Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/46—Polymerisation initiated by wave energy or particle radiation
  • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/40—High-molecular-weight compounds
  • C08G18/63—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers
  • C08G18/633—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers onto polymers of compounds having carbon-to-carbon double bonds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/40—High-molecular-weight compounds
  • C08G18/63—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers
  • C08G18/637—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers characterised by the in situ polymerisation of the compounds having carbon-to-carbon double bonds in a reaction mixture of saturated polymers and isocyanates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/67—Unsaturated compounds having active hydrogen
  • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
  • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
  • C08L33/04—Homopolymers or copolymers of esters
  • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
  • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
  • C08L33/12—Homopolymers or copolymers of methyl methacrylate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/02—Printing inks
  • C09D11/10—Printing inks based on artificial resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/02—Printing inks
  • C09D11/10—Printing inks based on artificial resins
  • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/30—Inkjet printing inks
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
  • C09D133/04—Homopolymers or copolymers of esters
  • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
  • C09D133/04—Homopolymers or copolymers of esters
  • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C09D133/10—Homopolymers or copolymers of methacrylic acid esters
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
  • C09D133/04—Homopolymers or copolymers of esters
  • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C09D133/10—Homopolymers or copolymers of methacrylic acid esters
  • C09D133/12—Homopolymers or copolymers of methyl methacrylate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
  • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/285—Permanent coating compositions
  • H05K3/287—Photosensitive compositions
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Definitions

• the present invention relates to a curable composition for a printed wiring board, in particular, an ultraviolet curable composition used in an ink jet system, a coating film for printed wiring board of at least one of resist and marking using the composition, and
• the present invention relates to a printed wiring board having a pattern obtained by use.
• thermosetting adhesive For example, as a composition used for manufacturing a flexible printed board or a tape carrier package, (1) a polyimide film called a coverlay film is punched out with a mold matched to a pattern, and then pasted using a thermosetting adhesive , A curing type (for example, Patent Document 1), (2) a type in which a photocurable composition for forming a flexible film is applied by screen printing and cured (for example, Patent Document 2), and (3) has flexibility There is a type in which a photocurable / thermosetting resin composition that forms a film is applied, exposed, developed, and cured (for example, Patent Document 3). Among these, the photocurable composition (2) having a small number of steps during pattern formation and a fast tact time is preferably used.
• JP-B-5-75032 Japanese Patent No. 10-2224018 JP-A-9-54434
• the curable composition as described above needs to adhere to both a plastic substrate mainly composed of polyimide and the conductor circuit metal provided thereon while maintaining various properties such as solder heat resistance. .
• the coating film formed from the conventional photocurable composition described in Patent Document 2 has poor flexibility and it is difficult to obtain excellent adhesion to the conductor circuit metal and the plastic substrate, improvement is desired. Yes.
• the present invention has been made in order to solve the above-described problems of the prior art, and its main purpose is to maintain various properties such as solder heat resistance and to have excellent flexibility, and both a plastic substrate and a conductor circuit metal. It is in providing the curable composition for printed wiring boards which is excellent in adhesiveness.
• Another object of the present invention is to provide a pattern cured coating film that is compatible with the adhesion between a plastic substrate and a conductor circuit metal, and a printed wiring board having the same, formed using such a curable composition for printed wiring boards. It is to provide.
• the above object of the present invention can be achieved by a curable composition for printed wiring boards, comprising a block copolymer, a (meth) acrylate compound having a hydroxyl group, and a photopolymerization initiator. It was found.
• the curable composition for printed wiring boards of the present invention comprises (A) a block copolymer, (B) a (meth) acrylate compound having a hydroxyl group, and (C) a photopolymerization initiator. It is a feature.
• the weight average molecular weight (Mw) of the (A) block copolymer is 10,000 or more and 100,000 or less, and the molecular weight distribution (Mw / Mn) is 3 or less. It is preferable that
• the (A) block copolymer has the following formula (I), XYX (I) (In the formula, X is a polymer unit having a glass transition point Tg of 0 ° C. or more, and Y is a polymer unit having a glass transition point Tg of less than 0 ° C.) It is preferable that it is a block copolymer represented by these.
