WO2015045498A1 - 荷電粒子線装置 - Google Patents
荷電粒子線装置 Download PDFInfo
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- WO2015045498A1 WO2015045498A1 PCT/JP2014/065407 JP2014065407W WO2015045498A1 WO 2015045498 A1 WO2015045498 A1 WO 2015045498A1 JP 2014065407 W JP2014065407 W JP 2014065407W WO 2015045498 A1 WO2015045498 A1 WO 2015045498A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical or photographic arrangements associated with the tube
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2803—Scanning microscopes characterised by the imaging method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2803—Scanning microscopes characterised by the imaging method
- H01J2237/2806—Secondary charged particle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/282—Determination of microscope properties
- H01J2237/2826—Calibration
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30433—System calibration
- H01J2237/3045—Deflection calibration
Definitions
- the present invention relates to a charged particle beam apparatus, and more particularly to a charged particle beam apparatus that generates image data and signal waveform data by beam scanning.
- SEM Scanning Electron Microscope
- Patent Document 1 discloses a method for improving the detection rate of foreign matter by changing the amount of current to be irradiated.
- Patent Document 2 discloses a method for suppressing surface charging by changing the electron beam scanning interval in accordance with the charging time constant of the sample to be observed.
- Patent Document 3 discloses a method of controlling a charged state distributed on a surface by changing a scanning speed of a part of a region in a FOV (Field Of View).
- Patent No. 4914180 corresponding US Pat. No. 7,763,852
- Patent No. 5341924 WO2012 / 102301A
- Patent Document 3 when performing beam scanning (pre-dose scanning) for attaching a charge to a sample, the inner region is scanned at a higher speed than the outer region in the scanning region, thereby relatively moving the inner region.
- a charged particle source a deflector that scans a sample with a charged particle beam emitted from the charged particle source, and a signal obtained by scanning the charged particle beam with respect to the sample are described below.
- a charged particle beam device comprising an image memory for storing the image and a control device for controlling the deflector, wherein the control device irradiates a position on the sample corresponding to each pixel with a charged particle beam.
- a charged particle beam apparatus is proposed that controls the deflector so as to scan the charged particle beam between the pixels at high speed.
- a charged particle beam apparatus comprising an image memory for storing the obtained signal and a control device for controlling the deflector, wherein the control device scans the charged particle beam and the interval between irradiation points.
- the flowchart which shows the process of setting an observation condition according to ROI (Region Of Interest).
- GUI Graphic User Interface
- a charged particle beam apparatus in which the beam scanning speed and the interval between irradiation points at the time of beam scanning are optimized in order to alleviate the influence of charging in minute site units in the FOV will be mainly described. To do. Furthermore, a charged particle beam apparatus capable of finding at least one optimum condition of the scanning speed and the interval between irradiation points will be described.
- an objective lens that focuses a charged particle beam emitted from a charged particle source, a deflector that changes a scanning position of the charged particle beam, and a control device that controls the scanning deflector
- a charged particle beam apparatus including a sample stage for mounting a sample and a detector for detecting charged particles emitted from the sample, in order to set observation conditions prior to regular observation
- a charged particle beam apparatus capable of acquiring a plurality of data by repeatedly changing the scanning speed of the charged particle beam and the interval between irradiation points and selecting an observation condition suitable for the measurement site from the data will be described. .
- the signal amount or contrast ratio of the measurement site can be improved.
- FIG. 1 shows a schematic diagram of a scanning electron microscope which is a kind of charged particle beam apparatus.
- the electron beam 2 (electron beam) generated by the electron gun 1 is converged by the condenser lens 3 and finally converged on the sample 6 by the objective lens 5.
- the deflector 4 scans the electron beam 2 over the electron beam scanning region of the sample (hereinafter also referred to as scanning). Observation of the sample is performed by scanning the primary electrons two-dimensionally, detecting the secondary electrons 7 excited in the sample by irradiation and emitting from the sample by the detector 8, and converting the electron signal into an image. ⁇ Measure.
- the SEM illustrated in FIG. 1 includes an image memory that stores a detection signal for each pixel, and the detection signal is stored in the image memory.
