WO2015102323A1 - Feuille de cuivre ainsi que composant électrique et batterie comportant cette dernière - Google Patents

Feuille de cuivre ainsi que composant électrique et batterie comportant cette dernière Download PDF

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Publication number
WO2015102323A1
WO2015102323A1 PCT/KR2014/012942 KR2014012942W WO2015102323A1 WO 2015102323 A1 WO2015102323 A1 WO 2015102323A1 KR 2014012942 W KR2014012942 W KR 2014012942W WO 2015102323 A1 WO2015102323 A1 WO 2015102323A1
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WO
WIPO (PCT)
Prior art keywords
copper foil
fine particles
copper
particle layer
fine particle
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Application number
PCT/KR2014/012942
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English (en)
Korean (ko)
Inventor
최은실
범원진
송기덕
Original Assignee
일진머티리얼즈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 일진머티리얼즈 주식회사 filed Critical 일진머티리얼즈 주식회사
Priority to CN201480071903.7A priority Critical patent/CN105874891A/zh
Priority to JP2016561983A priority patent/JP2017508890A/ja
Publication of WO2015102323A1 publication Critical patent/WO2015102323A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites

Definitions

  • the present invention relates to a copper foil, an electric component and a battery including the copper foil, and more particularly to a copper foil excellent in adhesive strength while having low roughness.
  • Laminates for printed circuit boards used in the electronics industry are impregnated with glass cloth, kraft paper, and glass fiber nonwoven fabrics with thermosetting resins such as phenolic resins and epoxy resins, and the resins are semi-precured. It is prepared by laminating a copper foil on one side or both sides of the prepreg.
  • a multilayer printed wiring board is produced by forming circuits on both sides of a copper-clad laminate to form an inner layer material, and laminating copper foil on both sides of the inner layer material through a prepreg.
  • the adhesion rate is not sufficient because the copper foil is separated from the prepreg in a subsequent process, thereby causing a defect in the product. Therefore, the surface treatment for improving adhesiveness with resin, such as a prepreg, is performed to copper foil.
  • the copper foil used for manufacture of a printed wiring board is performing the roughening process which forms unevenness
  • the roughness of the roughened copper foil is buried in the base resin to provide an anchoring effect, thereby improving the adhesion between the copper foil and the base resin.
  • the surface treatment of the copper foil When the surface treatment of the copper foil is performed, the surface roughness of the copper foil is increased, the adhesion between the copper foil and the base resin may be improved, but the etching resistance to the microcircuit may be lowered. Therefore, in consideration of the etching property, development of a technique capable of improving the adhesion while maintaining the surface roughness of the copper foil is required.
  • an object of the present invention is to provide a copper foil excellent in adhesive strength while low roughness.
  • Copper foil according to an aspect of the present invention for achieving the above object is a copper foil with irregularities formed on at least one surface, a fine particle layer formed on the surface, the upper fine particles located on the average line according to the average height of the surface Is more than the lower particulates located below the mean line.
  • the ratio of the number of upper microparticles to the number of lower microparticles may be 80:20 to 100: 0.
  • Upper fine particles may form a triangle connecting the center point.
  • the diameter of the fine particles may be 1 to 3 ⁇ m.
  • the fine particles may be metal particles or copper alloy particles including at least one metal of copper (Cu), iron (Fe), molybdenum (Mo), and cobalt (Co).
  • the peel strength of the copper foil may be 1.28 to 1.33 kgf / cm, the surface roughness Rz may be 5.2 to 6.5 ⁇ m, and the surface roughness Rmax may be 6.5 to 7.7 ⁇ m.
  • the insulating substrate According to another aspect of the invention, the insulating substrate; And an copper foil as described above attached to one surface of an insulating substrate.
  • a battery comprising such a copper foil.
  • preparing a copper foil with irregularities formed on at least one surface And forming a fine particle layer on the surface on which the unevenness is formed, and forming the fine particle layer such that the upper fine particles positioned above the average line according to the average height of the surface are larger than the lower fine particles positioned below the average line.