• Y in the formula (I) contains poly n-butyl (meth) acrylate and X contains polymethyl (meth) acrylate.
• the (A) block copolymer is preferably liquid at a temperature of 20 ° C. or higher.
• the curable composition for a printed wiring board of the present invention further contains a bifunctional (meth) acrylate compound (excluding those having a hydroxyl group).
• the viscosity of the bifunctional (meth) acrylate compound at 25 ° C. is preferably 5 to 50 mPa ⁇ s.
• the curable composition for a printed wiring board of the present invention further includes a thermosetting component.
• the curable composition for printed wiring boards of the present invention preferably has a viscosity at 50 ° C. of 5 to 50 mPa ⁇ s.
• the cured coating film of the present invention is obtained by irradiating light to the above curable composition for printed wiring boards.
• the printed wiring board of the present invention is characterized by having a pattern cured coating film obtained by printing the above-mentioned curable composition for a printed wiring board on a substrate and irradiating it with light.
• the printed wiring board of the present invention is characterized in that the above-mentioned curable composition for printed wiring boards is printed on a substrate by an ink jet printing method and has a pattern cured coating film obtained by irradiating it with light. It is. *
• the substrate is preferably a plastic substrate.
• the curable composition of this invention can be used suitably as an inkjet composition.
• the curable composition for printed wiring boards of the present invention (hereinafter also referred to as curable composition) comprises (A) a block copolymer (component A) and (B) a (meth) acrylate compound having a hydroxyl group (component B). And (C) a photopolymerization initiator (component C).
• (meth) acrylate is a term generically referring to acrylate, methacrylate and a mixture thereof, and the same applies to other similar expressions.
• a block copolymer is a copolymer having a molecular structure in which two or more kinds of polymers having different properties are connected by a covalent bond to form a long chain.
• the block copolymer used in the present invention is preferably an XYX or XYX ′ type block copolymer.
• the center Y is a soft block and has a low glass transition point Tg, preferably less than 0 ° C.
• both outer X or X ′ Is a hard block and has a high Tg, and is preferably composed of polymer units of 0 ° C. or higher.
• the glass transition point Tg is measured by differential scanning calorimetry (DSC).
• a polymer unit comprising a polymer unit having a Tg of X or X ′ of 50 ° C. or more and a Tg of Y of ⁇ 20 ° C. or less. More preferred is a block copolymer of Of the XYX or XYX ′ type block copolymers, those in which X or X ′ is highly compatible with the (B) (meth) acrylate having a hydroxyl group are preferred. Those having low compatibility with the (B) hydroxyl group-containing (meth) acrylate are preferred. Thus, it is considered that a specific structure in the matrix can be easily shown by using a block copolymer in which the blocks at both ends are compatible with the matrix and the central block is incompatible with the matrix.
• X or X ' preferably contains polymethyl (meth) acrylate (PMMA), polystyrene (PS) or the like, and Y preferably contains poly n-butyl acrylate (PBA), polybutadiene (PB) or the like.
• PMMA polymethyl (meth) acrylate
• PS polystyrene
• Y preferably contains poly n-butyl acrylate (PBA), polybutadiene (PB) or the like.
• Examples of commercially available block copolymers include acrylic triblock copolymers manufactured using living polymerization manufactured by Arkema. SBM type represented by polystyrene-polybutadiene-polymethyl methacrylate, MAM type represented by polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate, and MAM N type treated with carboxylic acid modification or hydrophilic group modification. And MAM A type. Examples of SBM types include E41, E40, E21, E20, MAM types include M51, M52, M53, M22, etc., MAM N types include 52N, 22N, and MAM A types include SM4032XM10. It is done. KURARITY manufactured by Kuraray Co., Ltd. is also a block copolymer derived from methyl methacrylate and butyl acrylate, and examples thereof include LA1114, LA2140e, LA2330, LA2250, LA4285, and the like.
