JPS6448684A - Production of aluminum-copper laminating material - Google Patents
Production of aluminum-copper laminating materialInfo
- Publication number
- JPS6448684A JPS6448684A JP20454587A JP20454587A JPS6448684A JP S6448684 A JPS6448684 A JP S6448684A JP 20454587 A JP20454587 A JP 20454587A JP 20454587 A JP20454587 A JP 20454587A JP S6448684 A JPS6448684 A JP S6448684A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- copper
- aluminum
- cold rolling
- laminating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Abstract
PURPOSE:To easily peel aluminum and copper foils and to obtain the laminating material not peeled off in case of piercing, etc., by superposing aluminum and copper foils and cladding the both by executing cold rolling at the specified rolling reduction rate. CONSTITUTION:An Al foil and copper foil are facilitated and the one face of the Al foil is subjected to rough facing by a nylon made wire brush. The Al and copper foils are then superposed so that the rough face of the Al foil comes to the copper foil side and the both are clad with cold rolling at 40-60% reduction of area by a cold rolling mill. The scratch onto the copper foil 2 can surely be prevented at the forming time of a through hole 3 and in case of peeling the Al foil thereafter it can be simply peeled off and the working can be simplified.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20454587A JPS6448684A (en) | 1987-08-17 | 1987-08-17 | Production of aluminum-copper laminating material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20454587A JPS6448684A (en) | 1987-08-17 | 1987-08-17 | Production of aluminum-copper laminating material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448684A true JPS6448684A (en) | 1989-02-23 |
Family
ID=16492289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20454587A Pending JPS6448684A (en) | 1987-08-17 | 1987-08-17 | Production of aluminum-copper laminating material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448684A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03231839A (en) * | 1990-02-07 | 1991-10-15 | Sumitomo Special Metals Co Ltd | Copper-based lead frame material |
KR100489680B1 (en) * | 2002-08-30 | 2005-05-17 | 재단법인 포항산업과학연구원 | Method for cladding copper plate on aluminum plate |
JP2008006496A (en) * | 2006-05-30 | 2008-01-17 | Neomax Material:Kk | Composite metal plate and method for producing the same |
CN103991268A (en) * | 2014-04-23 | 2014-08-20 | 李新明 | Production technology of single-sided aluminum base copper-clad plate |
CN104057220A (en) * | 2014-06-27 | 2014-09-24 | 江苏协昌电子科技有限公司 | PCB (Printed Circuit Board) copper bar leg punching device of electric vehicle controller |
CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
-
1987
- 1987-08-17 JP JP20454587A patent/JPS6448684A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03231839A (en) * | 1990-02-07 | 1991-10-15 | Sumitomo Special Metals Co Ltd | Copper-based lead frame material |
KR100489680B1 (en) * | 2002-08-30 | 2005-05-17 | 재단법인 포항산업과학연구원 | Method for cladding copper plate on aluminum plate |
JP2008006496A (en) * | 2006-05-30 | 2008-01-17 | Neomax Material:Kk | Composite metal plate and method for producing the same |
CN103991268A (en) * | 2014-04-23 | 2014-08-20 | 李新明 | Production technology of single-sided aluminum base copper-clad plate |
CN104057220A (en) * | 2014-06-27 | 2014-09-24 | 江苏协昌电子科技有限公司 | PCB (Printed Circuit Board) copper bar leg punching device of electric vehicle controller |
CN104057220B (en) * | 2014-06-27 | 2016-02-17 | 江苏协昌电子科技有限公司 | A kind of controller for electric vehicle pcb board copper bar rushes foot device |
CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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