WO2015164853A1 - High breakdown n-type buried layer - Google Patents

High breakdown n-type buried layer Download PDF

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Publication number
WO2015164853A1
WO2015164853A1 PCT/US2015/027699 US2015027699W WO2015164853A1 WO 2015164853 A1 WO2015164853 A1 WO 2015164853A1 US 2015027699 W US2015027699 W US 2015027699W WO 2015164853 A1 WO2015164853 A1 WO 2015164853A1
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Prior art keywords
layer
type
substrate
semiconductor device
type buried
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PCT/US2015/027699
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English (en)
French (fr)
Inventor
Sameer P. Pendharkar
Binghau Hu
Henry Litzmann EDWARDS
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Texas Instruments Japan Ltd
Texas Instruments Inc
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Texas Instruments Japan Ltd
Texas Instruments Inc
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Priority to CN201580020171.3A priority Critical patent/CN106233439B/zh
Priority to JP2017507937A priority patent/JP6657183B2/ja
Publication of WO2015164853A1 publication Critical patent/WO2015164853A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H10D62/107—Buried supplementary regions, e.g. buried guard rings 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/114—PN junction isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/834—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H—ELECTRICITY
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H—ELECTRICITY
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H10P30/212—Through-implantation
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/22—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/28—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by an annealing step, e.g. for activation of dopants
    • H—ELECTRICITY
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1404—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase using predeposition followed by drive-in of impurities into the semiconductor surface, e.g. predeposition from a gaseous phase
    • H10P32/1406—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase using predeposition followed by drive-in of impurities into the semiconductor surface, e.g. predeposition from a gaseous phase by ion implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H10W15/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor

