WO2015071969A1 - Structure de montage de grand composant et procédé de montage de grand composant - Google Patents

Structure de montage de grand composant et procédé de montage de grand composant Download PDF

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Publication number
WO2015071969A1
WO2015071969A1 PCT/JP2013/080633 JP2013080633W WO2015071969A1 WO 2015071969 A1 WO2015071969 A1 WO 2015071969A1 JP 2013080633 W JP2013080633 W JP 2013080633W WO 2015071969 A1 WO2015071969 A1 WO 2015071969A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
substrate
component
large component
transfer
Prior art date
Application number
PCT/JP2013/080633
Other languages
English (en)
Japanese (ja)
Inventor
芝芳 戸谷
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2013/080633 priority Critical patent/WO2015071969A1/fr
Priority to JP2015547316A priority patent/JP6319812B2/ja
Publication of WO2015071969A1 publication Critical patent/WO2015071969A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention relates to a large component mounting structure in which a large component is soldered to a substrate and a large component mounting method.
  • a shield component for protecting an electronic component mounted on a substrate is mounted on the substrate.
  • a solder paste is screen-printed on a predetermined portion of a land pattern on an upper surface of a substrate to form a solder print portion, and then the shield component bonding surface is superimposed on the solder print portion of the substrate.
  • the large component is mounted on the substrate after alignment, and then the substrate on which the shield component is mounted is carried into a reflow apparatus, and the solder printing portion of the substrate is heated to thereby mount the shield component on the substrate. Reflow soldering is used.
  • Patent Document 1 describes that a thin solder coat layer of about 10 to 30 ⁇ m is formed on the surface of the shield component in order to improve the wettability of the molten solder during the reflow process.
  • Japanese Patent Application Laid-Open No. H10-228561 describes that a solder chip is mounted at a location where a mounting failure of a shield component may occur due to an insufficient amount of solder only by a solder printing portion of a substrate.
  • the solder printing part for soldering the shield part to the substrate is formed by screen printing at the same time as the solder printing part for mounting the other mounting parts.
  • the solder printing part to be soldered is also thinner. For this reason, due to the twisting and warping of a large shield component, a mounting failure of the shield component is likely to occur due to insufficient solder amount only at the solder printing portion of the substrate.
  • Patent Document 1 the solder chip is mounted only at a portion where the mounting failure of the shield component may occur due to insufficient solder amount only by the solder printing portion of the substrate.
  • Such a problem is a problem that occurs in the same manner even when a large component other than the shield component is soldered to the substrate.
  • the problem to be solved by the present invention is to provide a large component mounting structure and a large component mounting method capable of realizing improvement in soldering reliability, reduction in manufacturing cost, and improvement in productivity when a large component is soldered to a substrate. That is.
  • the present invention provides a large component mounting structure in which a large component is soldered to a substrate, and a solder formed by a printing method on a portion of the mounting surface of the substrate where the large component is soldered
  • the printed portion and a solder transfer portion formed by a transfer method are reflow soldered to a portion of the large component to be soldered to the solder printed portion of the substrate.
  • a solder transfer portion is formed by a transfer method in a portion of the large component to be soldered to the solder print portion of the substrate, the gap between the solder print portion of the substrate and the large component is transferred by solder transfer. It can be filled with the portion, both can be securely soldered, and the soldering reliability can be improved.
  • the solder transfer portion is formed on the large component by the transfer method, a plurality of solder transfer portions to be formed on the large component can be formed efficiently and at the same time, manufacturing cost reduction and productivity improvement can be realized.
  • the large component to which the present invention can be applied is not limited to the shield component that protects the electronic component mounted on the substrate, and may be a large component other than the shield component.
  • Large shield parts are likely to be twisted and warped, and the gap between the printed circuit board and the solder printing portion tends to be large, so that the effect of applying the present invention is great.
  • the solder transfer part it is preferable to form a convex part protruding downward in a part of the large part where the solder transfer part is formed. In this way, it is possible to reliably and easily form the solder transfer portion only on the convex portion of the large component by the transfer method, and the solder transfer portion can be easily formed with high accuracy.
  • the large component mounting method of the present invention includes a printing process in which solder is printed on a portion of a mounting surface of a substrate where a large component is to be soldered to form a solder printing portion, and solder printing of the substrate in the large component A step of immersing the part to be joined in the solder in the transfer tank to form a solder transfer part in the part, and aligning the solder transfer part of the large component so as to overlap the solder printing part of the substrate A mounting step of mounting the large component on the substrate, and the substrate on which the large component is mounted is carried into a reflow apparatus, and the solder transfer portion and the solder printing portion are heated to attach the large component to the substrate. And a reflow process for reflow soldering.
  • FIGS. 1A to 1D are process diagrams showing a mounting process of a shield component according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of the shield component.
  • a solder printing unit 14 for soldering the shield component 11 is printed on the surface of the land 13 (conductor pattern) formed on the mounting surface of the substrate 12 by a printing method such as screen printing. It is formed with.
  • the shield component 11 soldered on the substrate 12 is frame-shaped or protected to protect an electronic component (not shown) mounted on the substrate 12. It is formed in a cover shape (case shape).
  • a plurality of convex portions 15 projecting downward are formed at predetermined intervals on the lower end surface of the shield component 11, and the downward projecting dimension of each convex portion 15 is constant. Therefore, when the shield component 11 is not twisted or warped, the lower end surface of each convex portion 15 is positioned in the same plane.
