WO2015121995A1 - Dispositif de refroidissement d'appareil électronique et son procédé de commande - Google Patents

Dispositif de refroidissement d'appareil électronique et son procédé de commande Download PDF

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Publication number
WO2015121995A1
WO2015121995A1 PCT/JP2014/053564 JP2014053564W WO2015121995A1 WO 2015121995 A1 WO2015121995 A1 WO 2015121995A1 JP 2014053564 W JP2014053564 W JP 2014053564W WO 2015121995 A1 WO2015121995 A1 WO 2015121995A1
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WIPO (PCT)
Prior art keywords
temperature
electronic device
door
inlet
target
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PCT/JP2014/053564
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English (en)
Japanese (ja)
Inventor
陽子 國眼
繁裕 椿
佐々木　重幸
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株式会社日立製作所
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Priority to PCT/JP2014/053564 priority Critical patent/WO2015121995A1/fr
Publication of WO2015121995A1 publication Critical patent/WO2015121995A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754—Air circulating in closed loop within cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades

Definitions

  • the present invention relates to an electronic device cooling apparatus and a control method thereof.
  • a server is placed in a dedicated room and is operated while being cooled by an air conditioner installed in the room.
  • an apparatus equipped with an electronic device such as an integrated circuit is required to be cooled because the operation of the device may become unstable and malfunction may occur when the temperature of the electronic device rises due to heat generation.
  • the cooling chamber in which the electronic device is installed may be opened for maintenance during cooling of the electronic device in the room. For example, when an outside air temperature is 35 ° C. and a cooling chamber that is cooling an electronic device to a target set temperature 25 ° C. is opened, the refrigerant in the refrigeration cycle becomes unstable, and the liquefied refrigerant may enter the compressor.
  • the compressor makes the target set temperature 25 ° C. almost at the outside air temperature of 35 ° C., so that the rotation speed is greatly increased. Thereafter, when the door of the cooling chamber that houses the electronic device is closed, the door of the cooling chamber that houses the electronic device is closed while the rotational speed of the compressor is increased.
  • the compressor since the compressor is operated in a state where the outside air temperature is 35 ° C. and the target set temperature is 25 ° C., the compressor can reduce the rotation speed to the operation state in which the cooling chamber for housing the electronic device is cooled. When the rotation speed of the compressor is decreased, the opening degree of the expansion valve is changed.
  • Patent Document 1 as a method for improving the influence of outside air when the door of the cooling chamber is opened, an air curtain is configured using a part of the cooling air when the door is opened, and the cooling air in the housing is opened when the door is opened. And the ambient air of the apparatus are prevented from mixing and the heat exchange inside and outside the housing is blocked.
  • the apparatus of Patent Document 1 is not equipped with a refrigeration cycle.
  • the compressor follows the outside air environment, the outside air rotates at high speed when it is hot, and the object to be cooled is cooled too much when the door is closed, or It does not give a solution to the problem that the outside air rotates at low speed when the temperature is low and the object to be cooled becomes too warm when the door is closed. Moreover, the problem that the liquefied refrigerant enters the compressor when the door is opened and closed is still unsolved.
  • the present invention has been made to solve the above-mentioned conventional technical problems, and an object thereof is to provide an electronic device cooling apparatus having a high reliability in cooling performance and a control method therefor regardless of opening of the door.
  • the compressor, the condenser, the decompression unit, and the evaporator constituting the refrigeration cycle for cooling the electronic device are connected by a pipe through which the refrigerant flows, and are provided in the storage chamber.
  • An electronic device cooling apparatus in which an electronic device is cooled with air cooled by the evaporator, a door that opens and closes the storage chamber, door open / close detection means that detects opening and closing of the door, and an evaporator inlet
  • a target superheat degree which is a control target value of the superheat degree obtained by subtracting the refrigerant temperature at the evaporator outlet from the refrigerant temperature at the evaporator outlet, is set before the door is closed. It has been changed to a higher value than the target degree of superheat.
  • an electronic device cooling apparatus in which a compressor, a condenser, a decompression unit, and an evaporator constituting a refrigeration cycle for cooling an electronic device are connected by a pipe through which a refrigerant flows and provided in a storage chamber.
  • An electronic device cooling apparatus in which the device is cooled by air cooled by the evaporator, wherein the storage chamber is opened / closed, door opening / closing detection means for detecting opening / closing of the door, and outside air temperature is detected.
  • An outside air temperature detecting means an inlet air temperature detecting means for detecting an inlet air temperature that is a temperature at which air for cooling the electronic device starts to hit the electronic device, and a control means for controlling the cooling
  • the control means is configured such that the outside air temperature is a target electronic equipment inlet temperature that is a control target value of the inlet temperature when the door is closed.
  • the target electronic device inlet temperature when the door is opened is changed to be higher than the target electronic device inlet temperature when the door is closed, and the outside air temperature is closed. If the target electronic device inlet temperature is lower than the target electronic device inlet temperature when the door is opened, the target electronic device inlet temperature when the door is closed is changed to be lower than the target electronic device inlet temperature when the door is closed. Yes.