- the sample is a dielectric
- a two-dimensional charge distribution is formed in the scanning area (FOV) during SEM observation.
- the electrons mainly detected by the SEM are secondary electrons having a large emission amount and a small energy ( ⁇ several eV), and thus are easily affected by slight charging formed on the surface. For this reason, in SEM observation of a charged sample, an image obtained varies depending on what charge distribution is formed at the time of irradiation. Parameters determining the surface charge distribution include the energy of primary electrons, the amount of current, the scanning order of electron beams, and the scanning speed, which affect the amount of secondary electrons emitted.
- Primary electron energy and current amount that directly affect the charging of the irradiation site are the main parameters for the observation condition search.
- the sample surface is a uniform material, the amount of secondary electrons emitted is constant, and charging control is considered to be relatively easy.
- the scanning order and the scanning speed are parameters that reflect the effect of relaxation of the charge accumulated by irradiation, and it has been found by the inventors that optimization of these parameters is important for measurement and inspection. Recognized.
- the shape and size of the observation pattern included in the irradiation area are not constant, and what scanning method is used. It takes a lot of time to find out what is optimal.
- the charging characteristics may differ depending on the difference in the manufacturing process, which may look good on a wafer in one process but difficult to observe in another process.
- a scanning condition determination method for improving the detection signal amount or the contrast ratio of an area to be observed by changing the scanning speed of the electron beam and the interval between irradiation points according to the observation pattern will be described with reference to the drawings.
- a method of searching for a condition that optimizes the signal amount or the contrast ratio by changing two parameters of the scanning speed and the interval between irradiation points will be described.
- Fig. 2 shows a flowchart for setting the observation conditions.
- an irradiation region (FOV) at the time of observation is set so that an observation pattern is included.
- the observation magnification and the observation angle are designated.
- an area (ROI) for length measurement (management) in the FOV is designated.
- the average signal amount (brightness) of ROI or the contrast ratio with a place specified separately, CNR (Contrast to Noise Ratio) with a place specified separately, or the area specified separately Specify one of the shrink amounts.
- the ROI and the area for calculating the contrast ratio are additionally designated.
- the CNR represents the magnitude of ROI contrast with respect to noise, and specifies a noise determination area in addition to an area for calculating a contrast ratio.
- an area for determining the shrink amount and an allowable value of the shrink amount are designated.
- the shape may be deformed due to damage caused by electron beam irradiation.
- Scanning is performed by changing the scanning speed and the interval between irradiation points by a predetermined condition for the designated FOV.
- the scanning speed corresponds to the scanning speed in the FOV
- the interval between the irradiation points corresponds to the number of divisions in the X direction and the Y direction in the FOV.
- the larger the number of divisions the narrower the interval between irradiation points. For example, when the inside of the FOV is scanned with 512 ⁇ 512 pixels, if the number of XY divisions is 512, the irradiation point interval is 1 (continuous).
- An index value (any one of average signal amount, contrast ratio, CNR, and shrink amount) is extracted from the image obtained as a result of each scan.
- the obtained results are displayed in a two-dimensional map illustrated in the lower diagram of FIG.
- an example of extracting measurement conditions for the via / trench pattern illustrated in the upper diagram of FIG. 3 will be described.
- the via bottom is set as the ROI in order to set the via bottom diameter as a measurement target, and the signal amount (luminance) and contrast (for example, the luminance difference from other designated portions) of the portion are found.
- the via illustrated in the upper diagram of FIG. 3 is configured by stacking the upper layer line pattern 301 on the lower layer pattern 302.
- the axis of the map is the scanning speed and the interval between the irradiation points, and displays the index value of each condition.
- each box of the map is displayed with a luminance corresponding to the obtained signal amount and contrast ratio. For example, the brighter the map color, the higher the signal amount or the contrast ratio. By performing such a display, it is possible to easily find an appropriate combination of scanning conditions.
- condition with the best index value for example, the box with the highest brightness and contrast
- the operator may select the condition from the obtained map.
- the operator can display and confirm the scanning order of the selected conditions (number of pixels to be scanned or change in irradiation point by animation) on the screen.
