 2015-04-17
Publication date: 2015-11-12
Also published as: JP6064943B2; JP2015216209A; TW201603063A

Abstract

Provided is an electronic apparatus comprising: an induction apparatus; a switching element; and a cooler. The induction apparatus has a core and a coil wound around the core. The switching element is electrically connected to the coil, and a switching operation is elicited in the switching element using a carrier frequency which was made to be high frequency. The cooler is thermally coupled to the core.

Description

Electronics

The present invention relates to an electronic device provided with an induction device such as a reactor or a transformer, having a core and a coil wound around the core.

Some electronic devices include an induction device such as a reactor or a transformer having a core and a coil wound around the core. In the induction device, for example, the temperature rise is suppressed by being cooled by a cooler (see, for example, Patent Document 1).

JP-A-7-192933

A switching element is electrically connected to the coil. In order to miniaturize the induction device, it is desirable to increase the carrier frequency used to perform the switching operation of the switching element. However, since the core has a low electrical resistivity, increasing the carrier frequency increases the iron loss of the core. Since the temperature of the induction device rises as the core generates heat due to the iron loss of the core, it is difficult to increase the carrier frequency.

An object of the present invention is to provide an electronic device capable of suppressing the temperature rise of the induction device caused by the high frequency of the carrier frequency.

An electronic device that solves the above problems is an induction device having a core and a coil wound around the core, and a switching element electrically connected to the coil, wherein switching is performed using a high-frequency carrier frequency. The switching device to be operated, and a cooler thermally coupled to the core.

BRIEF DESCRIPTION OF THE DRAWINGS The longitudinal cross-sectional view of the reactor apparatus in 1st Embodiment. The longitudinal cross-sectional view of the reactor apparatus in 2nd Embodiment.

Hereinafter, a first embodiment of a vehicle-mounted reactor device 10, which is a type of electronic device, will be described according to FIG.
As shown in FIG. 1, the reactor device 10 includes an induction device 11 having two cores, ie, a first core 21 and a second core 22, and two coils, ie, a first coil 31 and a second coil 32. . The first core 21 and the second core 22 are U-shaped cores. The first core 21 and the second core 22 are magnetic members and are formed of dust cores.

The first core 21 includes a flat plate portion 21a having a substantially rectangular flat plate shape, a cylindrical first leg portion 21b extending from one end in the longitudinal direction of the flat plate portion 21a toward the second core 22, and a longitudinal direction of the flat plate portion 21a. And a cylindrical second leg 21 c extending from the other end of the second core 22 to the second core 22.

The second core 22 includes a flat plate portion 22a having a substantially rectangular flat plate shape, a cylindrical first leg 22b extending from one end in the longitudinal direction of the flat plate portion 22a toward the first core 21, and a longitudinal direction of the flat plate portion 22a. And a cylindrical second leg 22c extending toward the first core 21 from the other end.

The first core 21 has the same shape as the second core 22. Further, in the first and

second cores

21 and 22, the end faces in the extending direction of the first legs 21b and 22b face each other, and the end faces in the extending direction of the second legs 21c and 22c face each other It is arranged to be.

A gap plate 13 is interposed between the end surfaces of the first legs 21b and 22b and between the end surfaces of the second legs 21c and 22c. Each gap plate 13 is a nonmagnetic material (for example, ceramic), and is formed in a disk shape having the same outer diameter as the first legs 21b and 22b and the second legs 21c and 22c. The gap plate 13 forms a gap between the end faces of the first legs 21b and 22b and between the end faces of the second legs 21c and 22c.

A first bobbin 41 is attached to the first core 21, and a second bobbin 42 is attached to the second core 22. The first bobbin 41 and the second bobbin 42 are made of resin. In the present embodiment, the first bobbin 41 and the second bobbin 42 are formed of polyphenylene sulfide resin (PPS resin).

The first bobbin 41 has a flat plate portion 41a, a cylindrical first cylindrical portion 41b projecting from the flat plate portion 41a, and a cylindrical second cylindrical portion 41c projecting from the flat plate portion 41a. The first leg portion 21b of the first core 21 is inserted into the first cylindrical portion 41b, and the second leg portion 21c of the first core 21 is inserted into the second cylindrical portion 41c.

The second bobbin 42 has a flat plate portion 42a, a cylindrical first cylindrical portion 42b projecting from the flat plate portion 42a, and a cylindrical second cylindrical portion 42c projecting from the flat plate portion 42a. The first leg 22b of the second core 22 is inserted into the first cylindrical portion 42b, and the second leg 22c of the second core 22 is inserted into the second cylindrical portion 42c.