  • a compressor, a condenser, a decompression unit, and an evaporator constituting a refrigeration cycle for cooling an electronic device are connected by a pipe through which a refrigerant flows,
  • An electronic device provided is cooled by air cooled by the evaporator, the door for opening and closing the storage chamber, door opening / closing detection means for detecting opening / closing of the door, and an inlet for detecting refrigerant temperature at the inlet of the evaporator
  • a method for controlling an electronic device cooling apparatus comprising temperature detecting means, outlet temperature detecting means for detecting a refrigerant temperature at an evaporator outlet, and control means for controlling the cooling, when the door is opened,
  • the target superheat degree which is a control target value of the superheat degree obtained by subtracting the refrigerant temperature at the evaporator inlet from the refrigerant temperature at the evaporator outlet, is changed to a value higher than the target superheat degree when
  • the perspective view which shows the structure of the electronic device cooling device of the modification 2 of embodiment of this invention. Sectional drawing which looked at the state at the time of the cooling operation which closed the front side door and the back side door of the electronic device cooling device of the modification 2 from upper direction.
  • the flowchart which shows the basic control at the time of the door opening in the cooling operation of an electronic device cooling device.
  • the flowchart which shows the control which resets only a target superheat degree in control at the time of the door opening in the cooling operation of an electronic device cooling device.
  • the flowchart which shows the control which resets the superheat degree at the time of the door opening in the cooling operation of the electronic device cooling device in the external temperature of 35 degreeC, and a server inlet temperature.
  • the flowchart which shows the control which resets the superheat degree at the time of the door opening in the cooling operation of the electronic device cooling device in the external temperature of 15 degreeC, and a server inlet temperature.
  • FIG. 1 is a perspective view showing a configuration of an electronic device cooling apparatus according to an embodiment of the present invention, and shows a state where a front door and a rear door are opened.
  • FIG. 2 is a cross-sectional view of the electronic device cooling apparatus during the cooling operation in which the front door and the rear door of FIG. 1 are closed as viewed from the left side from the front.
  • the arrow a1 in FIG. 2 indicates the flow of air circulating in the storage chamber 5, and the arrow a2 indicates the flow of air passing through the heat dissipation and machine chamber 6.
  • the electronic device cooling apparatus R of the embodiment is an apparatus for cooling the server 8 that generates heat during operation to a desired temperature. Therefore, the electronic device cooling apparatus R includes the following refrigeration cycle for cooling the server 8.
  • the refrigerant flowing through the pipe h (see FIG. 2) is compressed to a high temperature and a high pressure, and the refrigerant discharged from the compressor 9 is condensed to exchange heat with indoor air to condense heat.
  • the electronic device cooling device R is disposed in the upper stage, the storage chamber 5 for storing the server 8, the evaporator 12, and the like, and the heat dissipation and machine in the lower stage, in which the condenser 10, the compressor 9, the expansion valve 11 and the like are stored.
  • the room 6 is divided into two parts in the vertical direction.
  • the upper storage chamber 5 is sealed from another chamber so that heat does not enter and exit in order to cool the server 8 to a desired temperature.
  • the compressor 9, the condenser 10, the expansion valve 11, and the evaporator 12 in the storage chamber 5 of the heat radiation and machine room 6 are sequentially connected by the refrigerant pipe h, The refrigeration cycle is formed.
  • the refrigerant that has been pressurized by the compressor 9 to become a high-temperature and high-pressure gas is sent to the condenser 10.
  • the refrigerant sent to the condenser 10 dissipates heat to the outside air in the process of passing through the condenser 10, and changes in phase from a gas to a two-phase state and to a liquid.
  • the refrigerant passes through the expansion valve 11 and is depressurized to be in a low-pressure two-phase state.
  • the refrigerant that has become a low-pressure two-phase state then absorbs heat from the air in the storage chamber 5 in the process of passing through the evaporator 12, and again changes from the two-phase state to a gas and is returned to the compressor 9. .
  • a casing k that forms the outer shell of the electronic device cooling device R includes a box-shaped cabinet 1, a front door 2, a rear door 3, and the like. As described above, the casing k of the electronic device cooling device R is divided into the upper storage chamber 5 and the lower machine chamber 6 and is divided into two.
  • a condenser 10 for radiating heat and a condenser fan 13 are arranged, and a compressor 9 and an expansion valve 11 of machinery are arranged.
  • Openings 16a and 16b are respectively provided at locations facing the heat radiation and machine room 6 of the front side door 2 and the back side door 3, respectively. Through the openings 16a and 16b, the air that has absorbed the heat of the condenser 10 in the heat radiating and machine room 6 and the air that has absorbed the heat of the compressor 9 can be circulated with the surrounding air (room air).
  • a condenser fan 13 is disposed upstream of the air flow passing through the heat radiation and machine room 6 indicated by an arrow a2 in FIG. 2, and a condenser 10 and a compressor 9 are disposed downstream thereof.
  • the condenser fan 13 allows outside air (indoor air) to flow in from the opening 16 a provided in the front door 2, and heat exchange between the outside air and the condenser 10 or the compressor 9 causes the condenser 10 and the compressor 9 to be exchanged. Promotes the release of heat to the outside air. In this way, the air that has absorbed the heat of the condenser 10 and the compressor 9 is discharged to the outside through the opening 16 b provided in the rear door 3.
  • the compressor 9 is a variable capacity compressor capable of capacity control.
  • a compressor a piston type, a rotary type, a scroll type, a screw type, or a centrifugal type can be adopted.
  • the compressor 9 is a scroll type compressor, capacity control is possible by inverter control, and the rotational speed is variable from low speed to high speed.
