WO2015081842A1 - 一种连接散热鳍片的散热壳体结构 - Google Patents

一种连接散热鳍片的散热壳体结构 Download PDF

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Publication number
WO2015081842A1
WO2015081842A1 PCT/CN2014/092766 CN2014092766W WO2015081842A1 WO 2015081842 A1 WO2015081842 A1 WO 2015081842A1 CN 2014092766 W CN2014092766 W CN 2014092766W WO 2015081842 A1 WO2015081842 A1 WO 2015081842A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipating
heat dissipation
heat
dissipating fin
fins
Prior art date
Application number
PCT/CN2014/092766
Other languages
English (en)
French (fr)
Inventor
陈卫国
康薇茹
Original Assignee
迈凯实金属技术（苏州）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201310649400.0A external-priority patent/CN103607872B/zh
Priority claimed from CN201310649403.4A external-priority patent/CN103607873A/zh
Priority claimed from CN201310649405.3A external-priority patent/CN103619143A/zh
Priority claimed from CN201310649404.9A external-priority patent/CN103619142A/zh
Priority claimed from CN201410087199.6A external-priority patent/CN103796457A/zh
Application filed by 迈凯实金属技术（苏州）有限公司 filed Critical 迈凯实金属技术（苏州）有限公司
Priority to EP14811749.2A priority Critical patent/EP2894954B1/en
Priority to US14/409,700 priority patent/US20160265853A1/en
Priority to KR1020147036993A priority patent/KR102290015B1/ko
Publication of WO2015081842A1 publication Critical patent/WO2015081842A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the technical field of heat dissipating devices, and more particularly to a heat dissipating housing connecting heat dissipating fins having high heat dissipation efficiency.
  • the outdoor electronic equipment needs protection against water and wind.
  • the outdoor electronic equipment mostly uses a non-ferrous alloy casting shell as the outer casing.
  • the general design is a die-cast housing.
  • the internal space composed of the cover is used to place a printed circuit board (PCB), or other equipment.
  • PCB printed circuit board
  • design heat dissipation fins on the outside of the housing to help the device to naturally dissipate heat.
  • the existing heat-dissipating shell usually adopts two main structures.
  • the structure 1 directly casts a heat-dissipating shell with heat-dissipating fins by a die-casting process, and the structure 2 firstly casts a heat-dissipating shell without fins, and then uses the glue to melt the fins. Bonded to the base of the die casting.
  • These two structures have the following disadvantages: 1.
  • Structure 1 is limited by the limitations of the die casting process, and the fin height is technically limited. The tall fins make the heat sink housing too heavy to handle and therefore cannot be economically implemented in the art.
  • the fins increase the overall weight of the heat-dissipating shell to allow the mold to be released from the mold.
  • the alloy material of the fins and the heat-dissipating shell have the same heat dissipation coefficient, and the overall heat dissipation effect is affected. limit. 2.
  • the heat-dissipating fins are bonded to the heat-dissipating shell, and the glue will affect the firmness of the heat-dissipating fins due to aging, and is easy to fall off.
  • the thermal conductivity of the glue also limits the heat dissipation performance of the heat-dissipating shell.
  • the thermal conductivity of the glue has great variability according to the data sheet of the industrial products on the market, and therefore, the heat dissipation performance of the heat-dissipating shell affects the result. It is not reliable.
  • the patent No. 200920213960.0 discloses a heat dissipation structure including an annular lamp holder 51 and a plurality of heat dissipation fins 52.
  • the outer surface of the outer surface is staggered with a plurality of grooves 53 so that one of the heat dissipation fins 52 The side can be inserted into the recess 53 by glue.
  • This patent uses the use of heat sink fins to dissipate the heat of the built-in light fixture.
  • the heat-dissipating fins in the patent are glued to the annular lamp holder, and the glue is a material with poor thermal conductivity.
  • the glue between the heat-dissipating fins and the annular lamp holder is not conducive to heat conduction and reduces heat dissipation efficiency.
  • the die casting described in the present specification refers to a process of filling a mold in a molten state or a semi-molten state under pressure, preferably at a high temperature and a high pressure, and crystal solidifying to form a casting under the pressure.
  • the alloy material may be a non-ferrous alloy, preferably a zinc alloy, an aluminum alloy, or a magnesium alloy, and is not limited to the above materials.
  • the heat dissipating fins in the present specification are obtained by extrusion molding or other cold forming methods, and the heat dissipating fins are made of a non-ferrous alloy material, preferably an aluminum alloy or a magnesium alloy, and are not limited to the above materials.
  • a heat dissipation housing structure connecting heat dissipation fins comprising: a heat dissipation housing (1) composed of an outer wall (13) and a side wall (12).
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein the heat dissipation fins (2) are inlaid and cast in an outer wall (13) of the heat dissipation housing (1).
  • the heat dissipation housing structure is configured to connect the heat dissipation fins, wherein the outer wall (13) is connected with a plurality of heat dissipation fins (2).
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein the heat dissipation housing (1) is provided with a boss (11) at a connection with the heat dissipation fins (2).
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein the height of the boss (11) is greater than the depth of the bottom of the heat dissipation fins (2).
  • the heat dissipation housing structure connecting the heat dissipation fins wherein: the heat dissipation fins (2)
  • the bottom (21) is inlaid and cast in the heat dissipation housing (1).
  • the heat dissipation housing structure is configured to connect the heat dissipation fins, wherein an anti-overflow boss (22) is disposed above the bottom portion (21) of the heat dissipation fins (2).
