WO2015102420A1 - Dispositif de levage pour un appareil de transfert de substrat et appareil de transfert de substrat comprenant ce dernier - Google Patents

Dispositif de levage pour un appareil de transfert de substrat et appareil de transfert de substrat comprenant ce dernier Download PDF

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Publication number
WO2015102420A1
WO2015102420A1 PCT/KR2015/000005 KR2015000005W WO2015102420A1 WO 2015102420 A1 WO2015102420 A1 WO 2015102420A1 KR 2015000005 W KR2015000005 W KR 2015000005W WO 2015102420 A1 WO2015102420 A1 WO 2015102420A1
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WO
WIPO (PCT)
Prior art keywords
elevating
lifting
guide
support
substrate
Prior art date
Application number
PCT/KR2015/000005
Other languages
English (en)
Korean (ko)
Inventor
김종욱
김상현
김태현
윤대규
Original Assignee
현대중공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140000173A external-priority patent/KR101587336B1/ko
Priority claimed from KR1020140000199A external-priority patent/KR101587337B1/ko
Application filed by 현대중공업 주식회사 filed Critical 현대중공업 주식회사
Priority to CN201580011368.0A priority Critical patent/CN106062944B/zh
Publication of WO2015102420A1 publication Critical patent/WO2015102420A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Definitions

  • the present invention relates to a substrate transport apparatus for transporting a substrate and a substrate transport apparatus including the same.
  • display devices, solar cells, semiconductor devices, and the like are manufactured through various processes.
  • This manufacturing process is performed using a substrate for manufacturing the electronic component.
  • the manufacturing process may include a deposition process for depositing a thin film of a conductor, a semiconductor, a dielectric, and the like on the substrate, and an etching process for forming the deposited thin film in a predetermined pattern. These manufacturing processes take place in the process chambers carrying out the process.
  • the substrate transfer apparatus is for transferring the substrate between the process chambers.
  • FIG. 1 is a block diagram schematically illustrating a substrate transfer apparatus according to the prior art
  • FIG. 2 is a view schematically illustrating a lift unit of the substrate transfer apparatus according to the prior art.
  • the substrate transfer apparatus 1 includes a transfer arm 2 supporting a substrate, a lifting portion 3 for lifting the transfer arm 2, and the transfer arm 2. It consists of the turning part 8 for rotating.
  • the transfer arm 2 transfers the substrate toward a chamber (not shown) while supporting the substrate.
  • the transfer arm 2 transfers the substrate in the horizontal direction.
  • the transfer arm 2 is coupled to the lifting unit 3.
  • the lifting unit 3 raises and lowers the transfer arm 2. As the lifting section 3 lifts and lowers the transfer arm 2, the substrate is also lifted.
  • the lifting portion 3 is coupled to the turning portion 8.
  • the turning section 8 rotates the lifting section 3. As the revolving part 8 pivots the lifting part 3, the transfer arm 2 and the substrate rotate.
  • the elevating unit 3 includes an elevating unit 4, an elevating guide unit 5, an elevating guide block 6, and a supporting unit 7.
  • the lifting unit 4 is coupled to the pivot 8.
  • the elevating unit 4 rotates with the rotation of the pivot 8.
  • the lifting guide part 5 is coupled to the lifting unit 4.
  • the lifting guide portion 5 is formed extending in the lifting direction of the transfer arm (2).
  • the elevating guide part 5 guides the elevating guide block 6.
  • a plurality of lifting guides 5 may be coupled to the lifting unit 4.
  • two lifting guide parts 5a and 5b are coupled to the lifting unit 4.
  • the first elevating guide portion 5a and the second elevating guide portion 5b coupled to the elevating unit 4 are arranged side by side.
  • the first lifting guide part 5a and the second lifting guide part 5b are spaced apart from each other.
  • first elevating guide portion 5a and the second elevating guide portion 5b are spaced apart from each other, a portion where the first elevating guide portion 5a and the elevating unit 4 are coupled, and the The portion where the two lifting guide portions 5b and the lifting unit 4 are coupled to each other has a first separation distance GL.
  • the lifting guide block 6 is coupled to the lifting guide part 5.
  • the lifting guide block 6 moves up and down along the lifting guide part 5.
  • a first elevating guide block 6a is coupled to the first elevating guide portion 5a, and a second elevating guide block 6b is coupled to the second elevating guide portion 5b.
  • the support portion 7 connects the lifting guide block 6 and the transfer arm 2.
  • the lifting guide block 6 is coupled to one surface of the support 7, and the transfer arm 2 is coupled to the other surface.
  • a plurality of supports 7 may be coupled to the transfer arm 2. That is, the lifting guide part 5, the lifting guide block 6 and the support part 7 are arranged in a row in order.
  • the transfer arm 2 may be coupled to a first support portion 7a supporting the first lifting guide block 6a and a second support portion 7b supporting the second lifting guide block 6b. .
  • the first supporting portion 7a and the second supporting portion 7b are also spaced apart from each other.
  • a portion where the first support portion 7a and the transfer arm 2 are coupled to each other, and a portion where the second support portion 7b and the transfer arm 2 are coupled to each other have a second separation distance BL. .
  • the first separation distance GL and the second separation distance BL are the same. Is formed.
  • the transfer arm 2 is applied to the coupling portion between the lifting portion 3 and the transfer arm 2 while transferring the substrate.
  • This load may be a load due to torque generated when the transfer arm 2 sags in one direction by the load of the substrate.
  • a large load is applied at a portion where the support 7 and the transfer arm 2 are coupled to each other. Since the support part 7 includes the first support part 7a and the second support part 7b, the support arm 2 is supported at two points. In the case of two-point support in this way, the longer the distance between the support points, the more stable it can be supported.