  • the expansion valve 11 may be a small-diameter tube, and other than the expansion valve 11 may be used as long as the pressure reducing means.
  • FIG. 2 shows a case where a plurality of servers 8 are stacked and arranged, a single server 8 may be arranged in a part of the storage room 5.
  • Each server 8 is provided with a blower 15, and the heat generating components inside the server 8 are cooled by circulating the air that is cooled by the evaporator 12 and circulated in the storage chamber 5.
  • the evaporator 12 that cools the air (cooling air) heated by the heat of the server 8 and the heated air pass through the evaporator 12. And a door fan 14 for suction.
  • the evaporator 12 circulates in the storage chamber 5 and cools the air heated by the server 8 by heat exchange.
  • the upper and lower ducts 4 a and 4 b are provided in the flow path 2 r passing through the front door 2 and the rear door 3. And a flow path 3r passing through the back side door 3 is connected to form an air path.
  • a baffle plate that expands the area of air contact with at least some of the air passages of the upper and lower ducts 4a and 4b, the flow path 2r of the front door 2, and the flow path 3r of the rear door 3. It is preferable to provide a member that promotes condensation. Alternatively, it is more preferable that a part of the air passages is cooled with water or the like, so that condensation on the air passages is promoted and adhesion of moisture to the server 8 is further suppressed.
  • the bottom plate of the evaporator 12 is provided with a drain pan (not shown) that receives condensed water that is condensed by water contained in the air that has cooled the server 8 in the evaporator 12.
  • the condensed water received by the drain pan is guided to a water storage tank (not shown) disposed in the heat radiating and machine room 6.
  • the electronic device cooling apparatus R hits the outside air temperature sensor 202 that detects the temperature of outside air as a sensor that detects the air temperature, and the server 8 that cools the server 8 in the storage chamber 5.
  • a temperature sensor 201 that detects an intake air temperature that is a starting temperature.
  • sensors for detecting the refrigerant temperature of the refrigeration cycle a temperature sensor 203 for detecting the evaporator (12) inlet temperature and a temperature sensor 204 for detecting the evaporator (12) outlet temperature are provided.
  • FIG. 3 is a block diagram illustrating control of the control device.
  • the electronic device cooling device R is a control device that adjusts the rotation speed (number of rotations) of the compressor 9, the condenser fan 13, and the door fan 14 and the opening degree of the expansion valve 11 based on the temperatures detected by the above-described sensors. 200.
  • the control device 200 is constituted by a microcomputer, a peripheral circuit, etc., and temperature data detected by each of the temperature sensors described above is input to the control device, and control is performed. Note that at least a part of the microcomputer of the control device may be configured by a circuit as long as predetermined control is performed.
  • the control device 200 includes information on the inlet temperature for cooling the server 8 detected by the temperature sensor 201, information on the outside temperature detected by the outside temperature sensor 202, and information on the inlet temperature of the evaporator 12 detected by the temperature sensor 203.
  • the control device 200 performs an operation according to the input information, the target superheat degree of the evaporator 12, the target server inlet temperature (target electronic equipment inlet temperature), the opening degree of the expansion valve 11, the rotational speed of the compressor 9, Information such as the rotational speed of the condenser fan 13 is output.
  • the target superheat degree is a control target value of (exit temperature ⁇ inlet temperature) of the evaporator 12.
  • the target server inlet temperature is a control target value of the inlet temperature that cools the server 8 detected by the temperature sensor 201.
  • the peripheral circuit of the control device 200 is configured so that the opening degree of the expansion valve 11 and the rotation speed of the compressor 9 are adjusted so that the target superheat degree and the target server intake air temperature are reached by the digital signal of each information of the calculation result in the control device 200.
  • the rotational speed of the condenser fan 13 is controlled.
  • the air cooled by the evaporator 12 flows through the flow path 2r of the front door 2 through the upper and lower ducts 4a and 4b, and is warmed by cooling the server 8.
  • the warmed air is cooled by the evaporator 12, moves to the flow path 2 r of the front door 2 through the upper and lower ducts 4 a and 4 b, and returns to the windward side of the server 8 again.
  • the structure which incorporates the evaporator 12 and the door fan 14 may be sufficient.
  • the door fan 14 is disposed upstream of the cooling air from the evaporator 12.
  • a side plate of the electronic device cooling device R or a door that can be opened and closed is installed, and the evaporator 12 and the door fan 14 are installed on the side plate or the side door. Also good.
  • FIG. 4 is a perspective view illustrating a configuration of the electronic device cooling apparatus according to the first modification of the embodiment, and illustrates a state in which the front door and the rear door are opened.
  • FIG. 5 is a cross-sectional view of the electronic device cooling apparatus during the cooling operation in which the front door and the rear door of the first modification are closed as viewed from the left side from the front.
  • An arrow a1 in FIG. 5 indicates the flow of air circulating in the storage chamber 5
  • an arrow a2 indicates the flow of air passing through the heat dissipation chamber 7.
  • the electronic device cooling device 2R of Modification 1 has a three-layer structure in the vertical direction from top to bottom and has two refrigeration cycles. .
  • the electronic device cooling apparatus 2R has two refrigeration cycles, a first refrigeration cycle and a second refrigeration cycle, the first refrigeration cycle is disposed on the front side, and the second refrigeration cycle is disposed on the back side.
