WO2015114742A1 - Dispositif de refroidissement d'appareil électronique - Google Patents

Dispositif de refroidissement d'appareil électronique Download PDF

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Publication number
WO2015114742A1
WO2015114742A1 PCT/JP2014/051882 JP2014051882W WO2015114742A1 WO 2015114742 A1 WO2015114742 A1 WO 2015114742A1 JP 2014051882 W JP2014051882 W JP 2014051882W WO 2015114742 A1 WO2015114742 A1 WO 2015114742A1
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Prior art keywords
compressor
evaporator
chamber
drain water
electronic device
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PCT/JP2014/051882
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English (en)
Japanese (ja)
Inventor
陽子 國眼
佐々木　重幸
繁裕 椿
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株式会社日立製作所
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Priority to PCT/JP2014/051882 priority Critical patent/WO2015114742A1/fr
Publication of WO2015114742A1 publication Critical patent/WO2015114742A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0212—Condensation eliminators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754—Air circulating in closed loop within cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades

Definitions

  • the present invention relates to an electronic device cooling apparatus for cooling an electronic device such as a server device.
  • An apparatus equipped with an electronic device such as an integrated circuit needs to be cooled because operation may become unstable and malfunction may occur when the temperature of the electronic device rises due to heat generation.
  • an air in the apparatus is cooled below the dew point temperature by cooling, drain water is generated, and the water adheres to the electronic device, which may damage the electronic device.
  • Patent Document 1 Japanese Patent No. 4660427
  • a storage chamber for storing a heating element and a cooling unit in which a refrigerant circuit is configured by a compressor, a condenser, an expansion valve, an evaporator, and the like are provided.
  • a cooling device that cools the heating element by circulating to the storage chamber includes a control device that controls the valve opening of the expansion valve and controls the operation of the compressor based on the air temperature in the storage chamber.
  • the control device performs an evaporation temperature control operation for controlling the valve opening degree of the expansion valve based on the evaporation temperature of the refrigerant in the evaporator so that the evaporation temperature becomes a predetermined condensation avoidance temperature capable of avoiding condensation on the heating element.
  • Patent Document 1 describes that “the refrigerant is stored in the evaporator 16 from the cooling chamber 15 in which the evaporator 16 is disposed by maintaining the evaporation temperature of the refrigerant at a temperature higher than a predetermined dew condensation avoiding temperature. It is possible to cool the server 2 while effectively avoiding the inconvenience that dew condensation occurs in the server 2 or the like as a heating element in the storage chamber 4 due to a marked decrease in the temperature of the cool air discharged into the chamber 4. Is possible "(paragraph 0048).
  • the amount of heat generated by the electronic device cooling device varies depending on operating conditions such as calculation processing. Since the amount of fluctuation increases as more electronic devices are mounted, it is important for a user who wants to store more servers in the electronic device cooling device to cool the fluctuating heating element to a uniform temperature without unevenness. .
  • the expansion valve is controlled so that the evaporator inlet temperature becomes the dew condensation avoidance temperature, but a specific method for determining the dew condensation avoidance temperature of the air in the storage having different dew points depending on the humidity is disclosed. Furthermore, when the temperature distribution occurs in the storage chamber as described above, it is not possible to determine the dew condensation avoidance temperature.
  • the air in the storage room before the cooling is started is ambient air, and there is a possibility that the amount of moisture is large when the surroundings of the apparatus are installed in a high temperature / high humidity environment.
  • the heat exchanger condenses due to cooling, and if this moisture is present in the storage chamber, it may be scattered to the electronic device and cause a problem.
  • the present invention has been made in order to solve the above-described conventional technical problems, and suppresses occurrence of temperature unevenness in the housing when the electronic device is cooled, and condensation water adheres to the electronic device.
  • An object of the present invention is to provide an electronic device cooling apparatus that prevents the above-described problem.
  • the present application includes a plurality of means for solving the above-mentioned problems.
  • a storage chamber for storing an electronic device and a compressor that is a space for storing a compressor and is located below the storage chamber.
  • a housing having a chamber and a first opening / closing door installed on the side of at least one housing so as to be openable / closable; and provided in the first opening / closing door;
  • a first evaporator that absorbs heat; a first compressor that is housed in the compressor chamber and that compresses the refrigerant that has passed through the first evaporator; and a lower part of the first evaporator,
  • a first drain water collecting means for collecting the drain water generated in the first evaporator and leading it to the compressor chamber.
