WO2015051637A1 - 一种掩模板搬运治具 - Google Patents
一种掩模板搬运治具 Download PDFInfo
- Publication number
- WO2015051637A1 WO2015051637A1 PCT/CN2014/076852 CN2014076852W WO2015051637A1 WO 2015051637 A1 WO2015051637 A1 WO 2015051637A1 CN 2014076852 W CN2014076852 W CN 2014076852W WO 2015051637 A1 WO2015051637 A1 WO 2015051637A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rod
- mask
- sleeve
- state
- driving rod
- Prior art date
Links
- 230000005540 biological transmission Effects 0.000 claims description 24
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000033001 locomotion Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000872 buffer Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
Definitions
- the present invention relates to the field of liquid crystal display technology, and in particular, to a mask transport jig. Background technique
- embodiments of the present invention provide a reticle handling jig that avoids direct contact between a human hand and a reticle during handling, and avoids the risk of damage to the reticle.
- a reticle handling jig comprising:
- a fixing structure for fixing a mask to be carried the fixing structure being disposed on the handling bracket.
- the fixing structure comprises:
- the latching structure is capable of being engaged with a corresponding edge of the mask to be handled in the first state, the snapping The structure releases the mask to be handled in the second state.
- the snap-fit structure includes an actuator rod having one end of the actuator rod having a card slot engageable with an edge of the mask to be transported, and the other end of the actuator rod is coupled to the connection structure.
- connection structure comprises:
- the driving rod is disposed in parallel with the mask to be transported when the engaging structure is in the first state, and the driving rod is to be carried when the engaging structure is in the second state
- the first end of the driving rod is pivotally connected to the carrying bracket;
- the driving rod is pivotally connected to one end of the driving rod and the carrying bracket,
- the other end of the transmission rod is pivotally connected to the latching structure;
- a sleeve for defining a position of the drive rod when the snap-fit structure is in the first state, the sleeve is coupled to the carrier bracket, and is disposed outside the drive rod, A sleeve is provided at a position corresponding to the first end of the drive rod with a connection for connection to the snap-fit structure.
- the execution rod is provided with a sliding slot
- the transmission rod is provided with a through hole at a position corresponding to the sliding slot, and a screw passes through the sliding slot and the through hole, and the transmission rod is Connected to the actuator rod, the transmission rod is rotated by the driving rod, and the screw moves in the sliding groove to drive the execution rod to clamp the mask to be transported or to release the to-be-moved Mask plate.
- a tension between the sleeve and the driving rod is provided for a predetermined angle between the driving rod and the sleeve when the locking structure is in the second state. component.
- the fixing structure further comprises: fastening the driving rod and the sleeve when the snap structure is in the first state, and in the second state when the snap structure is in the second state And releasing the driving rod and the pin of the sleeve, the pin penetrating through the first through hole on the sleeve and the second through hole on the driving rod.
- the sleeve rod is a strip-shaped groove structure having a U-shaped cross section, and two side walls of the sleeve rod extend outward from a position corresponding to the first end of the driving rod to form two the connections.
- the two connecting portions are pivotally connected to the latching structure.
- the carrying bracket is a cross-shaped structure formed by intersecting a plurality of beams, and the ends of the well-shaped structure are provided with the fixing structure.
- the carrying bracket comprises two long beams and two short beams arranged side by side, and a reinforcing rib is arranged between the two long beams.
- the beneficial effects of the invention are: avoiding direct contact between the human hand and the mask, reducing the risk of damage during the handling of the mask, and improving work efficiency.
- Figure 1 is a schematic view showing the structure of the present invention
- Figure 2 is a schematic view showing the execution rod of the present invention in a first state
- Figure 3 is a schematic view showing the second state of the actuator rod of the present invention.
- FIG. 4 is a block diagram showing the structure of the present invention. detailed description
- an embodiment of the present invention provides a mask 4 carrying jig, comprising: a carrying bracket;
- a fixing structure 2 for fixing the mask 4 to be carried the fixing structure 2 being provided on the carrying bracket.
- the arrangement of the mask 4 in the present embodiment avoids the direct contact between the human hand and the mask 4, eliminates the contamination of the mask 4 by the human hand, reduces the risk of the mask 4 being damaged during the handling process, and improves the work efficiency. .
- the fixing structure 2 fixes the mask 4 to be transported, and the above technical effects can be achieved. Therefore, the structure of the fixing structure 2 can be various. The following structural details are adopted for the embodiment. Described as follows.