  • Other configurations are the same as those of the electronic device cooling apparatus R of the first embodiment.
  • the electronic device cooling device 2R includes a storage chamber 5 that is disposed in the middle stage and accommodates the server 8, the evaporators 12a and 12b, a heat radiation chamber 7 that is disposed in the upper stage and accommodates the condensers 10a and 10b, and is compressed in the lower stage. It is divided into a machine room 6 in which the machines 9a and 9b, the expansion valves 11a and 11b and the like are accommodated, and has a three-layer structure divided into three in the vertical direction.
  • the storage chamber 5 is sealed from another chamber so that heat does not enter and exit in order to cool the server 8 to a desired temperature.
  • Openings 16a and 16b are respectively provided at locations facing the heat radiation chamber 7 and the machine room 6 of the front door 2 and the rear door 3, respectively. Through the openings 16a and 16b, the air that has absorbed the heat of the condenser 10 in the heat radiating chamber 7 and the air that has absorbed the heat of the compressor 9 in the machine chamber 6 can be circulated with ambient air (indoor air). Has been.
  • a first door fan 14 a and a first evaporator 12 a are installed in the flow path 2 r of the front door 2 of the storage chamber 5, and the rear surface of the storage chamber 5
  • a second evaporator 12 b and a second door fan 14 b are installed in the flow path 3 r of the side door 3.
  • a first condenser 10a and a first condenser fan 13a are arranged on the front side, and a second condenser 10b and a second condenser fan are arranged on the rear side. 13b.
  • a first compressor 9a and a first expansion valve 11a are disposed on the front side, and a second compressor 9b and a second expansion valve 11b are disposed on the back side. Is arranged.
  • the first compressor 9a in the machine room 6 the first condenser 10a in the heat radiating room 7, and the first expansion valve 11a in the machine room 6 are used.
  • the first evaporator 12a of the storage chamber 5 is sequentially connected by the refrigerant pipe ha.
  • the second compressor 9b in the machine chamber 6 As the second refrigeration cycle, on the back side of the electronic device cooling device 2R, the second compressor 9b in the machine chamber 6, the second condenser 10b in the heat radiating chamber 7, the second expansion valve 11b in the machine chamber 6, and storage
  • the second evaporator 12b of the chamber 5 is sequentially connected by the refrigerant pipe hb.
  • the electronic device cooling device 2R detects the outside air temperature sensor 202 that detects the temperature of the outside air as a sensor that detects the air temperature, and the temperature of the air entering the server 8 for cooling the server 8 in the storage chamber 5.
  • the temperature sensor 201 is provided.
  • Each of the sensors 204a is provided.
  • the electronic device cooling device 2R is based on the temperatures detected by the sensors described above, and the first and second compressors 9a and 9b, the first and second condenser fans 13a and 13b, and the first and second compressors.
  • a control device (not shown) is provided for adjusting the rotational speed (number of rotations) of the door fans 14a and 14b and the opening degrees of the first and second expansion valves 11a and 11b. The control device performs the same control as the control device 200 of the first embodiment.
  • the air that cools the server 8 includes the first door fan 14a, the first evaporator 12a, the server 8, the second evaporator 12b, the second door fan 14b, the upper and lower ducts 4a, 4b,
  • the server 8 is cooled by circulating to the first door fan 14a.
  • the electronic device cooling apparatus 2R the case where two refrigeration cycles are provided on the front side and the back side is illustrated, but the two refrigeration cycles are replaced with a front side and a back side, and a right side portion and a left side portion are provided. May be provided.
  • FIG. 6 shows an electronic device cooling device provided with one refrigeration cycle on the back side
  • FIG. 7 shows an electronic device cooling device 2R2 provided with one refrigeration cycle on the side portion side.
  • FIG. 8 is a perspective view showing the configuration of the electronic device cooling apparatus of Modification 2 of the embodiment of the present invention, and shows a state in which the front door is opened.
  • FIG. 9 is sectional drawing which looked at the state at the time of the cooling operation which closed the front side door and the back side door of the electronic device cooling device of the modification 2 from upper direction.
  • the arrow b1 in FIGS. 8 and 9 indicates the flow of air circulating in the storage chamber 35, and the arrow b2 in FIG. 8 indicates the flow of air passing through the heat dissipation chamber 7.
  • the electronic device cooling device 3R of the second modified example horizontally moves the air that cools the server 8 in the storage chamber 35 (see the broken line arrow b1 in FIGS. 8 and 9). It is configured to circulate.
  • Other configurations of the electronic device cooling apparatus 3R of the third embodiment are the same as those of the electronic apparatus cooling device R of the first embodiment.
  • the electronic device cooling device 3R of Modification 2 is arranged in the middle stage, the storage chamber 35 in which the server 8, the evaporator 32, and the like are housed, and the condenser 10 in the upper stage.
  • the condenser 10 in the upper stage.
  • a heat radiating chamber 7 in which the components are stored and a machine chamber 6 in which the compressor 9, the expansion valve 11 and the like are disposed in the lower stage and are divided into three parts in the vertical direction.
  • the upper radiating chamber 7 is provided with a condenser 10 constituting a refrigeration cycle and a condenser fan 13 for sucking outside air and radiating heat of the condenser fan 13.
  • a compressor 9 and an expansion valve 11 are arranged in the lower machine chamber 6.