Definitions

  • This relates generally to semiconductor devices, and more particularly to buried layers in semiconductor devices.
  • An example semiconductor device contains an n-type buried layer in a p-type substrate.
  • the buried layer is biased to a high voltage, above 80 volts, to provide isolated operation at high voltage for a component in the substrate above the buried layer.
  • the pn junction exhibits undesirable leakage current and low breakdown.
  • a semiconductor device has an n-type buried layer over a p-type first epitaxial layer and under a p-type second epitaxial layer.
  • the buried layer is formed by implanting heavy n-type dopants, antimony and/or arsenic, into the p-type first epitaxial layer at a high dose and low energy, and implanting a lighter n-type dopant, phosphorus, at a low dose and high energy.
  • a thermal drive process diffuses and activates both the heavy dopants and the phosphorus.
  • the heavy dopants do not diffuse significantly, advantageously maintaining a narrow profile for a main layer of the buried layer.
  • the phosphorus diffuses to advantageously provide a lightly-doped layer several microns thick below the main layer.
  • FIG. 1 is a cross section of an example semiconductor device containing a high voltage n-type buried layer.
  • FIGS. 2 A through 2F are cross sections of a semiconductor device, similar to the semiconductor device of FIG. 1, shown in successive stages of fabrication.
  • FIGS. 3 A through 3F are cross sections of another example semiconductor device containing a high voltage localized n-type buried layer, depicted in successive stages of fabrication.
  • FIG. 4 is a cross section of an alternate example semiconductor device containing a high voltage n-type buried layer.
  • FIG. 1 is a cross section of an example semiconductor device containing a high voltage n-type buried layer.
  • the semiconductor device 100 has a substrate 102, which includes a first epitaxial layer 104 of semiconductor material, such as single crystal silicon.
  • the substrate 102 also includes a second epitaxial layer 106 disposed on the first epitaxial layer 104.
  • the second epitaxial layer 106 includes a semiconductor material, which may have a same composition as the first epitaxial layer 104.
  • An n-type buried layer 108 is disposed in the substrate 102 at a boundary between the first epitaxial layer 104 and the second epitaxial layer 106, extending into the first epitaxial layer 104 and the second epitaxial layer 106.
  • the first epitaxial layer 104 immediately below the n-type buried layer 108 is referred to as a lower layer 110.
  • the lower layer 110 is p-type and has a resistivity of 5 ohm-cm to 10 ohm-cm.
  • the second epitaxial layer 106 above the n-type buried layer 108 is referred to as an upper layer 112.
  • the upper layer 112 is p-type and has a resistivity of 5 ohm-cm to 10 ohm-cm.
  • the n-type buried layer 108 includes a main layer 114, which straddles the boundary between the first epitaxial layer 104 and the second epitaxial layer 106, extending at least a micron into the first epitaxial layer 104 and at least a micron into the second epitaxial layer 106.
  • the main layer 114 has an average doping density greater than 5x 10 18 cm "3 . At least 50 percent of the n-type dopants in the main layer 114 are arsenic and/or antimony.
  • a top surface 116 of the main layer 114 is at least 5 microns below a top surface 118 of the substrate 102.
  • the top surface 116 of the main layer 114 may be 8 microns to 12 microns below the top surface 118 of the substrate 102.
  • the n-type buried layer 108 includes a lightly-doped layer 120 extending at least 2 microns below the main layer 114.
  • the lightly-doped layer 120 is disposed in the first epitaxial layer 104 over the lower layer 110.
  • the lightly-doped layer 120 has an average doping density of l x lO 16 cm “3 to l x lO 17 cm “3 .
  • At least 90 percent of the n-type dopants in the lightly-doped layer 120 are phosphorus.
  • the n-type buried layer 108 may extend substantially across the semiconductor device 100 as indicated in FIG. 1.
  • the n-type buried layer 108 may be biased 80 volts to 110 volts higher than the lower layer 110.
  • the structure of the n-type buried layer 108 with the lightly-doped layer 120 may advantageously prevent breakdown of a pn junction between the n-type buried layer 108 and the lower layer 110, and may advantageously provide a desired low level of leakage current.
  • the structure of the n-type buried layer 108 with the main layer 114 advantageously provides a low sheet resistance to maintain a uniform bias for components in the upper layer 112 above the n-type buried layer 108.
  • the semiconductor device 100 may include a deep trench structure 122, which extends through the upper layer 112, through the n-type buried layer 108, and into the lower layer 110.
  • the deep trench structure 122 includes a dielectric liner 124, including silicon dioxide contacting the semiconductor material of the substrate 102.
  • the deep trench structure 122 may also include an electrically conductive fill material 126, such as polycrystalline silicon (referred to as polysilicon) on the dielectric liner 124.