- the obtained observation conditions relating to the scanning speed and the irradiation point interval are stored on the hard disk or memory of the apparatus, and the stored observation conditions are read to perform measurement for length measurement.
- This observation condition can be read even when an image is acquired by a recipe, and observation under the same condition is possible by aligning the observation pattern by addressing or the like. According to the present embodiment, it is possible to determine the presence or absence of an optimal observation condition even in an ROI whose shape or material contrast is difficult to extract. For example, more accurate and effective process management can be performed in a semiconductor manufacturing process. It becomes possible.
- the interval between the irradiation points is set by dividing the FOV into M ⁇ N blocks in the XY direction.
- the division is performed in units of pixels of the image.
- the FOV and the number of pixels of the image to be acquired may be set based on the block size and the number of pixels.
- FIG. 4 shows an example in which a 6 ⁇ 9 pixel image is divided into 3 ⁇ 3 blocks.
- a case where scanning is started from the upper left block 1 for a 3 ⁇ 3 block is shown.
- the upper left pixel “1” of the block 1 is irradiated. Since the same place is irradiated within each block, the block size matches the interval between the irradiation points.
- Each block is illuminated with pixel “1”. Thereafter, returning to block 1, the lower right pixel “2” in the block is irradiated.
- a reference for selecting the pixel “2” a distance from the pixel “1” irradiated in the past of each block is obtained, and a pixel having the smallest influence of charging is selected.
- next irradiation block is block 1
- the influence of pixel selection in the block is evaluated under the condition that there are blocks around (for example, the fifth block in FIG. 4).
- the influence of the irradiated pixel and the past irradiated pixel is expressed by the following equation (1).
- charging weighting factors may be multiplied.
- the distance to the (1, 1) pixel “1” of each block is obtained, and the pixel with the longest distance is set as the next irradiation point.
- the third irradiation pixel after irradiating the pixel “1” of each block as the second irradiation point is obtained based on the following formula (2).
- it is multiplied by a relaxation factor over time. This is because the influence of charging is distinguished between the pixel “2” irradiated immediately before and the pixel “1” irradiated before.
- the charge relaxation coefficient t can be set by an operator.
- the fourth irradiation pixel is obtained by Expression (3).
- FIG. 5 illustrates a scanning signal when discontinuous irradiation as shown in FIG. 4 is performed.
- FIG. 5 shows transitions of the X scan signal and the Y scan signal when the electron beam is scanned from the pixel “1” of the block 1 in FIG. 4 to the pixel “1” of the block 4 in FIG. (The movement between each pixel is described as (a) (b) (c)).
- V indicates the maximum deflection voltage in the X and Y directions.
- the deflection signal is expressed by a voltage value.
- the pixel irradiation time is ⁇ t, and electrons emitted during the ⁇ t irradiation time are detected.
- the inclination ⁇ of the scan signal represents the scanning speed, and the larger the inclination, the faster the electron beam moves. It is assumed that the movement between pixels has a larger inclination ⁇ than the normal scan, and the larger the inclination, the faster the electron beam moves, so the number of electrons irradiated when moving between irradiation pixels is reduced. Is possible.
- the moving speed may be obtained from the amount of current to be irradiated and the interval (distance ⁇ L) between the irradiation points.
- the change of the scanning time as a parameter corresponds to the change of the time ⁇ t for irradiating the pixel.
- An image is acquired by changing ⁇ t and ⁇ L.
- charging accumulation is reduced by continuously irradiating a beam to an adjacent portion, and charging by scanning the same scanning trajectory multiple times. It is possible to balance the accumulation.
- the control device for the scanning electron microscope controls each component of the scanning electron microscope, functions to form an image based on the detected electrons, and the average signal amount of the ROI set in advance based on the intensity distribution of the detected electrons And a function to derive the contrast ratio.
- FIG. 6 shows an example of a pattern measurement system provided with an arithmetic processing unit 603.
- This system includes a scanning electron microscope system including a SEM main body 601, a control device 602 of the SEM main body, and an arithmetic processing device 603.