  • the evaporator 32 and the door fan 34 are arranged so that air for cooling the server 8 circulates in the horizontal direction (see arrow b1 in FIG. 9). Is installed on the side plate kd1.
  • the compressor 9 in the machine room 6, the condenser 10 in the heat radiating room 7, the expansion valve 11 in the machine room 6, and the evaporator 32 in the storage room 35 are sequentially connected by the refrigerant pipe h3 (see FIG. 8), and the refrigeration cycle is performed. Forming.
  • the electronic device cooling device 3R since air for cooling the server 8 circulates in the horizontal direction, upper and lower ducts 4a and 4b provided above and below the server 8 in the storage chamber 35 (see FIGS. 1 and 2). ) Is not necessary.
  • the evaporator 32 is disposed on the side plate kd1, and therefore the evaporator 10 installed in the condenser 10 in the heat radiating chamber 7 and the side plate kd1 in the storage chamber 35.
  • the door fan 34, the compressor 9 and the expansion valve 11 in the machine room 6, and the refrigerant pipe h3 can be provided as one replaceable part P having a U-shape when viewed from the front or the rear.
  • the electronic device cooling device 3R even when the front door 2 or the rear door 3 is opened, the evaporator 32 is disposed on the side plate kd1 on the side, so that the evaporator 32 serves as the heat source server 8. Therefore, the influence on the cooling performance of the server 8 can be reduced as much as possible.
  • the evaporator 32 is installed on the side plate kd1 on the side and the front side. Since it is not installed on the side door 2 or the back side door 3, the condensed water adhering to the evaporator 32 jumps to the place where the air that cools the server 8 enters the server 8 by opening and closing the front side door 2 or the back side door 3. Hateful. Therefore, it is possible to suppress the condensed water from adhering to the server 8.
  • the vertical space of the server 8 can be increased, and the server 8 can be expanded (stacked) in the vertical direction. .
  • the refrigeration cycle is two refrigeration cycles, a first refrigeration cycle and a second refrigeration cycle, and as shown by a two-dot chain line in FIG.
  • the first evaporator 32a and the second evaporator 32b may be installed in the storage chamber 35.
  • the control feature of the electronic device cooling device R is that the cooling operation of the electronic device cooling device R is not performed when the front door 2 or the rear door 3 is closed while the server 8 is being cooled in the storage room. It suppresses becoming stable.
  • the target superheat degree that is the control target value or the target superheat degree and the input of the server 8 is triggered by the opening of the front door 2 or the rear door 3 while the server 8 is being cooled in the storage room.
  • Control for changing the target server intake air temperature, which is the target value of the air temperature is performed as follows.
  • the target superheat degree is a control target value of (exit temperature ⁇ inlet temperature) of the evaporator 12.
  • the outlet temperature of the evaporator 12 is detected by a temperature sensor 204 (see FIG. 2), and the inlet temperature of the evaporator 12 is detected by a temperature sensor 203.
  • the target server inlet temperature is a control target value of the inlet temperature for cooling the server 8 detected by the temperature sensor 201 (see FIG. 2).
  • the server 8 is controlled in the temperature in the outside air state.
  • the compressor 9 is controlled to achieve the target set temperature.
  • the target superheat degree of the target set value of the superheat degree is used for control when the front side door 2 or the rear side door 3 is opened while the inside of the storage chamber 5 is being cooled. And the target server inlet temperature of the target set value of the inlet temperature of the server 8 is changed.
  • the liquid refrigerant may return to the compressor 9.
  • the target superheat degree is increased from the set value when the front door 2 or the rear door 3 is closed. Thereby, it is suppressed that the liquid state refrigerant returns to the compressor 9.
  • the increase in the target superheat degree is made larger when the outside air temperature is low than when the outside air temperature is high. This is because the refrigerant is less likely to evaporate when the outside air temperature is low, and the liquid refrigerant is more likely to return to the compressor 9 than when the outside air temperature is high. Thereby, it can suppress effectively that the refrigerant
  • the evaporator 12 when the outside air temperature is high, the evaporator 12 is more likely to condense than when the outside air temperature is low. Therefore, it is desirable that the increase in the degree of superheat is lower than when the outside air temperature is low. is there. Therefore, the condensation of the evaporator 12 is effectively suppressed.
  • Table 1 shows a target that is a control target of the degree of superheat when the front door 2 or the rear door 3 is opened when the target server inlet temperature that is the target set temperature of the inlet of the server 8 is 25 ° C.
  • Table 1 shows a case where the target server inlet temperature is 25 ° C., and the amount of change in the target superheat degree shown in Table 1 may change depending on the target server inlet temperature.
  • the amount of change that is an increase in the target superheat degree is set larger than when the outside air temperature is higher than the target set temperature 25 ° C. .
  • the compressor 9 rotates too much when the outside air temperature is high, or the rotation is insufficient when the outside air temperature is low. It is necessary to suppress. Further, it is necessary to prevent the refrigerant in the liquid state from returning to the compressor 9 when the opened front side door 2 or back side door 3 is closed.
  • the target set value of the inlet temperature of the server 8 detected by the temperature sensor 201 that detects the inlet temperature of the air for cooling the server 8 in the storage room 5 (35) to the server 8 is set.