  • a solder transfer portion 17 is formed on the lower end surface of each convex portion 15 by a transfer method (dip method).
  • solder transfer portion 17 of the shield component 11 With the solder transfer portion 17 of the shield component 11 overlaid on the solder print portion 14 of the substrate 12, the solder transfer portion 17 and the solder print portion 14 are heated and reflowed, and the shield component 11 is reflow soldered to the substrate 12. ing.
  • a suction surface portion 18 that is sucked by a suction nozzle (not shown) of a component mounting machine when the shield component 11 is mounted is formed at the position of the center of gravity of the shield component 11 or a position close thereto.
  • a screen printing device (not shown) is arranged on the upstream side of the conveyance path of the substrate 12, and one or more component mounting machines (not shown) are arranged on the downstream side thereof.
  • a reflow device (not shown) is disposed on the downstream side.
  • Each component mounter is set with a component feeder (not shown) such as a tape feeder and a tray feeder for supplying electronic components to be mounted on the substrate 12, and the component mounter for mounting the shield component 11.
  • a tray feeder for supplying the shield component 11, a component feeder (not shown) such as a tape feeder, and a transfer device (not shown) for forming the solder transfer portion 17 on the lower end surface of each convex portion 15 on the lower surface of the shield component 11. Z) is set.
  • a board 12 put into a component mounting line is carried into a screen printing apparatus (not shown), and a shield part 11 on a mounting surface of the board 12 is soldered. 13, a printing process is performed in which solder paste (cream solder) is screen-printed to form the solder printing unit 14. In this printing process, a solder printing section (not shown) for mounting other mounted components is simultaneously screen-printed.
  • solder paste cream solder
  • the substrate 12 on which the solder printing unit 14 is formed in this way is conveyed to one or a plurality of component mounting machines arranged on the downstream side of the screen printing apparatus, and the mounted components are sequentially mounted on the substrate 12. .
  • the suction surface portion 18 of the shield component 11 supplied by the component supply device is sucked by the suction nozzle (not shown) of the component mounter. Then, the shield component 11 is moved above the transfer tank (transfer table) of the transfer device, and the shield component 11 is lowered by the lowering operation of the suction nozzle, so that each convex portion 15 on the lower surface of the shield component 11 is moved.
  • a transfer step of forming the solder transfer portion 17 is performed by immersing the solder in liquid or paste in the transfer tank and attaching the solder to the lower end surface of each convex portion 15.
  • the shield component 11 on which the solder transfer portion 17 is formed is moved above the substrate 12 while being attracted to the suction nozzle, and the solder transfer portion 17 of the shield component 11 is moved.
  • a mounting process for mounting the shield component 11 on the substrate 12 is performed by positioning so as to overlap the solder printing portion 14 of the substrate 12.
  • the board 12 on which the shield component 11 is mounted is carried into a reflow apparatus (not shown), and the solder transfer portion 17 and the solder printing portion 14 are heated to thereby shield the shield.
  • a reflow process for reflow soldering the component 11 to the substrate 12 is executed.
  • the solder transfer portion 17 is formed by the transfer method on the convex portion 15 to be soldered to the solder print portion 14 of the substrate 12 in the shield component 11.
  • the gap between the portion 14 and the convex portion 15 of the shield component 11 can be filled with the solder transfer portion 17, both can be securely soldered, and the soldering reliability can be improved.
  • the solder transfer portion 17 is formed on the shield component 11 by the transfer method, the solder transfer portions 17 formed on the shield component 11 can be efficiently formed at a time, thereby reducing manufacturing costs and improving productivity. Can be realized.
  • the convex portion 15 protruding downward is formed in the portion of the shield component 11 where the solder transfer portion 17 is to be formed, only the convex portion 15 of the shield component 11 is reliably transferred by the transfer method.
  • the solder transfer portion 17 can be easily formed and the solder transfer portion 17 can be easily formed with high accuracy.
  • the large component to which the present invention can be applied is not limited to the shield component as in the above embodiment, and may be a large component other than the shield component.
  • the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention, such as changing the shape of the shield component (large component) or changing the number of solder transfer portions 17. Needless to say, this can be done.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Selon la présente invention, dans le cas du brasage d'un composant blindé (11), c'est-à-dire d'un grand composant, sur une surface de montage d'un substrat (12), en premier lieu, une section à brasure imprimée (14) est formée par impression d'une pâte à braser sur une plage d'accueil (13) à laquelle le composant blindé doit être brasé, ladite plage d'accueil étant une partie de la surface de montage du substrat, une section saillante (15) du composant blindé est immergée dans de la brasure à l'état liquide ou à l'état pâteux dans une cuve de transfert, ladite section saillante étant destinée à être collée à la section à brasure imprimée du substrat, et une section à brasure transférée (17) est formée sur une surface d'extrémité inférieure de la section saillante. Ensuite, la section à brasure transférée du composant blindé est alignée de manière que la section à brasure transférée se superpose à la section à brasure imprimée du substrat, et le composant blindé est monté sur le substrat. Le substrat sur lequel le composant blindé est monté est ensuite transporté jusqu'à un appareil de refusion, la section à brasure transférée et la section à brasure imprimée sont chauffées, et le composant blindé est brasé au substrat par brasage par refusion.
PCT/JP2013/080633 2013-11-13 2013-11-13 Structure de montage de grand composant et procédé de montage de grand composant WO2015071969A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2013/080633 WO2015071969A1 (fr) 2013-11-13 2013-11-13 Structure de montage de grand composant et procédé de montage de grand composant
JP2015547316A JP6319812B2 (ja) 2013-11-13 2013-11-13 大型部品実装構造及び大型部品実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/080633 WO2015071969A1 (fr) 2013-11-13 2013-11-13 Structure de montage de grand composant et procédé de montage de grand composant