  • the first support part 7a and the second support part 7b are supported by the transfer arm 2 and the second separation distance BL to be spaced apart from each other, in order to increase the second separation distance BL.
  • the first separation distance GL must also be large. Since the first separation distance GL is a distance between the first lifting guide part 5a and the second lifting guide part 5b, when the first separation distance GL becomes large, the lifting unit 4 It must be large. As the size of the lifting unit 4 increases, the load applied to the swinging portion 8 increases, so that the swinging portion 8 also needs to be larger to support the lifting unit 4.
  • the size of the entire substrate transfer apparatus 1 according to the prior art must be large. There was no.
  • the substrate transfer apparatus 1 according to the prior art occupies a lot of space, and thus the space efficiency of the work space in which the substrate transfer apparatus 1 according to the prior art is installed. There was a problem of deterioration.
  • the present invention has been made to solve the above-described problems, and to provide a lifting device for a substrate transfer device that can be stably coupled with the transfer arm and the lifting portion without increasing the size and a substrate transfer device including the same. .
  • the present invention may include the following configuration.
  • Lifting apparatus for a substrate transfer device includes a lifting unit for elevating the transfer arm so that the height of the transfer arm for transferring the substrate is changed; A first elevating guide part and a second elevating guide part coupled to the elevating unit and arranged in parallel with each other to guide the elevating of the transfer arm; A first elevating guide block including a first guide groove coupled to the first elevating guide portion, and elevating along the first elevating guide portion; And a second elevating guide block coupled to the second elevating guide unit and elevating along the second elevating guide unit.
  • the first guide groove and the second guide groove may be disposed to face each other.
  • Lifting apparatus for a substrate transfer device includes an elevating frame coupled to the elevating transfer arm for transporting the substrate; A driving unit coupled to the elevating frame to provide a driving force for elevating the transfer arm; A cover for blocking foreign substances generated from the driving unit from being scattered as the transfer arm is lifted; And a cover support part protruding from the lifting frame to support the cover.
  • the cover support and the lifting frame may be integrally formed.
  • the substrate transfer apparatus comprises a transfer arm for transferring a substrate; An elevating device for elevating the conveying arm so that the height at which the conveying arm is located is changed; A turning part for rotating the elevating device so that the direction in which the transfer arm is directed is changed; And a driving unit for moving the turning unit in the driving direction.
  • the elevating device is a first lifting guide portion and a second lifting guide portion which is arranged in parallel with each other to guide the lifting of the transfer arm, the first lifting up and down along the first lifting guide portion
  • the first elevating guide part and the second elevating guide part may be disposed between the first elevating guide block and the second elevating guide block.
  • the distance between the first elevating guide block and the second elevating guide block is greater than the distance between the first elevating guide portion and the second elevating guide portion, thereby allowing the support to stably support the transfer arm.
  • FIG. 1 is a block diagram schematically showing a substrate transfer apparatus according to the prior art
  • FIG. 2 is a schematic view showing the lifting portion of the substrate transfer apparatus according to the prior art
  • FIG. 3 is a schematic perspective view of a substrate transfer apparatus according to a first embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a lift apparatus for a substrate transfer apparatus according to a first embodiment of the present invention.
  • FIG. 5 is a schematic exploded cross-sectional view of a lift apparatus for a substrate transfer apparatus according to a first embodiment of the present invention.
  • FIG. 6 is a perspective view showing a substrate transfer apparatus according to a second embodiment of the present invention.
  • FIG. 7 is a perspective view illustrating a lifting device in the substrate transfer device of FIG. 6.
  • FIG. 8 is a cross-sectional view illustrating the lift apparatus of FIG. 7.
  • FIG. 8 is a cross-sectional view illustrating the lift apparatus of FIG. 7.
  • the substrate transfer apparatus 10 transfers the substrate (S).
  • the substrate S is for manufacturing electronic components such as a display device, a solar cell, and a semiconductor device.
  • the substrate S may be a glass substrate for manufacturing the electronic component.
  • the substrate S may be a metal substrate, a polyimide substrate, a plastic substrate, or the like.
  • the substrate S may be a bonded substrate in which two or more substrates are bonded to each other.
  • the substrate S is formed in a substantially square plate shape, but is not limited thereto and may be formed in various shapes.
  • the substrate S is manufactured through a manufacturing process such as a deposition process and an etching process in a process chamber.
  • the substrate transfer apparatus 10 transfers the substrate S to the process chamber.
  • the substrate transfer apparatus 10 according to the first embodiment of the present invention transfers the substrate S from the substrate cassette holding the substrate S to the process chamber.
  • the substrate transfer apparatus 10 according to the first embodiment of the present invention transfers the substrate S between a plurality of process chambers for performing different manufacturing processes.
  • the substrate transfer apparatus 10 includes a transfer arm 20 for transferring the substrate S and a height at which the transfer arm 20 is positioned.
  • Lifting device 100 for elevating the transfer arm 20 so that is changed, and the turning unit 30 for rotating the lifting device 100 so that the direction toward which the transfer arm 20 is changed. .
  • the elevating device 100 includes an elevating unit 110 for elevating the transfer arm 20, a first elevating guide portion 120 and a second elevating guide portion 130 coupled to the elevating unit 110.
  • the first lifting guide block 140 may be lifted along the first lifting guide part 120
  • the second lifting guide block 150 may be lifted along the second lifting guide part 130. .
  • the first elevating guide part 120 and the second elevating guide part 130 are coupled to the elevating unit 110.
  • the first elevating guide portion 120 and the second elevating guide portion 130 are coupled to the elevating unit 110 to be arranged in parallel with each other.
