WO2015151913A1 - 放熱ユニット、ｌｅｄ照明装置およびその製造方法 - Google Patents

放熱ユニット、ｌｅｄ照明装置およびその製造方法 Download PDF

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Publication number
WO2015151913A1
WO2015151913A1 PCT/JP2015/058811 JP2015058811W WO2015151913A1 WO 2015151913 A1 WO2015151913 A1 WO 2015151913A1 JP 2015058811 W JP2015058811 W JP 2015058811W WO 2015151913 A1 WO2015151913 A1 WO 2015151913A1
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WIPO (PCT)
Prior art keywords
heat
plate
heat dissipation
members
dissipation unit
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PCT/JP2015/058811
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English (en)
French (fr)
Japanese (ja)
Inventor
隆彦 南部
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株式会社ナベル
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Publication of WO2015151913A1 publication Critical patent/WO2015151913A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Definitions

  • the present invention relates to a heat radiating unit to which a heat source is attached and a method for manufacturing the same, and more particularly to a heat radiating unit using a vapor chamber and a method for manufacturing the same.
  • Electronic components such as semiconductor integrated circuits, LED elements, and power devices generate heat due to the current flowing inside, and become heat sources.
  • the heat generated from the electronic component adversely affects other components and the casing, resulting in problems such as deterioration of the performance of the device using the electronic component.
  • heat radiating unit to which the electronic component is attached, heat from the electronic component is diffused by heat conduction, and is dissipated to the atmosphere.
  • heat dissipation unit various shapes, structures, and the like have been proposed in order to increase the efficiency of heat dissipation.
  • a vapor chamber having a cooling effect by vaporization and condensation of the enclosed heat medium in the heat dissipation unit.
  • the heat medium sealed inside moves away from the heat source when vaporized.
  • the vaporized heat medium is cooled and condensed by heat radiation, and the condensed heat medium recirculates again.
  • the vapor chamber cools the heat source using heat conduction caused by repeated vaporization and condensation.
  • the heat radiating unit includes a first vapor chamber (first heat pipe) to which a heat source is attached, and a plurality of second vapor chambers standing on the surface of the first vapor chamber and acting as heat radiating fins.
  • first and second vapor chambers has a continuous vapor diffusion path and a capillary channel, and conducts heat with a common heat medium.
  • the heat medium continuously moves in the first and second heat pipes through the vapor diffusion path and the capillary flow path, and efficiently conducts heat. Therefore, in this heat radiating unit, the heat from the first vapor chamber to which the heat source is attached is efficiently transmitted to the plurality of second vapor chambers acting as the radiating fins, and the heat transfer from the heat source to the radiating fins is increased. As a result, the heat dissipation efficiency is increased.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a heat dissipation unit having a simple structure and high heat dissipation.
  • the heat radiating unit according to the present invention includes a plurality of at least one type of plate-like members formed in a hollow structure having a heat medium so as to be excellent in heat conduction, and the plurality of plate-like members are laminated.
  • the plate member having a hollow structure constituting the heat dissipating unit is excellent in mass productivity, and the process of laminating the plate members is simple. Therefore, the heat radiating unit formed by laminating the plate-like members is very easy to manufacture and excellent in mass productivity. Further, since the plate-like member is formed in a hollow structure having a heat medium, the plate-like member is excellent in heat conduction, and the heat radiating unit composed of this plate-like member has high heat conductivity and consequently high heat dissipation. Have sex. That is, the heat dissipation unit according to the present invention has an excellent heat dissipation property with a simple structure.
  • a heat dissipation unit including a plurality of plate-like members excellent in heat conduction is manufactured.
  • This manufacturing method includes laminating the plate-like members, forming a laminating parallel surface substantially parallel to the laminating direction, and connecting a heat source to the laminating parallel surface.
  • the heat dissipation unit can be manufactured by a simple method of stacking a plurality of hollow plate members. Since this heat radiating unit includes a stacked parallel surface to which a heat source is connected in a direction substantially horizontal to the stacking direction, the heat source is connected to a part of each plate-like member.
