JP6084178B2 - 放熱ユニット、led照明装置およびその製造方法 - Google Patents
放熱ユニット、led照明装置およびその製造方法 Download PDFInfo
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- JP6084178B2 JP6084178B2 JP2014074687A JP2014074687A JP6084178B2 JP 6084178 B2 JP6084178 B2 JP 6084178B2 JP 2014074687 A JP2014074687 A JP 2014074687A JP 2014074687 A JP2014074687 A JP 2014074687A JP 6084178 B2 JP6084178 B2 JP 6084178B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 230000005855 radiation Effects 0.000 title claims description 19
- 230000017525 heat dissipation Effects 0.000 claims description 69
- 238000010030 laminating Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000008016 vaporization Effects 0.000 description 6
- 238000009834 vaporization Methods 0.000 description 5
- 238000003486 chemical etching Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 244000126211 Hericium coralloides Species 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
11 前面(第1種類の板状部材)
12 後面(第1種類の板状部材)
13 側面(第1種類の板状部材)
20 第2種類の板状部材
21 前面(第2種類の板状部材)
22 後面(第2種類の板状部材)
23 側面(第2種類の板状部材)
30 第3種類の板状部材
31 前面(第3種類の板状部材)
32 後面(第3種類の板状部材)
33 前面(第3種類の板状部材)
40 第4種類の板状部材
41 前面(第4種類の板状部材)
42 後面(第4種類の板状部材)
43 側面(第4種類の板状部材)
100 放熱ユニット(第1の実施形態)
102 受熱部(第1の実施形態)
103 放熱部(第1の実施形態)
104 底面(第1の実施形態)
105 取付領域(第1の実施形態)
200 放熱ユニット(第2の実施形態)
202 受熱部(第2の実施形態)
203 放熱部(第2の実施形態)
204 底面(第2の実施形態)
205 取付領域(第2の実施形態)
300 放熱ユニット(第3の実施形態)
302 受熱部(第3の実施形態)
303 放熱部(第3の実施形態)
304 底面(第3の実施形態)
305 取付領域(第3の実施形態)
400 放熱ユニット(第4の実施形態)
402 受熱部(第4の実施形態)
403 放熱部(第4の実施形態)
405 取付領域(第4の実施形態)
L1 第1の延在部
L2 第2の延在部
L3 第3の延在部
L4 第4の延在部
L5 第5の延在部
L6 第6の延在部
L7 第7の延在部
C 溝
Claims (9)
- 熱源に接続され熱源からの熱を受ける受熱部と、この受熱部に連続し熱源からの熱を放熱する放熱部とを備えた放熱ユニットであって、
中空構造に形成され、内部に熱媒体の経路全体が収まった板状部材を複数備え、
各板状部材は、前記受熱部を構成する受熱部構成要素と、この受熱部構成要素と一体に作られ前記熱媒体の経路が連続した前記放熱部を構成する放熱部構成要素とを備え、前記受熱部構成要素の厚み寸法と、前記放熱部構成要素の厚み寸法とは、同一に設定されたものであり、
複数の前記板状部材は互いの熱媒体の経路が連続されることなく積層されている、放熱ユニット。 - 積層された複数の前記板状部材は、積層方向に略平行な積層平行面を共同して形成し、
前記積層平行面は前記熱源を接続される、請求項1に記載の放熱ユニット。 - 各板状部材は、積層方向に貫通する穴または溝を備える、請求項1または2に記載の放熱ユニット。
- 1種類の前記板状部材を、隙間を空けることなく厚み方向に添接させている、請求項1、2または3に記載の放熱ユニット。
- 一方の板状部材と他方の板状部材とが交互に積層された2種類の板状部材からなり、一方の板状部材と他方の板状部材の形状とが互いに異なる、請求項1、2または3に記載の放熱ユニット。
- 複数種類の前記板状部材を備える、請求項1、2または3に記載の放熱ユニット。
- 請求項1〜6のいずれか一項に記載の放熱ユニットを備え、
前記熱源はLEDである、LED照明装置。 - 熱伝導に優れた複数の板状部材を備える、請求項1〜7のいずれか一項に記載の放熱ユニットの製造方法であって、
前記板状部材を積層させること、
積層方向と略平行な積層平行面を形成すること、
前記積層平行面に熱源を接続することを含む、放熱ユニットの製造方法。 - 前記積層平行面を形成することは、エッチングまたは研磨により平面を形成することを含む、請求項8に記載の放熱ユニットの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014074687A JP6084178B2 (ja) | 2014-03-31 | 2014-03-31 | 放熱ユニット、led照明装置およびその製造方法 |
PCT/JP2015/058811 WO2015151913A1 (ja) | 2014-03-31 | 2015-03-24 | 放熱ユニット、led照明装置およびその製造方法 |
Applications Claiming Priority (1)
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JP2014074687A JP6084178B2 (ja) | 2014-03-31 | 2014-03-31 | 放熱ユニット、led照明装置およびその製造方法 |
Publications (3)
Publication Number | Publication Date |
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JP2015198140A JP2015198140A (ja) | 2015-11-09 |
JP2015198140A5 JP2015198140A5 (ja) | 2016-02-04 |
JP6084178B2 true JP6084178B2 (ja) | 2017-02-22 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2014074687A Expired - Fee Related JP6084178B2 (ja) | 2014-03-31 | 2014-03-31 | 放熱ユニット、led照明装置およびその製造方法 |
Country Status (2)
Country | Link |
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JP (1) | JP6084178B2 (ja) |
WO (1) | WO2015151913A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2024127957A1 (ja) * | 2022-12-16 | 2024-06-20 | 日本発條株式会社 | 放熱構造体、及び放熱構造体の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3143811B2 (ja) * | 1992-08-28 | 2001-03-07 | 昭和アルミニウム株式会社 | ヒートパイプ式ヒートシンク |
JPH07318282A (ja) * | 1994-05-20 | 1995-12-08 | Sumitomo Metal Ind Ltd | チャンネル型放熱フィンとその製造方法 |
JPH1117078A (ja) * | 1997-06-19 | 1999-01-22 | Sumitomo Precision Prod Co Ltd | 放熱器 |
JP4178857B2 (ja) * | 2002-07-15 | 2008-11-12 | 株式会社デンソー | 冷却器 |
RU2524058C2 (ru) * | 2009-09-28 | 2014-07-27 | Абб Рисерч Лтд | Охлаждающий модуль для охлаждения электронных элементов |
-
2014
- 2014-03-31 JP JP2014074687A patent/JP6084178B2/ja not_active Expired - Fee Related
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2015
- 2015-03-24 WO PCT/JP2015/058811 patent/WO2015151913A1/ja active Application Filing
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Publication number | Publication date |
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JP2015198140A (ja) | 2015-11-09 |
WO2015151913A1 (ja) | 2015-10-08 |
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