In the first and

second bobbins

41 and 42, the tips in the projecting direction of the first

cylindrical portions

41b and 42b face each other, and the tips in the projecting direction of the second

cylindrical portions

41c and 42c face each other Is located in

The first coil 31 has an annular shape, and is wound around the first

cylindrical portions

41b and 42b into which the first legs 21b and 22b are inserted. The second coil 32 has an annular shape, and is wound around the second

cylindrical portions

41c and 42c into which the second legs 21c and 22c are inserted. In the present embodiment, each of the first and

second coils

31 and 32 is formed by edgewise bending a single conductive plate, and the tip of the first coil 31 is the tip of the second coil 32 and the connecting part It is linked at 33. The first coil 31 wound on the first legs 21b and 22b (that is, the first

cylindrical portions

41b and 42b) and the second legs 21c and 22c (that is, the second

cylindrical portions

41c and 42c) The second coil 32 and the second coil 32 are disposed radially adjacent to each other, and a connecting portion 33 is provided in a gap between the

coils

31 and 32. The winding direction of the first coil 31 is different from the winding direction of the second coil 32. The first and

second coils

31 and 32 may be integrally formed by edgewise bending a single conductive plate.

The reactor system 10 includes two coolers, ie, a first cooler 51 and a second cooler 52. The first cooler 51 is thermally coupled to the first core 21. The second cooler 52 is thermally coupled to the second core 22.

Each of the first and

second coolers

51 and 52 is flat and has square box-like

main portions

51a and 52a. The

main body portions

51a and 52a are made of aluminum. Each

main body

51a, 52a has a

first plate

51b, 52b, a second plate 51c, 52c, and a corrugated

inner fin

51d, 52d. In the first cooler 51, the inner fins 51d are disposed between the first and second plates 51b and 51c and brazed to the plates 51b and 51c, and the outer peripheral edge portion of the first plate 51b is the second plate It is brazed to the outer peripheral edge of 51c. The first plate 51b, the second plate 51c, and the inner fins 51d form a refrigerant flow passage 51e in which cooling water as a refrigerant flows in the main body 51a. Similarly, in the second cooler 52, the inner fins 52d are disposed between the first and

second plates

52b and 52c and brazed to the

plates

52b and 52c, and the outer peripheral edge of the first plate 52b is It is brazed to the outer peripheral edge of the second plate 52c. The first plate 52b, the second plate 52c, and the inner fins 52d form a refrigerant flow passage 52e through which cooling water as a refrigerant flows in the main body 52a.

The flat plate portion 21 a of the first core 21 has a surface (outside surface) opposite to the second core 22. The first plate 51b of the first cooler 51 is in close contact with the outer surface of the flat plate portion 21a of the first core 21 in a state of surface contact via a heat release grease (not shown). The flat plate portion 22 a of the second core 22 has a surface (outside surface) opposite to the first core 21. The second plate 52c of the second cooler 52 is in close contact with the outer surface of the flat plate portion 22a of the second core 22 in a surface contact via a heat release grease (not shown). Therefore, in the present embodiment, the two

coolers

51 and 52 are disposed on both sides of the cores (the first core 21 and the second core 22) to sandwich the cores. The first cooler 51 and the core (first core 21) are in surface contact with each other, and the second cooler 52 and the core (second core 22) are in surface contact with each other.

The switching element 53 (for example, an insulated gate bipolar transistor (IGBT)) is mounted on the second plate 51 c of the first cooler 51 via the substrate 53 a. Thus, the first cooler 51 is thermally coupled to the switching element 53. The switching element 53 is electrically connected to the first coil 31 and the second coil 32. Further, on the second plate 51 c of the first cooler 51, a control substrate 54 electrically connected to the switching element 53 is mounted. The control board 54 controls the switching operation of the switching element 53. Then, in the present embodiment, the control substrate 54 controls the switching operation of the switching element 53 using a carrier frequency (for example, a carrier frequency of 10 kHz or more) which has been increased in frequency.

Next, the operation of the present embodiment will be described.
In the reactor device 10 of the present embodiment, in order to miniaturize the induction device 11, the carrier frequency for performing the switching operation of the switching element 53 is increased. However, since the electrical resistivity of the first core 21 and the second core 22 is small, the iron loss of the first core 21 and the second core 22 is increased by increasing the carrier frequency, which is caused by the iron loss. An exotherm occurs.

In the present embodiment, the first core 21 is thermally coupled to the first cooler 51, and the second core 22 is thermally coupled to the second cooler 52. According to this, the first core 21 is efficiently cooled by the cooling water flowing through the refrigerant flow passage 51e of the first cooler 51, and the second core is cooled by the cooling water flowing through the refrigerant flow passage 52e of the second cooler 52 22 is cooled efficiently.

The switching element 53 generates a large amount of heat as the carrier frequency increases. However, the switching element 53 is cooled by the cooling water flowing through the refrigerant flow path 51e of the first cooler 51, so that the temperature rise of the switching element 53 is suppressed.