  • each plate member Since each plate member is excellent in heat conduction, it efficiently conducts and dissipates heat from the connected heat source. Therefore, the manufacturing method of the heat radiating unit has a very high heat radiating property although it is a very simple method of laminating easily manufactured plate-like members. Therefore, the manufacturing method of the heat radiating unit according to the present invention can provide a heat radiating unit having high heat radiating property by a simple process.
  • the present invention provides a heat dissipation unit with a simple structure and high heat dissipation.
  • the heat dissipation unit 100 is connected to a heat source (not shown), receives a heat from the heat source, and receives heat from the heat source. And a heat dissipating part 103 that dissipates heat.
  • the heat dissipating unit 103 receives heat from the heat receiving unit 102 by heat conduction, and dissipates heat from a portion in contact with the atmosphere.
  • the heat radiating unit 100 includes one type of plate-like member 10 (see FIG. 3), and is formed by laminating a plurality of one type of plate-like member 10.
  • the plate-like member 10 includes a plurality of grooves C penetrating in the plate thickness direction (stacking direction), and includes a front surface 11, a rear surface 12, a front surface 11, and a side surface 13 that connects the rear surface 12. . Therefore, the front surface 11 and the rear surface 12 have a shape having a plurality of grooves.
  • Each plate-like member 10 is formed in a hollow structure, has a heat medium therein, conducts heat by movement of the heat medium and changes in the state of vaporization and liquefaction, and is a so-called vapor chamber excellent in heat conductivity. It is.
  • the plate-like vapor chamber is manufactured by a conventionally well-known technique.
  • the plate-like member 10 is formed in a comb-teeth shape having a comb-teeth portion in which a plurality of rod-like portions are juxtaposed. That is, the plate-like member 10 includes a first extending portion L1 extending in the first direction and a first portion orthogonal to the first direction so as to stand upright on the first extending portion L1. And a plurality of second extending portions L2 extending in the two directions. Therefore, the 2nd extension part L2 forms a comb-tooth part, and the 1st extension part L1 forms the rod-shaped main-body part which integrates a some comb tooth. Therefore, the groove
  • the plate-like member 10 is laminated in the thickness direction of the plate-like member 10 by adhering the adjacent front surface 11 and rear surface 12 together.
  • the plurality of laminated plate-like members 10 are a front surface 11 of one plate-like member 10 located at both ends of the heat dissipation unit 100 in the lamination direction, a rear surface 12 of the other plate-like member 10, and all the plate-like members 10. The side surface 13 of this is exposed.
  • each plate-like member 10 has an independent heat medium moving path, and the adjacent plate-like members 10 are simply laminated and laminated, so that the inside of the hollow structure of the adjacent plate-like members 10 The heating medium path is not continuous.
  • the front surface 11 and the rear surface 12 of the plate-like member 10 are formed flat by means such as etching, polishing, and surface treatment, which are well known in the art, and are bonded together so as to be in close contact with each other. Moreover, the heat conductive grease is apply
  • the bottom surface 104 is a stacking parallel surface parallel to the stacking direction, and has a mounting region 105 to which a heat source can be mounted.
  • the heat dissipating part 103 has a concavo-convex structure in which a plurality of comb-like plate-like members 10 are overlapped so that the walls facing the first direction stand vertically.
  • the side surface 13 constituting the heat radiating part 103 dissipates heat from the heat source. That is, the heat dissipation unit 100 mainly dissipates heat from the groove C of each plate member 10.
  • the plate-like member 10 is formed with a groove C penetrating in the thickness direction and dissipates heat from the groove C, but penetrates in the thickness direction instead of or together with the groove C.
  • a hole may be formed so that heat is dissipated from the hole.
  • heat from the heat source is received from the side surface 13 that forms the heat receiving portion 102, and the heat radiating portion 103 is formed by heat conduction of the internal heat transfer medium. It is transmitted to the side surface 13 and diffused into the atmosphere. That is, the one plate-like member 10 that forms a part of the laminated parallel surface having the attachment region 105 conducts heat in a direction perpendicular to the laminated parallel surface (extending direction of the second extending portion L2).