• the block copolymer used in the present invention is preferably a ternary or more block copolymer, and a block copolymer having a precisely controlled molecular structure synthesized by a living polymerization method is effective for obtaining the effects of the present invention. More preferred. This is presumably because the block copolymer synthesized by the living polymerization method has a narrow molecular weight distribution and the characteristics of each unit become clear.
• the molecular weight distribution (Mw / Mn) of the block copolymer used is preferably 3 or less, more preferably 2.5 or less, and still more preferably 2.0 or less.
• the block copolymer containing the (meth) acrylate polymer block as described above can be produced, for example, by the method described in JP-A-2007-516326 and JP-A-2005-515281.
• the weight average molecular weight of the block copolymer is preferably in the range of 10,000 to 100,000, more preferably 10,000 to 50,000. If the weight average molecular weight is 10,000 or more, the intended effects of toughness and flexibility can be obtained. On the other hand, if the weight average molecular weight is 100,000 or less, it is possible to suppress deterioration of printability due to an increase in the viscosity of the composition.
• the block copolymer used in the present invention is preferably in a liquid state at a temperature of 25 ° C. When the block copolymer is a liquid, it can be easily dissolved in the composition, so that the composition becomes uniform and stable characteristics can be obtained.
• the blending amount of the (A) block copolymer is preferably in the range of 1 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention. When the amount is 1 part by mass or more, the effect of the invention can be obtained satisfactorily. When the amount is 30 parts by mass or less, the viscosity becomes appropriate and good printability is obtained.
• (B) (Meth) acrylate compound having a hydroxyl group a low molecular weight material such as a monomer or an oligomer is used. Specifically, a material having a molecular weight in the range of 100 to 1,000, preferably in the range of a molecular weight of 110 to 700 is used. Used.
• (meth) acrylate compound having a hydroxyl group examples include 2-hydroxy-3-acryloyloxypropyl (meth) acrylate, 2-hydroxy-3-phenoxyethyl (meth) acrylate, and 1,4-cyclohexanedi Methanol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol monohydroxypenta (meth) ) Acrylate, 2-hydroxypropyl (meth) acrylate and the like.
• 2-hydroxy-3-acryloyloxypropyl acrylate 2-hydroxy-3-phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 1,4-cyclohexanedimethanol Monoacrylate is preferably used.
• a monofunctional (meth) acrylate compound is preferably used because of easy viscosity adjustment.
• the blending amount of the (meth) acrylate compound having a hydroxyl group is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention.
• the adhesiveness which is the characteristics of the composition of this invention becomes more favorable.
• the blending amount is 50 parts by mass or less, a decrease in ink compatibility can be suppressed.
• the curable composition of the present invention has excellent adhesion to both the plastic substrate and the conductor circuit metal by the combination of the component (A) and the component (B), for example, for printed wiring boards.
• As a resist ink etching resist ink, solder resist ink, plating resist ink
• it exhibits excellent substrate protection performance.
• (C) Photopolymerization initiator (C) It does not specifically limit as a photoinitiator,
• a photoradical polymerization initiator can be used.
• this radical photopolymerization initiator any compound can be used as long as it is a compound that generates radicals by light, laser, electron beam or the like and initiates radical polymerization reaction.
• Examples of the photopolymerization initiator include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; 2-hydroxy-2-methyl-1-phenyl-propane-1- Alkylphenones such as ON; acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4 Amino such as-(methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, N, N-dimethylaminoacetophenone Acetophenones; 2-methyl Anthraquinones such as nthraquinone, 2-ethylanth
• Ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; 2,4,5-triarylimidazole dimer; Riboflavin tetrabutyrate; 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole Thiol compounds such as 2,4,6-tris-s-triazine, 2,2,2-tribromoethanol, tribromomethylphenylsulfone and the like organic halogen compounds; , Benzophenones such as 4,4'-bisdiethylaminobenzophenone or xanthones; acylphosphine such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide Finoxides; bis (cyclopentadienyl) -di-phenyl-titanium, bis
• photopolymerization initiators can be used alone or as a mixture of two or more thereof, and further, N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4- Photoinitiator aids such as tertiary amines such as dimethylaminobenzoate, triethylamine, triethanolamine can be added.