- the fixed structure 2 includes:
- the latching structure is capable of being engaged with a corresponding edge of the mask 4 to be handled in the first state, the card The joint structure releases the mask 4 to be handled in the second state.
- the mask 4 is fixed by snapping to prevent damage to the mask 4.
- the snap-fit structure can be engaged with the mask to be transported, and can be changed between the first state and the second state under the control of the connection structure, thereby achieving the above effects, and thus the structure of the snap-fit structure can be various
- the snap-fit structure includes an execution rod 23, and one end of the execution rod 23 has a card slot 231 engageable with an edge of the mask 4 to be transported, and the other end of the actuator rod 23
- the connection structure is connected.
- the structure of the mask transport jig is described in detail below by the actuator bar 23.
- the width of the card slot 231 is adapted to the thickness of the mask 4 to be carried in order to clamp the mask 4.
- connection structure includes:
- the driving rod 22 is disposed in parallel with the mask 4 to be transported (the mask to be transported is generally placed in parallel) when the actuator rod 23 is in the first state, and the driving rod 22 is in the
- the second end of the operating rod 23 is at an angle to the mask to be transported, and the first end of the driving rod 22 is pivotally connected to the beam 1 on the corresponding carrying bracket;
- a driving rod 24 one end of the transmission rod 24 is pivotally connected to one end of the driving rod 22 and the carrying bracket, and the other end of the driving rod 24 is pivotally connected to the executing rod 23;
- the sleeve rod 21 for defining a position of the drive rod 22 when the actuator rod 23 is in the first state, the sleeve rod 21 is coupled to the carrier bracket and is disposed on the drive rod 22 Externally, the sleeve 21 is provided with a connecting portion 211 for connection with the actuator rod 23 at a position corresponding to the first end of the drive rod 22.
- the fixing structure 2 is fixed and loosened to the mask 4 to be transported by the same principle as the crank slider mechanism, the driving rod 22 and the transmission rod 24 are kept in a vertical state, and the driving rod 22 is pivotally connected to the corresponding beam 1
- the transmission rod 24 is pivotally connected to the execution rod 23, and the execution rod 23 is pivotally connected to the sleeve rod 21.
- the sleeve rod 21 is used for fixing the execution rod 23, and the power source of the execution rod 23 is only transmitted by the transmission rod 24 to ensure the execution rod. 23 movement direction and movement angle.
- the driving rod 22 moves toward the sleeve 21 until the driving rod 22 is parallel with the sleeve rod 21, and the driving transmission rod 24 rotates.
- the execution rod 23 moves to the direction of the mask 4 to be conveyed to
- the card slot 231 is engaged with the corresponding edge of the mask 4 to be transported, that is, the actuator rod 23 is in the first state, as shown in FIG. 2; the driving rod 22 is moved away from the sleeve 21, and the driving transmission rod 24 is reversely moved.
- the execution rod 23 moves in the reverse direction, and the mask 4 is disengaged from the card slot 231, that is, the execution rod 23 is in the second state, as shown in FIG.
- the execution rod 23 is provided with a sliding slot.
- the transmission rod 24 is provided with a through hole at a position corresponding to the sliding slot.
- the screw passes through the sliding slot and the through hole, and the transmission rod 24 and the actuator rod are disposed. 23, the transmission rod 24 is rotated by the driving rod 22, and the screw moves in the sliding groove to drive the execution rod 23 to clamp the mask 4 to be conveyed or to release the mask 4 to be conveyed.
- the solid line in Fig. 4 shows the state of the drive lever 22, the transmission lever 24, and the execution lever 23 when the actuator lever 23 is in the first state; the broken line indicates the drive lever 22, the transmission lever 24, and the execution lever 23 when the execution lever 23 is in the first state. status.
- the elastic member is a spring, which defines a range of motion of the driving rod 22, so as to effectively control the range of motion of the operating rod 23, so that when the operating rod 23 is in the first state, the driving rod 22 is parallel to the sleeve rod 21.
- the execution rod 23 is perpendicular to the driving rod 22, that is, perpendicular to the mask 4 to be transported, the card slot 231 is engaged with the mask 4 to be transported, and when the lever 23 is in the second state, the driving rod 22 and the sleeve
- the angle between 21 is the angle a of Figure 4.
- the mask 4 carries the life of the jig.
