WO2015143758A1 - 一种玻璃基板切割设备及切割方法 - Google Patents

一种玻璃基板切割设备及切割方法 Download PDF

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Publication number
WO2015143758A1
WO2015143758A1 PCT/CN2014/077248 CN2014077248W WO2015143758A1 WO 2015143758 A1 WO2015143758 A1 WO 2015143758A1 CN 2014077248 W CN2014077248 W CN 2014077248W WO 2015143758 A1 WO2015143758 A1 WO 2015143758A1
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Prior art keywords
glass substrate
cutting
crack
pressure nozzle
pressure
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PCT/CN2014/077248
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English (en)
French (fr)
Inventor
贾胡平
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/647,117 priority Critical patent/US20170008794A1/en
Publication of WO2015143758A1 publication Critical patent/WO2015143758A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations

Definitions

  • the present invention relates to a glass substrate manufacturing apparatus and a method of fabricating the same, and more particularly to a glass substrate cutting apparatus and a cutting method.
  • the glass substrate is required to be combined with a color filter during the preparation process, and the liquid crystal is poured on the substrate and then cut into a desired size.
  • the glass substrate is cut back and forth by a cutting knife to cut it into two halves.
  • the cutting head is easy to wear and become dull, and the crack is shallow when cutting the glass, making it difficult to break, if repeatedly cutting , affecting the cutting quality of the glass substrate, can not meet the requirements of the refined production of the liquid crystal panel.
  • the main object of the present invention is to provide a glass substrate cutting apparatus with high cutting efficiency and good quality and a cutting method therefor.
  • the invention provides a glass substrate cutting device, comprising a table, a cutting blade and a roller, wherein the glass substrate is transferred on a worktable, and the cutting blade comprises an upper cutting blade and a lower cutting blade, which are respectively disposed at upper and lower ends of the glass substrate And the cutting edges are opposite to cut the glass substrate into two halves from the upper and lower sides of the glass substrate, the drum is disposed at the upper end of the glass substrate, and the glass substrate can be pressed to be broken along the cutting crack on the glass substrate, wherein the cutting
  • the apparatus further includes a high pressure nozzle for ejecting a high pressure gas stream along the cutting crack to accelerate fracture of the glass substrate.
  • the cutting device further has a jet control unit electrically connected to the high-pressure nozzle, including a solenoid valve and a heater electrically connected to each other, the solenoid valve being electrically connected to the high-pressure nozzle, and the high-pressure airflow is heated by the heater.
  • a jet control unit electrically connected to the high-pressure nozzle, including a solenoid valve and a heater electrically connected to each other, the solenoid valve being electrically connected to the high-pressure nozzle, and the high-pressure airflow is heated by the heater.
  • the solenoid valve Through the on and off of the solenoid valve, the high-pressure airflow is controlled to be led out from the high-pressure nozzle, and the crack depth of the glass substrate is deepened by the high-pressure airflow, thereby accelerating the fracture of the glass substrate.
  • the high-pressure nozzle is disposed between the cutting blade and the drum, and the inner diameter of the outlet end of the high-pressure nozzle is 1-2 mm, and the diameter of the nozzle is small, so that the pressure of the airflow derived from the nozzle is increased, which is beneficial to Breakage of cracks in the glass substrate.
  • the pressure of the high-pressure air jet ejected from the high-pressure nozzle is 0.5 to 1.5 MPa, and the temperature is normal temperature, 25 to 35 degrees.
  • the high-pressure nozzles are two, and are respectively symmetrically disposed at upper and lower ends of the glass substrate.
  • the crack is subjected to high-pressure blowing through the high-pressure nozzles at the upper and lower ends of the glass substrate to balance the force, thereby avoiding the phenomenon that the glass substrate is bent and deformed due to local uneven force.