  • the electronic device cooling device of the present invention provides an electronic device cooling device that suppresses the generation of a temperature village in the casing when the electronic device is cooled and prevents condensation water from adhering to the electronic device. be able to.
  • FIG. 1 It is a perspective view which shows the structure of the electronic device cooling device of 1st Example which concerns on this invention. It is a figure which shows the II-II cross section of FIG. 1 about the electronic cooling device of 1st Example which concerns on invention. It is a figure which shows the detailed structure of the drain water moving means of FIG. 2 about the electronic cooling device of 1st Example which concerns on this invention. It is a control flow figure of the electronic cooling device of the 1st example concerning the present invention. It is a block diagram of a control system in the cooling operation of the electronic cooling device of the first embodiment according to the present invention. It is sectional drawing which shows the structure of the electronic cooling device of 2nd Example which concerns on this invention.
  • FIGS. 1 to 7 an electronic device cooling apparatus according to first to second embodiments of the present invention will be described in detail with reference to FIGS. 1 to 7.
  • a server is housed and cooled as an electronic device
  • an electronic device other than the server may be used as long as the electronic device generates heat by operation.
  • FIG. 1 is a perspective view showing a configuration of the electronic device cooling apparatus 0 of the present embodiment, and shows a state in which the front door 2 and the rear door 3 are opened.
  • the electronic device cooling apparatus 0 of the present embodiment stores a storage chamber 5 that stores a server 8, a condenser chamber 7 that stores a condenser, a condenser fan 13 provided on the ceiling surface of the casing, and a compressor. And a compressor chamber 6, and a duct 4 is provided in the storage chamber 5 at the ceiling and the bottom, respectively.
  • the back side door 3 is provided with an evaporator 12 that cools the air in the storage chamber 5, and the front side door 2 and the back side door 3 are provided with openings 16, in the condenser chamber 7 and in the compressor chamber.
  • the air in 6 can be circulated with the surrounding air.
  • FIG. 2 is a diagram showing a cross section during the cooling operation of the electronic device cooling apparatus 0 of FIG. 1 with the front door 2 and the rear door 3 closed.
  • the solid arrows in FIG. 2 indicate the flow of air circulating in the storage chamber 5, and the white arrows indicate the flow of air passing through the condenser chamber 7.
  • the casing of the electronic device cooling device 0 is composed of a cabinet 1, a front door 2, and a rear door 3.
  • the rear door 3 includes an evaporator 12 and a door fan 14, and the evaporator 12 can exchange heat with the air circulating in the housing.
  • the casing of the electronic device cooling device 0 is divided into a condenser chamber 7, a storage chamber 5, and a compressor chamber 6.
  • ducts 4 are provided at the ceiling and bottom, respectively, and a server 8 is mounted as an electronic device in the other space.
  • a plurality of servers 8 are stacked and arranged, but may be arranged alone in a part of the storage chamber 5.
  • Each server 8 is provided with a blower 15, and the internal heat generating components can be cooled by circulating the surrounding air.
  • the duct 4 connects the flow path passing through the front door 2 and the flow path provided in the back door 3 and passing through the evaporator 11. It has become. Further, the opening 16 provided in the front door 2 and the back door 3 allows the air in the condenser chamber 7 and the compressor chamber 6 to circulate with the ambient air.
  • a condenser 10 and a condenser fan 13 are arranged in the condenser chamber 7, and a compressor 9 and an expansion valve 11 are arranged in the compressor chamber 6, and the compressor 9, the condenser 10, and the expansion valve 11 are arranged.
  • the evaporator 12 is sequentially connected by a refrigerant pipe to form a back side refrigeration cycle.
  • a flexible tube is used for a part of the pipe connecting the evaporator 12 and the expansion valve 10 and a part of the pipe connecting the evaporator 12 and the compressor 9.
  • the bottom of the evaporator 12 is provided with a drain pan 100 having an inclined bottom plate, and a guide 106 for moving drain water to the duct 4 at the bottom of the storage chamber 5 is connected to the inclined portion of the bottom plate.