• the blending ratio of the photopolymerization initiator is preferably in the range of 0.5 to 10 parts by mass in 100 parts by mass of the curable composition of the present invention.
• the curable composition for printed wiring boards of the present invention preferably further contains a bifunctional (meth) acrylate compound (excluding those having a hydroxyl group).
• a bifunctional (meth) acrylate compound excluding those having a hydroxyl group
• the compatibility of each component in the curable composition for printed wiring boards can be further improved.
• bifunctional (meth) acrylate examples include 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, 1,10 -Diacrylates of diols such as decanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, Polypropylene glycol diacrylate, neopentyl glycol diacrylate, neopentyl glycol with ethylene oxide and propylene oxide Diols of diols obtained by adding at least one of the above, diacrylates of glycols such as caprolactone modified hydroxypivalic acid neopentyl glycol diacrylate, bisphenol A
• diacrylates of diols having an alkyl chain having 4 to 12 carbon atoms particularly 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9- Nonanediol diacrylate and 1,10-decanediol diacrylate are preferred.
• the blending amount of these bifunctional acrylate compounds is preferably 20 to 80 parts by mass, more preferably 40 to 70 parts by mass in 100 parts by mass of the curable composition of the present invention.
• the blending amount of the bifunctional (meth) acrylate is 20 parts by mass or more, the ink compatibility is good.
• the blending amount is 80 parts by mass or less, the ink adhesion is good.
• the viscosity of the bifunctional (meth) acrylate compound at 25 ° C. is preferably 5 to 50 mPa ⁇ s, particularly 5 to 30 mPa ⁇ s. In this viscosity range, the handleability as a diluent of a bifunctional (meth) acrylate compound becomes good, and each component can be mixed uniformly. As a result, it can be expected that the entire surface of the coating film adheres uniformly to the substrate.
• thermosetting component can be added to the curable composition of the present invention. It can be expected that adhesion and heat resistance are improved by adding a thermosetting component.
• thermosetting components used in the present invention include amino resins such as melamine resins, benzoguanamine resins, melamine derivatives, and benzoguanamine derivatives, blocked isocyanate compounds, cyclocarbonate compounds, thermosetting components having a cyclic (thio) ether group, bismaleimide, Known thermosetting resins such as carbodiimide resins can be used. Particularly preferred are blocked isocyanate compounds from the viewpoint of excellent storage stability.
• thermosetting component having a plurality of cyclic (thio) ether groups in the molecule is a compound having any one of the three, four or five-membered cyclic (thio) ether groups in the molecule or a plurality of two types of groups.
• a compound having a plurality of epoxy groups in the molecule that is, a polyfunctional epoxy compound, a compound having a plurality of oxetanyl groups in the molecule, that is, a polyfunctional oxetane compound, a compound having a plurality of thioether groups in the molecule, That is, episulfide resin etc. are mentioned.
• polyfunctional epoxy compound examples include epoxidized vegetable oils such as Adekasizer O-130P, Adekasizer O-180A, Adekasizer D-32, and Adekasizer D-55 manufactured by ADEKA; jER828, jER834 manufactured by Mitsubishi Chemical Corporation; jER1001, jER1004, Daicel EHPE3150, DIC Epicron 840, Epicron 850, Epicron 1050, Epicron 2055, Toto Kasei Epototo YD-011, YD-013, YD-127, YD-128, Dow Chemical D. E. R. 317, D.E. E. R. 331, D.D. E. R. 661, D.E. E. R.
• E. R. 330 Sumi-epoxy ESA-011, ESA-014, ELA-115, ELA-128 manufactured by Sumitomo Chemical Co., Ltd.
• E. R. 330 A.I. E. R. 331, A.I. E. R. 661, A.I. E. R.