  • the heat medium is formed in a hollow structure having a movable path. Thereby, each one plate-shaped member 10 receives heat, transfers heat, and dissipates heat without passing through a thermal interface. Therefore, even if there is no heat transfer between the adjacent plate-like members 10, a heat radiating unit having excellent heat radiating properties is provided.
  • heat from the heat source is directly radiated, but in the other plate-like member 10, heat from the heat source is radiated through contact thermal resistance.
  • the adjacent plate-shaped member 10 is provided with the front surface 11 and the rear surface 12 of the same shape, a contact surface is large and the thermal resistance by contact is comparatively small. Therefore, the heat dissipation of the heat dissipation unit varies depending on the shape and size of the plate-like member 10, particularly the shape and size of the groove C. Therefore, the shape, size, and the like of the plate member are appropriately changed in consideration of heat dissipation.
  • the heat dissipation unit is manufactured by laminating plate-like members excellent in heat conduction, forming a laminating parallel surface substantially parallel to the laminating direction, and connecting a heat source to the laminating parallel surface. That is, the front surface and the rear surface of the same shape of one kind of plate-shaped member are brought into contact with each other, and a part of the side surface connecting the front surface and the rear surface of the plurality of contacted plate-shaped members is formed as the attachment region 105 to which the heat source is attached. It is manufactured by.
  • the bottom surface 104 including the attachment region 105 is formed by laminating a plurality of plate-like members 10 on the side surface 13 of the plate-like member 10 forming the bottom surface 104 such as etching such as chemical etching, electrolytic polishing, and physical polishing. It is formed on a flat surface by polishing or the like.
  • the heat radiation unit 100 is manufactured by manufacturing a large number of plate-shaped members having the same shape and stacking them, the manufacturing cost of the plate-shaped members is reduced and the stacking process is easy.
  • the plurality of plate-like members 10 of the heat dissipation unit 100 can be fixed in a stacked state by various means. For example, you may fix in the state laminated
  • the heat dissipation unit 200 is provided with a heat source, a heat receiving unit 202 that receives heat from the heat source, and heat dissipation that dissipates heat generated from the heat source.
  • Unit 203 The heat radiating unit 203 receives heat from the heat receiving unit 202 by heat conduction, and dissipates heat from a surface dew portion in contact with the atmosphere.
  • the heat dissipation unit 200 according to the present embodiment includes a first type plate-like member 10 (see FIG. 3) and a second type plate-like member 20 (see FIG. 6), and includes a plurality of first and second types.
  • the plate-like members 10 and 20 are alternately laminated.
  • the first type of plate-like member 10 is the plate-like member 10 described in the first embodiment.
  • the second type plate-like member 20 includes a front surface 21, a rear surface 22, a front surface 21, and a side surface 23 that connects the rear surface 22. Similar to the plate-like member 10, the second type of plate-like member 20 is formed in a hollow structure, has a heat medium therein, and conducts heat by movement of the heat medium and change of state of vaporization and liquefaction. It is a so-called vapor chamber (or heat pipe) excellent in thermal conductivity.
  • the second type of plate-like member 20 includes a third extending portion L3 extending in one direction.
  • the third extending portion L3 has a front surface and a rear surface having the same shape as the front surface and the rear surface of the first extending portion L1.
  • the rear surface 22 (of the third extending portion L3) of the member 20 and the front surface 11 of the first extending portion L1 of the first type plate member 10 are bonded to each other.
  • the 2nd extension part L2 of the 1st type plate-shaped member 10 forms the thermal radiation part 203, the 1st extension part L1 of the 1st type plate-shaped member 10, and a 2nd type plate-shaped member.
  • 20 (the third extending portion L3) forms a heat receiving portion 202.