  • the first lifting guide part 120 and the second lifting guide part 130 are spaced apart from each other to have a first separation distance GL from each other and are coupled to the lifting unit 110.
  • the first lifting guide block 140 includes a first guide groove 141 coupled to the first lifting guide part 120
  • the second lifting guide block 150 includes the second lifting guide part ( It includes a second guide groove 151 coupled to 130.
  • the first elevating guide part 120 is inserted into the first guide groove 141, thereby being coupled to the first elevating guide block 140.
  • the second elevating guide part 130 is inserted into the second guide groove 151 to be coupled to the second elevating guide block 150.
  • the first guide groove 141 and the second guide groove 151 are disposed to face each other.
  • the first elevating guide portion 120 and the second elevating guide portion 130 are disposed between the first elevating guide block 140 and the second elevating guide block 150. Therefore, the separation distance between the first lifting guide block 140 and the second lifting guide block 150 is inevitably larger than the first separation distance GL.
  • first elevating guide block 140 and the second elevating guide block 150 is coupled to the transfer arm 20 through a plurality of supporting parts to be described later, the first elevating guide block 140 and the As the separation distance between the second lifting guide block 150 is greater than the first separation distance GL, the separation distance between the plurality of supporting parts and the portion to which the transfer arm 20 is coupled (hereinafter, referred to as a second separation distance)
  • the separation distance BL) may also be greater than the first separation distance GL.
  • the substrate transfer apparatus 10 according to the first embodiment of the present invention can achieve the following effects.
  • the transfer arm 20 transfers the substrate S
  • a large load is applied to a portion where the plurality of support parts and the transfer arm 20 are coupled to each other.
  • the plurality of support parts may stably support the transfer arm 20.
  • the substrate transfer apparatus 10 according to the first embodiment of the present invention may increase the second separation distance BL without increasing the first separation distance GL, compared to the related art. Accordingly, the substrate transfer apparatus 10 according to the first embodiment of the present invention may support the transfer arm 20 more stably than in the prior art. Therefore, in the substrate transfer apparatus 10 according to the first embodiment of the present invention, the coupling force between the transfer arm 20 and the plurality of supports is increased, so that the transfer arm 20 and the plurality of supports are separated. This can prevent damage.
  • the substrate transport apparatus 10 according to the first embodiment of the present invention may reduce the overall size as the first separation distance GL is formed to be smaller than the second separation distance BL. That is, even if the second separation distance BL is formed to be the same as in the prior art, the first separation distance GL is reduced compared to the prior art.
  • the first separation distance GL is a distance between the first lifting guide part 120 and the second lifting guide part 130, and when the first separation distance GL is decreased, the first lifting guide GL It is possible to reduce the size of the lifting unit 110 is coupled to the portion 120 and the second lifting guide portion 130.
  • the substrate transport apparatus 10 according to the first embodiment of the present invention is reduced in overall size as the size of the lifting unit 110 is reduced. Therefore, the space occupied by the substrate transfer apparatus 10 according to the first embodiment of the present invention is reduced, thereby increasing the space efficiency of the workspace in which the substrate transfer apparatus 10 according to the first embodiment of the present invention is disposed. You can.
  • the transfer arm 20 transfers the substrate S.
  • the transfer arm 20 transfers the substrate S while supporting the substrate S.
  • the transfer arm 20 moves toward the substrate S before supporting the substrate S.
  • the transfer arm 20 transfers the substrate S.
  • the transfer arm 20 may transfer the substrate S in a straight line.
  • the transfer arm 20 is coupled to the lifting device 100.
  • the transfer arm 20 may include an arm base 21, an arm unit 22, and a support hand 23.
  • the arm base 21 is coupled to the lifting device 100 to be lifted.
  • the arm base 21 is elevated by the elevating device 100. Accordingly, the height at which the transfer arm 20 is located may be changed.
  • the arm unit 22 is movably coupled to the arm base 21. One end of the arm unit 22 is coupled to the arm base 21, and the other end is coupled to the support hand 23. As the arm unit 22 moves, the support hand 23 may move together.
  • the arm unit 22 may move the support hand 23 in a straight line.
  • the arm unit 22 may include at least one arm mechanism.
  • the arm unit 22 may move the support hand 23 in a straight line by using a plurality of arm mechanisms that rotate in different directions.
  • the present invention is not limited thereto, and the support hand 23 may be moved in a straight line by using a female mechanism moving in a straight line.
  • the arm unit 22 may include a first arm mechanism 221 and a second arm mechanism 222.
  • the first arm mechanism 221 is rotatably coupled to the arm base 21. One end of the first arm mechanism 221 is coupled to the arm base 21, and the other end is coupled to the second arm mechanism 222.
  • the second arm mechanism 222 is rotatably coupled to the first arm mechanism 221. One end of the second arm mechanism 222 is coupled to the first arm mechanism 221, and the other end is coupled to the support hand 23.
  • the support hand 23 is rotatably coupled to the second arm mechanism 222.
  • the support hand 23 supports the substrate S.
  • the first arm mechanism 221, the second arm mechanism 222, and the support hand 23 allow the support hand 23 to move in a straight line while rotating at different rotation ratios. Accordingly, the transfer arm 20 may transfer the substrate S supported by the support hand 23 in a straight line.
  • the first arm mechanism 221 and the second arm mechanism 222 are coupled to rotate at different heights. That is, the first arm mechanism 221 is coupled to the upper surface of the arm base 21, and the second arm mechanism 222 is coupled to the upper surface of the first arm mechanism 221. By such a combination, the first arm mechanism 221 and the second arm mechanism 222 rotate at different heights. On the contrary, the first arm mechanism 221 may be coupled to the bottom surface of the arm base 21, and the second arm mechanism 222 may be coupled to the bottom surface of the first arm mechanism 221. In this case, the first arm mechanism 221 and the second arm mechanism 222 rotate at different heights.