  • the heat dissipation housing structure connecting the heat dissipation fins wherein: the overflow prevention boss (22) has a rectangular cross section, or the overflow prevention boss (22) has a triangular cross section, a triangular right angle side and the heat dissipation
  • the housing (1) is in contact.
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein: the heat dissipation fins (2) above the overflow prevention boss (22) are gradually thickened from top to bottom.
  • the heat dissipation housing structure connecting the heat dissipation fins wherein: the overflow prevention boss (22) extends from both ends of the heat dissipation fins (2).
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein a bottom portion (21) of the heat dissipation fins (2) has a thickness greater than an average thickness thereof, and the bottom portion (21) is embedded in the heat dissipation housing (1) Inside.
  • the heat dissipation housing structure connecting the heat dissipation fins wherein: the bottom portion (21) of the heat dissipation fins (2) has an inverted "T" shape, a triangular shape, a circular shape, or an I-shape A variety of combinations.
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein: the heat dissipation housing (1) is uniformly provided with a plurality of elongated protrusions (11), and the bottom of the heat dissipation fins (2) 21) Casting on the boss (11) of the heat dissipation housing (1).
  • the heat dissipation housing structure is configured to connect the heat dissipation fins, wherein: the heat dissipation housing (1) is provided with a plurality of bosses (11'), and the bottom portion (21) of the heat dissipation fins (2) is provided with a plurality of The space (3) is avoided, and the height of the boss (11') is higher than the height of the shelter (3).
  • the heat dissipation housing structure connecting the heat dissipation fins wherein: the bottom portion (21) of the heat dissipation fins (2) is a hollow structure with an open bottom surface, and skirts (23) on both sides, the skirt (23) The bottom is folded inwardly, and the boss (11) is inlaid and cast in the skirt (23).
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein the heat dissipation fins are inlaid and cast in the outer wall (13) of the heat dissipation housing (1) by die casting.
  • the heat dissipation housing structure connecting the heat dissipation fins wherein: the die casting method is a process of filling an alloy material under pressure and crystallizing under pressure to form a casting.
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein the alloy is filled with a mold in a molten state.
  • the heat dissipation housing structure connecting the heat dissipation fins, wherein the alloy is filled in a semi-molten state.
  • the heat dissipating shell structure connecting the heat dissipating fins wherein: the bottom of the heat dissipating fins (2) is provided with a bottom bump (3) for limiting.
  • the boss can fix the heat-dissipating fins more firmly without changing the thickness of the heat-dissipating shell, ensuring heat dissipation and strength while reducing the material as much as possible. Use, reduce the weight of the heat sink itself and reduce costs.
  • the bottom of the heat dissipation fin is inlaid and cast in the heat dissipation shell, which solves the problem that the glue bonding the heat dissipation fin is not conducive to heat conduction and the conduction effect is not sustained, and the heat dissipation efficiency is improved. Moreover, since the process is automated and integrated into the casting process, the manual bonding process is reduced and the production efficiency is improved.
  • the heat-dissipating fins are firmly fixed on the heat-dissipating casing, preventing the falling off due to the aging of the glue, ensuring the normal heat-dissipating ability, and, in addition, the new technology does not need to be cleaned and prepared with chemical materials for the heat-dissipating fins.
  • the main outer casing is glued to a good bond, which is also enhanced in terms of environmental protection and occupational disease protection. Since the curing stage of the glue is no longer needed in the manufacturing stage, the energy loss is greatly reduced.
  • An anti-overflow boss is arranged above the bottom of the heat dissipating fin to prevent material waste from being caused by metal liquid overflowing from both sides of the fin.
  • the fins above the anti-overflow boss are gradually thickened from top to bottom to prevent metal liquid from overflowing from both sides of the anti-overflow boss during casting.
  • the anti-overflow protrusion extends from both ends of the heat dissipation fin to further prevent metal material from being thrown from both ends of the heat dissipation fin during casting to cause waste of material.
  • the bottom of the heat dissipation fin is a hollow bottom open structure to prevent material waste from being caused by the metal liquid during casting.
  • FIG. 1 is a schematic diagram of a heat dissipation structure of Patent No. 200920213960.0;
  • FIG. 2 is a partial view of the heat dissipation housing
  • Figure 3 is a cross-sectional view of the heat dissipation housing
  • FIG. 4a is a schematic view of a heat dissipation fin having a rectangular cross section of the overflow prevention boss
  • 4b is a schematic view of a heat dissipation fin having a triangular cross section of the overflow prevention boss
  • FIG. 4c is a schematic view showing the gradual thickening of the heat dissipation fins in FIG. 4a;
  • FIG. 4d is a schematic view showing the gradual thickening of the heat dissipation fins in FIG. 4b;
  • FIG. 5 is a schematic view of a heat dissipation fin extending outward from an overflow prevention boss
  • FIG. 6 is a schematic view of a heat dissipating fin provided with a bottom bump at the bottom;
  • Figure 7 is a left side view of Figure 6;
  • Figure 8 is a cross-sectional view of the heat dissipation housing
  • Figure 9a is a schematic view of a heat dissipating fin having a triangular cross section
  • Figure 9b is a schematic view of a "T" shaped heat sink fin with an inverted bottom section
  • Figure 9c is a schematic view of a heat sink fin having a circular cross section
  • Figure 9d is a schematic view of a fin having a bottom section of an I-shape
  • 9e is a schematic view showing another embodiment of a fin having a bottom cross section of an I-shape
  • Figure 9f is a schematic view of a heat sink fin with a vacant space at the bottom;
  • Figure 10 is a cross-sectional view of the heat dissipation housing
  • Figure 11a is a schematic view of a heat sink fin having a rectangular skirt
  • Figure 11b is a schematic view of a heat sink fin having a circular skirt
  • Figure 11c is a schematic view of a heat sink fin having an inverted trapezoidal skirt
  • Figure 11d is a schematic view of a heat sink fin having a serrated skirt.