• Brominated epoxy resins such as 714 (both trade names); jER152 and jER154 manufactured by Mitsubishi Chemical Corporation, and D.C. E. N. 431, D.D. E. N. 438, Epicron N-730, Epicron N-770, Epicron N-865 manufactured by DIC, Epototo YDCN-701, YDCN-704 manufactured by Tohto Kasei Co., Ltd. EPPN-201, EOCN-1025, EOCN manufactured by Nippon Kayaku Co., Ltd. -1020, EOCN-104S, RE-306, Sumitomo Epoxy ESCN-195X, ESCN-220, manufactured by Sumitomo Chemical Co., Ltd. E. R.
• Novolak type epoxy resins such as ECN-235 and ECN-299 (both trade names); biphenol novolak type epoxy resins such as NC-3000 and NC-3100 manufactured by Nippon Kayaku; Epicron 830 manufactured by DIC, Mitsubishi Chemical JER807 manufactured by Toto Kasei Co., Ltd. Etototo YDF-170, YDF-175, YDF-2004, etc. (all trade names) bisphenol F type epoxy resin; Toto Kasei Co., Ltd.
• Epototo ST-2004, ST-2007, ST- Hydrogenated bisphenol A type epoxy resin such as 3000 (trade name); jER604 manufactured by Mitsubishi Chemical Co., Ltd., Epotot YH-434 manufactured by Tohto Kasei Co., Ltd., Sumi-epoxy ELM-120 manufactured by Sumitomo Chemical Co., Ltd. ) Glycidylamine type epoxy resin; hydantoin type epoxy resin; manufactured by Daicel Alicyclic epoxy resins Rokisaido 2021 etc. (all trade names); manufactured by Mitsubishi Chemical Corporation YL-933, Dow Chemical Co. of T. E. N. , EPPN-501, EPPN-502, etc.
• epoxy resin having a dicyclopentadiene skeleton such as HP-7200 and HP-7200H manufactured by DIC
• glycidyl methacrylate copolymer epoxy resin such as CP-50S and CP-50M manufactured by NOF Corporation
• the present invention is not limited to these.
• These epoxy resins can be used alone or in combination of two or more.
• novolak-type epoxy resins bixylenol-type epoxy resins, biphenol-type epoxy resins, biphenol novolac-type epoxy resins, naphthalene-type epoxy resins or mixtures thereof are particularly preferable.
• polyfunctional oxetane compound examples include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1,4-bis [(3- Methyl-3-oxetanylmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3- In addition to polyfunctional oxetanes such as oxetanyl) methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and oligomers or copolymers thereof, oxetane alcohol and novolak resin , Poly (p-hydroxy
• Examples of the compound having a plurality of cyclic thioether groups in the molecule include bisphenol A type episulfide resin YL7000 manufactured by Mitsubishi Chemical Corporation. Moreover, episulfide resin etc. which replaced the oxygen atom of the epoxy group of the novolak-type epoxy resin with the sulfur atom using the same synthesis method can be used.
• amino resins such as melamine derivatives and benzoguanamine derivatives
• amino resins include methylol melamine compounds, methylol benzoguanamine compounds, methylol glycoluril compounds, and methylol urea compounds.
• the alkoxymethylated melamine compound, the alkoxymethylated benzoguanamine compound, the alkoxymethylated glycoluril compound and the alkoxymethylated urea compound have the methylol group of the respective methylolmelamine compound, methylolbenzoguanamine compound, methylolglycoluril compound and methylolurea compound. Obtained by conversion to an alkoxymethyl group.
• the type of the alkoxymethyl group is not particularly limited and can be, for example, a methoxymethyl group, an ethoxymethyl group, a propoxymethyl group, a butoxymethyl group, or the like.
• a melamine derivative having a formalin concentration which is friendly to the human body and the environment is preferably 0.2% or less.