- the fixing structure 2 further includes For fastening the drive rod 22 and the sleeve 21 when the actuator rod 23 is in the first state, and releasing the drive rod 22 when the execution rod 23 is in the second state And a pin 25 of the sleeve 21, the pin 25 is disposed through the first through hole on the sleeve 21 and the second through hole on the driving rod 22.
- the sleeve 21 is a U-shaped strip-shaped groove structure, and the two side walls of the sleeve 21 extend outwardly from the first end of the drive rod 22 to form two
- the connecting portion 211 is partially located between the two connecting portions 211, and the execution rod 23 is pivotally connected to the ends of the two connecting portions 211.
- One end of the rod 23 is not pivotally connected to the transmission rod 24, and the connection point of the rod 23 connected to the connecting portion 211 has a predetermined distance from the slot 231 according to actual needs, so as to fix the rod 23, which is advantageous for The direction of movement and the angle of movement of the actuator 23 are controlled.
- the handling bracket is used to provide the fixing structure 2, and the hand-held portion of the manual handling mask 4 or the clamping portion of the tool handling mask 4 is provided.
- the technical effect, therefore, the structure of the handling bracket can be various. The following several possible structures are described in detail below.
- the carrying bracket comprises at least two cross beams 1 arranged side by side, at least two cross beams 1 being connected by connecting rods, and the fixing structure 2 is provided at both ends of each cross beam 1 in the moving mask 4 When the fixing structures 2 at both ends of each beam 1 are respectively connected to opposite ends of the mask 4 to fix the mask 4, the handling of the mask 4 is facilitated.
- the transport bracket is a cross-shaped structure formed by intersecting a plurality of cross beams 1 , and the end portions of the well-shaped structure are respectively provided with the fixed structure. 2.
- both ends of each of the beams 1 are pivotally connected to the driving rods 22 of the corresponding fixed structures 2, and when the operating rod 23 is in the first state, the driving rods 22 are parallel with the corresponding beams 1, and the executing rods are located at::: In the state, the drive rod has an angle with the corresponding beam 1, i.e., the angle a shown in Fig. 4, to control the range of motion and the direction of motion of the actuator 23.
- the periphery of the mask 4 is fixed, and even if the mask 4 is tilted during transportation, damage due to sliding or even falling of the mask 4 can be avoided, and the mask 4 can be transported during transportation. Security.
- the carrying bracket comprises two long beams 1 and two short beams 1 arranged side by side, and in order to strengthen the strength of the carrying bracket, between the two long beams 1 is provided.
- Reinforcement 3 as shown in Figure 1.
- FIG. 4 shows that the mask 4 transport fixture includes two parts (the machine member 1 is the drive rod 22 and the transmission rod 24, and the machine member 2 is the actuator rod 23), two low pairs, one Gao Fu.
- a higher pair or a higher pair in mechanical engineering, refers to a pair of motions formed by the contact of two members of a mechanism through points or lines. For example, a gear pair and a cam pair belong to a high auxiliary mechanism. In contrast, the motion pair formed by the contact of the surface is called a low auxiliary mechanism.