  • the cutter blade on the same side, the high-pressure nozzle and the crack are on the same straight line, and the front-rear distance between the cutter and the high-pressure nozzle is 1-3 cm; the roller is disposed beside the high-pressure nozzle, and is offset from the crack. Left between the drum and the high pressure nozzle The right spacing is 1 ⁇ 3cm, that is, the distance between the roller and the crack is l ⁇ 3cm.
  • the roller presses the glass substrate on both sides of the crack so that the glass substrate is pressed to break at the crack. If the distance between the roller and the crack is too large, the force point of the glass substrate is affected, and the phenomenon that it is broken at other positions affects the molding quality of the glass substrate.
  • the invention also provides a method for cutting a glass substrate, comprising the steps of:
  • Step 1) Place the glass substrate on the workbench smoothly and adjust the position of the cutting blade
  • Step 2) starting cutting, the upper cutting blade moves in the same direction as the lower cutting blade, forming a crack on the glass substrate;
  • Step 3) starting the jet control unit, ejecting a high-pressure airflow along the crack through the high-pressure nozzle, deepening the glass substrate Crack depth
  • Step 4) Pressing the glass substrate, pushing the roller to press the glass substrate along the crack, so that the glass substrate is broken into two halves.
  • the pressure of the high pressure gas stream is 0.5 to 1.5 MPa, and the force intensity on the crack is increased by the high pressure gas stream.
  • the cutting of the glass substrate and the jetting of the high pressure nozzle are performed in synchronization to deepen the crack of the glass substrate and accelerate the breakage thereof.
  • the distance between the running track of the drum and the crack is 1-3 cm, and the drum presses the glass substrate along the reverse trajectory of the cutting.
  • the glass substrate cutting device of the invention increases the pressure at the crack and deepens the crack depth by adding a high-pressure nozzle to cut the high-pressure airflow while cutting, thereby achieving the effect of rapid cracking. .
  • the glass substrate is balanced when it is broken, and it is prevented from being broken in other parts.
  • the high efficiency gas blow cracks accelerate the cutting efficiency and cutting quality.
  • the jetted high-pressure airflow does not pollute the glass substrate and is safer and more reliable than other media.
  • FIG. 1 is a schematic structural view of a glass substrate cutting device of the present invention
  • FIG. 2 is a circuit diagram of a glass substrate cutting device of the present invention.
  • the present invention provides a glass substrate cutting apparatus comprising a table 1, a cutting blade 2, a drum 3 and a high pressure nozzle 4, a cutting blade 2, a roller 3 and a high pressure nozzle 4 pairs are disposed symmetrically mounted on the upper and lower ends of the glass substrate 5.
  • the glass substrate 5 is transferred on the table 1, and the cutting blade 2 includes an upper cutting blade 20 and a lower cutting blade 21, which are respectively disposed at upper and lower ends of the glass substrate 5 and opposite to each other, so as to be from the upper and lower sides of the glass substrate 5
  • the glass substrate 5 is cut into two halves, and the drum 3 is disposed at the upper end of the glass substrate 5, and can be broken by pressing the glass substrate 5 along a cutting crack on the glass substrate 5; the high-pressure nozzle 4 is disposed on the cutting blade 2 Between the drum 3 and the drum 3, a high-pressure air stream can be ejected along the cutting crack to accelerate the breakage of the glass substrate 5.
  • the workbench 1 includes a first workbench 10 and a second workbench 12, and the glass substrate 5 is transferred from the first workbench 10 to the second workbench 12 by a conveyor belt.
  • the cutting assembly includes a cutting blade 2, a drum 3, and a high pressure nozzle 4 between the two stages, and when the middle portion of the glass substrate 5 is transferred to the position of the cutting assembly, the cutting process is started.
  • the high pressure tip 4 includes an upper needle tip 40 and a lower needle tip 41 which are symmetrically disposed at upper and lower ends of the glass substrate 5, respectively.
  • the cracks are subjected to high-pressure blowing through the high-pressure nozzles 4 at the upper and lower ends of the glass substrate 5 to balance the force, thereby preventing the glass substrate 5 from being bent and deformed due to local uneven force.