  • the drain pan 100 is disposed at a position higher than the duct 4 at the bottom of the storage chamber 5, and the tip of the guide 106 is disposed in the duct 4 at the bottom of the storage chamber 5. Further, the duct 4 at the bottom of the storage chamber 5 has a part of the surface where the storage chamber 5 and the compressor chamber 6 are in contact with each other, the storage chamber 5 and the compressor chamber 6 communicate with each other, and the compressor 9 is disposed.
  • the structure is such that the water storage tank 102 is connected by a guide 101. Further, a water leakage sensor 103 is provided on the wall surface of the water storage tank 102.
  • FIG. 3 is a diagram showing a detailed configuration of the water storage tank 102 of the electronic cooling device of the present embodiment.
  • drain water from the duct is collected in the water storage tank 102 via the guide 101.
  • a compressor 9 is disposed in the water storage tank 102, and the drain water can be naturally evaporated by the surface of the high-temperature compressor 9.
  • a water leakage sensor 103 is provided on the inner wall of the water storage tank 102. When the water leakage sensor 103 detects moisture, the user is notified of the information, and the user opens the valve 105 so that the moisture is electronically cooled. 0 can be released to the outside.
  • the compressor 9 is a variable capacity compressor capable of capacity control.
  • a piston type, a rotary type, a scroll type, a screw type, or a centrifugal type can be adopted.
  • the compressor 9 is a scroll type compressor, capacity control is possible by inverter control, and the rotational speed is variable from low speed to high speed.
  • the R410A refrigerant is charged in the refrigeration cycle, for example, HFO1234yf, R134a, and the like can be used, and the refrigerant is not limited here.
  • the condenser chamber 7 is provided with a blower 18 so that heat can be exchanged between the outside air flowing in from the openings provided in the upper portions of the front door 2 and the rear door 3 and the condenser 10.
  • the electronic device cooling device 0 includes an outside air temperature sensor 202 and a storage room temperature sensor 201 as sensors for detecting the air temperature.
  • sensors for detecting the refrigerant temperature a sensor 203 for detecting the evaporator inlet temperature and a sensor 204 for detecting the compressor suction temperature are provided.
  • the electronic device cooling apparatus 0 of the present embodiment adjusts the rotation speed of the compressor 9, the condenser fan 13, and the evaporator fan 12, and the opening degree of the expansion valve 11, based on the temperatures detected by the above-described sensors.
  • a control device 200 (not shown) is provided (see FIG. 4 for the operation flow of the control device 200).
  • the refrigerant that has been pressurized by the compressor 9 to become a high-temperature and high-pressure gas is sent to the condenser 10.
  • the refrigerant sent to the condenser 10 dissipates heat to the outside air in the process of passing through the condenser 10, and changes in phase from a gas to a two-phase state and to a liquid.
  • the refrigerant passes through the expansion valve 11 and is depressurized to be in a low-pressure two-phase state.
  • the refrigerant that has entered the low-pressure two-phase state then absorbs heat from the air in the storage chamber 5 in the process of passing through the evaporator 12, changes again from the two-phase state to gas, and is returned to the compressor 9. .
  • the air around the server 8 is taken into the server by a blower 15 built in the server 8 and becomes high temperature due to exhaust heat of the server 8.
  • the air that has passed through the server 8 passes through the evaporator 12 by the fan 14 built in the back side door 3, is cooled, and is sent to the front side door 2 through the duct 4. That is, the air cooled by the evaporator 12 flows through the storage chamber 5 and is warmed by cooling the server 8.
  • the warmed air is cooled by the evaporator 12, then moves through the duct 4 toward the front door 2, and returns to the windward side of the server 8.
  • FIG. 5 shows a block diagram of a control system in the cooling operation of the electronic cooling device of the present embodiment.
  • the control system of the electronic device cooling apparatus 200 includes a control apparatus 200, a sensor 201 that detects a server inlet temperature, a sensor 202 that detects an outside temperature, and a temperature that detects a refrigerant temperature at an evaporator inlet.
  • a sensor 203 and a temperature sensor 204 for detecting the refrigerant temperature on the suction side of the compressor are provided.
  • the temperature detected by each sensor is described with the same reference numeral as the sensor.
  • the server inlet temperature 201 is the temperature of the air that flows into the storage chamber 5 in order to cool the server 8 that is an electronic device.
  • the control device 200 is constituted by a microcomputer, and temperature data detected by each of the temperature sensors is input to the control device 200.