  • heat-dissipating housing 11, long boss; 11', round boss; 12, side wall; 13, outer wall; 2. heat-dissipating fin; 21; bottom; 22. anti-overflow boss; 23, skirt; 24, avoiding space; 3, bottom bump; 51, ring lamp holder; 52, heat sink fin; 53, groove.
  • a heat dissipation housing structure connecting the heat dissipation fins includes a heat dissipation housing 1 composed of a top wall and a side wall 12.
  • the top and side walls 12 form an outer casing 13.
  • the heat radiating fins 2 are embedded in the outer wall 13 by die casting.
  • a plurality of heat dissipation fins 2 are connected to the outer wall 13, and a plurality of heat dissipation fins 2 are disposed on the outer wall 13 at equal intervals and in parallel. The depth of the heat sink fin 2 inserted into the outer wall 13 can reach the position.
  • the bottom portion 21 of the heat dissipation fin 2 is inlaid in the heat dissipation housing 1.
  • an anti-overflow boss 22 is disposed above the bottom portion 21 of the heat dissipation fin 2.
  • the spill prevention boss 22 has a rectangular cross section.
  • the long side of the rectangle formed by the overflow preventing boss 22 is in direct contact with the end surface of the heat dissipation housing 1.
  • the anti-overflow boss 22 has a triangular cross section, and the triangular right-angled corner is in contact with the heat dissipation housing 1.
  • an anti-overflow boss 22 is disposed above the bottom portion 21 of the heat dissipation fin 2 to prevent metal liquid from overflowing from both sides of the heat dissipation fin 2 during casting. Causes waste of materials.
  • the heat radiating fins 2 above the overflow preventing boss 22 are gradually thickened from top to bottom.
  • the anti-overflow boss 22 has a rectangular cross section, and the long side of the rectangle formed by the anti-overflow boss 22 is in direct contact with the end surface of the heat dissipation housing 1, and the heat dissipation fins 2 above the anti-overflow boss 22 are Gradually thickening from top to bottom.
  • the anti-overflow boss 22 has a triangular cross section, the triangular right-angled side is in contact with the heat dissipation housing 1, and the heat dissipation fins 2 above the overflow prevention boss 22 are gradually thickened from top to bottom.
  • the overflow preventing boss 22 extends from both ends of the heat dissipating fin 2.
  • the bottom of the heat dissipation fin 2 is further provided with a bottom bump 3 for limiting, and the heat dissipation fin 2 is located after being connected to the heat dissipation housing 1 .
  • the lower surface of the bottom bump 3 at the bottom of the heat dissipation fin 2 is flush with the outer wall 13 of the heat dissipation housing 2.
  • the fin height is not limited by the process, and the fins are not increased by the draft angle, so that the overall weight of the heat-dissipating shell is increased, the alloy material of the fins and The heat dissipating shell can adopt different materials, so the heat dissipating coefficient can be different, the overall heat dissipating effect is not restricted, the heat dissipating efficiency is improved, the manual bonding process is reduced, the production efficiency is greatly improved, and the automatic production can be realized, and
  • the heat dissipation fins 2 are firmly fixed on the heat dissipation housing 1 to prevent falling off and ensure normal heat dissipation capability.
  • the heat dissipation housing 1 is provided with a long boss 11 at a position where it is connected to the heat dissipation fin 2.
  • the height of the elongated boss 11 is greater than the depth at which the heat sink fin 2 is buried.
  • the long boss 11 has a rectangular cross section.
  • the rectangular long boss 11 is extended upward on the heat dissipation housing 1 and the rectangle formed by the long boss 11
  • the long side of the long side is perpendicular to the heat dissipating case 1, and the short side of the rectangle formed by the long boss 11 is in contact with the heat dissipating fin 2.
  • the long boss 11 has a trapezoidal cross section.
  • the long side of the trapezoid formed by the long boss 11 is in direct contact with the heat dissipation case 1, and the short side of the trapezoid formed by the long boss 11 is in contact with the heat dissipation fin 2.
  • the bottom portion 21 of the heat dissipation fin 2 has a thickness greater than its average thickness, and the bottom portion 21 is inlaid and cast in the heat dissipation housing 1.
  • the bottom portion 21 of the heat dissipation fin 2 has a triangular cross section.
  • One side of the triangle formed by the bottom portion 21 of the heat dissipation fin 2 is parallel to the heat dissipation housing 1, and the corner formed by the other two sides of the triangle formed by the bottom portion 21 of the heat dissipation fin 2 is in contact with the bottom portion 21 of the heat dissipation fin 2.
  • the bottom portion 21 of the heat dissipation fin 2 has an inverted "T" shape.
  • the inverted "T” shaped lateral edge formed by the bottom portion 21 of the heat dissipation fin 2 is parallel to the heat dissipation housing 1, and the inverted "T” shaped vertical side formed by the bottom portion 21 of the heat dissipation fin 2 is collinear with the heat dissipation fin 2 and Contact.
  • the bottom portion 21 of the heat dissipation fin 2 has a circular cross section.
  • the bottom portion 21 of the heat dissipation fin 2 has an I-shaped cross section.
  • the I-shaped portion formed by the bottom portion 21 of the heat-dissipating fin 2 includes two lateral sides and a vertical side between the two lateral sides.