  • the cutting device further has a jet control unit 6 electrically connected to the high pressure tip 4, comprising two solenoid valves 60 and a heater 61 electrically connected to each other, the two solenoid valves 60 being respectively associated with the upper nozzle 40 and the lower
  • the nozzles 41 are electrically connected to control the on and off of the high pressure airflow in the upper and lower nozzles 40, 41, respectively. After the high-pressure airflow is heated by the heater 61, the high-pressure airflow is controlled to be led out of the high-pressure nozzle 4 by the opening and closing of the solenoid valve 60, and the crack depth of the glass substrate is deepened by the high-pressure airflow, thereby accelerating the fracture of the glass substrate 5.
  • the inner diameter of the outlet end of the high pressure nozzle 4 is l ⁇ 2 mm, and the diameter of the nozzle is small, so that the pressure of the airflow derived from the nozzle is increased, which is favorable for the crack of the crack of the glass substrate.
  • the pressure of the high-pressure gas stream ejected from the high-pressure nozzle is 0.5 to 1.5 MPa, and the temperature is normal temperature. The greater the pressure of the airflow, the greater the pressure on the crack and the greater the depth of the crack, resulting in a rapid splitting effect.
  • the cutters 2 on the same side, the high pressure nozzles 4 and the cracks are on the same straight line, and the front and rear distance between the cutter 2 and the high pressure nozzle 4 is 1-3 cm; the drum 3 is disposed on the high pressure nozzle 4, away from the crack, the left-right distance between the drum 3 and the high-pressure nozzle 4 is 1-3 cm, that is, the distance between the drum 3 and the crack is 1-3 cm.
  • the cutting blade 2 and the high-pressure nozzle 4 can cut the glass substrate to form a crack on the same straight line, and the roller 3 deviates from the crack when pressing the glass substrate 5, and the roller 3 can press the glass substrate 5 on both sides of the crack, so that the glass substrate 5 is pressed and fractured at the crack. If the distance between the roller 3 and the crack is too large, the force receiving point of the glass substrate 5 is affected, and the phenomenon that it is broken at other positions affects the molding quality of the glass substrate.
  • the invention also provides a method for cutting a glass substrate, comprising the steps of:
  • Step 1) The glass substrate is placed on the table smoothly, and the position of the cutting blade is adjusted by the position adjusting device, so that the cutting assembly is opposite to the middle portion of the glass substrate and perpendicular thereto to ensure that the cut crack is flat;
  • Step 2) Starting cutting, the upper cutting blade moves in the same direction as the lower cutting blade, forming a crack on the glass substrate; Step 3) starting the jet control unit, turning on the electromagnetic valve, and ejecting the high-pressure airflow along the crack through the high-pressure nozzle, Deepen the crack depth on the glass substrate;
  • Step 4) Pressing the glass substrate, pushing the roller to press the glass substrate along the crack, causing the glass substrate to be broken into two halves, and then pulling the cut glass substrate away from the vacuum of the second table.
  • the pressure of the high-pressure air stream is 0.5 to 1.5 MPa, and the strength of the force on the crack is increased by the high-pressure airflow.
  • the distance between the running track of the drum and the crack is 1-3 cm, and the drum presses the glass substrate along the reverse trajectory of the cutting.
  • the cutting of the glass substrate and the jetting of the high pressure nozzle are performed in synchronization to deepen the crack of the glass substrate and accelerate the breakage thereof.
  • the high-pressure nozzle sprays the high-pressure airflow along the crack, so that the depth of the original crack is increased by at least one time, the cutting efficiency and quality are obviously improved, and the glass substrate is more easily broken along the crack, and the crack is cracked. smooth.
  • the glass substrate cutting device of the invention increases the pressure at the crack and deepens the crack depth by adding a high-pressure nozzle to cut the high-pressure airflow while cutting, thereby achieving the effect of rapid splitting.
  • a high-pressure nozzle to cut the high-pressure airflow while cutting, thereby achieving the effect of rapid splitting.