  • the front surface 11 and the rear surface 12 of the ten second extending portions L2 and the side surfaces 13 of all the plate-like members 10 are exposed. That is, by laminating different plate-like members, in addition to the side surfaces of each plate-like member, the front and rear portions of the plate-like member that are not bonded are exposed.
  • the first and second types of plate-like members 10 and 20 have independent heat transfer paths, and the adjacent plate-like members 10 and 20 are simply laminated and laminated, The path of the heat medium inside the hollow structure of the adjacent plate members 10 and 20 is not continuous.
  • the front surfaces 11 and 21 and the rear surfaces 12 and 22 of the first and second types of plate-like members 10 and 20 are formed flat by means such as etching, polishing, and surface treatment that are well known in the art, and are in close contact with each other. Touch.
  • the contact portions of the first and second types of plate-like members 10 and 20 are coated with heat conductive grease to improve the adhesion between the surfaces. Thereby, the contact thermal resistance of the front surface 21 and the rear surface 12, and the front surface 11 and the rear surface 22 is reduced.
  • each front surface and each rear surface may be in contact so that the plate-like members 10 and 20 are laminated.
  • a part of the side surfaces 13 and 23 of the plurality of first and second types of plate-like members 10 and 20 jointly forms a bottom surface 204.
  • the bottom surface 204 is a stacking parallel surface parallel to the stacking direction, and has a mounting region 205 to which a heat source can be mounted.
  • the heat dissipating part 203 has a concavo-convex structure in which the opposing pillars stand vertically by stacking the second type plate member 20 on the plurality of first type plate members 10 having a comb shape.
  • the front surface 11, the rear surface 12, and the side surface 13 of the first extending portion L1 of the first type plate-like member 10 forming the heat radiation portion 203 dissipate heat from the heat source.
  • the first type plate-like member 10 that forms a part of the attachment region 205 heat from the heat source is received from the first extending portion L1 that forms the heat receiving portion 202, and is radiated by the internal heat medium. It is transmitted to the second extending portion L2 forming the portion 203 and is diffused to the atmosphere. That is, the one plate-like member 10 that forms a part of the laminated parallel surface having the attachment region 205 conducts heat in a direction perpendicular to the laminated parallel surface (extending direction of the second extending portion L2).
  • the heat medium is formed in a hollow structure having a movable path. Thereby, each one plate-shaped member 10 receives heat, transfers heat, and dissipates heat without passing through a thermal interface. Therefore, even if the thermal interface resistance between adjacent plate-like members 20 is high, a heat dissipation unit having excellent heat dissipation is provided.
  • the plate-like member 10 is formed with a plurality of grooves C penetrating in the thickness direction and dissipates heat from the grooves C, but instead of the grooves C or together with the grooves C, A plurality of through holes may be formed so that heat is dissipated from the holes.
  • the first type plate-like member 10 and the second type plate that form the attachment region are heated by the heat from the heat source. Is transmitted from the shaped member 20 to the second extending portion L2 forming the heat radiating portion 203 through the heat conduction of the internal heat transfer medium through the contact surface superimposed on the other first type plate-like member 10. Dissipated into the atmosphere.
  • heat from the heat source is directly radiated, but in the other first type plate-like member 20, heat from the heat source is the heat of the plate-like members 10, 20. Heat is dissipated through the interface.
  • the heat dissipation unit 200 according to the second embodiment has a smaller contact surface than the heat dissipation unit 100 according to the first embodiment, the thermal resistance of the thermal interface increases and the heat conduction deteriorates.
  • the heat radiating part 203 has a large surface area and good heat dissipation.
  • the heat dissipation unit is manufactured by laminating plate-like members excellent in heat conduction, forming a laminating parallel surface substantially parallel to the laminating direction, and connecting a heat source to the laminating parallel surface. That is, the heat radiating unit 200 is configured to bring the front surfaces and rear surfaces of the two types of first and second types of plate-shaped members into contact with each other and to connect the front surfaces and the rear surfaces of the plurality of stacked plate-shaped members. It is manufactured by forming a part as a mounting area to which the heat source is attached. By laminating two kinds of plate-like members, portions where the shapes of the front and rear surfaces of these plate-like members are different are exposed.
