WO2015161806A1 - Process for producing aluminium-based board clad with copper foil on one side - Google Patents

Process for producing aluminium-based board clad with copper foil on one side Download PDF

Info

Publication number
WO2015161806A1
WO2015161806A1 PCT/CN2015/077225 CN2015077225W WO2015161806A1 WO 2015161806 A1 WO2015161806 A1 WO 2015161806A1 CN 2015077225 W CN2015077225 W CN 2015077225W WO 2015161806 A1 WO2015161806 A1 WO 2015161806A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
cutting
force
board
based board
Prior art date
Application number
PCT/CN2015/077225
Other languages
French (fr)
Chinese (zh)
Inventor
李新明
Original Assignee
李新明
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 李新明 filed Critical 李新明
Publication of WO2015161806A1 publication Critical patent/WO2015161806A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure

Definitions

  • the invention relates to the production of single-sided aluminum substrates and the fields of downlights, lamp panels and the like. Specifically, it is a production process of single-sided aluminum-based copper-clad laminates.
  • aluminum-based copper clad laminates mainly function as interconnects, insulation and support for printed circuit boards, and have very high transmission speed, energy loss and characteristic impedance of signals in the circuit.
  • the large impact, printed circuit board performance, quality, manufacturing process, manufacturing level, manufacturing cost, and long-term reliability and stability depend to a large extent on aluminum-based copper clad laminates.
  • the production process of aluminum-based copper clad laminate mainly includes the following steps: cutting, drilling, dry/wet film imaging, acid/alkaline etching, silk screen soldering, silk screen characters, cutting V-groove, processing board edge board Test, OSP finished products, and finally packaged and shipped; dry/wet film imaging is the part required to make the circuit on the sheet, including grinding plate, film, exposure and development, acid/alkaline etching is After the dry/wet film is imaged, the required portion of the line is retained, removing excess portions of the line, including etching, filming, drying, and inspection.
  • the object of the present invention is to provide a physical copper-clad production process, which is not only simple in process, convenient in processing, but also environmentally friendly, and does not affect workers and the environment.
  • a production process of a single-sided aluminum-based copper clad laminate comprising the following steps:
  • stamping The copper foil is attached to the surface of the aluminum substrate by a punching machine; pressed with a force of 5-10 kg, the temperature is 150-190 degrees Celsius, and the time is 10-20 minutes until the force of 2-5 cattle is used. Unplugging
  • the invention has the following characteristics:
  • a production process of a single-sided aluminum-based copper clad laminate according to the present invention comprises the following steps:
  • Cutting material a 1.2x2.4 meter aluminum plate is cut into semi-finished products, and the outer dimensions of the semi-finished products are determined according to different types;
  • stamping The copper foil is attached to the surface of the aluminum substrate by a punching machine; pressed with a force of 5-10 kg, the temperature is 150-190 degrees Celsius, and the time is 10-20 minutes until the force of 2-5 cattle is used. Unplugging
  • Test can be packaged and shipped: After the semi-finished products are finished, the technical parameters such as thermal conductivity, peel strength and withstand voltage can be tested without any problem, and packaged and shipped into the warehouse.
  • the present invention solves the problems of human health and environmental pollution caused by imaging, etching, etc. in the prior art by replacing the traditional chemical copper-clad method by physical copper-clad method, and has obvious progress significance, and can be widely applied. Promotion.

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

Provided is a process for producing an aluminium-based board clad with a copper foil on one side, comprising the following steps: (1) cutting; (2) boring; (3) stamping: sticking a copper foil on the surface of an aluminium-based board using a punch press; and pressing with a force of 5-10 kilograms at a temperature of 150-190 degrees Celsius for a time of 10-20 minutes until no loosening occurs under pulling using a force of 2-5 newtons; (4) cutting V-shaped grooves, and processing the edge board of the board; and (5) after testing and manufacturing same into a finished product by OSP, packaging for delivery. The process has the following features: 1. the process is simple, and convenient in processing; 2. no chemicals are applied, which is more environment-friendly; and 3. the manufacturing cost is decreased by 30%.