  • the high efficiency gas blown marks accelerate the cutting efficiency and cutting quality.
  • the jetted high-pressure airflow does not cause contamination of the glass substrate, and is safer and more reliable than spraying other media.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

一种玻璃基板切割设备及切割方法。该设备包括工作台、切割刀和滚筒。所述玻璃基板在工作台上传递；切割刀包括上切割刀和下切割刀，其分别设于玻璃基板的上下端且刀口相对，以从玻璃基板的上下两侧将玻璃基板切割成两半；所述滚筒设于玻璃基板的上端，可沿玻璃基板上的切割裂痕按压玻璃基板使之断裂。所述切割设备进一步包括高压针嘴，其设于切割刀与滚筒之间，可沿切割裂痕喷射出高压气流，以加速玻璃基板的断裂。通过增设高压针嘴，在切割的同时，向裂痕喷出高压气流，以加大裂痕处的压力，从而达到快速裂片的效果。

Description

一种玻璃基板切割设备及切割方法 技术领域
本发明涉及一种玻璃基板的制造设备及制备方法， 尤其是指一种玻璃基板的切割设备及 切割方法。
背景技术
现有的液晶面板，其玻璃基板在制备过程中，需与彩色滤光片结合，并在基板上灌注液晶， 而后切割成所需的尺寸。 通常采用切割刀来回切割玻璃基板， 以将其切断成两半， 这时， 由 于切割刀的长期使用， 刀头易磨损变钝， 切割玻璃时裂痕较浅， 使其难于断裂， 若再反复切 割， 影响玻璃基板的切割品质， 不能满足液晶面板精细化生产的要求。
发明内容
基于现有技术的不足， 本发明的主要目的在于提供切割效率高、 品质佳的玻璃基板切割 设备及其切割方法。
本发明提供了一种玻璃基板切割设备， 包括工作台、 切割刀和滚筒， 所述玻璃基板在工 作台上传递， 切割刀包括上切割刀和下切割刀， 其分别设于玻璃基板的上下端且刀口相对， 以从玻璃基板的上下两侧将玻璃基板切割成两半， 所述滚筒设于玻璃基板的上端， 可沿玻璃 基板上的切割裂痕按压玻璃基板使之断裂， 其中， 所述切割设备还进一步包括高压针嘴， 可 沿切割裂痕喷射出高压气流， 以加速玻璃基板的断裂。
优选地， 所述切割设备还进一步喷气控制单元， 其与高压针嘴电连接， 包括相互电连接 的电磁阀和加热器， 电磁阀与高压针嘴电性连接， 高压气流经加热器加热后， 通过电磁阀的 通断， 控制高压气流由高压针嘴中导出， 通过高压气流加深玻璃基板裂痕深度， 随之加快玻 璃基板的断裂。
优选地， 所述高压针嘴设于切割刀与滚筒之间， 所述高压针嘴出口端的内径为 l~2mm， 针嘴的口径小， 使得从针嘴中导出的气流压强增大， 有利于玻璃基板裂痕的断裂。 由高压针 嘴喷出的高压气流的压力为 0.5~1.5Mpa， 温度为常温， 25-35度。
优选地， 所述高压针嘴为两个， 分别对称地设于玻璃基板的上下两端。 通过玻璃基板上 下两端的高压针嘴对裂痕进行高压鼓吹， 使之受力平衡， 避免其因局部受力不均而造成玻璃 基板弯曲变形的现象。