  • the bottom surface 204 including the attachment region 205 is formed by laminating a plurality of plate-like members 10 and 20, and side surfaces 13 and 23 of the plate-like members 10 and 20 forming the bottom surface are etched like chemical etching, electropolishing, It is formed on a flat surface by polishing such as physical polishing.
  • the heat radiation unit 200 is manufactured by manufacturing a large amount of two types of plate members and stacking them, the manufacturing cost of the plate members is reduced and the stacking process is facilitated.
  • the plurality of first-type and second-type plate-like members 10 and 20 of the heat dissipation unit 200 can be fixed in a stacked state by various means. For example, you may fix in the state laminated
  • the heat dissipation unit 300 is provided with a heat source, a heat receiving unit 302 that receives heat from the heat source, and a heat dissipation unit 303 that radiates heat generated from the heat source. Is provided.
  • the heat dissipating unit 303 receives heat from the heat receiving unit 302 by heat conduction, and dissipates heat from a portion in contact with the atmosphere.
  • the heat dissipation unit 300 according to the present embodiment includes a third type of plate-like member 30 (see FIG. 8) and a fourth type of plate-like member 40 (see FIG. 9), and includes a plurality of third and fourth sheets. It is formed by alternately laminating plate members 30 and 40 of various types.
  • the third type of plate-like member 30 extends in the second direction from the fourth extending portion L4 extending in the first direction and the fourth extending portion L4. And a fifth extending portion L5 in the shape of a battledore.
  • the third type plate-shaped member 30 has a front surface 31, a rear surface 32, and a side surface 33 that connects the front surface 31 and the rear surface 32.
  • the third type plate-like member 30 is formed in a hollow structure, has a heat medium therein, conducts heat by movement of the heat medium and changes in the state of vaporization and liquefaction, and has excellent heat conductivity. It is a so-called vapor chamber (or heat pipe) having conductivity.
  • the fourth type of plate-like member 40 extends in the second direction from the sixth extension L6 extending in the first direction and the sixth extension L6. And is formed in a T-shape.
  • the fourth type plate-like member 40 has a front surface 41, a rear surface 42, and a side surface 43 that connects the front surface 41 and the rear surface 42.
  • the fourth type plate-like member 40 is formed in a hollow structure, has a heat medium therein, conducts heat by movement of the heat medium and changes in the state of vaporization and liquefaction, and has excellent heat conductivity. It is a so-called vapor chamber (or heat pipe) having conductivity.
  • the fourth extending portion L4 of the third type plate member 30 and the sixth extending portion L6 of the fourth type plate member 40 have substantially the same shape.
  • the front surface 31 of the fourth extending portion L4 and the rear surface 42 of the sixth extending portion L6 of the fourth type plate-like member 40 are bonded together to form a heat receiving portion 304.
  • the front surface 31 of the fifth extending portion L5 of the member 30 and the rear surface 42 of the seventh extending portion L7 of the fourth type plate-like member 40 are in contact with each other, and a heat radiating portion 303 is formed.
  • the fifth extending portion L5 of the third type plate-like member 30 has a front surface 31 that is not in contact with the seventh extended portion L7 of the fourth type plate-like member 40, a part of the rear surface 32, and a side surface 33. To dissipate heat.
  • the portion that is not in contact with the fourth type plate-like member 40 and the side surface 33 are exposed. That is, by laminating different plate-like members, in addition to the side surfaces of each plate-like member, the front and rear portions of the plate-like member that are not bonded are exposed.
  • the third and fourth types of plate-like members 30 and 40 have independent heat medium moving paths, and the adjacent plate-like members 10 and 20 are simply laminated and laminated, The path of the heat medium inside the hollow structure is not continuous.
  • the front surfaces 31 and 41 and the rear surfaces 32 and 42 of the third and fourth types of plate-like members 30 and 40 are formed flat by means such as etching, polishing, and surface treatment that are well known in the art, and are in close contact with each other. Are superimposed.