Description

一种单面铝基覆铜箔板的生产工艺Production process of single-sided aluminum-based copper clad laminate 技术领域Technical field
本发明涉及单面铝基板生产制造及筒灯、灯盘等领域，具体地说，它是一种单面铝基覆铜箔板的生产工艺。The invention relates to the production of single-sided aluminum substrates and the fields of downlights, lamp panels and the like. Specifically, it is a production process of single-sided aluminum-based copper-clad laminates.
背景技术Background technique
铝基覆铜箔板作为印刷电路板制造中的基板材料，对印刷电路板主要起互连导通、绝缘和支撑的作用，对电路中的信号的传输速度、能量损失和特性阻抗等有很大的影响，印刷电路板的性能、品质、制造中的加工型、制造水平、制造成本以及长期的可靠性及稳定性在很大程度上取决于铝基覆铜箔板。As a substrate material in the manufacture of printed circuit boards, aluminum-based copper clad laminates mainly function as interconnects, insulation and support for printed circuit boards, and have very high transmission speed, energy loss and characteristic impedance of signals in the circuit. The large impact, printed circuit board performance, quality, manufacturing process, manufacturing level, manufacturing cost, and long-term reliability and stability depend to a large extent on aluminum-based copper clad laminates.
目前，铝基覆铜箔板的制作过程主要包括以下步骤：开料、钻孔、干/湿膜成像、酸性/碱性蚀刻、丝印阻焊、丝印字符、切割V型槽、加工板边板，测试、OSP制成产成品，最后包装出货；其中干/湿膜成像是在板料上呈现出制作线路所需要的部分，包括磨板、贴膜、曝光以及显影，酸性/碱性蚀刻是将干/湿膜成像后保留需要的线路部分，除去线路以外多余的部分，包括蚀刻、退膜、烘干以及检板。上述工艺不仅工艺复杂，使用到的设备较多，而且由于生产过程中必须用到化学品，溶剂或液体，对工作人员身体健康及环境污染均存在不同程度的影响，显然不符合现代社会和生产对铝基覆铜箔板环保和安全生产的高要求。At present, the production process of aluminum-based copper clad laminate mainly includes the following steps: cutting, drilling, dry/wet film imaging, acid/alkaline etching, silk screen soldering, silk screen characters, cutting V-groove, processing board edge board Test, OSP finished products, and finally packaged and shipped; dry/wet film imaging is the part required to make the circuit on the sheet, including grinding plate, film, exposure and development, acid/alkaline etching is After the dry/wet film is imaged, the required portion of the line is retained, removing excess portions of the line, including etching, filming, drying, and inspection. The above process is not only complicated in process, but also uses a lot of equipment, and because chemicals, solvents or liquids must be used in the production process, it has different degrees of influence on the health and environmental pollution of the workers, which obviously does not conform to modern society and production. High requirements for environmentally friendly and safe production of aluminum-based copper clad laminates.
因此，现有技术有待于改进和提高。Therefore, the prior art needs to be improved and improved.
发明内容Summary of the invention
针对现有技术中存在的不足之处，本发明的目的是提供一种物理覆铜的生产工艺，不仅工艺简单、加工方便，而且环保，不会对工作人员和环境造成影响。In view of the deficiencies in the prior art, the object of the present invention is to provide a physical copper-clad production process, which is not only simple in process, convenient in processing, but also environmentally friendly, and does not affect workers and the environment.
为实现上述目的，本发明所采用的技术方案是：In order to achieve the above object, the technical solution adopted by the present invention is:
一种单面铝基覆铜箔板的生产工艺，包括以下步骤：A production process of a single-sided aluminum-based copper clad laminate, comprising the following steps:
(1)开料；(1) cutting material;
(2)钻孔；(2) drilling;
(3)冲压：利用冲床将铜箔贴于铝基板的表面；以5-10公斤的力压着，温度为150-190摄氏度，时间为10-20分钟，直至使用2-5牛的力拉拔不松脱；(3) Stamping: The copper foil is attached to the surface of the aluminum substrate by a punching machine; pressed with a force of 5-10 kg, the temperature is 150-190 degrees Celsius, and the time is 10-20 minutes until the force of 2-5 cattle is used. Unplugging
(4)切割V型槽、加工板边板； (4) Cutting the V-shaped groove and processing the edge plate;
(5)测试，OSP制成成品后，即可包装出货。(5) Test, after the OSP is finished, it can be packaged and shipped.
与现有技术相比，本发明具有以下特点：Compared with the prior art, the invention has the following characteristics:
1、工艺简单，加工方便；1. Simple process and convenient processing;
2、不适用化学药品，更环保；2, not applicable to chemicals, more environmentally friendly;
3、制造成本降低30％。3. Manufacturing costs are reduced by 30%.
具体实施方式detailed description
下面给出实施例对本发明作进一步的详细说明：The present invention will be further described in detail below by way of examples:
实施例：本发明一种单面铝基覆铜箔板的生产工艺，包括以下步骤：Embodiment: A production process of a single-sided aluminum-based copper clad laminate according to the present invention comprises the following steps:
(1)开料：把一张1.2x2.4米的铝板剪切成半成品，半成品的外形尺寸依不同类型而定；(1) Cutting material: a 1.2x2.4 meter aluminum plate is cut into semi-finished products, and the outer dimensions of the semi-finished products are determined according to different types;
(2)钻孔：在半成品上钻些定位工艺孔，孔径视各种产品类型而定)；(2) Drilling: drilling some positioning process holes on the semi-finished products, the aperture is determined by various product types);
(3)冲压：利用冲床将铜箔贴于铝基板的表面；以5-10公斤的力压着，温度为150-190摄氏度，时间为10-20分钟，直至使用2-5牛的力拉拔不松脱；(3) Stamping: The copper foil is attached to the surface of the aluminum substrate by a punching machine; pressed with a force of 5-10 kg, the temperature is 150-190 degrees Celsius, and the time is 10-20 minutes until the force of 2-5 cattle is used. Unplugging
(4)切割V型槽、加工板边板：在半成品上切割V型槽，槽尺寸视各种产品类型而定，利于边料分离；(4) Cutting the V-groove and processing the edge plate: cutting the V-groove on the semi-finished product, the groove size depends on various product types, which is beneficial to the separation of the edge material;
(5)测试，即可包装出货：半成品做好后经检测如导热系数、剥离强度、耐电压等技术参数无问题后即可，经包装好入库出货。(5) Test, can be packaged and shipped: After the semi-finished products are finished, the technical parameters such as thermal conductivity, peel strength and withstand voltage can be tested without any problem, and packaged and shipped into the warehouse.
综上，本发明通过物理覆铜方式替代传统的化学覆铜方式，解决了现有工艺中采用成像、蚀刻等方式存在的对人体健康和环境污染的问题，具有明显的进步意义，可广泛加以推广。In summary, the present invention solves the problems of human health and environmental pollution caused by imaging, etching, etc. in the prior art by replacing the traditional chemical copper-clad method by physical copper-clad method, and has obvious progress significance, and can be widely applied. Promotion.
以上所述，仅是本发明的较佳实施例而已，并非对本发明的技术范围作任何限制，凡是依据本发明的技术实质对上面实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术的范围内。 The above is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention. Any minor modifications, equivalent changes, and modifications made to the above embodiments in accordance with the technical spirit of the present invention are still Within the scope of the present technology.