- the arithmetic processing device 603 supplies a predetermined control signal to the control device 602 and performs signal processing of the signal obtained in the SEM main body 601 and the obtained image information and recipe information.
- a memory 605 for storing is incorporated.
- the control device 602 and the arithmetic processing device 602 are described as separate units, but may be an integrated control device.
- Electrons emitted from the sample or generated at the conversion electrode by the beam scanning by the electrostatic deflector 606 are captured by the detector 607 and are converted into digital signals by an A / D converter built in the control device 602. Is converted to Image processing according to the purpose is performed by image processing hardware such as a CPU, ASIC, and FPGA incorporated in the arithmetic processing unit 602.
- the arithmetic processing unit 604 has a measurement condition setting unit 608 for setting measurement conditions such as a scanning condition of the electrostatic deflector 606 based on the measurement conditions input by the input device 613, and the ROI input by the input device 613.
- An image feature amount calculation unit 609 that is obtained from image data from which the brightness and contrast are obtained is incorporated.
- the arithmetic processing unit 604 includes a design data extraction unit 610 that reads design data from the design data storage medium 612 according to the conditions input by the input device 613 and converts the vector data into layout data as necessary. Has been.
- a pattern measurement unit 611 that measures the dimension of the pattern based on the acquired signal waveform is incorporated.
- the pattern measurement unit 611 forms a line profile based on, for example, a detection signal, and performs dimension measurement between the peaks of the profile.
- a GUI for displaying images, inspection results, and the like is displayed to the operator.
- the input device 613 is an imaging recipe creation device that sets the measurement conditions including the coordinates of the electronic device, the pattern type, and the imaging conditions (optical conditions and stage movement conditions) required for the inspection as an imaging recipe. Also works.
- the input device 613 also has a function of collating the input coordinate information and information on the pattern type with the layer information of the design data and the pattern identification information, and reading out necessary information from the design data storage medium 612. Yes.
- Design data stored in the design data storage medium 612 is expressed in a GDS format, OASIS format, or the like, and is stored in a predetermined format.
- the design data can be of any type as long as the software that displays the design data can display the format and handle it as graphic data.
- the graphic data is a line segment that has been subjected to a deformation process that approximates the actual pattern by performing an exposure simulation instead of the line segment image information indicating the ideal shape of the pattern formed based on the design data. It may be image information.
- the measurement condition setting unit 608 sets appropriate scanning conditions by the steps illustrated in FIG. For example, using the input device 613, the FOV size, the FOV position (coordinates), the ROI size, and the ROI position are set in the layout data in the vicinity of the measurement target pattern extracted by the design data extraction unit 610. By doing so, the operating conditions of the apparatus are automatically set. More specifically, the FOV position for each combination of a plurality of scanning speed conditions and a plurality of irradiation point interval conditions is determined. At this time, a plurality of regions having the same pattern structure in the FOV and located at different positions are selected and registered as FOVs.
- the design data extraction unit 610 reads the design data from the design data storage medium 612 according to the conditions input by the input device 613, and converts the vector data into the layout data as necessary. FOV and ROI can be set.
- the image feature amount calculation unit 609 extracts ROI signal information from the acquired image, and generates a display signal of the input device 613.
- the image feature amount calculation unit 609 derives an ROI index value (average detection signal amount or contrast ratio with a designated portion) set in advance for each scanning condition based on the detection signal, as illustrated in FIG.
- a map of index values for the scanning speed and the irradiation interval is displayed on the display screen of the input device 613 or the like.
- FIG. 7 is a diagram illustrating an example of a GUI screen for setting operating conditions of the SEM.
- the GUI screen illustrated in FIG. 7 is provided with a setting unit for setting the operating conditions of the SEM when performing scanning for selecting an appropriate scanning condition from a plurality of scanning conditions.
- the beam condition setting window 701 is provided with a plurality of windows for setting beam conditions. In the example of FIG.