• thermosetting component examples include Cymel 300, 301, 303, 370, 325, 327, 701, 266, 267, 238, 1141, 272, 202, 1156. 1158, 1123, 1170, 1174, UFR65, 300 (all manufactured by Mitsui Cyanamid), Nicalak Mx-750, Mx-032, Mx-270, Mx-280, Mx- 290, Mx-706, Mx-708, Mx-40, Mx-31, Ms-11, Mw-30, Mw-30HM, Mw-390, Mw-100LM, Mw- 750LM (all manufactured by Sanwa Chemical Co., Ltd.).
• Such a thermosetting component may be used individually by 1 type, and may be used in combination of 2 or more type.
• An isocyanate compound and a blocked isocyanate compound are compounds having a plurality of isocyanate groups or blocked isocyanate groups in one molecule.
• Examples of such a compound having a plurality of isocyanate groups or blocked isocyanate groups in one molecule include polyisocyanate compounds or blocked isocyanate compounds.
• the blocked isocyanate group is a group in which the isocyanate group is protected by the reaction with the blocking agent and temporarily inactivated, and the blocking agent is dissociated when heated to a predetermined temperature. Produces. It was confirmed that the curability and toughness of the resulting cured product were improved by adding the polyisocyanate compound or the blocked isocyanate compound.
• polyisocyanate compound for example, aromatic polyisocyanate, aliphatic polyisocyanate or alicyclic polyisocyanate is used.
• aromatic polyisocyanate include, for example, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, o-xylylene diisocyanate, and m-xylylene diisocyanate and 2,4-tolylene dimer.
• aliphatic polyisocyanate examples include tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4-methylenebis (cyclohexyl isocyanate), and isophorone diisocyanate.
• alicyclic polyisocyanate examples include bicycloheptane triisocyanate.
• adducts, burettes and isocyanurates of the above-mentioned isocyanate compounds can be used.
• the blocked isocyanate compound an addition reaction product of an isocyanate compound and an isocyanate blocking agent is used.
• an isocyanate compound which can react with a blocking agent the above-mentioned polyisocyanate compound etc. are mentioned, for example.
• isocyanate blocking agent examples include phenolic blocking agents such as phenol, cresol, xylenol, chlorophenol and ethylphenol; lactam blocking agents such as ⁇ -caprolactam, ⁇ -palerolactam, ⁇ -butyrolactam and ⁇ -propiolactam; Active methylene blocking agents such as ethyl acetoacetate and acetylacetone; methanol, ethanol, propanol, butanol, amyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, benzyl Ether, methyl glycolate, butyl glycolate, diacetone alcohol, Alcohol blocking agents such as methyl acid and ethyl lactate; oxime blocking agents such as formaldehyde oxime, acetaldoxime, acetoxime, methyl e
• the blocked isocyanate compound may be commercially available, for example, Sumidur BL-3175, BL-4165, BL-1100, BL-1265, Death Module TPLS-2957, TPLS-2062, TPLS-2078, TPLS-2117.
• thermosetting component is preferably 1 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention.
• the blending amount is 1 part by mass or more, sufficient toughness and heat resistance of the coating film can be obtained. On the other hand, if it is 30 mass parts or less, it can suppress that storage stability falls.
• a surface tension adjuster in addition to the above components, a surfactant, a matting agent, a polyester resin for adjusting film physical properties, and a polyurethane resin as necessary.
• Vinyl resins acrylic resins, rubber resins, waxes, phthalocyanine blue, phthalocyanine green, iodin green, disazo yellow, crystal violet, titanium oxide, carbon black, naphthalene black and the like
• Known and commonly used additives such as adhesion-imparting agents such as at least one antifoaming agent and leveling agent such as silicone, fluorine and polymer, imidazole, thiazole, triazole and silane coupling agent Can be blended.
• resin can be mix
• skeleton is preferable.
• the polyene skeleton is preferably formed by polymerization using, for example, polybutadiene or isoprene, or both, and in particular, the general formula (I), (In the formula, n represents 10 to 300.) It is preferable that it is comprised from the repeating unit represented by these. Due to the olefinic double bond of such repeating units, flexibility is imparted to the curable resist composition for printed wiring boards, the followability to the substrate is increased, and good adhesion is obtained.