  • the substrate transfer apparatus 10 according to the first embodiment of the present invention may be implemented to transfer a plurality of substrates (S).
  • the substrate transfer apparatus 10 according to the first embodiment of the present invention may include a plurality of transfer arms 20.
  • the substrate transport apparatus 10 according to the first embodiment of the present invention may be two. It may include two transfer arms (20). That is, it may include two support hands 23.
  • the two transfer arms 20 may be coupled to the lifting device 100 to be arranged side by side with respect to the lifting direction. For example, one transfer arm 20 is disposed below, and the other transfer arm 20 is disposed above.
  • the two support hands 23 may support and transport the substrate S at different heights based on the lifting direction.
  • the first arm mechanism 221 is installed on the arm base 21, and the second arm mechanism 222 is disposed on the first arm mechanism 221 in the transfer arm 20 positioned below the two transfer arms 20. Is installed. On the contrary, the first arm mechanism 221 is installed under the arm base 21 and the second arm mechanism 222 is installed under the first arm mechanism 221 in the transfer arm 20 positioned above.
  • the elevating device 100 elevates the transfer arm 20. Accordingly, the lifting device 100 may change the height at which the transfer arm 20 is located.
  • the elevating apparatus 100 elevates the transfer arm 20 to a height at which the substrate S to be supported by the transfer arm 20 is located. After the transfer arm 20 supports the substrate S, the substrate S is elevated as the lifting device 100 lifts the transfer arm 20. That is, the elevating apparatus 100 elevates the substrate S to a height at which the process chamber is located.
  • the elevating device 100 may elevate the transfer arm 20 by a gear method using a motor, a rack gear, a pinion gear, and the like.
  • the elevating apparatus 100 may transfer the belt by a belt method using a motor, a pulley and a belt, a ball screw method using a motor and a ball screw, and a linear motor method using a coil and a permanent magnet.
  • the arm 20 may be raised and lowered.
  • the lifting device 100 includes a lifting unit 110, a first lifting guide part 120 and a second lifting guide part 130 coupled to the lifting unit 110.
  • the lifting unit 110 raises and lowers the transfer arm 20.
  • the lifting unit 110 supports the lifting guide parts 120 and 130.
  • the lifting unit 110 may be formed in a pillar shape so as to support the lifting guide parts 120 and 130. That is, the lifting unit 110 is formed to extend in the lifting direction of the transfer arm 20.
  • the pivot unit 30 and the transfer arm 20 are coupled to the lifting unit 110.
  • the elevating unit 110 is coupled to the swing portion 30, and rotates by the swing portion (30).
  • the transfer arm 20 is coupled to the lifting unit 110 so as to be lifted.
  • the elevating unit 110 may include a first elevating unit (110a) coupled to the turning unit (30).
  • the elevating unit 110 may further include a second elevating unit 110b coupled to the elevating unit 110a to elevate.
  • the transfer arm 20 is liftably coupled to the second lifting unit 110b.
  • the second lifting unit 110b may be omitted.
  • the transfer arm 20 may be coupled to the first lifting unit 110a to be elevated.
  • the first elevating guide part 120 and the second elevating guide part 130 are coupled to the elevating unit 110.
  • the first lifting guide part 120 and the second lifting guide part 130 are coupled to the lifting unit 110 in parallel with each other.
  • the first lifting guide part 120 and the second lifting guide part 130 are spaced apart from each other and are coupled to the lifting unit 110.
  • the first lifting guide part 120 and the second lifting guide part 130 are spaced apart from each other to have a first separation distance GL and are coupled to the lifting unit 110. Since the first elevating guide portion 120 and the second elevating guide portion 130 should be disposed between the first elevating guide block 140 and the second elevating guide block 150, the elevating unit 110 ) Is formed with a protrusion 111 to which the first lifting guide part 120 and the second lifting guide part 130 are coupled.
  • the protrusion 111 protrudes from the elevating unit 110 toward the transfer arm 20.
  • the first lifting guide part 120 and the second lifting guide part 130 are coupled to the protrusion 111 so as to protrude in different directions.
  • the first lifting guide part 120 protrudes from the protrusion 111 toward the first lifting guide block 140.
  • the second lifting guide portion 130 protrudes from the protrusion 111 toward the second lifting guide block 150.
  • the first lifting guide block 140 is coupled to the first lifting guide part 120.
  • the first lifting guide block 140 includes the first guide groove 141.
  • the first elevating guide part 120 is inserted into the first guide groove 141, so that the first elevating guide part 120 and the first elevating guide block 140 are coupled to each other.
  • the second lifting guide block 150 is coupled to the second lifting guide part 130.
  • the second lifting guide block 150 includes the second guide groove 151.
  • the second lifting guide part 130 is inserted into the second guide groove 151, so that the second lifting guide part 130 and the second lifting guide block 150 are coupled to each other.
  • the first elevating guide block 140 and the second elevating guide block 150 are disposed such that the first guide groove 141 and the second guide groove 151 face each other. As a result, the first elevating guide portion 120 and the second elevating guide portion 130 are disposed between the first elevating guide block 140 and the second elevating guide block 150.
  • the first support part 160 supports the first lifting guide block 140.
  • the first support portion 160 connects the first lifting guide block 140 and the transfer arm 20.
  • the first support unit 160 connects the first lifting guide block 140 and the arm base 21 of the transfer arm 20.
  • the first support part 160 includes a first support member 161 and a first support member 162.
  • the first support member 161 and the first support member 162 support different surfaces of the first lifting guide block 140.
  • the first supporting member 161 is disposed between the first lifting guide block 140 and the transfer arm 20.