  • the structure of the n-type buried layer 108 with the lightly-doped layer 120 is especially advantageous for preventing breakdown of the pn junction between the n-type buried layer 108 and the lower layer 110 at the dielectric liner 124.
  • the deep trench structure 122 may have a closed loop configuration as depicted in FIG. 1, so that a portion 128 of the upper layer 112 is electrically isolated from the remaining upper layer 112 by the deep trench structure 122 and is electrically isolated from the lower layer 110 by the n-type buried layer 108.
  • Components in the portion 128 of the upper layer 112 may be advantageously operated at 85 volts to 110 volts relative to components in the remaining upper layer 112 outside the deep trench structure 122.
  • FIG. 2A through FIG. 2F are cross sections of a semiconductor device, similar to the semiconductor device of FIG. 1, shown in successive stages of fabrication.
  • fabrication of the semiconductor device 100 starts with the first epitaxial layer 104.
  • the first epitaxial layer 104 may be a top portion of a stack of epitaxial layers on a heavily-doped single crystal silicon wafer.
  • the first epitaxial layer 104 is p-type with a resistivity of 5 ohm-cm to 10 ohm-cm.
  • a layer of pad oxide 130 is formed over the first epitaxial layer 104, such as by thermal oxidation.
  • N-type dopants 132 are implanted into the first epitaxial layer 104 to form a first implanted layer 134.
  • the n-type dopants include at least 50 percent arsenic and/or antimony. In one version of this example, the n-type dopants 132 may be substantially all antimony, as indicated in FIG. 2A.
  • the n-type dopants 132 are implanted at a dose greater than 5x 10 14 cm "2 , such as l x lO 15 cm "2 to 5x 10 15 cm "2 .
  • Antimony in the n-type dopants 132 may be implanted at energies less than 50 keV.
  • Arsenic in the n-type dopants 132 may be implanted at energies less than 40 keV.
  • phosphorus 136 is implanted into the first epitaxial layer 104 to form a second implanted layer 138 below the first implanted layer 134.
  • the phosphorus 136 is implanted at a dose of 1 x 10 13 cm “2 to 1 x 10 14 cm “2 and at an energy above 100 keV.
  • a first thermal drive process 140 heats the first epitaxial layer 104 to a temperature of 1150 °C to 1225 °C for at least 30 minutes.
  • the first thermal drive process 140 may be performed in a furnace with an oxidizing ambient, which increases a thickness of the layer of pad oxide 130.
  • the first thermal drive process 140 causes the implanted n-type dopants in the first implanted layer 134 and the implanted phosphorus in the second implanted layer 138 to diffuse deeper into the first epitaxial layer 104.
  • the phosphorus in the second implanted layer 138 diffuses farther into the first epitaxial layer 104 than the arsenic and antimony in the first implanted layer 134.
  • the layer of pad oxide 130 is subsequently removed, such as by a wet etch using a dilute aqueous solution of buffered hydrofluoric acid.
  • an epitaxy process grows the second epitaxial layer 106 on the first epitaxial layer 104.
  • the epitaxy process may use silane, dichlorosilane, or other silicon-containing reagents.
  • the n-type dopants in the first implanted layer 134 of FIG. 2C diffuse into the second epitaxial layer 106, to form the main layer 114 of the n-type buried layer 108.
  • the main layer 114 straddles the boundary between the first epitaxial layer 104 and the second epitaxial layer 106.
  • the phosphorus in the second implanted layer 138 of FIG. 2C forms the lightly-doped layer 120 of the n-type buried layer 108.
  • the epitaxy process may use a boron-containing reagent (such as diborane) to provide p-type doping in the second epitaxial layer 106.
  • a boron-containing reagent such as diborane
  • p-type dopants such as boron
  • the first epitaxial layer 104 and the second epitaxial layer 106 provide a top portion of the substrate 102.
  • a second thermal drive process 142 heats the substrate 102 to a temperature of 1125 °C to 1200 °C for at least 120 minutes.
  • the second thermal drive process 142 may be performed in a furnace with a slightly oxidizing ambient.
  • the main layer 114 of the n-type buried layer 108 extends at least a micron into the first epitaxial layer 104 and at least a micron into the second epitaxial layer 106, and the lightly-doped layer 120 extends at least 2 microns below the main layer 114.
  • An average doping in the main layer 114 is greater than 5x 10 18 cm "3 .
  • An average doping in the lightly-doped layer 120 is l lO 16 cm "3 to l x lO 17 cm “3 .
  • the deep trench structure 122 may be formed by etching a deep trench in the substrate 102 after the second thermal drive process 142 of FIG. 2E.
  • the dielectric liner 124 may be formed by thermal oxidation followed by deposition of silicon dioxide by a sub-atmospheric chemical vapor deposition (SACVD) process.
  • SACVD sub-atmospheric chemical vapor deposition
  • the electrically conductive fill material 126 may be formed by depositing a conformal layer of polysilicon and subsequently removing the polysilicon from over a top surface of the substrate, such as by a chemical mechanical polish (CMP) process.