• the repeating unit represented by the general formula I is preferably 50% or more, and more preferably 80% or more.
• polyene skeleton of the (meth) acrylate compound has the following general formula (II), The unit represented by may be included.
• liquid polybutadiene urethane (meth) acrylate obtained by subjecting 2-hydroxyethyl (meth) acrylate to a urethane addition reaction with a hydroxyl group of liquid polybutadiene via 2,4-tolylene diisocyanate, and maleic anhydride were added.
• Examples of commercially available products include NISSO PB TE-2000, NISSO PB TEA-1000, NISSO PB TE-3000, NISSO PB TEAI-1000 (all of which are manufactured by Nippon Soda Co., Ltd.), CN301, CN303, CN307 (SARTOMER) , BAC-15 (manufactured by Osaka Organic Chemical Industry), BAC-45 (manufactured by Osaka Organic Chemical Industry), EY RESIN BR-45UAS (manufactured by Light Chemical Industry), and the like.
• (Meth) acrylate having a polyene skeleton can be used alone or in combination.
• the curable composition for printed wiring boards of this invention can mix
• Diluents include diluent solvents, photoreactive diluents, heat reactive diluents, and the like. Of these diluents, photoreactive diluents are preferred.
• Photoreactive diluents include (meth) acrylates, vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, ⁇ -methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, N-vinylformamide, xylyl
• examples thereof include compounds having an unsaturated double bond, oxetanyl group, and epoxy group, such as range oxetane, oxetane alcohol, 3-ethyl-3- (phenoxymethyl) oxetane, resorcinol diglycidyl ether, and the like.
• (meth) acrylates are preferable, and monofunctional (meth) acrylates are more preferable.
• monofunctional (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, 2- Examples include (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, and glycidyl methacrylate, acryloylmorpholine, and the like.
• the blending amount of these diluents is preferably 1 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention.
• the curable composition for printed wiring boards of the present invention contains a tri- or higher functional (meth) acrylate compound (excluding those having a hydroxyl group) for the purpose of improving the tackiness after UV curing of the composition. I can do it.
• Trifunctional or higher (meth) acrylate compounds include trimethylolpropane triacrylate, trimethylolmethane triacrylate, ethylene oxide modified trimethylolpropane triacrylate, propylene oxide modified trimethylolpropane triacrylate, epichlorohydrin modified trimethylolpropane triacrylate, penta Erythritol tetraacrylate, tetramethylol methane tetraacrylate, ethylene oxide modified phosphate triacrylate, propylene oxide modified phosphate triacrylate, epichlorohydrin modified glycerol triacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, or their silsesquioxanes
• Polyfunctional acrylate or methacrylate monomers corresponding to these are include ⁇ -caprolactone-modified trisacryloxyethyl isocyanurate. The blending amount of the trifunctional or
• the curable composition for a printed wiring board of the present invention having the above components is applied to a printing method such as a screen printing method, an inkjet method, a dip coating method, a flow coating method, a roll coating method, a bar coater method, or a curtain coating method.
• a printing method such as a screen printing method, an inkjet method, a dip coating method, a flow coating method, a roll coating method, a bar coater method, or a curtain coating method.
• the viscosity at 50 ° C. of the curable composition for printed wiring boards of the present invention is preferably 5 to 50 mPa ⁇ s. More preferably, it is 5 to 20 mPa ⁇ s.
• the viscosity refers to a viscosity measured at normal temperature (25 ° C.) or 50 ° C. according to JIS K2283. If the viscosity at room temperature is 150 mPa ⁇ s or less, or the viscosity at 50 ° C. is 5 to 50 mPa ⁇ s, printing by the ink jet printing method is possible.
• the curable composition for a printed wiring board of the present invention when applied as an ink for an ink jet system by the above composition, it can be printed on a flexible wiring board in a roll-to-roll system. In this case, it is possible to form a pattern cured coating film at high speed by attaching a light irradiation light source described later after passing through the ink jet printer.