  • One lateral side of the I-shaped bottom portion 21 is parallel with the heat-dissipating casing 1, and the other lateral side and the heat-dissipating fin Sheet 2 is in vertical contact. See Figure 9e, or the vertical side of the I-shaped bottom 21 is in vertical contact with the heat sink fins 2.
  • the bottom of the heat dissipation fin 2 is provided with a cutout 24 for avoiding the threaded hole inside the heat dissipation housing 1, and only a circle is provided at the corresponding position of the heat dissipation housing 1.
  • Boss 11' The height of the circular boss 11' located at these vacant positions is higher than the corresponding screw holes and the height of the circular boss 11'.
  • the heat dissipation housing 1 is reserved with the heat dissipation fin 2
  • the bottom 21 is matched with the groove shape, and the heat dissipation fin 2 can be mounted in such a manner that the bottom portion 21 of the heat dissipation fin 2 slides from the side of the heat dissipation housing 1 into the groove of the heat dissipation housing 1 and is punched by the heat dissipation housing.
  • the body 1 or both ends of the bottom portion 21 inserted into the heat-insulating fin 2 are fixed by this.
  • the bottom portion 21 of the heat dissipation fin 2 is directly disposed inside the heat dissipation housing 1 , which solves the problem that the glue bonding the heat dissipation fin 2 is not conducive to heat conduction and improves the heat dissipation efficiency;
  • the bottom portion 21 of the heat dissipation fin 2 is inlaid and cast in the interior, which reduces the manual bonding process, greatly improves the production efficiency, and can realize automatic production;
  • the heat dissipation fin 2 is embedded in the heat dissipation housing 1 and can be firmly fixed
  • the heat-dissipating case 1 is prevented from falling off to ensure normal heat dissipation capability.
  • a plurality of elongated long bosses 11 are uniformly disposed on the heat dissipation housing 1, and the bottom portion 21 of the heat dissipation fins 2 is inlaid and cast in the heat dissipation housing 1.
  • Long boss 11 is on.
  • the bottom portion 21 of the heat dissipating fin 2 has a hollow bottom open structure, the sides are a skirt 23, the bottom of the skirt 23 is folded inward, and the long boss 11 is inlaid and cast in the skirt 23.
  • the hollow structure within the skirt 23 is rectangular.
  • the long side of the rectangle formed by the hollow structure of the skirt 23 and the heat radiating fin 2 are perpendicular to each other, or the short side of the rectangle formed by the hollow structure of the skirt 23 and the heat radiating fin 2 are perpendicular to each other.
  • the hollow structure within the skirt 23 is circular.
  • the circular shape formed by the hollow structure of the skirt 23 is specifically larger than the semicircular superior arc shape, or the circular shape formed by the hollow structure of the skirt 23 is specifically smaller than the semicircular arc shape.
  • the hollow structure in the skirt 23 is an inverted trapezoid.
  • the long side of the inverted trapezoid formed by the hollow structure of the skirt 23 faces the upper side of the heat dissipating fin 2, and the short side faces the lower side of the heat dissipating casing 1.
  • the hollow structure within the skirt 23 is serrated.
  • the zigzag shape is such that a plurality of protrusions are equally spaced at the inner side walls of the hollow structure of the skirt 23, and the shapes of the plurality of protrusions include a rectangle or a triangle or the like. If the shape of the bump is rectangular, the short side of the rectangular bump is in contact with the inner side wall of the hollow structure of the skirt 23; if the shape of the bump is triangular, one side of the triangular bump is in contact with the inner side wall of the hollow structure of the skirt 23, The other two sides of the triangular projection form an angle opposite the center of the hollow structure of the skirt 23.
  • the long boss 11 of the heat dissipation housing 1 is provided with a contour matching with the hollow structure in the skirt 23, and the heat dissipation fin 2 can be installed in the following manner: the heat dissipation fin 2
  • the skirt 23 slides from the side of the heat dissipation housing 1 into the long boss 11 of the heat dissipation housing 1, and is punched by the long boss 11 of the heat dissipation housing 1 or the two skirts 23 of the heat sink fin 2 The end is fixed by this.
  • the die casting described in the present specification refers to a process of filling a mold in a molten state or a semi-molten state under pressure, preferably at a high temperature and a high pressure, and crystal solidifying to form a casting under the pressure.
  • the alloy material may be a non-ferrous alloy, preferably a zinc alloy, an aluminum alloy, or a magnesium alloy, and is not limited to the above materials.
  • the heat dissipating fins in the present specification are formed by extrusion, and the heat dissipating fins are made of a non-ferrous alloy material, preferably an aluminum alloy or a magnesium alloy, and are not limited to the above materials.