  • a surface treatment method is provided.
  • the content of iron may be 10 to 30g
  • the content of molybdenum may be 0.5 to 10g
  • the content of cobalt may be 1 to 15g.
  • the electroplating process for forming the microparticle layer may be performed at 20 to 60 A / dm 2 for 1 to 5 seconds.
  • Copper foil according to the present invention is excellent in adhesive strength while low roughness. Accordingly, the etching property for forming the microcircuit board is guaranteed and the adhesive strength is excellent, thereby improving adhesion to the resin and the like, thereby improving product reliability when manufacturing a product using copper foil.
  • 1 is a view showing the surface of the copper foil according to an embodiment of the present invention.
  • FIG. 2 is a view showing the surface of the copper foil excluding the fine particles in FIG.
  • FIG. 3 is a view showing a part of the surface of the copper foil in FIG.
  • Figure 4 is a scanning electron microscopy (SEM) image of the surface of the copper foil surface-treated in Example 1.
  • FIG. 5 is an SEM image of the surface of the copper foil of Example 2.
  • FIG. 6 is an SEM image of the surface of the copper foil of Example 3.
  • FIG. 7 is an SEM image of the surface of the copper foil of Example 4.
  • FIG. 8 is an SEM image of the surface of a copper foil of Comparative Example 1.
  • FIG. 9 is an SEM image of the surface of a copper foil of Comparative Example 2.
  • FIG. 10 is an SEM image of the surface of a copper foil of Comparative Example 3.
  • FIG. 10 is an SEM image of the surface of a copper foil of Comparative Example 3.
  • Copper foil according to an aspect of the present invention is a copper foil having irregularities formed on at least one surface and a fine particle layer formed on the surface, the lower fine particles located above the average line according to the average height of the surface is located below the average line More than particles.
  • FIG. 1 is a view showing the surface of the copper foil according to an embodiment of the present invention
  • Figure 2 is a view showing the surface of the copper foil excluding the fine particles in Figure 1
  • Figure 3 is a part of the surface of the copper foil in Figure 1 The figure is shown.
  • the copper foil according to the present embodiment is a copper foil having irregularities formed on a surface thereof and a fine particle layer formed on the surface thereof, and more upper fine particles positioned above the average line according to the average height of the surface than the lower fine particles positioned below the average line.
  • corrugation is formed in the surface.
  • the process of manufacturing copper foil is generally classified into a manufacturing process, ie, the process of manufacturing copper foil itself, and the process of processing the surface of the manufactured copper foil.
  • Copper foil manufactured according to the manufacturing process has a surface roughness which is different depending on the process. That is, high roughness includes large irregularities on the surface, and low roughness includes small irregularities on the surface.
  • Surfaces having such irregularities are subjected to various surface treatment processes as necessary to impart the necessary characteristics in subsequent processes.
  • the surface when used in an FPCB or as a negative electrode current collector of a secondary battery, the surface may be roughened to increase roughness in order to improve adhesion with a resin or an active material, and the diffusion of copper particles into another layer may be improved.
  • a barrier treatment may be performed to prevent the surface treatment, and a surface treatment to enhance adhesion may be performed by an antirust treatment to prevent surface oxidation, or a surface treatment using a silane coupling agent at the outermost surface.
  • a roughening treatment is performed to increase the surface roughness.
  • the roughening treatment may include a fine particle layer on the surface of the copper foil to be in contact with the resin or the active material.
  • the unevenness 120 is formed on the surface of the copper foil layer 110, and the fine particles 131 form the fine particle layer 130 in the unevenness 120.
  • the fine particles may be classified based on the average line m according to the average height of the unevenness 220 of the copper foil 210. That is, the fine particles positioned above the average line m may be referred to as upper fine particles, and the fine particles positioned below the average line m may be referred to as lower fine particles.