  • the first supporting member 161 connects the first lifting guide block 140 and the transfer arm 20 between the first lifting guide block 140 and the transfer arm 20.
  • the first support member 162 protrudes from the first support member 161.
  • the first support member 162 protrudes from the first support member 161 toward the lifting unit 110.
  • the first support member 162 may be formed to protrude between one end and the other end of the first support member 161.
  • the first support member 162 supports the opposite side of the portion of the first lifting guide block 140 in which the first guide groove 141 is formed. As a result, the first lifting guide block 140 is disposed between the first support member 162 and the first lifting guide part 120.
  • the first support member 162 may support the first lifting guide block 140 to prevent the first lifting guide block 140 from being separated from the first lifting guide part 120. That is, the first support member 162 allows the first lifting guide part 120 and the first lifting guide block 140 to be more stably coupled. Therefore, according to the substrate transfer apparatus 10 according to the first embodiment of the present invention, the first elevating guide portion 120 and the first elevating guide block 140 may be more firmly coupled.
  • the first support member 161 and the first support member 162 may be integrally formed using extrusion molding.
  • the first support member 162 supports the first elevating guide block 140 and may receive a large load due to the structure protruding from the first support member 161. Therefore, the substrate transport apparatus 10 according to the first embodiment of the present invention integrally forms the first support member 161 and the first support member 162 by extrusion molding to support the first support member. Even if a large load is applied to 162, the first support member 162 and the first support member 161 are prevented from being separated.
  • the first support part 160 may include a light weight groove 163 formed through the first support member 161.
  • the first support portion 160 is coupled to the first lifting guide block 140 and the transfer arm 20, and the first support portion 160 and the by the weight of the first support portion 160 itself
  • a load is applied to the coupling portion between the first lifting guide block 140 and the coupling portion between the first support portion 160 and the transfer arm 20.
  • the lightweight groove 163 may reduce the weight of the first support part 160 as it is formed through the first support part 160. Accordingly, the lightweight groove 163 is coupled to the coupling portion between the first support portion 160 and the first lifting guide block 140 and the coupling portion between the first support portion 160 and the transfer arm 20. The load applied can be reduced.
  • the first support part 160 may further include a through groove 164 formed through the first support member 161 such that a seal member blocking contaminants passes through the first support member 161. have. Since the first lifting guide block 140 and the first supporting part 160 must move while being lifted, an open moving space is required. Contaminants generated between the first elevating unit 110a and the first elevating guide block 140 may be scattered to the outside because the moving space is open. When such contaminants are scattered and reach the substrate S, the substrate S cannot be used as a defective product. Therefore, the seal member is disposed in the moving space to block the moving space. The seal member may hinder the movement of the first lifting guide block 140 and the first support part 160. Accordingly, the through hole 164 is provided in the first support part 160 so that the seal member can pass therethrough. Since the seal member penetrates through the through hole 164, the first lifting guide block 140 and the first support part 160 may move and move up and down without interference. In this case, the seal member may block the moving space to prevent the pollutants from scattering to the outside.
  • the second support part 170 includes a second support member 171 and a second support member 172.
  • the second supporting member 171 and the second supporting member 172 support different surfaces of the second lifting guide block 150.
  • the second supporting member 171 is disposed between the second lifting guide block 150 and the transfer arm 20.
  • the second supporting member 171 connects the second lifting guide block 150 and the transfer arm 20 between the second lifting guide block 150 and the transfer arm 20.
  • the second support member 172 is formed to protrude from the second support member 171.
  • the second support member 172 is formed to protrude from the second support member 171 toward the lifting unit 110.
  • the second support member 172 may be formed to protrude between one end and the other end of the first support member 161.
  • the second supporting member 172 supports the opposite side of the portion where the second guide groove 151 is formed in the second lifting guide block 150.
  • the second lifting guide block 150 is disposed between the second support member 172 and the second lifting guide part 130.
  • the second support member 172 may support the second lifting guide block 150 to prevent the second lifting guide block 150 from being separated from the second lifting guide part 130. That is, the second support member 172 allows the second lifting guide part 130 and the second lifting guide block 150 to be more stably coupled. Therefore, according to the substrate transfer apparatus 10 according to the first embodiment of the present invention, the second lifting guide portion 130 and the second lifting guide block 150 may be more firmly coupled.
  • the second support member 171 and the second support member 172 may be integrally formed using extrusion molding.
  • the second supporting member 172 supports the second lifting guide block 150 and may receive a large load due to the structure protruding from the second supporting member 171. Therefore, the substrate transfer apparatus 10 according to the first embodiment of the present invention integrally forms the second support member 171 and the second support member 172 by extrusion molding, thereby forming the second support member. Even if a large load is applied to the 172, the second support member 172 and the second support member 171 is prevented from being separated.
  • the second support part 170 may include a lightweight groove 173 formed through the second support member 171 and a seal member that blocks contaminants to pass through the second support member 171. It may include a through groove 174 formed through the support member 171. The description of the lightweight groove 173 and the through groove 174 is replaced by the description of the lightweight groove 163 and the through groove 164 of the first support part 160.
  • the first support part 160 and the second support part 170 connect the first lifting guide block 140, the second lifting guide block 150, and the transfer arm 20, respectively.
  • the first support part 160 and the second support part 170 are spaced apart from each other and are coupled to the transfer arm 20.
  • a portion where the first support portion 160 and the transfer arm 20 are coupled, and a portion where the second support portion 170 and the transfer arm 20 are coupled to each other have a second separation distance BL.
  • the second separation distance BL may eventually be a portion at which the first support member 161 and the arm base 21 are coupled, and a portion at which the second support member 171 and the arm base 21 are coupled to each other. Means the distance between.