优选地， 所述同侧的切割刀、 高压针嘴与裂痕在同一直线上， 切割刀与高压针嘴之间的 前后间距为 l~3cm; 所述滚筒设置于高压针嘴旁， 偏离裂痕， 所述滚筒与高压针嘴之间的左 右间距为 l~3cm， 即滚筒与裂痕之间的间距为 l~3cm。 滚筒可在裂痕的两侧按压玻璃基板， 使得玻璃基板受压而在裂痕处断裂。 若滚筒与裂痕之间的间距过大， 则影响玻璃基板的受力 点， 而会致其在其他位置断裂的现象， 影响玻璃基板的成型品质。
本发明还提供了一种玻璃基板切割的方法， 其包括以下步骤：
步骤 1 ) 将玻璃基板平稳放置于工作台上， 调整切割刀的位置后；
步骤 2) 启动切割， 所述上切割刀与下切割刀同向运动， 在玻璃基板上形成裂痕； 步骤 3 ) 启动喷气控制单元， 通过高压针嘴沿裂痕喷射出高压气流， 加深玻璃基板上的 裂痕深度；
步骤 4) 按压玻璃基板， 推动滚筒沿裂痕按压玻璃基板， 使得所述玻璃基板断裂成两半。 优选地， 在步骤 3 ) 中， 所述高压气流的压力为 0.5~1.5Mpa， 通过高压气流增加裂痕上 的受力强度。
所述玻璃基板的切割和高压针嘴的喷气同步进行， 以加深玻璃基板的裂痕， 并加速其断 裂。
优选地， 所述滚筒的运行轨迹与裂痕之间的间距为 l~3cm， 滚筒沿切割的反向轨迹按压 所述玻璃基板。
与现有技术相比， 本发明玻璃基板切割设备， 通过增设高压针嘴， 在切割的同时， 向裂痕 喷出高压气流， 以加大裂痕处的压力， 加深裂痕深度， 从而达到快速裂片的效果。 通过设置 切割刀和滚筒之间的间距， 使得玻璃基板在折断时， 受力均衡， 避免其在其他部分发生断裂。 通过高压气吹裂痕， 加快了切割效率和切割品质。 同时， 喷射的高压气流也不会对玻璃基板 造成污染， 相对于喷射其他介质更安全可靠。
附图说明
图 1为本发明一种玻璃基板切割设备的结构示意图；
图 2为本发明一种玻璃基板切割设备的电路示意图。
具体实施方式
为了加快玻璃基板的切割效率， 提高切割品质， 本发明提供了一种玻璃基板切割设备， 包括工作台 1、 切割刀 2、 滚筒 3和高压针嘴 4， 切割刀 2、 滚筒 3和高压针嘴 4成对设置， 对称地安装于玻璃基板 5的上端和下端。 所述玻璃基板 5在工作台 1上传递， 切割刀 2包括 上切割刀 20和下切割刀 21， 其分别设于玻璃基板 5的上下端且刀口相对， 以从玻璃基板 5 的上下两侧将玻璃基板 5切割成两半， 所述滚筒 3设于玻璃基板 5的上端， 可沿玻璃基板 5 上的切割裂痕按压玻璃基板 5使之断裂； 所述高压针嘴 4， 其设于切割刀 2与滚筒 3之间， 可沿切割裂痕喷射出高压气流， 以加速玻璃基板 5的断裂。 其中， 所述工作台 1包括第一工作台 10和第二工作台 12， 玻璃基板 5由传送带从第一 工作台 10传递至第二工作台 12。 切割组件包括切割刀 2、 滚筒 3和高压针嘴 4， 其位于两工 作台之间， 当玻璃基板 5的中部传送至切割组件位置时， 启动切割程序。
优选地， 所述高压针嘴 4包括上针嘴 40和下针嘴 41， 分别对称地设于玻璃基板 5的上 下两端。 通过玻璃基板 5上下两端的高压针嘴 4对裂痕进行高压鼓吹， 使之受力平衡， 避免 其因局部受力不均而造成玻璃基板 5弯曲变形的现象。 所述切割设备还进一步喷气控制单元 6， 其与高压针嘴 4电连接， 包括相互电连接的两个电磁阀 60和加热器 61， 所述两个电磁阀 60分别与上针嘴 40、下针嘴 41电连接， 分别控制上针嘴 40和下针嘴 41中高压气流的通断。 高压气流经加热器 61加热后， 通过电磁阀 60的通断， 控制高压气流由高压针嘴 4中导出， 通过高压气流加深玻璃基板裂痕深度， 随之加快玻璃基板 5的断裂。