  • Copper foil 100 according to the present invention is the upper fine particles than the lower fine particles.
  • the upper fine particles are located in the mountain portion of the unevenness 120
  • the lower fine particles are fine particles located in the bone portion of the unevenness 120.
  • the upper fine particles are more than the lower fine particles or there are no lower fine particles, there are few or no fine particles in the bone portion of the unevenness 120. Therefore, empty space is created in the valley part of the unevenness 120, and the porosity becomes high.
  • the copper foil 100 is in contact with a resin or an active material, such a space is filled with the resin or the active material, thereby improving adhesion.
  • the reason for roughening the surface of the copper foil is that the surface of the copper foil, which has an increased unevenness due to the roughening treatment, is buried in a resin or the like to provide an anchor effect to improve adhesion.
  • a resin or the like to provide an anchor effect to improve adhesion.
  • less microparticles are generated in the valleys between the uneven acid and the acid to form empty spaces, and at the top thereof, fine particles are formed so that the resin filled in the empty spaces is anchored. The effect is to improve the adhesion.
  • the fine particle group is positioned above the average line (m) of the copper foil 210, and it is preferable to secure the porosity as much as possible because the smaller particles are located in the lower portion.
  • the ratio of the number of upper microparticles and the number of lower microparticles may be 80:20 to 100: 0.
  • the upper fine particles may form a triangle connecting the center point.
  • three upper fine particles 331, 332, and 333 are positioned on the uneven surface 320, and the center shape 340 connecting the center points P 1 , P 2 , and P 3 is a triangle. .
  • the diameter of the fine particles may be 1 to 3 ⁇ m. If the diameter of the microparticles is too small, it may penetrate into the valleys of the unevenness, and the ratio of the lower fine particles may be increased. If the diameter of the microparticles is too large, the overall unevenness increases, which increases the surface roughness of the copper foil. Done.
  • the fine particles may be metal particles or copper alloy particles including at least one metal of copper (Cu), iron (Fe), molybdenum (Mo), and cobalt (Co).
  • the peel strength of the copper foil may be 1.28 to 1.33 kgf / cm, the surface roughness Rz may be 5.2 to 6.5 ⁇ m, and the surface roughness Rmax may be 6.5 to 7.7 ⁇ m.
  • the fine particles formed in the uneven portion are located in an acidic region, and thus the surface of the copper foil has a low surface roughness and high peel strength, thereby improving adhesion.
  • the insulating substrate and an copper foil attached to one surface of the insulating substrate.
  • Copper foil contained in an electrical component includes the circuit formed by etching copper foil.
  • Such electrical components include, for example, TAB tapes, printed wiring boards (PCBs), flexible printed circuit boards (FPCs, flexible PCBs), and the like, but are not necessarily limited thereto, and are used by attaching copper foil on an insulating substrate. Anything that can be used in.
  • a battery comprising the copper foil described above.
  • Copper foil may be used as a negative electrode current collector of a battery, but is not necessarily limited thereto, and may also be used as other components used in a battery.
  • the battery is not particularly limited and includes all primary and secondary batteries, and any battery that can be used in the art as a battery using copper foil as a current collector, such as a lithium ion battery, a lithium polymer battery, or a lithium air battery Do.
  • preparing a copper foil with irregularities formed on at least one surface And forming a fine particle layer on the surface on which the unevenness is formed, and forming the fine particle layer such that the upper fine particles positioned above the average line according to the average height of the surface are larger than the lower fine particles positioned below the average line.
  • a surface treatment method is provided.
  • copper foil is copper sulfate; Sulfuric acid; And it is immersed in the surface treatment solution containing a metal containing iron (Fe), molybdenum (Mo) and cobalt (Co) and electrolytically to form a fine particle layer on at least one surface of the copper foil with irregularities on the surface.
  • Fe iron
  • Mo molybdenum
  • Co cobalt