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  • Microelectronics & Electronic Packaging (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开一种连接散热鳍片的散热壳体结构，其中：包括由顶壁与侧壁构成的散热壳体，且顶壁与侧壁形成一个外壁，所述外壁上连接有多片散热鳍片。使用本发明一种连接散热鳍片的散热壳体结构，散热鳍片底部通过压铸镶嵌在散热壳体内部，解决了压铸鳍片散热性能不佳、压铸鳍片高度受限制、压铸鳍片重量增加了的问题，同时解决了粘结散热鳍片的胶水不利于热量传导的问题，提高了散热效率。

Description

一种连接散热鳍片的散热壳体结构 技术领域
本发明涉及一种散热设备的技术领域，尤其涉及一种具有较高散热效率的连接散热鳍片的散热壳体。
背景技术
随着电子技术不断的发展，设备功率越来越大，对散热的要求也越来越高。此外，户外电子设备需要防水、防风等防护，室外电子设备多用有色合金铸件壳体作为外壳，一般设计是压铸壳体，盒盖组成的内部空间用于放置印刷线路板(PCB)，或其它设备，起防护作用，又在壳体外部设计散热鳍片，帮助设备自然散热。
现有的散热壳体通常采用2种主结构，结构1直接采用压铸工艺铸造出带有散热鳍片的散热壳体，结构2先压铸出没有鳍片的散热壳体，再采用胶水将鳍片粘结在压铸件底座。这两种结构存在以下缺点：1、结构1受限制于压铸工艺的限制，鳍片高度有工艺上的限制。高大的鳍片使得散热壳体太重以至于难以处理，因此不能在本领域中经济地进行实施。另外，鳍片因有拔模角度，而使得散热壳体的总体重量增加，以允许从模具中脱模，鳍片的合金材料和散热壳体同样的材料，散热系数也一样，总体散热效果受限制。2、散热鳍片粘结在散热壳体上，胶水会因老化而影响到散热鳍片的牢固性，并且容易脱落。另外，胶水的导热系数也限制了散热壳体的散热性能，胶水的导热系数根据市场上的工业产品的数据表的不同而具有巨大的变化性，因此，使得散热外壳的散热性能表现的影响结果是不可靠的。
参见图1所示，专利号为200920213960.0公开了一种散热结构，包括环状灯座51及若干散热鳍片52，其外侧表面交错环设有若干个凹槽53，使得散热鳍片52的一侧通过胶水能够插设于凹槽53中。 该专利通过散热鳍片的使用以此来发散内置发光灯具的热量。但是该专利中的散热鳍片采用胶水与环状灯座粘结，胶水是导热性能差的材料，散热鳍片与环状灯座之间的胶水不利于热量的传导，降低散热效率。
发明内容
本发明的目的在于提供一种连接散热鳍片的散热壳体结构，以适应位于其中的电子元件和外壳，同时允许最轻的结构重量和高热消耗效率，相比现有的压铸工艺而言，不需要在环境和抗压表现上妥协。
本说明书中所述压铸是指将熔融状态或半熔融态的合金材料在加压情况下，优选的是在高温高压下，充填铸型，并在该压力情况下结晶凝固形成铸件的工艺过程。其中，上述的合金材料可以是非铁合金，优选为锌合金、铝合金、镁合金，且不限于上述几种材料。
本说明书中的散热鳍片是通过挤压成型或其他冷成型方法得到的，且散热鳍片的材质为非铁合金材料，优选为铝合金、镁合金，且不限于上述几种材料。
为了实现上述目的，本发明采取的技术方案为：
一种连接散热鳍片的散热壳体结构，其中：包括由外壁(13)与侧壁(12)构成的散热壳体(1)。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片(2)镶嵌铸造在所述散热壳体(1)的外壁(13)内。
所述的连接散热鳍片的散热壳体结构，其中：所述外壁(13)上连接有多片散热鳍片(2)。
所述的连接散热鳍片的散热壳体结构，其中：所述散热壳体(1)在与散热鳍片(2)连接处设置有凸台(11)。
所述的连接散热鳍片的散热壳体结构，其中：所述凸台(11)高度大于所述散热鳍片(2)底部埋设深度。
所述的连接散热鳍片的散热壳体结构，其中：所述凸台(11)截面为矩形、或梯形。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片(2) 的底部(21)镶嵌铸造在所述散热壳体(1)内。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片(2)的底部(21)上方设置有防溢凸台(22)。
所述的连接散热鳍片的散热壳体结构，其中：所述防溢凸台(22)截面为矩形，或者所述防溢凸台(22)截面为三角形，三角形一直角边与所述散热壳体(1)接触。
所述的连接散热鳍片的散热壳体结构，其中：所述防溢凸台(22)上方的散热鳍片(2)由上而下逐渐增厚。
所述的连接散热鳍片的散热壳体结构，其中：所述防溢凸台(22)延伸出所述散热鳍片(2)的两端。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片(2)的底部(21)厚度大于其平均厚度，所述底部(21)埋设在所述散热壳体(1)内。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片(2)的底部(21)截面为倒置的“T”形、三角形、圆形、或工字形中的一种或多种的组合。
所述的连接散热鳍片的散热壳体结构，其中：所述散热壳体(1)上均匀设置有多个长条形的凸台(11)，所述散热鳍片(2)的底部(21)镶嵌铸造在所述散热壳体(1)的凸台(11)上。