  • the target air inlet temperature is set to cool the air circulating in the housing. Therefore, regardless of the room temperature of the room in which the electronic device cooling device 0 is installed, the electronic devices such as the server 8 disposed in the electronic device cooling device 0 can be cooled with cooling air having a desired temperature. Specifically, the actual server intake air temperature is detected by the sensor 201 and the outside air temperature is detected by the sensor 202, and the rotation speed of the compressor 9 and the opening degree of the expansion valve 11 are set so as to reach the target server intake air temperature set by the user. To control.
  • the control system of the electronic device cooling apparatus 0 uses the temperature detected by each temperature sensor and the target server inlet temperature, and follows the control flow described later to open the expansion valve 11 and rotate the compressor 9. Control number and.
  • FIG. 4 shows a control flow of the compressor 9 and the expansion valve 11 in the cooling operation of this embodiment.
  • the control device 200 reads the target server intake air temperature set by the user from the memory in the control device (S1). Further, the actual server inlet temperature is detected by the sensor 201, and the outside temperature is detected by the sensor 202 (S1). As described above, the target server inlet temperature is configured so that the user can change the setting as appropriate. Next, based on the target inlet temperature, the rotational speed of the compressor 9 and the opening of the expansion valve 11 are determined (S2), and the operation of the compressor 9 and the expansion valve 11 is started (S3).
  • the degree of superheat (compressor suction temperature 204 ⁇ evaporator inlet temperature 203) of the rear side cycle is confirmed (S4), and if it is within the target range, the process proceeds to the next step. If the degree of superheat in the rear-side cycle deviates from the target value, the expansion valve is adjusted to correct the target value (S5).
  • the server inlet temperature 201 is confirmed (S6), and if it is the target value, the operation is continued as it is, but if it is outside the target value, the rotation speed of the compressor 9 is adjusted (S7), Return to the superheat degree confirmation (S4) again As described above, the electronic device cooling apparatus 0 of the present embodiment cools the server 8 with the circulating air. Condensation does not occur above the moisture of the air, and there is a low possibility that the server 8 will malfunction due to drain water.
  • the air in the storage chamber 5 is condensed when cooled by the evaporator 12. This produces drain water.
  • the drain water is collected by the drain pan 100 at the bottom of the evaporator 12 and moves to the duct 4 at the bottom of the storage chamber 5 through the guide 101. Since the duct 4 communicates with the water storage tank 102 in the compressor room, the drain water moved to the duct 4 is collected in the water storage tank 102.
  • the duct 4 is partially open to the compressor chamber 6, if the amount of drain water in the water storage tank is higher than the connection position of the pipe 104 by being connected to the water storage tank 102 by the pipe 104, In addition, air does not flow between the compressor chamber 6 and the storage chamber 5.
  • the water in the water storage tank increases due to the operation for a long time and the water leakage sensor 103 detects moisture, the information is notified to the user, and the user opens the valve 105 to remove the moisture from the electronic cooling device 0. Can be released.
  • the drain water can be effectively moved from the bottom of the evaporator 12 of the back side door 3 which is a movable part to the duct 4 by the drain pan 100 and the guide 101. Even when opening and closing, leakage of drain water can be suppressed.
  • the compressor 9 since the compressor 9 is arranged in the water storage tank 102, the drain water naturally evaporates from the surface of the high-temperature compressor 9, and when the drain water is low, the cooling operation can be continued without maintenance. Further, when the water cooled by the evaporator 12 touches the surface of the compressor 9, an increase in the temperature of the compressor 9 can be suppressed, and the reliability of the compressor can be improved.
  • a simple structure such as a general server rack can prevent dust and dust from entering, but when operating for a long time in a high-temperature and high-humidity environment, the air around the device is taken into the cabinet, and these air Is cooled by the evaporator, there is a possibility that drain water is generated under the evaporator. For this reason, it is necessary to consider not only the air originally present in the storage chamber but also the moisture of the ambient air flowing in from the gaps between the devices.
  • the present embodiment it is possible to suppress the leakage of drain water from an evaporator installed in a movable part such as a door and to reduce the surface temperature of the compressor, thereby increasing the temperature.
  • -A highly efficient and highly reliable electronic device cooling apparatus that cools a heating element uniformly even in a high humidity environment can be provided at low cost. This makes it possible to cool electronic devices evenly, even when the amount of heat generated is such that multiple servers are stacked and housed in the housing, or when the device is installed in a high-temperature, high-humidity environment. It is possible to provide a cooling device that can cool an electronic device with high efficiency without causing condensation.