  • the second separation distance BL is proportional to a degree in which the first support part 160, the second support part 170, and the transfer arm 20 stably support the load of the substrate S. That is, when the second separation distance BL increases, the coupling force between the first support part 160, the second support part 170, and the transfer arm 20 increases. As the first elevating guide portion 120 and the second elevating guide portion 130 is disposed between the first elevating guide block 140 and the second elevating guide block 150, the second separation distance BL is larger than the first separation distance GL.
  • the pivot 30 rotates the transfer arm 20.
  • the transfer arm 20 moves the support hand 23 and the substrate S supported by the support hand 23 in a straight line.
  • the pivot 30 may change the moving direction of the support hand 23 and the substrate S by rotating the transfer arm 20.
  • the pivot 30 is coupled to the lifting device 100. Therefore, when the turning part 30 rotates, the lifting device 100 coupled to the turning part 30 and the transfer arm 20 coupled to the lifting device 100 rotate.
  • the pivot unit 30 may include a pivot frame and a driving unit to rotate the pivot frame.
  • the pivot frame is coupled to the lifting device 100.
  • the pivot frame rotates about the pivot axis.
  • the driving unit generates a driving force for rotating the pivot frame.
  • the pivot frame rotates by the driving unit rotating the pivot shaft.
  • the driving unit may include a motor generating a driving force, and a speed reducer transmitting the driving force of the motor to the pivot shaft.
  • the speed reducer amplifies the driving force of the motor and transmits it to the pivot shaft.
  • the motor and the reducer may be connected using a pulley and a belt.
  • the motor and the reducer may be directly connected.
  • the substrate transport apparatus 10 may further include a travel unit 40 for moving the transport arm 20 along a travel direction.
  • the driving part 40 is coupled to the turning part 30.
  • the driving unit 40 moves the turning unit 30, the lifting device 100 and the transfer arm 20 coupled to the turning unit 30 move.
  • the traveling part 40 moves the substrate S supported by the transfer arm 20 in the traveling direction.
  • the driving unit 40 may move the turning unit 30 by a gear method using a motor, a rack gear, a pinion gear, and the like.
  • the traveling part 40 may move the turning part 30 by a belt method using a motor, a pulley and a belt, a ball screw method using a motor and a ball screw, and a linear motor method using a coil and a permanent magnet. have.
  • FIG. 6 is a perspective view illustrating a substrate transfer apparatus according to a second embodiment of the present invention
  • FIG. 7 is a perspective view illustrating a lift apparatus in the substrate transfer apparatus of FIG. 6,
  • FIG. 8 is a cross-sectional view illustrating the lift apparatus of FIG. 7.
  • the substrate transfer apparatus 50 is for transferring the substrate (S).
  • the substrate S is for manufacturing electronic components such as a display device, a solar cell, and a semiconductor device.
  • the substrate S may be a glass substrate for manufacturing the electronic component.
  • the substrate S may be a metal substrate, a polyimide substrate, a plastic substrate, or the like.
  • the substrate S may be a bonded substrate in which two or more substrates are bonded to each other.
  • the substrate transfer apparatus 50 according to the second embodiment of the present invention may transfer the substrate S between process chambers that perform a manufacturing process such as a deposition process or an etching process for the substrate S.
  • the substrate transfer apparatus 50 according to the second embodiment of the present invention may transfer the substrate S between the process chambers and the cassette in which the substrate S is stored.
  • the substrate transfer apparatus 50 includes a transfer arm 60 for transferring the substrate S, and an elevation for lifting the transfer arm 60.
  • the lifting device 90 has a lifting frame 91 to which the transfer arm 60 is liftably coupled, a driving unit 92 coupled to the lifting frame 91, and a cover 93 for preventing foreign matter from scattering. And a cover support 94 for supporting the cover.
  • the transfer arm 60 is elevated by being coupled to the lifting frame 91 by the driving unit 92.
  • the cover 93 prevents foreign matters generated from the driver 92 from scattering.
  • the substrate transfer apparatus 50 according to the second embodiment of the present invention may block foreign matters generated from the driver 92 from scattering. Therefore, the substrate transfer device 50 according to the second embodiment of the present invention can prevent contamination of the substrate S and the surrounding environment by blocking foreign matters from scattering, and thus deteriorate the quality of the substrate. It can prevent.
  • the transfer arm 60 transfers the substrate S.
  • the transfer arm 60 is coupled to the lifting device 90. Accordingly, the transfer arm 60 may be rotated together as the lifting device 90 is rotated by the pivot 70.
  • the transfer arm 60 may include an arm base 61, an arm body 62, an arm unit 63, and a support hand 64.
  • the arm base 61 is coupled to the lifting device 90 to be lifted.
  • the arm base 61 is elevated by the elevating device 90. Accordingly, the height at which the transfer arm 60 is located may be changed.
  • the female body 62 is coupled to the female base 61.
  • the arm body 62 may be coupled to the other side of the arm base 61.
  • the arm unit 63 is movably coupled to the arm body 62. As the arm unit 63 moves, the support hand 64 may move together. The arm unit 63 may move the support hand 64 in a straight line. In this case, the arm unit 63 may move the support hand 64 in a straight line by moving in a straight line. Although not shown, the arm unit 63 may rotate to move the support hand 64 in a straight line.
  • the arm unit 63 may include a first arm mechanism 63a and a second arm mechanism 63b.
  • the first arm mechanism 63a is movably coupled to the arm body 62.
  • the first arm mechanism 63a may move in a ball screw manner using a motor and a ball screw.
  • the first arm mechanism (63a) is a gear method using a motor, a rack gear (pinion gear), etc., a belt method using a motor, a pulley and a belt, a linear motor using a coil and a permanent magnet, etc. It can also be moved by (Linear Motor) method.