所述的连接散热鳍片的散热壳体结构，其中：所述散热壳体(1)上设置有若干凸台(11’)，所述散热鳍片(2)的底部(21)设置有若干避空位(3)，且所述凸台(11’)的高度高于所述避空位(3)的高度。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片(2)的底部(21)为底面开放的中空结构，两侧为裙边(23)，所述裙边(23)底部向内翻折，所述凸台(11)镶嵌铸造于所述裙边(23)内。
所述的连接散热鳍片的散热壳体结构，其中：所述裙边(23)内的中空结构为矩形、圆形、倒梯形、或锯齿形中的一种或多种的组合。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片通过压铸方式镶嵌铸造在所述散热壳体(1)的外壁(13)内。
所述的连接散热鳍片的散热壳体结构，其中：所述压铸方式是将合金材料在加压情况下充填铸型，并在压力下结晶凝固形成铸件的工艺过程。
所述的连接散热鳍片的散热壳体结构，其中：所述合金在熔融态下充填铸型。
所述的连接散热鳍片的散热壳体结构，其中：所述合金在半熔融态下充填铸型。
所述的连接散热鳍片的散热壳体结构，其中：所述散热鳍片(2)的底部设置有用于限位的底部凸块(3)。
本发明由于采用了上述技术，使之与现有技术相比具有的积极效果是：
(1)凸台的设置与传统的全铸壳体相比，在不改变散热壳体厚度的情况下，可以较牢固的固定散热鳍片，保证散热和强度的同时，尽可能的减少材料的使用，降低散热壳体自身重量、降低成本。
(2)散热鳍片底部镶嵌铸造在散热壳体内部，解决了粘结散热鳍片的胶水不利于热量传导且传导效果不持续的问题，提高了散热效率。而且由于工序是自动化的而且被整合到了铸造过程中，因此减少了人工粘结的工序，提高了生产效率。同时，使得散热鳍片牢牢固定在散热壳体上，防止了因为胶水老化而产生的脱落，保证正常的散热能力，另外，由于新技术并不需要为散热鳍片而用化学材料清洗和准备主外壳以产生胶水良好的粘结，从而在环境保护和职业病防护方面也得到了加强。由于胶水的固化炉管制造阶段不再需要，因而极大地降低了能量损耗。
(3)散热鳍片底部上方设置防溢凸台，防止铸造时金属液体从散热鳍片两侧溢出造成材料的浪费。防溢凸台上方的散热鳍片由上而下逐渐增厚，防止铸造时金属液体从防溢凸台两侧溢入。同时，防溢凸台延伸出散热鳍片的两端，进一步防止铸造时金属液体从散热鳍片两端溢出造成材料的浪费。
(4)散热鳍片底部的裙边将凸台包裹在其内部，有效减小铸造内应力，防止变形。
(5)散热鳍片底部为中空底面开放结构，防止铸造时金属液体出造成材料的浪费。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，并可依照说明书的内容予以实施，以下以本发明的较佳实施例并配合附图详细说明如后。本发明的具体实施方式由以下实施例及其附图详细给出。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1为专利号为200920213960.0的散热结构示意图；
图2为散热壳体局部视图；
图3为散热壳体剖视图；
图4a为防溢凸台截面为矩形的散热鳍片示意图；
图4b为防溢凸台截面为三角形的散热鳍片示意图；
图4c为图4a中散热鳍片逐渐增厚示意图；
图4d为图4b中散热鳍片逐渐增厚示意图；
图5为向外延伸出防溢凸台的散热鳍片示意图；
图6为底部设置有底部凸块的散热鳍片示意图；
图7为图6的左视图；
图8为散热壳体剖视图；
图9a为底部截面为三角形的散热鳍片示意图；
图9b为底部截面为倒置的“T”形的散热鳍片示意图；
图9c为底部截面为圆形的散热鳍片示意图；
图9d为底部截面为工字形的散热鳍片示意图；
图9e为底部截面为工字形的散热鳍片另一实施例示意图；
图9f为底部开设有避空位的散热鳍片示意图；
图10为散热壳体剖视图；
图11a为裙边为矩形的散热鳍片示意图；
图11b为裙边为圆形的散热鳍片示意图；
图11c为裙边为倒梯形的散热鳍片示意图；
图11d为裙边为锯齿形的散热鳍片示意图。
图中标号说明：1、散热壳体；11、长凸台；11’、圆凸台；12、侧壁；13、外壁；2、散热鳍片；21、底部；22、防溢凸台；23、裙边；24、避空位；3、底部凸块；51、环状灯座；52、散热鳍片；53、凹槽。
具体实施方式
下面结合附图和具体实施例对本发明作进一步说明，但不作为本发明的限定。
参照图2、图3所示，一种连接散热鳍片的散热壳体结构，包括由顶壁与侧壁12构成的散热壳体1。顶壁和侧壁12形成了外壳13。散热鳍片2通过压铸嵌入在外壁13。
参照图3所示，进一步来看，外壁13上连接有多片散热鳍片2，多片散热鳍片2相互等间距并平行地设置在外壁13上。散热鳍片2插入外壁13的深度即可达到位置。
通过上述的文字表述并结合附图可以看出，散热鳍片没有采用胶水粘结，是直接采用压铸嵌入在散热壳体中，减少了人工粘结的工序，提高了散热壳体的导热性能，提高的紧固可靠性，大大提高了生产效率，并可实现自动化生产。
在本发明的实施例中，散热鳍片2的底部21镶嵌铸造在散热壳体1内。作为本发明一较佳的实施方式，散热鳍片2的底部21上方设置有防溢凸台22。
参照图4a所示，防溢凸台22截面为矩形。防溢凸台22所形成的矩形的长边与散热壳体1的端面直接接触。
参照图4b所示，防溢凸台22截面为三角形，三角形一直角边与散热壳体1接触。
再进一步结合本发明的实际使用情况来看，散热鳍片2底部21上方设置防溢凸台22，防止铸造时金属液体从散热鳍片2两侧溢出 造成材料的浪费。
为了防止铸造时金属液体从防溢凸台两侧溢入，防溢凸台22上方的散热鳍片2由上而下逐渐增厚。
参照图4c所示，防溢凸台22截面为矩形，防溢凸台22所形成的矩形的长边与散热壳体1的端面直接接触，并且防溢凸台22上方的散热鳍片2由上而下逐渐增厚。
参照图4d所示，防溢凸台22截面为三角形，三角形一直角边与散热壳体1接触，并且防溢凸台22上方的散热鳍片2由上而下逐渐增厚。