  • CMP chemical mechanical polish
  • Optional n-type self-aligned sinkers 144 may be formed in the second epitaxial layer 106 abutting the deep trench structures by implanting n-type dopants into the second epitaxial layer 106 after the deep trenches are partially etched.
  • the n-type self-aligned sinkers 144 provide electrical connections to the n-type buried layer 108.
  • FIG. 3A through FIG. 3F are cross sections of another example semiconductor device containing a high voltage localized n-type buried layer, depicted in successive stages of fabrication.
  • a localized n-type buried layer extends across only a portion of the semiconductor device.
  • the semiconductor device 300 is formed on a first epitaxial layer 304 containing a semiconductor material, such as single crystal silicon.
  • the first epitaxial layer 304 is p-type with a resistivity of 5 ohm-cm to 10 ohm-cm.
  • a layer of pad oxide 330 is formed over the first epitaxial layer 304.
  • an implant mask 346 is formed over the layer of pad oxide 330 to expose an area for the localized n-type buried layer 308.
  • the implant mask 346 may include photoresist formed by a photolithographic process or may include hard mask material, such as silicon dioxide formed by a thermal oxidation or a plasma enhanced chemical vapor (PECVD) process. Hard mask material in the implant mask 346 may advantageously facilitate subsequent removal of the implant mask 346 after implanting phosphorus at high energies.
  • N-type dopants 332 are implanted through the area exposed by the implant mask 346 into the first epitaxial layer 304 to form a first implanted layer 334.
  • the n-type dopants includes at least 50 percent arsenic and/or antimony.
  • the n-type dopants 332 are implanted at a dose greater than 5> ⁇ 10 14 cm "2 , such as l lO 15 cm "2 to 5> ⁇ 10 15 cm "2 .
  • phosphorus 336 is implanted through the area exposed by the implant mask 346 into the first epitaxial layer 304 to form a second implanted layer 338 below the first implanted layer 334.
  • the phosphorus 336 is implanted at a dose of l x lO 13 cm “2 to 1 x 10 14 cm “2 and at an energy above 100 keV.
  • Organic material in the implant mask 346, such as photoresist, is removed before a subsequent first thermal drive process.
  • a first thermal drive process 340 heats the first epitaxial layer 304 to a temperature of 1150 °C to 1225 °C for at least 30 minutes, such as described in reference to FIG. 2C.
  • the first thermal drive process 340 causes the implanted n-type dopants in the first implanted layer 334 and the implanted phosphorus in the second implanted layer 338 to diffuse deeper into the first epitaxial layer 304.
  • the phosphorus in the second implanted layer 338 diffuses farther into the first epitaxial layer 304 than the arsenic and antimony in the first implanted layer 334.
  • the implant mask 346 (if any) and the layer of pad oxide 330 are subsequently removed.
  • an epitaxy process grows a second epitaxial layer 306 on the first epitaxial layer 304 to provide a substrate 302 of the semiconductor device 300.
  • the n-type dopants in the first implanted layer 334 of FIG. 3C diffuse into the second epitaxial layer 306, to form a main layer 314 of the localized n-type buried layer 308.
  • the main layer 314 straddles a boundary between the first epitaxial layer 304 and the second epitaxial layer 306.
  • the phosphorus in the second implanted layer 338 of FIG. 3C forms a lightly-doped layer 320 of the localized n-type buried layer 308 below the main layer 314.
  • the second epitaxial layer 306 is p-type with a resistivity of 5 ohm-cm to 10 ohm-cm.
  • the first epitaxial layer 304 immediately below the n-type buried layer 308 is referred to as a lower layer 310.
  • the second epitaxial layer 306 above the n-type buried layer 308 is referred to as an upper layer 312.
  • a second thermal drive process 342 heats the substrate 302 to a temperature of 1125 °C to 1200 °C for at least 120 minutes.
  • the main layer 314 of the localized n-type buried layer 308 extends at least a micron into the first epitaxial layer 304 and at least a micron into the second epitaxial layer 306, and the lightly-doped layer 320 extends at least 2 microns below the main layer 314.
  • a top surface 316 of the main layer 314 is at least 5 microns below a top surface 318 of the substrate 302.
  • the top surface 316 of the main layer 314 may be 8 microns to 12 microns below the top surface 318 of the substrate 302.
  • An average doping in the main layer 314 is greater than 5 X 10 18 cm "3 .
  • At least 50 percent of the n-type dopants in the main layer 314 are arsenic and/or antimony.
  • the lightly-doped layer 320 extends at least 2 microns below the main layer 314.
  • An average doping in the lightly-doped layer 320 is l x lO 16 cm “3 to l x lO 17 cm “3 .
  • At least 90 percent of the n-type dopants in the lightly-doped layer 320 are phosphorus.
  • n-type sinkers 348 are formed in the second epitaxial layer 306, extending down to the localized n-type buried layer 308.