  • Iron is included in the surface treatment solution, 10 to 30 g of molybdenum, 0.5 to 10 g, and 1 to 15 g of cobalt. If the metal content in the surface treatment solution is too small, the copper alloy is not sufficiently formed, so it is difficult to control the ratio of the upper fine particles and the lower fine particles. If the metal content is too high, too many fine particles are formed, resulting in high surface roughness. It may be disadvantageous in terms of etching.
  • the electroplating process for forming the microparticle layer may be performed at 20 to 60 A / dm 2 for 1 to 5 seconds.
  • the copper foil according to the present invention may be additionally surface treated.
  • any one or a combination of heat and chemical resistance treatment, chromate treatment, silane coupling treatment, and the like, and the like may be appropriately selected depending on subsequent processes.
  • the heat and chemical resistance treatment can be carried out by forming a thin film on metal foil by sputtering, electroplating or electroless plating of any one or alloys of metals such as nickel, tin, zinc, chromium, molybdenum and cobalt, for example. Can be. In terms of cost, electroplating is preferable.
  • a complexing agent such as citrate, tartarate, and sulfamic acid may be added in a required amount.
  • chromate treatment an aqueous solution containing hexavalent to trivalent chromium ions is used.
  • the chromate treatment may be a simple immersion treatment, but is preferably carried out by cathodic treatment. It is preferable to carry out on the conditions of 0.1-70 g / L sodium dichromate, pH 1-13, bath temperature 15-60 degreeC, current density 0.1-5 A / dm ⁇ 2> , electrolysis time 0.1-100 second .
  • sodium dichromate it may be carried out using chromic acid or potassium dichromate.
  • epoxy functional silanes such as 3-glycidoxy propyl trimethoxysilane and 2- (3, 4- epoxycyclohexyl) ethyl trimethoxysilane
  • Amino functional silanes such as -aminopropyl trimethoxysilane, N-2- (aminoethyl) -3-aminopropyl trimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyl dimethoxysilane
  • Acrylic functional silanes such as olefin functional silanes, such as a vinyl trimethoxy silane, a vinylphenyl trimethoxysilane, and a vinyl tris (2-methoxyethoxy) silane
  • 3-acryloxypropyl trimethoxysilane 3-metha Methacryl-functional silanes, such as chlorooxypropyl trimethoxysi
  • Such a coupling agent is dissolved in a solvent such as water at a concentration of 0.1 to 15 g / L, and applied to a metal foil at a temperature of room temperature to 70 ° C, or electrodeposited to adsorb.
  • a solvent such as water
  • These silane coupling agents form a film by condensation-bonding with the hydroxyl group of the antirust process metal on the metal foil surface.
  • a stable bond is formed by heating, ultraviolet irradiation or the like. The heating is dried for 2 to 60 seconds at a temperature of 100 to 200 ° C. Ultraviolet irradiation is performed in the range of 200-400 nm and 200-2500 mJ / cm ⁇ 2> .
  • the positive electrode was a 5 mm thick, 10 x 10 cm 2 Dimentionally Stable Electrode (DSE) electrode plate, and the negative electrode was a titanium electrode plate having the same size and thickness as the positive electrode.
  • DSE Dimentionally Stable Electrode
  • plating was performed at 35 A / dm 2 , and a copper foil having a thickness of 18 ⁇ m was prepared.
  • Chlorine ions and additives were added to the copper electrolyte.
  • the copper foil thus prepared was electrolyzed for 1 to 5 seconds at a current density of 35 A / dm 2 using the following copper electrolyte to form a fine particle layer.
  • the scanning electron microscopy (SEM) image of the surface of the copper foil in which the microparticle layer was formed by Example 1 is shown in FIG.
  • the fine particle layer was formed by performing electroplating on the surface of the copper foil in the same manner as in Example 1.
  • the SEM image of the surface of the copper foil in which the microparticle layer was formed is shown in FIG.
  • the fine particle layer was formed by performing electroplating on the surface of the copper foil in the same manner as in Example 1.
  • the SEM image of the surface of the copper foil in which the microparticle layer was formed is shown in FIG.
  • Example 1 The SEM image of the surface of the copper foil in which the microparticle layer was formed is shown in FIG.
  • the fine particle layer was formed by performing electroplating on the surface of the copper foil in the same manner as in Example 1.
  • the SEM image of the surface of the copper foil in which the microparticle layer was formed is shown in FIG.