  • the contact portions of the third and fourth types of plate-like members 30 and 40 are coated with heat conductive grease to improve the adhesion between the surfaces. Thereby, the contact thermal resistance of the front surface 31, the rear surface 42, and the front surface 41 and the rear surface 32 is reduced.
  • each front surface and each rear surface may be in contact so that the plate-like members 30 and 40 are laminated.
  • a part of the side surfaces 33 and 43 of the plurality of third and fourth types of plate-like members 30 and 40 form a bottom surface 304 together.
  • the bottom surface 304 has an attachment area (not shown) to which a heat source is attached.
  • a fourth type of plate-like member 40 is superimposed on a plurality of third-type plate-like members 30 of a fand plate shape, so that the fifth plate-like fifth extension facing the stacking direction of the heat dissipation units.
  • a concave-convex structure is formed such that the existing portion L5 stands vertically, and the front surface 31, the rear surface 32, and the side surface 33 of the fifth extending portion L5 of the third type plate-like member 30 dissipate heat from the heat source.
  • the heat radiating portion is formed by heat conduction of the internal heat transfer medium. It is transmitted to the front surface 31, the rear surface 32, and the side surface 33 that form 303, and is diffused to the atmosphere. That is, the one plate-like member 30 that forms a part of the laminated parallel surface having the attachment region 305 conducts heat in a direction perpendicular to the laminated parallel surface (extending direction of the fifth extending portion L5).
  • the heat medium is formed in a hollow structure having a movable path.
  • each one plate-shaped member 30 receives heat, transfers heat, and dissipates heat without passing through the thermal interface. Therefore, even if the heat radiation of the adjacent plate-like members 40 is small, a heat radiating unit excellent in heat dissipation is provided.
  • the heat from the heat source is the third type plate-like member 30 that forms the attachment region 305 and the fourth type member. It is transmitted through the contact surface superimposed on the plate-like member 40, is transmitted to the side surface 33 forming the heat radiation portion 303 by heat conduction of the internal heat transfer medium, and is dissipated to the atmosphere.
  • heat from the heat source is directly radiated, but in the other third type plate-like member 30, heat from the heat source is radiated through the contact thermal resistance.
  • the plate-like member 30 has a fifth extending portion L5 formed in the shape of a battledore, but the fifth extending portion has a groove penetrating in the thickness direction or at least one. Two holes may be formed. By providing grooves and holes, the surface dew increases, so the heat dissipation of the heat dissipation unit can be increased.
  • the heat dissipation unit is manufactured by laminating plate-like members excellent in heat conduction, forming a laminating parallel surface substantially parallel to the laminating direction, and connecting a heat source to the laminating parallel surface. That is, the heat radiating unit 300 is configured to bring the front surface and the rear surface of the two types of third and fourth types of plate-shaped members into contact with each other, and to connect the front surface and the rear surface of the plurality of stacked plate-shaped members. It is manufactured by forming a part as a mounting area to which the heat source is attached. By laminating two kinds of plate-like members, portions where the shapes of the front and rear surfaces of these plate-like members are different are exposed.
  • the bottom surface 304 including the attachment region is formed by stacking a plurality of plate-like members 30 and 40, and then etching the side surfaces 33 and 43 of the plate-like members 30 and 40 forming the bottom surface 304 by etching such as chemical etching or electropolishing. It is formed on a flat surface by polishing such as physical polishing.
  • the heat dissipation unit 300 is manufactured by manufacturing a large amount of two types of plate-like members and stacking them, the manufacturing cost of the plate-like members is reduced and the stacking process is facilitated.
  • the plurality of third-type and fourth-type plate-like members 30 and 40 of the heat dissipation unit 300 can be fixed in a stacked state by various means. For example, you may fix in the state laminated
  • the heat dissipation unit 400 is provided with a heat source, a heat receiving unit 402 that receives heat from the heat source, and a heat dissipating unit 403 that dissipates heat generated from the heat source. Is provided.