参照图5所示，为了进一步防止铸造时金属液体从散热鳍片两端溢出造成材料的浪费，防溢凸台22延伸出散热鳍片2的两端。
参照图6和图7所示，作为本发明一较佳实施方式，散热鳍片2的底部还设置有用于限位的底部凸块3，当散热鳍片2与散热壳体1连接后，位于散热鳍片2底部的底部凸块3的下表面与散热壳体2的外壁13齐平。
通过上述的文字表述并结合附图可以看出，散热鳍片2底部镶嵌铸造在散热壳体1内部，解决了粘结散热鳍片2的胶水不利于热量传导的问题。同时，并不制于压铸工艺的限制，从而使得鳍片高度没有了工艺上的限制，鳍片也不会因有拔模角度，而使得散热壳体的总体重量增加，鳍片的合金材料和散热壳体可以采用不同的材料，因而其散热系数可以不同，总体散热效果不受制约，提高了散热效率、减少了人工粘结的工序，大大提高了生产效率，并可实现自动化生产，并使得散热鳍片2牢牢固定在散热壳体1上，防止脱落，保证正常的散热能力。
在本发明的另一实施例中，参照图8所示，散热壳体1在与散热鳍片2连接处设置有长凸台11。
作为本发明一较佳的实施方式，长凸台11高度大于散热鳍片2底部埋设深度。
结合本发明一实施方式来看，长凸台11截面为矩形。矩形的长凸台11在散热壳体1上向上延伸设置，并且长凸台11所形成的矩形 的长边与散热壳体1垂直，长凸台11所形成的矩形的短边与散热鳍片2相接触。
结合本发明一实施方式来看，长凸台11截面为梯形。长凸台11所形成的梯形的长边与散热壳体1直接接触，长凸台11所形成的梯形的短边与散热鳍片2相接触。
通过上述的文字表述并结合附图可以看出，长凸台11的设置使不改变散热壳体1厚度的情况下，可以较牢固的固定散热鳍片2，保证散热和强度的同时，尽可能的减少材料的使用，降低成本。
在本发明的另一实施例中，参照图9a所示，散热鳍片2的底部21厚度大于其平均厚度，底部21镶嵌铸造在散热壳体1内。
参照图9a所示，结合本发明一较佳的实施方式来看，散热鳍片2的底部21截面为三角形。散热鳍片2底部21所形成的三角形的一边与散热壳体1相平行，散热鳍片2底部21所形成的三角形另两边延伸形成的角与散热鳍片2的底部21接触。
参照图9b所示，结合本发明一实施方式来看，散热鳍片2的底部21截面为倒置的“T”形。散热鳍片2底部21所形成的倒“T”形的横边与散热壳体1相平行，散热鳍片2底部21所形成的倒“T”形的竖边与散热鳍片2共线并相接触。
参照图9c所示，结合本发明一实施方式来看，散热鳍片2的底部21截面为圆形。
结合本发明一实施方式来看，参照图9d所示，散热鳍片2的底部21截面为工字形。散热鳍片2底部21所形成的工字形包括两横边和位于两横边之间的一竖边，工字形底部21的一横边与散热壳体1相平行，另一横边与散热鳍片2垂直接触。参见图9e所示，或者为工字形底部21的竖边与散热鳍片2垂直接触。
如图9f所示，作为本发明一实施方式来看，散热鳍片2的底部开设有用于避开散热壳体1内部的螺纹孔的避空位24，仅在散热壳体1对应位置设有圆凸台11’。位于这些避空位处的圆凸台11’的高度高于与之相对应的螺纹孔和圆凸台11’的高度。
结合本发明一实施方式来看，散热壳体1上预留有与散热鳍片2 的底部21相匹配的凹槽形状，散热鳍片2的安装方式可采用：散热鳍片2的底部21从散热壳体1的侧面滑入散热壳体1的凹槽内，并且通过冲压散热壳体1或者插入封铸散热鳍片2的底部21的两端以此固定。
通过上述的文字表述并结合附图可以看出，散热鳍片2底部21直接设置在散热壳体1内部，解决了粘结散热鳍片2的胶水不利于热量传导的问题，提高了散热效率；散热鳍片2底部21镶嵌铸造于内部，减少了人工粘结的工序，大大提高了生产效率，并可实现自动化生产；此外，散热鳍片2埋设在散热壳体1内，能够牢牢固定在散热壳体1上，防止其脱落，保证正常的散热能力。
在本发明的另一实施例中，参照图10所示，散热壳体1上均匀设置有多个长条形的长凸台11，散热鳍片2的底部21镶嵌铸造在散热壳体1的长凸台11上。散热鳍片2的底部21为中空底面开放结构，两侧为裙边23，裙边23底部向内翻折，长凸台11镶嵌铸造于裙边23内。
参照图11a所示，裙边23内的中空结构为矩形。裙边23中空结构所形成的矩形的长边与散热鳍片2相互垂直，或者裙边23中空结构所形成的矩形的短边与散热鳍片2相互垂直。
参照图11b所示，裙边23内的中空结构为圆形。裙边23中空结构所形成的圆形具体为大于半圆形优弧状，或者裙边23中空结构所形成的圆形具体为小于半圆形劣弧状。
参照图11c所示，裙边23内的中空结构为倒梯形。裙边23中空结构所形成的倒梯形的长边朝散热鳍片2所在的上方，短边朝散热壳体1所在的下方。
参照图11d所示，裙边23内的中空结构为锯齿形。锯齿形为在裙边23中空结构的两内侧壁均等间距间隔设置若干凸块，该若干凸块的形状包括矩形或者三角形等。若凸块的形状为矩形，则矩形凸块的短边与裙边23中空结构的内侧壁接触；若凸块的形状为三角形，三角形凸块的一边与裙边23中空结构的内侧壁接触，三角形凸块的另两边形成的角正对裙边23中空结构的中央。
结合本发明一实施方式来看，散热壳体1的长凸台11上预留有与裙边23内的中空结构相匹配的外形轮廓，散热鳍片2的安装方式可采用：散热鳍片2的裙边23从散热壳体1的侧面滑入散热壳体1的长凸台11上，并且通过冲压散热壳体1的长凸台11或者插入封铸散热鳍片2的裙边23的两端以此固定。
本说明书中所述压铸是指将熔融状态或半熔融态的合金材料在加压情况下，优选的是在高温高压下，充填铸型，并在该压力情况下结晶凝固形成铸件的工艺过程。其中，上述的合金材料可以是非铁合金，优选为锌合金、铝合金、镁合金，且不限于上述几种材料。