Claims (1)

  1. 一种单面铝基覆铜箔板的生产工艺，其特征在于，包括以下步骤：The invention relates to a production process of a single-sided aluminum-based copper-clad board, which comprises the following steps:
    (1)开料；(1) cutting material;
    (2)钻孔；(2) drilling;
    (3)冲压：利用冲床将铜箔贴于铝基板的表面；以5-10公斤的力压着，温度为150-190摄氏度，时间为10-20分钟，直至使用2-5牛的力拉拔不松脱；(3) Stamping: The copper foil is attached to the surface of the aluminum substrate by a punching machine; pressed with a force of 5-10 kg, the temperature is 150-190 degrees Celsius, and the time is 10-20 minutes until the force of 2-5 cattle is used. Unplugging
    (4)切割V型槽、加工板边板；(4) Cutting the V-shaped groove and processing the edge plate;
    (5)测试，OSP制成成品后，即可包装出货。 (5) Test, after the OSP is finished, it can be packaged and shipped.
PCT/CN2015/077225 2014-04-23 2015-04-22 Process for producing aluminium-based board clad with copper foil on one side WO2015161806A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410166494.0 2014-04-23
CN201410166494.0A CN103991268A (en) 2014-04-23 2014-04-23 Production technology of single-sided aluminum base copper-clad plate