  • the first arm mechanism 63a may be coupled to the arm body 62 so as to be movable in a straight line.
  • the first arm mechanism 63a When the arm unit 63 is implemented to rotate, the first arm mechanism 63a may be rotatably coupled to the arm body 62.
  • the second arm mechanism 63b is movably coupled to the first arm mechanism 63a.
  • the second arm mechanism 63b may move in a belt manner using a motor, a pulley, a belt, and the like.
  • the second arm mechanism 63b may move in a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and a linear motor method using a coil and a permanent magnet.
  • the second arm mechanism 63b may be coupled to the first arm mechanism 63a so as to be movable in a straight line.
  • the second arm mechanism 63b may be rotatably coupled to the first arm mechanism 63a.
  • the second arm mechanism 63b and the first arm mechanism 63a may be rotated in directions opposite to each other to move the support hand 64 in a straight line.
  • the support hand 64 is coupled to the arm unit 63.
  • the support hand 64 may move the substrate S by moving in a straight line as the arm unit 63 moves.
  • the support hand 64 may be coupled to the second arm mechanism 63b.
  • the transfer arm 60 may be implemented to transfer a plurality of the substrates (S).
  • the transfer arm 60 may include a plurality of the second arm mechanism 63b and the support hand 64, respectively.
  • the transfer arm 60 moves the second arm mechanism 63b and the support hand 64 to each other.
  • the second female mechanisms 63b may be coupled to the first female mechanisms 63a such that the second female mechanisms 63b are positioned opposite to each other with respect to the first female mechanism 63a.
  • the support hands 64 may be coupled to the second arm mechanisms 63b such that the lifting device 90 is positioned at different heights with respect to the direction in which the lifting device 90 lifts and lowers the transfer arm 60.
  • the lifting device 90 raises and lowers the transfer arm 60. Accordingly, the lifting device 90 may change the height at which the transfer arm 60 is located.
  • the lifting device 90 includes the lifting frame 91, the driving unit 92, the cover 93, and the cover support 94.
  • the lifting frame 91 is coupled to the pivot 70.
  • the transfer arm 60 is coupled to the lifting frame 91 to be liftable.
  • the lifting device 90 may change the height at which the transfer arm 60 is located.
  • the driving unit 92 is coupled to the lifting frame 91.
  • the driving unit 92 provides a driving force for raising and lowering the transfer arm 60.
  • the drive unit 92 includes a rack gear 921 and a pinion gear 922.
  • the rack gear 921 is coupled to the lifting frame 91 in a lifting direction in which the transfer arm 60 is lifted.
  • a thread is formed on one surface of the rack gear 921.
  • the rack gear 921 is meshed with the pinion gear 922 by a thread.
  • the rack gear 921 provides a path through which the pinion gear 922 moves.
  • the pinion gear 922 is coupled to the transfer arm 60. Threads are formed on an outer surface of the pinion gear 922.
  • the pinion gear 922 is meshed with the rack gear 921 by a thread. Accordingly, while the pinion gear 922 and the rack gear 921 are engaged, the pinion gear 922 is rotated by a motor (not shown), whereby the transfer arm 60 may be lifted and lowered. .
  • the cover 93 prevents foreign substances generated from the driving unit 92 from being scattered as the transfer arm 60 is elevated.
  • the cover 93 is coupled to the lifting frame 91. Accordingly, the substrate transfer apparatus 50 according to the second embodiment of the present invention may block foreign matters generated from the driving unit 92 from being scattered to the outside of the cover 93. Therefore, the substrate transfer apparatus 50 according to the second embodiment of the present invention prevents foreign matter from scattering outside the cover 93, thereby preventing contamination of the substrate S and the surrounding environment. Degradation of the quality of the substrate S can be prevented.
  • the cover support part 94 is formed to protrude from the lifting frame 91 to support the cover 93.
  • the cover support part 94 is integrally formed with the lifting frame 91 along the lifting direction of the transfer arm 60.
  • the cover support 94 may reinforce the strength of the lifting frame (91). Accordingly, the substrate transport apparatus 50 according to the second embodiment of the present invention can prevent the cover 93 from being shaken by the cover support 94 supporting the cover 93. Therefore, the substrate transport apparatus 50 according to the second embodiment of the present invention can prevent the foreign matter from occurring as the cover 93 is shaken. Accordingly, since the substrate transfer apparatus 50 according to the second embodiment of the present invention can prevent the substrate S and the surrounding environment from being contaminated by foreign matter, the quality of the substrate S is deteriorated. You can prevent more.
  • the cover support 94 and the lifting frame 91 are integrally formed, thereby reinforcing the strength of the lifting frame 91. . Accordingly, the substrate transfer apparatus 50 according to the second embodiment of the present invention can reduce the deformation such as the lifting frame 91 is bent in the process of transferring the substrate (S). Therefore, the substrate transfer apparatus 50 according to the second embodiment of the present invention can reduce the time and cost required to maintain the lifting frame 91 as the lifting frame 91 is deformed, and furthermore, Since the lifting path of the transfer arm 60 can be prevented from being deformed, the reliability of the operation of transferring the substrate S can be improved.
  • the cover support part 94 includes an installation groove 941 in which the driving part 92 is installed.
  • the installation groove 941 may be formed to be recessed in the direction toward the lifting frame 91 from the cover support portion 94. Accordingly, in the substrate transfer apparatus 50 according to the second embodiment of the present invention, the driving unit 92 is installed in the installation groove 941, so that the driving unit 92 protrudes from the elevating device 90. Can be prevented. Therefore, the substrate transfer apparatus 50 according to the second embodiment of the present invention can contribute to miniaturization of the substrate transfer apparatus 50.