Publications (1)

Publication Number Publication Date
WO2015071969A1 true WO2015071969A1 (fr) 2015-05-21

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Application Number Title Priority Date Filing Date
PCT/JP2013/080633 WO2015071969A1 (fr) 2013-11-13 2013-11-13 Structure de montage de grand composant et procédé de montage de grand composant

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JP (1) JP6319812B2 (fr)
WO (1) WO2015071969A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012456A (zh) * 2018-01-19 2018-05-08 南京利景盛电子有限公司 一种金属异型腔体内底面印膏搪锡工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008072037A (ja) * 2006-09-15 2008-03-27 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2008072036A (ja) * 2006-09-15 2008-03-27 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品実装方法
JP2010245561A (ja) * 2010-07-13 2010-10-28 Fujitsu Media Device Kk 電子部品の製造方法
JP2012028432A (ja) * 2010-07-21 2012-02-09 Murata Mfg Co Ltd 電子部品
JP2013197565A (ja) * 2012-03-23 2013-09-30 Murata Mfg Co Ltd 複合モジュールおよびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3655743B2 (ja) * 1997-12-25 2005-06-02 松下電器産業株式会社 フィルム基板への電子部品半田付け方法
JP2001102738A (ja) * 1999-09-30 2001-04-13 Matsushita Electric Ind Co Ltd 電子部品実装半田付け方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008072037A (ja) * 2006-09-15 2008-03-27 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2008072036A (ja) * 2006-09-15 2008-03-27 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品実装方法
JP2010245561A (ja) * 2010-07-13 2010-10-28 Fujitsu Media Device Kk 電子部品の製造方法
JP2012028432A (ja) * 2010-07-21 2012-02-09 Murata Mfg Co Ltd 電子部品
JP2013197565A (ja) * 2012-03-23 2013-09-30 Murata Mfg Co Ltd 複合モジュールおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012456A (zh) * 2018-01-19 2018-05-08 南京利景盛电子有限公司 一种金属异型腔体内底面印膏搪锡工艺

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Publication number Publication date
JPWO2015071969A1 (ja) 2017-03-09
JP6319812B2 (ja) 2018-05-09

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