- the lower pair in the present embodiment is the first motion pair formed by the driving rod 22 and the beam 1, the second motion pair formed by the transmission rod 24 and the execution rod 23, and the upper pair is the motion pair formed by the actuator rod 23 and the mask 4.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Respiratory Apparatuses And Protective Means (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/406,350 US9601361B2 (en) | 2013-10-11 | 2014-05-06 | Fixture for conveying a mask plate for the production of thin film transistor liquid crystal display |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310473332.7A CN103600954B (zh) | 2013-10-11 | 2013-10-11 | 一种掩模板搬运治具 |
CN201310473332.7 | 2013-10-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015051637A1 true WO2015051637A1 (zh) | 2015-04-16 |
Family
ID=50119245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2014/076852 WO2015051637A1 (zh) | 2013-10-11 | 2014-05-06 | 一种掩模板搬运治具 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9601361B2 (zh) |
CN (1) | CN103600954B (zh) |
WO (1) | WO2015051637A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103600954B (zh) * | 2013-10-11 | 2015-10-07 | 京东方科技集团股份有限公司 | 一种掩模板搬运治具 |
CN105742202A (zh) * | 2014-12-08 | 2016-07-06 | 家登精密工业股份有限公司 | 光罩取料装置及其夹持机构 |
CN106853644A (zh) * | 2017-01-03 | 2017-06-16 | 京东方科技集团股份有限公司 | 一种机械手臂 |
CN109775354B (zh) * | 2019-02-12 | 2020-12-15 | 苏州钧舵机器人有限公司 | 一种框架类物体的夹爪及具有该夹爪的抓取机构 |
IT201900002917A1 (it) * | 2019-02-28 | 2020-08-28 | Raimondi Spa | Dispositivo di presa di elementi lastriformi |
CN112768388A (zh) * | 2021-01-15 | 2021-05-07 | 台州学院 | 一种翻转结构及半导体封装板加工装置 |
CN113636258B (zh) * | 2021-10-15 | 2021-12-28 | 南通炫昱实业有限公司 | 用于石材雕塑工艺品的人工搬运辅助装置 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6072240A (ja) * | 1983-09-28 | 1985-04-24 | Toshiba Ceramics Co Ltd | ウエ−ハ保持具 |
US5775000A (en) * | 1996-05-13 | 1998-07-07 | Ebara Corporation | Substrate gripper device for spin drying |
TW461010B (en) * | 1999-05-01 | 2001-10-21 | Mirae Corp | Carrier module |
CN200990375Y (zh) * | 2006-12-29 | 2007-12-12 | 艾逖恩机电(深圳)有限公司 | 直立式引线框支架夹具 |
CN101366110A (zh) * | 2005-11-23 | 2009-02-11 | 材料及技术公司 | 用于保持衬底的装置和方法 |
CN202189821U (zh) * | 2011-07-22 | 2012-04-11 | 江阴市爱多光伏科技有限公司 | 一种太阳能硅片的夹持工具 |
CN103094172A (zh) * | 2012-12-21 | 2013-05-08 | 东莞市中镓半导体科技有限公司 | 半导体及微电子行业耐高温防滑夹具 |
CN103094175A (zh) * | 2012-12-21 | 2013-05-08 | 东莞市中镓半导体科技有限公司 | 一种晶片专用三夹头夹具 |
TW201403746A (zh) * | 2012-07-05 | 2014-01-16 | Min Kuan Technology Co | 光罩夾持器 |
CN103600954A (zh) * | 2013-10-11 | 2014-02-26 | 京东方科技集团股份有限公司 | 一种掩模板搬运治具 |
CN103726096A (zh) * | 2012-10-15 | 2014-04-16 | 艾工场股份有限公司 | 衬底保持装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2783078A (en) * | 1952-03-07 | 1957-02-26 | Vacuum Concrete Inc | Handling apparatus |
US3261637A (en) * | 1964-03-13 | 1966-07-19 | Greater Iowa Corp | Self-releasing pickup unit |
US3306646A (en) * | 1965-07-30 | 1967-02-28 | Flexicore Company Inc | Lifting hook assembly |
US3695667A (en) * | 1970-06-16 | 1972-10-03 | Frederick George Ullrich | Lifting devices |
US5697752A (en) * | 1995-07-13 | 1997-12-16 | Progressive Tool & Industries Company | Overhead transfer clamp actuator and linkage |
US6517303B1 (en) * | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6062620A (en) * | 1998-08-25 | 2000-05-16 | Eaton Corporation | Spreader bar |
JP4517315B2 (ja) * | 1999-10-08 | 2010-08-04 | 株式会社ニコン | 基板落下防止機構およびこれを備えた基板検査装置 |
US6749392B1 (en) * | 2001-02-22 | 2004-06-15 | Ben A. Adams | Quick connect/disconnect tank lifting brace and method of use |