本说明书中的散热鳍片是通过挤压成型的，且散热鳍片的材质为非铁合金材料，优选为铝合金、镁合金，且不限于上述几种材料。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (24)

  1. 一种连接散热鳍片的散热壳体结构，其特征在于：包括由顶壁与侧壁(12)构成的散热壳体(1)。
  2. 根据权利要求1所述的连接散热鳍片的散热壳体结构，其特征在于：所述顶壁和所述侧壁(12)形成一外壁(13)
  3. 根据权利要求2所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热鳍片(2)镶嵌铸造在所述散热壳体(1)的外壁(13)内。
  4. 根据权利要求2或3所述的连接散热鳍片的散热壳体结构，其特征在于：所述外壁(13)上连接有多片散热鳍片(2)。
  5. 根据权利要求4所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热壳体(1)在与散热鳍片(2)连接处设置有长凸台(11)。
  6. 根据权利要求5所述的连接散热鳍片的散热壳体结构，其特征在于：所述长凸台(11)高度大于所述散热鳍片(2)底部埋设深度。
  7. 根据权利要求5所述的连接散热鳍片的散热壳体结构，其特征在于：所述长凸台(11)截面为矩形、或梯形、或矩形和梯形的组合。
  8. 根据权利要求4所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热鳍片(2)的底部(21)镶嵌铸造在所述散热壳体(1)内。
  9. 根据权利要求8所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热鳍片(2)的底部(21)上方设置有防溢凸台(22)。
  10. 根据权利要求9所述的连接散热鳍片的散热壳体结构，其特征在于：所述防溢凸台(22)截面为矩形，或者所述防溢凸台(22)截面为三角形，三角形一直角边与所述散热壳体(1)接触。
  11. 根据权利要求9或10所述的连接散热鳍片的散热壳体结构，其特征在于：所述防溢凸台(22)上方的散热鳍片(2)由上而下逐渐增厚。
  12. 根据权利要求9或10所述的连接散热鳍片的散热壳体结构，其 特征在于：所述防溢凸台(22)延伸出所述散热鳍片(2)的两端。
  13. 根据权利要求4所述的连接散热鳍片的散热壳体结构，其特征在于：所述底部(21)埋设在所述散热壳体(1)内。
  14. 根据权利要求13所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热鳍片(2)的底部(21)截面为倒置的“T”形、三角形、圆形、或工字形中的一种或多种的组合。
  15. 根据权利要求6所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热壳体(1)上均匀设置有多个长条形的长凸台(11)，所述散热鳍片(2)的底部(21)镶嵌铸造在所述散热壳体(1)的长凸台(11)上。
  16. 根据权利要求6所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热壳体(1)上设置有若干圆凸台(11’)，所述散热鳍片(2)的底部(21)设置有若干避空位(24)，且所述圆凸台(11’)的高度高于所述避空位(24)的高度。
  17. 根据权利要求15所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热鳍片(2)的底部(21)为底面开放的中空结构，两侧为裙边(23)，所述裙边(23)底部向内翻折。
  18. 根据权利要求17所述的连接散热鳍片的散热壳体结构，其特征在于：所述裙边(23)内的中空结构为矩形、圆形、倒梯形、或锯齿形中的一种或多种的组合。
  19. 根据权利要求2所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热鳍片通过压铸方式镶嵌铸造在所述散热壳体(1)的外壁(13)内。
  20. 根据权利要求19所述的连接散热鳍片的散热壳体结构，其特征在于：所述压铸方式是将合金材料在加压情况下充填铸型，并在压力下结晶凝固形成铸件的工艺过程。
  21. 根据权利要求20所述的连接散热鳍片的散热壳体结构，其特征在于：所述合金在熔融态下充填铸型。
  22. 根据权利要求20所述的连接散热鳍片的散热壳体结构，其特征在于：所述合金在半熔融态下充填铸型。
  23. 根据权利要求4所述的连接散热鳍片的散热壳体结构，其特征在于：所述散热鳍片(2)的底部设置有用于使散热鳍片接触散热壳体的内腔的底部凸块(3)，所述底部凸块与外壁齐平，从而在压铸工艺中够引导散热鳍片进行垂直对准，改善内部功率元件的散热。
  24. 根据权利要求5所述的连接散热鳍片的散热壳体结构，其特征在于：所述裙边(23)的高度小于所述长凸台(11)的高度，所述长凸台(11)将所述散热鳍片(2)的底部连接于其上。
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EP2894954A4 (en) 2016-06-15
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EP2894954B1 (en) 2021-08-11
KR20160093744A (ko) 2016-08-09
EP2894954A1 (en) 2015-07-15

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