  • Table 2 shows the target server inlet temperature of the server when the front door 2 or the rear door 3 is opened when the target server inlet temperature, which is the target set temperature of the inlet of the server 8, is 25 ° C. An example of the amount of change is shown. Table 2 shows a case where the target server inlet temperature is 25 ° C., and the amount of change in the target server inlet temperature shown in Table 2 may vary depending on the target server inlet temperature.
  • the change amount of the target server intake air temperature is set to (outside air temperature ⁇ 25) / 2 following the change in the outside air temperature from 45 ° C. to 10 ° C.
  • the data of Table 1 and Table 2 are stored in a table or the like.
  • the data in Tables 1 and 2 is merely an example, and other data may be used.
  • FIG. 10 is a flowchart showing basic control when the door is opened in the cooling operation of the electronic device cooling apparatus.
  • the front and rear doors 2 and 3 are closed, and the normal cooling operation of the server 8 is performed in the storage chamber 5.
  • the change amount of the increase in the target superheat degree according to the outside air temperature is acquired from the information in Table 1 stored in a table or the like, added to the target superheat degree value of the initial value, and according to the outside air temperature Reset the target superheat. Further, the change amount of the target server intake temperature corresponding to the outside air temperature is acquired from the information in Table 2 stored in a table or the like, and added to the initial value of the target server inlet temperature, and the change is made according to the outside air temperature.
  • the target server inlet temperature is reset (S103).
  • the opening degree of the expansion valve 11 is calculated and obtained so as to achieve the reset target superheat degree.
  • the opening degree of the expansion valve 11 is narrowed.
  • the opening degree of the expansion valve 11 is widened.
  • the rotational speed of the compressor 9 and the rotational speed of the condenser fan 13 are calculated and obtained so as to reach the reset target server inlet temperature (S104).
  • the normal cooling operation shifts to the next operation. That is, the expansion valve 11 is controlled so as to obtain the opening degree obtained in S104, the compressor 9 is operated so as to obtain the rotational speed obtained in S104, and the condenser fan so as to obtain the rotational speed obtained in S104. 13 is operated (S105).
  • the degree of superheat is equal to the reset target degree of superheat (Yes in S107)
  • control device 200 performs control when the door of the electronic device cooling device R described below is opened.
  • FIG. 11 is a flowchart showing control for resetting only the target superheat degree in the control when the door is opened in the cooling operation of the electronic device cooling apparatus.
  • the front and rear doors 2 and 3 are closed, and the cooling operation of the server 8 is performed in the storage chamber 5.
  • the front door opening / closing detection sensor 205a detects that the front door 2 is opened
  • / or the back door opening / closing detection sensor 205b detects that the rear door 3 is opened (see FIG. 11).
  • the outside air temperature sensor 202 obtains the value of the outside air temperature of 35 ° C., the target superheat degree of 5 ° C. when the door (2, 3) as the control target is closed (initial value)
  • the server 8 The target server inlet temperature 25 ° C. when the door (2, 3), which is the target set temperature of the inlet temperature, is closed (initial value) is acquired (S202).
  • the amount of change from the target superheat degree of 5 ° C. corresponding to the target server inlet temperature value of 25 ° C. and the outside air temperature of 35 ° C. is the target server inlet temperature of 25 ° C. stored in a table or the like.
  • change amount 2 degreeC is acquired, change amount 2 degreeC is added to the value of the target superheat degree 5 degreeC of an initial value, and the target superheat degree 7 degreeC according to outside temperature is reset ( S203).
  • the opening degree of the expansion valve 11 is calculated so that the target superheat degree 7 ° C. reset in S203 is obtained (S204). Subsequently, from the normal cooling operation, the expansion valve 11 is moved to the opening calculated in S204, and the cooling operation is performed (S205).
  • the opening degree of the expansion valve 11 is adjusted so as to become the target superheat degree 7 ° C. (S209), and the process proceeds to S206.
  • the target superheat degree is set higher, the opening degree of the expansion valve 11 is narrowed.
  • the target superheat degree is set lower, the opening degree of the expansion valve 11 is widened.
  • the process proceeds to S206.
  • the rotational speed of the compressor 9 and the rotational speed of the condenser fan 13 satisfy the target server inlet temperature 25 ° C. (S210). Thereafter, the process proceeds to S206.
  • the above is control which resets only the target superheat degree in control at the time of door opening.
  • the target superheat degree and the target are set under the conditions that the outside air temperature is 35 ° C., the target server inlet temperature 25 ° C. and the target superheat degree 5 ° C. of the normal cooling operation in which the front door 2 and the rear door 3 are closed. This is control for resetting the server inlet temperature.
  • FIG. 12 is a flowchart showing control for resetting the degree of superheat and the server inlet temperature when the door is opened in the cooling operation of the electronic device cooling apparatus at an outside air temperature of 35 ° C. As shown in FIG. 2, during the normal cooling operation, the front and rear doors 2 and 3 are closed, and the server 8 is cooling in the storage chamber 5.
  • the outside air temperature value (35 ° C.) is acquired by the outside air temperature sensor 202, and the doors (2, 3), which are control targets in the state where the front and rear side doors 2, 3 are closed, are closed.
  • An air temperature value (25 ° C.) is acquired (S302).