Publications (1)

Publication Number Publication Date
WO2015161806A1 true WO2015161806A1 (en) 2015-10-29

Family

ID=51305720

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/077225 WO2015161806A1 (en) 2014-04-23 2015-04-22 Process for producing aluminium-based board clad with copper foil on one side

Country Status (2)

Country Link
CN (1) CN103991268A (en)
WO (1) WO2015161806A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103991268A (en) * 2014-04-23 2014-08-20 李新明 Production technology of single-sided aluminum base copper-clad plate
CN104968154A (en) * 2015-05-06 2015-10-07 刘地发 Automatic production line of LED aluminum substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1833290A1 (en) * 2004-12-03 2007-09-12 Hallys Corporation Electronic component production method and electronic component production equipment
CN102437270A (en) * 2011-12-09 2012-05-02 陕西科技大学 Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof
CN102781170A (en) * 2012-07-24 2012-11-14 中山市达进电子有限公司 Method for preparing mirror-surface aluminum substrate
CN102802348A (en) * 2012-07-17 2012-11-28 昆山生隆科技发展有限公司 High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board
CN103991268A (en) * 2014-04-23 2014-08-20 李新明 Production technology of single-sided aluminum base copper-clad plate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448684A (en) * 1987-08-17 1989-02-23 Showa Aluminum Corp Production of aluminum-copper laminating material
CN102791080A (en) * 2012-08-23 2012-11-21 北京凯迪思电路板有限公司 Method for manufacturing ultrathin copper foil in circuit board manufacturer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1833290A1 (en) * 2004-12-03 2007-09-12 Hallys Corporation Electronic component production method and electronic component production equipment
CN102437270A (en) * 2011-12-09 2012-05-02 陕西科技大学 Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof
CN102802348A (en) * 2012-07-17 2012-11-28 昆山生隆科技发展有限公司 High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board
CN102781170A (en) * 2012-07-24 2012-11-14 中山市达进电子有限公司 Method for preparing mirror-surface aluminum substrate
CN103991268A (en) * 2014-04-23 2014-08-20 李新明 Production technology of single-sided aluminum base copper-clad plate

Also Published As

Publication number Publication date
CN103991268A (en) 2014-08-20

Similar Documents

Publication Publication Date Title
CN103179790B (en) Mixed pressing printed circuit board and preparation method thereof
CN104363704B (en) A kind of thick hole copper PCB preparation method
CN104717846A (en) Method for manufacturing metallization groove holes in PCB
CN104540338B (en) High Aligning degree HDI production methods
CN104333979A (en) Method of carrying out secondary hole drilling in multi-layer board
CN201383900Y (en) Blind hole type circuit board
WO2015161806A1 (en) Process for producing aluminium-based board clad with copper foil on one side
CN203357536U (en) PCB drilling device
CN104378931A (en) Method for manufacturing metallized counterbore in PCB
CN203691754U (en) Combined and jointed board based on various kinds of samples
CN108712819B (en) Printed circuit board scrapping method
CN105163523A (en) Super-thick copper etching technique for PCB
CN105246254B (en) A method of making PTH platforms on PCB
CN110944452A (en) Impedance control method for high-performance fine line flexible circuit board
CN207266381U (en) A kind of wiring board PP vacuum pressing-combinings consent structure
US9107311B2 (en) Method for manufacturing printed circuit board
CN106793581B (en) Multilayer N+N folds structure circuit board pressing localization method
CN105636363B (en) Multi-layer PCB core material brown film crashing
CN104470239A (en) Method for ameliorating lateral erosion of flexible hollowed-out circuit board
CN106102352B (en) A method of solving non-symmetrical line slab warping
CN104768336B (en) A kind of interlayer interconnection process
CN207625877U (en) A kind of inclined inspection structure of golden finger erosion control
CN106455339B (en) A kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield
CN204166509U (en) The contact panel that Flim functional sheet is integrated with flexible circuit board
CN106612609B (en) Light thin black conductive adhesive film

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15783405

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15783405

Country of ref document: EP

Kind code of ref document: A1