  • the substrate transfer apparatus 50 may include a guide installation unit 96 on which the guide unit 95 is installed, and a spacer 97.
  • the guide installation portion 96 supports the guide portion 95 for guiding the lifting and lowering of the transfer arm 60.
  • the guide installation part 96 is formed to protrude from the lifting frame 91.
  • the guide installation unit 96 includes a first guide installation member 961 and a second guide installation member 962.
  • the first guide installation member 961 is formed to protrude from the lifting frame 91.
  • the first guide installation member 961 is formed to be located on one side of the drive unit 92.
  • the first guide mounting member 961 is integrally formed with the lifting frame 91 along the lifting direction.
  • the second guide mounting member 962 is formed to protrude from the lifting frame 91.
  • the second guide installation member 962 is formed to be located on the other side of the drive unit 92.
  • the second guide installation member 962 is integrally formed with the elevating frame 91 along the elevating direction.
  • the substrate transport apparatus 50 according to the second embodiment of the present invention is formed integrally with the guide installation unit 96 and the lifting frame 91, thereby reinforcing the strength of the lifting frame 91.
  • the substrate transfer apparatus 50 according to the second embodiment of the present invention may further reduce deformation such as bending of the lifting frame 91 in the process of transferring the substrate S.
  • FIG. Therefore, the substrate transfer apparatus 50 according to the second embodiment of the present invention can further reduce the time and cost required to maintain the lifting frame 91 as the lifting frame 91 is deformed. Since the lifting path of the transfer arm 60 may be further prevented from being deformed, the reliability of the operation of transferring the substrate S may be further improved.
  • the substrate transfer apparatus 50 according to the second embodiment of the present invention may prevent the guide unit 95 from shaking by installing the guide unit 95 in the guide installation unit 96. Therefore, the substrate transfer apparatus 50 according to the second embodiment of the present invention can prevent the lifting path from shaking when the transfer arm 60 moves along the guide portion 95. Accordingly, the substrate transfer apparatus 50 according to the second embodiment of the present invention can improve the accuracy of the operation of transferring the substrate (S).
  • the spacer 97 supports the cover 93 positioned in a space for installing a cable bare (not shown) for supplying power to the driving unit 92.
  • the spacer 97 is one side is coupled to the lifting frame 91, the other side is coupled to the cover 93.
  • the substrate transfer apparatus 50 according to the second embodiment of the present invention supports the lifting frame 91 and the cover 93 so that the cover 93 of the space for installing the cable bare is provided. It can be prevented from shaking. Therefore, the substrate transfer apparatus 50 according to the second embodiment of the present invention can prevent the substrate S and the surrounding environment from being contaminated as the cover 93 is shaken, and the cover 93 Can contribute to reinforcement.
  • the pivot unit 70 rotates the lifting device 90. Accordingly, the pivot 70 may change the direction in which the transfer arm 60 faces.
  • the pivot 70 is rotatably coupled to the travel 80.
  • the revolving part 70 may rotate the lifting device 90 by rotating about the rotating shaft in a state coupled to the driving part 80.
  • the driving unit 80 moves the turning unit 70 in the driving direction. Accordingly, the driving unit 80 may move the substrate S supported by the transfer arm 60 in the driving direction.
  • the driving unit 80 includes a driving base 81 and a driving guide 82.
  • the driving base 81 moves in the driving direction along the driving guide part 82.
  • the driving base 81 moves in the driving direction by a driving force provided from a driving unit (not shown).
  • the substrate S may be transported along the travel direction by moving the travel base 81 along the travel direction.
  • the pivot 70 is coupled to the traveling base 81.
  • the driving guide part 82 is installed along the driving direction.
  • the driving guide 82 provides a path through which the driving base 81 moves.
  • the driving base 81 is coupled to the driving guide 82.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention se rapporte à un dispositif de levage pour un appareil de transfert de substrat et à un appareil de transfert de substrat comprenant ledit dispositif, le dispositif comprenant : une unité de levage destinée à lever un bras de transfert de sorte à changer la hauteur à laquelle est agencé le bras de transfert destiné à transférer le substrat ; une première partie de guidage du levage et une seconde partie de guidage du levage, disposées parallèlement l'une par rapport à l'autre, pour guider le levage du bras de transfert ; un premier bloc de guidage du levage comportant une première rainure de guidage couplée à la première partie de guidage du levage ; et un second bloc de guidage du levage comportant une seconde rainure de guidage couplée à la seconde partie de guidage du levage, la première rainure de guidage et la seconde rainure de guidage étant agencées de sorte à se faire face.
PCT/KR2015/000005 2014-01-02 2015-01-02 Dispositif de levage pour un appareil de transfert de substrat et appareil de transfert de substrat comprenant ce dernier WO2015102420A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201580011368.0A CN106062944B (zh) 2014-01-02 2015-01-02 基板传送装置用升降装置以及基板传送装置

Applications Claiming Priority (4)

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KR1020140000173A KR101587336B1 (ko) 2014-01-02 2014-01-02 기판 이송장치용 승강장치 및 이를 포함하는 기판 이송장치
KR10-2014-0000199 2014-01-02
KR10-2014-0000173 2014-01-02
KR1020140000199A KR101587337B1 (ko) 2014-01-02 2014-01-02 기판 이송장치용 승강장치 및 이를 포함하는 기판 이송장치

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KR101331368B1 (ko) * 2011-10-20 2013-11-19 현대중공업 주식회사 사행 보상 기능을 구비하는 기판 반송용 로봇 및 그의 사행 보상 방법

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KR20100090716A (ko) * 2007-12-05 2010-08-16 히라따기꼬오 가부시키가이샤 기판 반송 장치 및 기판 반송 장치의 제어 방법
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