• the light irradiation is performed by irradiation with ultraviolet rays or active energy rays, but ultraviolet rays are preferable.
• a light source for light irradiation a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is appropriate.
• electron beams, ⁇ rays, ⁇ rays, ⁇ rays, X rays, neutron rays, and the like can also be used.
• the heating temperature is, for example, 80 to 200 ° C. By setting this heating temperature range, it can be sufficiently cured.
• the heating time is, for example, 10 to 100 minutes.
• the curable composition for a printed wiring board of the present invention has excellent adhesion to a printed wiring board including a plastic substrate mainly composed of polyimide and the like and a conductor circuit provided thereon, and is a solder.
• Pattern cured coatings excellent in various properties such as heat resistance, chemical resistance, solvent resistance, pencil hardness, electroless gold plating resistance, and bendability can be formed.
• part means part by mass unless otherwise specified.
• Examples 1 to 4 and Comparative Examples 1 to 3 The components shown in Table 1 were blended in the proportions (unit: part) shown in the table, and premixed with a stirrer to prepare a curable composition.
• Viscosity at 50 ° C Viscosity of the curable compositions obtained in Examples 1 to 4 and Comparative Examples 1 to 3 at 50 ° C. and 100 rpm was measured with a cone plate viscometer (TVH-33H manufactured by Toki Sangyo Co., Ltd.). It was measured. Evaluation criteria ⁇ : 20 mPa ⁇ S or less ⁇ : 20 mPa ⁇ S more than 50 mPa ⁇ S or less ⁇ : 50 mPa ⁇ S or more
• the flexible copper-clad laminate was coated on the substrate using a piezo-type inkjet printer so that the film thickness was 15 ⁇ m by inkjet printing. At this time, UV temporary curing was performed with a high-pressure mercury lamp attached to the inkjet head immediately after printing. Thereafter, curing was performed by heating at 150 ° C. for 1 hour to obtain a test piece.
• the cured test piece was repeatedly bent with the protective film on the inner side under the following conditions using a MIT (Masschus Institutes of Technology) tester, and the number of cycles at which electrical conduction could not be obtained was obtained. A test was performed on three test pieces per evaluation, and an average value at which continuity could not be obtained was calculated. Test criteria and judgment criteria are as shown below.
• MIT test condition load 500 gf Angle: Angle facing 135 ° Speed: 175 times / min Tip: R 0.38 mm cylinder Evaluation criteria ⁇ : 50 times or more x: Less than 50 times
• Electroless gold plating resistance 4. Using a commercially available electroless nickel plating bath and electroless gold plating bath under the conditions of nickel 0.5 ⁇ m and gold 0.03 ⁇ m. Gold plating was performed on the cured coating film obtained in, and the surface state of the cured coating film was observed. Judgment criteria are as follows. Evaluation criteria ⁇ : No change is observed. X: Significant whitening or clouding occurred.
• the photo-curable compositions for printed wiring boards of Examples 1 to 4 according to the present invention are dry to touch after UV curing, adhesion to polyimide, adhesion to copper, Good results were shown in all of pencil hardness, bendability, solvent resistance, chemical resistance, solder heat resistance, and electroless gold plating resistance.
• the curable composition for printed wiring boards of the present invention is excellent in adhesion to both a plastic substrate and a conductor circuit metal, and has solder heat resistance, solvent resistance, chemical resistance, pencil hardness, Fine patterns with excellent characteristics such as electroless gold plating resistance can be formed. Further, when jetting by an ink jet method, the viscosity must be low to enable jetting. In general, low-viscosity photo-curable compositions are said to have low adhesion and heat resistance characteristics, but this composition is suitable for solder resist pattern formation by the inkjet method of printed wiring boards even when the viscosity is low. Can be used. Therefore, in addition to printed wiring plate materials such as resist inks and marking inks, it can be used for applications such as UV molded article materials, optical modeling materials, and 3D inkjet materials.

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