- Pattern Type pattern type
- Vacc acceleration voltage of beam
- Number of Frames number of integrated frames
- FOV size of FOV
- Probe Current beam current
- Rotation n Angle tilt direction
- a scanning speed setting unit 702 can select a plurality of scanning speeds, and the measurement condition setting unit 608 can set the number of set scanning speeds or a combination of the set number of scanning speeds and the interval between irradiation points. Scan conditions are set and registered in the memory 605 or the like.
- the scanning block setting unit 703 sets the coordinates of the area to be set as the ROI.
- a setting unit for the irradiation point interval condition may be provided so that the irradiation point interval to be tried can be selectively selected.
- the image evaluation parameter setting unit 704 determines what parameters are used to evaluate the ROI to be evaluated. On the GUI screen illustrated in FIG. 7, two parameters, the contrast of the ROI to be measured and the contrast of the other ROI, or the brightness of the ROI can be selected.
- the ROI is set on the setting screen 705.
- the ROI evaluation parameter may be a resolution evaluation value such as the sharpness in the ROI. Other image evaluation parameters may be selected according to the purpose of measurement or inspection.
- the via bottom is designated as the ROI with the cursor box.
- the ROI As an index to be optimized at this time, there is a contrast ratio between the ROI and the surroundings or an average signal amount (luminance) of the ROI.
- the operator designates a region B for luminance comparison with a cursor box. This index value is obtained by changing the scanning speed (scanning speed) and the irradiation interval (scanning block). The operator sets necessary conditions for the scanning speed and the number of blocks. It is possible to set a plurality of conditions for both the scanning speed and the number of blocks.
- the influence of charging can be suppressed and highly accurate measurement can be performed by finding the appropriate scanning conditions by evaluating the ROI parameters for each scanning speed and / or interval between irradiation points. It becomes possible.
- FIG. 8 shows a simulation result of observing a via-in trench shape in which a via exists in the trench.
- ROI is the contrast of the shape at the bottom of the via.
- the pattern was irradiated with an electron beam, and electrons detected from the sample were counted for each pixel to form a detected electron image. In the simulation, the effect of charging by the primary electrons and the emitted secondary electrons was considered.
- the outline of the bottom of the hole formed in the space cannot be determined by a normal one-way scan ( ⁇ X ⁇ + X, + Y ⁇ ⁇ Y).
- electron beam irradiation was performed by dividing the inside of the FOV into 4 ⁇ 4 blocks.
- the contour of the bottom of the hole can be determined, and the contrast of the bottom of the hole which is an ROI has increased. This is because the charging of the surface has been relaxed by changing the interval between the irradiation points, and it is shown that the optimization of the observation conditions according to the observation location is effective.
- spaces and lines are made of a dielectric, and charging characteristics may change depending on the manufacturing process. In such a case, by optimizing the observation conditions only for the first time on the wafer to be observed, the same conditions can be reflected in subsequent observations. Further, the material characteristics of the sample, such as relaxation of charging, can be predicted from the change in scanning speed and irradiation point interval.
- FIG. 9 shows an example in which four hole patterns 902 exist in the FOV 901.
- the ROI 903 for the low-speed scanning area secondary electron high-efficiency detection area
- scanning in the area is performed at low speed, and the other areas are scanned at high speed, thereby suppressing charging and measuring with high accuracy.
- the scanning speed within the ROI may be selected, for example, such that the height difference between the bottom and peak of the profile waveform is greater than a predetermined value (first threshold). Further, in order not to perform excessive beam irradiation on the ROI, conditions may be set such that the height difference between the bottom and the peak does not exceed a predetermined value (second threshold). .
- FIG. 10 shows an example of forming an image by irradiating only the ROI of the sample. If the magnification and the number of pixels are determined after addressing the observation pattern, it is possible to determine in which region the ROI exists. When the operator gives a certain likelihood on the GUI in advance and designates the irradiation area, information on only the ROI can be obtained. At this time, it is possible to measure the ROI by outputting an image at the same magnification as that of the normal full scan. Such observation is effective for a sample with significant charge and shrinkage (damage).