  • the opening degree of the expansion valve 11 is calculated and obtained so that the reset target superheat degree becomes 7 ° C. Since the target superheat degree is 7 ° C. and 2 ° C. is higher than the initial value, the opening degree of the expansion valve 11 is narrowed. Further, the rotational speed of the compressor 9 and the rotational speed of the condenser fan 13 are increased so that the initial target server inlet temperature 25 ° C. becomes the reset target server inlet temperature 30 ° C. It is obtained by calculation (S304).
  • the normal cooling operation shifts to the next operation. That is, the opening of the expansion valve 11 is controlled to be narrowed so that the opening of the expansion valve 11 obtained in S304 is obtained. Further, the compressor 9 is operated so as to achieve the increased rotational speed determined in S304, and the condenser fan 13 is operated so as to achieve the rotational speed determined in S304 (S305). As a result, it is possible to prevent the compressor 9 from rotating excessively when returning to the normal cooling operation later, and the liquid refrigerant from entering the compressor 9. Subsequently, it is determined whether the front door 2 and / or the rear door 3 are opened (S306).
  • the opening degree of the expansion valve 11 is adjusted to be the target superheat degree 7 ° C. (S309).
  • the rotation speed of the compressor 9 and the rotation speed of the condenser fan 13 are determined based on the server inlet temperature.
  • the air temperature is adjusted to 30 ° C. (S310). Thereafter, the process proceeds to S306.
  • the process proceeds to S306.
  • the above is the degree of superheat when the door is opened under the conditions that the outside air temperature is 35 ° C., the target server inlet temperature 25 ° C. for the normal cooling operation in which the front and rear doors 2 and 3 are closed, and the target superheat degree 5 ° C. This is a control flow for resetting the inlet temperature.
  • FIG. 13 is a flowchart showing control for resetting the degree of superheat when the door is opened in the cooling operation of the electronic device cooling apparatus at an outside air temperature of 15 ° C., and the server inlet temperature.
  • the front and rear doors 2 and 3 are closed, and the normal cooling operation of the server 8 is performed in the storage chamber 5.
  • the outside air temperature sensor 202 obtains the outside air temperature value (15 ° C.), and the target superheat degree, which is a control target when the front and rear doors 2 and 3 are closed (initial value).
  • the value (5 ° C.) and the value (25 ° C.) of the target server inlet temperature when the door (2, 3), which is the target set temperature of the inlet temperature of the server 8, is closed (initial value) are acquired ( S402).
  • the opening degree of the expansion valve 11 is calculated and obtained so that the reset target superheat degree is 11 ° C. Since the target superheat degree is 11 ° C. and 6 ° C. is higher than the initial value, the opening degree of the expansion valve 11 is narrowed. Further, the rotational speed of the compressor 9 and the rotational speed of the condenser fan 13 are lowered so that the initial target server inlet temperature 25 ° C. becomes the reset target server inlet temperature 20 ° C. (S404).
  • the normal cooling operation shifts to the next operation. That is, the opening degree of the expansion valve 11 is controlled to be narrowed so as to be the opening degree of the expansion valve 11 obtained in S404. Further, the compressor 9 is operated so as to be the rotational speed obtained in S404, and the condenser fan 13 is operated so as to be the rotational speed obtained in S404 (S405). Thereby, insufficient rotation of the compressor 9 when returning to the normal cooling operation later and liquid refrigerant entering the compressor 9 are suppressed.
  • the opening degree of the expansion valve 11 is adjusted to become the target superheat degree 11 ° C. (S409).
  • the server intake air temperature is equal to the target server intake air temperature 20 ° C. (S408). .
  • the rotation speed of the compressor 9 and the rotation speed of the condenser fan 13 are the target server inlet temperature.
  • the server inlet temperature is adjusted to 20 ° C. (S410). Thereafter, the process proceeds to S406.
  • the process proceeds to S406.
  • the above is to reset the degree of superheat when the door of the electronic device cooling device R is opened and the server inlet temperature under the conditions of the server inlet air 15 ° C., the target server inlet temperature 25 ° C. of the normal cooling operation, and the target superheat degree 5 ° C. This is the flow of control.
  • the return of the refrigerant in the liquid state to the compressor 9 is more likely to occur when the outside air temperature is lower than the target server inlet temperature, but the target superheat degree is determined by the outside air temperature being the target server inlet temperature. Since the lower case is set higher than the higher case, it is possible to more reliably prevent the liquid refrigerant from returning to the compressor 9. Therefore, the reliability of the compressor 9 and the reliability of the cooling performance of the electronic device cooling device R can be improved. In addition, condensation is more likely to occur when the outside temperature is higher than when the outside temperature is low, but the amount of increase in the target superheat degree is lower than when the outside temperature is low, so that condensation can be suppressed in advance.
  • the target server inlet temperature is changed to follow the outside air temperature so that it is close to the outside air temperature, so that the doors (2, 3) are opened. It is possible to prevent the storage room 5 from being overcooled when the outside air temperature is high when the outside air temperature is high after being closed and overheating of the storage room 5 when the outside air temperature is low.
  • the compressor 9 can be prevented from being rotated excessively, and the compressor 9 can be prevented from being damaged.
  • the opened front side door 2 and / or back side door 3 are closed, it is possible to promptly shift to a normal cooling operation when the door is closed. Therefore, damage to the blades caused by high-speed rotation of the compressor 9 can be suppressed, the reliability of the compressor 9 can be improved, and the operating life can be extended.
  • the target server inlet temperature is changed to follow the outside air temperature so as to be close to the outside air temperature, it is possible to suppress the liquid refrigerant from returning to the compressor 9 when the doors (2, 3) are closed. .