  • the n-type sinkers 348 may have a closed-loop configuration to isolate a portion 328 of the upper layer 312 from the remaining upper layer 312.
  • the localized n-type buried layer 308 isolates the portion 328 of the upper layer 312 from the lower layer 310.
  • the structure of the localized n-type buried layer 308 with the main layer 314 and the lightly-doped layer 320 may advantageously provide a low sheet resistance in the localized n-type buried layer 308, while reducing leakage current and preventing breakdown of a pn junction between the localized n-type buried layer 308 and the lower layer 310.
  • FIG. 4 is a cross section of an alternate example semiconductor device containing a high voltage n-type buried layer.
  • the semiconductor device 400 has a substrate 402, which includes a first epitaxial layer 404 of p-type semiconductor material, such as single crystal silicon.
  • the substrate 402 also includes a second epitaxial layer 406 disposed on the first epitaxial layer 404.
  • the second epitaxial layer 406 includes a p-type semiconductor material, which may have a same composition as the first epitaxial layer 404.
  • An n-type buried layer 408 is disposed in the substrate 402 at a boundary between the first epitaxial layer 404 and the second epitaxial layer 406, extending into the first epitaxial layer 404 and the second epitaxial layer 406.
  • the first epitaxial layer 404 immediately below the n-type buried layer 408 is referred to as a lower layer 410.
  • the lower layer 410 is p-type and has a resistivity of 5 ohm-cm to 10 ohm-cm.
  • the second epitaxial layer 406 above the n-type buried layer 408 is referred to as an upper layer 412.
  • the upper layer 412 is p-type and has a resistivity of 5 ohm-cm to 10 ohm-cm.
  • the n-type buried layer 408 includes a main layer 414, which straddles the boundary between the first epitaxial layer 404 and the second epitaxial layer 406, extending at least a micron into the first epitaxial layer 404 and at least a micron into the second epitaxial layer 406.
  • the main layer 414 has an average doping density greater than 5x 10 18 cm "3 .
  • a top surface 416 of the main layer 414 is at least 5 microns below a top surface 418 of the substrate 402.
  • the top surface 416 of the main layer 414 may be 8 microns to 12 microns below the top surface 418 of the substrate 402.
  • the n-type buried layer 408 includes a lightly-doped layer 420 extending at least 2 microns below the main layer 414.
  • the lightly-doped layer 420 is disposed in the first epitaxial layer 404 over the lower layer 410.
  • the lightly-doped layer 420 has an average doping density of 1 10 16 cm “3 to 1 10 17 cm " .
  • the n-type buried layer 408 may be formed as described in any of the examples herein.
  • One or more deep trench structures 422 are disposed in the substrate 402, extending below the buried layer 408 into the lower layer 410.
  • the deep trench structures 422 include dielectric liners 424 contacting the substrate 402.
  • the deep trench structures 422 include electrically conductive trench fill material 426 on the dielectric liners 424.
  • the dielectric liner 424 is removed at bottoms 450 of the deep trench structures 422, and the trench fill material 426 extends to the substrate 402, making electrical connection to the substrate 402 through a p-type contact region 452.
  • the contact region 452 and the method of removing the dielectric liner 424 at the bottom 450 of each deep trench structure 422 may be done as described in Application No. US 14/555,359, which is incorporated herein by reference.
  • the trench fill material 426 includes a first layer of polysilicon 454 disposed on the dielectric liner 424, extending to the bottoms 450 of the deep trench structures 422.
  • a second layer of polysilicon 456 is disposed on the first layer of polysilicon 454. Dopants are distributed in the first layer of polysilicon 454 and the second layer of polysilicon 456 with an average doping density of at least l x lO 18 cm "3 .
  • the trench fill material 426 may be formed as described in Application No. US 14/555,300, which is incorporated herein by reference.
  • N-type self-aligned sinkers 444 are disposed in the upper layer 412 abutting the deep trench structures 422 and extending to the buried layer 408.
  • the self-aligned sinkers 444 provide electrical connections to the buried layer 408.
  • the self-aligned sinkers 444 may be formed as described in Application No. US 14/555,209, which is incorporated herein by reference.

Landscapes

  • Element Separation (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Semiconductor Memories (AREA)
PCT/US2015/027699 2014-04-25 2015-04-27 High breakdown n-type buried layer Ceased WO2015164853A1 (en)

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US61/984,205 2014-04-25
US14/555,330 2014-11-26
US14/555,330 US9385187B2 (en) 2014-04-25 2014-11-26 High breakdown N-type buried layer

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JP2017514319A (ja) 2017-06-01
US20150311281A1 (en) 2015-10-29
US9673273B2 (en) 2017-06-06
JP6657183B2 (ja) 2020-03-04
CN106233439A (zh) 2016-12-14
US9385187B2 (en) 2016-07-05
US20160315141A1 (en) 2016-10-27

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