The following effects can be obtained in the above embodiment.
(1) The switching element 53 performs switching operation using the carrier frequency whose frequency is increased. The first core 21 is thermally coupled to the first cooler 51, and the second core 22 is thermally coupled to the second cooler 52. According to this, the first core 21 can be efficiently cooled by the first cooler 51, and the second core 22 can be efficiently cooled by the second cooler 52. As a result, it is possible to suppress the temperature rise of the induction device 11 caused by the increase of the carrier frequency.

(2) The first cooler 51 is thermally coupled to the switching element 53. According to this, the switching element 53 that generates heat as the carrier frequency becomes higher can be cooled by the first cooler 51.

(3) Reactor apparatus 10 includes two

coolers

51 and 52, and

coolers

51 and 52 are disposed on both sides of

cores

21 and 22 so as to sandwich first core 21 and second core 22. . According to this, the first and

second cores

21 and 22 can be cooled more efficiently, and the temperature rise of the induction device 11 can be further suppressed.

(4) The first plate 51 b of the first cooler 51 is in surface contact with the flat plate portion 21 a of the first core 21. The second plate 52 c of the second cooler 52 is in surface contact with the flat plate portion 22 a of the second core 22. According to this, uniformization of the temperature distribution in the first and

second cores

21 and 22 can be promoted. As a result, an increase in local eddy current loss in the first and

second cores

21 and 22 can be suppressed.

The above embodiment may be modified as follows.
○ As shown in the second embodiment of FIG. 2, even if the resin 55 is disposed between the first coil 31 and the

coolers

51 and 52 and between the second coil 32 and the

coolers

51 and 52 Good. The resin 55 is, for example, a thermoplastic resin such as polyphenylene sulfide resin (PPS resin) containing glass filler, or polybutylene terephthalate resin (PBT resin). The resin 55 may be a thermosetting resin such as unsaturated polyester resin. According to this, the heat from the first coil 31 and the second coil 32 is dissipated to the

coolers

51 and 52 through the resin 55, so that the first coil 31 and the second coil 32 can be efficiently cooled. it can. As a result, the temperature rise of the induction device 11 can be further suppressed.

In each of the above-described embodiments, at least a portion of the first plate 51b of the first cooler 51 may be in contact with the flat plate portion 21a of the first core 21, and the first cooler 51 and the first core 21 may be It does not have to be in face contact with each other.

In each of the above-described embodiments, at least a portion of the second plate 52c of the second cooler 52 may be in contact with the flat plate portion 22a of the second core 22, and the second cooler 52 and the second core 22 may be It does not have to be in face contact with each other.

In each of the above embodiments, one of the two

coolers

51 and 52 may be omitted.
In each of the above embodiments, the switching element 53 may be mounted on the second cooler 52. In this case, the switching element 53 may not be thermally coupled to the second cooler 52.

In each of the above embodiments, the switching element 53 may not be thermally coupled to the first cooler 51.
In each of the above embodiments, the shape of the

inner fins

51d and 52d is not particularly limited. For example, the

inner fins

51d and 52d may be pin fins.

In each of the above embodiments, the

coolers

51 and 52 may be air-cooled. In this case, a cooling gas such as air flows as a refrigerant through each of the

refrigerant channels

51e and 52e.
In each of the above embodiments, the

coolers

51 and 52 may be made of aluminum die-cast.

In each of the above embodiments, the first core 21 may have a shape different from that of the second core 22.
In each of the above embodiments, the induction device 11 may have the first coil 31 and the second coil 32 wound around one core. Alternatively, only one coil may be provided.

In each of the above embodiments, the induction device 11 may have three or more cores.
In each of the above embodiments, the induction device 11 may have three or more coils.

In each of the above embodiments, the first coil 31 and the second coil 32 may be wound round wires.
In each of the above embodiments, the switching element 53 may be, for example, a metal oxide semiconductor field effect transistor (MOSFET) or the like.

In each of the above embodiments, the switching element 53 may be mounted on the control board 54.
In each of the above embodiments, the control board 54 may not be mounted on the second plate 51c of the first cooler 51, but may be fixed to another member such as a housing, for example.

In each of the above embodiments, the induction device 11 may be a device other than a reactor (for example, a transformer).
In each of the above-described embodiments, the reactor device 10 may be a reactor device other than for use in vehicles.

Claims

An induction device having a core and a coil wound on the core;
A switching element electrically connected to the coil, wherein the switching element is switched using a high frequency carrier frequency;
An electronic device thermally coupled to the core.
The electronic device according to claim 1, wherein the cooler is thermally coupled to the switching element.
The electronic device according to claim 1, wherein the core and the cooler are in surface contact with each other.
The electronic device according to any one of claims 1 to 3, wherein the coolers are disposed on both sides of the core.
The electronic device according to any one of claims 1 to 4, further comprising a resin disposed between the coil and the cooler.