  • the rotation speed of the compressor 9 is changed to a higher value when the door is closed, and when the outside temperature is lower than the target server inlet temperature, the door is closed.
  • the rotation speed of the compressor 9 is changed to a low value.
  • the rotation speed of the compressor 9 when the door is closed is prevented from exceeding a predetermined rotation speed (first predetermined rotation speed), or the outside air temperature is the target.
  • first predetermined rotation speed the rotational speed of the compressor 9 when the door is closed
  • second predetermined rotational speed the rotational speed of the compressor 9 when the door is closed
  • the electronic device cooling device R (2R, 2R1, 2R2, 3R) has been described. It is also possible to provide a cooling housing in which the space of the room is arranged, or a cooling housing in which the space of the storage room for cooling is arranged in the upper stage, and the space of the heat radiating and machine room in which the heat radiating room and machinery are accommodated in the lower stage. Is possible.
  • a cooling housing is arranged in a space where a heat radiating chamber is provided in the upper stage and provided with a heat radiating part, a space storage room provided in the middle stage and provided with a cooling target and a cooling part for cooling the cooling target, and a lower stage. And a machine room in a space where the machinery is provided. Or it can be set as the structure provided with the cooling object and the cooling part which cools this cooling object arranged in the upper stage, and the heat radiation and machine room of the space arranged in the lower stage and provided with the heat dissipation part and machinery. As a result, it is possible to provide a cooling housing that is excellent in thermal characteristics, maintainability, and controllability.
  • the electronic apparatus cooling device R (2R, 2R1, 2R2, 3R) having a high reliability in cooling performance and its control method can be realized by the configuration described above, regardless of the opening of the door.
  • the present invention is not limited to the above-described embodiments and modifications, and includes various embodiments.
  • the above-described embodiments and modification examples are merely illustrative of the present invention, and are not necessarily limited to those having all the configurations described.
  • a part of the configuration described may be included.

Abstract

La présente invention concerne un dispositif (R) de refroidissement d'appareil électronique comportant un compresseur (9), un condenseur (10), un moyen de décompression (11) et un évaporateur (12) qui constituent un cycle de réfrigération permettant de refroidir un appareil électronique (8) et qui sont raccordés par des conduites (h). L'appareil électronique (8) disposé à l'intérieur d'une chambre de logement (5) est refroidi au moyen d'air refroidi par l'évaporateur (12). Le dispositif (R) de refroidissement d'appareil électronique comprend : des portes (2, 3) qui ouvrent et ferment la chambre de logement (5) ; des moyens de détection d'ouverture/fermeture (205a, 205b) de portes qui détectent l'ouverture et la fermeture des portes (2, 3) ; un moyen de détection de température d'entrée (203) qui détecte la température de frigorigène au niveau d'une entrée d'évaporateur ; un moyen de détection de température de sortie (204) qui détecte la température de frigorigène au niveau d'une sortie d'évaporateur ; et un moyen de régulation (200) qui régule le frigorigène. Lorsque les moyens de détection d'ouverture/fermeture (205a, 205b) de portes détectent l'ouverture des portes (2, 3), le moyen de régulation (200) modifie un degré cible de surchauffe, qui constitue une valeur cible de régulation du degré de surchauffe obtenu par déduction de la température de frigorigène d'entrée d'évaporateur à la température de frigorigène de sortie d'évaporateur, vers une valeur supérieure à la valeur cible de surchauffe correspondant à l'état fermé des portes (2, 3).
PCT/JP2014/053564 2014-02-14 2014-02-14 Dispositif de refroidissement d'appareil électronique et son procédé de commande WO2015121995A1 (fr)

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IT201800003529A1 (it) * 2018-03-14 2019-09-14 Dkc Europe S R L Armadio rack informatico

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JP2002261219A (ja) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd 半導体素子の冷却装置
JP2005030679A (ja) * 2003-07-14 2005-02-03 Mitsubishi Electric Corp 冷凍空調装置及び冷凍空調装置の制御方法
JP2011155301A (ja) * 2011-05-02 2011-08-11 Hitachi Plant Technologies Ltd 電子機器の冷却システム
JP2013258166A (ja) * 2012-06-11 2013-12-26 Hitachi Ltd 電子機器装置およびその筺体
JP2014022377A (ja) * 2012-07-12 2014-02-03 Nec Corp 冷却制御装置、冷却制御システム、冷却制御方法、及び、冷却制御プログラム

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Publication number Priority date Publication date Assignee Title
JP2002261219A (ja) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd 半導体素子の冷却装置
JP2005030679A (ja) * 2003-07-14 2005-02-03 Mitsubishi Electric Corp 冷凍空調装置及び冷凍空調装置の制御方法
JP2011155301A (ja) * 2011-05-02 2011-08-11 Hitachi Plant Technologies Ltd 電子機器の冷却システム
JP2013258166A (ja) * 2012-06-11 2013-12-26 Hitachi Ltd 電子機器装置およびその筺体
JP2014022377A (ja) * 2012-07-12 2014-02-03 Nec Corp 冷却制御装置、冷却制御システム、冷却制御方法、及び、冷却制御プログラム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201800003529A1 (it) * 2018-03-14 2019-09-14 Dkc Europe S R L Armadio rack informatico

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