  • FIG. 6 is an example of a configuration diagram showing an electronic device cooling apparatus 0 ′ according to the second embodiment of the present invention.
  • the casing of the electronic device cooling device 0 ' is composed of a cabinet 1, a front door 2, and a rear door 3.
  • the front door 2 includes an evaporator 12a and a fan 14a
  • the rear door 3 includes an evaporator 12b and a fan 14b.
  • the evaporators 12a and 12b can exchange heat with the air circulating in the housing. It has become.
  • the cabinet 1 is provided with a condenser chamber 8, a server storage chamber 5, and a duct 4, and a server 8 is mounted in the storage chamber 5.
  • the compressor 9a, the condenser 10a, the expansion valve 11a, and the evaporator 12a are sequentially connected by a refrigerant pipe to form a front side refrigeration cycle
  • the compressor 9b, the condenser 10b, the expansion valve 11b, and the evaporator 12b are formed by a refrigerant pipe. They are sequentially connected to form a back side refrigeration cycle
  • the electronic device cooling apparatus 0 ′ of the present embodiment has two refrigeration cycles.
  • a flexible tube is used for a part of the pipe connecting the evaporators 12a and 12b and the expansion valves 11a and 11b and a part of the pipe connecting the evaporators 12a and 12b and the compressors 9a and 9b.
  • a drain pan 100a with an inclined bottom plate is provided below the front-side evaporator 12a, and a guide 101a for moving drain water to the duct 4 at the bottom of the storage chamber 5 is connected to the inclined portion of the bottom plate. Yes.
  • a front side water leakage sensor 103a is arranged at the lower end of the bottom plate of the drain pan 100a.
  • a drain pan 100b having an inclined bottom plate is also provided below the back side evaporator 12b.
  • the drain pans 100a and 100b are arranged at a position higher than the duct 4 at the bottom of the storage chamber 5, and the tips of the guides 101a and 101b are arranged in the duct 4 at the bottom of the storage chamber 5.
  • the duct 4 at the bottom of the storage chamber 5 has a part of the surface where the storage chamber 5 and the compressor chamber 6 are in contact with each other, and allows the storage chamber 5 and the compressor chamber 6 to communicate with each other.
  • the structure is connected to the water storage tank 102a or 102b in which the compressor 9b is disposed.
  • the water storage tanks 102a and 102b are connected by a pipe 106, and each drain water can be circulated.
  • a water leakage sensor 103b is provided on the wall surface of the water storage tank 102b in which the rear side compressor is disposed.
  • the electronic device cooling apparatus 0 ′ includes a sensor 201 that detects the server inlet temperature and a sensor 202 that detects the outside air temperature as sensors that detect the air temperature, and the front side cycle as a sensor that detects the refrigerant temperature.
  • the electronic device cooling device 0 ′ of the present embodiment is based on the temperatures detected by the sensors that detect the air temperature and the sensors that detect the refrigerant temperature, and the rotation speeds of the compressors 9a and 9b and the expansion valves 11a, A control device 200 ′ (control block, refer to FIG. 7 and FIG. 8 for the control flow) for adjusting the opening degree of 11b is provided.
  • the flow of the refrigerant is the same as in Example 1, it is omitted.
  • the flow of air circulating in the electronic device cooling device 0 ′ will be described below.
  • the air around the server 8 is taken into the server by a blower 15 built in the server 8 and becomes high temperature due to exhaust heat of the server 8.
  • the air that has moved to the duct 4 passes through the evaporator 12a by the fan 14a built in the front door 2, is cooled for the second time, and is discharged to the suction side of the server 8.
  • the electronic device cooling device 0 ′ of the present embodiment forms a circulating flow in which the air in the casing flows through the evaporator 12a, the storage chamber 5, and the evaporator 12b, and circulates back to the evaporator 12a.
  • FIG. 7 shows a control flow of the compressor 9 and the expansion valve 11 in the cooling operation of this embodiment.
  • the basic operation of the cooling operation in the present embodiment shown in FIG. 7 is the same as the control flow described in the first embodiment, but the control targets are the compressors 9a and 9b, the expansion valves 11a and 11b, the condensation These are dexterous fans 13a and 13b. Further, the adjustment amount of the rotational speeds of the front-side compressor 9a and the rear-side compressor 9b in S9 in the figure is the same rotational speed.