  • the heat dissipating unit 403 receives heat from the heat receiving unit 402 by heat conduction, and dissipates heat from a portion in contact with the atmosphere.
  • the heat radiating unit 400 according to the present embodiment is composed of the third and fourth types of plate-like members 30 and 40 (see FIGS. 8 and 9), similarly to the heat radiating unit 300 according to the third embodiment.
  • a plurality of plate-like members 30 and 40 are alternately laminated.
  • the heat radiating unit 400 according to the present embodiment is different from the heat radiating unit 300 of the third embodiment in that the heat receiving portion 402 is not formed by stacking the plate-like members 30 and 40. That is, the heat radiation part 403 is formed by laminating the plate-like members 30 and 40, and the heat receiving part 402 is formed separately from this.
  • the heat receiving portion 402 is connected to the front surface 31 of the third type plate member 30 on one end side in the stacking direction via the heat transfer member 406.
  • the shape of the heat transfer member 406 may be changed so that the heat transfer member 406 penetrates the third and fourth types of plate-like members in the stacking direction.
  • the attachment region is appropriately changed depending on the shape of the heat source, the attachment method, and the like.
  • stacking parallel surface should just be substantially parallel to the lamination direction.
  • the heat radiating unit should just be provided with the at least 1 type of plate-shaped member, and may be comprised by laminating
  • the heat radiating unit according to the embodiment of the present invention can be used as various heat radiating units such as a heat radiating unit for LED lighting and a heat radiating unit for electronic parts.
  • the heat source need only be connected to the attachment region and can transfer heat to the heat dissipation unit, and may be attached directly or indirectly via an interposer or the like.
  • the present invention can be used for heat dissipation from a heat source.
  • First-type plate-like member 11 Front surface (first-type plate-like member) 12 Rear surface (first type plate member) 13 Side (first type plate-like member) 20 Second type plate-like member 21 Front surface (second type plate-like member) 22 Rear surface (second-type plate member) 23 Side (2nd type plate-like member) 30 3rd type plate-shaped member 31 Front surface (3rd type plate-shaped member) 32 Rear surface (third type of plate-like member) 33 Front (3rd type plate-like member) 40 4th type plate-like member 41 Front side (4th type plate-like member) 42 Rear surface (fourth type plate-like member) 43 Side (fourth kind of plate-like member) 100 Heat dissipation unit (first embodiment) 102 Heat receiving portion (first embodiment) 103 Heat Dissipation Part (First Embodiment) 104 Bottom (first embodiment) 105 Mounting region (first embodiment) 200 Heat Dissipation Unit (Second Embodiment) 202 Heat receiving unit (second embodiment) 203 Heat Dissip

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
PCT/JP2015/058811 2014-03-31 2015-03-24 放熱ユニット、ｌｅｄ照明装置およびその製造方法 WO2015151913A1 (ja)

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WO2024127957A1 (ja) * 2022-12-16 2024-06-20 日本発條株式会社 放熱構造体、及び放熱構造体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685480A (ja) * 1992-08-28 1994-03-25 Showa Alum Corp ヒートパイプ式ヒートシンク
JP2013506307A (ja) * 2009-09-28 2013-02-21 アーベーベー・リサーチ・リミテッド 電子部品を冷却するための冷却モジュール

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Publication number Priority date Publication date Assignee Title
JPH07318282A (ja) * 1994-05-20 1995-12-08 Sumitomo Metal Ind Ltd チャンネル型放熱フィンとその製造方法
JPH1117078A (ja) * 1997-06-19 1999-01-22 Sumitomo Precision Prod Co Ltd 放熱器
JP4178857B2 (ja) * 2002-07-15 2008-11-12 株式会社デンソー 冷却器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685480A (ja) * 1992-08-28 1994-03-25 Showa Alum Corp ヒートパイプ式ヒートシンク
JP2013506307A (ja) * 2009-09-28 2013-02-21 アーベーベー・リサーチ・リミテッド 電子部品を冷却するための冷却モジュール

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