  • the fine particle layer was formed by performing electroplating on the surface of the copper foil in the same manner as in Example 1.
  • the SEM image of the surface of the copper foil in which the microparticle layer was formed is shown in FIG.
  • the fine particle layer was formed by performing electroplating on the surface of the copper foil in the same manner as in Example 1.
  • the SEM image of the surface of the copper foil in which the microparticle layer was formed is shown in FIG.
  • 4 to 7 are surface images of copper foils of Examples 1 to 4 according to the present invention. Referring to Figure 4, it can be seen that the fine particles are concentrated in the acid portion of the irregularities on the copper foil surface. 5 to 7 also similar to Figure 1 it can be seen that the fine particles are densely located in the uneven portion of the copper foil surface, less than the mountain portion in the bone portion.
  • FIGS. 8 to 10 which are surface images of the copper foils of Comparative Examples 1 to 3, it can be seen that the fine particles are evenly located in the valleys as well as the acid of the unevenness. In the copper foils of Comparative Examples 1 to 3, the fine particles cover the entire surface of the copper foil.
  • the upper fine particles located above the average line of the unevenness are present more than the lower fine particles, and the lower fine particles are present so that the resin or the active material penetrates into the bone part. It is expected that the adhesion is high because it is likely to
  • the surface roughness of the copper foil of Example 1 is lower than the surface roughness of Comparative Example 1, but the peel strength is higher, the adhesion to other materials such as resin or active material to be contacted in the subsequent process It can be seen that this is high.
  • the evaluation result that the peeling strength of the copper foil of Example 1 having a lower surface roughness but not the same surface roughness is higher than that of Comparative Example 1 may be inferred as a result of the position of the microparticles of Example 1 being biased.
  • the surface roughness values of copper foils of Examples 2 to 4 are smaller or similar, but the peeling strength is 1.30 kgf / cm or more, respectively. The value higher than the peeling strength of is shown.
  • the adhesiveness with other materials is high when manufacturing a product such as a resin or an active material, and thus the defect rate is low in the process, the yield is high, and the surface roughness is etched. Its excellent properties make it possible to form fine circuit patterns, thus increasing product reliability.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une feuille de cuivre qui présente une faible rugosité et une excellente force adhésive. La feuille de cuivre proposée est une feuille de cuivre qui comporte une partie irrégulière formée sur au moins l'une de ses surfaces et une couche de particules fines formée sur sa surface, le nombre de particules fines supérieures agencées au-dessus d'une ligne moyenne selon la hauteur moyenne de la surface étant supérieur au nombre de particules fines inférieures agencées en dessous de la ligne moyenne.
PCT/KR2014/012942 2013-12-30 2014-12-26 Feuille de cuivre ainsi que composant électrique et batterie comportant cette dernière WO2015102323A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201480071903.7A CN105874891A (zh) 2013-12-30 2014-12-26 铜箔、包含该铜箔的电气部件以及电池
JP2016561983A JP2017508890A (ja) 2013-12-30 2014-12-26 銅箔、これを含む電気部品及び電池

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KR10-2013-0166916 2013-12-30
KR1020130166916A KR101695236B1 (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지

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WO2015102323A1 true WO2015102323A1 (fr) 2015-07-09

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200392640A1 (en) * 2019-06-12 2020-12-17 Co-Tech Development Corp. Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same
US11332839B2 (en) * 2019-06-19 2022-05-17 Co-Tech Development Corp. Advanced electrodeposited copper foil and copper clad laminate using the same
TWI776168B (zh) * 2019-06-19 2022-09-01 金居開發股份有限公司 進階反轉電解銅箔及應用其的銅箔基板

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Publication number Priority date Publication date Assignee Title
KR102399930B1 (ko) * 2017-08-29 2022-05-18 에스케이넥실리스 주식회사 노듈층을 갖는 동박의 제조방법, 이 방법으로 제조된 동박, 이를 포함하는 이차전지용 전극 및 이차전지
CN111031663B (zh) * 2018-10-09 2023-05-05 金居开发股份有限公司 铜箔基板
KR102413300B1 (ko) * 2020-12-10 2022-06-27 와이엠티 주식회사 금속박, 이를 포함하는 캐리어 부착 금속박 및 이를 포함하는 인쇄회로기판

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