JP2009154213A (ja) * | 2006-04-11 | 2009-07-16 | Nikon Corp | 搬送装置、搬送方法、およびデバイス製造方法 |
DE102006017763B4 (de) * | 2006-04-12 | 2009-12-17 | Schott Ag | Dünnglasgreifer |
CN200992806Y (zh) * | 2006-12-30 | 2007-12-19 | 瞿启忠 | 钢管脚手架和支撑架卡式连接件 |
CN201071198Y (zh) * | 2007-04-29 | 2008-06-11 | 上海莉敏实业有限公司 | 一种夹子 |
US8109550B1 (en) * | 2008-09-29 | 2012-02-07 | Honda Motor Co., Ltd. | Pack end tool |
TWI427024B (zh) * | 2011-05-27 | 2014-02-21 | Au Optronics Corp | 撐持治具及應用其之搬移方法 |
CN202807624U (zh) * | 2012-09-14 | 2013-03-20 | 宝钢不锈钢有限公司 | 手持助力夹具装置 |
CN203048155U (zh) * | 2013-01-24 | 2013-07-10 | 京东方科技集团股份有限公司 | 掩膜板搬运治具 |
-
2013
- 2013-10-11 CN CN201310473332.7A patent/CN103600954B/zh not_active Expired - Fee Related
-
2014
- 2014-05-06 WO PCT/CN2014/076852 patent/WO2015051637A1/zh active Application Filing
- 2014-05-06 US US14/406,350 patent/US9601361B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6072240A (ja) * | 1983-09-28 | 1985-04-24 | Toshiba Ceramics Co Ltd | ウエ−ハ保持具 |
US5775000A (en) * | 1996-05-13 | 1998-07-07 | Ebara Corporation | Substrate gripper device for spin drying |
TW461010B (en) * | 1999-05-01 | 2001-10-21 | Mirae Corp | Carrier module |
CN101366110A (zh) * | 2005-11-23 | 2009-02-11 | 材料及技术公司 | 用于保持衬底的装置和方法 |
CN200990375Y (zh) * | 2006-12-29 | 2007-12-12 | 艾逖恩机电(深圳)有限公司 | 直立式引线框支架夹具 |
CN202189821U (zh) * | 2011-07-22 | 2012-04-11 | 江阴市爱多光伏科技有限公司 | 一种太阳能硅片的夹持工具 |
TW201403746A (zh) * | 2012-07-05 | 2014-01-16 | Min Kuan Technology Co | 光罩夾持器 |
CN103726096A (zh) * | 2012-10-15 | 2014-04-16 | 艾工场股份有限公司 | 衬底保持装置 |
CN103094172A (zh) * | 2012-12-21 | 2013-05-08 | 东莞市中镓半导体科技有限公司 | 半导体及微电子行业耐高温防滑夹具 |
CN103094175A (zh) * | 2012-12-21 | 2013-05-08 | 东莞市中镓半导体科技有限公司 | 一种晶片专用三夹头夹具 |
CN103600954A (zh) * | 2013-10-11 | 2014-02-26 | 京东方科技集团股份有限公司 | 一种掩模板搬运治具 |
Also Published As
Publication number | Publication date |
---|---|
CN103600954A (zh) | 2014-02-26 |
CN103600954B (zh) | 2015-10-07 |
US20160268151A1 (en) | 2016-09-15 |
US9601361B2 (en) | 2017-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2015051637A1 (zh) | 一种掩模板搬运治具 | |
KR101035896B1 (ko) | 기판반송장치 | |
BR112021000417A2 (pt) | Estacionamento magnético para limpador robótico em um painel solar | |
JP2011224645A (ja) | 溶接治具及びそれを用いた溶接方法 | |
US20170194564A1 (en) | Frame for mounting mask plate, mask plate device and method for fixing mask plate using frame for mounting mask plate | |
JP2006322919A (ja) | 偏光フィルムキャリア | |
KR20140113057A (ko) | 도막 형성 로봇 | |
KR101548581B1 (ko) | 교량 가설 빔 인양장치 | |
JP2009092451A (ja) | 二軸試験装置及び二軸試験方法 | |
KR101595003B1 (ko) | 기판 이송 로봇 | |
JP6134907B2 (ja) | ペースト転写ユニット及び部品実装装置 | |
JP5617471B2 (ja) | 電子部品実装用装置および電子部品実装用作業実行方法 | |
KR100746575B1 (ko) | 기판 이송 장치 및 이를 이용한 기판의 이송 방법 | |
JP6315460B2 (ja) | スピンドルユニット | |
JP3135359U (ja) | ハンドリング装置 | |
CN106064213A (zh) | 一种可输送细长条类薄钣金的机械手 | |
KR101794963B1 (ko) | 작업공간 가변형 케이블 로봇 | |
KR20110020465A (ko) | 탭피스 취부 장치 | |
JP2018177392A (ja) | 基板把持装置 | |
JP3219542U (ja) | 治具の開閉をコントロールできる作動装置 | |
KR100822279B1 (ko) | 도포장치 | |
JP7054170B2 (ja) | ベルトコンベヤ装置 | |
KR100860721B1 (ko) | 패널 이송장치 | |
KR20070107231A (ko) | 슬릿노즐 이송장치 | |
KR20200043628A (ko) | 자석 착탈식 철판 운반 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 14406350 Country of ref document: US |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14851498 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC - FORM 1205A (17.06.2016) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14851498 Country of ref document: EP Kind code of ref document: A1 |