优选地， 所述高压针嘴 4出口端的内径为 l~2mm， 针嘴的口径小， 使得从针嘴中导出的 气流压强增大， 有利于玻璃基板裂痕的断裂。 由高压针嘴喷出的高压气流的压力为 0.5~1.5Mpa, 温度为常温。 气流压力越大， 对裂痕产生的压力越大， 造成的裂痕深度将越大， 从而达成快速裂片的效果。
优选地， 所述同侧的切割刀 2、 高压针嘴 4与裂痕在同一直线上， 切割刀 2与高压针嘴 4 之间的前后间距为 l~3cm; 所述滚筒 3设置于高压针嘴 4旁， 偏离裂痕， 所述滚筒 3与高压 针嘴 4之间的左右间距为 l~3cm， 即滚筒 3与裂痕之间的间距为 l~3cm。 这样， 切割刀 2与 高压针嘴 4可在同一直线上切割玻璃基板形成裂痕， 而滚筒 3在按压玻璃基板 5时， 偏离裂 痕， 滚筒 3可在裂痕的两侧按压玻璃基板 5， 使得玻璃基板 5受压而在裂痕处断裂。若滚筒 3 与裂痕之间的间距过大， 则影响玻璃基板 5的受力点， 而会致其在其他位置断裂的现象， 影 响玻璃基板的成型品质。
本发明还提供了一种玻璃基板切割的方法， 其包括以下步骤：
步骤 1 ) 将玻璃基板平稳放置于工作台上， 通过位置调整装置调整切割刀的位置后， 使 得切割组件与玻璃基板的中部相对， 且与之相垂直， 以保证所切割的裂痕平整；
步骤 2) 启动切割， 所述上切割刀与下切割刀同向运动， 在玻璃基板上形成裂痕； 步骤 3 ) 启动喷气控制单元， 接通电磁阀， 通过高压针嘴沿裂痕喷射出高压气流， 加深 玻璃基板上的裂痕深度；
步骤 4) 按压玻璃基板， 推动滚筒沿裂痕按压玻璃基板， 使得所述玻璃基板断裂成两半， 再从第二工作台的真空将切割后的玻璃基板抽离。
优选地， 在步骤 3 ) 中， 所述高压气流的压力为 0.5~1.5Mpa， 通过高压气流增加裂痕上 的受力强度。 优选地， 所述滚筒的运行轨迹与裂痕之间的间距为 l~3cm， 滚筒沿切割的反向轨迹按压 所述玻璃基板。
所述玻璃基板的切割和高压针嘴的喷气同步进行， 以加深玻璃基板的裂痕， 并加速其断 裂。 在本发明中， 在切割的同时， 由高压针嘴沿裂痕喷射高压气流， 使得原裂痕的深度增加 至少一倍， 明显提高了切割的效率和品质， 使得玻璃基板更易于沿裂痕折断， 且裂痕平整。
本发明玻璃基板切割设备， 通过增设高压针嘴， 在切割的同时， 向裂痕喷出高压气流， 以 加大裂痕处的压力， 加深裂痕深度， 从而达到快速裂片的效果。 通过设置切割刀和滚筒之间 的间距， 使得玻璃基板在折断时， 受力均衡， 避免其在其他部分发生断裂。 通过高压气吹裂 痕， 加快了切割效率和切割品质。 同时， 喷射的高压气流也不会对玻璃基板造成污染， 相对 于喷射其他介质更安全可靠。

Claims

权 利 要 求 书
、 一种玻璃基板切割设备， 包括工作台、 切割刀和滚筒， 所述玻璃基板在工作台上传递， 切割 刀包括上切割刀和下切割刀， 其分别设于玻璃基板的上下端且刀口相对， 以从玻璃基板的上 下两侧将玻璃基板切割成两半， 所述滚筒设于玻璃基板的上端， 可沿玻璃基板上的切割裂痕 按压玻璃基板使之断裂， 其中： 所述切割设备还进一步包括高压针嘴， 可沿切割裂痕喷射出 高压气流， 以加速玻璃基板的断裂， 所述高压针嘴设于切割刀与滚筒之间。