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Abstract
Description
<走査信号>
図4に示す様な不連続な照射を行う際の走査信号を、図5に例示する。図5では、時間tを横軸としたときの図4のブロック1のピクセル“1”からブロック4のピクセル“1”まで電子線を走査した際のXスキャン信号とYスキャン信号の推移を示している(各ピクセル間の移動は(a)(b)(c)と記載)。図5で、VはXおよびY方向への最大偏向電圧を示す。なお、本例では静電偏向器を採用する例を説明しているため、偏向信号は電圧値で表記する。
<設計データとの連携>
走査電子顕微鏡の制御装置は、走査電子顕微鏡の各構成を制御すると共に、検出された電子に基づいて画像を形成する機能や、検出電子の強度分布に基づいて、予め設定したROIの平均信号量やコントラスト比を導出する機能を備えている。図6に演算処理装置603を備えたパターン測定システムの一例を示す。
2 電子線
3 コンデンサレンズ、
4 偏向器
5 対物レンズ
6 試料
7 2次電子
8 検出器
Claims (11)
- 荷電粒子源と、当該荷電粒子源から放出された荷電粒子ビームを試料に走査する偏向器と、前記試料に対する荷電粒子ビームの走査によって得られる信号を記憶する画像メモリと、前記偏向器を制御する制御装置を備えた荷電粒子線装置において、
前記制御装置は、前記各画素に対応する試料上の位置に荷電粒子ビームを照射するときに比べて、前記各画素間の前記荷電粒子ビームの走査を高速に行うよう前記偏向器を制御することを特徴とする荷電粒子線装置。 - 請求項1において、
前記制御装置は、異なる走査速度にて得られる信号によって得られる前記信号に基づいて、前記荷電粒子ビームの走査速度を決定することを特徴とする荷電粒子線装置。 - 請求項2において、
前記制御装置は、前記信号によって形成される画像の所定のROIが所定の条件を満たす走査速度を選択することを特徴とする荷電粒子線装置。 - 請求項3において、
前記制御装置は、前記ROI内の輝度情報、或いは前記ROIと他の部分とのコントラスト、前記ROIと他の部分とのCNR、或いは前記ROIのシュリンク量が所定の条件となる走査速度を選択することを特徴とする荷電粒子線装置。 - 請求項2において、
前記制御装置は、前記異なる走査速度と、異なる照射点間間隔の組み合わせの中から、前記信号によって形成される画像の所定のROIが、所定の条件を満たす前記走査速度と前記照射点間間隔を選択することを特徴とする荷電粒子線装置。 - 請求項5において、
前記制御装置は、前記走査速度と照射点間間隔の組み合わせ毎の画像評価結果を、表示装置にマップ状に表示させることを特徴とする荷電粒子線装置。 - 請求項1において、
前記制御装置は、予め操作者によって指定された視野内のROIに該当するピクセルのみを走査し、ROI以外のピクセルと合わせて所定のピクセル数のSEM画像を形成することを特徴とする荷電粒子線装置。 - 荷電粒子源と、当該荷電粒子源から放出された荷電粒子ビームを試料に走査する偏向器と、前記試料に対する荷電粒子ビームの走査によって得られる信号を記憶する画像メモリと、前記偏向器を制御する制御装置を備えた荷電粒子線装置において、
前記制御装置は、前記荷電粒子ビームを走査するときの走査速度及び照射点間間隔の少なくとも1つを、少なくとも2つの状態としたときに、それぞれの状態で得られる信号を評価し、当該評価結果が所定の条件を満たす前記走査速度及び前記照射点間間隔の少なくとも1つを選択することを特徴とする荷電粒子線装置。 - 請求項8において、
前記制御装置は、前記荷電粒子ビームの走査によって得られる画像のROIの平均輝度またはコントラスト比が最大となる走査条件を選択することを特徴とする荷電粒子線装置。 - 請求項8において、
前記制御装置は、前記走査速度および照射点の間隔を繰り返し変化させる際に、X走査波形、及び/又はY走査波形を任意に変化させることを特徴とする荷電粒子線装置。 - 請求項8において、
前記走査速度を一軸、前記照射点の間隔を他の一軸とするマップを表示する入力装置を備え、当該マップによる設定に基づいて前記走査速度と前記照射点の間隔が設定されることを特徴とする荷電粒子線装置。
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