  • FIG. 8 shows a block diagram of a control system in the cooling operation and the dehumidifying operation of the electronic cooling device of the present embodiment.
  • the main operation is the same as in the first embodiment. That is, the server inlet temperature is detected by the sensor 201 and the outside air temperature is detected by the sensor 202, and the rotation speed of the compressor 9 and the opening degree of the expansion valve 11 are controlled so as to reach the target server inlet temperature. Also, in order for the compressor 9 to operate correctly, the degree of superheat (compressor suction temperature 204 ⁇ evaporator inlet temperature 203) of the rear side cycle is confirmed, and if the target value is exceeded, the expansion valve 11 is adjusted. And correct it to the target value. Further, the rotational speed of the condenser fan 13 is controlled to an appropriate value according to the rotational speed of the compressor 9.
  • the presence or absence of moisture is detected from the front side water leakage sensor 103b, and when moisture is detected, the electronic device cooling device 0 'performs the dehumidifying operation in addition to the cooling operation.
  • FIG. 9 shows a control flow of the compressor 9 and the expansion valve 11 in the dehumidifying operation of this embodiment.
  • the electronic device cooling apparatus 0 ′ of the present embodiment includes the front-side evaporator 12a on the wind of the server 8, condensation occurs in the evaporator 12a when the humidity of the air circulating in the storage chamber 5 is high. There is a possibility that the inconvenience of drain water adhering to the server 8 occurs.
  • the electronic device cooling apparatus 0 'of the present embodiment since the electronic device cooling apparatus 0 'of the present embodiment includes the front-side water leakage sensor 103a, it detects that condensation occurs in the front-side evaporator 12a and performs a dehumidifying operation.
  • FIG. 9 shows a control flow of the compressors 9a and 9b and the expansion valves 11a and 11b in the dehumidifying operation of this embodiment.
  • the control device 200 ′ switches the control of the electronic cooling device 0 ′ from the cooling operation to the dehumidifying operation.
  • the control device 200 ′ reads out the target server inlet temperature and target server humidity set by the user from the memory in the control device (S1). Further, the actual server inlet temperature is detected by the sensor 20, and the outside temperature is detected by the sensor 25 (S1).
  • the dew condensation temperature is a dew point temperature calculated based on the target server humidity and the target server intake air temperature assumed by the user. This condensation temperature can be obtained from an air diagram. Specifically, when the target server inlet temperature is 25 ° C. and the target server humidity is 30%, the condensation temperature is 6.2 ° C.
  • This predetermined time is a dehumidifying operation time determined by the volume of the storage chamber 5 and the flow rate of the circulating air, and is 120 seconds here.
  • the rear-side expansion valve 11b is adjusted to correct the target value (S7).
  • the superheat degree of the front-side cycle front-side evaporator outlet temperature 204a-evaporator inlet temperature 203a
  • the front-side expansion valve 11a is adjusted to correct it to the target value (S8).
  • the server inlet air temperature 201 is confirmed (S6), and if it is the target value, the operation is continued as it is, but if it is outside the target value, the rotation of the front side compressor 9a and the rear side compressor 9b Adjust the number (S9), and again check the back side evaporation temperature (back side evaporator inlet temperature) 203b and the front side cycle superheat (front side evaporator outlet temperature 204a-evaporator inlet temperature 203a) (S4, S5) Return to).
  • the amount of adjustment of the rotational speeds of the front-side compressor 9a and the rear-side compressor 9b is the same rotational speed.
  • the control device 200 switches the control operation from the dehumidifying operation to the cooling operation.
  • the electronic device cooling device 0 ' according to the present embodiment can obtain the effects described below by using the above-described structure and control method.
  • the back side evaporator 12b cools the air in the storage room 5 to the dew condensation temperature for a certain period of time, and if the air in the storage room 5 is higher than the target humidity, the back side evaporator 12b Condensation occurs and falls to the back side drain pan 100b, and is collected from there through the duct 4 to the water storage tank 102b.
  • the electronic device cooling device 0 ′ of the present embodiment avoids the moisture from adhering to the server 8 by performing the dehumidifying operation when the humidity of the air in the storage chamber 5 is high. Reliability can be maintained.
  • the electronic device cooling device 0 ′ of the present embodiment includes a mechanism and a control for appropriately treating drain water, and thus the front-side evaporator 12a and the rear-side evaporator 12b installed in the movable part.