、 根据权利要求 1所述的玻璃基板切割设备， 其中： 所述切割设备还进一步喷气控制单元， 其 与高压针嘴电连接， 包括相互电连接的电磁阀和加热器， 电磁阀与高压针嘴电性连接， 高压 气流经加热器加热后， 通过电磁阀的通断， 控制高压气流由高压针嘴中导出。
、 根据权利要求 2所述的玻璃基板切割设备， 其中： 所述高压针嘴出口端的内径为 l~2mm。 、 根据权利要求 3 所述的玻璃基板切割设备， 其中： 由高压针嘴喷出的高压气流的压力为 0.5~1.5Mpa, 温度为 25-35度。
、 根据权利要求 1 所述的玻璃基板切割设备， 其中： 所述切割刀与高压针嘴之间的间距为 l~3cm; 所述滚筒与高压针嘴之间的间距为 l~3cm。
、 一种采用如权利要求 1所述的设备进行玻璃基板切割的方法， 其中包括以下步骤： 步骤 1 ) 将玻璃基板平稳放置于工作台上， 调整切割刀的位置后；
步骤 2) 启动切割， 所述上切割刀与下切割刀同向运动， 在玻璃基板上形成裂痕； 步骤 3 ) 启动喷气控制单元， 通过高压针嘴沿裂痕喷射出高压气流， 加深玻璃基板上的裂痕 深度；
步骤 4) 按压玻璃基板， 推动滚筒沿裂痕按压玻璃基板， 使得所述玻璃基板断裂成两半。 、 根据权利要求 6 所述的玻璃基板切割方法， 其中： 在步骤 3 ) 中， 所述高压气流的压力为 0.5~1.5Mpa。
、 根据权利要求 6所述的玻璃基板切割方法，其中：所述玻璃基板的切割和高压针嘴的喷气同 步进行。
、 根据权利要求 6所述的玻璃基板切割方法， 其中： 所述滚筒的运行轨迹与裂痕之间的间距为 l~3cm, 滚筒沿切割的反向轨迹按压所述玻璃基板。
、 一种玻璃基板切割设备， 包括工作台、 切割刀和滚筒， 所述玻璃基板在工作台上传递， 切 割刀包括上切割刀和下切割刀，其分别设于玻璃基板的上下端且刀口相对， 以从玻璃基板的 上下两侧将玻璃基板切割成两半，所述滚筒设于玻璃基板的上端，可沿玻璃基板上的切割裂 痕按压玻璃基板使之断裂， 其中： 所述切割设备还进一步包括高压针嘴， 可沿切割裂痕喷射 出高压气流， 以加速玻璃基板的断裂。 、 根据权利要求 10所述的玻璃基板切割设备， 其中： 所述高压针嘴设于切割刀与滚筒之间。 、 根据权利要求 10所述的玻璃基板切割设备， 其中： 所述切割设备还进一步喷气控制单元， 其与高压针嘴电连接， 包括相互电连接的电磁阀和加热器， 电磁阀与高压针嘴电性连接， 高 压气流经加热器加热后， 通过电磁阀的通断， 控制高压气流由高压针嘴中导出。
、 根据权利要求 11所述的玻璃基板切割设备， 其中： 所述高压针嘴出口端的内径为 l~2mm。 、 根据权利要求 12所述的玻璃基板切割设备， 其中： 由高压针嘴喷出的高压气流的压 力为 0.5~1.5Mpa, 温度为 25-35度。
、 根据权利要求 10所述的玻璃基板切割设备， 其中： 所述切割刀与高压针嘴之间的间距为 l〜3cm。
、根据权利要求 10所述的玻璃基板切割设备，其中：所述滚筒与高压针嘴之间的间距为 l〜3cm。
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