  • Server 8 can be evenly distributed even in high-temperature and high-humidity environments by suppressing the leakage of drain water from the air and the surface temperature of the front compressor 9a and the rear compressor 9b. Therefore, it is possible to provide a highly efficient and highly reliable electronic device cooling apparatus that cools at a low cost.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention a pour objet un dispositif de refroidissement d'appareil électronique qui supprime la survenue d'une variation de température à l'intérieur d'un boîtier lors du refroidissement d'un appareil électronique, et empêche l'adhérence d'eau condensée sur l'appareil électronique. En vue de résoudre le problème susmentionné, un dispositif de refroidissement d'appareil électronique est caractérisé en ce qu'il comprend : un boîtier comprenant une chambre de réception destinée à recevoir un appareil électronique, une chambre de compresseur qui consiste en un espace recevant un compresseur et qui est située au-dessous de la chambre de réception, et au moins une première porte d'ouverture et de fermeture qui est placée de sorte à pouvoir se fermer sur une surface latérale du boîtier; un premier évaporateur qui est agencé sur la première porte d'ouverture et de fermeture, et qui absorbe, à l'aide d'un fluide frigorigène, la chaleur présente dans l'air circulant à l'intérieur de la chambre de réception; un premier compresseur qui est reçu à l'intérieur de la chambre de compresseur, et qui comprime le fluide frigorigène ayant passé à travers le premier évaporateur; et un premier moyen de collecte d'eau de drainage qui est disposé au-dessous du premier évaporateur, et qui collecte l'eau de drainage produite au niveau du premier évaporateur et guide celle-ci vers la chambre de compresseur.
PCT/JP2014/051882 2014-01-29 2014-01-29 Dispositif de refroidissement d'appareil électronique WO2015114742A1 (fr)

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Publication number Priority date Publication date Assignee Title
CN106852071A (zh) * 2016-12-28 2017-06-13 曙光节能技术（北京）股份有限公司 用于刀片服务器的液冷装置
US9854710B2 (en) 2015-11-04 2017-12-26 Fujitsu Limited Information processing device and container for data center
CN107803868A (zh) * 2017-11-30 2018-03-16 拓卡奔马机电科技有限公司 裁床裁剪系统的温度控制方法、装置及裁床裁剪系统
EP4188045A4 (fr) * 2020-07-28 2023-12-27 Huawei Technologies Co., Ltd. Armoire de dissipation de chaleur et appareil de communication

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JPH08316676A (ja) * 1995-05-15 1996-11-29 Hitachi Ltd 電子装置および筐体構造およびその冷却ユニット
JP2009134541A (ja) * 2007-11-30 2009-06-18 Sanyo Electric Co Ltd 電子機器冷却装置
JP2009157681A (ja) * 2007-12-27 2009-07-16 Sanyo Electric Co Ltd 電子機器冷却装置
JP2012145820A (ja) * 2011-01-13 2012-08-02 Canon Inc 画像形成装置

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JPH08316676A (ja) * 1995-05-15 1996-11-29 Hitachi Ltd 電子装置および筐体構造およびその冷却ユニット
JP2009134541A (ja) * 2007-11-30 2009-06-18 Sanyo Electric Co Ltd 電子機器冷却装置
JP2009157681A (ja) * 2007-12-27 2009-07-16 Sanyo Electric Co Ltd 電子機器冷却装置
JP2012145820A (ja) * 2011-01-13 2012-08-02 Canon Inc 画像形成装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9854710B2 (en) 2015-11-04 2017-12-26 Fujitsu Limited Information processing device and container for data center
CN106852071A (zh) * 2016-12-28 2017-06-13 曙光节能技术（北京）股份有限公司 用于刀片服务器的液冷装置
CN107803868A (zh) * 2017-11-30 2018-03-16 拓卡奔马机电科技有限公司 裁床裁剪系统的温度控制方法、装置及裁床裁剪系统
CN107803868B (zh) * 2017-11-30 2019-06-11 拓卡奔马机电科技有限公司 裁床裁剪系统的温度控制方法、装置及裁床裁剪系统
EP4188045A4 (fr) * 2020-07-28 2023-12-27 Huawei Technologies Co., Ltd. Armoire de dissipation de chaleur et appareil de communication

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